CN112987392A - Light source module and display device - Google Patents
Light source module and display device Download PDFInfo
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- CN112987392A CN112987392A CN201911291220.3A CN201911291220A CN112987392A CN 112987392 A CN112987392 A CN 112987392A CN 201911291220 A CN201911291220 A CN 201911291220A CN 112987392 A CN112987392 A CN 112987392A
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- light
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- source module
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
A light source module comprises a substrate, a plurality of light emitting elements, a plurality of semi-reflection elements, an encapsulation layer and a plurality of reflection patterns. The substrate is provided with a bearing surface, the light-emitting elements are arranged on the bearing surface, and each light-emitting element is provided with a top surface far away from the bearing surface. The semi-reflective elements are respectively arranged on the top surfaces of the light-emitting elements. The packaging layer covers and is attached to the bearing surface, the light-emitting element and the semi-reflecting element. The packaging layer is provided with a light-emitting surface far away from the bearing surface, and the light-emitting surface is provided with a plurality of reflecting grooves respectively corresponding to the light-emitting elements. The reflective grooves are respectively provided with an opening positioned on the light-emitting surface and a bottom part opposite to the opening, the area of the opening is larger than that of the bottom part, and the reflective patterns are respectively arranged in the reflective grooves. The display device comprises the light source module and the display panel. The display panel is arranged opposite to the light source module and is adjacent to the light emergent surface. The light source module and the display device are used for providing a surface light source with uniform brightness under the condition of not increasing the thickness.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a light source module and a display device, and more particularly, to a light source module and a display device having a light emitting element with a semi-reflective element and a reflective groove.
[ background of the invention ]
The structure of the liquid crystal display mainly comprises a backlight module, a display panel, an outer frame and other elements. The backlight module can be divided into an edge-type backlight module and a direct-type backlight module according to different light source directions. In detail, the direct type backlight module has a local dimming (local dimming) function compared to the edge type backlight module. Therefore, in the market, a direct type backlight module is mostly used in a large-medium-sized liquid crystal display using a Light Emitting Diode (LED) as a light source. In general, a direct type backlight module includes light emitting elements arranged in a two-dimensional array on a substrate, and a diffusion plate disposed above the light emitting elements. In order to provide a uniform surface light source for the direct type backlight module, technicians can determine an optimal configuration mode according to the H/P ratio; where H is the distance from the bottom of the light emitting device to the diffuser plate, and P is the distance (pitch) between adjacent light emitting devices. In order to meet the market trend of thinning appearance, the H value of newly developed products is only continuously reduced.
However, because the led has strong forward light, when the H value is too small, the effective illumination area of the display panel will generate light spots with alternating brightness and darkness, which greatly reduces the imaging quality. To improve the above problem, the skilled person can only increase the number of light emitting devices to reduce the value of P, but this method will increase the product cost and further reduce the market competitiveness. Therefore, in the case where it is necessary to keep the product cost while thinning the appearance, the above problem is urgently required to be improved.
This background section is provided merely to aid in understanding the present disclosure, and thus the disclosure in the background section may include art that does not constitute a part of the common general knowledge of those skilled in the art. Furthermore, the disclosure in the "background" does not represent a material or problem to be solved by one or more embodiments of the present invention, nor is it intended to be known or recognized by one of ordinary skill in the art prior to the filing of the present application.
[ summary of the invention ]
The invention provides a light source module, which can provide a surface light source with uniform brightness without increasing the thickness, thereby achieving both the thinning appearance and the product cost.
The invention provides a display device, which achieves the advantages of thin appearance, low product cost and good imaging quality.
Other objects and advantages of the present invention will be further understood from the technical features disclosed in the present invention.
To achieve one or a part of or all of the above or other objects, the light source module provided by the present invention includes a substrate, a plurality of light emitting elements, a plurality of semi-reflective elements, an encapsulation layer, and a plurality of reflective patterns. The substrate is provided with a bearing surface. The light emitting elements are arranged on the bearing surface, and each light emitting element is provided with a top surface far away from the bearing surface. The semi-reflective elements are respectively arranged on the top surfaces of the light-emitting elements. The packaging layer covers and is attached to the bearing surface, the light-emitting element and the semi-reflection element, the packaging layer is provided with a light-emitting surface far away from the bearing surface, the light-emitting surface is provided with a plurality of reflection grooves respectively corresponding to the light-emitting element, the reflection grooves are respectively provided with an opening positioned on the light-emitting surface and a bottom opposite to the opening, and the area of the opening is larger than that of the bottom. The reflection patterns are respectively arranged in the reflection grooves.
In order to achieve one or a part of or all of the above or other objects, the present invention provides a display device including the light source module and the display panel. The display panel is arranged opposite to the light source module and is adjacent to the light emitting surface of the packaging layer of the light source module.
The light source module of the embodiment of the invention is provided with the semi-reflection element and the reflection groove above the light-emitting element, so that a surface light source with uniform brightness can be provided under the condition of not increasing the thickness, the thinning appearance is considered, the product cost is maintained, and the market demand is met. In addition, the display device of the embodiment of the invention adopts the light source module, so that the display device has the advantages of thin appearance, low product cost and good imaging quality.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
Fig. 1A is a schematic view of a light source module according to an embodiment of the invention.
Fig. 1B is an enlarged view of the area a of fig. 1A.
Fig. 2 is a schematic view of a light source module according to another embodiment of the present invention.
Fig. 3 is a schematic diagram of a display device according to an embodiment of the present invention.
[ detailed description ] embodiments
The foregoing and other technical and other features and advantages of the invention will be apparent from the following detailed description of a preferred embodiment, which proceeds with reference to the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
Fig. 1A is a schematic view of a light source module according to an embodiment of the invention, and fig. 1B is an enlarged view of a part a of fig. 1A. Referring to fig. 1A and 1B, a light source module 100 of the present embodiment includes a substrate 110, a plurality of light emitting elements 120, a plurality of semi-reflective elements 130, an encapsulation layer 140, and a plurality of reflective patterns 160. The substrate 110 has a carrying surface 111, the light emitting devices 120 are disposed on the carrying surface 111, and each of the light emitting devices 120 has a top surface 121 far away from the carrying surface 111. The semi-reflective elements 130 are disposed on the top surfaces 121 of the light-emitting elements 120, respectively. The package layer 140 covers and adheres to the supporting surface 111, the light emitting device 120 and the semi-reflective device 130. The bonding process is not limited to bonding the package layer 140 to the carrier surface 111, the light emitting device 120 and the semi-reflective device 130, but rather, the package layer 140 may be in contact with the carrier surface 111, the light emitting device 120 and the semi-reflective device 130. The package layer 140 has a light-emitting surface 141 far away from the supporting surface 111, and the light-emitting surface 141 has a plurality of reflective grooves 141a respectively corresponding to the light-emitting devices 120. The reflective grooves 141a respectively have an opening 141b on the light emitting surface 141 and a bottom 141c opposite to the opening 141b, and the area of the opening 141b is larger than that of the bottom 141 c. The reflective patterns 160 are respectively disposed in the reflective grooves 141 a.
The substrate 110 may be a circuit board, and the carrying surface 111 may be a surface of the substrate 110 on which a plurality of conductive patterns (not shown) are disposed, and the conductive patterns are electrically connected to the light emitting element 120. For example, when the substrate 110 is a Printed Circuit Board (PCB), the conductive pattern may be a metal line on the PCB, but the invention is not limited thereto.
The light emitting element 120 may be a light emitting diode, but may be another kind of light emitting element. The light emitting elements 120 may be arranged in an array on the supporting surface 111. In addition, the light emitting device 120 may also be an unpackaged light emitting chip, such as a light emitting diode chip, directly cut from a wafer. For example, the led chip is a die-level nitride led chip emitting blue light with dominant wavelength, but the invention is not limited thereto. On the other hand, as shown in fig. 1B, each of the light emitting elements 120 has a top surface 121 and a bottom surface 122 opposite to each other, and a plurality of side surfaces 123 connected between the top surface 121 and the bottom surface 122. The bottom surface 122 is connected to the supporting surface 111, and the top surface 121 and the side surfaces 123 are light emitting surfaces. In other words, the light emitting device 120 can emit light through the top surface 121, the bottom surface 122 and the side surface 123. In other embodiments, the light emitting element 120 with only the top surface 121 as the light emitting surface may be selected.
The semi-reflective element 130 is disposed on the top surface 121 of the light emitting element 120 to reflect a portion of the light emitted from the light emitting element 120, and another portion of the light penetrates through the semi-reflective element 130 and enters the package layer 140. In other words, the semi-reflective element 130 of the present invention is not limited to an element with a reflectivity of 50%, but generally refers to an element that allows light to partially pass through and partially reflect. In one embodiment, the semi-reflective element 130 is, for example, a Distributed Bragg Reflector (DBR). The semi-reflective element 130 includes a plurality of light refracting layers 131, the light refracting layers 131 include a higher refractive index light refracting layer 131 and a lower refractive index light refracting layer 131, and the higher refractive index light refracting layer 131 and the lower refractive index light refracting layer 131 are alternately stacked. In addition, in the embodiment where the light emitting element 120 is a light emitting chip, the multiple light refraction layers 131 of the semi-reflective element 130 can be sequentially formed on the top surface 121 of the light emitting element 120 and integrated with the light emitting element 120 into a single component. In another embodiment, the semi-reflective element 130 may be disposed on the top surface 121 of the light-emitting element 120 after the whole fabrication process is completed.
Due to the semi-reflective elements 130, the light pattern of the light provided by each light emitting element 120 passing through each semi-reflective element 130 is lower in brightness in the central area than in the peripheral area. As shown in fig. 1B, the light L1 generated from the light emitting element 120 is significantly concentrated in brightness in the central region. When the light L1 passes through the semi-reflective element 130, a portion of the light L1 is reflected as a reflected light L2, and another portion of the light L1 passes through the semi-reflective element 130 and becomes a transmitted light L3. Specifically, the semi-reflective element 130 has high reflectivity and low transmittance for the light L1 with a small angle with the normal light emitting direction N; the semi-reflective element 130 has low reflectivity and high transmittance for the light L1 with a larger angle with the normal light emitting direction N. Therefore, the beam pattern of the transmitted light L3 has a central area with a lower brightness than the surrounding areas, and resembles a batwing profile. Thus, on the premise of maintaining the thickness OD of the light source module 100 and not increasing the number of the light emitting elements 120, the semi-reflective element 130 can effectively suppress the bright area above the light emitting elements 120, thereby improving the uniformity of the surface light source.
It should be noted that, in fig. 1B, the light ray L1 is used to illustrate the light pattern of the light emitting element 120, and in order to clearly show the light patterns of the light rays L1 and L2, the light emitting position of the light ray L1 is drawn on the bottom surface 122 of the light emitting element 120 in fig. 1B, but the light ray L1 is not limited to be emitted from the bottom surface 122 of the light emitting element 120.
The light emitting devices 120 may be light emitting chips, and each semi-reflective device 130 includes a plurality of light refractive layers 131 stacked on the top surface 121 of each light emitting device 120. In other words, when the light emitting element 120 is an unpackaged light emitting chip, the semi-reflective element 130 may be directly formed on the light emitting chip through a plating process. For example, the multi-layer light refracting layer 131 may be a plurality of films with different refractive indexes plated on the top surface 121, and the films may be formed by stacking a high refractive index film and a low refractive index film on each other. By disposing the light refracting layer 131 having an appropriate refractive index, the light line L1 entering the light refracting layer 131 is guided in a direction deviating from the normal light outgoing direction N, and exits as a penetrating light ray L3 having a beam pattern resembling a batwing profile. Therefore, the semi-reflective element 130 can effectively suppress the bright spots above the light-emitting element 120, so that the light source module 100 of the present embodiment can provide a surface light source with better uniformity.
The encapsulation layer 140 may be a light-transmitting material, such as a Silicone encapsulation resin (Silicone), an Epoxy resin (Epoxy), a UV curable resin, or the like, but the invention is not limited thereto. In addition, the light emitting surface 141 of the package layer 140 may be provided with a plurality of light scattering microstructures (not shown) at positions where the reflective grooves 141a are not provided. The light scattering microstructure may include a plurality of concave portions and/or a plurality of convex portions disposed on the light emitting surface 141. In an embodiment, the light scattering microstructure may be a roughened surface formed by sandblasting or etching, so that the penetrating light L3 entering the package layer 140 can be more uniformly diffused when exiting from the light-emitting surface 141.
The area of the opening 141b of the reflective groove 141a may be larger than the area of the top surface 121 of the light emitting element 120, and the shape of the reflective groove 141a may be designed according to practical requirements. For example, the reflective groove 141a may be a pyramid formed by a single slope of the inclined side surface and the pointed bottom 141c, or a corner post formed by a single slope of the inclined side surface and the flat bottom 141 c. In addition, the side surface of the reflective groove 141a may be a curved surface. On the other hand, the side surface of the reflective groove 141a may be formed by a plurality of inclined surfaces with different slopes or concave or convex surfaces with different curvatures, for example, stepped. Therefore, the reflective cavities 141a may also be hemispherical, semi-ellipsoidal, parabolic, or polygonal, and the invention is not limited thereto.
The reflection pattern 160 is for reflecting the light incident on the reflection groove 141a, and is, for example, a transparent light line L3 to further suppress a bright point above the light emitting element 120 and further improve the uniformity of the surface light source. On the other hand, the reflective pattern 160 may cover the bottom 141c of the reflective groove 141a and not fill the reflective groove 141 a. The material of the reflective pattern 160 may include an optical material such as a reflective material, a light diffusing material, or a wavelength conversion material, but the present invention is not limited thereto.
In the present embodiment, the light source module 100 may further include an optical film 170. The optical film 170 is disposed on a side adjacent to the light emitting surface 141. The number of the optical films 170 may be one or more, and the optical films 170 may be a diffusion plate, a diffusion sheet, a prism sheet, a wavelength conversion sheet, or the like.
In addition, in the present embodiment, the light source module 100 may further include a reflective layer 180 disposed on the carrying surface 111 in a region where the light emitting element 120 is not disposed, and covered and attached by the encapsulation layer 140. For example, the reflective layer 180 may be a specular reflective layer or a diffuse reflective layer; the specular reflection layer may be a silver paint reflection sheet or paint, and the diffuse reflection layer may be a white paint reflection sheet or paint, but the invention is not limited thereto. The reflective layer 180 can reflect the light reflected from the semi-reflective element 130, the light-emitting surface 141 of the package layer 140 and the reflective pattern 160, so as to improve the light utilization rate. Fig. 1A and 1B illustrate an embodiment in which the encapsulation layer 140 covers and is attached to the reflective layer 180 when the reflective layer 180 is provided, and when the light source module 100 does not include the reflective layer 180, the encapsulation layer 140 may also directly cover and be attached to the supporting surface 111, as shown in fig. 2 and 3.
Fig. 2 is a schematic view of a light source module according to another embodiment of the present invention. Referring to fig. 2, in the present embodiment, a difference between the light source module 100a and fig. 1A and 1B is that the light source module 100a further includes a plurality of reflective elements 190 respectively disposed between the bottom surface 122 of the light emitting element 120 and the supporting surface 111. Specifically, the main function of the reflective element 190 is to reflect the light emitted from the bottom surface 122 of the light emitting element 120, so that more light can enter the package layer 140.
In one embodiment, the reflective element 190 may be similar to the semi-reflective element 130 described above, and includes a plurality of light refractive layers (not shown) stacked on top of each other. Since the reflective element 190 is used for reflecting the light emitted from the bottom surface 122 of the light emitting element 120, the arrangement of the stack of the multiple light refraction layers and the high refractive index and the low refractive index of the reflective element 190 may be different from that of the semi-reflective element 130. In another embodiment, the reflective element 190 may be a metal reflective layer. The metallic reflective layer may be a reflective coating formed of silver or aluminum. In this embodiment, the reflective element 190 is only disposed corresponding to the light emitting elements 120, that is, the reflective element 190 is not disposed between the adjacent light emitting elements 120, and the encapsulation layer 140 directly covers and adheres to the supporting surface 111. In another embodiment, the light source module 100a may further include a reflective layer (not shown) disposed on the supporting surface 111 in a region where the light emitting device 120 is not disposed, and the material of the reflective device 190 may be different from that of the reflective layer.
Fig. 3 is a schematic diagram of a display device according to an embodiment of the present invention. Referring to fig. 3, the display device 200 includes a display panel 201 and the light source module of any of the above embodiments, and fig. 3 exemplifies the light source module 100. Since the above elements except the display panel 201 are described in detail in the foregoing, the description thereof will be omitted hereinafter.
The display panel 201 is disposed opposite to the light source module 100 and adjacent to the light emitting surface 141. The display panel 201 is, for example, a liquid crystal display panel or other kinds of display panels, and the light source module 100 is used to provide a surface light source to the display panel 201. In addition, since the display device 200 is disposed in cooperation with the light source modules 100 and 100a, the display device 200 can provide good image quality without increasing the overall thickness and the number of light emitting elements. Therefore, the display device 200 of the present embodiment has the advantages of thin appearance, low product cost and good image quality.
In summary, the light source module of the embodiment of the invention adopts the semi-reflective element and the reflective groove disposed on the light emitting element, so that a surface light source with uniform brightness can be provided without increasing the thickness, and further the appearance is thinned while maintaining the product cost, thereby meeting the market demand. In addition, the display device of the embodiment of the invention adopts the light source module, so that the display device has the advantages of thin appearance, low product cost and good imaging quality.
It should be understood that the above description is only a preferred embodiment of the present invention, and that the scope of the present invention should not be limited thereby, and that the appended claims and the description of the invention should be construed as broadly as the present invention includes all the equivalent variations and modifications which fall within the true scope and spirit of the invention. Moreover, not all objects or advantages or features disclosed herein are necessarily achieved by any one embodiment or claim of the invention. In addition, the abstract and the title of the invention are provided for assisting the search of patent documents and are not intended to limit the scope of the invention.
Claims (10)
1. A light source module comprising a substrate, a plurality of light emitting elements, a plurality of semi-reflective elements, an encapsulation layer, and a plurality of reflective patterns,
the substrate is provided with a bearing surface;
the plurality of light-emitting elements are configured on the bearing surface, and each of the plurality of light-emitting elements is provided with a top surface far away from the bearing surface;
the plurality of semi-reflective elements are respectively arranged on the plurality of top surfaces of the plurality of light-emitting elements;
the packaging layer covers and is attached to the bearing surface, the light-emitting elements and the semi-reflecting elements, the packaging layer is provided with a light-emitting surface far away from the bearing surface, the light-emitting surface is provided with a plurality of reflecting grooves respectively corresponding to the light-emitting elements, the reflecting grooves are respectively provided with openings positioned on the light-emitting surface and bottoms opposite to the openings, and the area of the openings is larger than that of the bottoms; and
the plurality of reflection patterns are respectively configured in the plurality of reflection grooves.
2. The light source module of claim 1, wherein the plurality of light emitting elements are light emitting chips, and each of the plurality of semi-reflective elements comprises a plurality of light refracting layers stacked on the top surface of each of the plurality of light emitting elements.
3. The light source module of claim 1, wherein the plurality of semi-reflective elements are distributed bragg reflectors.
4. The light source module of claim 1, wherein the pattern of light provided by each of the plurality of light emitting elements after passing through each of the plurality of semi-reflective elements is such that the brightness of the central region is lower than the brightness of the surrounding regions.
5. The light source module of claim 1, wherein each of the light emitting elements has a bottom surface facing the supporting surface, and the light source module further comprises a plurality of reflective elements respectively disposed between the bottom surfaces of the light emitting elements and the supporting surface.
6. The light source module of claim 5, wherein each of the plurality of reflective elements is a metallic reflective layer.
7. The light source module of claim 5, wherein each of the plurality of reflective elements comprises a plurality of photorefractive layers stacked on top of each other.
8. The light source module of claim 1, further comprising a reflective layer disposed on the carrying surface in a region where the light emitting elements are not disposed, and covered by the encapsulation layer.
9. The light source module of claim 1, wherein each of the light emitting elements has a bottom surface opposite to the top surface and a plurality of side surfaces connected between the top surface and the bottom surface, the bottom surface is connected to the carrying surface, and the top surface and the side surfaces are light emitting surfaces.
10. A display device comprising a light source module and a display panel, wherein,
the light source module includes a substrate, a plurality of light emitting elements, a plurality of semi-reflective elements, an encapsulation layer, and a plurality of reflective patterns,
the substrate is provided with a bearing surface;
the plurality of light-emitting elements are configured on the bearing surface, and each of the plurality of light-emitting elements is provided with a top surface far away from the bearing surface;
the plurality of semi-reflective elements are respectively arranged on the plurality of top surfaces of the plurality of light-emitting elements;
the packaging layer covers and is attached to the bearing surface, the light-emitting elements and the semi-reflecting elements, the packaging layer is provided with a light-emitting surface far away from the bearing surface, the light-emitting surfaces are provided with a plurality of reflecting grooves respectively corresponding to the light-emitting elements, the reflecting grooves are respectively provided with an opening positioned on the light-emitting surface and a bottom opposite to the opening, and the area of the opening is larger than that of the bottom; and
the plurality of reflection patterns are respectively configured in the plurality of reflection grooves; and
the display panel is arranged opposite to the light source module and is adjacent to the light emergent surface.
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CN201911291220.3A CN112987392A (en) | 2019-12-16 | 2019-12-16 | Light source module and display device |
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CN201911291220.3A CN112987392A (en) | 2019-12-16 | 2019-12-16 | Light source module and display device |
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CN1740873A (en) * | 2004-08-27 | 2006-03-01 | 孙庆成 | Straight down type back light module |
CN1786789A (en) * | 2004-12-06 | 2006-06-14 | 翰立光电股份有限公司 | Plane type light source |
CN101749601A (en) * | 2010-01-08 | 2010-06-23 | 友达光电股份有限公司 | Backlight module and display with same |
CN102478178A (en) * | 2010-11-23 | 2012-05-30 | 深圳帝光电子有限公司 | Direct type ultrathin light emitting diode (LED) backlight module and display terminal |
JP2017212363A (en) * | 2016-05-26 | 2017-11-30 | セイコーエプソン株式会社 | Light source device and projector |
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2019
- 2019-12-16 CN CN201911291220.3A patent/CN112987392A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1740873A (en) * | 2004-08-27 | 2006-03-01 | 孙庆成 | Straight down type back light module |
CN1786789A (en) * | 2004-12-06 | 2006-06-14 | 翰立光电股份有限公司 | Plane type light source |
CN101749601A (en) * | 2010-01-08 | 2010-06-23 | 友达光电股份有限公司 | Backlight module and display with same |
CN102478178A (en) * | 2010-11-23 | 2012-05-30 | 深圳帝光电子有限公司 | Direct type ultrathin light emitting diode (LED) backlight module and display terminal |
JP2017212363A (en) * | 2016-05-26 | 2017-11-30 | セイコーエプソン株式会社 | Light source device and projector |
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