CN113025244A - Adhesive resin for metal base material and preparation method thereof - Google Patents

Adhesive resin for metal base material and preparation method thereof Download PDF

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Publication number
CN113025244A
CN113025244A CN202011568435.8A CN202011568435A CN113025244A CN 113025244 A CN113025244 A CN 113025244A CN 202011568435 A CN202011568435 A CN 202011568435A CN 113025244 A CN113025244 A CN 113025244A
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Prior art keywords
bonding resin
ethylene
metal base
base material
parts
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CN202011568435.8A
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Chinese (zh)
Inventor
李薇薇
毕宏海
储江顺
孙晓光
黄健
杨少辉
李楠
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Shanghai Bangzhong New Material Co ltd
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Shanghai Bangzhong New Material Co ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/06Polyethene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869Acids or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00Properties characterising the ingredient of the composition
    • C08L2207/06Properties of polyethylene
    • C08L2207/062HDPE

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a bonding resin for a metal base material and a preparation method thereof, wherein the bonding resin comprises the following components in parts by weight: 10-30 parts of high-density polyethylene, 20-40 parts of modified polyethylene, 20-40 parts of ethylene copolymer, 10-20 parts of polyurethane, 1-10 parts of filler and 1-3 parts of auxiliary agent. The bonding resin for the metal base material is bonded with different metal base materials, the tested peel strength is kept above 120N/25mm, and the bonding resin meets the requirements in the industrial standard QB/T5607-2019. The preparation method of the invention has simple process, can be applied in large scale and is suitable for industrial production.

Description

Adhesive resin for metal base material and preparation method thereof
Technical Field
The invention relates to the field of adhesives, in particular to an adhesive resin for a metal base material and a preparation method thereof.
Background
China is a large country for producing and consuming bonding resin, and with the development of industries such as new energy, electronic and electric products, machinery, automobiles, aerospace and the like, high-performance and high-quality high-end bonding resin products become bottlenecks which restrict the continuous development of the bonding resin field in China. The bonding resin can be used for bonding non-metallic materials such as paper, fabrics, wood, leather, glass and the like, can also be used for bonding various metals, and is widely applied to the industries such as aerospace, machinery, light textile, building, wood processing and the like, and the aspects of repairing and protecting historical relics and antiques. With the development of the technology, multifunctional and high-performance adhesive resin is increasingly widely applied in the modern industrial field and becomes an indispensable material for the modern industry and the defense industry.
The future demand trend of the bonding resin for metal substrates is good. Firstly, in the pipeline industry, the consumption of various metal pipelines, plastic pipelines, metal plastic composite material pipelines, steel wires and steel belts for corrosion prevention is kept in a strong growth state, and the demands for steel wire glue, steel belt glue, plastic-lined pipe glue, corrosion-resistant steel pipe glue and multiple pipe glue are continuously increased. Meanwhile, environmental protection regulations tend to be strict, and consumption of new green pollution-free bonding resin products for metal substrates is facilitated. The main application fields of the bonding resin for the metal base material are the fields of steel strip reinforced polyethylene spiral corrugated pipes, steel wire mesh reinforced polyethylene composite pipes, plastic-lined steel pipes, aluminum-plastic composite plates, aluminum-plastic composite pipes, stable pipes and the like, and the total demand of the bonding resin for the metal base material is continuously increased along with the rapid development of related industries.
Disclosure of Invention
The invention aims to provide a bonding resin for a metal base material and a preparation method thereof, aiming at the defects in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a bonding resin for a metal base material, which comprises the following components in parts by weight:
Figure BDA0002861722460000021
further, the density of the high-density polyethylene is 0.940-0.960g/cm3The melt index at 190 ℃ under 2.16kg pressure is 2.0-8.0g/10min, and the molecular weight is 50000-90000.
Further, the modified polyethylene is maleic anhydride modified high-density polyethylene, and the density of the modified polyethylene is 0.940-0.960g/cm3And a melt index at 190 ℃ under a pressure of 2.16kg of 2.0 to 6.0g/10min, and wherein the graft ratio of maleic anhydride is 1.0 to 2.0%.
Further, the ethylene copolymer is one or more of an ethylene-acrylic acid copolymer, an ethylene-vinyl acetate copolymer, an ethylene-ethyl acrylate copolymer, an ethylene-methyl methacrylate copolymer and an ethylene-butyl acrylate copolymer.
Further, the filler is one or more of nano calcium carbonate, fumed silica and talcum powder.
Further, the auxiliary agent is one or more of an antioxidant, a coupling agent, an antistatic agent and a heat stabilizer.
The second aspect of the present invention provides a method for preparing the above adhesive resin for metal substrates, comprising the steps of: weighing the high-density polyethylene, the modified polyethylene, the ethylene copolymer, the polyurethane, the filler and the auxiliary agent in parts by weight, and adding the materials into a high-speed mixing roll to be uniformly mixed; adding the uniformly mixed materials into a double-screw extruder for extrusion, cooling extruded material strips to room temperature through a circulating water tank, drying by blowing through a blower, and then granulating in a granulator to obtain the adhesive resin for the metal base material; wherein, the temperature range of each temperature zone of the extruder is 190-230 ℃.
By adopting the technical scheme, compared with the prior art, the invention has the following technical effects:
the existing bonding resin for the metal base material has requirements on the metal base material, the surface of the metal base material needs to be treated, the applicable metal base material is single, the universal applicability is not available, and the peel strength value is generally distributed at the lower limit of the industry standard requirement and is more than or equal to 90N/25 mm. The bonding resin for the metal base material is bonded with different metal base materials, the tested peel strength is kept above 120N/25mm, and the requirements in the industrial standard QB/T5607-2019 are met. The preparation method of the invention has simple process, can be applied in large scale and is suitable for industrialized production.
Detailed Description
The present invention is further illustrated by the following examples, which are not to be construed as limiting the invention. It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
Example 1
The bonding resin for the metal base material of the embodiment comprises the following components in parts by weight:
Figure BDA0002861722460000031
wherein the high density polyethylene has a density of 0.956g/cm3The melt index was 4.5g/10min (190 ℃ C., under 2.16kg pressure) and the molecular weight was 65000. The density of the maleic anhydride grafted high-density polyethylene is 0.948g/cm3The melt index was 6.0g/10min (190 ℃ C., 2.16kg pressure), and the graft ratio of maleic anhydride was 1.7%. The vinyl acetate content of the ethylene vinyl acetate copolymer was 28%.
The preparation process of the bonding resin for the metal base material comprises the following steps: weighing the raw materials of the components in parts by weight, adding the raw materials into a high-speed mixing roll, and uniformly mixing; adding the uniformly mixed materials into a double-screw extruder for extrusion, cooling an extruded material strip to room temperature through a circulating water tank, drying by blowing through a blower, and then granulating in a granulator to obtain the bonding resin for the metal base material; wherein, the temperature range of each temperature zone of the extruder is 190-230 ℃.
Example 2
The bonding resin for the metal base material of the embodiment comprises the following components in parts by weight:
Figure BDA0002861722460000032
Figure BDA0002861722460000041
wherein the high density polyethylene has a density of 0.958g/cm3The melt index was 1.5g/10min (190 ℃ C., 2.16kg pressure) and the molecular weight was 80000. The density of the maleic anhydride grafted high-density polyethylene is 0.950g/cm3The melt index was 4.0g/10min (190 ℃ C., 2.16kg pressure), and the graft ratio of maleic anhydride was 1.5%. The acrylic acid content of the ethylene acrylic acid copolymer was 12%.
The preparation process of the bonding resin for the metal base material comprises the following steps: weighing the raw materials of the components in parts by weight, adding the raw materials into a high-speed mixing roll, and uniformly mixing; adding the uniformly mixed materials into a double-screw extruder for extrusion, cooling an extruded material strip to room temperature through a circulating water tank, drying by blowing through a blower, and then granulating in a granulator to obtain the bonding resin for the metal base material; wherein, the temperature range of each temperature zone of the extruder is 190-230 ℃.
Example 3
The bonding resin for the metal base material of the embodiment comprises the following components in parts by weight:
Figure BDA0002861722460000042
wherein the high density polyethylene has a density of 0.952g/cm3The melt index was 8.0g/10min (190 ℃ C., under 2.16kg pressure) and the molecular weight was 74000. The density of the maleic anhydride grafted high-density polyethylene is 0.949g/cm3The melt index was 2.0g/10min (190 ℃ C., 2.16kg pressure), and the grafting ratio of maleic anhydride was 1.8%. Butyl acrylate in ethylene butyl acrylate copolymerThe content of (B) is 8%.
The preparation process of the bonding resin for the metal base material comprises the following steps: weighing the raw materials of the components in parts by weight, adding the raw materials into a high-speed mixing roll, and uniformly mixing; adding the uniformly mixed materials into a double-screw extruder for extrusion, cooling an extruded material strip to room temperature through a circulating water tank, drying by blowing through a blower, and then granulating in a granulator to obtain the bonding resin for the metal base material; wherein, the temperature range of each temperature zone of the extruder is 190-230 ℃.
The adhesive resins prepared in examples 1 to 3 were subjected to peel strength tests in accordance with the requirements of national standard GB/T2791, and selected metal substrates included galvanized steel, cold-rolled steel and aluminum sheets, with the results shown in Table 1 below:
Figure BDA0002861722460000051
as can be seen from the table above, the bonding resin disclosed by the invention is bonded with different metal base materials, and tested peel strength resins are all kept above 120N/25mm, and all meet the requirements in the industrial standard QB/T5607-2019.
In view of the above, the adhesive strength of the adhesive resins of examples 1 to 3 can satisfy the requirements of the adhesive resin for metal substrates.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims (7)

1. The adhesive resin for the metal base material is characterized by comprising the following components in parts by weight:
Figure RE-FDA0003054032590000011
2. the bonding resin for metal substrates according to claim 1, wherein the high-density polyethylene has a density of 0.940 to 0.960g/cm3The melt index at 190 ℃ under 2.16kg pressure is 2.0-8.0g/10min, and the molecular weight is 50000-90000.
3. The bonding resin for metal substrates according to claim 1, wherein the modified polyethylene is maleic anhydride-modified high-density polyethylene having a density of 0.940 to 0.960g/cm3And a melt index at 190 ℃ under a pressure of 2.16kg of 2.0 to 6.0g/10min, and wherein the graft ratio of maleic anhydride is 1.0 to 2.0%.
4. The bonding resin for metal substrates as claimed in claim 1, wherein the ethylene copolymer is one or more selected from ethylene-acrylic acid copolymer, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl methacrylate copolymer, and ethylene-butyl acrylate copolymer.
5. The bonding resin for metal substrates as claimed in claim 1, wherein the filler is one or more of nano calcium carbonate, fumed silica and talc.
6. The bonding resin for metal substrates as claimed in claim 1, wherein the auxiliary agent is one or more selected from an antioxidant, a coupling agent, an antistatic agent and a heat stabilizer.
7. The process for producing a bonding resin for metal substrates according to any one of claims 1 to 6, comprising the steps of: weighing the high-density polyethylene, the modified polyethylene, the ethylene copolymer, the polyurethane, the filler and the auxiliary agent in parts by weight, and adding the materials into a high-speed mixing roll to be uniformly mixed; adding the uniformly mixed materials into a double-screw extruder for extrusion, cooling extruded strips to room temperature through a circulating water tank, drying by blowing through a blower, and then granulating in a granulator to obtain the bonding resin for the metal base material; wherein, the temperature range of each temperature zone of the extruder is 190-230 ℃.
CN202011568435.8A 2020-12-25 2020-12-25 Adhesive resin for metal base material and preparation method thereof Pending CN113025244A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114163953A (en) * 2021-12-30 2022-03-11 上海邦中新材料有限公司 High-adhesion-durability hot melt adhesive for steel wire mesh pipes and preparation method of hot melt adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394485A (en) * 1982-03-31 1983-07-19 Chemplex Company Four component adhesive blends and composite structures
CN102533162A (en) * 2011-12-28 2012-07-04 广州鹿山新材料股份有限公司 Preparation method of poly ethylene (PE) hot melt glue powder for 3PE anti-corrosion pipelines
CN104449469A (en) * 2014-11-28 2015-03-25 河源市普立隆新材料科技有限公司 Method for preparing polyethylene type adhesive resin for multilayer co-extrusion barrier package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4394485A (en) * 1982-03-31 1983-07-19 Chemplex Company Four component adhesive blends and composite structures
CN102533162A (en) * 2011-12-28 2012-07-04 广州鹿山新材料股份有限公司 Preparation method of poly ethylene (PE) hot melt glue powder for 3PE anti-corrosion pipelines
CN104449469A (en) * 2014-11-28 2015-03-25 河源市普立隆新材料科技有限公司 Method for preparing polyethylene type adhesive resin for multilayer co-extrusion barrier package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114163953A (en) * 2021-12-30 2022-03-11 上海邦中新材料有限公司 High-adhesion-durability hot melt adhesive for steel wire mesh pipes and preparation method of hot melt adhesive

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