CN112992734B - Drying device for cleaning semiconductor wafer - Google Patents
Drying device for cleaning semiconductor wafer Download PDFInfo
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- CN112992734B CN112992734B CN202110173400.2A CN202110173400A CN112992734B CN 112992734 B CN112992734 B CN 112992734B CN 202110173400 A CN202110173400 A CN 202110173400A CN 112992734 B CN112992734 B CN 112992734B
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- 238000001035 drying Methods 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000004140 cleaning Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 238000007664 blowing Methods 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 239000000428 dust Substances 0.000 claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims description 68
- 230000005540 biological transmission Effects 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000003466 welding Methods 0.000 claims description 7
- 125000003003 spiro group Chemical group 0.000 claims description 3
- 238000007599 discharging Methods 0.000 abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a drying device for cleaning a semiconductor wafer, which comprises a drying box, a drying mechanism and a discharging mechanism, wherein the drying box mainly comprises supporting legs, a bottom plate, a shell, a top plate, a dust cover and a sealing door, the top of each supporting leg is connected with the bottom plate through a bolt, the outer side of the top of the bottom plate is connected with the shell through a bolt, and the top of the shell is connected with the top plate through a bolt. The wafer drying device can blow hot air to the upper center and the lower center of the wafer, water on the surface of the wafer flows outwards from the middle, so that the water drops, and then the residual water is evaporated and dried, so that the drying efficiency is improved; can also drive all dwangs through link gear and rotate, the dwang drives the blowing frame and rotates, and then makes the alternating hot gas flow of aiming at of wafer on the blowing frame, is provided with like this and is favorable to increasing the wafer quantity of placing on the blowing frame, is favorable to increasing the quantity of dry wafer, consequently is of value to improving production efficiency.
Description
Technical Field
The invention relates to the technical field of wafer drying, in particular to a drying device for cleaning a semiconductor wafer.
Background
In the manufacturing process of semiconductors, a pattern transfer process, including a photolithography process, is required. The photolithography technique is a pattern copying technique, and is a key technique in the semiconductor manufacturing process. Briefly, photolithography is inspired by photographic technology, which uses the photosensitive properties of photoresist to accurately copy the pattern of a photolithographic mask onto the photoresist coated on a wafer. Before spin coating the photoresist on the wafer, the wafer surface needs to be baked because the wafer surface is cleaned.
Chinese patent publication No. CN109663723A discloses a drying device for wafer, which comprises a drying box, a humidity sensor, a driving mechanism and a placing mechanism are arranged in the drying box, the placing mechanism comprises a plurality of placing units, a stirring component which can intermittently stir the placing units to move is arranged below the driving mechanism, and the stirring component is controlled by the humidity sensor. However, this device has the following disadvantages: 1. the hot air in the drying box is continuously stirred by the rotation of the wafer, so that the air flow is disordered, but the wafer still needs to move stably, so that the flowing speed of the air flow is limited, and the drying efficiency is influenced; 2. the wafer needs to be placed on the supporting plate, so that the lower surface of the wafer is in contact with the supporting plate, the lower surface of the wafer cannot be dried, and the wafer can be thoroughly dried only by turning over the wafer.
Disclosure of Invention
The present invention is directed to a drying apparatus for cleaning a semiconductor wafer to solve the above problems.
The invention realizes the purpose through the following technical scheme:
the drying device for cleaning the semiconductor wafer comprises a drying box, wherein the drying box mainly comprises supporting legs, a bottom plate, a shell, a top plate, a dust cover and a sealing door, the tops of the supporting legs are connected with the bottom plate through bolts, the outer side of the top of the bottom plate is connected with the shell through bolts, the top of the shell is connected with the top plate through bolts, exhaust holes are formed in the top of the top plate, the dust cover is screwed in the inner sides of the exhaust holes, the front end of the shell is connected with the sealing door through hinges, the drying device further comprises a drying mechanism and a discharging mechanism, the drying mechanism is arranged in the center of the interior of the shell, the discharging mechanism is arranged on the outer side of the drying mechanism, the discharging mechanism comprises an upper planet carrier, a discharging carrier group and a lower planet carrier, the outer side of the bottom of the upper planet carrier is connected with a plurality of the discharging carrier groups through bearings, and the lower ends of the discharging carrier groups penetrate through the lower planet carrier, the drying mechanism comprises a fan, a central pipe, a communicating pipe, an air outlet pipe, a heating wire, a supporting mesh pipe and a filter, wherein the air inlet end of the fan is connected with the filter through a throat hoop, the fan is connected to the center of the top plate through a bolt, the central pipe is connected to the lower side of the fan through a bolt, the central pipe penetrates through the top plate and the upper planet frame and is connected with the upper planet frame through a bearing, a plurality of communicating pipes are welded to the periphery of the lower part of the upper planet frame, each communicating pipe is provided with a plurality of communicating pipes, and the air outlet pipe which is vertically arranged is welded to one end, away from the central pipe, of each communicating pipe, the air outlet pipe is communicated with the central pipe through the communicating pipe, the heating wire is connected to the inside of the central pipe through a screw, the supporting mesh pipe for supporting the heating wire is arranged on the inner side of the heating wire, air flow can be generated through a fan, the air flow is heated by the heating wire to form hot air flow, the hot air flow is blown to the upper center and the lower center of the wafer through the central pipe, the communicating pipe and the air outlet pipe, water on the surface of the wafer flows outwards from the middle at the moment, water drops, and then residual water is evaporated and dried, so that the drying efficiency is improved, all the rotating rods can be driven to rotate through the linkage mechanism, the rotating rods drive the material placing frame to rotate, further the wafers on the material placing frame are alternately aligned with the hot air flow, so that the quantity of the wafers placed on the material placing frame is increased, and the quantity of the dried wafers is increased, thus contributing to an improvement in production efficiency.
Preferably, the number of the groups of the communicating pipes is the same as that of the discharge rack groups, and the positions of the communicating pipes correspond to each other, so that the wafers on each discharge rack group can be dried.
Preferably, the number of the communicating pipes in each group is one more than that of the material placing frames outside the rotating rods, and one communicating pipe is arranged above and below each material placing frame, so that wafers on each material placing frame can be dried.
Preferably, the top go out tuber pipe top and below go out the equal spiro union in tuber pipe bottom has sealed lid, sets up like this and seals the tuber pipe through sealed lid, prevents that the hot gas flow is extravagant.
Preferably, the dust cover includes external screw thread pipe, bracing piece, apron, external screw thread pipe spiro union is in exhausting the hole inboard, the welding of external screw thread pipe top has the angle setting such as a plurality of the bracing piece, the bracing piece top has the diameter to be greater than this exhaust hole through the screw connection the apron sets up like this and can effectually prevent that the dust from entering into inside the shell from the gas vent department.
Preferably, the blowing frame includes collar, connecting rod, blowing ring, support frame, the collar passes through the screw connection and is in the dwang outside, the welding of collar outside has a plurality of the connecting rod, the connecting rod is kept away from the one end welding of dwang has the blowing ring, the welding of blowing inboard bottom has the support frame has set up like this and has realized that a plurality of wafers can be placed in every collar outside.
Preferably, the link gear includes motor, drive shaft, transmission assembly, the motor passes through bolted connection bottom plate bottom central authorities, there is the output of motor through the coupling joint the drive shaft, the drive shaft upper end is passed the bottom plate, and connects through the bearing down the planet frame bottom, the drive shaft outside is provided with transmission assembly, transmission assembly with the dwang is connected, sets up like this and to drive the drive shaft through the motor and rotate, and the drive shaft drives transmission assembly operation, has realized dwang pivoted function.
Preferably, transmission assembly includes driving gear, drive gear, driven gear, the driving gear passes through the key-type connection and is in the drive shaft outside, driving gear week side meshing is connected with a plurality of drive gear, drive gear keeps away from one side meshing of driving gear is connected with driven gear, driven gear passes through the key-type connection and is in the dwang outside sets up the driving gear like this and drives drive gear and rotate, and drive gear drives driven gear and rotates, has realized the rotation function of dwang.
Preferably, drive assembly includes main sprocket, driven sprocket, drive chain, the main sprocket passes through the key-type connection and is in the drive shaft outside, driven sprocket passes through the key-type connection and is in the dwang outside, main sprocket and all pass through between the driven sprocket drive chain sets up like this that the main sprocket can drive chain through driven sprocket and rotate, and drive chain drives the dwang and rotates, has realized the rotation function of dwang.
Preferably, the inner side of the transmission chain is meshed with the driven chain wheel, the outer side of the transmission chain is meshed with the main chain wheel, and the transmission mode that the main chain wheel and the transmission chain are driven by the driven chain wheel is achieved.
The technical scheme provided by the invention can have the following beneficial effects:
1. the wafer drying device can generate airflow through the fan, the airflow is heated by the heating wires to become hot airflow, the hot airflow is blown to the upper center and the lower center of the wafer through the central pipe, the communicating pipe and the air outlet pipe, and at the moment, water on the surface of the wafer flows outwards from the middle to drop the water, and then the residual water is evaporated and dried, so that the drying efficiency is improved;
2. the linkage mechanism can drive all the rotating rods to rotate, and the rotating rods drive the material placing frame to rotate, so that wafers on the material placing frame are aligned with hot air flow alternately, and the linkage mechanism is beneficial to increasing the number of the wafers placed on the material placing frame and increasing the number of dried wafers, and is beneficial to improving the production efficiency.
Additional features of the invention and advantages thereof will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a drying apparatus for cleaning a semiconductor wafer according to the present invention;
FIG. 2 is a cross-sectional view of a drying apparatus for cleaning a semiconductor wafer according to the present invention;
FIG. 3 is a schematic structural diagram of a dust cover of the drying device for cleaning semiconductor wafers according to the present invention;
FIG. 4 is a schematic structural diagram of a discharging mechanism of the drying device for cleaning semiconductor wafers according to the present invention;
FIG. 5 is a bottom view of a discharging mechanism of a drying device for cleaning semiconductor wafers according to a first embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a rack set of a drying apparatus for cleaning semiconductor wafers according to the present invention;
FIG. 7 is a schematic structural diagram of a material loading frame of the drying apparatus for cleaning semiconductor wafers according to the present invention;
fig. 8 is a bottom view of a discharging mechanism of a drying device for cleaning semiconductor wafers according to a second embodiment of the present invention.
The reference numerals are explained below:
1. a drying box; 2. a drying mechanism; 3. a linkage mechanism; 4. a discharging mechanism; 101. supporting legs; 102. a base plate; 103. a housing; 104. a top plate; 105. a dust cover; 106. a sealing door; 1051. an externally threaded tube; 1052. a support bar; 1053. a cover plate; 201. a fan; 202. a central tube; 203. a communicating pipe; 204. an air outlet pipe; 205. heating wires; 206. supporting the mesh tube; 207. a filter; 2041. a sealing cover; 301. a motor; 302. a drive shaft; 303. a transmission assembly; 3031. a driving gear; 3032. a transmission gear; 3033. a driven gear; 31. a main sprocket; 32. a driven sprocket; 33. a drive chain; 401. an ascending planet carrier; 402. a discharge frame group; 403. a downlink planet carrier; 4021. rotating the rod; 4022. a material placing frame; 40221. a mounting ring; 40222. a connecting rod; 40223. a discharge ring; 40224. a support frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1
As shown in fig. 1-7, a drying device for cleaning semiconductor wafers comprises a drying box 1, the drying box 1 mainly comprises support legs 101, a bottom plate 102, a housing 103, a top plate 104, a dust cover 105 and a sealing door 106, the top of the support legs 101 is connected with the bottom plate 102 through bolts, the outer side of the top of the bottom plate 102 is connected with the housing 103 through bolts, the top of the housing 103 is connected with the top plate 104 through bolts, the top of the top plate 104 is provided with exhaust holes, the dust cover 105 is screwed on the inner side of the exhaust holes, the front end of the housing 103 is connected with the sealing door 106 through hinges, the drying mechanism 2 and the discharging mechanism 4 are also included, the drying mechanism 2 is arranged at the center inside of the housing 103, the discharging mechanism 4 is arranged at the outer side of the drying mechanism 2, the discharging mechanism 4 comprises an upper planet rack 401, a discharging rack set 402 and a lower planet rack 403, the outer side of the bottom of the upper planet rack 401 is connected with a plurality of discharging rack sets 402 through bearings, the lower end of the discharging frame group 402 penetrates through the lower planet frame 403, is connected with the lower planet frame 403 through a bearing, and is connected with a linkage mechanism 3 for driving the lower planet frame to rotate, the discharging frame group 402 comprises a rotating rod 4021 and a discharging frame 4022, the periphery of the rotating rod 4021 is connected with a plurality of discharging frames 4022 which are arranged at equal intervals through screws, the drying mechanism 2 comprises a fan 201, a central pipe 202, a communicating pipe 203, an air outlet pipe 204, a heating wire 205, a supporting mesh pipe 206 and a filter 207, the air inlet end of the fan 201 is connected with the filter 207 through a hose clamp, the fan 201 is connected to the center of the top of a top plate 104 through a bolt, the lower part of the fan 201 is connected with the central pipe 202 through a screw, the central pipe 202 penetrates through the top plate 104 and the upper planet frame 401 and is connected with the upper planet frame 401 through a bearing, a plurality of communicating pipes 203 are welded on the periphery of the lower part of the upper planet frame 401, each communicating pipe is provided with a plurality of communicating pipes 203, one end of each communicating pipe 203, which is far away from the central pipe 202, is welded with the air outlet pipe 204 which is vertically arranged, the air outlet pipe 204 is communicated with the central pipe 202 through the communicating pipe 203, the inside of the central pipe 202 is connected with the heating wire 205 through a screw, the inner side of the heating wire 205 is provided with a supporting mesh pipe 206 for supporting the heating wire 205, air flow can be generated through the fan 201, the air flow is heated by the heating wire 205 to become hot air flow, the hot air flow is blown to the upper center and the lower center of the wafer through the central pipe 202, the communicating pipe 203 and the air outlet pipe 204, at the moment, water on the surface of the wafer flows outwards from the middle, so that the water drops, then the residual water is evaporated and dried, therefore, the drying efficiency is favorably improved, in this way, all the rotating rods 4021 can be driven to rotate through the linkage mechanism 3, the rotating rods 4021 drive the blowing frame 4022 to rotate, further, the wafers on the blowing frame 4022 are alternately aligned, in this way, the hot air flow is favorable for increasing the number of the wafers placed on the blowing frame 4022, and is favorable for increasing the number of the dried wafers, therefore, the production efficiency is improved, the number of the groups of the communicating pipes 203 is the same as the number of the discharging frame groups 402, and the positions of the communicating pipes are corresponding, so that wafers on each discharging frame group 402 can be dried, the number of the communicating pipes 203 in each group is one more than that of the discharging frames 4022 outside each rotating rod 4021, and one communicating pipe 203 is arranged above and below each discharging frame 4022, so that the wafers on each discharging frame 4022 can be dried, the tops of the air outlet pipes 204 at the uppermost end and the bottoms of the air outlet pipes 204 at the lowermost end are respectively screwed with a sealing cover 2041, so that the air outlet pipes 204 can be sealed through the sealing covers 2041, waste of hot air is prevented, the dust cover 105 comprises an external threaded pipe 1051, a supporting rod 1052 and a cover plate 1053, the external threaded pipe 1051 is screwed inside an exhaust hole, a plurality of supporting rods 1052 arranged at equal angles are welded on the tops of the external threaded pipes 1051, the tops of the supporting rods are connected with the cover plates 1053 with the diameters of which are larger than the exhaust hole through screws, the arrangement can effectively prevent dust from entering the inside of the housing 103 from the air outlet, the material placing frame 4022 comprises an installation ring 40221, a connecting rod 40222, material placing rings 40223 and a supporting frame 40224, the installation ring 40221 is connected to the outer side of the rotating rod 4021 through screws, a plurality of connecting rods 40222 are welded to the outer side of the installation ring 40221, the material placing ring 40223 is welded to one end, away from the rotating rod 4021, of each connecting rod 40222, the supporting frame 40224 is welded to the bottom of the inner side of each material placing ring 40223, the arrangement realizes that a plurality of wafers can be placed on the outer side of each installation ring 40221, the linkage mechanism 3 comprises a motor 301, a driving shaft 302 and a transmission assembly 303, the motor 301 is connected to the center of the bottom plate 102 through bolts, the output end of the motor 301 is connected with the driving shaft 302 through a coupler, the upper end of the driving shaft 302 penetrates through the bottom plate 102 and is connected to the bottom of the lower planet carrier 403 through a bearing, the transmission assembly 303 is arranged on the outer side of the driving shaft 302, the transmission assembly 303 is connected with the rotating rod 4021, the driving shaft 302 can be driven to rotate by the motor 301, the driving shaft 302 drives the transmission assembly 303 to operate, the rotating rod 4021 is rotated, the transmission assembly 303 comprises a driving gear 3031, a transmission gear 3032 and a driven gear 3033, the driving gear 3031 is connected to the outer side of the driving shaft 302 through a key, a plurality of transmission gears 3032 are connected to the peripheral side of the driving gear 3031 in an engaged manner, one side, away from the driving gear 3031, of the transmission gear 3032 is connected with the driven gear 3033 in an engaged manner, the driven gear 3033 is connected to the outer side of the rotating rod 4021 through a key, the driving gear 3031 is arranged to drive the transmission gear 3032 to rotate, the transmission gear 3032 drives the driven gear 3033 to rotate, and the rotating function of the rotating rod 4021 is realized.
In the structure, when in use, firstly the sealing door 106 is opened, then the cleaned wafer is placed inside the material placing ring 40223, in the process, the lower planet carrier 403 and the rotating rod 4021 are rotated to enable the material placing ring 40223 to be close to the sealing door 106, so that the wafer is conveniently placed, then the sealing door 106 is closed, the motor 301, the fan 201 and the heating wire 205 are started to be electrified, the heating wire 205 is electrified to generate heat, the fan 201 is started to generate air flow, the air flow is heated by the heating wire 205 to become hot air flow, the hot air flow is blown to the upper center and the lower center of the wafer through the central tube 202, the communicating tube 203 and the air outlet tube 204, at the moment, water on the surface of the wafer flows outwards from the middle to drop the water, and then the residual water is evaporated and dried, so that the drying efficiency is improved, the driving shaft 302 is driven to rotate by the starting of the motor 301, the driving shaft 302 drives the driving gear 3031 to rotate, the driving gear 3031 drives the transmission gear 3032 to rotate, the transmission gear 3032 drives the driven gear 3033 to rotate, all the rotating rods 4021 are driven to rotate, the rotating rods 4021 drive the material discharging frames 4022 to rotate, and wafers on the material discharging frames 4022 are aligned with hot air alternately, so that the quantity of the wafers placed on the material discharging frames 4022 is increased, the quantity of the dry wafers is increased, and the production efficiency is improved beneficially.
Example 2
As shown in fig. 8, embodiment 2 differs from embodiment 1 in that: drive assembly 303 includes main sprocket 31, driven sprocket 32, drive chain 33, main sprocket 31 passes through the key-type connection in the drive shaft 302 outside, driven sprocket 32 passes through the key-type connection in the dwang 4021 outside, through the transmission of drive chain 33 between main sprocket 31 and all driven sprocket 32, it can drive chain 33 through driven sprocket 32 and rotate to set up main sprocket 31 like this, drive chain 33 drives dwang 4021 and rotates, the rotation function of dwang 4021 has been realized, drive chain 33 inboard is connected with driven sprocket 32 meshing, drive chain 33 outside is connected with main sprocket 31 meshing, it makes the specific transmission mode of main sprocket 31 and drive chain 33 through driven sprocket 32 to set up like this.
In the structure, when in use, the sealing door 106 is firstly opened, then the cleaned wafer is placed at the inner side of the material placing ring 40223, in the process, the lower planet carrier 403 and the rotating rod 4021 are rotated to enable the material placing ring 40223 to be close to the sealing door 106, so that the wafer is conveniently placed, then the sealing door 106 is closed, the motor 301, the fan 201 and the heating wire 205 are started to be electrified, the heating wire 205 is electrified to generate heat, the fan 201 is started to generate air flow, the air flow is heated by the heating wire 205 to become hot air flow, the hot air flow is blown to the upper center and the lower center of the wafer through the central tube 202, the communicating tube 203 and the air outlet tube 204, at the moment, water on the surface of the wafer flows outwards from the middle to enable the water to drip, and then the residual water is evaporated and dried, so that the drying efficiency is improved, the driving shaft 302 is driven to rotate by the starting of the motor 301, the driving shaft 302 drives the main chain wheel 31 to rotate, the main sprocket 31 drives through driven sprocket 32 and drives drive chain 33 and rotate, and then drives all dwang 4021 and rotate, and dwang 4021 drives blowing frame 4022 and rotates, and then makes the alternating hot air current of aiming at of wafer on the blowing frame 4022, is provided with like this and benefits the wafer quantity of placing on the increase blowing frame 4022, is of value to the quantity that increases dry wafer, consequently is of value to the improvement production efficiency.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A drying device for semiconductor wafer washs, including stoving case (1), stoving case (1) mainly comprises supporting leg (101), bottom plate (102), shell (103), roof (104), dust cover (105), sealing door (106), there is bottom plate (102) supporting leg (101) top through bolted connection, there is shell (103) bottom outside of bottom plate (102) top through bolted connection, there is roof (104) top through bolted connection, the exhaust hole has been seted up at roof (104) top, and the inboard spiro union of exhaust hole has dust cover (105), there is sealing door (106) through hinge connection shell (103) front end, its characterized in that: still include drying mechanism (2), drop feed mechanism (4), the inside central authorities of shell (103) are provided with drying mechanism (2), drying mechanism (2) outside is provided with drop feed mechanism (4), drop feed mechanism (4) are including going up star frame (401), blowing frame group (402), down star frame (403), it is connected with a plurality of through the bearing to go up star frame (401) bottom outside blowing frame group (402), blowing frame group (402) lower extreme passes down star frame (403), and with down star frame (403) pass through the bearing and connect, and be connected with its pivoted link gear (3) of drive, blowing frame group (402) are including dwang (4021), blowing frame (4022), dwang (4021) week is week side has a plurality of equidistance to set up through the screw connection blowing frame (4022), drying mechanism (2) are including fan (201), The air purifier comprises a central pipe (202), communicating pipes (203), an air outlet pipe (204), a heating wire (205), a supporting mesh pipe (206) and a filter (207), wherein the air inlet end of a fan (201) is connected with the filter (207) through a hose clamp, the fan (201) is connected to the center of the top of a top plate (104) through a bolt, the central pipe (202) is connected to the lower portion of the fan (201) through a screw, the central pipe (202) penetrates through the top plate (104) and an uplink planet carrier (401) and is connected with the uplink planet carrier (401) through a bearing, a plurality of groups of communicating pipes (203) are welded on the periphery of the lower portion of the uplink planet carrier (401), each group is provided with a plurality of communicating pipes (203), one end of each communicating pipe (203) far away from the central pipe (202) is welded with the air outlet pipe (204) which is vertically arranged, the air outlet pipe (204) is communicated with the central pipe (202) through the communicating pipe (203), the heating wire (205) is connected to the inside of the central pipe (202) through a screw, and the supporting mesh pipe (206) for supporting the heating wire (205) is arranged on the inner side of the heating wire (205);
the linkage mechanism (3) comprises a motor (301), a driving shaft (302) and a transmission assembly (303), the motor (301) is connected to the center of the bottom plate (102) through a bolt, the output end of the motor (301) is connected with the driving shaft (302) through a coupler, the upper end of the driving shaft (302) penetrates through the bottom plate (102) and is connected to the bottom of the lower planet carrier (403) through a bearing, the transmission assembly (303) is arranged on the outer side of the driving shaft (302), and the transmission assembly (303) is connected with the rotating rod (4021);
the transmission assembly (303) comprises a main chain wheel (31), driven chain wheels (32) and a transmission chain (33), wherein the main chain wheel (31) is connected to the outer side of the driving shaft (302) through a key, the driven chain wheels (32) are connected to the outer side of the rotating rod (4021) through keys, and the main chain wheel (31) and all the driven chain wheels (32) are in transmission through the transmission chain (33);
the inner side of the transmission chain (33) is meshed with the driven chain wheel (32), and the outer side of the transmission chain (33) is meshed with the main chain wheel (31).
2. A drying apparatus for cleaning semiconductor wafers as claimed in claim 1, wherein: the number of the groups of the communicating pipes (203) is the same as that of the discharge rack groups (402), and the positions of the groups correspond to those of the discharge rack groups.
3. A drying apparatus for cleaning semiconductor wafers as claimed in claim 2, wherein: the number of the communicating pipes (203) in each group is one more than that of the blowing frames (4022) on the outer side of each rotating rod (4021), and one communicating pipe (203) is arranged above and below each blowing frame (4022).
4. A drying apparatus for cleaning semiconductor wafers as claimed in claim 3, wherein: the top of the air outlet pipe (204) at the uppermost end and the bottom of the air outlet pipe (204) at the lowermost end are both screwed with sealing covers (2041).
5. A drying apparatus for cleaning semiconductor wafers as claimed in claim 1, wherein: the dust cover (105) comprises an external threaded pipe (1051), a supporting rod (1052) and a cover plate (1053), wherein the external threaded pipe (1051) is screwed inside the exhaust hole, the supporting rod (1052) which is arranged at a plurality of equal angles is welded at the top of the external threaded pipe (1051), and the top of the supporting rod (1052) is connected with the cover plate (1053) with a diameter larger than the exhaust hole through screws.
6. A drying apparatus for cleaning semiconductor wafers as claimed in claim 1, wherein: the blowing frame (4022) includes collar (40221), connecting rod (40222), blowing ring (40223), support frame (40224), collar (40221) passes through the screw connection in the dwang (4021) outside, the welding of collar (40221) outside has a plurality of connecting rod (40222), connecting rod (40222) is kept away from the welding of the one end of dwang (4021) has blowing ring (40223), the welding of the inboard bottom of blowing ring (40223) has support frame (40224).
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| CN116040319B (en) * | 2022-10-24 | 2023-09-01 | 江苏科沛达半导体科技有限公司 | Mechanical arm for carrying wafer cleaning |
| CN116026111B (en) * | 2023-03-27 | 2023-06-13 | 苏州芯海半导体科技有限公司 | Chip processing baking equipment |
| CN116659086B (en) * | 2023-08-01 | 2023-09-29 | 上海咖玫迩风机有限公司 | Circulation type industrial air heater |
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| CN111293060A (en) * | 2020-02-21 | 2020-06-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning and fixing device and wafer cleaning equipment |
| CN111687018A (en) * | 2020-06-10 | 2020-09-22 | 马鞍山市谷庆门业有限公司 | Drying device is used in timber production |
| CN111854356A (en) * | 2020-08-06 | 2020-10-30 | 郑州工业应用技术学院 | Drying furnace for resistor production for electronic products and use method thereof |
| CN214620345U (en) * | 2021-02-09 | 2021-11-05 | 江苏亚电科技有限公司 | Drying device for cleaning semiconductor wafer |
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| WO2015071927A1 (en) * | 2013-11-12 | 2015-05-21 | 森合精機株式会社 | Cleaning apparatus |
| CN109663723B (en) * | 2018-12-28 | 2021-10-08 | 安徽龙芯微科技有限公司 | Drying device for wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111293060A (en) * | 2020-02-21 | 2020-06-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning and fixing device and wafer cleaning equipment |
| CN111687018A (en) * | 2020-06-10 | 2020-09-22 | 马鞍山市谷庆门业有限公司 | Drying device is used in timber production |
| CN111854356A (en) * | 2020-08-06 | 2020-10-30 | 郑州工业应用技术学院 | Drying furnace for resistor production for electronic products and use method thereof |
| CN214620345U (en) * | 2021-02-09 | 2021-11-05 | 江苏亚电科技有限公司 | Drying device for cleaning semiconductor wafer |
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