CN112980142A - Preparation method and application of insulating high-thermal-conductivity plastic particles - Google Patents
Preparation method and application of insulating high-thermal-conductivity plastic particles Download PDFInfo
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- 239000004033 plastic Substances 0.000 title claims abstract description 36
- 229920003023 plastic Polymers 0.000 title claims abstract description 36
- 239000002245 particle Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 15
- 239000011858 nanopowder Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000004643 cyanate ester Substances 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- QOKYJGZIKILTCY-UHFFFAOYSA-J hydrogen phosphate;zirconium(4+) Chemical compound [Zr+4].OP([O-])([O-])=O.OP([O-])([O-])=O QOKYJGZIKILTCY-UHFFFAOYSA-J 0.000 claims abstract description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 11
- TUUQISRYLMFKOG-UHFFFAOYSA-N trihexyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCCCCCOC(=O)CC(C(=O)OCCCCCC)(OC(C)=O)CC(=O)OCCCCCC TUUQISRYLMFKOG-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910000166 zirconium phosphate Inorganic materials 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 8
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 8
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 238000005303 weighing Methods 0.000 claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 24
- 229910052582 BN Inorganic materials 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- SESFRYSPDFLNCH-UHFFFAOYSA-N benzyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 9
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- 229960002903 benzyl benzoate Drugs 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000967 suction filtration Methods 0.000 claims description 6
- 239000006228 supernatant Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 208000003251 Pruritus Diseases 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 239000012065 filter cake Substances 0.000 claims description 3
- 238000007710 freezing Methods 0.000 claims description 3
- 230000008014 freezing Effects 0.000 claims description 3
- 238000003760 magnetic stirring Methods 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002086 nanomaterial Substances 0.000 abstract description 4
- 239000002322 conducting polymer Substances 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229920000891 common polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a preparation method of insulating high-thermal-conductivity plastic particles, which comprises the following steps of weighing epoxy resin EP, cyanate ester resin, nano powder, modified filler, adhesive, acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, antioxidant and compatilizer in parts by weight; adding the nano powder and the modified filler into a high-speed mixer together, and mixing to obtain a first mixture; wherein the nano powder is hexagonal boron nitride nano powder; and the modified filler is modified nano silicon dioxide; adding the first mixture, epoxy resin EP and cyanate ester resin into a high-speed mixer together, uniformly mixing, then keeping the temperature, adding acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, an antioxidant and a compatilizer, and stirring to obtain a second mixture; and extruding and granulating the second mixture to obtain the high-thermal-conductivity insulating plastic particles. The heat-conducting plastic disclosed by the invention is relatively good in insulating property and mechanical property, stable and uniform in heat-conducting property, and particularly can develop a good way for applying the nano material to high-performance plastic products.
Description
Technical Field
The invention relates to a preparation method and application of insulating high-thermal-conductivity plastic particles, belonging to the technical field of plastic particles.
Background
The heat-conducting polymer materials widely used in industry at present comprise heat-conducting composite plastics, heat-conducting adhesives, heat-conducting coatings, heat-conducting copper-clad plates, various heat-conducting rubbers and elastomers, such as thermal interface elastomers and the like. At present, the composite insulating and heat conducting polymer is mainly formed by compounding insulating and heat conducting inorganic particles such as boron nitride, silicon nitride, aluminum oxide and the like with different polymer matrixes; in addition, the heat-conducting polymer prepared by compounding the conductor particles and the polymer, such as a carbon material and a metal-filled heat-conducting high polymer material, is suitable for low-insulation or non-insulation heat-conducting occasions. The heat-conducting polymer is only applied to packaging, electrical insulation and heat dissipation of equipment such as power electronic components, motors and the like, and has heat conductivity 4-10 times that of common polymers. In the prior art, the insulating property and the mechanical property of the heat-conducting plastic are relatively poor, the heat-conducting property is unstable and uniform, and particularly, a good path for applying the nano material to a high-performance plastic product cannot be developed. Therefore, a method for preparing insulating high thermal conductivity plastic particles and the use thereof are urgently needed to solve the problem existing in the prior art.
In order to solve the technical problems, a new technical scheme is especially provided.
Disclosure of Invention
The present invention aims to provide a method for preparing insulating high thermal conductivity plastic particles and the use thereof, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a method for preparing insulating high thermal conductivity plastic particles, the method comprising the steps of:
weighing epoxy resin EP, cyanate ester resin, nano powder, modified filler, adhesive, acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, antioxidant and compatilizer according to parts by weight;
adding the nano powder and the modified filler into a high-speed mixer together, and mixing to obtain a first mixture; wherein the nano powder is hexagonal boron nitride nano powder; and the modified filler is modified nano silicon dioxide;
adding the first mixture, epoxy resin EP and cyanate ester resin into a high-speed mixer together, uniformly mixing, then keeping the temperature, adding acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, an antioxidant and a compatilizer, and continuously stirring and mixing for 20-30 min to obtain a second mixture;
and step four, extruding and granulating the second mixture through an extruder to obtain the high-thermal-conductivity insulating plastic particles.
Preferably, in the second step, the preparation of the hexagonal boron nitride nanopowder comprises the following steps:
s1, adding the hexagonal boron nitride micro powder into ethanol, performing ultrasonic dispersion for 10-15min to obtain a milky liquid, adding the milky liquid into a three-neck flask, adding a KOH solution, performing magnetic stirring at 90-103 ℃ in a silicon oil bath, performing reflux reaction for 13-16h, distilling out ethanol, and performing suction filtration on the obtained solution to obtain a hydroxylated hexagonal boron nitride filter cake;
s2, adding hydroxylated hexagonal boron nitride into benzyl benzoate, performing wet ball milling for 13-16h through a sand mill, then filling into a bottle container, and sealing; wherein the addition amount of benzyl benzoate is 1.9 times of the amount of hydroxylated hexagonal boron nitride;
s3, heating to 50-60 ℃ through a water bath, immediately placing in a low-temperature refrigerator at-38 ℃ to-25 ℃, freezing for 9-11h, naturally heating to room temperature, performing wet ball milling for 13-16h, adding N, N-dimethylacetamide, and performing ultrasonic treatment for 1-3h by using an ultrasonic cell crusher to obtain a mixed dispersed solution of hexagonal boron nitride; the addition amount of the N, N-dimethylacetamide is 1-1.5 times of the amount of the hydroxylated hexagonal boron nitride in the step S2;
s4, centrifuging the dispersed solution, collecting supernatant, and cleaning and drying the supernatant to obtain hexagonal boron nitride nano powder; the drying process adopts a vacuum drying oven to dry for 13-15h at 35-45 ℃.
Preferably, the coating comprises, by weight, 25-45 parts of epoxy resin, 20-35 parts of cyanate ester resin, 2-12 parts of nano powder, 6-14 parts of modified filler, 1-3 parts of adhesive, 1-3 parts of acetyl tri-n-hexyl citrate, 1-3 parts of zirconium hydrogen phosphate, 1-2 parts of anti-itching agent and 1-2 parts of compatilizer.
Preferably, the preparation method of the modified nano-silica in the second step comprises the following steps: adding nano SiO2 powder into an ethanol solution, adding vinyl tri (beta-methoxyethoxy) silane and 1, 6-hexanediol diglycidyl ether, stirring and dispersing at 55-60 ℃ for 35-45min, cooling to room temperature, performing ultrasonic oscillation for 0.5-0.7h, performing suction filtration, washing with ethanol, and drying in a vacuum box at 80 ℃ for 1-1.5h to obtain the modified nano silicon dioxide.
Preferably, the mixing temperature in the high-speed mixer in the second step is 70-90 ℃, and the adhesive is added and stirred at a high speed for 20-40 min.
Preferably, in the third step, the first mixture, the epoxy resin EP and the cyanate ester resin are added into a high-speed mixer together, and are uniformly mixed at 125-155 ℃.
Preferably, in the fourth step, the second mixture is extruded and granulated by an extruder at a temperature of 122-140 ℃ to obtain the high thermal conductivity insulating plastic particles.
Preferably, the insulating high thermal conductive plastic particles are applied to buildings, automobiles or ships.
Compared with the prior art, the invention has the beneficial effects that: the heat-conducting plastic has relatively good insulating property and mechanical property, and stable and uniform heat-conducting property, and particularly, can develop a good way for applying the nano material to high-performance plastic products.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a method for preparing insulating high thermal conductivity plastic particles, the method comprising the steps of:
weighing epoxy resin EP, cyanate ester resin, nano powder, modified filler, adhesive, acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, antioxidant and compatilizer according to parts by weight;
adding the nano powder and the modified filler into a high-speed mixer together, and mixing to obtain a first mixture; wherein the nano powder is hexagonal boron nitride nano powder; and the modified filler is modified nano silicon dioxide;
adding the first mixture, epoxy resin EP and cyanate ester resin into a high-speed mixer together, uniformly mixing, then keeping the temperature, adding acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, an antioxidant and a compatilizer, and continuously stirring and mixing for 20-30 min to obtain a second mixture;
and step four, extruding and granulating the second mixture through an extruder to obtain the high-thermal-conductivity insulating plastic particles.
Preferably, in the second step, the preparation of the hexagonal boron nitride nanopowder comprises the following steps:
s1, adding the hexagonal boron nitride micro powder into ethanol, performing ultrasonic dispersion for 10-15min to obtain a milky liquid, adding the milky liquid into a three-neck flask, adding a KOH solution, performing magnetic stirring at 90-103 ℃ in a silicon oil bath, performing reflux reaction for 13-16h, distilling out ethanol, and performing suction filtration on the obtained solution to obtain a hydroxylated hexagonal boron nitride filter cake;
s2, adding hydroxylated hexagonal boron nitride into benzyl benzoate, performing wet ball milling for 13-16h through a sand mill, then filling into a bottle container, and sealing; wherein the addition amount of benzyl benzoate is 1.9 times of the amount of hydroxylated hexagonal boron nitride;
s3, heating to 50-60 ℃ through a water bath, immediately placing in a low-temperature refrigerator at-38 ℃ to-25 ℃, freezing for 9-11h, naturally heating to room temperature, performing wet ball milling for 13-16h, adding N, N-dimethylacetamide, and performing ultrasonic treatment for 1-3h by using an ultrasonic cell crusher to obtain a mixed dispersed solution of hexagonal boron nitride; the addition amount of the N, N-dimethylacetamide is 1-1.5 times of the amount of the hydroxylated hexagonal boron nitride in the step S2;
s4, centrifuging the dispersed solution, collecting supernatant, and cleaning and drying the supernatant to obtain hexagonal boron nitride nano powder; the drying process adopts a vacuum drying oven to dry for 13-15h at 35-45 ℃.
Preferably, the coating comprises, by weight, 25-45 parts of epoxy resin, 20-35 parts of cyanate ester resin, 2-12 parts of nano powder, 6-14 parts of modified filler, 1-3 parts of adhesive, 1-3 parts of acetyl tri-n-hexyl citrate, 1-3 parts of zirconium hydrogen phosphate, 1-2 parts of anti-itching agent and 1-2 parts of compatilizer.
Preferably, the preparation method of the modified nano-silica in the second step comprises the following steps: adding nano SiO2 powder into an ethanol solution, adding vinyl tri (beta-methoxyethoxy) silane and 1, 6-hexanediol diglycidyl ether, stirring and dispersing at 55-60 ℃ for 35-45min, cooling to room temperature, performing ultrasonic oscillation for 0.5-0.7h, performing suction filtration, washing with ethanol, and drying in a vacuum box at 80 ℃ for 1-1.5h to obtain the modified nano silicon dioxide.
Preferably, the mixing temperature in the high-speed mixer in the second step is 70-90 ℃, and the adhesive is added and stirred at a high speed for 20-40 min.
Preferably, in the third step, the first mixture, the epoxy resin EP and the cyanate ester resin are added into a high-speed mixer together, and are uniformly mixed at 125-155 ℃.
Preferably, in the fourth step, the second mixture is extruded and granulated by an extruder at a temperature of 122-140 ℃ to obtain the high thermal conductivity insulating plastic particles.
Preferably, the insulating high thermal conductive plastic particles are applied to buildings, automobiles or ships.
Compared with the prior art, the invention has the beneficial effects that: the heat-conducting plastic has relatively good insulating property and mechanical property, and stable and uniform heat-conducting property, and particularly, can develop a good way for applying the nano material to high-performance plastic products.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A method for preparing insulated high thermal conductivity plastic particles, which is characterized by comprising the following steps:
weighing epoxy resin EP, cyanate ester resin, nano powder, modified filler, adhesive, acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, antioxidant and compatilizer according to parts by weight;
adding the nano powder and the modified filler into a high-speed mixer together, and mixing to obtain a first mixture; wherein the nano powder is hexagonal boron nitride nano powder; and the modified filler is modified nano silicon dioxide;
adding the first mixture, epoxy resin EP and cyanate ester resin into a high-speed mixer together, uniformly mixing, then keeping the temperature, adding acetyl tri-n-hexyl citrate, zirconium hydrogen phosphate, an antioxidant and a compatilizer, and continuously stirring and mixing for 20-30 min to obtain a second mixture;
and step four, extruding and granulating the second mixture through an extruder to obtain the high-thermal-conductivity insulating plastic particles.
2. The method for preparing insulating high thermal conductivity plastic particles according to claim 1, wherein: in the second step, the preparation of the hexagonal boron nitride nanopowder comprises the following steps:
s1, adding the hexagonal boron nitride micro powder into ethanol, performing ultrasonic dispersion for 10-15min to obtain a milky liquid, adding the milky liquid into a three-neck flask, adding a KOH solution, performing magnetic stirring at 90-103 ℃ in a silicon oil bath, performing reflux reaction for 13-16h, distilling out ethanol, and performing suction filtration on the obtained solution to obtain a hydroxylated hexagonal boron nitride filter cake;
s2, adding hydroxylated hexagonal boron nitride into benzyl benzoate, performing wet ball milling for 13-16h through a sand mill, then filling into a bottle container, and sealing; wherein the addition amount of benzyl benzoate is 1.9 times of the amount of hydroxylated hexagonal boron nitride;
s3, heating to 50-60 ℃ through a water bath, immediately placing in a low-temperature refrigerator at-38 ℃ to-25 ℃, freezing for 9-11h, naturally heating to room temperature, performing wet ball milling for 13-16h, adding N, N-dimethylacetamide, and performing ultrasonic treatment for 1-3h by using an ultrasonic cell crusher to obtain a mixed dispersed solution of hexagonal boron nitride; the addition amount of the N, N-dimethylacetamide is 1-1.5 times of the amount of the hydroxylated hexagonal boron nitride in the step S2;
s4, centrifuging the dispersed solution, collecting supernatant, and cleaning and drying the supernatant to obtain hexagonal boron nitride nano powder; the drying process adopts a vacuum drying oven to dry for 13-15h at 35-45 ℃.
3. The method for preparing insulating high thermal conductivity plastic particles according to claim 2, wherein: the anti-itching agent comprises, by weight, 25-45 parts of epoxy resin, 20-35 parts of cyanate ester resin, 2-12 parts of nano powder, 6-14 parts of modified filler, 1-3 parts of adhesive, 1-3 parts of acetyl tri-n-hexyl citrate, 1-3 parts of zirconium hydrogen phosphate, 1-2 parts of an anti-itching agent and 1-2 parts of a compatilizer.
4. The method for preparing insulating high thermal conductivity plastic particles according to claim 3, wherein: the preparation method of the modified nano silicon dioxide in the step two comprises the following steps: adding nano SiO2 powder into an ethanol solution, adding vinyl tri (beta-methoxyethoxy) silane and 1, 6-hexanediol diglycidyl ether, stirring and dispersing at 55-60 ℃ for 35-45min, cooling to room temperature, performing ultrasonic oscillation for 0.5-0.7h, performing suction filtration, washing with ethanol, and drying in a vacuum box at 80 ℃ for 1-1.5h to obtain the modified nano silicon dioxide.
5. The method for preparing insulating high thermal conductivity plastic particles according to claim 4, wherein: and step two, mixing the mixture in the high-speed mixer at the temperature of 70-90 ℃, adding the adhesive, and stirring the mixture at a high speed for 20-40 min.
6. The method for preparing insulating high thermal conductivity plastic particles according to claim 1, wherein: in the third step, the first mixture, the epoxy resin EP and the cyanate resin are added into a high-speed mixer together, and are uniformly mixed at 125-155 ℃.
7. The method for preparing insulating high thermal conductivity plastic particles according to claim 1, wherein: and in the fourth step, extruding and granulating the second mixture at the temperature of 122-140 ℃ by using an extruder to obtain the high-thermal-conductivity insulating plastic particles.
8. The method for producing insulating high thermal conductive plastic particles according to any one of claims 1 to 7, wherein: the insulating high-thermal-conductivity plastic particles are applied to buildings, automobiles or ships.
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| CN108659327A (en) * | 2018-03-30 | 2018-10-16 | 湖北娅安科技开发有限公司 | A kind of special heat-conducting insulation material of new energy car battery and preparation method thereof |
| CN109354831A (en) * | 2018-11-13 | 2019-02-19 | 曹佳男 | A kind of high heat conductive insulating plastic pellet and preparation method thereof |
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2021
- 2021-02-10 CN CN202110183879.8A patent/CN112980142A/en active Pending
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| CN101659844A (en) * | 2008-08-26 | 2010-03-03 | 上海同立电工材料有限公司 | Radiation-resistant mica tape adhesive, preparation method thereof and application thereof |
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