CN113012940A - Thin film capacitor structure integrated with shielding function - Google Patents

Thin film capacitor structure integrated with shielding function Download PDF

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Publication number
CN113012940A
CN113012940A CN202110214303.3A CN202110214303A CN113012940A CN 113012940 A CN113012940 A CN 113012940A CN 202110214303 A CN202110214303 A CN 202110214303A CN 113012940 A CN113012940 A CN 113012940A
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CN
China
Prior art keywords
film capacitor
thin film
shielding
integrated
shielding function
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110214303.3A
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Chinese (zh)
Inventor
袁涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Centem Automotive Electronics Co ltd
Original Assignee
Ningbo Centem Automotive Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Centem Automotive Electronics Co ltd filed Critical Ningbo Centem Automotive Electronics Co ltd
Priority to CN202110214303.3A priority Critical patent/CN113012940A/en
Publication of CN113012940A publication Critical patent/CN113012940A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention discloses a thin film capacitor structure with an integrated shielding function, which comprises a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure form an integrated structure by adopting an injection molding process; wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes. The thin film capacitor structure with the integrated shielding function has a simple operation structure design, and effectively reduces the manufacturing cost; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.

Description

Thin film capacitor structure integrated with shielding function
Technical Field
The invention relates to the technical field of communication, in particular to a thin film capacitor structure integrating a shielding function.
Background
Along with the rapid development of new energy automobile technology, the bus capacitor that needs to use is more and more extensive in kind, and the requirement to design and assembly is higher and higher in production or maintenance process, all need consider the electric capacity can influence the performance of other power electronic device when the design installation, consequently all need increase shielding structure above the bus capacitor.
In the prior art, the bus capacitor and the shielding structure are designed in a split mode, and enough space needs to be reserved around the bus capacitor to arrange the shielding structure and the fixing structure. In addition, the existing shielding structure is fixed by bolts (as shown in fig. 6), the installation process is complicated, the material increase is high, and the cost is high.
Disclosure of Invention
The invention provides a thin film capacitor structure integrated with a shielding function.
The invention provides the following scheme:
a thin film capacitor structure integrating a shielding function comprises a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure are integrated into a whole by adopting an injection molding process;
wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes.
Preferably: the external dimension of the metal shielding structure is not less than the cross section of the internal space of the shell of the film capacitor.
Preferably: the metal shielding structure comprises any one of a copper wire mesh shielding layer, an aluminum foil shielding layer and a copper foil shielding layer.
Preferably: the thin film capacitor is connected with the shell through the connecting holes and the screws.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
according to the invention, a thin film capacitor structure with an integrated shielding function can be realized, and in an implementation mode, the structure can comprise a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure are formed into an integral structure by adopting an injection molding process; wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes. The thin film capacitor structure with the integrated shielding function has a simple operation structure design, and effectively reduces the manufacturing cost; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
fig. 2 is a front view of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along plane A-A in accordance with an embodiment of the present invention;
fig. 4 is a top view of a thin film capacitor structure with integrated shielding function according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an installation state of a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a connection manner of a film capacitor and a shielding structure in the prior art.
In the figure: the thin film capacitor comprises a thin film capacitor 1, a connecting hole 11, a metal shielding structure 2, a shell 3 and a screw 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Examples
Referring to fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, a thin film capacitor structure integrated with a shielding function according to an embodiment of the present invention is shown in fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, the structure may include a thin film capacitor 1 and a metal shielding structure 2, and the thin film capacitor 1 and the metal shielding structure 2 are formed into an integral structure by an injection molding process;
wherein, the thin film capacitor 1 is formed with a plurality of connecting holes 11, so as to realize the connection with the outer shell 3 through a plurality of the connecting holes 11.
The application provides a structure adopts injection moulding process to form integral type structure with film capacitor and shielding structure for film capacitor need not other connecting pieces with shielding structure and links to each other, only need fix film capacitor with the screw and can accomplish the installation in corresponding shell.
In order to achieve good shielding performance, the outer dimensions of the metallic shielding structure 2 are not smaller than the cross section of the inner space of the housing of the film capacitor 1. The shielding structure can completely shield the upper part of the film capacitor, so that the purpose of improving the shielding effect is achieved. The shielding structure may take various forms in practical applications, for example, the metal shielding structure includes any one of a copper wire mesh shielding layer, an aluminum foil shielding layer, and a copper foil shielding layer.
The shell that this application embodiment provided can be the shell that is used for installing multiple electrical components, and for the convenience of electric capacity and shell linking to each other, film capacitor 1 through a plurality of connecting hole 11 and many screws 4 with shell 3 links to each other. Because electric capacity and shielding structure formula structure as an organic whole, when consequently installing and using, only need to adopt the screw with the electric capacity and fix with the shell and can accomplish the installation.
The embodiment of the application provides integrated form shielding structure's film capacitor, moulds plastics and coats film capacitor's metal shielding structure, with the electric capacity of an integrated form, has replaced the installation of original film capacitor and extra shielding structure. The film capacitor is fixed only by screws, so that the purposes of simple installation, space occupation reduction, material cost and reliable shielding protection are achieved.
In a word, the thin film capacitor structure integrating the shielding function has a simple operation structure design, and the manufacturing cost is effectively reduced; the space utilization of the structural design is improved; the production is simplified, the product installation difficulty is reduced, and the environment adaptability is better; meanwhile, the production process is rapid, simple and convenient, and has larger installation tolerance adjusting space, thereby improving the cost performance of products and reducing the cost of the manufacturing process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims (4)

1. A thin film capacitor structure integrating a shielding function is characterized by comprising a thin film capacitor and a metal shielding structure, wherein the thin film capacitor and the metal shielding structure form an integral structure by adopting an injection molding process;
wherein, the thin film capacitor is formed with a plurality of connecting holes so as to be connected with the shell through the plurality of connecting holes.
2. The thin film capacitor structure with integrated shielding function as claimed in claim 1, wherein the metal shielding structure has an outer dimension not smaller than a cross section of the inner space of the housing of the thin film capacitor.
3. The thin film capacitor structure with integrated shielding function of claim 1, wherein the metal shielding structure comprises any one of a copper wire mesh shielding layer, an aluminum foil shielding layer, and a copper foil shielding layer.
4. The thin film capacitor structure integrated with shielding function as claimed in claim 1, wherein the thin film capacitor is connected to the housing through a plurality of the connection holes and a plurality of screws.
CN202110214303.3A 2021-02-26 2021-02-26 Thin film capacitor structure integrated with shielding function Pending CN113012940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110214303.3A CN113012940A (en) 2021-02-26 2021-02-26 Thin film capacitor structure integrated with shielding function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110214303.3A CN113012940A (en) 2021-02-26 2021-02-26 Thin film capacitor structure integrated with shielding function

Publications (1)

Publication Number Publication Date
CN113012940A true CN113012940A (en) 2021-06-22

Family

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Application Number Title Priority Date Filing Date
CN202110214303.3A Pending CN113012940A (en) 2021-02-26 2021-02-26 Thin film capacitor structure integrated with shielding function

Country Status (1)

Country Link
CN (1) CN113012940A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1148723A (en) * 1995-06-21 1997-04-30 伊利诺斯工具制造公司 Infrared shield of capacitor
US20060104006A1 (en) * 2004-11-17 2006-05-18 Matsushita Electric Industrial Co., Ltd. Film capacitor and method of manufacturing the same
CN103493198A (en) * 2012-09-11 2014-01-01 华为终端有限公司 Electronic device and manufacturing method thereof
CN203932518U (en) * 2014-05-12 2014-11-05 洛阳伟信电子科技有限公司 A kind of electric connector with metal screen
CN206877840U (en) * 2017-05-27 2018-01-12 宁波新容电器科技有限公司 It is electromagnetically shielded capacitor
CN209527044U (en) * 2018-11-09 2019-10-22 中山大洋电机股份有限公司 A kind of electric machine controller
CN110379626A (en) * 2019-07-25 2019-10-25 浙江伊控动力系统有限公司 A kind of capacitor and its manufacturing process, application method for parallel IGBT
CN210897001U (en) * 2019-12-11 2020-06-30 三北(天津)电子科技有限公司 Small-size condenser of metallic film
CN211150337U (en) * 2019-12-14 2020-07-31 上海电驱动股份有限公司 Low inductance capacitance device of integrated filtering magnetic ring

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1148723A (en) * 1995-06-21 1997-04-30 伊利诺斯工具制造公司 Infrared shield of capacitor
US20060104006A1 (en) * 2004-11-17 2006-05-18 Matsushita Electric Industrial Co., Ltd. Film capacitor and method of manufacturing the same
CN103493198A (en) * 2012-09-11 2014-01-01 华为终端有限公司 Electronic device and manufacturing method thereof
CN203932518U (en) * 2014-05-12 2014-11-05 洛阳伟信电子科技有限公司 A kind of electric connector with metal screen
CN206877840U (en) * 2017-05-27 2018-01-12 宁波新容电器科技有限公司 It is electromagnetically shielded capacitor
CN209527044U (en) * 2018-11-09 2019-10-22 中山大洋电机股份有限公司 A kind of electric machine controller
CN110379626A (en) * 2019-07-25 2019-10-25 浙江伊控动力系统有限公司 A kind of capacitor and its manufacturing process, application method for parallel IGBT
CN210897001U (en) * 2019-12-11 2020-06-30 三北(天津)电子科技有限公司 Small-size condenser of metallic film
CN211150337U (en) * 2019-12-14 2020-07-31 上海电驱动股份有限公司 Low inductance capacitance device of integrated filtering magnetic ring

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Application publication date: 20210622

RJ01 Rejection of invention patent application after publication