CN112996349B - Lightweight thermal control device of high-power-consumption transmitter - Google Patents

Lightweight thermal control device of high-power-consumption transmitter Download PDF

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Publication number
CN112996349B
CN112996349B CN202110156193.XA CN202110156193A CN112996349B CN 112996349 B CN112996349 B CN 112996349B CN 202110156193 A CN202110156193 A CN 202110156193A CN 112996349 B CN112996349 B CN 112996349B
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China
Prior art keywords
power
light
weight
transmitter
consumption transmitter
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CN202110156193.XA
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CN112996349A (en
Inventor
赵吉喆
顾燕萍
周砚耕
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Shanghai Institute of Satellite Engineering
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Shanghai Institute of Satellite Engineering
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
    • B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
    • B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
    • B64G1/506—Heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20381—Thermal management, e.g. evaporation control

Abstract

The invention provides a light thermal control device of a high-power-consumption transmitter, which comprises: the light-weight embedded heat pipe comprises a light-weight OSR, a light-weight embedded heat pipe, a high-power transmitter A-TWT, a high-power transmitter B-EPC, a low-temperature thermal compensation heater, a structure mounting plate and a light-weight adhesive, wherein the light-weight embedded heat pipe is embedded in the structure mounting plate, the high-power transmitter A-TWT, the high-power transmitter A-EPC, the high-power transmitter B-TWT and the high-power transmitter B-EPC are mounted on the structure mounting plate, the low-temperature thermal compensation heater is adhered to the structure mounting plate in the area where the light-weight embedded heat pipe is located, and the light-weight OSR is adhered to the surface of the structure mounting plate through the light-weight adhesive. The weight of the heat spreading plate and the transmitter mounting plate is saved; the waste heat emission efficiency of the high-power-consumption transmitter is improved; the weight of the radiation coating on the surface of the structure mounting plate is reduced; the thermal control weight of the high-power-consumption transmitter is reduced.

Description

Lightweight thermal control device of high-power-consumption transmitter
Technical Field
The invention relates to a satellite thermal control device, in particular to a light thermal control device of a high-power-consumption transmitter.
Background
With the increase of the search radius, the orbital height of the satellite is higher and higher, and the weight of the satellite is more and more strictly required from solar synchronization, geosynchronous to moon, mars and the like. On the other hand, along with the complication of the satellite function, the power consumption of a single machine is larger and larger, the generated waste heat is more and more, the heat consumption of a transmitter is increased to over one hundred watts from dozens of watts, and 5-10 Kg weight resources are required to be consumed by adopting the traditional heat control mode of a heat diffusion plate heating pipe. And the temperature requirements of the transmitter TWT and the EPC are different, and the method of simultaneously mounting the transmitter TWT and the EPC on a mounting baseplate of the transmitter and then carrying out thermal control reduces the heat dissipation efficiency and increases the risk of high-temperature failure of the EPC. The application of the integrated soaking plate in the thermal design of the traveling wave tube amplifier is researched in the vacuum electronic technology, and the article is not suitable for space flight tests by adopting a ground thermal control technology and radiating a high-power-consumption transmitter through convection. And the thermal control device is heavy because the ground thermal design weight resource is not limited.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a light thermal control device of a high-power-consumption transmitter.
According to the present invention, there is provided a light thermal control device for a high power consumption transmitter, comprising: the light-weight embedded heat pipe comprises a light-weight OSR, a light-weight embedded heat pipe, a high-power transmitter A-TWT, a high-power transmitter B-EPC, a low-temperature thermal compensation heater, a structural mounting plate and a light-weight adhesive, wherein the light-weight embedded heat pipe is embedded in the structural mounting plate, the high-power transmitter A-TWT, the high-power transmitter A-EPC, the high-power transmitter B-TWT and the high-power transmitter B-EPC are mounted on the structural mounting plate in the area where the light-weight embedded heat pipe is located, the low-temperature thermal compensation heater is adhered to the structural mounting plate in the area where the light-weight embedded heat pipe is located, and the light-weight OSR is adhered to the surface of the structural mounting plate through the light-weight adhesive.
Preferably, the lightweight embedded heat pipe has a first side fin and a second side fin, and the second side fin is cut off by the lightweight embedded heat pipe.
Preferably, the first side fin outer surface is adhered to the single machine mounting side of the structural mounting plate.
Preferably, there are two lightweight embedded heat pipes.
Preferably, the high-power-consumption transmitter A-TWT and the high-power-consumption transmitter B-TWT are installed on the same light-weight embedded heat pipe, the high-power-consumption transmitter A-EPC and the high-power-consumption transmitter B-EPC are installed on the other light-weight embedded heat pipe, a certain temperature difference is established between the high-power-consumption transmitter A-EPC and the light-weight embedded heat pipe, and the characteristic that the TWT is resistant to higher temperature is utilized, so that the heat dissipation efficiency of the thermal control device is improved, and the weight of the thermal control device is reduced.
Preferably, the lightweight embedded heat pipe is designed into a U shape or an S shape, so that the heat is rapidly diffused, meanwhile, a heat exchange path is increased, and the heat dissipation efficiency is improved.
Preferably, the light-weight embedded heat pipe is an omega-shaped heat pipe with the diameter of 10mm multiplied by 50 mm.
Preferably, mounting boards of the high-power-consumption transmitter A-TWT, the high-power-consumption transmitter A-EPC, the high-power-consumption transmitter B-TWT and the high-power-consumption transmitter B-EPC are eliminated, and the components of the high-power-consumption transmitter A-TWT, the high-power-consumption transmitter A-EPC, the high-power-consumption transmitter B-TWT and the high-power-consumption transmitter B-EPC are directly mounted on a satellite cabin board.
Compared with the prior art, the invention has the following beneficial effects:
1. the weight of the heat spreading plate and the transmitter mounting plate is saved.
2. The waste heat emission efficiency of the high-power-consumption transmitter is improved.
3. The weight of the radiation coating on the surface of the structural mounting plate is reduced.
4. The thermal control weight of a high-power-consumption transmitter is reduced
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural diagram of a lightweight thermal control device of a high power consumption transmitter;
fig. 2 is a schematic cross-sectional view of a lightweight embedded heat pipe.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1, a light-weight thermal control device of a high-power-consumption transmitter includes: the light-weight embedded heat pipe comprises light-weight OSR1, a light-weight embedded heat pipe 2, a high-power-consumption transmitter A-TWT3, a high-power-consumption transmitter A-EPC4, a high-power-consumption transmitter B-TWT5, a high-power-consumption transmitter B-EPC6, a low-temperature thermal compensation heater 7, a structure mounting plate 8 and a light-weight adhesive 9, wherein the light-weight embedded heat pipe 2 is embedded in the structure mounting plate 8, the high-power-consumption transmitter A-TWT3, the high-power-consumption transmitter A-EPC4, the high-power-consumption transmitter B-TWT5 and the high-power-consumption transmitter B-EPC6 are installed on the structure mounting plate 8 in the area where the light-weight embedded heat pipe 2 is located, the low-temperature thermal compensation heater 7 is pasted on the structure mounting plate 8 in the area where the light-weight embedded heat pipe 2 is located, and the light-weight OSR1 is pasted on the surface of the structure mounting plate 8 through the light-weight adhesive 9.
The TWT and the EPC are installed in the areas of the structural installation plates 8 corresponding to the different lightweight embedded heat pipes 2, the lightweight embedded heat pipes 2 with the same width as the TWT are embedded below the TWT installation surface and bent into a U shape or an S shape, heat is rapidly diffused, meanwhile, heat exchange paths are increased, and heat dissipation efficiency is improved. Through good contact of the lightweight embedded heat pipe 2 and the TWT and EPC components, waste heat is rapidly diffused to the lightweight embedded heat pipe 2, and the waste heat is radiated to a space heat sink through the structural mounting plate 8 through heat exchange between the lightweight embedded heat pipe 2 and the structural mounting plate 8; the temperature of the corresponding radiating surface is improved by utilizing the characteristic that the TWT is resistant to higher temperature, so that the radiating efficiency is improved, and the weight of the thermal control device is reduced; the temperature difference between the TWT and the EPC is established by utilizing the characteristic of poor heat conduction of the honeycomb plate, and the temperature of the EPC is reduced. The light weight OSR1 and the light weight adhesive 9 are adopted, the second fin 10 of the light weight embedded heat pipe 2 is cut, and the weight of the thermal control device is reduced.
As shown in fig. 2, the lightweight embedded heat pipe 2 has a first side fin and a second side fin 10, and the second side fin 10 is cut off from the lightweight embedded heat pipe 2; the outer surface of the first side fin is stuck with the single machine installation side of the structure installation plate 8.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims (6)

1. A lightweight thermal control device for a high power consumption transmitter, comprising: the system comprises a light OSR (1), a light-weight embedded heat pipe (2), a high-power-consumption transmitter A-TWT (3), a high-power-consumption transmitter A-EPC (4), a high-power-consumption transmitter B-TWT (5), a high-power-consumption transmitter B-EPC (6), a low-temperature thermal compensation heater (7), a structure mounting plate (8) and a light-weight adhesive (9);
the lightweight embedded heat pipe (2) is embedded in the structure mounting plate (8), the high-power-consumption transmitter A-TWT (3), the high-power-consumption transmitter A-EPC (4), the high-power-consumption transmitter B-TWT (5) and the high-power-consumption transmitter B-EPC (6) are mounted on the structure mounting plate (8) in the area where the lightweight embedded heat pipe (2) is located, the low-temperature thermal compensation heater (7) is pasted on the structure mounting plate (8) in the area where the lightweight embedded heat pipe (2) is located, and the light OSR (1) is pasted on the surface of the structure mounting plate (8) through the lightweight adhesive (9);
the number of the lightweight embedded heat pipes (2) is two;
the high-power-consumption transmitter A-TWT (3) and the high-power-consumption transmitter B-TWT (5) are installed on the same light-weight embedded heat pipe (2), and the high-power-consumption transmitter A-EPC (4) and the high-power-consumption transmitter B-EPC (6) are installed on the other light-weight embedded heat pipe (2).
2. The light-weight thermal control device of the high-power-consumption transmitter according to claim 1, wherein: the lightweight embedded heat pipe (2) is provided with a first side fin and a second side fin (10), and the second side fin (10) is cut off from the lightweight embedded heat pipe (2).
3. The light-weight thermal control device of the high-power-consumption transmitter according to claim 2, wherein: the outer surface of the first side fin is pasted with the single machine installation side of the structure installation plate (8).
4. The light-weight thermal control device of the high-power-consumption transmitter according to claim 1, wherein: the lightweight embedded heat pipe (2) is designed into a U shape or an S shape.
5. The light-weight thermal control device of the high-power-consumption transmitter according to claim 1, wherein: the light-weight embedded heat pipe (2) is an omega-shaped heat pipe with the diameter of 10mm multiplied by 50 mm.
6. The light-weight thermal control device of the high-power-consumption transmitter according to claim 1, wherein: mounting plates of the high-power-consumption transmitter A-TWT (3), the high-power-consumption transmitter A-EPC (4), the high-power-consumption transmitter B-TWT (5) and the high-power-consumption transmitter B-EPC (6) are eliminated, and the components of the high-power-consumption transmitter A-TWT (3), the high-power-consumption transmitter A-EPC (4), the high-power-consumption transmitter B-TWT (5) and the high-power-consumption transmitter B-EPC (6) are directly mounted on a satellite deck.
CN202110156193.XA 2021-02-04 2021-02-04 Lightweight thermal control device of high-power-consumption transmitter Active CN112996349B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011120995A1 (en) * 2010-03-30 2011-10-06 Astrium Sas Device for thermally controlling an electron tube having a radiating collector, comprising a screen, a fluid loop and a high-temperature radiator

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CN102611396A (en) * 2011-12-22 2012-07-25 中国科学院空间科学与应用研究中心 Microwave solid-state power amplifier
CN102751153B (en) * 2012-06-18 2015-05-06 上海卫星工程研究所 Interchangeability design method for domestic satellite-mounted travelling-wave tube amplifier and imported satellite-mounted travelling-wave tube amplifier
EP3109171B1 (en) * 2015-06-24 2021-04-21 Airbus Defence and Space GmbH Modular satellite device support panel
US10332820B2 (en) * 2017-03-20 2019-06-25 Akash Systems, Inc. Satellite communication transmitter with improved thermal management
CN108791959B (en) * 2018-06-15 2020-11-24 上海卫星工程研究所 Star sensor lightweight thermal control device based on structure mounting plate
CN112034873B (en) * 2020-09-02 2024-04-30 中国科学院微小卫星创新研究院 MEO navigation satellite thermal control system

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
WO2011120995A1 (en) * 2010-03-30 2011-10-06 Astrium Sas Device for thermally controlling an electron tube having a radiating collector, comprising a screen, a fluid loop and a high-temperature radiator

Non-Patent Citations (1)

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Title
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