CN113021711B - Road structure compressive strain monitoring sensor, manufacturing method and device - Google Patents

Road structure compressive strain monitoring sensor, manufacturing method and device Download PDF

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Publication number
CN113021711B
CN113021711B CN202110218191.9A CN202110218191A CN113021711B CN 113021711 B CN113021711 B CN 113021711B CN 202110218191 A CN202110218191 A CN 202110218191A CN 113021711 B CN113021711 B CN 113021711B
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cap plug
sensor
packaging
hole
monitoring sensor
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CN113021711A (en
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梁明
辛雪
苏林萍
姚占勇
仇正梅
蒋红光
张吉哲
姚凯
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Shandong University
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Shandong University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/021—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles by casting in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/752—Measuring equipment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

The present disclosure provides a road structure compressive strain monitoring sensor, a manufacturing method and a device, the steps include: preparing an integrated forming die, injecting a conductive composite smart material, and forming and curing to obtain a conductive core element; assembling the conductive core element to form a casting mold, casting a high-temperature-resistant material, and obtaining the high-temperature-resistant conductive core element after molding and curing; assembling the high-temperature-resistant conductive core element into a compression strain sensor packaging mold, injecting packaging materials, and obtaining a road structure compression strain monitoring sensor after molding and curing; by the manufacturing device and the method for the micro-compressive strain and compressive stress monitoring sensor, when the sensor is manufactured, the manufacturing process of the sensor is simple, the manufacturing material is easy to obtain, and the simple preparation of a core element, a conducting circuit and a packaging material of the sensor can be effectively realized; the rigidity of the pavement structure layer is matched with that of the pavement structure layer, the service life is long, and the survival rate is high.

Description

Road structure compressive strain monitoring sensor, manufacturing method and device
Technical Field
The disclosure relates to the field of road engineering materials and road engineering monitoring, in particular to a device and a method for manufacturing a micro pressure strain monitoring sensor by taking a strain and stress resistance response sensitive conductive composite smart material as a core element.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
In recent years, the conductive composite smart material provides a new idea for intelligent monitoring. The conductive composite smart material is applied to the engineering fields of roads, bridges, aerospace, civil engineering, electronics, electrics, petrochemical engineering and the like, and has wide prospect. However, in practical engineering application, the conductive composite smart material needs to face various complex engineering environments. In the field of road engineering, when the conductive composite smart material is used as a core element for monitoring strain or stress, the following aspects need to be satisfied:
(1) in the road paving process, the embedded sensor can withstand the rolling and compaction of overweight construction tools such as a road roller, a tamper and the like, the temperature of the asphalt mixture used for the road is as high as 160-180 ℃ during the construction, and the common sensor is hardly survived under the environment.
(2) The rigidity of the sensor needs to be matched with the rigidity of a structure layer, a water stabilization layer and the like of the asphalt concrete pavement.
(3) The service life should match the road life as much as possible.
(4) The influence of complex environments such as humidity on the conductive composite smart material can be effectively solved.
On the other hand, after the preparation of the common conductive composite smart material is finished, a lead wire needs to be further connected through a silver adhesive pasted electrode, an aluminum foil pasted electrode or a tin soldering method and the like. The defects of the sample surface integrity, long curing time period of the conductive adhesive, poor bonding effect of the conductive adhesive, unstable contact electric signals and the like exist; and the production process is complex and the production efficiency is low.
Disclosure of Invention
In order to solve the above problems, the present disclosure provides a device and a method for manufacturing a road structure micro-compressive strain and compressive stress monitoring sensor.
In a first aspect, the present disclosure provides a method for manufacturing a road structure compressive strain monitoring sensor, comprising the steps of:
preparing an integrated forming die, injecting a conductive composite smart material, and forming and curing to obtain a conductive core element;
assembling the conductive core element to form a casting mold, casting a high-temperature-resistant material, and obtaining the high-temperature-resistant conductive core element after molding and curing;
and assembling the high-temperature-resistant conductive core elements into a compression strain sensor packaging mold, injecting packaging materials, and obtaining the road structure compression strain monitoring sensor after molding and curing.
In a second aspect, the present disclosure provides a road structure compressive strain monitoring sensor manufactured by the manufacturing method of the road structure compressive strain monitoring sensor according to the first aspect, which includes a conductive composite smart material core element, epoxy columns and an outer packaging layer, wherein the epoxy columns are installed on the top and the bottom of the conductive composite smart material core element, and the outer packaging layer is wrapped on the side surface of the conductive composite smart material.
In a third aspect, the present disclosure provides a device for manufacturing a compressive strain monitoring sensor for a road structure, which includes an integrated molding mold, an epoxy column casting mold and a compressive strain sensor packaging mold, and the method for manufacturing the compressive strain monitoring sensor according to the first aspect is adopted to manufacture the compressive strain monitoring sensor.
Compared with the prior art, this disclosure possesses following beneficial effect:
1. the method comprises the steps of preparing an integrated forming die, injecting a conductive composite smart material, obtaining a conductive core element after forming and curing, assembling the conductive core element to form a pouring die, pouring a high-temperature-resistant material, and obtaining the high-temperature-resistant conductive core element after forming and curing, so that the problems that (1) in the road paving process, a buried sensor can be rolled and compacted by overweight construction tools such as a road roller, a compactor and the like, the temperature of an asphalt mixture used by a road is up to 160-180 ℃ during construction, and a common sensor is hardly alive under the environment are solved; (2) the rigidity of the sensor needs to be matched with the rigidity of a structure layer, a water stabilization layer and the like of the asphalt concrete pavement. The service life of the conductive composite smart material is matched with the service life of a road as far as possible, and the conductive composite smart material is influenced by complex environments such as humidity; (3) after the preparation of the common conductive composite smart material is finished, connecting wires need to be further connected through a silver adhesive pasted electrode, an aluminum foil pasted electrode or a tin soldering method and the like; (4) the integrity of the surface of a sample may not be smooth enough, the curing time period of the conductive adhesive is long, the bonding effect of the conductive adhesive is not good, and a contact electric signal is unstable; the production process is complex, and the production efficiency is low; in the aspect of sensor manufacturing, by the manufacturing device and the method for the micro-compressive strain and compressive stress monitoring sensor, when the sensor is manufactured, the manufacturing process of the sensor is simple, the manufacturing materials are easy to obtain, and the simple preparation of a core element, a conducting circuit and a packaging material of the sensor can be effectively realized. The unit price of the sensor is greatly reduced on the premise of ensuring the monitoring precision and the engineering application. Has obvious economic benefit and social benefit.
2. In the aspect of engineering application and service life, the sensor researched and developed by the manufacturing device and the method for the micro-compressive strain and compressive stress monitoring sensor provided by the disclosure can be effectively applied to the field of road engineering with construction and working environments which are often severe, the rigidity of the sensor is matched with that of a pavement structure layer, the service life is long, and the survival rate is high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a flow chart of a method of manufacturing a road structure compressive strain monitoring sensor of the present disclosure;
FIG. 2 is a schematic view of an integrated molding die for the conductive composite smart material and the conductive wire according to the present disclosure;
FIG. 3 is a schematic view of the injection/outflow cap plug required in the integrated molding die of the present disclosure;
FIG. 4 is a schematic structural view of an epoxy column casting mold of the present disclosure;
FIG. 5 is a schematic view of a compression strain sensor package mold structure of the present disclosure;
FIG. 6 is a schematic illustration of a cap plug required in a compressive strain sensor package mold of the present disclosure;
FIG. 7 is a schematic view of the installation of a road structure compressive strain monitoring sensor of the present disclosure;
wherein, 1, a lower end injection conduit, 2, a lower end injection hole, 3, a lower end injection cap plug, 4, a conducting wire, 5, a forming tube, 6, a conductive composite smart material filling space, 7, a conducting wire, 8, an upper end outflow cap plug, 9, an upper end outflow hole, 10, an upper end outflow conduit; 11. 12, pouring a guide pipe into the space at the lower end of the poured epoxy column, 13, pouring a guide pipe out of the space at the lower end of the poured epoxy column, 14, pouring a guide pipe into the space at the upper end of the poured epoxy column, and 15, pouring a guide pipe out of the space at the upper end of the poured epoxy column; 21. the lower end of the packaging material is filled into the conduit, 22, the upper end of the packaging material flows out of the conduit, 23, the lower end is filled into the cap plug, 24, the upper end flows out of the cap plug;
in fig. 7, firstly, a high temperature resistant conductive core element, secondly, a packaging material layer, thirdly, a lead, fourthly, a circuit connected with the lead, and fifthly, a detection system.
The specific implementation mode is as follows:
the present disclosure is further illustrated by the following examples in conjunction with the accompanying drawings.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure herein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Example 1
As shown in fig. 1, the present disclosure provides a method for manufacturing a road structure compressive strain monitoring sensor, comprising the steps of:
preparing an integrated forming die, injecting a conductive composite smart material, and forming and curing to obtain a conductive core element;
assembling the conductive core element to form a casting mold, casting a high-temperature-resistant material, and obtaining the high-temperature-resistant conductive core element after molding and curing;
assembling the high-temperature-resistant conductive core elements into a compression strain sensor packaging mold, injecting packaging materials, and obtaining the road structure compression strain monitoring sensor after molding and curing.
Further, the high-temperature resistant material is epoxy resin, the casting mold is an epoxy column casting mold, the upper end and the lower end of the epoxy column casting mold are respectively cast with epoxy resin, and the epoxy resin is molded and cured to obtain the conductive core element with the epoxy column;
further, the step of assembling the conductive core elements to form a casting mold comprises: and pulling out the upper end cap plug and the lower end cap plug of the integrated forming mold, cleaning the residual conductive composite smart material in the cap plugs, and assembling to form the epoxy column pouring mold.
Further, after the packaging material is completely cured, the packaging mold of the compressive strain sensor is removed, and the road structure compressive strain monitoring sensor is obtained.
Furthermore, the integrated forming die comprises an upper-end outflow cap plug, a forming pipe and a lower-end injection cap plug which are sequentially connected; the upper end outflow cap plug is provided with a conduit mounting hole for mounting an upper end outflow conduit; the lower inflow cap plug is provided with a conduit mounting hole for mounting a lower injection conduit; the lower surface of the upper end outflow cap plug is tightly attached with a first conducting wire, and the upper surface of the lower end inflow cap plug is tightly attached with a second conducting wire. Specifically, the integrated forming mold comprises a forming pipe, a lower end injection cap plug, a lower end injection guide pipe, an upper end outflow cap plug, an upper end outflow guide pipe and a lead; the forming tube is made of a silicone tube, a rubber tube or organic glass, and the size and the shape of the forming tube can be adjusted according to the design size of the sensor; the lower end injection cap plug and the upper end outflow cap plug are made of one of polyethylene, epoxy plates, polytetrafluoroethylene, nylon and polyether-ether-ketone PPEK; the outer diameters of the lower end injection cap plug and the upper end outflow cap plug are consistent with the inner diameter of the forming pipe; one side of the cap plug is reserved with an aperture with the size consistent with the outer diameters of the injection catheter and the outflow catheter; the lead is tightly attached to the cap plugs at the two ends.
Further, when the conductive composite smart material is injected, the integrated forming die is required to maintain 45-degree clamping; the upper end cap plug holes and the lower end cap plug holes are opposite in a Z shape, and the upper end cap plug holes are positioned at the position closest to the upper part, so that air in the forming pipe is prevented from being reserved.
Furthermore, the epoxy column pouring mold comprises a conductive composite smart material core element, an epoxy column pouring lower end space injection guide pipe, an epoxy column pouring lower end space outflow guide pipe, an epoxy column pouring upper end space injection guide pipe and an epoxy column pouring upper end space outflow guide pipe.
Further, the pressure strain sensor packaging mold comprises an upper end outflow cap plug, a packaging forming tube and a lower end injection cap plug which are sequentially connected; the upper end outflow cap plug is provided with an upper end outflow guide pipe, and the lower end injection cap plug is provided with a lower end injection guide pipe. Specifically, the packaging mold for the compressive strain sensor comprises a packaging molding pipe, a conductive composite smart material, a lower end injection cap plug, a lower end injection guide pipe, an upper end outflow cap plug, an upper end outflow guide pipe and the like, wherein the conductive composite smart material is connected with the epoxy column at two ends and is integrally molded with a lead.
Furthermore, the conductive composite smart material is prepared by taking polymer, asphalt, cement and the like as a matrix and compounding carbon nano tubes, nickel powder, graphene, carbon black, silver powder and other carbon or metal conductive phases, and can respond to sensitive mechanical information such as strain, stress and the like. The curing process varies depending on the particular substrate.
Furthermore, the epoxy column pouring mold is characterized in that on the basis of the integrated molding mold, the cap plugs at the two ends are moved outwards, and injection holes and outflow holes are respectively arranged in the formed upper end space and the lower end space. In the upper end space, a preformed hole of the upper end cap plug is used as an outflow port, and a newly introduced hole close to the conductive composite smart material is used as an injection port; in the lower end space, a reserved hole of the lower end cap plug is used as an injection port, and a newly introduced hole close to the conductive composite smart material is used as an outflow port. The newly introduced hole is sealed with a sealant after insertion of the catheter to prevent leakage. The outward moving height of the cap plugs at the two ends can be adjusted according to the design size of the sensor. The height of the outward moving of the cap plugs at the two ends determines the height of the epoxy columns connected to the two ends of the conductive composite smart material. The purpose of accessing the epoxy columns at the upper end and the lower end is to ensure that the conductive composite smart material can be always positioned at the central position when the sensor is packaged subsequently, thereby having the function of fixing the axis. The introduction of air bubbles should be avoided when carrying out the blending and feeding of the epoxy resin system.
Furthermore, an epoxy column mounting groove is formed in the center of the lower end injection cap plug and the center of the upper end outflow cap plug. Specifically, the lower end injection cap plug and the upper end outflow cap plug are provided with a groove with the same size as the epoxy columns connected with the two ends at the central position except for the hole diameter with the same size as the outer diameters of the injection guide pipe and the outflow guide pipe, and the depth of the groove is 0.02mm-5.0 mm.
Furthermore, when the sensor packaging mold is assembled, the two end caps are supported by the epoxy columns externally connected to the two ends of the conductive composite smart material, and the two end caps and the packaging molded tube are fixed to prevent sliding. The size of the packaging and forming pipe can be adjusted according to the design size of the sensor; the outer diameters of the lower end injection cap plug and the upper end outflow cap plug are consistent with the inner diameter of the packaging forming pipe; the sensor package mold should maintain a 45 degree grip while injecting the encapsulation material. The upper end cap plug hole and the lower end cap plug hole are opposite in a Z shape, and the upper end cap plug hole is positioned at the position closest to the upper part, so that air is not reserved in the packaging tube. After the packaging material is completely cured, all the molds are removed, and the road structure micro-pressure strain and pressure stress monitoring sensor can be obtained.
Example 2
The utility model provides a road structure is little to be pressed the strain, compressive stress monitoring sensor manufacturing method, includes:
(1) cutting a silicone tube with the length of 5cm and the inner diameter of 1cm, and cleaning the inside. And (3) punching holes at corresponding positions of the silicone tube, and inserting the pre-embedded lead with the protective skins at the two ends removed into the holes.
(2) And respectively plugging the lower end injection cap plug and the upper end outflow cap plug into the silica gel tube, wherein the diameter of the cap plug is consistent with the inner diameter of the silica gel tube. The lower end injection guide pipe is inserted into the hole reserved on one side of the lower end injection cap plug, and the upper end outflow guide pipe is inserted into the hole reserved on one side of the upper end outflow cap plug. The lead is closely attached to the cap plugs at the two ends.
(3) And respectively sealing the reserved aperture of the cap plug and the insertion aperture of the lead by using vacuum sealant. The assembled "integrated molding die" should maintain a 45 degree grip. The upper end cap plug hole and the lower end cap plug hole are opposite in a Z shape, and the upper end cap plug hole is positioned at the position closest to the upper part, so that air in the forming pipe is prevented from being reserved.
(4) Injecting the conductive composite smart material by adopting a vacuum injection or vacuum suction mode, and carrying out molding and curing on the material
(5) And pulling out the cap plugs at the upper end and the lower end, and cleaning the residual conductive composite smart materials in the cap plugs. The 'epoxy column pouring mold' is characterized in that on the basis of the 'integrated molding mold', cap plugs at two ends are moved outwards by 1cm, and filling holes and outflow holes are respectively arranged in the formed upper end space and the lower end space.
(6) And after assembling to form an epoxy column pouring mold, mixing an epoxy resin system, respectively injecting epoxy resin into the upper end space and the lower end space in a vacuum injection or vacuum suction mode, and curing for 24 hours at room temperature. The mold is then removed.
(7) Cutting a silicone tube with the length of 8cm and the diameter of 2cm, and cleaning the inside. The two ends of the conductive composite smart material are externally connected with epoxy columns to prop the two end caps, and the two end caps and the packaged forming tube are fixed to prevent sliding. Wherein, except for reserving apertures with the same size as the outer diameters of the injection conduit and the outflow conduit on the two end plugs, a groove with the same size as the epoxy columns connected with the two ends is reserved in the center position, the depth of the groove is 2.0mm, and the diameter of the groove is 1 cm.
(8) After the 'compression strain sensor packaging mold' is assembled, the components are clamped at 45 degrees. Injecting the packaging material epoxy resin by adopting a vacuum injection or vacuum suction mode, and carrying out molding and curing on a resin system.
(9) After the packaging material is completely cured, all the molds are removed, and the road structure micro-pressure strain and pressure stress monitoring sensor can be obtained.
Example 3
The invention provides a road structure compressive strain monitoring sensor which is manufactured by adopting the manufacturing method of the road structure compressive strain monitoring sensor according to the embodiment.
Example 4
A road structure compressive strain monitoring sensor manufacturing device comprises an integrated forming die, an epoxy column pouring die and a compressive strain sensor packaging die, and the sensor is manufactured by the compressive strain monitoring sensor manufacturing method according to the embodiment.
The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Although the embodiments of the present disclosure have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present disclosure, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive changes in the technical solutions of the present disclosure.

Claims (6)

1. A method for manufacturing a road structure compressive strain monitoring sensor is characterized by comprising the following steps:
preparing an integrated forming die, injecting a conductive composite smart material, and forming and curing to obtain a conductive core element;
assembling the conductive core elements to form a pouring mold, pouring a high-temperature-resistant material, and obtaining the high-temperature-resistant conductive core elements after molding and curing;
assembling the high-temperature-resistant conductive core element into a compression strain sensor packaging mold, injecting packaging materials, and obtaining a road structure compression strain monitoring sensor after molding and curing;
the integrated forming die comprises an upper-end outflow cap plug, a forming pipe and a lower-end injection cap plug which are sequentially connected; the pouring mould is characterized in that on the basis of the integrated forming mould, the cap plugs at the two ends are moved outwards, and an injection hole and a flow-out hole are respectively arranged in the formed upper and lower end spaces; in the upper end space, a preformed hole of the upper end cap plug is used as an outflow port, and a hole is newly introduced to a position close to the conductive composite smart material to be used as an injection port; in the lower end space, a reserved hole of the lower end cap plug is used as an injection port, and another hole is newly introduced to a position close to the conductive composite smart material and used as an outflow port; after the newly introduced two holes are inserted into the guide pipe, sealing the two holes by using a sealant;
the pressure strain sensor packaging mold comprises an upper end outflow cap plug, a packaging forming pipe and a lower end injection cap plug which are sequentially connected; the upper end outflow cap plug is provided with an upper end outflow guide pipe, and the lower end injection cap plug is provided with a lower end injection guide pipe; an epoxy column mounting groove is formed in the center of the lower end injection cap plug and the upper end outflow cap plug;
when the conductive composite smart material is injected, the integrated forming die maintains 45-degree clamping; the upper end cap plug hole and the lower end cap plug hole are opposite in a Z shape, and the upper end cap plug hole is positioned at the position which is the most upper part, so that the air in the forming pipe is not retained; when the packaging material is injected, the packaging mold of the compressive strain sensor is maintained to be clamped at 45 degrees; the upper end cap plug hole and the lower end cap plug hole are opposite in a Z shape, and the upper end cap plug hole is positioned at the position closest to the upper part, so that air is not reserved in the packaging tube.
2. The method for manufacturing a compressive strain monitoring sensor according to claim 1, wherein the high temperature resistant material is epoxy resin, the casting mold is an epoxy column casting mold, the epoxy resin is respectively cast on the upper end and the lower end of the epoxy column casting mold, and the epoxy resin is molded and cured to obtain the conductive core element with the epoxy column.
3. The method of manufacturing a compressive strain monitoring sensor of claim 1 wherein the upper outflow cap plug has a conduit mounting hole for mounting an upper outflow conduit; the lower end injection cap plug is provided with a guide pipe mounting hole for mounting a lower end injection guide pipe; the lower surface of the upper end outflow cap plug is tightly attached with a first conducting wire, and the upper surface of the lower end injection cap plug is tightly attached with a second conducting wire.
4. The method of claim 1, wherein the sensor package mold is assembled by pressing the two caps with epoxy posts externally connected to the two ends of the conductive composite smart material, and fixing the two caps with the package molding tube to prevent sliding.
5. A road structure pressure strain monitoring sensor, which is manufactured by the method for manufacturing the road structure pressure strain monitoring sensor according to any one of claims 1 to 4, and comprises a conductive composite smart material core element, epoxy columns and an outer packaging layer, wherein the epoxy columns are arranged at the top and the bottom of the conductive composite smart material core element, and the outer packaging layer is wrapped on the side surface of the conductive composite smart material.
6. A device for manufacturing a compressive strain monitoring sensor of a road structure, which comprises an integrated molding die, an epoxy column pouring die and a compressive strain sensor packaging die, and is manufactured by the method for manufacturing the compressive strain monitoring sensor according to any one of claims 1 to 4.
CN202110218191.9A 2021-02-26 2021-02-26 Road structure compressive strain monitoring sensor, manufacturing method and device Active CN113021711B (en)

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