CN113004829A - Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof - Google Patents
Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof Download PDFInfo
- Publication number
- CN113004829A CN113004829A CN202110243827.5A CN202110243827A CN113004829A CN 113004829 A CN113004829 A CN 113004829A CN 202110243827 A CN202110243827 A CN 202110243827A CN 113004829 A CN113004829 A CN 113004829A
- Authority
- CN
- China
- Prior art keywords
- silver powder
- parts
- graphene oxide
- graphene
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to an electronic adhesive for packaging a graphene-based semiconductor chip and a preparation method thereof, wherein the electronic adhesive comprises the following raw materials in parts by weight: 10-25 parts of epoxy resin, 2-8 parts of a reaction diluent, 3-8 parts of a bi-component curing agent, 1-2 parts of an accelerator, 0.5-1 part of a coupling agent, 1-3 parts of aminated graphene oxide, 0.5-1.5 parts of a one-dimensional carbon nano tube and 50-80 parts of compound silver powder, wherein the bi-component curing agent is a mixture of a dicyandiamide curing agent and an imidazole curing agent; the compound silver powder is a mixture of flake silver powder and spherical silver powder. According to the electronic adhesive for packaging the graphene-based semiconductor chip, the aminated graphene oxide, the one-dimensional carbon nano tube and the compound silver powder are added, and the mixture is uniformly stirred by a planetary stirrer and then is rolled by a three-roll machine for multiple times, so that the graphene oxide/carbon nano tube/conductive metal particles form a uniform spatial structure of surface/line/point, and the electronic adhesive has excellent volume resistivity and conductivity.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to an electronic adhesive for packaging a graphene-based semiconductor chip and a preparation method thereof.
Background
The packaging of electronic components has evolved from the early simple glass envelope packaging of vacuum tubes to today's extremely sophisticated advanced systems, now developed as one of the core technologies of the new generation of integrated circuits. Due to moore's law followed by the semiconductor industry, integrated circuits have become more and more complex, have become more and more fast, and have become smaller in chip size, which has put higher demands on packaging technology. At present, a plurality of devices work normally and need to package a chip in a vacuum environment, the chip is connected with a packaging substrate in a certain mode, and an adhesive material is added between the chip and the packaging substrate, so that the chip can be fixed and can bear certain thermal and mechanical stress.
The epoxy resin adhesive is a chip adhesive commonly used in the field of electronic packaging, and consists of matrix epoxy resin, conductive filler (generally conductive silver particles), a curing agent, an auxiliary agent and the like, wherein the conductive particles are combined together through the bonding action of the matrix resin to form a conductive path, so that the conductive connection of the bonded materials is realized.
The existing epoxy resin conductive adhesive simply relies on filling flake silver powder to obtain conductive performance, and the conductive performance deviation and higher volume resistivity of the existing epoxy resin conductive adhesive are bottleneck problems restricting the development of the epoxy resin adhesive.
Disclosure of Invention
The invention aims to provide an electronic adhesive for packaging a graphene-based semiconductor chip, which has excellent volume resistivity and conductivity.
The technical scheme adopted by the invention for solving the problems is as follows: an electronic adhesive for packaging a graphene-based semiconductor chip comprises the following raw materials in parts by weight:
10-25 parts of epoxy resin
2-8 parts of reaction diluent
3-8 parts of bi-component curing agent
1-2 parts of accelerator
0.5-1 part of coupling agent
1-3 parts of aminated graphene oxide
0.5 to 1.5 parts of one-dimensional carbon nano tube
50-80 parts of compound silver powder
Wherein the bi-component curing agent is a mixture of dicyandiamide curing agent and imidazole curing agent; the compound silver powder is a mixture of flake silver powder with the average grain diameter of 1.1-10 mu m and spherical silver powder with the average grain diameter of 0.01-1 mu m.
Preferably, the epoxy resin is one or two of bisphenol a type epoxy resin and bisphenol F type epoxy resin.
Preferably, the reaction diluent is at least one of allyl glycidyl ether, butyl glycidyl ether, 1, 4-butanediol diglycidyl ether, and 1, 6-hexanediol glycidyl ether.
Preferably, the mass ratio of the dicyandiamide curing agent to the imidazole curing agent is 3: 1-1.1: 1.
Preferably, the accelerator is at least one of 2,4, 6-tris (dimethylaminomethyl) phenol and aminoethyl piperazine.
Preferably, the coupling agent is at least one of gamma-glycidoxypropyltrimethoxysilane and gamma- (methacryloyloxy) propyltrimethoxysilane.
Preferably, the mass ratio of the plate-like silver powder to the spherical silver powder is 3: 1.
Preferably, the aminated graphene oxide is prepared by the following steps: dispersing graphene oxide in deionized water to prepare a graphene oxide colloidal suspension; according to the formula (6-8 g): dissolving an amine compound into absolute ethyl alcohol according to the proportion of 100mL, and stirring until the amine compound is fully dissolved to obtain a dissolved solution; and adding the dissolved solution into the graphene oxide colloidal suspension, uniformly stirring to obtain an aminated graphene oxide dispersion solution, and carrying out vacuum filtration, washing and freeze drying on the aminated graphene oxide dispersion solution to obtain the aminated graphene oxide.
Preferably, the amine compound is diethyltoluenediamine, dodecylamine or diethylenetriamine.
Another object of the present invention is to provide a method for preparing an electronic adhesive for graphene-based semiconductor chip packaging, comprising the following steps:
(1) and weighing the epoxy resin, the reaction diluent, the curing agent, the accelerator, the coupling agent, the aminated graphene oxide and the compound silver powder according to the proportion for later use.
(2) Adding the epoxy resin and the reaction diluent into a double-planetary power mixing stirrer, stirring uniformly, then sequentially adding the curing agent, the accelerator, the coupling agent, the aminated graphene oxide and the one-dimensional carbon nano tube, stirring, adding the compound silver powder after stirring uniformly, and stirring.
(3) And (3) rolling the uniformly stirred materials by a ceramic three-roller machine, defoaming by a defoaming machine, discharging, and refrigerating at low temperature after discharging.
Preferably, the stirring in the step (2) is specifically: the rotation speed is 500-1000 rpm, and the revolution speed is 10-20 rpm.
Preferably, the uniformly stirred material in the step (3) is rolled by a ceramic three-roller machine, and the specific process parameters are as follows: 30/20 and 20/10 (gap, mum) are sequentially carried out for 3 times respectively, and the speed is 150-300 r/s.
Compared with the prior art, the invention has the advantages that:
(1) according to the invention, the aminated graphene oxide is adopted, so that the thermal stability and the mechanical property of the graphene oxide are further improved, the physical and chemical properties of the graphene material can be fully exerted, and the crosslinking degree of the cured resin is not influenced; the aminated graphene oxide not only improves the heat conductivity and the electric conductivity of the adhesive, but also further improves the bonding force.
(2) According to the invention, aminated graphene oxide, one-dimensional carbon nanotubes and compound silver powder are added, and are uniformly stirred by a planetary stirrer and then are rolled for multiple times by a three-roller machine, so that the graphene oxide/carbon nanotubes/conductive metal particles form a uniform spatial structure of surface/line/point, and the graphene oxide/carbon nanotubes/conductive metal particles have excellent volume resistivity and thermal conductivity.
(3) The invention adopts dicyandiamide curing agent and imidazole curing agent which are double-component curing agents, greatly improves the curing rate and reduces the curing time.
(4) The invention adopts the mixture of the flake silver powder and the spherical silver powder, and the spherical silver powder can effectively fill the gaps among the flake silver powder, so that the silver powder is more closely connected, thereby ensuring the conductivity of the adhesive.
Detailed Description
The present invention will be described in further detail with reference to examples.
Example 1
An electronic adhesive for packaging a graphene-based semiconductor chip comprises the following raw materials in parts by weight:
bisphenol A epoxy resin E5115 parts
7 parts of 1, 4-butanediol diglycidyl ether
6 parts of two-component curing agent
1 part of 2,4, 6-tris (dimethylaminomethyl) phenol
1 part of gamma-glycidyl ether oxypropyltrimethoxysilane
Aminated graphene oxide 2 parts
1 part of one-dimensional carbon nano tube
66 parts of compound silver powder
Wherein the bi-component curing agent is dicyandiamide and imidazole curing agent with the mass ratio of 1.1: 1; the compound silver powder is a mixture of flake silver powder with the average grain diameter of 1 mu m and spherical silver powder with the average grain diameter of 0.05 mu m, and the mass ratio of the flake silver powder to the spherical silver powder is 3: 1.
The aminated graphene oxide is prepared by the following steps: dispersing 3g of graphene oxide in 100mL of deionized water to prepare a graphene oxide colloidal suspension; according to the weight ratio of 6 g: dissolving diethyl toluenediamine into absolute ethyl alcohol according to the proportion of 100mL, and stirring until the diethyl toluenediamine is fully dissolved to obtain a dissolved solution; and adding the dissolved solution into the graphene oxide colloidal suspension, uniformly stirring to obtain an aminated graphene oxide dispersion solution, and carrying out vacuum filtration, washing and freeze drying on the aminated graphene oxide dispersion solution to obtain the aminated graphene oxide.
A preparation method of an electronic adhesive for packaging a graphene-based semiconductor chip comprises the following steps:
(1) and weighing the epoxy resin, the reaction diluent, the curing agent, the accelerator, the coupling agent, the aminated graphene oxide and the compound silver powder according to the proportion for later use.
(2) Adding epoxy resin and a reaction diluent into a double-planetary power mixing stirrer for stirring, sequentially adding a curing agent, an accelerator, a coupling agent, aminated graphene oxide and a one-dimensional carbon nano tube after uniformly stirring, adding compound silver powder after uniformly stirring for stirring, wherein the stirring is as follows: the rotation speed is 1000 rpm, and the revolution speed is 20 rpm.
(3) And rolling the uniformly stirred materials by a ceramic three-roller machine sequentially (30/20 and 20/10 (gap, mu m) are carried out for 3 times respectively at the speed of 250 revolutions per second), discharging the materials after defoaming by a defoaming machine, and refrigerating the materials at low temperature after discharging.
Example 2
An electronic adhesive for packaging a graphene-based semiconductor chip comprises the following raw materials in parts by weight:
bisphenol F type epoxy resin NPEF-17025 parts
6.5 parts of 1, 6-hexanediol glycidyl ether
6 parts of two-component curing agent
1.5 parts of 2,4, 6-tris (dimethylaminomethyl) phenol
1 part of gamma- (methacryloyloxy) propyl trimethoxy silane
Aminated graphene oxide 2 parts
1 part of one-dimensional carbon nano tube
67 parts of compound silver powder
Wherein the bi-component curing agent is a mixture of dicyandiamide and imidazole curing agent in a mass ratio of 2: 1; the compound silver powder is a mixture of flake silver powder with the average grain diameter of 2 mu m and spherical silver powder with the average grain diameter of 0.08 mu m, and the mass ratio of the flake silver powder to the spherical silver powder is 3: 1.
Preferably, the aminated graphene oxide is prepared by the following steps: dispersing 3g of graphene oxide in 100mL of deionized water to prepare a graphene oxide colloidal suspension; according to the weight ratio of 6 g: dissolving diethylenetriamine into absolute ethyl alcohol at a ratio of 100mL, and stirring until the diethylenetriamine is fully dissolved to obtain a dissolved solution; and adding the dissolved solution into the graphene oxide colloidal suspension, uniformly stirring to obtain an aminated graphene oxide dispersion solution, and carrying out vacuum filtration, washing and freeze drying on the aminated graphene oxide dispersion solution to obtain the aminated graphene oxide.
A preparation method of an electronic adhesive for packaging a graphene-based semiconductor chip comprises the following steps:
(1) and weighing the epoxy resin, the reaction diluent, the curing agent, the accelerator, the coupling agent, the aminated graphene oxide and the compound silver powder according to the proportion for later use.
(2) Adding epoxy resin and a reaction diluent into a double-planetary power mixing stirrer for stirring, sequentially adding a curing agent, an accelerator, a coupling agent, aminated graphene oxide and a one-dimensional carbon nano tube after uniformly stirring, adding compound silver powder after uniformly stirring for stirring, wherein the stirring is as follows: the rotation speed is 800 revolutions per minute, and the revolution speed is 18 revolutions per minute.
(3) And rolling the uniformly stirred materials by a ceramic three-roller machine sequentially (30/20 and 20/10 (gap, mu m) are carried out for 3 times respectively at the speed of 250 revolutions per second), discharging the materials after defoaming by a defoaming machine, and refrigerating the materials at low temperature after discharging.
Example 3
An electronic adhesive for packaging a graphene-based semiconductor chip comprises the following raw materials in parts by weight:
bisphenol A epoxy resin E5110 parts
Allyl glycidyl ether 6 parts
Two-component curing agent 5 parts
1.5 parts of 2,4, 6-tris (dimethylaminomethyl) phenol
1 part of gamma- (methacryloyloxy) propyl trimethoxy silane
1.5 parts of aminated graphene oxide
1 part of one-dimensional carbon nano tube
74 portions of compound silver powder
Wherein the bi-component curing agent is a mixture of dicyandiamide curing agent and imidazole curing agent in a mass ratio of 3: 1; the compound silver powder is a mixture of flake silver powder with the average grain diameter of 2 mu m and spherical silver powder with the average grain diameter of 0.01 mu m, and the mass ratio of the flake silver powder to the spherical silver powder is 3: 1.
Preferably, the aminated graphene oxide is prepared by the following steps: dispersing 3g of graphene oxide in 100mL of deionized water to prepare a graphene oxide colloidal suspension; according to the weight ratio of 6 g: dissolving dodecylamine into absolute ethyl alcohol according to the proportion of 100mL, and stirring until the dodecylamine is fully dissolved to obtain a dissolved solution; and adding the dissolved solution into the graphene oxide colloidal suspension, uniformly stirring to obtain an aminated graphene oxide dispersion solution, and carrying out vacuum filtration, washing and freeze drying on the aminated graphene oxide dispersion solution to obtain the aminated graphene oxide.
A preparation method of an electronic adhesive for packaging a graphene-based semiconductor chip comprises the following steps:
(1) and weighing the epoxy resin, the reaction diluent, the curing agent, the accelerator, the coupling agent, the aminated graphene oxide and the compound silver powder according to the proportion for later use.
(2) Adding epoxy resin and a reaction diluent into a double-planetary power mixing stirrer for stirring, sequentially adding a curing agent, an accelerator, a coupling agent, aminated graphene oxide and a one-dimensional carbon nano tube after uniformly stirring, adding compound silver powder after uniformly stirring for stirring, wherein the stirring is as follows: the rotation speed is 1000 rpm, and the revolution speed is 18 rpm.
(3) And rolling the uniformly stirred materials by a ceramic three-roller machine sequentially (30/20 and 20/10 (gap and mu m) for 3 times respectively at the speed of 300 revolutions per second), defoaming by a defoaming machine, discharging, and refrigerating at low temperature after discharging.
Comparative example 1
The only difference from example 1 is: no aminated graphene oxide was added.
Comparative example 2
The only difference from example 1 is: adding graphene oxide, namely, the graphene oxide is not modified.
Comparative example 3
The only difference from example 1 is: no one-dimensional carbon nanotubes are added.
Comparative example 4
The only difference from example 1 is: the mass ratio of dicyandiamide to imidazole curing agent is 0.8: 1.
The specific performance parameters of the adhesives of the examples and the comparative examples are shown in table 1, and the specific test methods are as follows:
(1) volume resistivity: and uniformly coating the prepared sample between two glass sheets on the organic glass plate wiped by absolute ethyl alcohol, and testing by adopting a four-electrode resistance testing method after curing.
(2) And (3) measuring the heat conductivity coefficient: a TPS 2500S type thermal conductivity coefficient tester of Hotdisk, Sweden is used, 200ml of test samples are placed in a 250ml glass beaker in a standard environment at 25 ℃, a test probe is placed in the samples, and the data are read after being stabilized.
(3) Peel strength (post cure test): tested with reference to GB/T2791-.
TABLE 1 Performance parameters Table for electronic Adhesives
In addition to the above embodiments, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the scope of the claims of the present invention.
Claims (10)
1. An electronic adhesive for packaging a graphene-based semiconductor chip is characterized in that: the composite material comprises the following raw materials in parts by weight:
10-25 parts of epoxy resin
2-8 parts of reaction diluent
3-8 parts of bi-component curing agent
1-2 parts of accelerator
0.5-1 part of coupling agent
1-3 parts of aminated graphene oxide
0.5 to 1.5 parts of one-dimensional carbon nano tube
50-80 parts of compound silver powder
Wherein the bi-component curing agent is a mixture of dicyandiamide curing agent and imidazole curing agent; the compound silver powder is a mixture of flake silver powder and spherical silver powder.
2. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the epoxy resin is one or two of bisphenol A type epoxy resin and bisphenol F type epoxy resin.
3. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the reaction diluent is at least one of allyl glycidyl ether, butyl glycidyl ether, 1, 4-butanediol diglycidyl ether and 1, 6-hexanediol glycidyl ether.
4. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the mass ratio of the dicyandiamide curing agent to the imidazole curing agent is 3: 1-1.1: 1.
5. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the accelerant is at least one of 2,4, 6-tri (dimethylaminomethyl) phenol and aminoethyl piperazine.
6. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the coupling agent is at least one of gamma-glycidoxypropyltrimethoxysilane and gamma- (methacryloyloxy) propyltrimethoxysilane.
7. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the average particle diameter of the flake silver powder is 1.1-10 μm, and the average particle diameter of the spherical silver powder is 0.01-1 μm; the mass ratio of the flaky silver powder to the spherical silver powder is 3: 1.
8. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 1, wherein: the aminated graphene oxide is prepared by the following steps: dispersing graphene oxide in deionized water to prepare a graphene oxide colloidal suspension; according to the formula (6-8 g): dissolving an amine compound into absolute ethyl alcohol according to the proportion of 100mL, and stirring until the amine compound is fully dissolved to obtain a dissolved solution; and adding the dissolved solution into the graphene oxide colloidal suspension, uniformly stirring to obtain an aminated graphene oxide dispersion solution, and carrying out vacuum filtration, washing and freeze drying on the aminated graphene oxide dispersion solution to obtain the aminated graphene oxide.
9. The electronic adhesive for graphene-based semiconductor chip packaging according to claim 8, wherein: the amine compound is diethyl toluene diamine, dodecyl amine or diethylene triamine.
10. A preparation method of an electronic adhesive for packaging a graphene-based semiconductor chip is characterized by comprising the following steps: the method comprises the following steps:
(1) weighing epoxy resin, a reaction diluent, a curing agent, an accelerator, a coupling agent, aminated graphene oxide and compound silver powder according to the proportion in claim 1 for later use;
(2) adding epoxy resin and a reaction diluent into a double-planetary power mixing stirrer for stirring, sequentially adding a curing agent, an accelerator, a coupling agent, aminated graphene oxide and a one-dimensional carbon nano tube for stirring after uniformly stirring, and adding compound silver powder for stirring after uniformly stirring;
(3) and (3) rolling the uniformly stirred materials by a ceramic three-roller machine, defoaming by a defoaming machine, discharging, and refrigerating at low temperature after discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110243827.5A CN113004829A (en) | 2021-03-05 | 2021-03-05 | Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110243827.5A CN113004829A (en) | 2021-03-05 | 2021-03-05 | Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113004829A true CN113004829A (en) | 2021-06-22 |
Family
ID=76406351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110243827.5A Pending CN113004829A (en) | 2021-03-05 | 2021-03-05 | Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113004829A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114181653A (en) * | 2022-01-13 | 2022-03-15 | 北京理工大学 | MXenes modified conductive adhesive and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108276929A (en) * | 2018-01-15 | 2018-07-13 | 安徽工业大学 | A kind of selfreparing epoxy elargol containing graphene |
| CN109468102A (en) * | 2018-11-10 | 2019-03-15 | 刘鹏 | One kind is based on polyaniline-modified nano-silver thread bi-component epoxide-resin high-effective conductive glue and preparation method thereof |
| WO2019108732A1 (en) * | 2017-12-01 | 2019-06-06 | The Regents Of The University Of California | Methods for conductive adhesives based on graphene and applications thereof |
| CN111423834A (en) * | 2020-04-01 | 2020-07-17 | 徐文忠 | Preparation method of sintered graphene/nano-silver composite conductive adhesive |
-
2021
- 2021-03-05 CN CN202110243827.5A patent/CN113004829A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019108732A1 (en) * | 2017-12-01 | 2019-06-06 | The Regents Of The University Of California | Methods for conductive adhesives based on graphene and applications thereof |
| CN108276929A (en) * | 2018-01-15 | 2018-07-13 | 安徽工业大学 | A kind of selfreparing epoxy elargol containing graphene |
| CN109468102A (en) * | 2018-11-10 | 2019-03-15 | 刘鹏 | One kind is based on polyaniline-modified nano-silver thread bi-component epoxide-resin high-effective conductive glue and preparation method thereof |
| CN111423834A (en) * | 2020-04-01 | 2020-07-17 | 徐文忠 | Preparation method of sintered graphene/nano-silver composite conductive adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114181653A (en) * | 2022-01-13 | 2022-03-15 | 北京理工大学 | MXenes modified conductive adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102010685B (en) | Epoxy resin conductive adhesive and preparation method thereof | |
| CN102102001B (en) | High thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof | |
| CN110343484B (en) | Anisotropic conductive adhesive based on particle matrix coated with liquid metal and preparation method | |
| CN106753143A (en) | A kind of low-temperature setting underfill with heat conduction function and preparation method thereof | |
| CN107418204B (en) | Preparation method of graphene @ calcium copper titanate-polybenzoxazole three-phase composite film | |
| CN113808779B (en) | Low-temperature curing insulating medium slurry for chip resistor | |
| CN111548765A (en) | Organosilicon system conductive adhesive and preparation method thereof | |
| CN112662354A (en) | Silicon dioxide filler, preparation method thereof and epoxy resin composite material | |
| CN102191003A (en) | Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof | |
| CN113372844A (en) | High-temperature-resistant epoxy resin conductive adhesive and preparation method thereof | |
| CN114456736B (en) | Modified silver-coated copper conductive powder epoxy conductive adhesive and preparation method thereof | |
| CN115368607B (en) | Polyether sulfone-based composite dielectric film material and preparation method thereof | |
| CN113004830B (en) | Weather-resistant high-thermal-conductivity graphene-based epoxy resin adhesive and preparation method thereof | |
| CN107118724B (en) | High-toughness, high-strength and superconducting thermionic pouring sealant and preparation method thereof | |
| CN113004829A (en) | Electronic adhesive for packaging graphene-based semiconductor chip and preparation method thereof | |
| WO2021142752A1 (en) | Organic silicon resin conductive adhesive, and preparation method therefor and application thereof | |
| CN111303813B (en) | Room temperature curing pouring sealant for precise electronic components and use method thereof | |
| CN112457808A (en) | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method | |
| CN102040934A (en) | Silver conductive adhesive and preparation method thereof | |
| CN114283962B (en) | Silver plating microsphere-based conductive silver paste and preparation method thereof | |
| CN113831878B (en) | Epoxy resin composition and application thereof | |
| CN103756253B (en) | Low dielectric constant hollow carbon sphere/epoxy resin composite material and preparation method thereof | |
| CN111334044B (en) | Organic silicone gel for precise electronic component encapsulation and use method thereof | |
| CN113667435A (en) | Low dielectric epoxy underfill | |
| CN115558448A (en) | Epoxy heat-conducting structural adhesive and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210622 |
|
| RJ01 | Rejection of invention patent application after publication |