CN113021192A - Energy-saving and environment-friendly silicon wafer treatment equipment for controlling metal atom activity - Google Patents
Energy-saving and environment-friendly silicon wafer treatment equipment for controlling metal atom activity Download PDFInfo
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- CN113021192A CN113021192A CN202110231733.6A CN202110231733A CN113021192A CN 113021192 A CN113021192 A CN 113021192A CN 202110231733 A CN202110231733 A CN 202110231733A CN 113021192 A CN113021192 A CN 113021192A
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- movably connected
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- silicon wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
- B24C9/006—Treatment of used abrasive material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to the technical field of novel electronic elements, and provides energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms. According to the energy-saving environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms, the temperature of a silicon wafer reaches a set value, the resistance value of a thermistor changes correspondingly to trigger a driving mechanism, the driving mechanism enables a push block to move, the push block pushes a push plate through a linkage rod, the push plate and a spring rod extrude a trapezoidal block, the trapezoidal block is controlled by the arc block, when the moving distance of the push block reaches the set value, the trapezoidal block is pulled aside to two sides by the trapezoidal block, a piston is pushed by the trapezoidal block, sand is sprayed out of a spray head by the piston, the sand impacts and damages the semiconductor silicon wafer, and the metal atoms in the silicon are enabled to move to the damaged part completely through heat transfer so.
Description
Technical Field
The invention relates to the technical field of novel electronic elements, in particular to energy-saving and environment-friendly silicon wafer processing equipment for controlling metal atom mobility.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is a novel electronic element, because the silicon element used as the raw material of the semiconductor silicon wafer is one of the most abundant elements in the earth crust, the silicon element is inexhaustible, the semiconductor silicon wafer is one of the reasons of the main photovoltaic material, more than four thousand transistors can be integrated on the silicon wafer, and the silicon wafer is a mark of scientific progress.
In the prior art, when a semiconductor silicon wafer is subjected to damage treatment, the activity of iron, chromium, nickel and zinc in the silicon cannot be judged, the activity of iron, chromium, nickel and zinc is insufficient, the silicon wafer cannot be moved to a damage point from the inside when the back of the silicon wafer meets the damage point, the impact damage point is subjected to a sand blasting method, and the sprayed sand is not recycled, so that not only waste is generated, but also the next impact is influenced, and therefore, the energy-saving and environment-friendly silicon wafer treatment equipment for controlling the activity of metal atoms is produced.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides an energy-saving and environment-friendly silicon wafer processing apparatus for controlling metal atom activity, which is achieved by the following specific technical means:
an energy-saving and environment-friendly silicon wafer processing device for controlling the activity of metal atoms comprises a machine body, wherein a placing frame is fixedly connected inside the machine body, a thermistor is fixedly connected at the bottom of the placing frame, the surface of the thermistor is movably connected with a push block, the left side and the right side of the push block are movably connected with linkage rods, the surface of each linkage rod is movably connected with a telescopic rod, one end of each linkage rod, far away from the push block, is movably connected with a slide block, the bottom of each linkage rod is movably connected with a push plate, the bottom of the push plate is movably connected with a spring rod, the bottom of the spring rod is movably connected with a trapezoidal block, the left side and the right side of the trapezoidal block are movably connected with arc blocks, the bottom of the trapezoidal block is fixedly connected with a piston, the bottom of the piston is movably connected with a spray head, the bottom of the, the surface of the extrusion plate is movably connected with an air bag.
Preferably, the top of the placing frame is fixedly connected with a semiconductor silicon chip, the placing frame is made of heat-absorbing materials, the surface of the push block is movably connected with a driving mechanism, and a thermistor is movably connected between the push block and the driving mechanism.
Preferably, the top of the telescopic rod is movably connected with the machine body, the back of the sliding block is movably connected with the limiting groove, the interior of the machine body is fixedly connected with a heating device, and the heating device heats the silicon wafer.
Preferably, the arc-shaped block is movably arranged in the machine body, and a spiral spring is movably connected between the arc-shaped block and the machine body.
Preferably, the left side and the right side of the piston are movably connected with sand boxes, a semiconductor silicon wafer is arranged under the spray head and inside the machine body, and the sand sprayed by the spray head is aligned with the silicon wafer.
Preferably, the movable sleeve is movably connected with an extrusion plate through a connecting rod arranged at the bottom of the movable sleeve, and the opening of the air bag faces the placing frame.
The invention has the following beneficial effects:
1. the energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms is placed in a placing rack for stabilization through a silicon wafer, a heating device heats the silicon wafer, the temperature of the silicon wafer is transmitted to the placing rack, a thermistor judges the temperature of the silicon wafer in real time, when the temperature of the silicon wafer reaches a set value, the resistance value of the thermistor correspondingly changes to trigger a driving mechanism, the driving mechanism enables a pushing block to move, the pushing block pushes a pushing plate through a linkage rod, the pushing plate and a spring rod extrude a trapezoidal block, the spring rod can be compressed and deformed, an arc block controls the trapezoidal block, when the moving distance of the pushing block reaches the set value, the trapezoidal block is pulled open towards two sides by the trapezoidal block, the spring rod restores the original shape to push the trapezoidal block, the spring rod can increase the pushing speed of the trapezoidal block, the spring rod indirectly accelerates the sand blasting speed, the trapezoidal block pushes a piston, the sand impacts and damages the semiconductor silicon chip, thereby realizing the effect of completely moving metal atoms in the silicon to the damaged part by utilizing heat transfer to facilitate treatment.
2. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms is placed in a placing rack for stabilization through a silicon wafer, a heating device heats the silicon wafer, the temperature of the silicon wafer is transmitted to the placing rack, a thermistor judges the temperature of the silicon wafer in real time, when the temperature of the silicon wafer reaches a set value, the resistance value of the thermistor correspondingly changes to trigger a driving mechanism, the driving mechanism enables a pushing block to move, the pushing block pushes a pushing plate through a linkage rod, the pushing plate and a spring rod extrude a trapezoidal block, the spring rod can be compressed and deformed, an arc block controls the trapezoidal block, when the moving distance of the pushing block reaches the set value, the trapezoidal block is pulled open towards two sides by the trapezoidal block, the spring rod restores the original shape to push the trapezoidal block, the spring rod can increase the pushing speed of the trapezoidal block, the spring rod indirectly accelerates the sand blasting speed, the trapezoidal block pushes a piston, the sand impacts and damages the semiconductor silicon wafer, metal atoms inside the silicon are completely moved to the damaged part by heat transfer to be convenient to process, the linkage rod drives the sliding block to move, the sliding block drives the moving sleeve to move by utilizing the turning rod, the moving sleeve and the connecting rod are matched to use the stretching extrusion plate, the extrusion plate sucks the sand to be sucked and recycled, and therefore the effects of recycling the sand, saving resources and preventing the next impact from being influenced by the sand to deform the silicon wafer are achieved.
Drawings
FIG. 1 is a schematic front view of the structure of the rack of the present invention;
FIG. 2 is a schematic front view of the telescopic rod structure of the present invention;
FIG. 3 is a schematic front view of a slider structure according to the present invention;
FIG. 4 is a schematic front view of the bladder configuration of the present invention;
FIG. 5 is a schematic front view of a trapezoid block structure according to the present invention.
In the figure: 1. a body; 2. placing a rack; 3. a thermistor; 4. a push block; 5. a linkage rod; 6. a telescopic rod; 7. a slider; 8. pushing the plate; 9. a spring lever; 10. a trapezoidal block; 11. an arc-shaped block; 12. a piston; 13. a spray head; 14. a crank lever; 15. moving the sleeve; 16. a connecting rod; 17. a pressing plate; 18. an air bag.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an energy-saving and environment-friendly silicon wafer processing device for controlling the activity of metal atoms comprises a machine body 1, a placing frame 2 is fixedly connected inside the machine body 1, a semiconductor silicon wafer is fixedly connected to the top of the placing frame 2, the placing frame 2 is made of a heat-absorbing material, a driving mechanism is movably connected to the surface of a push block 4, a thermistor 3 is movably connected between the push block 4 and the driving mechanism, the thermistor 3 is fixedly connected to the bottom of the placing frame 2, the push block 4 is movably connected to the surface of the thermistor 3, linkage rods 5 are movably connected to the left side and the right side of the push block 4, and telescopic rods 6 are movably connected to the surface.
Top swing joint organism 1 of telescopic link 6, the back swing joint of slider 7 has the spacing groove, the inside fixedly connected with heating device of organism 1, heating device heats the silicon chip, the one end swing joint that ejector pad 4 was kept away from to gangbar 5 has slider 7, the bottom swing joint of gangbar 5 has push pedal 8, the bottom swing joint of push pedal 8 has spring beam 9, the bottom swing joint of spring beam 9 has trapezoidal piece 10, the equal swing joint in the left and right sides of trapezoidal piece 10 has arc piece 11, arc piece 11 swing joint is in the inside of organism 1, swing joint has coil spring between arc piece 11 and the organism 1, the bottom fixedly connected with piston 12 of trapezoidal piece 10, the left and right sides swing joint of piston 12 has the sand box.
Be provided with the semiconductor silicon chip under shower nozzle 13 and the inside that is located organism 1, shower nozzle 13 spouts sand and just aims at the silicon chip, the bottom swing joint of piston 12 has shower nozzle 13, the bottom swing joint of slider 7 has turning lever 14, the bottom swing joint of turning lever 14 has removal cover 15, removal cover 15 has stripper plate 17 through setting up the connecting rod 16 swing joint in its bottom, the opening of gasbag 18 is towards rack 2, the bottom swing joint of removal cover 15 has connecting rod 16, the surperficial swing joint of connecting rod 16 has stripper plate 17, the surperficial swing joint of stripper plate 17 has gasbag 18.
To sum up, the energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms has the advantages that a silicon wafer is placed in the placing frame 2 for stabilization, the heating device heats the silicon wafer, the temperature of the silicon wafer is transmitted to the placing frame 2, the thermistor 3 judges the temperature of the silicon wafer in real time, when the temperature of the silicon wafer reaches a set value, the resistance value of the thermistor 3 correspondingly changes to trigger the driving mechanism, the driving mechanism enables the push block 4 to move, the push block 4 pushes the push plate 8 by using the linkage rod 5, the push plate 8 and the spring rod 9 extrude the trapezoidal block 10, the spring rod 9 can be compressed and deformed, the arc block 11 controls the trapezoidal block 10, when the moving distance of the push block 4 reaches the set value, the trapezoidal block 10 is poked to two sides by the trapezoidal block 10, the spring rod 9 restores the original shape to push the trapezoidal block 10, the spring rod 9 can increase the pushing speed of the trapezoidal block 10, the trapezoidal block 10 pushes the piston 12, the piston 12 sprays sand from the spray head 13, the sand impacts and damages the semiconductor silicon wafer, and metal atoms in the silicon completely move to the damaged part by heat transfer so as to be convenient for processing.
The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms comprises a silicon wafer, a heating device, a pushing block 4, a linkage rod 5, a pushing plate 8, a spring rod 9, an arc block 11, a driving mechanism and a spring rod 9, wherein the silicon wafer is placed inside a placing frame 2 to be stabilized, the heating device heats the silicon wafer, the temperature of the silicon wafer is transmitted to the placing frame 2, the thermistor 3 judges the temperature of the silicon wafer in real time, when the temperature of the silicon wafer reaches a set value, the resistance value of the thermistor 3 correspondingly changes to trigger the driving mechanism, the driving mechanism enables the pushing block 4 to move, the pushing block 4 pushes the pushing plate 8 by utilizing the linkage rod 5, the pushing plate 8 and the spring rod 9 extrude the trapezoid block 10, the spring rod 9 can be compressed and deformed, the arc block 11 controls the trapezoid block 10, when the moving distance, the trapezoidal block 10 pushes the piston 12, the piston 12 sprays sand from the nozzle 13, the sand impacts and damages the semiconductor silicon wafer, metal atoms inside the silicon are completely moved to the damaged part by heat transfer to be convenient to process, the linkage rod 5 drives the slider 7 to move, the slider 7 drives the movable sleeve 15 to move by the aid of the connecting rod 14, the movable sleeve 15 and the connecting rod 16 are matched to use the stretching extrusion plate 17, the extrusion plate 17 sucks in and sucks and recovers the sand, the sand is recycled, resources are saved, and the silicon wafer is prevented from being deformed due to the influence of the sand on next impact.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an energy-concerving and environment-protective silicon chip treatment facility of control metal atom activity, includes organism (1), its characterized in that: the inner part of the machine body (1) is fixedly connected with a placing rack (2), the bottom of the placing rack (2) is fixedly connected with a thermistor (3), the surface of the thermistor (3) is movably connected with a push block (4), the left side and the right side of the push block (4) are both movably connected with a linkage rod (5), the surface of the linkage rod (5) is movably connected with a telescopic rod (6), one end of the linkage rod (5) far away from the push block (4) is movably connected with a slide block (7), the bottom of the linkage rod (5) is movably connected with a push plate (8), the bottom of the push plate (8) is movably connected with a spring rod (9), the bottom of the spring rod (9) is movably connected with a trapezoidal block (10), the left side and the right side of the trapezoidal block (10) are both movably connected with arc blocks (11), the bottom of the trapezoidal block (10) is fixedly, the bottom of the sliding block (7) is movably connected with a crank rod (14), the bottom of the crank rod (14) is movably connected with a movable sleeve (15), the bottom of the movable sleeve (15) is movably connected with a connecting rod (16), the surface of the connecting rod (16) is movably connected with an extrusion plate (17), and the surface of the extrusion plate (17) is movably connected with an air bag (18).
2. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms as claimed in claim 1, wherein: the top of the placing frame (2) is fixedly connected with a semiconductor silicon chip, the placing frame (2) is made of heat-absorbing materials, the surface of the push block (4) is movably connected with a driving mechanism, and a thermistor (3) is movably connected between the push block (4) and the driving mechanism.
3. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms as claimed in claim 1, wherein: the top of the telescopic rod (6) is movably connected with the machine body (1), the back of the sliding block (7) is movably connected with a limiting groove, and the interior of the machine body (1) is fixedly connected with a heating device.
4. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms as claimed in claim 1, wherein: the arc-shaped block (11) is movably arranged in the machine body (1), and a spiral spring is movably connected between the arc-shaped block (11) and the machine body (1).
5. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms as claimed in claim 1, wherein: the left side and the right side of the piston (12) are movably connected with sand boxes, and a semiconductor silicon chip is arranged right below the spray head (13) and inside the machine body (1).
6. The energy-saving and environment-friendly silicon wafer processing equipment for controlling the activity of metal atoms as claimed in claim 1, wherein: the movable sleeve (15) is movably connected with an extrusion plate (17) through a connecting rod (16) arranged at the bottom of the movable sleeve, and an opening of the air bag (18) faces the placing frame (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110231733.6A CN113021192A (en) | 2021-03-02 | 2021-03-02 | Energy-saving and environment-friendly silicon wafer treatment equipment for controlling metal atom activity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110231733.6A CN113021192A (en) | 2021-03-02 | 2021-03-02 | Energy-saving and environment-friendly silicon wafer treatment equipment for controlling metal atom activity |
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| Publication Number | Publication Date |
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| CN113021192A true CN113021192A (en) | 2021-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110231733.6A Withdrawn CN113021192A (en) | 2021-03-02 | 2021-03-02 | Energy-saving and environment-friendly silicon wafer treatment equipment for controlling metal atom activity |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8409184D0 (en) * | 1983-04-07 | 1984-05-16 | Vault Corp | Controlled removal of oxide from floppy disks |
| DE19946195C1 (en) * | 1999-09-27 | 2001-04-05 | Epcos Ag | Removal of alumina particle layer sintered onto sintered multilayer ceramic substrate, employs two stages of dry grit blasting followed by electrostatic repulsion of submicron residue |
| CN107901168A (en) * | 2017-11-30 | 2018-04-13 | 陈以璇 | Bamboo clappers surface processing equipment |
| CN108296989A (en) * | 2018-04-11 | 2018-07-20 | 佛山市穗远恒科建材有限公司 | A kind of plate shape wood surface building mortion |
| CN212044266U (en) * | 2020-01-07 | 2020-12-01 | 江苏鑫德龙环保科技有限公司 | Reciprocating type scraper blade recovery unit in sandblast room |
| CN112188936A (en) * | 2019-05-03 | 2021-01-05 | 海曼机械和设备有限公司 | Method and apparatus for forming a decorative surface |
-
2021
- 2021-03-02 CN CN202110231733.6A patent/CN113021192A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8409184D0 (en) * | 1983-04-07 | 1984-05-16 | Vault Corp | Controlled removal of oxide from floppy disks |
| DE19946195C1 (en) * | 1999-09-27 | 2001-04-05 | Epcos Ag | Removal of alumina particle layer sintered onto sintered multilayer ceramic substrate, employs two stages of dry grit blasting followed by electrostatic repulsion of submicron residue |
| CN107901168A (en) * | 2017-11-30 | 2018-04-13 | 陈以璇 | Bamboo clappers surface processing equipment |
| CN108296989A (en) * | 2018-04-11 | 2018-07-20 | 佛山市穗远恒科建材有限公司 | A kind of plate shape wood surface building mortion |
| CN112188936A (en) * | 2019-05-03 | 2021-01-05 | 海曼机械和设备有限公司 | Method and apparatus for forming a decorative surface |
| CN212044266U (en) * | 2020-01-07 | 2020-12-01 | 江苏鑫德龙环保科技有限公司 | Reciprocating type scraper blade recovery unit in sandblast room |
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Application publication date: 20210625 |