CN112993180A - Flexible display panel, manufacturing method and display device - Google Patents

Flexible display panel, manufacturing method and display device Download PDF

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Publication number
CN112993180A
CN112993180A CN202110145955.6A CN202110145955A CN112993180A CN 112993180 A CN112993180 A CN 112993180A CN 202110145955 A CN202110145955 A CN 202110145955A CN 112993180 A CN112993180 A CN 112993180A
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layer
hole
organic
display panel
substrate
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CN202110145955.6A
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CN112993180B (en
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张子予
曹方旭
秦成杰
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US17/588,306 priority patent/US20220246883A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Abstract

The embodiment of the application provides a flexible display panel, a manufacturing method and a display device, wherein the flexible display panel comprises a flexible substrate, the flexible substrate comprises a first surface and a second surface which are opposite, and a thin film transistor layer, a pixel unit and a thin film packaging layer are stacked on the first surface of the flexible substrate; the flexible substrate is provided with a through hole at one side of the thin film transistor layer and the pixel unit, the through hole penetrates through the flexible substrate along the direction between the first surface and the second surface, and the thin film packaging layer extends along the hole wall of the through hole; the flexible display panel further comprises an organic coating layer arranged on the hole wall, and the thin film packaging layer is located on the side face, far away from the hole wall, of the organic coating layer. Through setting up organic coating, make the film packaging layer compare in the more remote pore wall of correlation technique to reduce the film packaging layer and shelter from the area of contact of position department glass substrate direct contact, thereby reduce the degree of difficulty of peeling off of flexible substrate and glass substrate, can also realize decreasing the separation, and then guarantee the integrality of flexible substrate structure.

Description

Flexible display panel, manufacturing method and display device
Technical Field
The embodiment of the application relates to the technical field of display equipment, in particular to a flexible display panel, a manufacturing method and a display device.
Background
At present, the flexible display panel can complete uniaxial folding and larger-radius curling operations, but cannot realize bidirectional stretching deformation and small-curvature folding and curling operations due to the limitation of strain limits of structures and materials. In view of this, local perforation of the flexible display panel is required, and bidirectional deformation and a larger amount of deformation are achieved by structural deformation.
In a related art, a flexible display panel includes a flexible substrate and a pixel unit, the pixel unit is disposed on the flexible substrate, a through hole penetrating through the flexible substrate in a thickness direction is formed in one side of the pixel unit of the flexible substrate, the through hole is stretched and deformed under stretching of the flexible substrate, and the stretching and deformation of the through hole drives a pixel area where the pixel unit is located to be stretched and rotated, so that the flexible display panel achieves a deformation amount larger than a material limit.
However, the flexible display panel is difficult to peel off from the glass substrate during the manufacturing process.
Disclosure of Invention
An object of the embodiments of the present application is to provide a flexible display panel, a manufacturing method thereof, and a display device, so as to solve the problem that a flexible substrate and a glass substrate are difficult to peel in the prior art.
In view of the foregoing, in a first aspect, an embodiment of the present application provides a flexible display panel, including a flexible substrate, where the flexible substrate includes a first surface and a second surface opposite to the first surface, and the flexible substrate is stacked on the first surface and provided with a thin film transistor layer, a pixel unit, and a thin film encapsulation layer;
the flexible substrate is provided with a through hole at one side of the thin film transistor layer and the pixel unit, the through hole penetrates through the flexible substrate along the direction between the first surface and the second surface, and the thin film packaging layer extends along the hole wall of the through hole;
the flexible display panel further comprises an organic coating layer arranged on the hole wall, and the thin film packaging layer is located on the side face, far away from the hole wall, of the organic coating layer.
In the flexible display panel of the embodiment of the application, the organic coating layer is arranged, and the thin film packaging layer is arranged on one side, far away from the hole wall, of the organic coating layer. Because the organic coating layer has certain thickness, the thin film packaging layer is farther away from the hole wall compared with the related technology, so that the contact area between the thin film packaging layer and the glass substrate at the shielding position is reduced, and even the direct contact between the thin film packaging layer and the glass substrate can be avoided, thus the peeling difficulty between the flexible substrate and the glass substrate can be reduced, the flexible substrate and the glass substrate can be peeled off easily, the damage separation can be realized, and the structural integrity of the flexible substrate is ensured.
In one possible embodiment, the organic coating layer covers the hole wall and extends from the hole wall toward the inside of the through hole.
In one possible embodiment, the through-hole comprises a hole bottom near the second surface, the hole wall having a bottom corner near the hole bottom; the organic clad layer extends from the hole wall to the base corner and extends from the base corner toward the inside of the through hole.
In one possible embodiment, the flexible substrate has an upper edge shielding structure protruding toward the inside of the through hole with respect to the hole wall; and the tail end of the organic coating layer, which is far away from the hole wall, is flush with the upper edge shielding structure or exceeds the upper edge shielding structure along the direction from the first surface to the second surface.
In one possible embodiment, the organic coating layer comprises a resinous organic material.
In one possible embodiment, the thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are stacked, disposed on two sides of the organic encapsulation layer, and hermetically covers the organic encapsulation layer.
In one possible embodiment, the thin film encapsulation layer includes an inorganic encapsulation layer and an organic encapsulation layer, which are stacked, the inorganic encapsulation layer is hermetically wrapped on the outer side of the pixel unit and the hole wall, and the organic encapsulation layer is wrapped on the side of the inorganic encapsulation layer away from the flexible substrate.
In one possible embodiment, the flexible substrate is formed by laminating an organic isolation layer and an inorganic isolation layer on the first surface, the organic isolation layer and the inorganic isolation layer surrounding the through hole, the organic isolation layer and the inorganic isolation layer are provided with an isolation groove, an opening direction of the isolation groove is a direction in which the second surface points to the first surface, and the isolation groove extends around an outer periphery of the through hole.
In a possible embodiment, in a direction opposite to the opening direction, a projected area of the inorganic isolation layer to the bottom of the isolation groove is not smaller than a projected area of the organic isolation layer to the bottom of the isolation groove.
In one possible implementation, the flexible display panel includes a flat layer and a pixel defining layer stacked on the thin-film transistor layer, the flat layer having a first opening disposed thereon, the pixel defining layer having a second opening disposed thereon;
the pixel unit comprises a first electrode, a second electrode and an organic light-emitting layer arranged between the first electrode and the second electrode; the first electrode is arranged on the flat layer, is opposite to the second opening and is connected with the pixel circuit in the thin film transistor layer through the first opening; the organic light emitting layer and the second electrode are disposed in the second opening.
In a possible embodiment, the first electrode is an anode, the second electrode is a cathode, the organic light emitting layer and the cathode are disconnected at the side wall of the isolation groove, and the thin film encapsulation layer is continuous in the isolation groove.
In one possible embodiment, the organic isolation layer is disposed in the same material as the planarization layer or the pixel defining layer.
In one possible embodiment, the pixel defining layer is provided with a support pillar, and the support pillar and the organic cladding layer are provided in the same layer and the same material.
In one possible embodiment, the flexible substrate includes a first organic substrate, a first inorganic substrate, and a second organic substrate that are disposed in a stack; the organic coating layer comprises a first subcoating layer and a second subcoating layer, the first subcoating layer covers the parts, corresponding to the first organic substrate, of the hole walls, and the second subcoating layer covers the parts, corresponding to the second organic substrate, of the hole walls.
In one possible embodiment, the first inorganic substrate has an overlap with the first subcoating layer and the second subcoating layer in a direction perpendicular to the flexible substrate.
In one possible embodiment, an inorganic insulating film layer is disposed on a side of the first organic substrate away from the first inorganic substrate, the inorganic insulating film layer is provided with a flat layer, and a pixel unit is disposed on the flat layer; the inorganic insulating film layer has an overlap with the first sub-coating layer in a direction perpendicular to the flexible substrate.
In a second aspect, an embodiment of the present application provides a method for manufacturing a flexible display panel, including the following steps:
providing a glass substrate;
manufacturing a back plate on the glass substrate; the back plate comprises a flexible substrate, wherein the flexible substrate is provided with a pixel area and an opening area, and a thin film substrate tube layer, a flat layer, a first electrode and a pixel defining layer are arranged on the flexible substrate in a stacking mode in the pixel area;
etching the opening region of the flexible substrate to form a through hole;
coating the hole wall of the through hole by adopting an organic material to form an organic coating layer, wherein the organic coating layer extends from the hole wall to a bottom corner close to the bottom of the through hole and extends from the bottom corner to the inside of the through hole;
evaporating an organic light-emitting layer and a second electrode above the first electrode;
packaging by adopting a thin film packaging layer, wherein the thin film packaging layer extends to the bottom of the hole along the hole wall and is positioned on one side of the organic coating layer away from the glass substrate;
etching to remove the material between the through hole and the glass substrate;
and separating the glass substrate and the flexible substrate by adopting laser stripping equipment.
In one possible embodiment, the manufacturing method further includes manufacturing a support pillar on the pixel defining layer, wherein the support pillar supports a mask for manufacturing the organic light emitting layer;
the support column and the organic coating layer are made of the same material at the same layer.
In a possible embodiment, the organic coating layer is made of resin photoresist liquid coating.
In a third aspect, an embodiment of the present application provides a display device, including the flexible display panel described in the first aspect.
Since the display device adopts the flexible display panel in the above embodiment, the display device has the same technical effect as the flexible display panel, and the details are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only the embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible display panel provided in the related art;
FIG. 2 is a cross-sectional view at D-D of the flexible display panel of FIG. 1 without being separated from the glass substrate;
fig. 3 is a front view of a flexible display panel provided in an embodiment of the present application;
FIG. 4 is a cross-sectional view D-D of FIG. 3;
FIG. 5 is a schematic structural diagram of the flexible display panel of FIG. 4 without being separated from the glass substrate;
fig. 6 is a schematic structural diagram of another flexible display panel provided in an embodiment of the present application;
fig. 7 is a schematic structural diagram of another flexible display panel provided in an embodiment of the present application.
Description of reference numerals:
a: pixel area, B: opening area, C: isolation region, F1: occlusion position, F2: pore wall, F3: upper edge shielding structure, F4 bottom corner;
1-glass substrate, 2-flexible substrate, 21-first organic substrate, 22-second organic substrate, 3-thin film transistor layer, 31-thin film transistor, 4-flat layer, 5-first electrode, 6-pixel defining layer, 7-thin film encapsulation layer, 71-first inorganic encapsulation layer, 72-organic encapsulation layer, 721-mask part, 73-second inorganic encapsulation layer, 74-third inorganic encapsulation layer, 8-second electrode, 9-organic light emitting layer, 10-through hole, 101-hole bottom, 11-pixel unit, 111-first sub-pixel, 112-second sub-pixel, 113-third sub-pixel, 12-barrier layer, 13-support column, 14-isolation groove, 15-inorganic isolation layer, 16-organic isolation layer, 17-organic coating layer, 171-first subcoating layer, 172-second subcoating layer, 173-third subcoating layer, 18-first inorganic substrate.
Detailed Description
Fig. 1 is a schematic structural diagram of a flexible display panel provided in the related art, and fig. 2 is a cross-sectional view of the flexible display panel in fig. 1 at D-D when the flexible display panel is not separated from a glass substrate, as shown in fig. 1 and fig. 2, the flexible display panel includes a flexible substrate 2, a pixel unit and a through hole 10, the flexible substrate 2 includes a pixel Area a and an opening Area B, the pixel unit is disposed in the pixel Area a of the flexible substrate 2, a plurality of pixel units form a pixel array on one side of the flexible substrate 2, and the pixel array defines an effective display Area (AA) of the flexible display panel.
The flexible substrate 2 is provided with a through hole 10 penetrating the flexible substrate 2 in the opening region B, and the through hole 10 is a micropore having a size corresponding to the pixel cell 11. The region corresponding to the through hole 10 is the opening region B, the opening region B is located between the pixel regions a, and both the opening region B and the pixel regions a are located in the AA region of the flexible display panel.
The through hole 10 is stretched and deformed when the flexible substrate 2 is bent, and the stretching and deformation of the through hole 10 drives the pixel region a where the pixel unit is located to be stretched and rotated, so that a larger deformation amount compared with a material limit is realized.
The main process steps for manufacturing the flexible display panel are as follows:
step S1: providing a glass substrate 1, and manufacturing a back plate on the glass substrate 1;
the step of fabricating the backplane generally includes fabricating the flexible substrate 2, and as can be seen from the above description, the flexible substrate 2 includes a pixel region a and an opening region B; step S1 further includes forming thin-film transistor layer 3, planarization layer 4, first electrode 5, and pixel defining layer 6 in pixel region a.
Step S2: etching the opening area B of the flexible substrate 2 to form a through hole 10;
step S3: an organic light emitting layer 9 and a second electrode 8 are vapor-deposited on the pixel defining layer 6;
step S4: packaging by adopting a thin film packaging layer 7;
step S5: etching to remove the material between the bottom 101 of the through hole 10 and the glass substrate 1;
step S6: the glass substrate 1 and the flexible substrate 2 are separated using a laser lift-off apparatus.
However, in practice it has been found that the above process steps have certain drawbacks.
When the through hole 10 is etched in step S2, the flexible substrate 2 forms the upper edge shielding structure F3 due to the side etching, the upper edge shielding structure F3 shields a region of the bottom 101 of the through hole 10 near the bottom corner F4, which is defined as a shielding position F1, that is, when viewed from above to below the flexible substrate 2, the shielding position F1 is shielded by the upper edge shielding structure F3, and the shielding position F1 cannot be exposed upwards along the through hole 10. Therefore, when the organic material is deposited on the glass substrate 1 in the hole bottom 101 of the through hole 10, the vapor deposition at the shielding position F1 is not performed, and a complete and continuous organic film layer cannot be formed on the glass substrate 1 in the hole bottom 101 of the through hole 10.
When the film encapsulation is performed on this basis, the film encapsulation layer 7 directly contacts the glass substrate 1 at the shielding position F1 when extending to the bottom 101 along the hole wall F2 of the through hole 10, and the direct contact between the inorganic encapsulation layer in the film encapsulation layer 7 and the glass substrate 1 affects the laser lift-off in step S6, which causes difficulty in lift-off and affects the integrity of the flexible substrate 2 after lift-off.
In view of this, the present disclosure provides a method for manufacturing a flexible display panel, in the manufacturing process, before the thin film encapsulation process, an organic material is used to encapsulate the hole wall F2 of the through hole 10, so as to form an organic encapsulation layer, and the thin film encapsulation layer 7 is disposed on a side of the organic encapsulation layer away from the hole wall F2. Because the organic coating layer has a certain thickness, the thin film encapsulation layer 7 is farther away from the hole wall F2 compared with the embodiment shown in fig. 1 and 2, so that the contact area between the thin film encapsulation layer 7 and the glass substrate 1 at the shielding position F1 is reduced, and even the direct contact between the thin film encapsulation layer 7 and the glass substrate 1 can be avoided, so that the peeling difficulty between the flexible substrate 2 and the glass substrate 1 can be reduced, the flexible substrate 2 and the glass substrate 1 can be peeled off easily, the damage separation can be realized, and the structural integrity of the flexible substrate 2 is ensured.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 3 is a schematic structural diagram of a flexible display panel according to an embodiment of the present disclosure, fig. 4 is a cross-sectional view D-D in fig. 3, and fig. 5 is a schematic structural diagram of the flexible display panel and a glass substrate in fig. 4; as shown in fig. 3 to 5, the flexible display panel includes a flexible substrate 2, a pixel unit 11, and a through hole 10. The flexible substrate 2 is a flexible plate-shaped structure capable of being bent, and includes a first surface and a second surface opposite to each other. Taking the orientation shown in fig. 4 as an example, the flexible substrate 2 is horizontally and laterally placed, and the first surface is located above the second surface, that is, the direction between the first surface and the second surface is the up-down direction, which is also the thickness direction of the flexible substrate 2, which is also the direction perpendicular to the flexible substrate 2. It can be understood that the direction between the first surface and the second surface is parallel to the light exit direction of the flexible display panel.
The flexible substrate 2 may be made of a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP). In the present embodiment, the flexible substrate 2 is made of polyimide PI.
The flexible substrate 2 is provided with a plurality of pixel units 11 on a first surface, the plurality of pixel units 11 are arranged on the flexible substrate 2 in an array manner to form a pixel array, and an area corresponding to the pixel array is an effective display area (AA area) of the flexible display panel. The pixel unit 11 may be an OLED (Organic Light-Emitting Diode), a Mini LED (sub-millimeter Light-Emitting Diode) or a Micro LED (Micro Light-Emitting Diode), and the pixel unit 11 is described as an OLED pixel unit.
The pixel unit 11 includes a plurality of sub-pixels, and the sub-pixels are light emitting devices capable of emitting a single color, for example, in the embodiment shown in fig. 3, the pixel unit 11 includes a first sub-pixel 111, a second sub-pixel 112, and a third sub-pixel 113, the first sub-pixel 111 is a G sub-pixel capable of emitting green light, the second sub-pixel 112 is an R sub-pixel capable of emitting red light, and the third sub-pixel 113 is a B sub-pixel capable of emitting blue light. When the flexible display panel displays, color display is realized by controlling the light emission of each sub-pixel.
The flexible substrate 2 is provided with a barrier layer 12, a thin-film transistor layer 3, a planarization layer 4, a pixel unit 11, and a thin-film encapsulation layer 7 on one side of the first surface. Among them, the barrier layer 12, i.e., the inorganic insulating film layer, may include an inorganic material such as an oxide or a nitride, and may include a plurality of layers or a single layer including the inorganic material, isolate the flexible substrate 2 and the structures on the flexible substrate 2, reduce or block permeation of foreign substances, moisture, or external air from below the flexible substrate 2 using material characteristics of the inorganic material, and may provide a flat surface.
Thin-film transistor layer 3 is located above barrier layer 12, and includes thin-film transistor 31 and pixel circuit, and the pixel circuit includes data line and scan line arranged in a crossing manner. The thin film transistor 31 may be a top gate type, a bottom gate type, or a double gate type, and the embodiment of the present application does not limit the specific type of the thin film transistor.
A flat layer 4 is arranged above the thin film transistor layer 3, the flat layer 4 covers the thin film transistor layer 3, and a flat surface is arranged on one side far away from the thin film transistor layer 3 and facilitates the manufacturing and forming of the structure above the flat surface. Planar layer 4 has a first opening that is through thin-film-transistor layer 3.
Above the planarization layer 4 is disposed a pixel defining layer 6, the pixel defining layer 6 having a second opening.
The pixel cell 11 comprises a first electrode 5, an intermediate layer and a second electrode 8, the intermediate layer being located between the first electrode 5 and the second electrode 8. The first electrode 5 is disposed between the planarization layer 4 and the pixel defining layer 6, opposite the second opening, and is connected to the pixel circuit in the thin-film transistor layer 3 through the first opening. The intermediate layer is located in the second opening and the second electrode 8 is located on the opposite side of the intermediate layer to the first electrode 5.
The intermediate layer includes the organic light emitting layer 9, and may further include a common layer common to the sub-pixels in the pixel unit 11, and the common layer may be at least one of a Hole Transport Layer (HTL), a Hole Injection Layer (HIL), an Electron Transport Layer (ETL), and/or an Electron Injection Layer (EIL).
In this embodiment, the first electrode 5 is an anode, the second electrode 8 is a cathode, and an organic light emitting layer, a common layer, a cathode, and a light modulation layer are sequentially disposed above the anode, wherein the light modulation layer is disposed on a side of the cathode away from the intermediate layer, and is used for modifying and adjusting light emitted by the organic light emitting layer to improve a display effect. The organic light-emitting layer 9, the common layer, the cathode, and the light-adjusting layer are formed by vapor deposition.
A supporting column 13 is arranged on the pixel defining layer 6 outside the second opening, the supporting column 13 extends upwards along the thickness direction of the flexible substrate 2, and the top end far away from the pixel defining layer 6 is used for supporting a mask plate used for evaporating the organic light-emitting layer 9.
The flexible substrate 2 is provided with through holes 10 in the regions between the pixel units 11, the through holes 10 penetrate through the flexible substrate 2 in the thickness direction of the flexible substrate 2, the end surfaces of the through holes 10 close to the second surface are defined as hole bottoms 101 of the through holes 10, and the positions of the hole walls F2 of the through holes 10 close to the second surface are defined as bottom angles F4.
Herein, the area of the flexible substrate 2 and the pixel unit 11 is defined as a pixel area a, and the area having the through hole 10 is called an opening area B, the opening area B and the pixel area a are both located in an AA area of the flexible display panel, and the opening area B is located in an area between the pixel areas a in the effective display area.
The through holes 10 are stretched and deformed when the flexible substrate 2 is bent, and the stretching deformation of the through holes 10 drives the pixel units 11 in the pixel area a to be stretched and rotated, so that a larger deformation amount than a material limit is realized.
The flexible display panel comprises a film packaging layer 7, wherein the film packaging layer 7 covers the top of a pixel unit 11 to realize the sealing and packaging of the pixel unit 11; the film encapsulation layer 7 extends along the hole wall F2 of the through hole 10 to the hole bottom 101. The thin film packaging layer 7 comprises an organic packaging layer and an inorganic packaging layer which are alternately arranged, and the inorganic packaging layer can be made of SiNx, SiCN or SiO2Etc., the material of the organic encapsulation layer may be an acrylic-based polymer, a silicon-based polymer, etc. The inorganic packaging layer has good water oxygen barrier property, and the organic packaging layer can well absorb and disperse stress between layers, so that the situation that the dense inorganic packaging layer generates cracks to reduce the water oxygen barrier property is avoided.
As shown in fig. 4, in the present embodiment, the thin film encapsulation layer 7 includes a first inorganic encapsulation layer 71, an organic encapsulation layer 72 and a second inorganic encapsulation layer 73, and the first inorganic encapsulation layer 71 and the second inorganic encapsulation layer 73 are disposed on two sides of the organic encapsulation layer 72 and seal-wrap the organic encapsulation layer 72 to fully exert the water blocking performance of the inorganic encapsulation layer.
As can be seen from the foregoing description, the through hole 10 is obtained by etching the flexible substrate 2, however, the through hole 10 may generate the upper edge shielding structure F3 due to lateral erosion, and the upper edge shielding structure F3 protrudes toward the axial line position of the through hole 10 relative to the hole wall F2. In the direction that the first surface points to the second surface, the through hole 10 is shielded along the shielding structure F3 at the shielding position F1 on the bottom 101 of the through hole 10.
In addition, the wall F2 of the through hole 10 generated by etching is rough, which causes poor coverage of the thin film encapsulation layer 7 on the sidewall of the through hole 10, thereby reducing the encapsulation reliability.
In the flexible display panel provided in the embodiment of the present application, the hole wall F2 and the shielding position F1 of the through hole 10 are coated with an organic material, so that the organic coating layer 17 is formed. The organic material forming the organic coating layer 17 may be selected according to an actual process, and for example, a resin-based photoresist may be selected.
The organic coating layer 17 extends along the hole wall F2 of the through hole 10, covers the rough wall surface of the hole wall F2 and has a smooth contact surface outside the hole wall F2, and when the thin film encapsulation layer 7 extends along the hole wall F2, the thin film encapsulation layer contacts with the smooth contact surface of the organic coating layer 17, so that the encapsulation reliability can be ensured.
The organic coating 17 extends along the hole wall F2 of the through-hole 10 to the hole bottom 101 and extends from the hole wall F2 at the hole bottom 101 towards the middle of the through-hole 10 along the first surface, i.e. towards the middle of the through-hole 10 along the first surface at the location of the bottom corner F4 of the through-hole 10. The end of the organic clad 17 away from the hole wall F2 of the through hole 10 is aligned with the upper edge shielding structure F3 in the up-down direction of the flexible substrate 2 or exceeds the shielding of the upper edge shielding structure F3. That is, the organic coating layer 17 can cover the portion of the glass substrate 1 where the hole bottom 101 of the through hole 10 is shielded by the upper edge shielding structure F3, that is, the glass substrate 1 at the shielding position F1. The organic coating layer 17 is matched with the organic film layer of the hole bottom 101 through evaporation, and a complete and continuous organic film layer corresponding to the hole bottom 101 of the through hole 10 is formed on the glass substrate 1, so that the direct contact between the film packaging layer 7 and the glass substrate is avoided, the peeling difficulty of the flexible substrate 2 and the glass substrate 1 is reduced, the flexible substrate 2 and the glass substrate 1 can be easily peeled, the damage separation can be realized, and the structural integrity of the flexible substrate 2 is further ensured.
In the above embodiment, the organic coating 17 is used to cover the shielding position F1 and the hole wall F2, and the organic coatings at the shielding position F1 and the hole wall F2 may have the same structure or two structures. However, the embodiment of the present application is not limited to this, and for example, if only the problem of difficulty in peeling is to be solved, the organic clad layer 17 may be provided only at the shielding position F1.
In addition, the organic encapsulating layer 17 can cover the shielding position F1, or exceed the shielding position F1, which is a preferred embodiment, but when the organic encapsulating layer 17 partially covers the shielding position F1, the organic encapsulating layer 17 can still reduce the difficulty of peeling the flexible substrate 2 from the glass substrate 1, so that the flexible substrate 2 can be easily peeled from the glass substrate 1, and the structural integrity of the flexible substrate 2 can be ensured to a certain extent, compared with the embodiment shown in fig. 1 and 2.
For another example, in a possible embodiment, the organic encapsulating layer 17 may be disposed only on the hole wall F2, which can solve the problem of reliability of the encapsulation of the etched hole wall F2 by the thin film encapsulation layer 7. Moreover, since the organic coating layer 17 has a certain thickness, the thin film encapsulation layer 7 is farther away from the hole wall F2 than in the embodiment shown in fig. 1 and 2, so that the contact area between the thin film encapsulation layer 7 and the glass substrate 1 at the shielding position F1 is reduced, and even the thin film encapsulation layer 7 and the glass substrate 1 can be prevented from directly contacting, so that the difficulty in peeling the flexible substrate 2 from the glass substrate 1 can be reduced, the flexible substrate 2 and the glass substrate 1 can be easily peeled, the damage separation can be realized, and the structural integrity of the flexible substrate 2 is ensured.
It should be noted that the organic cladding layer 17 is partially removed during the manufacturing process of the flexible display panel, and therefore, in some embodiments, the organic cladding layer 17 may not embody all the structural features described above, but the organic cladding layer 17 should be disposed on the hole wall F2 of the through hole 10 and between the hole wall F2 and the thin film encapsulation layer 7.
In order to prevent water and oxygen from entering the organic light emitting material from the through hole 10, the flexible display panel provided in the embodiment of the present application is provided with the isolation groove 14 at the periphery of the through hole 10. As shown in fig. 3 and 5, the region defining the periphery of the through hole 10 is an isolation region C, the side of the barrier layer 12 away from the flexible substrate 2 is provided with an organic isolation layer 16 and an inorganic isolation layer 15 in the isolation region C, the organic isolation layer 16 and the inorganic isolation layer 15 are etched around the periphery of the through hole 10 to form an isolation trench 14, and the opening direction of the isolation trench 14 is upward along the thickness direction of the flexible substrate 2, that is, the second surface is directed toward the first surface. The organic isolation layer 16 may be made of the same material as the planarization layer 4 or the pixel defining layer 6.
The organic light-emitting layer 9 and the second electrode 8 are separated by the isolation groove 14, that is, by the sidewall of the isolation groove 14 close to the organic light-emitting layer 9; the thin film encapsulation layer 7 is continuous within the isolation trench 14.
By arranging the isolation groove 14, the organic light-emitting material and the through hole 10 can be isolated, so that a transmission path of water vapor is isolated, water and oxygen invasion from the through hole 10 is blocked, and the display effect and the display reliability of the pixel unit 11 are ensured.
The isolation trench 14 is formed by etching, and similarly to the through hole 10, a side etching structure is formed on the side wall, in which the projection area of the inorganic isolation layer 15 to the bottom of the isolation trench 14 in the direction opposite to the opening direction of the isolation trench is not smaller than the projection area of the organic isolation layer 16 to the bottom of the isolation trench 14. By such an arrangement, the isolation effect of the inorganic isolation layer 15 can be ensured, and meanwhile, when the thin film package is performed, the side etching structure can effectively prevent the organic package layer 72 from flowing into the through hole 10, so that the inorganic package layer coats the organic package layer 72.
Fig. 6 is a schematic structural diagram of another flexible display panel provided in an embodiment of the present application, and as shown in fig. 6, the present embodiment is different from the above embodiments in that the flexible substrate 2 has a double-layer structure and includes a first organic substrate 21 and a second organic substrate 22, and a first inorganic substrate 18 disposed between the first organic substrate 21 and the second organic substrate 22. The first organic substrate 21 and the second organic substrate 22 may be made of a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP). In the present embodiment, the first organic substrate 21 and the second organic substrate 22 are both made of polyimide PI. The first inorganic substrate 18 may include an inorganic material such as an oxide or a nitride, and may include a plurality of layers or a single layer including the inorganic material, and the first organic substrate 21 and the second organic substrate 22 are separated using a material property of the inorganic material.
Taking the orientation shown in fig. 6 as an example, the first organic substrate 21 is located above the first inorganic substrate 18, and the second organic substrate 22 is located below the first inorganic substrate 18. Corresponding to the double-layer structure, the organic cladding layer includes a first cladding layer 171 and a second cladding layer 172, the first cladding layer 171 covers a portion of the hole wall F2 corresponding to the first organic substrate 21, and the second cladding layer 172 covers a portion of the hole wall F2 corresponding to the second organic substrate 22. The first inorganic substrate 18, the inorganic insulating film layer (barrier layer 12), and the first and second subcoating layers have an overlap in a direction perpendicular to the flexible substrate.
The inorganic insulating film layer further has a third coating layer 173, the third coating layer 173 is located on one side of the isolation trench 14 close to the through hole 10, and the third coating layer 173 is an ineffective structure left by the organic coating layer 17 during manufacturing.
Fig. 7 is a schematic structural diagram of another flexible display panel provided in an embodiment of the present application, and as shown in fig. 7, the flexible display panel in this embodiment is different from the flexible display panel in fig. 6 in a thin film encapsulation layer 7. In the embodiment, the thin film encapsulation layer 7 includes an organic encapsulation layer 72 and a third inorganic encapsulation layer 74, the organic encapsulation layer 72 is disposed above the third inorganic encapsulation layer 74, and the third inorganic encapsulation layer 74 plays a main role in blocking water from the front side and blocking the organic layer. The outer side of the organic encapsulation layer 72 has an outer side surface parallel to the first surface, so that the organic encapsulation layer has a flat surface and covers foreign matters.
Further, the organic encapsulation layer 74 has a mask portion 721 located at the through hole, and the mask portion 721 is a mask structure for etching the material of the bottom 101 of the through hole 10.
The embodiment of the application also provides a manufacturing method, which comprises the following steps:
step S10: providing a glass substrate;
step S20: manufacturing a back plate on a glass substrate;
the backplane includes a flexible substrate having a pixel region and an opening region, the flexible substrate being provided with a pixel unit in the pixel region, and thus step S20 includes: manufacturing a flexible substrate on a glass substrate, and manufacturing a thin film substrate tube layer, a flat layer, a first electrode and a pixel defining layer on a pixel area of the flexible substrate;
step S30: etching the opening area of the flexible substrate to form a through hole;
step S40: coating the through hole with an organic material to form an organic coating layer;
the organic coating layer extends from the hole wall to a bottom corner close to the bottom of the through hole and extends from the bottom corner to the inside of the through hole;
step S40: evaporating an organic light-emitting layer and a second electrode above the first electrode;
step S50: packaging by adopting a thin film packaging layer, wherein the thin film packaging layer extends to the bottom of the through hole along the hole wall of the through hole and is positioned on one side of the organic coating layer away from the glass substrate;
step S60: etching to remove the material between the through hole and the glass substrate;
step S70: and separating the glass substrate and the flexible substrate by using laser stripping equipment.
The manufacturing method is adopted to manufacture the flexible display panel, and the through hole is organically coated before film packaging to form the organic coating layer, so that the contact area of the film packaging layer and the glass substrate is reduced or the contact between the film packaging layer and the glass substrate is avoided during film packaging, the separation difficulty between the glass substrate and the flexible substrate is reduced, the flexible substrate and the glass substrate can be easily peeled off, the damage separation can be realized, and the structural integrity of the flexible substrate is further ensured.
In the above manufacturing method, a support pillar is further manufactured on the pixel defining layer, and the support pillar supports a mask plate for manufacturing the organic light emitting layer. In a possible implementation mode, the supporting column and the organic coating layer are manufactured in the same layer, and the arrangement is that the organic coating layer is manufactured by using the existing equipment and process, the equipment investment is avoided, the process section is not required to be increased, and the feasibility and the production efficiency are high.
In one possible embodiment, the organic coating layer is made of resin photoresist liquid coating.
The embodiment of the present application also provides a display device, where the display device includes the flexible display panel in the above embodiments, and the display device may be a mobile phone, a foldable watch, or a foldable tablet, etc.
In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the embodiments of the present application and simplifying the description, but do not indicate or imply that the referred devices or elements must have specific orientations, be configured in specific orientations, and operate, and thus, should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the present application described above can be combined with each other as long as they do not conflict with each other.
So far, the technical solutions of the embodiments of the present application have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the embodiments of the present application is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the embodiments of the present application, and the technical solutions after the changes or substitutions will fall within the protection scope of the embodiments of the present application.

Claims (20)

1. A flexible display panel, characterized by: the pixel structure comprises a flexible substrate, wherein the flexible substrate comprises a first surface and a second surface which are opposite, and a thin film transistor layer, a pixel unit and a thin film packaging layer are stacked on the first surface of the flexible substrate;
the flexible substrate is provided with a through hole at one side of the thin film transistor layer and the pixel unit, the through hole penetrates through the flexible substrate along the direction between the first surface and the second surface, and the thin film packaging layer extends along the hole wall of the through hole;
the flexible display panel further comprises an organic coating layer arranged on the hole wall, and the thin film packaging layer is located on the side face, far away from the hole wall, of the organic coating layer.
2. The flexible display panel of claim 1, wherein: the organic coating layer covers the hole wall and extends from the hole wall toward the inside of the through hole.
3. The flexible display panel of claim 2, wherein: the through-hole comprises a hole bottom close to the second surface, and the hole wall is provided with a bottom corner close to the hole bottom; the organic clad layer extends from the hole wall to the base corner and extends from the base corner toward the inside of the through hole.
4. The flexible display panel of claim 3, wherein: the flexible substrate is provided with an upper edge shielding structure which protrudes towards the inside of the through hole relative to the hole wall; and the tail end of the organic coating layer, which is far away from the hole wall, is flush with the upper edge shielding structure or exceeds the upper edge shielding structure along the direction from the first surface to the second surface.
5. The flexible display panel of claim 1, wherein: the organic coating layer includes a resinous organic material.
6. The flexible display panel of claim 1, wherein: the film packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are stacked, wherein the first inorganic packaging layer and the second inorganic packaging layer are arranged on two sides of the organic packaging layer and are used for sealing and coating the organic packaging layer.
7. The flexible display panel of claim 1, wherein: the film packaging layer comprises an inorganic packaging layer and an organic packaging layer which are stacked, the inorganic packaging layer is hermetically coated on the outer side of the pixel unit and the hole wall, and the organic packaging layer is coated on one side, far away from the flexible substrate, of the inorganic packaging layer.
8. The flexible display panel of any one of claims 1-7, wherein: the flexible substrate is provided with an organic isolation layer and an inorganic isolation layer which surround the through hole in a stacking mode on the first surface, isolation grooves are formed in the organic isolation layer and the inorganic isolation layer, the opening direction of the isolation grooves is the direction of the second surface pointing to the first surface, and the isolation grooves extend around the periphery of the through hole.
9. The flexible display panel of claim 8, wherein: along the opposite direction of the opening direction, the projection area of the inorganic isolation layer to the bottom of the isolation groove is not smaller than the projection area of the organic isolation layer to the bottom of the isolation groove.
10. The flexible display panel of claim 8, wherein: the flexible display panel comprises a flat layer and a pixel defining layer, wherein the flat layer and the pixel defining layer are stacked on the thin film transistor layer, a first opening is formed in the flat layer, and a second opening is formed in the pixel defining layer;
the pixel unit comprises a first electrode, a second electrode and an organic light-emitting layer arranged between the first electrode and the second electrode; the first electrode is arranged on the flat layer, is opposite to the second opening and is connected with the pixel circuit in the thin film transistor layer through the first opening; the organic light emitting layer and the second electrode are disposed in the second opening.
11. The flexible display panel of claim 10, wherein: the first electrode is an anode, the second electrode is a cathode, the organic light-emitting layer and the cathode are disconnected on the side wall of the isolation groove, and the thin film packaging layer is continuous in the isolation groove.
12. The flexible display panel of claim 10, wherein: the organic isolation layer and the flat layer or the pixel defining layer are arranged in the same layer and the same material.
13. The flexible display panel of claim 10, wherein: support posts are disposed on the pixel defining layer.
14. The flexible display panel of claim 1, wherein: the flexible substrate comprises a first organic substrate, a first inorganic substrate and a second organic substrate which are arranged in a stacked mode; the organic coating layer comprises a first subcoating layer and a second subcoating layer, the first subcoating layer covers the parts, corresponding to the first organic substrate, of the hole walls, and the second subcoating layer covers the parts, corresponding to the second organic substrate, of the hole walls.
15. The flexible display panel of claim 14, wherein: the first inorganic substrate has an overlap with the first subcoating layer and the second subcoating layer in a direction perpendicular to the flexible substrate.
16. The flexible display panel according to claim 14 or 15, wherein: an inorganic insulating film layer is arranged on one side, away from the first inorganic substrate, of the first organic substrate, a flat layer is arranged on the inorganic insulating film layer, and pixel units are arranged on the flat layer; the inorganic insulating film layer has an overlap with the first sub-coating layer in a direction perpendicular to the flexible substrate.
17. A manufacturing method of a flexible display panel is characterized by comprising the following steps:
providing a glass substrate;
manufacturing a back plate on the glass substrate; the back plate comprises a flexible substrate, wherein the flexible substrate is provided with a pixel area and an opening area, and a thin film substrate tube layer, a flat layer, a first electrode and a pixel defining layer are arranged on the flexible substrate in a stacking mode in the pixel area;
etching the opening region of the flexible substrate to form a through hole;
coating the hole wall of the through hole by adopting an organic material to form an organic coating layer, wherein the organic coating layer extends from the hole wall to a bottom corner close to the bottom of the through hole and extends from the bottom corner to the inside of the through hole;
evaporating an organic light-emitting layer and a second electrode above the first electrode;
packaging by adopting a thin film packaging layer, wherein the thin film packaging layer extends to the bottom of the hole along the hole wall and is positioned on one side of the organic coating layer away from the glass substrate;
etching to remove the material between the through hole and the glass substrate;
and separating the glass substrate and the flexible substrate by adopting laser stripping equipment.
18. The method of claim 17, further comprising forming a support pillar on the pixel defining layer, the support pillar supporting a mask for forming the organic light emitting layer;
the support column and the organic coating layer are made of the same material at the same layer.
19. The method of manufacturing according to claim 17 or 18, wherein: the organic coating layer is made by resin photoresist liquid coating.
20. A display device characterized by comprising the flexible display panel according to any one of claims 1 to 16.
CN202110145955.6A 2021-02-02 2021-02-02 Flexible display panel, manufacturing method and display device Active CN112993180B (en)

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