CN113004845B - Anionic photocuring mercaptan-epoxy adhesive - Google Patents
Anionic photocuring mercaptan-epoxy adhesive Download PDFInfo
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- CN113004845B CN113004845B CN202110185975.6A CN202110185975A CN113004845B CN 113004845 B CN113004845 B CN 113004845B CN 202110185975 A CN202110185975 A CN 202110185975A CN 113004845 B CN113004845 B CN 113004845B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
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- Polymers & Plastics (AREA)
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Abstract
The invention relates to an anionic photocuring thiol-epoxy adhesive, belonging to the field of photocuring. The components of the anion photocuring mercaptan-epoxy high-hardness adhesive comprise 40-60 parts of hydantoin epoxy resin, 20-45 parts of mercaptan-1, 5-30 parts of mercaptan-2, 10-30 parts of reactive diluent and 1-5 parts of photobase generator, wherein the mercaptan-1 and the mercaptan-2 are different substances, the mercaptan-1 is liquid resin, and the mercaptan-2 has a heterocyclic ring or benzene ring structure. The adhesive has the advantages of good adhesive property, high reaction activity, long working life, high adhesive layer hardness, good wear resistance and high temperature resistance.
Description
Technical Field
The invention relates to an anionic photocuring thiol-epoxy adhesive, belonging to the field of photocuring.
Background
The photocuring technology has the advantages of green, energy saving, environmental protection and the like, and can be applied to the fields of coatings, adhesives, dental repair materials and the like. The anion photocuring adopts a photobase generator as an initiator, and the curing system has small shrinkage, no oxygen inhibition and small corrosion to a base material. Because of the low quantum yield of the photobase generators, the coating still needs long-time illumination and postbaking.
The epoxy resin has outstanding bonding performance and wide application in the field of electronic packaging, the curing speed of a high-light-yield alkali system can be improved by adopting the reaction of high-activity hydantoin epoxy resin and mercaptan, and the formula has a longer pot life; by compounding with rigid structural mercaptan, the hardness and the wear resistance of the adhesive layer can be improved, and the performance of the adhesive is improved.
Disclosure of Invention
Based on the problems, the invention provides an anionic photocuring thiol-epoxy adhesive which comprises the following components:
the mercaptan-1 and the mercaptan-2 are different substances; wherein, the mercaptan-1 is liquid resin, and the mercaptan-2 is provided with a heterocyclic ring or a benzene ring structure.
The mercaptan-1 is in a liquid state and has a fast reaction speed with the epoxy resin, the mercaptan-2 is resin with a rigid structure, the system hardness can be improved, the anionic photocuring system has higher reaction activity and coating performance by adjusting the content of the mercaptan-1 and the mercaptan-2 in the system and mutually matching with other substances in the system, and the formed adhesive layer has higher wear resistance and hardness.
In one embodiment, the components of the anionic photocurable thiol-epoxy adhesive further comprise a photosensitizer. When the wavelength of the photobase generator used in the adhesive is longer, a photosensitizer does not need to be added; when the photobase generator used has a short wavelength, a photosensitizer is added.
In one embodiment, the photosensitizer comprises 2-Isopropylthioxanthone (ITX).
In one embodiment, the hydantoin epoxy has an epoxy value in the range of 0.5 to 0.7.
In one embodiment, the thiol-1 has an epoxy value in the range of 0.5 to 0.7.
In one embodiment, the molar mass ratio of the sum of the molar masses of the mercapto groups of thiol-1 and thiol-2 to the epoxy groups of the hydantoin epoxy resin is 1: 1.
In one embodiment, the hydantoin epoxy resin includes 5, 5-dimethyl-1, 3-di (oxiranylmethyl) imidazolidine-2, 4-dione (brand MHR070, MHR 154B).
In one embodiment, the reactive diluent comprises at least one of trimethylolpropane triglycidyl ether, neopentyl glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether, polypropylene glycol diglycidyl ether, ethylene glycol diglycidyl ether, benzyl glycidyl ether, butyl glycidyl ether, and fatty glycidyl ether.
In one embodiment, the thiol-1 comprises at least one of trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate).
In one embodiment, the thiol-2 comprises at least one of 1,3, 5-tris (3-mercaptopropyl) isocyanurate, 2,4, 6-trimercapto-s-triazine, and 1, 4-benzenedimethylthiol.
In one embodiment, the photobase generator comprises at least one compound selected from the group consisting of carbamates, O-acyloximes, O-carbamoyloximes, alpha-aminoketones, benzoylformamides, and reduced amidines, cobalt amine complexes, quaternary ammonium salts, tetraphenylborate salts, and carboxylic acid salts.
Advantageous effects
The invention provides an anionic photocuring thiol-epoxy adhesive, which has the following advantages:
1. the hydantoin epoxy resin belongs to glycidyl amine type epoxy resin, the anion photocuring activity of an epoxy group is higher than that of glycidyl ether type epoxy resin, and the hydantoin epoxy resin is matched with liquid mercaptan resin, so that the reactivity of the composition is improved.
2. The scheme selects two kinds of mercaptan resin with different proportions, and has the advantages of high film coating performance, high adhesive layer hardness, good wear resistance and high temperature resistance while maintaining the curing uniformity of the system and high reactivity.
3. The system has good bonding performance and can be widely applied to adhesion of photoelectric devices and high-voltage insulating devices.
4. The scheme is simple, economical and environment-friendly, and is suitable for industrial production.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in detail with reference to the following embodiments.
Example 1: the following substances are mixed according to a proportion to form the anionic photocuring thiol-epoxy adhesive.
Wherein, the hydantoin epoxy resin MHR070 is purchased from New materials of Taiji, Guangzhou, has an epoxy value of 0.7 and is in a liquid state.
Wherein the pentaerythritol tetra (3-mercaptobutanoic acid) is in liquid state.
Wherein the 1,3, 5-tris (3-mercaptopropyl) isocyanurate is in a solid state.
The molar weight of the mercapto groups of the pentaerythritol tetra (3-mercaptobutanoate) and the 1,3, 5-tris (3-mercaptopropyl) isocyanurate were 0.023mol and 0.012mol, respectively.
The epoxy molar weight of the hydantoin epoxy resin MHR070 is 0.035 mol.
Example 2: the components of example 1 were mixed with the photobase generator and photosensitizer and resin to dissolve, coated on a steel plate, the steel plate was cured by ultraviolet light, irradiated 9 times by a crawler-type UV curing machine (Fusion corporation, F300UV), cured and formed, and cured after standing at 80 ℃ for 2 hours.
Example 3: the following substances are mixed according to a proportion to form the anionic photocuring thiol-epoxy adhesive.
| Composition (I) | Specific material | Mass percent |
| Hydantoin epoxy resin | MHR154B | 45％ |
| Thiol 1 | Tetrakis (3-mercaptobutanoic acid) pentaerythritol ester | 35％ |
| Thiol 2 | 2,4, 6-trimercapto-s-triazine | 10％ |
| Reactive diluent | Trimethylolpropane triglycidyl ether | 5％ |
| Photobase generator | TBD·HBPh4 | 3％ |
| Photosensitizers | ITX | 2％ |
Wherein the hydantoin epoxy resin MHR154B is available from Taiji New materials, Guangzhou, and has an epoxy value of 0.5 and is in a liquid state.
Wherein the pentaerythritol tetra (3-mercaptobutanoic acid) is in liquid state.
Wherein the 2,4, 6-trimercapto-s-triazine is in a solid state.
The molar weight of the tetra (3-mercaptobutanoic acid) pentaerythritol ester and the molar weight of the 2,4, 6-trimercapto-s-triazine mercapto group are respectively 0.0188mol and 0.0062 mol.
The epoxy molar weight of the hydantoin epoxy resin MHR070 is 0.025 mol.
Real-time example 4: according to the composition proportion of the embodiment 3, the photobase generator and the photosensitizer are stirred and dissolved with resin, coated on a steel plate, the steel plate is cured by ultraviolet light, irradiated for 9 times under a crawler-type UV curing machine (Fusion company, F300UV), cured and molded, and placed for 2 hours at 80 ℃ for curing.
Example 5: the following substances are mixed according to a proportion to form the anionic photocuring thiol-epoxy adhesive.
| Composition (I) | Specific substance | Mass percent |
| Hydantoin epoxy resin | Hydantoin epoxy resin (MHR154B) | 45％ |
| Thiol 1 | Trimethylolpropane tris (3-mercaptopropionate) | 25％ |
| Thiol 2 | 1,4-benzenedimethylthiol | 20％ |
| Reactive diluent | 1, 4-butanediol diglycidyl ether | 5％ |
| Photobase generator | TBD·HBPh4 | 3％ |
| Photosensitizers | ITX | 2％ |
Wherein the hydantoin epoxy resin MHR154B is available from Taiji New materials, Guangzhou, and has an epoxy value of 0.5 and is in a liquid state.
Wherein the trimethylolpropane tris (3-mercaptopropionate) is in a liquid state.
Wherein, the 1, 4-benzenedimethylmercaptan is in a liquid state.
The molar weight of trimethylolpropane tri (3-mercaptopropionate) and the molar weight of mercapto group of 1, 4-benzenedimethylthiol are 0.01375mol and 0.01125mol respectively.
The epoxy molar weight of the hydantoin epoxy resin MHR070 is 0.025 mol.
Example 6: according to the composition proportion of the embodiment 5, the photobase generator and the photosensitizer are stirred and dissolved with resin, coated on a steel plate, the steel plate is cured by ultraviolet light, irradiated for 9 times under a crawler-type UV curing machine (Fusion company, F300UV), cured and molded, and placed for 2 hours at 80 ℃ for curing.
Example 7: performance testing
| Storage stability/day | Hardness of pencil | Tg/℃ | Shear strength/MPa | Thermal stability/. degree.C | |
| Example 1 | 12 | 4H | 60 | 5.5 | 300 |
| Example 2 | 12 | 5H | 65 | 5.8 | 300 |
| Example 3 | 12 | 5H | 55 | 5.3 | 300 |
The prepared photocuring adhesive has good storage stability, the glass transition temperature and the hardness of a curing film are improved due to the addition of aromatic and heterocyclic mercaptan, the mechanical property is still improved although the uniformity of a cross-linked network is reduced, and meanwhile, the adhesive is high in bonding strength and high in thermal stability and is suitable for being used under a high-temperature condition.
The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto. All equivalent changes, simplifications and modifications which do not depart from the spirit and scope of the invention are intended to be covered by the scope of the invention.
Claims (7)
1. An anionic photocuring thiol-epoxy adhesive is characterized by comprising the following components in parts by weight:
40-60 parts of hydantoin epoxy resin
120-45 parts of mercaptan
25-30 parts of mercaptan
5-30 parts of reactive diluent
1-5 parts of photobase generator;
the mercaptan-1 and the mercaptan-2 are different substances; wherein, the mercaptan-1 is liquid resin, and the mercaptan-2 is in a heterocyclic ring or benzene ring structure;
the mercaptan-1 comprises at least one of trimethylolpropane tri (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutanoate) and pentaerythritol tetrakis (3-mercaptopropionate);
the mercaptan-2 comprises at least one of 1,3, 5-tri (3-mercaptopropyl) isocyanurate, 2,4, 6-trimercapto-s-triazine and 1, 4-benzenedimethylmercaptan.
2. The anionic photocurable thiol-epoxy adhesive according to claim 1, wherein the hydantoin epoxy resin is a liquid resin with an epoxy value of 0.5-0.7.
3. The anionic photocurable thiol-epoxy adhesive according to claim 1, wherein the epoxy value of thiol-1 is 0.5-0.7.
4. The anionic photocurable thiol-epoxy adhesive according to claim 1, wherein the molar mass ratio of the sum of the molar masses of thiol-1 and thiol-2 to the epoxy groups of the hydantoin epoxy resin is 1: 1.
5. The anionic photocurable thiol-epoxy adhesive according to claim 1, 2 or 4, wherein the hydantoin epoxy resin comprises 5, 5-dimethyl-1, 3-di (oxiranylmethyl) imidazolidine-2, 4-dione.
6. The anionic photocurable thiol-epoxy adhesive according to claim 1, wherein the reactive diluent comprises at least one of trimethylolpropane triglycidyl ether, neopentyl glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether, polypropylene glycol diglycidyl ether, ethylene glycol diglycidyl ether, benzyl glycidyl ether, butyl glycidyl ether, and aliphatic glycidyl ether.
7. The anionic photocurable thiol-epoxy adhesive of claim 1, wherein the photobase generator comprises at least one of carbamate, O-acyloxime ester, O-carbamoyloxime ester, α -aminoketone, benzoylformamide and reduced amidine, cobalt-amine complex, quaternary ammonium salt, tetraphenylboron salt, and carboxylate.
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| CN202110185975.6A CN113004845B (en) | 2021-02-13 | 2021-02-13 | Anionic photocuring mercaptan-epoxy adhesive |
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| CN202110185975.6A CN113004845B (en) | 2021-02-13 | 2021-02-13 | Anionic photocuring mercaptan-epoxy adhesive |
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| CN113004845B true CN113004845B (en) | 2022-05-17 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6153719A (en) * | 1998-02-04 | 2000-11-28 | Lord Corporation | Thiol-cured epoxy composition |
| CN102977557B (en) * | 2012-12-11 | 2015-11-18 | 蓝星(北京)化工机械有限公司 | A kind of room temperature curing epoxy composition and method of making the same |
| CN108192285A (en) * | 2017-12-23 | 2018-06-22 | 汕头市骏码凯撒有限公司 | A kind of optics LED encapsulation bonds epoxy-plastic packaging material and preparation method thereof with high |
| CN109575860B (en) * | 2018-11-27 | 2020-01-31 | 深圳市明粤科技有限公司 | low-temperature fast-curing conductive silver adhesive and preparation method thereof |
| CN112322237A (en) * | 2020-11-06 | 2021-02-05 | 江南大学 | Single-component UV (ultraviolet) delayed curing adhesive composition and preparation and application methods thereof |
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