CN112992766A - Carrier for substrate surface treatment - Google Patents
Carrier for substrate surface treatment Download PDFInfo
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- CN112992766A CN112992766A CN202110181120.6A CN202110181120A CN112992766A CN 112992766 A CN112992766 A CN 112992766A CN 202110181120 A CN202110181120 A CN 202110181120A CN 112992766 A CN112992766 A CN 112992766A
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- substrate
- loading plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors and display panels, in particular to a carrier for substrate surface treatment, which comprises a substrate carrier, a lifting arm and a loading plate, wherein the lifting arm and the loading plate are connected with each other; the first vacuum assembly is arranged on the loading plate, and the substrate is adsorbed on the loading plate through the first vacuum assembly; the protective cover is in a square shape and provided with an annular hollow cavity, the protective cover is arranged on the loading plate, the first electric conductor is positioned in the hollow cavity, the protective cover is arranged along the circumferential direction of the substrate, the inner ring of the protective cover is abutted against the substrate, and the outer ring of the protective cover is abutted against the loading plate, so that the hollow cavity is in a sealed state; and the second conductor is positioned in the hollow cavity, one end of the second conductor is electrically connected with the first conductor, and the other end of the second conductor is electrically connected with the technical surface of the substrate. The invention can facilitate the process production.
Description
Technical Field
The invention relates to the technical field of semiconductors and display panels, in particular to a carrier for substrate surface treatment.
Background
In the field of semiconductor and display panels, it is often necessary to process and inspect substrates to ensure the display effect after the display panel is manufactured. When a substrate is processed, a process surface of the substrate needs to be immersed in a chemical solution, and then the process surface of the substrate is electrified for chemical deposition. In the prior art, a clamp is usually adopted to clamp a substrate and place the substrate into a tank filled with a chemical solution, and the mode can only deal with products which are relatively extensive and have no high requirements on process results, and cannot be applied to the field of high-requirement semiconductors and display panels. .
Therefore, a carrier for substrate surface treatment is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a carrier for substrate surface treatment, which can electrify the substrate surface and carry out high-precision process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a carrier for substrate surface treatment, comprising:
the substrate carrier comprises a suspension arm and a loading plate which are connected with each other, and a first conductor is arranged on the loading plate;
the first vacuum assembly is arranged on the loading plate, and the substrate is adsorbed on the loading plate through the first vacuum assembly;
the protective cover is in a square shape and provided with an annular hollow cavity, the protective cover is arranged on the loading plate, the first electric conductor is positioned in the hollow cavity, the protective cover is arranged along the circumferential direction of the substrate, the inner ring of the protective cover is abutted against the substrate, and the outer ring of the protective cover is abutted against the loading plate, so that the hollow cavity is in a sealed state;
and one side of the protective cover facing the substrate is provided with the second conductor, the second conductor is positioned in the hollow cavity, one end of the second conductor is electrically connected with the first conductor, and the other end of the second conductor is electrically connected with the technical surface of the substrate.
Further, still include second vacuum assembly, second vacuum assembly sets up on the load board, and with the cavity intercommunication of safety cover, the safety cover passes through second vacuum assembly adsorbs on the load board.
Further, the first vacuum assembly includes:
the first vacuum chuck is arranged on one side, facing the substrate, of the loading plate;
the first vacuum piece is arranged on the suspension arm and communicated with the first vacuum chuck, and the first vacuum piece can be communicated with an external vacuum device;
and the first vacuum holding piece is arranged between the first vacuum suction cup and the first vacuum piece and used for holding the vacuum degree of the first vacuum suction cup.
Further, the first vacuum suction cups are arranged on the loading plate at intervals.
Further, the safety cover includes first sealing washer, second sealing washer and mounting, the mounting is the square, first sealing washer is followed the inner circle setting of mounting is in on the mounting, the second sealing washer is followed the outer lane setting of mounting is in on the mounting, first sealing washer with the second sealing washer is all relative one side protrusion of mounting, first sealing washer the second sealing washer with the mounting encloses to establish and forms well cavity, the second electric conductor sets up on the mounting, first sealing washer with the base plate butt, the second sealing washer with load the board butt, the mounting sets up on the load board.
Furthermore, a positioning column is arranged on one side, facing the loading plate, of the fixing piece, a positioning hole matched with the positioning column is formed in the loading plate, and the positioning column is inserted into the positioning hole.
Furthermore, the positioning columns are arranged along the circumferential direction of the fixing piece at intervals, and the positioning holes are arranged along the circumferential direction of the loading plate at intervals and are in one-to-one correspondence with the positioning columns.
Furthermore, the vacuum substrate processing device also comprises a third vacuum assembly which is arranged on the substrate carrier, is communicated with the hollow cavity and is used for keeping the vacuum degree of the hollow cavity.
Furthermore, a third conductor is arranged on the suspension arm, and the third conductor is electrically connected with an external power supply and the first conductor.
Furthermore, a plurality of hooks are arranged on the suspension arm at intervals along the axial direction of the suspension arm.
The invention has the beneficial effects that:
the invention provides a carrier for substrate surface treatment, which is characterized in that a loading plate is provided with a first vacuum assembly, a substrate is adsorbed on the loading plate through the first vacuum assembly, the substrate is conveniently fixed on the loading plate through the arrangement of the first vacuum assembly, the loading plate is provided with a first electric conductor, a hollow cavity of a protective cover is provided with a second electric conductor, one end of the second electric conductor is electrically connected with the first electric conductor, and the other end of the second electric conductor is electrically connected with a process surface of the substrate, so that the substrate is electrified.
Drawings
FIG. 1 is a schematic view of a carrier for substrate surface treatment according to the present invention;
FIG. 2 is a schematic view of a protective cover of a carrier for surface treatment of a substrate according to the present invention.
In the figure:
1. a substrate carrier; 11. a loading plate; 12. a suspension arm; 121. hooking; 2. a protective cover; 21. a fixing member; 22. a second electrical conductor; 23. a first seal ring; 24. a second seal ring; 25. a positioning column; 3. a first vacuum assembly; 31. a gas supplementing block; 32. an air tap; 33. a first vacuum chuck; 4. a third electrical conductor; 5. a third vacuum assembly; 6. a wireless control module; 7. a second vacuum assembly.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings and the embodiment. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In order to energize the substrate surface and perform a high precision process, as shown in fig. 1-2, the present invention provides a carrier for substrate surface treatment. The carrier for substrate surface treatment comprises: a substrate carrier 1, a first vacuum assembly 3, a protective cover 2, a first electrical conductor and a second electrical conductor 22.
The substrate carrier 1 comprises a suspension arm 12 and a loading plate 11 which are connected with each other, and a first conductor is arranged on the loading plate 11; the first vacuum assembly 3 is arranged on the loading plate 11, and the substrate is adsorbed on the loading plate 11 through the first vacuum assembly 3; the protective cover 2 is in a shape of a square and is provided with an annular hollow cavity, the protective cover 2 is arranged on the loading plate 11, the first electric conductor is positioned in the hollow cavity, the protective cover 2 is arranged along the circumferential direction of the substrate, the inner ring of the protective cover 2 is abutted against the substrate, and the outer ring of the protective cover 2 is abutted against the loading plate 11, so that the hollow cavity is in a sealed state; a second conductor 22 is arranged on one side of the protective cover 2 facing the substrate, the second conductor 22 is positioned in the hollow cavity, one end of the second conductor is electrically connected with the first conductor, and the other end of the second conductor is electrically connected with the technical surface of the substrate.
Through setting up first vacuum assembly 3, the fixed base plate on loading board 11, set up first electric conductor on loading board 11, be provided with second electric conductor 22 in the cavity of protective cover 2, the one end and the first electric conductor electricity of second electric conductor 22 are connected, the other end is connected with the technology face electricity of base plate, the realization is to the circular telegram of base plate, because first electric conductor and second electric conductor 22 all are located the cavity of protective cover 2, and cavity is in encapsulated situation, can guarantee that first electric conductor and second electric conductor 22 are not corroded by chemical solution, through the aforesaid setting, guarantee to satisfy the technology demand of base plate.
Further, the first vacuum assembly 3 includes: a first vacuum chuck 33, a first vacuum member and a first vacuum holder. Wherein, the first vacuum chuck 33 is arranged on the side of the loading plate 11 facing the substrate; a first vacuum is provided on the boom 12 and communicates with a first vacuum cup 33, which can communicate with an external vacuum device; the first vacuum maintaining member is disposed between the first vacuum suction cup 33 and the first vacuum member for maintaining the degree of vacuum of the first vacuum suction cup 33.
Specifically, the vacuum part comprises an air nozzle 32 and an air supplement block 31, the air supplement block 31 is fixedly arranged on the suspension arm 12 and is communicated with a first vacuum suction cup 33 through a pipeline, and the air nozzle 32 is arranged on the air supplement block 31 and is communicated with an external vacuum device. Air between the first vacuum chuck 33 and the substrate is evacuated by an external vacuum device, thereby firmly adsorbing the substrate on the loading plate 11. The vacuum degree of the first vacuum suction cup 33 can be ensured by the vacuum holder, and the vacuum failure due to leakage is prevented from causing accidents. In order to further ensure the vacuum degree, sealant is coated at the joints between the air supplement block 31 and the pipeline and between the pipeline and the first vacuum suction cup 33.
Further, a plurality of first vacuum suction cups 33 are provided at intervals on the loading plate 11. The absorption force to the substrate can be ensured to meet the requirement by arranging the plurality of first vacuum suction cups 33, so that the substrate is ensured to be stably arranged on the loading plate 11.
Further, the carrier for substrate surface treatment further comprises a second vacuum assembly 7, the second vacuum assembly 7 is arranged on the loading plate 11 and is communicated with the hollow cavity of the protection cover 2, and the protection cover 2 is adsorbed on the loading plate 11 through the second vacuum assembly 7. Through setting up second vacuum assembly 7, be convenient for fix the position of safety cover 2, realize the sealed between safety cover 2 and base plate and the loading plate 11, and can guarantee the vacuum of the vacuum cavity of safety cover 2. Specifically, the second vacuum assembly 7 has a similar structure to the first vacuum assembly 3, and is not described in detail herein.
Further, the protective cover 2 includes a first sealing ring 23, a second sealing ring 24 and a fixing member 21, the fixing member 21 is in a shape of a square, the first sealing ring 23 is disposed on the fixing member 21 along an inner ring of the fixing member 21, the second sealing ring 24 is disposed on the fixing member 21 along an outer ring of the fixing member 21, both the first sealing ring 23 and the second sealing ring 24 protrude from one side of the fixing member 21, the first sealing ring 23, the second sealing ring 24 and the fixing member 21 are surrounded to form a hollow cavity, the second conductor 22 is disposed on the fixing member 21, the first sealing ring 23 abuts against the base plate, the second sealing ring 24 abuts against the loading plate 11, and the fixing member 21 is disposed on the loading plate 11.
Specifically, the protective cover 2 is abutted to the substrate and the loading plate 11 through an external device, and by arranging the first sealing ring 23 and the second sealing ring 24, the first sealing ring 23 and the second sealing ring 24 are stressed to generate elastic deformation, so that a gap between the protective cover 2 and the substrate and the loading plate 11 is blocked, sealing of the hollow cavity is realized, and the first conductor and the second conductor 22 in the hollow cavity are protected.
In order to manufacture the protective cover 2, the fixing member 21 is composed of two fixing plates arranged in parallel at intervals, and the first sealing ring 23 and the second sealing ring 24 are clamped between the two fixing plates.
Furthermore, a positioning column 25 is disposed on one side of the fixing member 21 facing the loading plate 11, a positioning hole matched with the positioning column 25 is formed in the loading plate 11, and the positioning column 25 is inserted into the positioning hole. When the protection cover 2 is mounted on the loading plate 11, the fixing member 21 can be positioned so as to determine the relative position of the protection cover 2 on the loading plate 11.
Furthermore, a plurality of positioning columns 25 are arranged at intervals along the circumferential direction of the fixing member 21, and a plurality of positioning holes are arranged at intervals along the circumferential direction of the loading plate 11 and are arranged in one-to-one correspondence with the positioning columns 25. By providing a plurality of positioning posts 25 and positioning holes, the stability of the connection between the protective cover and the loading plate 11 can be ensured.
Further, the carrier for substrate surface treatment further includes a third vacuum assembly 5 disposed on the substrate carrier 1 and communicated with the hollow cavity for maintaining a vacuum degree of the hollow cavity. When testing the base plate, because the vacuum of second vacuum subassembly 7 can change to can not satisfy the requirement, at this moment, when monitoring the vacuum decline in the cavity through vacuum monitoring device, open third vacuum subassembly 5 and carry out the vacuum maintenance to the cavity, guarantee this a carrier for base plate surface treatment can normally work.
Specifically, the wireless control module 6 can be arranged on the suspension arm 12 to control the opening and closing of the first vacuum assembly 3, the second vacuum assembly 7 and the third vacuum assembly 5, and automatic control can be realized by arranging the wireless control module 6, so that the operation efficiency of the equipment is improved.
Further, a third conductor 4 is disposed on the boom 12, and the third conductor 4 is electrically connected to both the external power source and the first conductor. When the substrate is electrified, the third conductor 4 is only required to be connected with an external power supply, and the on-site wiring of an operator is not required, so that the off-line and efficient operation of the carrier is realized.
Further, a battery module can be disposed on the boom 12, and the battery module is electrically connected to the wireless control module 6, the third conductor 4 and the third vacuum assembly 5 for providing electric energy. In order to facilitate charging, a charging interface electrically connected with the storage battery module is further arranged on the suspension arm 12.
Further, in order to facilitate connection between the carrier for substrate surface treatment and an external mechanical structure and facilitate transportation, a plurality of hooks 121 are disposed on the suspension arm 12 at intervals along the axial direction of the suspension arm 12.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A carrier for substrate surface treatment, comprising:
the substrate carrier (1) comprises a suspension arm (12) and a loading plate (11) which are connected with each other, wherein a first conductor is arranged on the loading plate (11);
the first vacuum assembly (3) is arranged on the loading plate (11), and the substrate is adsorbed on the loading plate (11) through the first vacuum assembly (3);
the protective cover (2) is in a square shape and provided with an annular hollow cavity, the protective cover (2) is arranged on the loading plate (11), the first electric conductor is located in the hollow cavity, the protective cover (2) is arranged along the circumferential direction of the substrate, the inner ring of the protective cover (2) is abutted to the substrate, and the outer ring of the protective cover (2) is abutted to the loading plate (11), so that the hollow cavity is in a sealed state;
the second conductor (22) is arranged on one side, facing the substrate, of the protective cover (2), the second conductor (22) is located in the hollow cavity, one end of the second conductor is electrically connected with the first conductor, and the other end of the second conductor is electrically connected with the technical surface of the substrate.
2. The carrier for substrate surface treatment according to claim 1, further comprising a second vacuum assembly (7), wherein the second vacuum assembly (7) is disposed on the loading plate (11) and is communicated with the hollow cavity of the protective cover (2), and the protective cover (2) is adsorbed on the loading plate (11) through the second vacuum assembly (7).
3. Carrier for substrate surface treatment according to claim 1, characterized in that the first vacuum assembly (3) comprises:
a first vacuum chuck (33) provided on a side of the loading plate (11) facing the substrate;
a first vacuum provided on said boom (12) and communicating with said first vacuum cup (33), said first vacuum being able to communicate with an external vacuum device;
a first vacuum maintaining member disposed between the first vacuum suction cup (33) and the first vacuum member for maintaining a degree of vacuum of the first vacuum suction cup (33).
4. A carrier for substrate surface treatment according to claim 3, wherein the first vacuum chuck (33) is provided in plurality at intervals on the loading plate (11).
5. The carrier for substrate surface treatment according to claim 1, wherein the protective cover (2) comprises a first sealing ring (23), a second sealing ring (24) and a fixing member (21), the fixing member (21) is square-shaped, the first sealing ring (23) is disposed on the fixing member (21) along an inner ring of the fixing member (21), the second sealing ring (24) is disposed on the fixing member (21) along an outer ring of the fixing member (21), the first sealing ring (23) and the second sealing ring (24) are both protruded relative to one side of the fixing member (21), the first sealing ring (23), the second sealing ring (24) and the fixing member (21) are enclosed to form the hollow cavity, the second conductive body (22) is disposed on the fixing member (21), and the first sealing ring (23) is abutted to the substrate, the second seal ring (24) abuts against the loading plate (11), and the fixing member (21) is provided on the loading plate (11).
6. The carrier for the surface treatment of the substrate according to claim 5, wherein a positioning column (25) is disposed on a side of the fixing member (21) facing the loading plate (11), a positioning hole matched with the positioning column (25) is opened on the loading plate (11), and the positioning column (25) is inserted into the positioning hole.
7. The carrier for the surface treatment of the substrate according to claim 6, wherein the positioning pillars (25) are arranged at intervals along the circumferential direction of the fixing member (21), and the positioning holes are arranged at intervals along the circumferential direction of the loading plate (11) and are arranged in one-to-one correspondence with the positioning pillars (25).
8. A carrier for substrate surface treatment according to claim 3, further comprising a third vacuum assembly (5) provided on the substrate carrier (1) and communicating with the hollow cavity for maintaining a vacuum level of the hollow cavity.
9. A carrier for substrate surface treatment according to claim 1, characterized in that a third electrical conductor (4) is arranged on the boom (12), the third electrical conductor (4) being electrically connected to both the external power source and the first electrical conductor.
10. A carrier for substrate surface treatment according to claim 1, characterized in that a plurality of hooks (121) are provided at intervals on the boom (12) along the axis of the boom (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181120.6A CN112992766A (en) | 2021-02-09 | 2021-02-09 | Carrier for substrate surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181120.6A CN112992766A (en) | 2021-02-09 | 2021-02-09 | Carrier for substrate surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112992766A true CN112992766A (en) | 2021-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110181120.6A Pending CN112992766A (en) | 2021-02-09 | 2021-02-09 | Carrier for substrate surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112992766A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113755935A (en) * | 2021-09-30 | 2021-12-07 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
-
2021
- 2021-02-09 CN CN202110181120.6A patent/CN112992766A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113755935A (en) * | 2021-09-30 | 2021-12-07 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
| CN113755935B (en) * | 2021-09-30 | 2023-07-25 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
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