CN113012940A - Thin film capacitor structure integrated with shielding function - Google Patents
Thin film capacitor structure integrated with shielding function Download PDFInfo
- Publication number
- CN113012940A CN113012940A CN202110214303.3A CN202110214303A CN113012940A CN 113012940 A CN113012940 A CN 113012940A CN 202110214303 A CN202110214303 A CN 202110214303A CN 113012940 A CN113012940 A CN 113012940A
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- China
- Prior art keywords
- film capacitor
- thin film
- shielding
- integrated
- shielding function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 55
- 239000010409 thin film Substances 0.000 title claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000009434 installation Methods 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a thin film capacitor structure with an integrated shielding function, which comprises a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure form an integrated structure by adopting an injection molding process; wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes. The thin film capacitor structure with the integrated shielding function has a simple operation structure design, and effectively reduces the manufacturing cost; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a thin film capacitor structure integrating a shielding function.
Background
Along with the rapid development of new energy automobile technology, the bus capacitor that needs to use is more and more extensive in kind, and the requirement to design and assembly is higher and higher in production or maintenance process, all need consider the electric capacity can influence the performance of other power electronic device when the design installation, consequently all need increase shielding structure above the bus capacitor.
In the prior art, the bus capacitor and the shielding structure are designed in a split mode, and enough space needs to be reserved around the bus capacitor to arrange the shielding structure and the fixing structure. In addition, the existing shielding structure is fixed by bolts (as shown in fig. 6), the installation process is complicated, the material increase is high, and the cost is high.
Disclosure of Invention
The invention provides a thin film capacitor structure integrated with a shielding function.
The invention provides the following scheme:
a thin film capacitor structure integrating a shielding function comprises a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure are integrated into a whole by adopting an injection molding process;
wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes.
Preferably: the external dimension of the metal shielding structure is not less than the cross section of the internal space of the shell of the film capacitor.
Preferably: the metal shielding structure comprises any one of a copper wire mesh shielding layer, an aluminum foil shielding layer and a copper foil shielding layer.
Preferably: the thin film capacitor is connected with the shell through the connecting holes and the screws.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
according to the invention, a thin film capacitor structure with an integrated shielding function can be realized, and in an implementation mode, the structure can comprise a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure are formed into an integral structure by adopting an injection molding process; wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes. The thin film capacitor structure with the integrated shielding function has a simple operation structure design, and effectively reduces the manufacturing cost; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
fig. 2 is a front view of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along plane A-A in accordance with an embodiment of the present invention;
fig. 4 is a top view of a thin film capacitor structure with integrated shielding function according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an installation state of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a connection manner of a film capacitor and a shielding structure in the prior art.
In the figure: the thin film capacitor comprises a thin film capacitor 1, a connecting hole 11, a metal shielding structure 2, a shell 3 and a screw 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Examples
Referring to fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention is shown in fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, the structure may include a thin film capacitor 1 and a metal shielding structure 2, and the thin film capacitor 1 and the metal shielding structure 2 are formed into an integral structure by an injection molding process;
wherein, the thin film capacitor 1 is formed with a plurality of connecting holes 11, so as to realize the connection with the outer shell 3 through a plurality of the connecting holes 11.
The application provides a structure adopts injection moulding process to form integral type structure with film capacitor and shielding structure for film capacitor need not other connecting pieces with shielding structure and links to each other, only need fix film capacitor with the screw and can accomplish the installation in corresponding shell.
In order to achieve good shielding performance, the outer dimensions of the metallic shielding structure 2 are not smaller than the cross section of the inner space of the housing of the film capacitor 1. The shielding structure can completely shield the upper part of the film capacitor, so that the purpose of improving the shielding effect is achieved. The shielding structure may take various forms in practical applications, for example, the metal shielding structure includes any one of a copper wire mesh shielding layer, an aluminum foil shielding layer, and a copper foil shielding layer.
The shell that this application embodiment provided can be the shell that is used for installing multiple electrical components, and for the convenience of electric capacity and shell linking to each other, film capacitor 1 through a plurality of connecting hole 11 and many screws 4 with shell 3 links to each other. Because electric capacity and shielding structure formula structure as an organic whole, when consequently installing and using, only need to adopt the screw with the electric capacity and fix with the shell and can accomplish the installation.
The embodiment of the application provides integrated form shielding structure's film capacitor, moulds plastics and coats film capacitor's metal shielding structure, with the electric capacity of an integrated form, has replaced the installation of original film capacitor and extra shielding structure. The film capacitor is fixed only by screws, so that the purposes of simple installation, space occupation reduction, material cost and reliable shielding protection are achieved.
In a word, the thin film capacitor structure integrating the shielding function has a simple operation structure design, and the manufacturing cost is effectively reduced; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (4)
1. A thin film capacitor structure integrating a shielding function is characterized by comprising a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure form an integral structure by adopting an injection molding process;
wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes.
2. The thin film capacitor structure with integrated shielding function as claimed in claim 1, wherein the metal shielding structure has an outer dimension not smaller than a cross section of the inner space of the housing of the thin film capacitor.
3. The thin film capacitor structure with integrated shielding function of claim 1, wherein the metal shielding structure comprises any one of a copper wire mesh shielding layer, an aluminum foil shielding layer, and a copper foil shielding layer.
4. The thin film capacitor structure integrated with shielding function as claimed in claim 1, wherein the thin film capacitor is connected to the housing through a plurality of the connection holes and a plurality of screws.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110214303.3A CN113012940A (en) | 2021-02-26 | 2021-02-26 | Thin film capacitor structure integrated with shielding function |
Applications Claiming Priority (1)
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CN202110214303.3A CN113012940A (en) | 2021-02-26 | 2021-02-26 | Thin film capacitor structure integrated with shielding function |
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CN113012940A true CN113012940A (en) | 2021-06-22 |
Family
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CN202110214303.3A Pending CN113012940A (en) | 2021-02-26 | 2021-02-26 | Thin film capacitor structure integrated with shielding function |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148723A (en) * | 1995-06-21 | 1997-04-30 | 伊利诺斯工具制造公司 | Infrared shield of capacitor |
US20060104006A1 (en) * | 2004-11-17 | 2006-05-18 | Matsushita Electric Industrial Co., Ltd. | Film capacitor and method of manufacturing the same |
CN103493198A (en) * | 2012-09-11 | 2014-01-01 | 华为终端有限公司 | Electronic device and manufacturing method thereof |
CN203932518U (en) * | 2014-05-12 | 2014-11-05 | 洛阳伟信电子科技有限公司 | A kind of electric connector with metal screen |
CN206877840U (en) * | 2017-05-27 | 2018-01-12 | 宁波新容电器科技有限公司 | It is electromagnetically shielded capacitor |
CN209527044U (en) * | 2018-11-09 | 2019-10-22 | 中山大洋电机股份有限公司 | A kind of electric machine controller |
CN110379626A (en) * | 2019-07-25 | 2019-10-25 | 浙江伊控动力系统有限公司 | A kind of capacitor and its manufacturing process, application method for parallel IGBT |
CN210897001U (en) * | 2019-12-11 | 2020-06-30 | 三北(天津)电子科技有限公司 | Small-size condenser of metallic film |
CN211150337U (en) * | 2019-12-14 | 2020-07-31 | 上海电驱动股份有限公司 | Low inductance capacitance device of integrated filtering magnetic ring |
-
2021
- 2021-02-26 CN CN202110214303.3A patent/CN113012940A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1148723A (en) * | 1995-06-21 | 1997-04-30 | 伊利诺斯工具制造公司 | Infrared shield of capacitor |
US20060104006A1 (en) * | 2004-11-17 | 2006-05-18 | Matsushita Electric Industrial Co., Ltd. | Film capacitor and method of manufacturing the same |
CN103493198A (en) * | 2012-09-11 | 2014-01-01 | 华为终端有限公司 | Electronic device and manufacturing method thereof |
CN203932518U (en) * | 2014-05-12 | 2014-11-05 | 洛阳伟信电子科技有限公司 | A kind of electric connector with metal screen |
CN206877840U (en) * | 2017-05-27 | 2018-01-12 | 宁波新容电器科技有限公司 | It is electromagnetically shielded capacitor |
CN209527044U (en) * | 2018-11-09 | 2019-10-22 | 中山大洋电机股份有限公司 | A kind of electric machine controller |
CN110379626A (en) * | 2019-07-25 | 2019-10-25 | 浙江伊控动力系统有限公司 | A kind of capacitor and its manufacturing process, application method for parallel IGBT |
CN210897001U (en) * | 2019-12-11 | 2020-06-30 | 三北(天津)电子科技有限公司 | Small-size condenser of metallic film |
CN211150337U (en) * | 2019-12-14 | 2020-07-31 | 上海电驱动股份有限公司 | Low inductance capacitance device of integrated filtering magnetic ring |
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Application publication date: 20210622 |
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