CN112986323A - Thermal insulation material thermal conductivity testing method based on layered embedded thermocouple - Google Patents
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Abstract
The invention provides a thermal conductivity testing method of a thermal insulation material based on a layered embedded thermocouple, which comprises the steps of arranging N temperature measuring points between a tested thermal insulation material and an upper panel arranged on the upper surface of the tested thermal insulation material, between the tested thermal insulation material and a lower panel arranged on the lower surface of the tested thermal insulation material and at different depths of the tested thermal insulation material in a test piece, constructing a thermal insulation boundary condition of the tested thermal insulation material, loading heat flow to the test piece by utilizing a wind tunnel, and obtaining the upper surface temperature T of the tested thermal insulation material after the heat flow is loaded1(T) measuring the actual temperature T of the N temperature measurement points after the heat flow is loadedf(XNT) using conjugate gradient method to measure the initial temperature T of the thermal insulation material0Initial assumed value of thermal conductivity of0And performing optimization iteration to obtain a thermal conductivity test value of the tested thermal insulation material. By applying the technical scheme of the invention, the problem that the error between the heat conductivity test result and the actual value of the heat conductivity in the flight state is larger due to the fact that the test method in the prior art is not suitable for a convection heating mode is solvedTo solve the technical problem of (1).
Description
Technical Field
The invention relates to the technical field of thermal insulation material performance testing, in particular to a thermal insulation material thermal conductivity testing method based on a layered embedded thermocouple.
Background
Currently, thermal insulation materials are widely used in high-speed aircraft, and accurate testing of thermal conductivity of the thermal insulation materials is crucial. However, in the test flight state of the aircraft, the heating mechanism of the thermal insulation material is often convection heating, while the common ground thermal conductivity performance testing means such as a protective hot plate method, a heat flow meter method, a HotDisk method, a single-side heating method and the like can only adopt heating forms such as contact heating and radiation heating, and the heating mechanism of the thermal insulation material in the test flight state and the ground test state is significantly different. Further, because the currently applied thermal insulation material generally has the characteristics of porosity and translucency, the thermal conductivity test result of the thermal insulation material is greatly influenced by the heating mechanism, so that the error between the thermal conductivity test result measured by the current ground test means and the true value of the thermal conductivity in the flight state is large, and the thermal insulation material is difficult to be applied to the thermal insulation performance prediction of the thermal insulation material under the flight condition.
Disclosure of Invention
The invention provides a thermal conductivity testing method for a thermal insulation material based on a layered embedded thermocouple, which can solve the technical problem that the error between a thermal conductivity testing result and a thermal conductivity true value in a flight state is large due to the fact that a testing method in the prior art is not suitable for a convection heating mode.
According to one aspect of the invention, a thermal conductivity test method of a thermal insulation material based on a layered embedded thermocouple is provided, and comprises the following steps:
n temperature measuring points are arranged between the thermal insulation material to be measured and an upper panel arranged on the upper surface of the thermal insulation material to be measured, between the thermal insulation material to be measured and a lower panel arranged on the lower surface of the thermal insulation material to be measured and at different depths of the thermal insulation material to be measured in the test piece, a thermocouple is pre-buried in each temperature measuring point, and the distance from the N temperature measuring points to the upper surface of the thermal insulation material to be measured is XN；
Obtaining the initial temperature T of the measured heat-insulating material0As the initial condition of the tested heat insulation material;
filling heat insulation outer layers at the periphery and the bottom surface of the test piece to construct heat insulation boundary conditions of the tested heat insulation material;
loading heat flow for the test piece by using a wind tunnel;
obtaining the upper surface temperature T of the measured thermal insulation material after the heat flow is loaded1(t) as a boundary condition for the temperature of the upper surface of the measured insulation material;
measuring actual temperatures T of N temperature measuring points after heat flow loading by using N thermocouplesf(XN,t)；
According to the boundary conditions of the thermal insulation, the initial conditions and the upper surface temperature, the measured thermal insulation material is subjected to a conjugate gradient method at the initial temperature T0Initial assumed value of thermal conductivity of0Performing optimization iteration to obtain a thermal conductivity optimized value, and calculating theoretical temperatures T of the N temperature measuring points according to the thermal conductivity optimized valueg(XNT) and then calculating the theoretical temperature Tg(XNT) and the actual temperature Tf(XNT) difference J (X)NT) up to the difference J (X)NAnd t) is smaller than a preset threshold value, and determining the corresponding thermal conductivity optimized value as the thermal conductivity test value of the tested thermal insulation material, wherein N is larger than or equal to 1.
Further, the height difference of every two adjacent temperature measuring points is 5 mm.
Further, the side length of the upper surface of the measured heat insulation material is not more than 200 mm.
Further, iteratively calculating a thermal conductivity optimized value according to a one-dimensional unsteady nonlinear thermal conductivity differential equation of the following formula:
wherein x represents the distance between any point on the measured heat-insulating material and the upper surface of the measured heat-insulating material, T (x, T) represents the temperature of the point x on the measured heat-insulating material at the moment T, rho (x, T) represents the density of the point x on the measured heat-insulating material at the point T, and cp(x, T) represents specific heat at a point x on the measured heat insulating material at a temperature of T, K (x, T) represents thermal conductivity at a point x on the measured heat insulating material at a temperature of T,
represents the change rate of the temperature T (x, T) of the measured heat-insulating material in the x direction,
represents the rate of change of the temperature T (x, T) of the measured insulation material over time T.
Further, the initial conditions were:
T(x,0)＝T0。
further, the adiabatic boundary conditions are:
further, the upper surface temperature boundary conditions are:
T(t)＝T1(t)，x＝0。
furthermore, the thermocouple is embedded in a manner that the thermocouple extends for a preset distance in the isothermal surface after being led out from the temperature measuring point.
Further, the material of the heat insulating outer layer is the same as that of the tested heat insulating material.
The invention provides a thermal conductivity testing method of a thermal insulation material based on a layered embedded thermocouple, which is characterized in that thermocouples are embedded between the thermal insulation material and an upper panel, between the thermal insulation material and a lower panel and at temperature measuring points at different depths in the thermal insulation material, a conjugate gradient method is utilized to optimize iteration, the thermal conductivity of the thermal insulation material to be tested is obtained through inverse identification, the measurement precision is high, the heating mechanism of the method is the same as the heating mechanism of an aircraft in a flying state, the accurate measurement of the thermal conductivity under the heating mode the same as the heating mechanism in practical application can be realized, and the method is suitable for the thermal conductivity test under the conditions of high altitude, high temperature and low pressure. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the error between the heat conductivity test result and the actual value of the heat conductivity in the flight state is larger due to the fact that the test method in the prior art is not suitable for a convection heating mode.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic flow chart illustrating a method for testing thermal conductivity of a layered embedded thermocouple-based insulating material according to an embodiment of the present invention;
FIG. 2 shows a schematic structural view of a test piece and an insulating outer layer provided according to a specific embodiment of the present invention;
wherein the figures include the following reference numerals:
101. an upper panel; 102. a lower panel; 103. a measured thermal insulation material; 104. a metal back plate; 105. measuring temperature points; 106. an insulating outer layer.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1, according to an embodiment of the present invention, there is provided a method for testing thermal conductivity of an insulating material based on a layered embedded thermocouple, the method comprising:
s1, arranging N temperature measuring points between the tested thermal insulation material and the upper panel arranged on the upper surface of the tested thermal insulation material, between the tested thermal insulation material and the lower panel arranged on the lower surface of the tested thermal insulation material and at different depths of the tested thermal insulation material in the test piece, embedding a thermocouple in each temperature measuring point, wherein the distance between the N temperature measuring points and the upper surface of the tested thermal insulation material is XN；
S2, obtaining the initial temperature T of the tested heat insulation material0As the initial condition of the tested heat insulation material;
s3, filling heat insulation outer layers at the periphery and the bottom of the test piece to construct heat insulation boundary conditions of the tested heat insulation material;
s4, loading heat flow for the test piece by using a wind tunnel;
s5, obtaining the tested heat insulation material after loading heat flowUpper surface temperature T of1(t) as a boundary condition for the temperature of the upper surface of the measured insulation material;
s6, measuring the actual temperature T of the N temperature measuring points after the heat flow is loaded by using N thermocouplesf(XN,t)；
S7, according to the boundary condition of the thermal insulation, the initial condition and the boundary condition of the upper surface temperature, the measured thermal insulation material is subjected to the initial temperature T by using the conjugate gradient method0Initial assumed value of thermal conductivity of0Performing optimization iteration to obtain a thermal conductivity optimized value, and calculating theoretical temperatures T of the N temperature measuring points according to the thermal conductivity optimized valueg(XNT) and then calculating the theoretical temperature Tg(XNT) and the actual temperature Tf(XNT) difference J (X)NT) up to the difference J (X)NAnd t) is smaller than a preset threshold value, and determining the corresponding thermal conductivity optimized value as the thermal conductivity test value of the tested thermal insulation material, wherein N is larger than or equal to 1.
In the present invention, the test piece and the outer heat insulating layer outside the test piece are constructed as shown in fig. 2, and the test piece includes an upper panel 101, a measured heat insulating material 103, a lower panel 102 and a metal back panel 104, which are sequentially laid from top to bottom. Temperature measuring points 105 can be arranged between the measured thermal insulation material 103 and the upper panel 101, between the measured thermal insulation material 103 and the lower panel 102 and in different depths inside the measured thermal insulation material 103 to obtain temperature change histories at different temperature measuring points 105, and the number of the temperature measuring points 105 is determined according to heat sinks of thermocouples, process constraints and actual needs. In order to improve the measurement accuracy, as shown in fig. 2, the connecting line of the temperature measuring points 105 is perpendicular to the upper surface of the measured thermal insulation material, and further, each temperature measuring point 105 is located at the center of the isothermal surface of the measured thermal insulation material where it is located. A one-dimensional like adiabatic heat transfer model was constructed by filling the adiabatic outer layer 106 around and at the bottom of the test piece.
By applying the method, the thermal conductivity of the thermal insulation material to be tested is obtained by embedding thermocouples between the thermal insulation material and the upper panel, between the thermal insulation material and the lower panel and at temperature measuring points with different depths in the thermal insulation material, optimizing iteration by using a conjugate gradient method and performing anti-identification, the measurement precision is high, the heating mechanism of the method is the same as that of an aircraft in a flying state, the thermal conductivity can be accurately measured in the heating mode which is the same as that of the actual application, and the method is suitable for testing the thermal conductivity under the conditions of high altitude, high temperature and low air pressure. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the error between the heat conductivity test result and the actual value of the heat conductivity in the flight state is larger due to the fact that the test method in the prior art is not suitable for a convection heating mode.
The depth distribution of the temperature measuring points in the measured heat insulation material is determined according to actual requirements, and as a specific embodiment of the invention, the height difference of every two adjacent temperature measuring points is 5 mm.
In order to ensure the measurement accuracy, the side length of the upper surface of the measured heat insulation material is not more than 200 mm.
According to the Fourier heat transfer theory, a conjugate gradient method is adopted, and a thermal conductivity optimized value is iteratively calculated according to a one-dimensional unsteady-state nonlinear thermal conductivity differential equation of the following formula:
wherein x represents the distance between any point on the measured heat-insulating material and the upper surface of the measured heat-insulating material, T (x, T) represents the temperature of the point x on the measured heat-insulating material at the moment T, rho (x, T) represents the density of the point x on the measured heat-insulating material at the point T, and cp(x, T) represents specific heat at a point x on the measured heat insulating material at a temperature of T, K (x, T) represents thermal conductivity at a point x on the measured heat insulating material at a temperature of T,
represents the change rate of the temperature T (x, T) of the measured heat-insulating material in the x direction,
represents the rate of change of the temperature T (x, T) of the measured insulation material over time T. c. Cp(x, T) and rho (x, T) as the measured heat-insulating materialThe physical property parameter (2) is a known amount.
Further, the initial conditions were:
T(x,0)＝T0。
the adiabatic boundary conditions were:
and the upper surface temperature boundary conditions are:
T(t)＝T1(t)，x＝0。
in the invention, the thermocouple is embedded in a way that the thermocouple extends for a preset distance in the isothermal surface after being led out from the temperature measuring point. Compared with the traditional vertical wiring mode, the wiring mode reduces the disturbance of the heat sink of the thermocouple to the temperature of the temperature measuring point on one hand, and also reduces the disturbance of the heat conduction of the thermocouple to the temperature of the temperature measuring point on the other hand, and the measured temperature is closer to the real temperature of the temperature measuring point.
In addition, the thermocouple, the upper panel, the thermal insulation material to be tested and the lower panel are integrally prepared in a pre-embedded mode, and compared with the traditional testing method in which the thermocouple is bonded on a test piece, the thermocouple testing device has the advantages that the heat sink of a temperature measuring point is smaller, the influence on the outer surface profile of the test piece is avoided, and the thermocouple testing device has better applicability.
In addition, the smaller the thermal conductivity of the heat insulating outer layer, the better, and as a specific example of the present invention, the material of the heat insulating outer layer is the same as that of the tested heat insulating material. The thickness of the insulating outer layer is determined according to the temperature of the metal back plate, and it is generally ensured that the heat conductivity of the metal back plate is less than 5% of the total injected heat, for example, the thickness of the insulating outer layer is 20mm in this embodiment.
In conclusion, the invention provides a thermal conductivity test method of a thermal insulation material based on a layered embedded thermocouple, which is characterized in that thermocouples are embedded between the thermal insulation material and an upper panel, between the thermal insulation material and a lower panel and at temperature measuring points with different depths in the thermal insulation material, a conjugate gradient method is utilized to optimize iteration, the thermal conductivity of the thermal insulation material to be tested is obtained through inverse identification, the measurement precision is higher, the heating mechanism of the method is the same as that of an aircraft in a flying state, the accurate measurement of the thermal conductivity under the heating mode which is the same as that of the heating mechanism in practical application can be realized, and the method is suitable for the thermal conductivity test under the conditions of high altitude. Compared with the prior art, the technical scheme of the invention can solve the technical problem that the error between the heat conductivity test result and the actual value of the heat conductivity in the flight state is larger due to the fact that the test method in the prior art is not suitable for a convection heating mode.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A thermal conductivity test method of a thermal insulation material based on a layered embedded thermocouple is characterized by comprising the following steps:
n temperature measuring points are arranged between a tested thermal insulation material and an upper panel arranged on the upper surface of the tested thermal insulation material, between the tested thermal insulation material and a lower panel arranged on the lower surface of the tested thermal insulation material and at different depths of the tested thermal insulation material in a test piece, a thermocouple is embedded in each temperature measuring point, and the distance from the N temperature measuring points to the upper surface of the tested thermal insulation material is XN；
Obtaining the initial temperature T of the tested heat-insulating material0As the initial condition of the measured thermal insulation material;
filling heat insulation outer layers at the periphery and the bottom surface of the test piece to construct heat insulation boundary conditions of the tested heat insulation material;
loading heat flow for the test piece by using a wind tunnel;
obtaining the upper surface temperature T of the measured thermal insulation material after the heat flow is loaded1(t) as a boundary condition for the temperature of the upper surface of the measured insulation material;
measuring the actual temperature T of the N temperature measuring points after the heat flow is loaded by using the N thermocouplesf(XN,t)；
According to the thermal insulation boundary condition, the initial condition and the upper surface temperature boundary condition, the measured thermal insulation material is subjected to a conjugate gradient method at the initial temperature T0Initial assumed value of thermal conductivity of0Carrying out optimization iteration to obtain a thermal conductivity optimized value, and calculating theoretical temperatures T of the N temperature measuring points according to the thermal conductivity optimized valueg(XNT) and calculating said theoretical temperature Tg(XNT) and the actual temperature Tf(XNT) difference J (X)NT) up to the difference J (X)NAnd t) is smaller than a preset threshold value, and determining the corresponding thermal conductivity optimized value as a thermal conductivity test value of the tested heat-insulating material, wherein N is larger than or equal to 1.
2. The method of claim 1, wherein the difference in height between every two adjacent temperature measurement points is 5 mm.
3. The thermal conductivity test method of claim 2, wherein the upper surface of the thermal insulation material under test has a side length of not more than 200 mm.
4. The thermal conductivity testing method of claim 3, wherein said thermal conductivity optimization value is iteratively calculated according to a one-dimensional unsteady-state nonlinear thermal conductivity differential equation of the formula:
wherein x represents the distance between any point on the measured heat-insulating material and the upper surface of the measured heat-insulating material, T (x, T) represents the temperature of the point x on the measured heat-insulating material at the moment T, rho (x, T) represents the density of the point x on the measured heat-insulating material at the point T, and cp(x, T) represents specific heat at a point x on the measured heat insulating material at a temperature of T, K (x, T) represents thermal conductivity at a point x on the measured heat insulating material at a temperature of T,
representing the rate of change of the temperature T (x, T) of the measured insulation material in the x direction,
represents the rate of change of the temperature T (x, T) of the measured insulation material over time T.
5. The thermal conductivity testing method of claim 4, wherein said initial conditions are:
T(x,0)＝T0。
6. the thermal conductivity testing method of claim 5, wherein said adiabatic boundary conditions are:
7. the thermal conductivity testing method of claim 6, wherein said upper surface temperature boundary conditions are:
T(t)＝T1(t)，x＝0。
8. the method for testing the thermal conductivity of the thermocouple according to claim 7, wherein the thermocouple is pre-embedded in a manner that the thermocouple extends for a predetermined distance in an isothermal plane after being led out from the temperature measuring point.
9. The thermal conductivity test method of claim 8, wherein the material of the outer thermally insulating layer is the same as the tested thermally insulating material.
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Application publication date: 20210618 |