CN112995378B

CN112995378B - Loudspeaker module and electronic equipment

Info

Publication number: CN112995378B
Application number: CN202110234531.7A
Authority: CN
Inventors: 李运海; 刘宇; 刘金华; 王传果
Original assignee: Beijing Honor Device Co Ltd
Current assignee: Beijing Honor Device Co Ltd
Priority date: 2021-02-09
Filing date: 2021-03-03
Publication date: 2022-09-02
Anticipated expiration: 2041-03-03
Also published as: CN112995378A

Abstract

The application provides a speaker module and electronic equipment relates to electronic equipment technical field, can promote the low frequency loudness under the prerequisite that does not increase the back cavity volume. The loudspeaker module comprises a shell, an inner core and a sound absorption structure; the housing comprises a first housing portion and a second housing portion; the thickness of the first housing portion is greater than the thickness of the second housing portion; the first shell part is provided with a first wall plate and a second wall plate which are arranged along the thickness direction of the loudspeaker module and are arranged oppositely; the second shell part encloses a second cavity; the inner core is arranged in the first cavity, and a front cavity is formed between the inner core and the first wall plate; a part of rear cavity is formed between the inner core and the second wall plate and communicated with the second cavity to form a rear cavity; the sound absorbing structure is filled in part of the rear cavity, and the second cavity is filled with air. The speaker module that this application embodiment provided is applied to electronic equipment.

Description

Loudspeaker module and electronic equipment

The present application claims priority of the chinese patent application entitled "a speaker module and an electronic device" filed by the national intellectual property office on 09.02/2021 under the application number 202110178643.5, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a loudspeaker module and electronic equipment with the loudspeaker module.

Background

The loudspeaker module is used for restoring audio electric signals such as music and voice into sound and can support the function of audio amplification, so that the loudspeaker module is more and more widely applied to electronic equipment such as mobile phones, tablet computers and notebook computers.

Along with the development of electronic equipment such as cell-phones, panel computer, people have had higher demand to the audio frequency experience of speaker module. Higher low frequency loudness can lead to better audio experience. The key factor affecting the low-frequency loudness of the speaker module is the size of the back cavity, and the larger the volume of the back cavity is, the higher the low-frequency loudness is. However, with the trend of thinning and miniaturization of electronic devices, the volume of the rear cavity is limited, which results in that the audio experience of the speaker module is difficult to be improved.

Disclosure of Invention

The embodiment of the application provides a speaker module and electronic equipment, can promote the low frequency loudness of speaker module under the prerequisite that does not increase the back cavity volume.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, some embodiments of the present application provide a loudspeaker module comprising a housing, an inner core, and a sound absorbing structure.

Wherein the housing comprises a first housing part and a second housing part arranged side by side and fixed together. The thickness of the first housing portion in the thickness direction of the speaker module is larger than the thickness of the second housing portion in the thickness direction of the speaker module. The first housing portion encloses a first cavity. The first housing portion has a first wall plate and a second wall plate arranged in the thickness direction of the speaker module and opposed to each other. The second housing portion encloses a second cavity.

In addition, the inner core is arranged in the first cavity, the inner core and the first wall plate are stacked, and a front cavity is formed between the inner core and the first wall plate. The inner core and the second wall plate are stacked, and a part of rear cavity is formed between the inner core and the second wall plate. The part of the rear cavity is communicated with the second cavity to form a rear cavity.

Furthermore, the sound-absorbing structure is filled in part of the rear cavity, and the second cavity is filled with air.

In this application embodiment, because inhale the sound structure and fill in cavity behind the part, and the second cavity is filled by the air, consequently, inhale the sound structure and do not get into constrictive second cavity, consequently can not cause the jam, whole second cavity homoenergetic can be effectively utilized. Therefore, the equivalent rear cavity of the loudspeaker module is large, and the low-frequency loudness of the loudspeaker module can be improved.

In a possible implementation manner of the first aspect, the sound-absorbing structure includes a plurality of sound-absorbing particles, and the speaker module further includes a first screen. The first screen includes, but is not limited to, gauze and metal mesh. The first net that separates sets up in the position that is close to the second cavity in the partial back cavity, and a plurality of sound particles of inhaling are filled in the first partial back cavity of keeping away from the second cavity that separates the net, and the first net that separates is used for preventing a plurality of sound particles of inhaling from getting into the second cavity. The sound absorbing structure is low in cost and can reduce the cost of the loudspeaker module.

In one possible implementation of the first aspect, the first housing part is provided with a filling opening. The shape of the filling opening includes, but is not limited to, circular, square, polygonal, and the like. The filling opening is communicated with part of the rear cavity. The sound-absorbing particles can be filled into part of the rear cavity through the filling opening. The filling opening is provided with a cover body, and the cover body is used for sealing the filling opening. In particular, the cover body can be covered on the edge of the first shell body part at the filling opening by gluing or the like.

In one possible implementation manner of the first aspect, the material of the sound absorbing particles is at least one of melamine, zeolite, glass fiber, and activated carbon.

In one possible implementation manner of the first aspect, the speaker module further includes a second mesh. The second screen includes, but is not limited to, gauze and metal mesh. The second separation net is positioned in part of the rear cavity, the second separation net covers the part, positioned in part of the rear cavity, of the inner core, and the sound absorption particles are filled in one side, far away from the inner core, of the second separation net. The second separation net is used for preventing sound absorption particles from entering the inner core, so that interference of the second separation net on the movement of the driving device and the vibrating diaphragm in the inner core is avoided.

In one possible implementation manner of the first aspect, the second housing portion has a third wall plate and a fourth wall plate which are arranged in the thickness direction of the speaker module and are arranged opposite to each other. The outer surface of the third wall panel is oriented in the same direction as the outer surface of the first wall panel. The outer face of the fourth panel is oriented in the same direction as the outer face of the second panel. The second wall panel is disposed coplanar with the fourth wall panel. The first wall panel and the third wall panel are located on the same side of the plane in which the second wall panel or the fourth wall panel is located. When being applied to the electronic equipment with the speaker module in, the third wallboard is towards the fingerprint identification module, and the first space of dodging can form the fingerprint identification module and dodge. Meanwhile, the second wall plate and the fourth wall plate are arranged in a coplanar manner, so that under the condition that the thickness of the second wall plate is consistent with that of the fourth wall plate, the outer surface of the second wall plate and the outer surface of the fourth wall plate are arranged in a coplanar manner, the loudspeaker module can be tightly attached to the surface, facing the screen, of the rear cover, and the structural compactness of the electronic equipment is guaranteed.

In one possible implementation of the first aspect, the first housing portion further comprises a first side frame. The first side frame is arranged between the first wall plate and the second wall plate, and the first side frame is arranged around the edges of the first wall plate and the second wall plate in a circle. The sound outlet channel is arranged on the first side frame. The second housing portion also includes a second side frame. The second side frame is arranged between the third wall plate and the fourth wall plate and arranged around the edges of the third wall plate and the fourth wall plate. The first wall plate, the third wall plate, the first side frame and the second side frame are integrally formed into a front shell. The second wall plate and the fourth wall plate are integrally formed into a rear shell. Like this, the casing is formed by two integral type structures of preceding shell and backshell assembly, can compromise assembly efficiency and assembly degree of difficulty simultaneously.

In a possible implementation manner of the first aspect, each of the front shell and the rear shell includes a metal middle plate and a plastic frame disposed at an edge of the metal middle plate. Specifically, the material of the metal middle plate includes, but is not limited to, stainless steel, aluminum alloy, magnesium aluminum alloy, and the like. The hardness of the metal is larger, so that the thickness of the middle areas of the front shell and the rear shell is reduced, and the heights of the first cavity and the second cavity are increased. Meanwhile, the plastic frame of the front shell can be directly pressed together with the plastic frame of the rear shell through an ultrasonic welding process, so that glue materials or other consumable materials used for connection are avoided. The metal middle plate and the plastic frame may be fixed together by gluing, clamping, screwing, in-mold Injection (IMD), and the like, which is not limited herein. In some embodiments, the metal middle plate and the plastic frame are fixed together by an IMD process, so that the use of glue or other consumables for realizing connection can be avoided.

In a possible implementation manner of the first aspect, a slot is provided in the front shell at a position corresponding to the first partition net. The end of the slot facing the rear shell forms a socket. The first separation net is inserted into the slot through the insertion opening. The assembly efficiency of pegging graft is high, is favorable to improving the assembly efficiency of speaker module. Meanwhile, the occupied space of the slot is small, and the space of the rear cavity can be ensured.

In one possible implementation form of the first aspect, the width of the first housing portion in the first direction is larger than the width of the second housing portion in the first direction. The first direction is perpendicular to the thickness direction of the loudspeaker module, and the first direction is perpendicular to the arrangement direction of the first shell part and the second shell part. In this way, at least one side of the second housing part in the first direction forms a second avoidance space, and the second avoidance space can avoid the electronic components on the auxiliary circuit board.

In one possible implementation manner of the first aspect, the first side frame includes a first side wall and a second side wall arranged along the first direction and opposite to each other. The first side wall is provided with a sound outlet channel which is communicated with the front cavity. The second side frame comprises a third side wall and a fourth side wall which are arranged along the first direction and are arranged at intervals. The outer surface of the third side wall is oriented in the same direction as the outer surface of the first side wall. The outer surface of the fourth side wall is oriented in the same direction as the outer surface of the second side wall. It should be noted that the outer surface of the first sidewall refers to a surface of the first sidewall away from the first cavity. The outer surface of the second side wall refers to the surface of the second side wall remote from the first cavity. The outer surface of the third sidewall refers to the surface of the third sidewall away from the second cavity. The outer surface of the fourth side wall refers to the surface of the fourth side wall away from the second cavity.

On the basis of the above technical solution, optionally, the fourth sidewall is disposed coplanar with the second sidewall. The first side wall and the third side wall are positioned on the same side of the plane on which the second side wall or the fourth side wall is positioned. Thus, the side of the third side wall far away from the fourth side wall forms a second avoiding space. When the loudspeaker module is applied to the electronic equipment, the second avoiding space can avoid the USB device on the auxiliary circuit board. Meanwhile, when the loudspeaker module is applied to the electronic equipment, the fourth side wall and the second side wall are used for being attached to the side wall of the battery, and the fourth side wall and the second side wall are arranged in a coplanar mode, so that under the condition that the thickness of the second side wall is consistent with that of the fourth side wall, the outer surface of the second side wall and the outer surface of the fourth side wall are arranged in a coplanar mode, the loudspeaker module can be tightly attached to the side wall of the battery, and the structural compactness of the electronic equipment is guaranteed.

In one possible implementation form of the first aspect, the housing further comprises a third housing part. The third housing portion is a plate-like structure. The third housing portion is disposed coplanar with the second and fourth walls. And the third housing portion is integrally formed with the second wall plate and the fourth wall plate. The third housing portion is for protecting the sub circuit board and the electronic components integrated on the sub circuit board. Meanwhile, the third housing part, the second wall plate and the fourth wall plate are arranged in a coplanar manner, so that the loudspeaker module can be tightly attached to the surface of the rear cover facing the screen, and the structural compactness of the electronic equipment is ensured.

In a second aspect, some embodiments of the present application provide an electronic device, which includes a screen, a housing, a fingerprint identification module, a circuit board, and the speaker module according to any of the above technical solutions.

Wherein, the shell includes frame and back lid. The screen and the rear cover are respectively positioned at two sides of the frame, and the screen, the frame and the rear cover enclose an internal accommodating space of the electronic equipment.

In addition, fingerprint identification module, circuit board and speaker module are located inside accommodation space. And the first casing part of fingerprint identification module, circuit board and speaker module arranges side by side in the plane parallel with the screen, and the second casing part of speaker module is located the one side of keeping away from the screen of fingerprint identification module, and the second casing part is in orthographic projection area on the screen with the orthographic projection area overlap of fingerprint identification module on the screen.

Furthermore, the inner core of the loudspeaker module is electrically connected with the circuit board. The frame is provided with a sound outlet. The sound outlet channel of the loudspeaker module is communicated with the sound outlet hole.

Because the electronic equipment that this application embodiment provided includes as above any technical scheme the speaker module, consequently the same technical problem can be solved to the two to reach the same technological effect.

In one possible implementation of the second aspect, the housing further comprises a third housing portion. The third housing portion is a plate-like structure. The third housing portion is disposed coplanar with the second and fourth walls. And the third housing portion is integrally formed with the second wall plate and the fourth wall plate. The third shell part of the loudspeaker module is positioned on one side of the circuit board far away from the screen. And the orthographic projection area of the third shell part on the screen is overlapped with the orthographic projection area of the circuit board on the screen. The third housing portion is used for protecting the sub circuit board and electronic components integrated on the sub circuit board. Meanwhile, the third housing part, the second wall plate and the fourth wall plate are arranged in a coplanar manner, so that the loudspeaker module can be tightly attached to the surface of the rear cover facing the screen, and the structural compactness of the electronic equipment is ensured.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is a schematic cross-sectional view of the electronic device of FIG. 1 at line A0-A0;

fig. 4 is a perspective view of a speaker module according to some embodiments of the present application;

FIG. 5 is a cross-sectional view of the speaker module shown in FIG. 4 taken along line A-A;

fig. 6 is an exploded view of the speaker module of fig. 4;

FIG. 7 is a cross-sectional view of the speaker module shown in FIG. 4 taken along line B-B;

fig. 8 is a schematic cross-sectional view of the core of the speaker module shown in fig. 4-6;

fig. 9 is a schematic diagram of the internal structure of the front housing of the speaker module shown in fig. 6.

Detailed Description

In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features.

In the description of the embodiments of the present application, it should be noted that the terms "mounted" and "connected" are to be interpreted broadly, unless explicitly stated or limited otherwise, and for example, "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate. The term "fixedly connected" means that they are connected to each other and their relative positional relationship is not changed after the connection. "rotationally coupled" means coupled to each other and capable of relative rotation after being coupled. "slidably connected" means connected to each other and capable of sliding relative to each other after being connected. The directional terms used in the embodiments of the present application, such as "inner", "outer", etc., are used solely in reference to the orientation of the figures, and thus, are used for better and clearer illustration and understanding of the embodiments of the present application, rather than to indicate or imply that the device or element so referred to must be in a particular orientation, constructed and operated in a particular orientation, and therefore should not be considered limiting of the embodiments of the present application. "plurality" means at least two. The scheme A and/or the scheme B comprise three schemes: scheme A, scheme B or both scheme A and scheme B.

In the description of the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The present application provides an electronic device 100, wherein the electronic device 100 is a type of electronic device having a speaker module. Specifically, the electronic device 100 includes, but is not limited to, a mobile phone, a tablet personal computer (tablet personal computer), a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, and a wearable device.

Referring to fig. 1-3, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the present disclosure, fig. 2 is an exploded view of the electronic device 100 shown in fig. 1, and fig. 3 is a schematic cross-sectional diagram of the electronic device 100 shown in fig. 1 at a line a0-a 0. In this embodiment, the electronic device 100 is a mobile phone. Specifically, the electronic device 100 includes a housing 10, a screen 20, a main circuit board 30, a sub circuit board 40, a connection structure 50, a battery 60, a fingerprint recognition module 70, and a speaker module 80. It should be noted that fig. 1, fig. 2, fig. 3 and the related drawings below only schematically show some components included in the electronic device 100, and the actual shape, the actual size, the actual position and the actual configuration of the components are not limited by fig. 1, fig. 2, fig. 3 and the following drawings. In addition, when the electronic apparatus 100 is a device of some other form, the electronic apparatus 100 may not include the sub circuit board 40, the connection structure 50, and the battery 60.

For convenience of description, the width direction of the electronic device 100 is defined as the X-axis. The length direction of the electronic device 100 is the Y-axis. The thickness direction of the electronic device 100 is the Z-axis. It will be appreciated that the coordinate system setting of the electronic device 100 can be flexibly set according to specific practical needs.

In the above embodiment, the housing 10 includes the bezel 11 and the rear cover 12 arranged in the Z-axis direction. The rear cover 12 is fixed to the bezel 11. Illustratively, the rear cover 12 may be fixedly attached to the bezel 11 by an adhesive. The rear cover 12 may also be integrally formed with the frame 11, that is, the rear cover 12 and the frame 11 are an integral structure.

In some embodiments, referring to fig. 2 and 3, the housing 10 further includes a middle plate 13. The middle plate 13 is attached to the inner surface of the rim 11. The middle plate 13 is disposed opposite to and spaced apart from the rear cover 12. The middle plate 13 and the frame 11 may be formed integrally. It will be appreciated that the housing 10 may not include the midplane 13.

With continued reference to fig. 2 and 3, the screen 20 is located on a side of the frame 11 away from the back cover 12. At this time, the screen 20 and the rear cover 12 are respectively located at both sides of the bezel 11. The screen 20, the bezel 11 and the rear cover 12 together enclose an inner accommodating space of the electronic device 100. The internal receiving space of the electronic device 100 can be used for receiving the main circuit board 30, the sub-circuit board 40, the connecting structure 50, the battery 60, the fingerprint identification module 70, the speaker module 80 and other devices. When the housing 10 includes the middle plate 13, the middle plate 13 is located between the screen 20 and the rear cover 12, and these devices are fixed and supported on the middle plate 13. The screen 20 may be a flat screen or a curved screen, which is not limited herein.

Specifically, the screen 20 includes a light-transmissive cover 21 and a display screen 22. The light-transmitting cover 21 is stacked on the display screen 22. A light-transmissive cover plate 21 is located on the side of the display screen 22 remote from the rear cover 12. The transparent cover 21 is mainly used for protecting and preventing dust of the display screen 22. The material of the transparent cover plate 21 includes, but is not limited to, glass. The display screen 20 is used to display images, video, and the like. The display screen 20 may be a flexible display screen or a rigid display screen. For example, the display panel 20 may be an organic light-emitting diode (OLED) display panel, an active matrix organic light-emitting diode (AMOLED) display panel, a mini light-emitting diode (mini-OLED) display panel, a micro light-emitting diode (micro-OLED) display panel, a micro organic light-emitting diode (micro-OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, or a Liquid Crystal Display (LCD).

The battery 60 is secured within the interior receiving cavity of the electronic device 100. In some embodiments, the surface of the middle plate 13 facing the rear cover 12 is provided with a battery mounting groove 13a, and the battery 60 is mounted in the battery mounting groove 13 a. In other embodiments, battery 60 may be secured to the surface of rear cover 12 facing display screen 22 when housing 10 does not include middle plate 13.

The main circuit board 30 is fixed in the internal receiving cavity of the electronic device 100. The main circuit board 30 and the battery 60 are arranged in the Y-axis direction. Specifically, the main circuit board 30 may be fixed to a surface of the middle plate 13 facing the rear cover 12. In other embodiments, when the housing 10 does not include the middle plate 13, the main circuit board 30 may be fixed to the surface of the display screen 22 facing the rear cover 12.

The main circuit board 30 may be a hard circuit board, a flexible circuit board, or a rigid-flexible circuit board. The main circuit board 30 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid FR-4 and Rogers dielectric board, or the like. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric plate is a high-frequency plate. The main circuit board 30 may be used for an integrated chip. For example, the chip may be an Application Processor (AP), a double data rate synchronous dynamic random access memory (DDR), a Universal Flash Storage (UFS), and the like. The main circuit board 30 is electrically connected to the display screen 22, and the main circuit board 30 is used for controlling the display screen 22 to display images or videos.

The sub circuit board 40 is fixed in the internal receiving cavity of the electronic apparatus 100. The sub circuit board 40 is located on a side of the battery 60 remote from the main circuit board 30. The sub circuit board 40 may be fixed to a surface of the middle plate 13 facing the rear cover 12. In other embodiments, the secondary circuit board 40 may be fixed to the side of the display screen 22 facing the rear cover 12 when the housing 10 does not include the middle plate 13.

The sub circuit board 40 may be a hard circuit board, a flexible circuit board, or a rigid-flex circuit board. The daughter circuit board 40 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid FR-4 and Rogers dielectric board, or the like. The sub-circuit board 40 may be used to integrate electronic components such as an antenna (e.g., a 5G antenna) rf front end, a Universal Serial Bus (USB) device, and an oscillator.

The sub circuit board 40 is electrically connected to the main circuit board 30 through the connection structure 50 to realize data and signal transmission between the sub circuit board 40 and the main circuit board 30. The connection structure 50 may be a Flexible Printed Circuit (FPC). In other embodiments, the connecting structure 50 may also be a wire or an enameled wire.

The fingerprint identification module 70 is fixed in the internal cavity of the electronic device 100. The fingerprint recognition module 70 is located on a side of the battery 60 away from the main circuit board 30. In some embodiments, the secondary circuit board 40 is provided with an avoiding gap a, and the fingerprint identification module 70 is disposed in the avoiding gap a. In other embodiments, the secondary circuit board 40 is not provided with the avoidance gap a, and the fingerprint identification module 70 and the secondary circuit board 40 are arranged side by side in the XY plane (parallel to the screen 20). Fingerprint identification module 70 is used for discerning the fingerprint of being kept away from the surface input of back cover 12 by screen 20. The fingerprint recognition module 70 may be fixed to a surface of the middle plate 13 facing the rear cover 12. The position that corresponds the identification area of fingerprint identification module 70 on middle plate 13 is equipped with opening 13b, and fingerprint identification module 70 can be kept away from the fingerprint of the surface input of back lid 12 by screen 20 through this opening 13b discernment. In other embodiments, the fingerprint identification module 70 may be fixed to the surface of the display screen 22 facing the rear cover 12 when the housing 10 does not include the middle plate 13.

In some embodiments, the fingerprint identification module 70 is electrically connected to the secondary circuit board 40, and at this time, the fingerprint identification module 70 is configured to send an identified fingerprint signal to the primary circuit board 30 through the secondary circuit board 40. Further, the main circuit board 30 controls the display screen 22 to display an image or video according to the fingerprint signal. In other embodiments, the fingerprint identification module 70 may also be directly electrically connected to the main circuit board 30 through a connection structure such as an FPC, a wire, an enameled wire, or the like.

The speaker module 80 is fixed in the internal receiving cavity of the electronic device 100. The speaker module 80 is located on a side of the battery 60 remote from the main circuit board 30. The speaker module 80 includes a first portion 80a, a second portion 80b, and a third portion 80 c. Referring to fig. 2 and 3, the first portion 80a, the fingerprint recognition module 70 and the sub circuit board 40 are arranged in parallel in the XY plane. The second portion 80b is located on the side of the fingerprint identification module 70 away from the middle plate 13, and the orthographic projection area of the second portion 80b on the screen 20 overlaps with the orthographic projection area of the fingerprint identification module 70 on the screen 20. Wherein "overlap" means "partially overlap" or "completely overlap". The third portion 80c is located on the side of the sub circuit board 40 integrated with electronic components, which is away from the middle plate 13, and the orthographic projection area of the third portion 80c on the screen 20 overlaps with the orthographic projection area of the sub circuit board 40 integrated with electronic components on the screen 20. In other embodiments, when the housing 10 does not include the midplane 13, the second portion 80b is located on a side of the fingerprint identification module 70 that is remote from the display screen 22. The third portion 80c covers the side of the sub-circuit board 40 away from the display screen 22.

The thickness of the second portion 80b along the Z-axis is less than the thickness of the first portion 80a along the Z-axis, as limited by the fingerprint recognition module 70. The thickness of the third portion 80c in the Z-axis direction is smaller than the thickness of the first portion 80a in the Z-axis direction, limited by the sub-circuit board 40 into which the electronic components are integrated. Further, since the thickness of the pattern recognition module 70 in the Z-axis direction is generally smaller than the thickness of the sub circuit board 40 integrated with electronic components in the Z-axis direction, the thickness of the third portion 80c in the Z-axis direction is also smaller than the thickness of the second portion 80b in the Z-axis direction. Therefore, referring to fig. 2 and 3, the shape of the speaker module 80 is irregular due to the extrusion of the fingerprint identification module 70, the sub circuit board 40 integrated with electronic components, and other devices along the Z-axis direction, and the extrusion of the fingerprint identification module 70, the rf module, the sub circuit board 40, the battery 60, and other devices along the XY direction.

It should be noted that, since the thickness of the third portion 80c in the Z-axis direction is small, and it is difficult to provide a rear cavity expansion space inside, in other embodiments, the speaker module 80 may not include the third portion 80 c.

The speaker module 80 is fixed to the surface of the middle plate 13 facing the rear cover 12 by a first portion 80 a. In some embodiments, the surface of the middle plate 13 facing the rear cover 12 is provided with a mounting groove (not shown), and the first portion 80a of the speaker module 80 is embedded in the mounting groove and fixed by a connector such as a screw, a snap, etc. In other embodiments, when the housing 10 does not include the middle plate 13, the speaker module 80 may be fixed to the surface of the display screen 22 facing the rear cover 12 through the first portion 80 a. In some embodiments, the speaker module 80 is also secured to the sub-circuit board 40 by a third portion 80 c.

In some embodiments, speaker module 80 is electrically connected to sub-circuit board 40. At this time, the voice electrical signal transmitted by the main circuit board 30 is transmitted to the speaker module 80 via the sub circuit board 40, and further converted into a sound signal by the speaker module 80 to be output. Specifically, the speaker module 80 has a sound outlet channel 80 d. The sound signal output from the speaker module 80 is output from the sound output channel 80 d. The frame 11 is provided with a sound outlet 11 a. The sound outlet hole 11a communicates with the sound outlet passage 80 d. The sound signal output from the sound outlet channel 80d is further output from the electronic device 100 through the sound outlet hole 11 a. In other embodiments, the speaker module 80 may also be directly electrically connected to the main circuit board 30 through a connection structure such as an FPC, a wire, an enamel wire, or the like.

Referring to fig. 4, fig. 4 is a perspective view of a speaker module 80 according to some embodiments of the present disclosure. In the present embodiment, the speaker module 80 includes a housing 81. The housing 81 is provided with a fixing hole 80e and a buckle 80 f. The housing 81 can be fixed to the middle plate 13 and the sub board 40 by the fixing holes 80e and the clips 80 f.

The housing 81 is used to protect its internal structure and encloses a front cavity and a rear cavity with the internal structure. The material of the housing 81 includes, but is not limited to, plastic, metal, and a combination of plastic and metal.

The housing 81 includes a first housing portion 811 and a second housing portion 812 arranged side by side and secured together. Referring to fig. 5, fig. 5 is a cross-sectional view of the speaker module 80 shown in fig. 4 at a line a-a. The thickness d1 of the first housing portion 811 in the thickness direction of the speaker module 80 is larger than the thickness d2 of the second housing portion 812 in the thickness direction of the speaker module 80. The thickness direction of the speaker module 80 is a direction consistent with the thickness direction of the electronic device when the speaker module 80 is installed in the electronic device, and the thickness direction of the speaker module 80 is also the Z-axis direction as described above.

The first housing portion 811 may be a one-piece housing or may be formed by assembling a plurality of portions. Similarly, the second housing portion 812 may be a unitary housing or may be formed from multiple pieces assembled together.

In some embodiments, with continued reference to fig. 5, the first housing portion 811 encloses a first cavity. The first housing portion 811 has a first wall plate 811a, a second wall plate 811b, and a first side frame 811 c. The first wall plate 811a and the second wall plate 811b are arranged in the thickness direction (i.e., the Z-axis direction) of the speaker module 80. The first wall plate 811a is disposed opposite to the second wall plate 811 b. The first side frame 811c is disposed around the edges of the first wall plate 811a and the second wall plate 811b, and the sound outlet passage 80d of the speaker module 80 is disposed on the first side frame 811 c.

The second housing portion 812 encloses a second cavity C3. The second housing portion 812 has a third wall 812a, a fourth wall 812b, and a second side frame 812 c. The third wall 812a and the fourth wall 812b are arranged in the thickness direction (i.e., the Z-axis direction) of the speaker module 80. The third wall 812a and the fourth wall 812b are disposed opposite to each other. The outer surface of the third wall panel 812a is oriented in the same direction as the outer surface of the first wall panel 811 a. The outer surface of the fourth wall panel 812b is oriented in the same direction as the outer surface of the second wall panel 811 b. The outer surface of the first wall plate 811a refers to a surface of the first wall plate 811a away from the first cavity. The outer surface of the second wall plate 811b refers to the surface of the second wall plate 811b remote from the first cavity. The outer surface of the third wall panel 812a refers to the surface of the third wall panel 812a distal from the second cavity C3. The outer surface of the fourth wall 812b refers to the surface of the fourth wall 812b that is away from the second cavity C3. A second side frame 812c is disposed around the edges of the third wall panel 812a and the fourth wall panel 812 b.

In addition to the above embodiments, the second wall plate 811b is optionally disposed coplanar with the fourth wall plate 812 b. The first wall panel 811a and the third wall panel 812a are located on the same side of the plane in which the second wall panel 811b or the fourth wall panel 812b is located. Thus, a first escape space is formed on a side of the third wall 812a remote from the fourth wall 812 b. When being applied to in above-mentioned electronic equipment 100 speaker module 80, third wallboard 812a is towards fingerprint identification module 70, and first dodging the space can form dodging to fingerprint identification module 70. Meanwhile, since the second wall plate 811b and the fourth wall plate 812b are disposed in a coplanar manner, in a case where the thickness of the second wall plate 811b is identical to that of the fourth wall plate 812b, the outer surface of the second wall plate 811b and the outer surface of the fourth wall plate 812b are disposed in a coplanar manner, so that the speaker module 80 can be closely attached to the surface of the rear cover 12 facing the screen 20, thereby ensuring the structural compactness of the electronic apparatus 100.

Referring to fig. 6, fig. 6 is an exploded view of the speaker module 80 shown in fig. 4. The first wall plate 811a, the third wall plate 812a, the first side frame 811c, and the second side frame 812c are integrally molded as a front case K1. The second wall plate 811b and the fourth wall plate 812b are integrally formed as a rear case K2. The front case K1 is fixed with the rear case K2. In this way, the housing 81 is assembled and formed by two integrated structures of the front shell K1 and the rear shell K2, and the assembling efficiency and the assembling difficulty can be simultaneously considered.

In other embodiments, the housing 81 may be formed by assembling other parts, and is not limited in particular.

The materials of the front case K1 and the rear case K2 include, but are not limited to, metal and plastic. In some embodiments, the front case K1 and the rear case K2 each include a metal middle plate and a plastic bezel disposed at an edge of the metal middle plate. Specifically, the material of the metal middle plate includes, but is not limited to, stainless steel, aluminum alloy, magnesium aluminum alloy, and the like. The hardness of the metal is higher, which is beneficial to reducing the thickness of the middle area of the front shell K1 and the rear shell K2 and increasing the height of the first cavity and the second cavity C3 in the Z-axis direction. Meanwhile, the plastic frame of the front shell K1 can be directly pressed together with the plastic frame of the rear shell K2 through an ultrasonic welding process, so that glue or other consumables used for connection are avoided. The metal middle plate and the plastic frame may be fixed together by gluing, clamping, screwing, in-mold Injection (IMD), and the like, which is not limited herein. In some embodiments, the metal middle plate and the plastic frame are fixed together by an IMD process, which may avoid the use of glue or other consumables for making the connection.

Further, in some embodiments, referring back to fig. 4, the width W1 of the first housing portion 811 in the first direction (i.e., the Y-axis direction) is greater than the width W2 of the second housing portion 812 in the first direction. The first direction is perpendicular to the thickness direction (i.e., Z-axis direction) of the speaker module, and the first direction is perpendicular to the arrangement direction (i.e., X-direction) of the first housing portion 811 and the second housing portion 812. In this way, at least one side of the second housing portion 812 in the first direction forms a second escape space that can escape the electronic components on the sub circuit board 40.

In some embodiments, with continued reference to fig. 6, the first side frame 811c includes a first side wall 811c1 and a second side wall 811c2 arranged along a first direction (i.e., the Y-axis direction) and opposite to each other. The sound emitting passage 80d is provided on the first side wall 811c 1. The second side frame 812c includes a third side wall 812c1 and a fourth side wall 812c2 arranged at intervals in the first direction. The orientation of the outer surface of the third sidewall 812c1 coincides with the orientation of the outer surface of the first sidewall 811c 1. The orientation of the outer surface of the fourth sidewall 812c2 coincides with the orientation of the outer surface of the second sidewall 811c 2. Note that the outer surface of the first sidewall 811c1 refers to a surface of the first sidewall 811c1 away from the first cavity. The outer surface of the second sidewall 811c2 refers to the surface of the second sidewall 811c2 that is away from the first cavity. The outer surface of the third sidewall 812C1 refers to the surface of the third sidewall 812C1 that is distal from the second cavity C3. The outer surface of the fourth side wall 812C2 refers to the surface of the fourth side wall 812C2 away from the second cavity C3.

On the basis of the above embodiment, optionally, the fourth side wall 812c2 is disposed coplanar with the second side wall 811c 2. The first sidewall 811c1 and the third sidewall 812c1 are located on the same side of the plane in which the second sidewall 811c2 or the fourth sidewall 812c2 is located. Thus, a side of the third side wall 812c1 away from the fourth side wall 812c2 forms a second escape space. When the speaker module 80 is applied to the electronic apparatus 100, the second avoiding space can avoid the USB device on the sub board 40. Meanwhile, when the speaker module 80 is applied to the electronic apparatus 100, the fourth side wall 812c2 and the second side wall 811c2 are configured to be attached to the side wall of the battery 60, and since the fourth side wall 812c2 and the second side wall 811c2 are disposed in a coplanar manner, in a case where the thickness of the second side wall 811c2 is identical to the thickness of the fourth side wall 812c2, the outer surface of the second side wall 811c2 is disposed in a coplanar manner with the outer surface of the fourth side wall 812c2, so that the speaker module 80 can be closely attached to the side wall of the battery 60, thereby ensuring the structural compactness of the electronic apparatus 100.

In some embodiments, the housing 81 further includes a third housing portion 813. The third housing portion 813 has a plate-like structure, and the third housing portion 813 protects the sub-circuit board 40 and electronic components integrated on the sub-circuit board 40. The material of the third housing portion 813 includes, but is not limited to, metal and plastic. And the third housing portion 813 may be secured to the first housing portion 811 and/or the second housing portion 812 by a threaded connection, snap fit, integral molding, or the like. In some embodiments, with continued reference to fig. 6, the third housing portion 813 is disposed coplanar with the second wall plate 811b and the fourth wall plate 812b, and the third housing portion 813 is integrally formed with the second wall plate 811b and the fourth wall plate 812 b. Thus, the structural composition of the housing 81 can be simplified, thereby reducing the difficulty of assembling the housing 81. Meanwhile, the third housing portion 813 is disposed coplanar with the second wall plate 811b and the fourth wall plate 812b, so that the speaker module 80 can be closely attached to the surface of the rear cover 12 facing the screen 20, thereby ensuring the compactness of the electronic device 100.

With continued reference to fig. 5 and 6, the speaker module 80 further includes an inner core 82. The core 82 is a core element of the speaker module 80 for generating sound. The inner core 82 is disposed within the first cavity. In some embodiments, a first step surface M1 is formed around the inner wall of the first cavity, and the inner core 82 is fixed on the first step surface M1. The inner core 82 and the first wall plate 811a, and the inner core 82 and the second wall plate 811b are stacked and spaced apart from each other. The inner core 82 and the first wall panel 811a form a front cavity C1 therebetween. Referring to fig. 7, fig. 7 is a cross-sectional view of the speaker module 80 shown in fig. 4 taken along line B-B, wherein the sound outlet channel 80d is communicated with the front cavity C1. A partial rear cavity C2 is formed between the inner core 82 and the second wall panel 811b, and the partial rear cavity C2 is communicated with the second cavity C3 to form a rear cavity.

Specifically, referring to fig. 8, fig. 8 is a schematic cross-sectional structural diagram of an inner core 82 of the speaker module 80 shown in fig. 4-6. In this embodiment, the core 82 includes a diaphragm 821 and a driving device 822 provided on one side of the diaphragm 821. When the core 82 is applied to the speaker module 80 shown in fig. 4 to 6, the edge of the surface of the diaphragm 821, which is away from the driving unit 822, is fixed to the first step surface M1 by means of adhesive, and the driving unit 822 is located in the partial back cavity C2. The driving device 822 is used for driving the diaphragm 821 to vibrate so as to drive the air in the front cavity C1 to vibrate to form sound waves, and the air flow circuit in the front cavity C1 is shown by the path shown by the arrow in fig. 7.

The driving device 822 includes, but is not limited to, an electric (i.e., moving coil) driving device, an electrostatic (i.e., capacitive) driving device, an electromagnetic (i.e., reed) driving device, or a piezoelectric (i.e., crystal) driving device. In some embodiments, the drive 822 is a moving coil drive. Specifically, referring to fig. 8, the driving device 822 includes a voice coil 8221 fixedly connected to the diaphragm 821, a magnetic circuit 8222 disposed on one side of the diaphragm 821, and a frame for mounting the diaphragm 821 and the magnetic circuit 8222. When energized, voice coil 8221 generates an induced magnetic field, which is displaced by the magnetic force of magnetic circuit 8222 to drive diaphragm 821 to vibrate.

In the prior art, in order to increase the low-frequency loudness of the speaker module 80 without increasing the physical volume of the rear cavity of the speaker module 80, sound-absorbing particles may be used to fill the entire rear cavity (including part of the rear cavity C2 and the second cavity C3) so as to maximize the equivalent volume of the rear cavity. In the speaker module 80 according to the above-described embodiment, the thickness of the second housing portion 812 in the thickness direction (i.e., Z-axis direction) of the speaker module 80 is smaller than the thickness of the first housing portion 811 in the thickness direction of the speaker module 80. The thickness of the second housing portion 812 in the Z-axis direction is small. The height of the second cavity C3 in the Z-axis direction is small and approximately coincides with the diameter of the sound absorbing particles. Therefore, if the sound absorbing particles are filled in the entire rear cavity, when the sound absorbing particles enter the narrow second cavity C3 from the partial rear cavity C2, one end of the second cavity C3 close to the partial rear cavity C2 is easily blocked, air in the second cavity C3 and air in the partial rear cavity C2 are not circulated, and thus the portion of the second cavity C3 far from the partial rear cavity C2 cannot be utilized. This reduces the actual equivalent utilization rate of the sound-absorbing particles. Meanwhile, the sound-absorbing particles block one end of the second cavity C3 near the partial rear cavity C2, resulting in poor filling uniformity of the sound-absorbing particles in the entire rear cavity.

In order to avoid the above problem, in the embodiment of the present application, please refer back to fig. 5, the speaker module 80 further includes a sound absorbing structure 87. The sound-absorbing structure 87 is filled in a part of the rear cavity C2. The second chamber C3 is filled with air.

In the embodiment of the present application, since the sound absorbing structure 87 is filled in the partial rear cavity C2 and the second cavity C3 is filled with air, the sound absorbing structure 87 does not enter the narrow second cavity C3, and therefore no blockage is caused, and the whole second cavity C3 can be effectively utilized. Therefore, the equivalent back cavity of the speaker module 80 is large, and the low-frequency loudness of the speaker module 80 can be improved.

In some embodiments, continuing to refer to fig. 5, sound absorbing structure 87 includes a plurality of sound absorbing particles made of a material including, but not limited to, one or more of melamine, zeolite, fiberglass, and activated carbon. Speaker module 80 also includes a first screen 83. The first screen 83 includes, but is not limited to, gauze and metal mesh. The first screen 83 is disposed in the partial rear chamber C2 at a position adjacent to the second chamber C3. The plurality of sound absorbing particles are filled in a part of the rear cavity of the first screen 83 far away from the second cavity C3. The first partition net 83 is used for preventing a plurality of sound-absorbing particles from entering the second cavity C3, that is, the diameter of the mesh holes on the first partition net 83 is smaller than that of the sound-absorbing particles, and the sound-absorbing particles cannot enter the second cavity C3 through the first partition net 83. The sound absorbing structure 87 is low in cost, and can reduce the cost of the speaker module 80.

In order to fill some of the rear cavities C2 with sound absorbing particles, in some embodiments, referring to fig. 6, a filling opening 85 is provided in the first housing portion 811. The shape of the fill port 85 includes, but is not limited to, circular, square, polygonal, and the like. The filling port 85 communicates with the partial rear chamber C2. The sound absorbing particles can be filled into the partial rear cavity C2 through the filling opening 85. The filling opening 85 is provided with a cover body 86, and the cover body 86 is used for sealing the filling opening 85. Specifically, the cover 86 may be attached to the edge of the first housing portion at the filling opening 85 by gluing or the like.

The first screen 83 may be disposed in the partial rear cavity C2 near the second cavity C3 by plugging, bonding, or the like. In some embodiments, referring to fig. 9, fig. 9 is a schematic diagram illustrating an internal structure of a front case K1 of the speaker module 80 shown in fig. 6. The front case K1 is provided with a slot 88 at a position corresponding to the first net 83 in fig. 6. The end of the slot 88 facing the rear shell K2 in fig. 6 forms a socket 881. The first screen 83 is inserted into the slot 88 through the insertion hole 881. The assembly efficiency of grafting is high, is favorable to improving the assembly efficiency of speaker module 80. Meanwhile, the occupied space of the slot is small, and the space of the rear cavity can be ensured.

Further, to avoid acoustical particles from entering the inner core 82 and affecting the motion of the diaphragm and the driver. In some embodiments, with continued reference to fig. 5 and 6, the speaker module 80 further includes a second mesh 84. The second screen 84 includes, but is not limited to, gauze and metal mesh. The second screen 84 is positioned within the partial posterior chamber C2 and the second screen 84 overlies the portion of the inner core 82 that is positioned outside of the partial posterior chamber C2. In some embodiments, a second step surface M2 is formed around the inner wall of the first cavity, and the second screen 84 is fixed on the second step surface M2. A plurality of sound absorbing particles are filled in the second screen 84 on the side away from the inner core 82. The second screen 84 is used to prevent sound absorbing particles from entering the core 82, thereby preventing the second screen 84 from interfering with the movement of the diaphragm and the drive mechanism in the core 82.

It is understood that the sound-absorbing structure 87 may be a block structure made of a sound-absorbing material (including a single material or a combination of two or more materials) such as melamine, zeolite, glass fiber, activated carbon, etc., and the sound-absorbing structure 87 is bonded to the inner wall of the partial rear cavity C2 by an adhesive material. Therefore, on one hand, the equivalent space of the rear cavity can be increased through the sound-absorbing structure 87, and the low-frequency loudness of the loudspeaker module 80 is improved; on the other hand, since the sound absorbing structure 87 is a block structure, and the sound absorbing structure 87 is adhered to the inner wall of the partial rear cavity C2 through the adhesive material, it is not necessary to provide a mesh, such as a gauze or a metal mesh, for blocking inside the partial rear cavity C2 or between the partial rear cavity C2 and the second cavity C3, so as to prevent the sound absorbing structure 87 from entering the second cavity C3.

In the present embodiment, the first housing portion 811, the core 82, and the sound absorbing structure 87 of the speaker module 80 form a first portion 80a of the speaker module 80 (see fig. 2). The second housing portion 812 of the speaker module forms the second portion 80b of the speaker module 80. The third housing portion 813 of the speaker module forms a third portion 80c of the speaker module 80.

It should be noted that fig. 4-9 only schematically illustrate some components included in the speaker module 80, and the actual shape, the actual size, the actual position, and the actual configuration of these components are not limited by those in fig. 4-9.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A loudspeaker module (80) comprising a housing (81), a core (82) and a sound absorbing structure (87);

the housing (81) comprises a first housing part (811) and a second housing part (812) arranged side by side and fixed together; the thickness of the first housing portion (811) in the thickness direction of the speaker module (80) is larger than the thickness of the second housing portion (812) in the thickness direction of the speaker module (80);

the first housing portion (811) encloses a first cavity, and the first housing portion (811) has a first wall plate (811a) and a second wall plate (811b) which are arranged in the thickness direction of the speaker module (80) and are arranged opposite to each other; the second housing portion (812) enclosing a second cavity (C3);

the inner core (82) is arranged in the first cavity, the inner core (82) and the first wall plate (811a) are laminated, and a front cavity (C1) is formed between the inner core (82) and the first wall plate (811 a); the inner core (82) and the second wall plate (811b) are stacked, and a partial rear cavity (C2) is formed between the inner core (82) and the second wall plate (811 b); the partial rear cavity (C2) is communicated with the second cavity (C3) to form a rear cavity;

the sound absorbing structure (87) is filled inside the partial rear cavity (C2), the second cavity (C3) being filled with air;

the sound-absorbing structure (87) comprises a plurality of sound-absorbing particles, and the loudspeaker module (80) further comprises a first screen (83);

first separate net (83) set up in be close to in partial back chamber (C2) the position of second cavity (C3), a plurality of sound particles of inhaling are filled in first keeping away from of separating net (83) in partial back chamber (C2) of second cavity (C3), first separate net (83) are used for preventing a plurality of sound particles of inhaling enter in second cavity (C3).

2. The loudspeaker module (80) of claim 1 wherein the sound absorbing particles are at least one of melamine, zeolite, fiberglass, activated carbon.

3. A loudspeaker module (80) according to claim 1 or 2, further comprising a second screen (84);

the second separates the net (84) and is located in partial rear cavity (C2), and the second separates net (84) cover be located in the inner core (82) outside the part of partial rear cavity (C2), a plurality of sound-absorbing particles fill in the second separates net (84) keep away from one side of inner core (82).

4. The speaker module (80) of claim 1 wherein the second housing portion (812) has a third wall panel (812a) and a fourth wall panel (812b) arranged opposite and aligned in a thickness direction of the speaker module (80);

the orientation of the outer surface of the third wall panel (812a) coincides with the orientation of the outer surface of the first wall panel (811a), and the orientation of the outer surface of the fourth wall panel (812b) coincides with the orientation of the outer surface of the second wall panel (811 b); the second wall panel (811b) is disposed coplanar with the fourth wall panel (812b), the first wall panel (811a) and the third wall panel (812a) being located on the same side of a plane in which the second wall panel (811b) or the fourth wall panel (812b) is located.

5. A speaker module (80) as recited in claim 4, wherein said first housing portion (811) further comprises a first side frame (811c), said first side frame (811c) being disposed between said first wall panel (811a) and said second wall panel (811b), and said first side frame (811c) being disposed around a periphery of said first wall panel (811a) and said second wall panel (811 b);

the second housing portion (812) further comprises a second side frame (812c), the second side frame (812c) being disposed between the third wall panel (812a) and the fourth wall panel (812b), and the second side frame (812c) being disposed around edges of the third wall panel (812a) and the fourth wall panel (812 b);

the first wall panel (811a), the third wall panel (812a), the first side frame (811c), and the second side frame (812c) are integrally formed as a front case (K1); the second wall plate (811b) and the fourth wall plate (812b) are integrally formed as a rear case (K2).

6. A loudspeaker module (80) according to claim 5, wherein a slot (88) is provided in the front shell (K1) at a position corresponding to the first mesh (83), and a socket (881) is formed at one end of the slot (88) facing the rear shell (K2); the first separation net (83) is inserted into the slot (88) through the inserting hole (881).

7. A loudspeaker module (80) according to claim 5 or 6, wherein the width of the first housing part (811) in a first direction is larger than the width of the second housing part (812) in the first direction;

wherein the first direction is perpendicular to a thickness direction of the speaker module (80), and the first direction is perpendicular to an arrangement direction of the first housing portion (811) and the second housing portion (812).

8. The speaker module (80) as claimed in claim 7, wherein the first side frame (811C) comprises a first side wall (811C1) and a second side wall (811C2) arranged along the first direction and opposite to each other, the first side wall (811C1) is provided with a sound outlet channel (80d) communicating with the front cavity (C1), and the second side frame (812C) comprises a third side wall (812C1) and a fourth side wall (812C2) arranged along the first direction and spaced apart from each other;

the orientation of the outer surface of the third side wall (812c1) coincides with the orientation of the outer surface of the first side wall (811c1), and the orientation of the outer surface of the fourth side wall (812c2) coincides with the orientation of the outer surface of the second side wall (811c 2); the fourth side wall (812c2) is disposed coplanar with the second side wall (811c2), and the first side wall (811c1) and the third side wall (812c1) are located on the same side of a plane on which the second side wall (811c2) or the fourth side wall (812c2) is located.

9. A loudspeaker module (80) according to any of claims 4-6, wherein the housing (81) further comprises a third housing portion (813), the third housing portion (813) being of plate-like construction;

the third housing portion (813) is disposed coplanar with the second and fourth wall panels (811b, 812b), and the third housing portion (813) is integrally formed with the second and fourth wall panels (811b, 812 b).

10. An electronic device (100) comprising a screen (20), a housing (10), a fingerprint recognition module (70), a circuit board, and a speaker module (80) according to any one of claims 1-8;

the shell (10) comprises a frame (11) and a rear cover (12), the screen (20) and the rear cover (12) are respectively positioned at two sides of the frame (11), and the screen (20), the frame (11) and the rear cover (12) enclose an internal accommodating space of the electronic equipment (100);

the fingerprint identification module (70), the circuit board and the loudspeaker module (80) are positioned in the inner accommodating space, the fingerprint identification module (70), the circuit board and a first shell part (811) of the loudspeaker module (80) are arranged side by side in a plane parallel to the screen (20), a second shell part (812) of the loudspeaker module (80) is positioned on one side of the fingerprint identification module (70) far away from the screen (20), and an orthographic projection area of the second shell part (812) on the screen (20) is overlapped with an orthographic projection area of the fingerprint identification module (70) on the screen (20);

the kernel (82) of speaker module (80) with the circuit board electricity is connected, be equipped with sound hole (11a) on frame (11), the sound channel (80d) of speaker module (80) with sound hole (11a) intercommunication goes out.

11. An electronic device (100) comprising a screen (20), a housing (10), a fingerprint recognition module (70), a circuit board, and the speaker module (80) of claim 9;

the fingerprint identification module (70), the circuit board and the speaker module (80) are located in the inner accommodating space, the fingerprint identification module (70), the circuit board and a first shell part (811) of the speaker module (80) are arranged side by side in a plane parallel to the screen (20), a second shell part (812) of the speaker module (80) is located on one side of the fingerprint identification module (70) away from the screen (20), a forward projection area of the second shell part (812) on the screen (20) overlaps with a forward projection area of the fingerprint identification module (70) on the screen (20), a third shell part (813) of the speaker module (80) is located on one side of the circuit board away from the screen (20), and a forward projection area of the third shell part (813) on the screen (20) and a forward projection area of the circuit board on the screen (20) are overlapped Overlapping shadow areas;

the inner core (82) of the loudspeaker module (80) is electrically connected with the circuit board, a sound outlet (11a) is arranged on the frame (11), and a sound outlet channel (80d) of the loudspeaker module (80) is communicated with the sound outlet (11 a).