CN112980144A - Photoelectromagnetic response epoxy glass polymer - Google Patents
Photoelectromagnetic response epoxy glass polymer Download PDFInfo
- Publication number
- CN112980144A CN112980144A CN202110205291.8A CN202110205291A CN112980144A CN 112980144 A CN112980144 A CN 112980144A CN 202110205291 A CN202110205291 A CN 202110205291A CN 112980144 A CN112980144 A CN 112980144A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- parts
- response
- inorganic filler
- glass polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 126
- 230000004044 response Effects 0.000 title claims abstract description 78
- 239000011521 glass Substances 0.000 title claims abstract description 39
- 229920000642 polymer Polymers 0.000 title claims abstract description 38
- 239000011256 inorganic filler Substances 0.000 claims abstract description 32
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000003054 catalyst Substances 0.000 claims abstract description 23
- 239000003085 diluting agent Substances 0.000 claims abstract description 22
- 239000002245 particle Substances 0.000 claims description 18
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004246 zinc acetate Substances 0.000 claims description 3
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims description 2
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 claims description 2
- 230000002441 reversible effect Effects 0.000 abstract description 7
- 238000004132 cross linking Methods 0.000 abstract description 6
- 229920002521 macromolecule Polymers 0.000 abstract description 6
- 230000006798 recombination Effects 0.000 abstract description 4
- 238000005215 recombination Methods 0.000 abstract description 4
- 230000000638 stimulation Effects 0.000 abstract description 3
- 230000004043 responsiveness Effects 0.000 description 30
- 238000003466 welding Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 8
- 238000012958 reprocessing Methods 0.000 description 7
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 230000008439 repair process Effects 0.000 description 4
- 239000004634 thermosetting polymer Substances 0.000 description 4
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical group C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- YYSCJLLOWOUSHH-UHFFFAOYSA-N 4,4'-disulfanyldibutanoic acid Chemical group OC(=O)CCCSSCCCC(O)=O YYSCJLLOWOUSHH-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid group Chemical group C(CCCCC(=O)O)(=O)O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid group Chemical group C(CCCCCCCCC(=O)O)(=O)O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000009757 thermoplastic moulding Methods 0.000 description 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical group CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- HRWYHCYGVIJOEC-UHFFFAOYSA-N 2-(octoxymethyl)oxirane Chemical group CCCCCCCCOCC1CO1 HRWYHCYGVIJOEC-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4207—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a photoelectric magnetic response epoxy glass polymer which comprises, by weight, 50-100 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-30 parts of epoxy diluent, 5-100 parts of inorganic filler and 0-5 parts of catalyst. The epoxy glass macromolecules with the photoelectromagnetic response can drive reversible exchange reaction of dynamic ester bonds or disulfide bonds, exchange of polymer chain segments and recombination of a crosslinking network under specific laser, voltage/current or an alternating magnetic field, so that the epoxy glass macromolecules can be repaired and welded under various external stimulations of photoelectromagnetics.
Description
Technical Field
The invention belongs to the field of high polymer materials, and particularly relates to a photoelectric-magnetic-response epoxy glass polymer.
Background
Epoxy polymers, a typical thermosetting polymer, are widely used because of excellent mechanical properties, excellent structural stability and good solvent resistance. However, after complete curing, the epoxy forms a three-dimensional crosslinked network, which becomes a three-dimensional crosslinked structure, is fixed in shape, and cannot be deformed any more. Unlike thermosetting polymers such as epoxy, linear or branched thermoplastic polymers such as polyethylene or polypropylene can be made to flow and be molded many times in a solvent or at high temperature, but their mechanical properties, structural stability, heat resistance and solvent resistance are far inferior to those of thermosetting polymers such as epoxy.
In this context, epoxy glass polymers (vitrimmers) have been designed in order to combine the advantages of stable thermoset polymer structures and removability of thermoplastic polymers. The epoxy material has the advantages of stable thermosetting polymer structure, excellent mechanical property, solvent resistance and the like, and simultaneously has the characteristics of thermal repairability and thermal remolding molding of the thermoplastic polymer. The above characteristics of the epoxy glass macromolecules mainly come from the introduction of reversible exchange dynamic bonds in a cross-linked network, and the reversible exchange dynamic bonds can generate reversible exchange reaction at high temperature, so that the cross-linked network realizes the exchange of polymer chain segments and the recombination of the cross-linked network on the premise of not breaking. Since the exchange reaction does not cause depolymerization of the crosslinked network nor decrease the crosslinking density of the network, the epoxy glass polymer always maintains excellent structural stability and solvent resistance. Due to the thermal responsiveness of reversible exchange dynamic bonds, epoxy glass polymers have thermal responsiveness and can be thermally restored and subjected to thermoplastic molding at high temperatures (Science,2011,334, 965-.
However, epoxy glass polymers (vitrimmers) with single thermal response can only realize restoration and plastic forming under the temperature stimulation condition, but cannot realize restoration and plastic forming under various external stimulation conditions of other light, electricity and magnetism.
Disclosure of Invention
The present invention aims to provide an epoxy glass polymer (vitrimer) having both of a photo-electromagnetic response. Due to the photoelectric and magnetic responsiveness, the epoxy glass polymer (vitrimer) can be repaired and welded under high temperature, laser, voltage/current or magnetic field respectively. In order to achieve the technical effects, the invention provides the following technical scheme:
the photoelectromagnetic response epoxy glass macromolecule is composed of, by weight, 50-100 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-30 parts of epoxy diluent, 5-100 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
The further technical scheme is that the photoelectromagnetic response epoxy glass polymer comprises, by weight, 50-100 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-20 parts of epoxy diluent, 5-50 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
The further technical scheme is that the photoelectromagnetic response epoxy glass polymer comprises, by weight, 50-90 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-20 parts of epoxy diluent, 5-30 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
The further technical scheme is that the photoelectromagnetic response epoxy glass polymer comprises, by weight, 50-80 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-20 parts of epoxy diluent, 5-30 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
The further technical proposal is that the Fe3O4The size of the particles is between 20nm-100 um.
The further technical scheme is that the epoxy resin is diglycidyl ether or diglycidyl ester, and the epoxy curing agent is dicarboxylic acid or dithiodiphenylamine.
The further technical scheme is that the epoxy diluent is monoglycidyl ether or monoglycidyl ester, and the catalyst is any one of zinc acetate, zinc acetylacetonate, triphenylphosphine or triazabicyclo.
Compared with the prior art, the invention has the following beneficial effects: the photoelectromagnetic response epoxy glass macromolecule (vitrimer) is an opaque epoxy material, a large number of reversibly exchanged dynamic ester bonds or disulfide bonds exist in a crosslinking network of the photoelectromagnetic response epoxy glass macromolecule (vitrimer), and reversible exchange reaction can occur at high temperature, so that exchange of polymer chain segments and recombination of the crosslinking network are realized, and thermal repair and thermoplastic molding of epoxy are realized while a crosslinking structure is maintained. Meanwhile, in the filler network of the photoelectromagnetic response epoxy glass polymer (vitrimer), inorganic filler Fe exists3O4The particles can convert light energy, electric energy and magnetic energy with specific wavelength into heat energy, so that the epoxy glass polymer (vitrimer) has photoelectric and magnetic responsiveness, and can drive reversible exchange reaction of dynamic ester bonds or disulfide bonds, exchange of polymer chain segments and recombination of a crosslinking network under specific laser, voltage/current or a magnetic field, thereby realizing the repair and plastic molding of the epoxy glass polymer (vitrimer) under various external stimuli of photoelectromagnetism.
Drawings
FIG. 1 is a thermal infrared imaging diagram and a temperature schematic diagram of a photo-electromagnetic response epoxy vitrimer under 808nm infrared laser irradiation;
FIG. 2 is a schematic diagram of repeated self-repairing of microcracks of a photo-electromagnetic response epoxy vitrimer under 808nm infrared laser irradiation;
FIG. 3 is a schematic view of a cross-section damage welding repair of a photo-electromagnetic response epoxy vitrimer under 808nm infrared laser irradiation;
FIG. 4 is a schematic diagram of the drivability of a photo-electromagnetic response epoxy vitrimer under a constant magnetic field and the contact maintenance of a fracture surface damage;
FIG. 5 is a schematic diagram of a photoelectric magnetic response epoxy vitrimer repairing a fracture surface damage under a magnetic field.
Detailed Description
The technical solution of the present invention is not limited to the following embodiments, but includes any combination of the embodiments.
Example 1
The invention relates to a photoelectromagnetic response epoxy glass polymer (vitrimer), which consists of 50-80 parts of epoxy resin, 20-40 parts of epoxy curing agent, 0 part of epoxy diluent, 5 parts of inorganic filler and 5 parts of catalyst in parts by weight.
The epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is sebacic acid, and the inorganic filler is Fe3O4Particles having a size of 20nm, the catalyst being a triazabicyclo.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 2
The invention relates to a photoelectromagnetic response epoxy glass polymer (vitrimer), which consists of 50-80 parts of epoxy resin, 20-40 parts of epoxy curing agent, 10 parts of epoxy diluent, 5 parts of inorganic filler and 5 parts of catalyst in parts by weight.
The epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is adipic acid, the epoxy diluent is octyl glycidyl ether, and the inorganic filler is Fe3O4Particles having a size of 50nm, the catalyst being zinc acetate.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 3
The photoelectromagnetic response epoxy glass polymer (vitrimer) is composed of 80-100 parts by weight of epoxy resin, 40-60 parts by weight of epoxy curing agent, 10 parts by weight of epoxy diluent, 10 parts by weight of inorganic filler and 0 part by weight of catalyst;
the epoxy resin is bisphenol F diglycidyl ether, the epoxy curing agent is 4, 4-dithio-dibutyric acid, the epoxy diluent is phenyl glycidyl ether, and the inorganic filler is Fe3O4Particles having a size of 50 nm.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 4
The photoelectromagnetic response epoxy glass polymer (vitrimer) is composed of 80-100 parts by weight of epoxy resin, 40-60 parts by weight of epoxy curing agent, 20 parts by weight of epoxy diluent, 10 parts by weight of inorganic filler and 5 parts by weight of catalyst;
the epoxy resin is bisphenol A diglycidyl ester, the epoxy curing agent is 4, 4-dithiodibutanoic acid, the epoxy diluent is phenyl glycidyl ether, and the inorganic filler is Fe3O4Particles having a size of 100nm, the catalyst being a triazabicyclo.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 5
The photoelectromagnetic response epoxy glass polymer (vitrimer) is composed of 50-60 parts by weight of epoxy resin, 20-60 parts by weight of epoxy curing agent, 10 parts by weight of epoxy diluent, 20 parts by weight of inorganic filler and 0 part by weight of catalyst;
the epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is 4, 4-dithiodiphenylamine, the epoxy diluent is butyl glycidyl ether, and the inorganic filler is Fe3O4Particles having a size of 20 nm.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 6
The photoelectromagnetic response epoxy glass polymer (vitrimer) is composed of 50-60 parts of epoxy resin, 20-60 parts of epoxy curing agent, 30 parts of epoxy diluent, 30 parts of inorganic filler and 2 parts of catalyst according to parts by weight;
the epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is 3, 3-dithiodiphenylamine, the epoxy diluent is phenyl glycidyl ether, and the inorganic filler is Fe3O4Particles having a size of 200nm, the catalyst being a triazabicyclo.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-responsiveness, and under the irradiation of 808nm infrared laser, the temperature of the material is raised to 100-300 ℃ or above in a short time, so that the self-repairing of microcracks can be realized, and the photo-responsiveness is presented.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks after being electrified, and shows the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, can be driven in a magnetic field, can realize the self-repairing of microcracks in an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, the good contact of the interface can be kept, so that the self-repairing of the interface is realized at high temperature (100-300 ℃ and above).
Example 7
The photoelectromagnetic response epoxy glass polymer (vitrimer) is composed of 50-60 parts of epoxy resin, 20-60 parts of epoxy curing agent, 5 parts of inorganic filler and 5 parts of catalyst according to parts by weight;
the epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is 4, 4-dithio-dibutyric acid, and the inorganic filler is Fe3O4Particles having a size of 20nm, the catalyst being a triazabicyclo.
The epoxy vitrimer with the photo-electromagnetic response has the thermal response, and can realize self-repairing, welding and reprocessing molding of cracks at high temperature (100-300 ℃ and above).
The epoxy vitrimer with the photo-electromagnetic response has the photo-response, and the temperature of the material is raised to 100-300 ℃ or above in a short time under the irradiation of 808nm infrared laser, as shown in figure 1. Under the irradiation of the infrared laser with the wavelength of 808nm, the self-repairing of the microcrack can be realized, as shown in figure 2. Under the irradiation of 808nm infrared laser, the welding repair of the cross section can be realized, as shown in figure 3.
The epoxy vitrimer with the photo-electromagnetic response has the electric responsiveness, can generate current under the voltage of 0.1-220V and higher, has excellent conductivity, can realize self-repairing of local microcracks by means of the heat effect of the current after electrification, and presents the electric responsiveness.
The epoxy vitrimer with the photo-electromagnetic response has the magnetic response, as shown in fig. 4, can be driven under a magnetic field, can realize self-repairing of microcracks under an alternating magnetic field, and shows the magnetic response. In addition, under a constant magnetic field, good contact of the interface can be maintained, so that self-repairing of the damaged interface is realized at a high temperature (100-300 ℃ and above), as shown in FIG. 5.
Although the present invention has been described herein with reference to the illustrated embodiments thereof, which are intended to be preferred embodiments of the present invention, it is to be understood that the invention is not limited thereto, and that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure.
Claims (7)
1. The photoelectromagnetic response epoxy glass polymer is characterized by comprising, by weight, 50-100 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-30 parts of epoxy diluent, 5-100 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
2. The photoelectromagnetically-responsive epoxy glass polymer as claimed in claim 1, wherein the photoelectromagnetically-responsive epoxy glass polymer comprises, by weight, 50-100 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-20 parts of epoxy diluent, 5-50 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
3. The photoelectromagnetically-responsive epoxy glass polymer according to claim 2, wherein the photoelectromagnetically-responsive epoxy glass polymer is produced according toThe weight portion of the material is composed of 50-90 portions of epoxy resin, 20-60 portions of epoxy curing agent, 0-20 portions of epoxy diluent, 5-30 portions of inorganic filler and 0-5 portions of catalyst, wherein the inorganic filler is Fe3O4Particles.
4. The photoelectromagnetically-responsive epoxy glass polymer as claimed in claim 3, wherein the photoelectromagnetically-responsive epoxy glass polymer comprises, by weight, 50-80 parts of epoxy resin, 20-60 parts of epoxy curing agent, 0-20 parts of epoxy diluent, 5-30 parts of inorganic filler and 0-5 parts of catalyst, wherein the inorganic filler is Fe3O4Particles.
5. The photoelectromagnetically-responsive epoxy glass polymer according to any one of claims 1 to 4, wherein the Fe is3O4The size of the particles is between 20nm-100 um.
6. The optoelectromagnetic-responsive epoxy glass polymer according to any one of claims 1 to 4, wherein the epoxy resin is diglycidyl ether or diglycidyl ester, and the epoxy curing agent is dicarboxylic acid or dithiodiphenylamine.
7. The optoelectromagnetic response epoxy glass polymer of any one of claims 1 to 4, wherein the epoxy diluent is monoglycidyl ether or monoglycidyl ester, and the catalyst is any one of zinc acetate, zinc acetylacetonate, triphenylphosphine, or triazabicyclo.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110205291.8A CN112980144A (en) | 2021-02-24 | 2021-02-24 | Photoelectromagnetic response epoxy glass polymer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110205291.8A CN112980144A (en) | 2021-02-24 | 2021-02-24 | Photoelectromagnetic response epoxy glass polymer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112980144A true CN112980144A (en) | 2021-06-18 |
Family
ID=76350021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110205291.8A Pending CN112980144A (en) | 2021-02-24 | 2021-02-24 | Photoelectromagnetic response epoxy glass polymer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112980144A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355039A (en) * | 2021-07-14 | 2021-09-07 | 中国工程物理研究院化工材料研究所 | Epoxy potting electronic component capable of repairing cracks in situ and being disassembled without damage |
| CN113980299A (en) * | 2021-08-12 | 2022-01-28 | 清华大学 | Method for preparing glass-like high polymer material product |
| CN114891320A (en) * | 2022-05-07 | 2022-08-12 | 重庆国际复合材料股份有限公司 | Epoxy resin/chopped glass fiber composite material and preparation method thereof |
| WO2023123845A1 (en) * | 2021-12-27 | 2023-07-06 | 西安隆基乐叶光伏科技有限公司 | Epoxy resin composition, cured epoxy resin composition, slurry and preparation method therefor, and electrode |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408680A (en) * | 2011-09-01 | 2012-04-11 | 西北工业大学 | Thermosetting resin able to realize high temperature heating and curing in high frequency magnetic field and preparation method thereof |
| CN104109329A (en) * | 2014-08-14 | 2014-10-22 | 哈尔滨工业大学 | Multi-stimulated and recovery-adjustable shape memory composite and preparation method thereof |
| CN104744922A (en) * | 2015-03-27 | 2015-07-01 | 同济大学 | Method for preparing magneto type biodegradable shape-memory-polymer nano composite material |
| CN105505128A (en) * | 2016-02-23 | 2016-04-20 | 南京工业大学 | Near-infrared light response self-repairing coating and preparation method thereof |
| CN109963702A (en) * | 2016-11-22 | 2019-07-02 | 默克专利股份有限公司 | For laser marking and the additive of the welding polymer material of laser |
| CN110627998A (en) * | 2019-10-14 | 2019-12-31 | 中国工程物理研究院化工材料研究所 | Method for regulating and controlling stress relaxation and reprocessing molding temperature of glass-like polymer material through dynamic bond content |
| CN112980165A (en) * | 2021-02-25 | 2021-06-18 | 四川大学 | Self-repairing shape memory composite material with photo-magnetic response and preparation and application thereof |
-
2021
- 2021-02-24 CN CN202110205291.8A patent/CN112980144A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408680A (en) * | 2011-09-01 | 2012-04-11 | 西北工业大学 | Thermosetting resin able to realize high temperature heating and curing in high frequency magnetic field and preparation method thereof |
| CN104109329A (en) * | 2014-08-14 | 2014-10-22 | 哈尔滨工业大学 | Multi-stimulated and recovery-adjustable shape memory composite and preparation method thereof |
| CN104744922A (en) * | 2015-03-27 | 2015-07-01 | 同济大学 | Method for preparing magneto type biodegradable shape-memory-polymer nano composite material |
| CN105505128A (en) * | 2016-02-23 | 2016-04-20 | 南京工业大学 | Near-infrared light response self-repairing coating and preparation method thereof |
| CN109963702A (en) * | 2016-11-22 | 2019-07-02 | 默克专利股份有限公司 | For laser marking and the additive of the welding polymer material of laser |
| CN110627998A (en) * | 2019-10-14 | 2019-12-31 | 中国工程物理研究院化工材料研究所 | Method for regulating and controlling stress relaxation and reprocessing molding temperature of glass-like polymer material through dynamic bond content |
| CN112980165A (en) * | 2021-02-25 | 2021-06-18 | 四川大学 | Self-repairing shape memory composite material with photo-magnetic response and preparation and application thereof |
Non-Patent Citations (4)
| Title |
|---|
| 杨洋，等: "环氧树脂基类玻璃高分子（Vitrimer）复合材料", 《中国优秀博硕士学位论文全文数据库(博士)工程科技Ⅰ辑》 * |
| 游敏，等编著: "《胶接强度分析及应用》", 30 April 2009, 华中科技大学出版社 * |
| 程晓敏，等编著: "《高分子材料导论》", 31 August 2006, 安徽大学出版社 * |
| 陆昕: "聚合物基高介电材料的三相复合和改性研究", 《中国优秀博硕士学位论文全文数据库(硕士)基础科学辑》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355039A (en) * | 2021-07-14 | 2021-09-07 | 中国工程物理研究院化工材料研究所 | Epoxy potting electronic component capable of repairing cracks in situ and being disassembled without damage |
| CN113980299A (en) * | 2021-08-12 | 2022-01-28 | 清华大学 | Method for preparing glass-like high polymer material product |
| WO2023123845A1 (en) * | 2021-12-27 | 2023-07-06 | 西安隆基乐叶光伏科技有限公司 | Epoxy resin composition, cured epoxy resin composition, slurry and preparation method therefor, and electrode |
| CN114891320A (en) * | 2022-05-07 | 2022-08-12 | 重庆国际复合材料股份有限公司 | Epoxy resin/chopped glass fiber composite material and preparation method thereof |
| CN114891320B (en) * | 2022-05-07 | 2023-09-19 | 重庆国际复合材料股份有限公司 | Epoxy resin/chopped glass fiber composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112980144A (en) | Photoelectromagnetic response epoxy glass polymer | |
| Li et al. | Lignin: a sustainable photothermal block for smart elastomers | |
| Zhong et al. | Self-repair of structural and functional composites with intrinsically self-healing polymer matrices: A review | |
| US20080216894A1 (en) | Quantum dot photovoltaic device | |
| JP5898097B2 (en) | Method for preparing conductive adhesive between solar cells | |
| AT411305B (en) | Post-treatment method for photovoltaic cell using thermal treatment at temperature above glass transition temperature of electron donor | |
| CN105542138A (en) | Preparation method of polyester chip for solar battery back film | |
| US8450136B2 (en) | Methods of manufacturing solar energy modules | |
| CN106818334B (en) | High-reflection degradable mulching film | |
| Chen et al. | Multi-functional epoxy vitrimers: Controllable dynamic properties, multiple-stimuli response, crack-healing and fracture-welding | |
| TWI531599B (en) | Composites | |
| US20190344502A1 (en) | Three dimensional printer apparatus | |
| CN111499837B (en) | Self-repairing in-situ fluorescent tracing type heat-resistant weather-resistant epoxy resin and preparation method thereof | |
| TW201544630A (en) | Transparent electrode and organic electronic device | |
| CN104725786A (en) | Self-repairing polymer material and repairing method thereof | |
| CN102637762B (en) | Solar cell frame and preparation method thereof | |
| Du et al. | A review of polypropylene and polypropylene/inorganic nanocomposites for HVDC cable insulation | |
| CN107418158B (en) | Flat fiber modified polyester composite material for welding with improved laser transparency | |
| WO2015182282A1 (en) | Polyester film for solar cell back sheets | |
| CN216610120U (en) | Hot melt welding equipment for plastic structural part | |
| CN105985622A (en) | PC-PET ((polycarbonate and polyethylene terephthalate) based LED radiating material comprising modified carbon black and carbon nanotubes and preparation method thereof | |
| Li et al. | Full-life-cycle eco-friendly polymeric insulating materials: research progress and future prospects | |
| CN111200034B (en) | Crystalline silicon photovoltaic module suitable for complex change electromagnetic environment | |
| EP3695932A1 (en) | Method for producing a bonded body of different materials | |
| CN111647215A (en) | Graphene floating body for floating system of offshore photovoltaic power station |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210618 |