CN112975781B

CN112975781B - A fixed equipment for wafer production

Info

Publication number: CN112975781B
Application number: CN202110202190.5A
Authority: CN
Inventors: 张健
Original assignee: Taijing Chongqing Electronics Co ltd
Current assignee: Taijing Chongqing Electronics Co ltd
Priority date: 2021-02-23
Filing date: 2021-02-23
Publication date: 2022-09-06
Anticipated expiration: 2041-02-23
Also published as: CN112975781A

Abstract

The invention provides a fixing device for wafer production, which structurally comprises a fixed disc, a box body, a display and a control panel, wherein the fixed disc slides at the front end of the box body; the flowing gas obtained by clamping or opening the clamping blocks is blown to the contact surface of the main block and the wafer through the air guide groove, so that small particles attached to the clamping blocks of the fixer are cleaned, the problem that the wafer deviates in the processing process due to shaking in the production process of the wafer is avoided, the processing precision and the yield of the wafer are improved, the fluctuation layer of the stop block bounces up and down through the inertia generated by sudden stop when the clamping blocks are clamped or opened, the small particles remained in the chip removal pipe are cleaned, and the problem that the small particles cannot circulate due to the fact that the small particles run into the chip removal pipe again under the influence of air flow is solved.

Description

A fixed equipment for wafer production

Technical Field

The invention belongs to the field of wafer photoetching development, and particularly relates to a fixing device for wafer production.

Background

The wafer production fixer is a fixing device used in wafer production, fixes the wafer in a clamping or attaching mode, enables the wafer to be stable in the production process, and is commonly used in wafer production, wafer film pasting and other wafer processing places.

Based on the above description, the present inventors found that the existing fixing apparatus for wafer production mainly has the following disadvantages, such as:

because fine particles in the air are easily attached to the clamping sheet of the fixer along with the flowing of the gas, if the clamping sheet clamps the particles between the clamping sheet and the wafer when the wafer is fixed, the particles are displaced due to shaking in the production process of the wafer, so that the wafer deviates in the processing process, and the processing precision of the wafer is reduced.

Disclosure of Invention

In order to solve the above technical problems, the present invention provides a fixing apparatus for wafer production, so as to solve the existing problems.

Aiming at the defects of the prior art, the purpose and the effect of the fixing equipment for wafer production are achieved by the following specific technical means: the utility model provides a fixed equipment for wafer production, its structure includes fixed disk, box, display, control panel, the fixed disk slides in the box front end, the display is installed on the control panel, the control panel electricity is connected in the lower left corner of box, the fixed disk is equipped with casing, clamping block, the casing is installed in the middle part of fixed disk, clamping block and the inside clearance fit of casing, clamping block is trapezoidal form and is equipped with six, and its contact surface is more smooth alloy material.

Preferably, the clamping block is provided with a main block and a bottom block, the right side of the bottom block is fixedly connected with the left end of the main block in an embedded mode, the left end of the main block is provided with a small bump, the small bump improves the stability in fixing for reducing the contact surface, and the bottom block is in a trapezoid shape with an arc up and down.

Preferably, the main block is provided with a block body, an air guide groove and a chip removal pipe, the air guide groove is located at the left end of the block body, the chip removal pipe is arranged inside the block body, when the clamping block is clamped or opened by the air guide groove, generated air flow is guided to the small protruding block on the left side of the main block, and four channels are formed in the chip removal pipe.

As preferred, the chip removal pipe is equipped with body, dog, the bullet piece that shakes, plays the layer, the dog is installed inside the body, the bullet piece that shakes is connected with bullet layer bottom is set firmly, play the inside bottom clearance fit of layer and body, the dog is conical fritter, and is equipped with two sets ofly, evenly distributes in the both sides of body, play the layer and make for having better elastic rubber.

Preferably, the dog is equipped with block, fluctuation layer, bag strip, compound marble, the fluctuation layer is installed in the block top, bag strip both ends and the inner wall of fluctuation layer inlay the solid joint, compound marble is installed inside the block, fluctuation layer top is the protruding layer piece of circular arc, and has certain elastic rubber and make, the bag strip is the cloth of gasbag material.

Preferably, the vibrating block is provided with a connecting plate, a pressing-opening block and a pushing block, the upper end and the lower end of the pressing-opening block are fixedly connected with the pushing block respectively in an embedded mode, the connecting plate is installed at the upper end and the lower end of the pushing block, the pressing-opening block is made of elastic ox-horn-shaped plastic, and the pushing block is made of elastic rubber blocks in an arc shape.

Compared with the prior art, the invention has the following beneficial effects:

1. the flowing gas obtained by clamping or opening the clamping blocks is blown to the contact surface of the main block and the wafer through the air guide groove, so that small particles attached to the clamping blocks of the fixer are cleaned, the problem that the wafer deviates in the processing process due to shaking in the production process of the wafer is avoided, and the processing precision and the yield of the wafer are improved.

2. When clamping or opening through the clamping piece, the inertia that stops producing suddenly makes the fluctuation layer of dog bounce from top to bottom for remain in the inside tiny particle of chip removal pipe and obtain the clearance, prevent that tiny particle from receiving the influence of air current and running into the chip removal pipe once more, cause the problem that gas can not circulate.

Drawings

FIG. 1 is a schematic structural diagram of a fixing apparatus for wafer production according to the present invention.

Fig. 2 is a top view of the fixing plate of the present invention in a cut-away open configuration.

Fig. 3 is a schematic view of a clamping structure of the fixing disc of the invention cut in a top view.

Fig. 4 is a schematic structural view of a clamping block according to the present invention.

Fig. 5 is a structural schematic diagram of the main block of the invention in a top view and in a section.

Fig. 6 is a structural schematic diagram of the chip removal pipe in a sectional view from above.

Fig. 7 is a top view of the block of the present invention.

Fig. 8 is a schematic sectional view of the missile block in plan view.

In the figure: the device comprises a fixed disc-1, a box body-2, a display-3, a control panel-4, a shell-11, a clamping block-12, a main block-21, a bottom block-22, a block body-211, an air guide groove-212, a chip removal pipe-213, a pipe body-131, a stop block-132, a vibration block-133, an elastic layer-134, a block body-321, a fluctuation layer-322, a bag strip-323, a rebound ball-324, a connecting plate-331, a press-opening block-332 and a push block-333.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1

As shown in figures 1 to 5:

the invention provides a fixing device for wafer production, which structurally comprises a fixed disc 1, a box body 2, a display 3 and a control panel 4, wherein the fixed disc 1 slides at the front end of the box body 2, the display 3 is installed on the control panel 4, the control panel 4 is electrically connected to the lower left corner of the box body 2, the fixed disc 1 is provided with a shell 11 and clamping blocks 12, the shell 11 is installed in the middle of the fixed disc 1, the clamping blocks 12 are in clearance fit with the inside of the shell 11, the clamping blocks 12 are in a ladder shape and are provided with six blocks, contact surfaces of the clamping blocks are made of smooth alloy materials, when a top block and a bottom block respectively slide towards the left side and the right side, other clamping blocks 12 in the fixing disc are in sliding fit with each other, and are inwards contracted into a round shape, so that a wafer is clamped.

The clamping block 12 is provided with a main block 21 and a bottom block 22, the right side of the bottom block 22 is fixedly connected with the left end of the main block 21 in an embedded mode, the left end of the main block 21 is provided with a small bump, the small bump improves the stability when being fixed for reducing a contact surface, the bottom block 22 is in a trapezoid shape with an arc up and down, the middle hollow part can enable the wafer to be breathable when clamping is finished, and the wafer is prevented from being damaged due to high temperature during production.

The main block 21 is provided with a block body 211, an air guide groove 212 and a chip removal pipe 213, the air guide groove 212 is located at the left end of the block body 211, the chip removal pipe 213 is installed inside the block body 211, when the air guide groove 212 clamps or opens the clamping block 12, generated air flow is guided to the small convex block on the left side of the main block 21, so that small particles remaining on the contact surface with the wafer are removed, the chip removal pipe 213 is provided with four channels which are communicated with the air guide groove 212, and the blown small particles can be discharged out of the main block 21.

The specific use mode and function of the embodiment are as follows:

in the invention, a power supply of a control panel 4 is connected to extend a fixed disk 1 of a box body 2, a wafer to be processed is placed on the fixed disk 1, the control panel 4 is operated to enable a top block and a bottom block of a clamping block 12 in a shell 11 of the fixed disk 1 to respectively slide towards the left side and the right side, other clamping blocks 12 in the fixed disk are mutually matched in a sliding way and are inwards contracted into a round shape, the wafer can be clamped and fixed, the subsequent processing is convenient, a small convex block at the left end of a main block 21 reduces a contact surface to improve the stability when the wafer is fixed, the wafer is not displaced due to vibration during processing, the middle hollow part of the bottom block 22 can enable the wafer to obtain a ventilation effect when the clamping is finished, the wafer is prevented from being damaged due to high temperature during production, an air guide groove 212 can guide the generated air flow to a small convex block at the left side of the main block 21 when the clamping block 12 is clamped or opened, and accordingly small particles remained on the contact surface of the main block 21 and the wafer can be removed, the debris discharge pipe 213 in the block body 211 can blow out the small particles out of the main block 21 by the gas flowing through the air guide groove 212.

Example 2

As shown in figures 6 to 8:

the invention provides a fixing device for wafer production, wherein a chip removal pipe 213 is provided with a pipe body 131, stop blocks 132, vibrating blocks 133 and elastic layers 134, the stop blocks 132 are installed inside the pipe body 131, the vibrating blocks 133 are fixedly connected with the bottom of the elastic layers 134 in an embedded mode, the elastic layers 134 are in clearance fit with the bottom end inside the pipe body 131, the stop blocks 132 are conical small blocks, two groups of small blocks are arranged and are uniformly distributed on two sides of the pipe body 131, in order to prevent guided small particles from reversely running into a main block 21 along with the flowing of gas, the elastic layers 134 are made of rubber with good elasticity, and the elastic blocks 133 driven by inertia to move up and down so that the small particles can be better cleaned out of the pipe body 131.

Wherein, the dog 132 is equipped with block 321, undulant layer 322, bag strip 323, the ball 324 of rebounding, undulant layer 322 is installed in the block 321 top, bag strip 323 both ends are connected with the built-in of undulant layer 322 inner wall, the ball 324 of rebounding is installed inside block 321, undulant layer 322 top is the protruding layer piece of circular arc, and has certain elastic rubber and make, bag strip 323 is the cloth strip of gasbag material, can receive the inertia of the ball 324 of rebounding and bounce from top to bottom and press the gas between undulant layer 322 and the bag strip 323, makes undulant layer 322 upwards bounce to the tiny particle on the dog 132 can be bounced to the export of chip removal pipe 213.

The vibrating block 133 is provided with a connecting plate 331, a press-opening block 332 and a pushing block 333, the upper end and the lower end of the press-opening block 332 are respectively fixedly connected with the pushing block 333, the connecting plate 331 is mounted at the upper end and the lower end of the pushing block 333, the press-opening block 332 is made of elastic ox-horn plastic, the pushing block 333 is an elastic rubber block in a circular arc shape, and the press-opening block 332 can be subjected to inertia generated by sudden stop when being clamped or opened by the clamping block 12, so that the pushing block 333 continues to move downwards to extrude the press-opening block 332, and the elastic layer 134 obtains power.

The specific use mode and function of the embodiment are as follows:

in the invention, the stopper 132 in the tube body 131 of the discharging tube 213 is in a cone shape, in order to prevent the guided small particles from reversely running into the main block 21 along with the flow of the gas, the elastic layer 134 at the bottom in the tube body 131 can be driven by the vibration block 133 of the inertia vibration, so that the small particles left at the bottom of the tube body 131 can be better cleaned out of the tube body 131, the fluctuation layer 322 on the stopper 132 can be vibrated up and down by the composite elastic ball 324 in the block body 321, the inertia generated by the sudden stop when the clamping block 12 is clamped or opened can make the bag bar 323 push the gas between the fluctuation layer 322 and the bag bar 323, so that the fluctuation layer 322 can be sprung up, so that the small particles on the stopper 132 can be sprung to the outlet of the discharging tube 213, the pushing block 333 of the vibration block 133 can continue to move downwards to press the opening block 332 by the inertia generated by the sudden stop when the clamping block 12 is clamped or opened, and the resilience force of the pushing block 332 pushes the pushing block 333 open after extrusion, the pushing block 333 drives the connecting plate 331 to push the elastic layer 134 away, so as to achieve the above-mentioned effect.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. The utility model provides a fixed equipment for wafer production, its structure includes fixed disk (1), box (2), display (3), control panel (4), fixed disk (1) slides in box (2) front end, install on control panel (4) display (3), control panel (4) electricity is connected in the lower left corner of box (2), its characterized in that: the fixed disk (1) is provided with a shell (11) and a clamping block (12), the shell (11) is installed in the middle of the fixed disk (1), the clamping block (12) is in clearance fit with the inside of the shell (11), the clamping block (12) is provided with a main block (21) and a bottom block (22), the right side of the bottom block (22) is fixedly connected with the left end of the main block (21), the main block (21) is provided with a block body (211), an air guide groove (212) and a chip removal pipe (213), the air guide groove (212) is located at the left end of the block body (211), the chip removal pipe (213) is installed inside the block body (211), the chip removal pipe (213) is provided with a tube body (131), a stop block (132), a vibration elastic block (133) and an elastic layer (134), the stop block (132) is installed inside the tube body (131), the vibration elastic block (133) is fixedly connected with the bottom of the elastic layer (134), and the elastic layer (134) is in clearance fit with the bottom end inside of the tube body (131), the block (132) is provided with a block body (321), an undulation layer (322), a bag strip (323) and a rebound ball (324), the undulation layer (322) is installed at the top of the block body (321), two ends of the bag strip (323) are fixedly connected with the inner wall of the undulation layer (322), the rebound ball (324) is installed inside the block body (321), the vibration block (133) is provided with a connecting plate (331), a pressing-open block (332) and a push block (333), the upper end and the lower end of the pressing-open block (332) are fixedly connected with the push block (333) respectively, and the connecting plate (331) is installed at the upper end and the lower end of the push block (333); the power supply of the control panel (4) is connected, so that the fixed disk (1) of the box body (2) extends out, a wafer to be processed is placed on the fixed disk (1), the control panel (4) is operated to enable the top block and the bottom block of the clamping block (12) in the shell (11) of the fixed disk (1) to respectively slide towards the left side and the right side, other clamping blocks (12) in the fixed disk are mutually matched in a sliding manner and are inwards contracted into a round shape to clamp the wafer, the subsequent processing is convenient, the small convex block at the left end of the main block (21) reduces the contact surface to improve the stability in the fixing process, the wafer is not displaced due to the vibration in the processing process, the middle hollow part of the bottom block (22) can enable the wafer to obtain the ventilation effect when the clamping is finished, the wafer is prevented from being damaged due to high temperature in the production process, the air guide groove (212) can guide the generated air flow to the small convex block at the left side of the main block (21) when the clamping block (12) is clamped or opened, therefore, residual small particles on the contact surface of the main block (21) and the wafer can be removed, and the small particles can be blown out of the main block (21) by the chip removal pipe (213) in the block body (211) by virtue of the gas flowing in the air guide groove (212); the stopper (132) in the tube body (131) of the debris discharge tube (213) is in a conical shape, in order to prevent the guided small particles from reversely running into the main block (21) along with the flowing of gas, the elastic layer (134) at the bottom in the tube body (131) can be driven by the vibration elastic block (133) which is elastically vibrated by inertia to fluctuate up and down, so that the small particles left at the bottom of the tube body (131) can be better cleaned out of the tube body (131), the fluctuation layer (322) on the stopper (132) can be driven by the composite elastic ball (324) in the tube body (321), the small particles on the stopper (132) can jump up and down by inertia generated by sudden stop when the clamping block (12) is clamped or opened, so that the sac bar (323) pushes the gas between the fluctuation layer (322) and the sac bar (323), the fluctuation layer (322) can bounce upwards, so that the small particles on the stopper (132) can be bounced towards the outlet of the debris discharge tube (213), and the pushing block (333) of the vibration elastic block (133) can suddenly stop by inertia generated when the clamping block (12) is clamped or opened, the pressing-opening block (332) is extruded by continuing to move downwards, and the resilience force of the pressing-opening block (332) pushes the push block (333) after extrusion, so that the push block (333) drives the connecting plate (331) to push the elastic layer (134) away.