CN112968731A - Photoelectric hybrid backplane interconnection method and system - Google Patents

Photoelectric hybrid backplane interconnection method and system Download PDF

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Publication number
CN112968731A
CN112968731A CN202110266749.0A CN202110266749A CN112968731A CN 112968731 A CN112968731 A CN 112968731A CN 202110266749 A CN202110266749 A CN 202110266749A CN 112968731 A CN112968731 A CN 112968731A
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China
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optical
optoelectronic
hybrid connector
connector
optoelectronic hybrid
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Inventor
欧均富
韦文
师进
张鑫
王欣
刘洪强
马瑞
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CRSC Research and Design Institute Group Co Ltd
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CRSC Research and Design Institute Group Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to the field of communication equipment, and discloses a method and a system for interconnecting a photoelectric hybrid backboard. The photoelectric hybrid back plate interconnection method comprises the following steps: the low-speed electric signal of the input unit is transmitted to the output unit through the electric connection part of the first photoelectric hybrid connector, the photoelectric hybrid backboard and the electric connection part of the second photoelectric hybrid connector in sequence; meanwhile, the high-speed electrical signal of the input unit is converted into an optical signal, and is transmitted to the output unit through the optical connection part of the first opto-electric hybrid connector, the transmission unit and the optical connection part of the second opto-electric hybrid connector in sequence, so that the high-speed electrical signal is converted. The invention has low signal transmission cost, high reliability and convenient and flexible configuration, and the transmission unit is configurable, thereby being convenient to rapidly configure or switch the backboard signal interconnection topology of the communication equipment.

Description

Photoelectric hybrid backplane interconnection method and system
Technical Field
The invention relates to the field of communication equipment, in particular to a method and a system for interconnecting photoelectric hybrid backplanes.
Background
With the rapid development of information technology, the signal transmission rate in a communication system is continuously improved, the switching capacity of communication equipment is larger and larger, the port rate and the backplane interface switching rate are higher and higher, and the interface rate requirement of more than 100Gbps has appeared.
However, the electrical backplane interconnection system of the conventional communication device is implemented by copper wire interconnection on a Printed Circuit Board (PCB for short), and is limited by electromagnetic operating characteristics, processing technology, production cost, heat dissipation, and the like, and the interface rate and backplane transmission distance of the electrical backplane interconnection system are limited, so that it is very difficult for the electrical backplane interconnection system to implement high-speed signal transmission. The optical interconnection technology can support the interconnection of high-speed interfaces of more than 100Gbps due to the advantages of high density, low loss, small crosstalk and the like. However, the optical connection topology of the conventional optical backplane interconnection technology is fixed, and the arrangement cannot be changed at any time, and redesign and production of optical connection are required in order to change. In addition, the electric connector and the optical connector in the existing scheme are mutually independent for use, so that the occupied space is large, and the cost is high.
Disclosure of Invention
Based on the above problems, the present invention aims to provide an interconnection method and system for an optoelectronic hybrid backplane, which has low signal transmission cost, high reliability, and convenient and flexible configuration.
In order to achieve the purpose, the invention adopts the following technical scheme:
an optoelectronic hybrid backplane interconnection method comprising the steps of:
the low-speed electric signal of the input unit is transmitted to the output unit through the electric connection part of the first photoelectric hybrid connector, the photoelectric hybrid backboard and the electric connection part of the second photoelectric hybrid connector in sequence;
meanwhile, the high-speed electrical signal of the input unit is converted into an optical signal, and is transmitted to the output unit through the optical connection part of the first opto-electric hybrid connector, the transmission unit and the optical connection part of the second opto-electric hybrid connector in sequence, so that the high-speed electrical signal is converted.
An optical-electrical hybrid backplane interconnection system comprising an input unit configured to input high-speed electrical signals and low-speed electrical signals and configured to convert the high-speed electrical signals into optical signals, a switching unit comprising an optical-electrical hybrid backplane and first and second optical-electrical hybrid connectors disposed on the optical-electrical hybrid backplane, the first and second optical-electrical hybrid connectors each comprising an optical connection portion and an electrical connection portion, a transmission unit configured to transmit the optical signals of the first optical-electrical hybrid connector to the second optical-electrical hybrid connector, and an output unit configured to convert the optical signals into high-speed electrical signals, and is configured to output a high-speed electrical signal and a low-speed electrical signal.
As a preferable aspect of the optoelectronic hybrid backplane interconnection system of the present invention, the input unit includes a first optoelectronic conversion module configured to convert an electrical signal into an optical signal, and a third optoelectronic hybrid connector including an optical connection portion and an electrical connection portion, the optical interface of the first optoelectronic conversion module is configured to be connected with the optical connection portion of the third optoelectronic hybrid connector, the optical connection portion of the third optoelectronic hybrid connector is configured to be connected with the optical connection portion of the first optoelectronic hybrid connector, and the electrical connection portion of the third optoelectronic hybrid connector is configured to be connected with the electrical connection portion of the first optoelectronic hybrid connector.
As a preferable aspect of the optoelectronic hybrid backplane interconnection system of the present invention, the input unit further includes a first plug board, and the first photoelectric conversion module and the third optoelectronic hybrid connector are respectively disposed on the first plug board.
As a preferable aspect of the optoelectronic hybrid backplane interconnection system of the present invention, the input unit further includes a first optical fiber bundle, one end of the first optical fiber bundle is configured to be connected to the first photoelectric conversion module, and the other end of the first optical fiber bundle is configured to be connected to an optical connection portion of the third optoelectronic hybrid connector.
As a preferable aspect of the opto-electric hybrid backplane interconnection system of the present invention, the transmission unit includes a second optical fiber bundle, one end of which is configured to be connected to the optical connection portion of the first opto-electric hybrid connector, and the other end of which is configured to be connected to the optical connection portion of the second opto-electric hybrid connector.
In a preferred embodiment of the optoelectronic hybrid backplane interconnection system of the present invention, the second optical fiber bundle includes an optical cable, and a first optical fiber array and a second optical fiber array respectively disposed at both ends of the optical cable, the first optical fiber array is configured to be connected to an optical connector of the first optoelectronic hybrid connector, and the second optical fiber array is configured to be connected to an optical connector of the second optoelectronic hybrid connector.
As a preferable aspect of the optical-electrical hybrid backplane interconnection system of the present invention, the output unit includes a second optical-electrical conversion module configured to convert an optical signal into an electrical signal, and a fourth optical-electrical hybrid connector including an optical connection portion and an electrical connection portion, the optical interface of the second optical-electrical conversion module is configured to be connected with the optical connection portion of the fourth optical-electrical hybrid connector, the optical connection portion of the fourth optical-electrical hybrid connector is configured to be connected with the optical connection portion of the second optical-electrical hybrid connector, and the electrical connection portion of the fourth optical-electrical hybrid connector is configured to be connected with the electrical connection portion of the second optical-electrical hybrid connector.
As a preferable aspect of the optoelectronic hybrid backplane interconnection system of the present invention, the output unit further includes a second plug board, and the second photoelectric conversion module and the fourth optoelectronic hybrid connector are respectively disposed on the second plug board.
As a preferable aspect of the optoelectronic hybrid backplane interconnection system of the present invention, the output unit further includes a third optical fiber bundle, one end of the third optical fiber bundle is configured to be connected to the optical interface of the second optoelectronic conversion module, and the other end of the third optical fiber bundle is configured to be connected to the optical connector of the fourth optoelectronic hybrid connector.
The invention has the beneficial effects that:
according to the interconnection method and system of the photoelectric hybrid backplane provided by the invention, a low-speed electrical signal of an input unit is transmitted to an output unit through an electrical connection part of a first photoelectric hybrid connector, an electrical connection part of the photoelectric hybrid backplane and an electrical connection part of a second photoelectric hybrid connector in sequence, and meanwhile, a high-speed electrical signal of the input unit is converted into an optical signal and is transmitted to the output unit through an optical connection part of the first photoelectric hybrid connector, a transmission unit and an optical connection part of the second photoelectric hybrid connector in sequence, so that the optical signal is converted into a high-speed electrical signal. The photoelectric hybrid backboard interconnection method and the system provided by the invention have the advantages of low signal transmission cost, high reliability, convenient and flexible configuration, the transmission unit is configurable, and the high-speed signal connection relation between each input unit and each output unit is conveniently and flexibly configured, so that the backboard signal interconnection topology of the communication equipment is rapidly configured or switched.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a schematic diagram of an optoelectronic hybrid backplane interconnection system applying an optoelectronic hybrid backplane interconnection method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an optoelectronic hybrid backplane interconnection system applying the optoelectronic hybrid backplane interconnection method according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an input unit in an optoelectronic hybrid backplane interconnection system applying the optoelectronic hybrid backplane interconnection method according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a switching unit in an opto-electronic hybrid backplane interconnection system applying an opto-electronic hybrid backplane interconnection method according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a transmission unit in an opto-electronic hybrid backplane interconnection system applying the opto-electronic hybrid backplane interconnection method according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an output unit in an optoelectronic hybrid backplane interconnection system using the optoelectronic hybrid backplane interconnection method according to an embodiment of the present invention.
In the figure:
1-an input unit; 2-a switching unit; 3-a transmission unit; 4-an output unit;
11-a first photoelectric conversion module; 12-a third opto-electric hybrid connector; 13-a first board; 14-first light
Fiber bundles;
21-an opto-electric hybrid backplane; 22-a first opto-electric hybrid connector; 23-a second opto-electric hybrid connector;
31-a second fiber bundle; 311-optical cables; 312-a first array of optical fibers; 313-a second array of optical fibers;
41-a second photoelectric conversion module; 42-a fourth opto-electric hybrid connector; 43-a second board; 44-third fiber bundle.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment provides an optoelectronic hybrid backplane interconnection method, which can be used for simultaneously transmitting a high-speed signal and a low-speed signal, and the optoelectronic hybrid backplane interconnection method comprises the following steps:
the low-speed electric signal of the input unit is transmitted to the output unit through the electric connection part of the first photoelectric hybrid connector, the photoelectric hybrid backboard and the electric connection part of the second photoelectric hybrid connector in sequence;
meanwhile, the high-speed electrical signal of the input unit is converted into an optical signal, and is transmitted to the output unit through the optical connection part of the first opto-electric hybrid connector, the transmission unit and the optical connection part of the second opto-electric hybrid connector in sequence, so that the high-speed electrical signal is converted.
The method for interconnecting the photoelectric hybrid backplanes has the advantages of low signal transmission cost, high reliability, convenience and flexibility in configuration, and the transmission unit is configurable, so that the high-speed signal connection relationship between each input unit and each output unit is conveniently and flexibly configured, and the backplane signal interconnection topology of the communication equipment is rapidly configured or switched.
As shown in fig. 1 to fig. 6, the present embodiment further provides an optoelectronic hybrid backplane interconnection system, which includes an input unit 1, a switching unit 2, a transmission unit 3, and an output unit 4. Wherein the input unit 1 is configured to input a high-speed electrical signal and a low-speed electrical signal, and is configured to convert the high-speed electrical signal into an optical signal. The switching unit 2 includes an opto-electric hybrid backplane 21 and a first opto-electric hybrid connector 22 and a second opto-electric hybrid connector 23 disposed on the opto-electric hybrid backplane 21, the first opto-electric hybrid connector 22 and the second opto-electric hybrid connector 23 each including an optical connection portion and an electrical connection portion, the opto-electric hybrid backplane 21 being configured to transmit an electrical signal of the first opto-electric hybrid connector 22 to the second opto-electric hybrid connector 23. The transmission unit 3 is configured to transmit the optical signal of the first opto-electric hybrid connector 22 to the second opto-electric hybrid connector 23. The output unit 4 is configured to convert the optical signal into a high-speed electrical signal, and is configured to output the high-speed electrical signal and a low-speed electrical signal.
The low-speed electrical signal of the input unit 1 is transmitted to the output unit 4 via the electrical connection portion of the first opto-electric hybrid connector 22, the opto-electric hybrid backplane 21, and the electrical connection portion of the second opto-electric hybrid connector 23 in this order. Meanwhile, the high-speed electrical signal of the input unit 1 is converted into an optical signal, and is transmitted to the output unit 4 via the optical connection portion of the first opto-electric hybrid connector 22, the transmission unit 3, and the optical connection portion of the second opto-electric hybrid connector 23 in this order, and is further converted into a high-speed electrical signal. The photoelectric hybrid backboard interconnection system is low in signal transmission cost, high in reliability and convenient and flexible to configure, the transmission unit 3 is configurable, and high-speed signal connection relations between the input units 1 and the output units 4 are conveniently and flexibly configured, so that backboard signal interconnection topologies of communication equipment are rapidly configured or switched.
Alternatively, the input unit 1 includes a first photoelectric conversion module 11 and a third photoelectric hybrid connector 12, the first photoelectric conversion module 11 is configured to convert an electrical signal into an optical signal, the third photoelectric hybrid connector 12 includes an optical connection portion and an electrical connection portion, the optical interface of the first photoelectric conversion module 11 is configured to be connected with the optical connection portion of the third photoelectric hybrid connector 12, the optical connection portion of the third photoelectric hybrid connector 12 is configured to be connected with the optical connection portion of the first photoelectric hybrid connector 22, and the electrical connection portion of the third photoelectric hybrid connector 12 is configured to be connected with the electrical connection portion of the first photoelectric hybrid connector 22. The low-speed electrical signal of the input unit 1 is transmitted to the electrical connection portion of the first opto-electric hybrid connector 22 through the electrical connection portion of the third opto-electric hybrid connector 12. The high-speed electrical signal of the input unit 1 is converted into an optical signal by the first photoelectric conversion module 11, and is transmitted to the optical connection portion of the first photoelectric hybrid connector 22 through the optical connection portion of the third photoelectric hybrid connector 12.
To facilitate the arrangement of the first photoelectric conversion module 11 and the third photoelectric hybrid connector 12, the input unit 1 optionally further includes a first plug board 13, and the first photoelectric conversion module 11 and the third photoelectric hybrid connector 12 are respectively disposed on the first plug board 13. To facilitate the transmission of optical signals between the first photoelectric conversion module 11 and the third photoelectric hybrid connector 12, optionally, the input unit 1 further includes a first optical fiber bundle 14, one end of the first optical fiber bundle 14 is configured to be connected with the first photoelectric conversion module 11, and the other end of the first optical fiber bundle 14 is configured to be connected with an optical connection portion of the third photoelectric hybrid connector 12. The optical signal of the first photoelectric conversion module 11 is transmitted to the optical connection part of the third photoelectric hybrid connector 12 through the first optical fiber bundle 14, the two ends of the first optical fiber bundle 14 are detachably connected with the first photoelectric conversion module 11 and the third photoelectric hybrid connector 12 respectively in a plugging mode, assembly is facilitated, and the first optical fiber bundle 14 adopts a 24-core optical fiber array, so that high-speed optical signal transmission is facilitated.
To facilitate the transmission of optical signals between the first opto-electric hybrid connector 22 and the second opto-electric hybrid connector 23, optionally, the transmission unit 3 comprises a second optical fiber bundle 31, one end of the second optical fiber bundle 31 being configured to be connected with the optical connection of the first opto-electric hybrid connector 22 and the other end being configured to be connected with the optical connection of the second opto-electric hybrid connector 23. The optical signal of the optical connection part of the first opto-electronic hybrid connector 22 is transmitted to the optical connection part of the second opto-electronic hybrid connector 23 through the second optical fiber bundle 31, and two ends of the second optical fiber bundle 31 are detachably plugged with the first opto-electronic hybrid connector 22 and the second opto-electronic hybrid connector 23 respectively, that is, the second optical fiber bundle 31 is configurable, so that the high-speed signal connection relationship between each input unit 1 and each output unit 4 is conveniently and flexibly configured, and the backplane signal interconnection topology of the communication equipment is rapidly configured or switched. Alternatively, the second optical fiber bundle 31 includes an optical cable 311, and a first optical fiber array 312 and a second optical fiber array 313 respectively disposed at two ends of the optical cable 311, the first optical fiber array 312 is configured to be connected with the optical connection portion of the first opto-electric hybrid connector 22, and the second optical fiber array 313 is configured to be connected with the optical connection portion of the second opto-electric hybrid connector 23. The first optical fiber array 312 and the second optical fiber array 313 both adopt 24-core optical fiber arrays, which are convenient for transmitting high-speed optical signals.
Alternatively, the output unit 4 includes a second photoelectric conversion module 41 and a fourth photoelectric hybrid connector 42, the second photoelectric conversion module 41 is configured to convert an optical signal into an electrical signal, the fourth photoelectric hybrid connector 42 includes an optical connection portion and an electrical connection portion, an optical interface of the second photoelectric conversion module 41 is configured to be connected with the optical connection portion of the fourth photoelectric hybrid connector 42, the optical connection portion of the fourth photoelectric hybrid connector 42 is configured to be connected with the optical connection portion of the second photoelectric hybrid connector 23, and the electrical connection portion of the fourth photoelectric hybrid connector 42 is configured to be connected with the electrical connection portion of the second photoelectric hybrid connector 23. The low-speed electrical signal of the electrical connection portion of the first opto-electric hybrid connector 22 is transmitted to the electrical connection portion of the second opto-electric hybrid connector 23 through the opto-electric hybrid backplane 21. The optical signal of the optical connection portion of the second opto-electric hybrid connector 23 is transmitted to the second opto-electric conversion module 41 through the optical connection portion of the fourth opto-electric hybrid connector 42, and the optical signal is converted into a high-speed electrical signal by the second opto-electric conversion module 41.
To facilitate the arrangement of the second photoelectric conversion module 41 and the fourth photoelectric hybrid connector 42, the output unit 4 optionally further includes a second interposer 43, and the second photoelectric conversion module 41 and the fourth photoelectric hybrid connector 42 are respectively disposed on the second interposer 43. To facilitate the transmission of optical signals between the second photoelectric conversion module 41 and the fourth photoelectric hybrid connector 42, optionally, the output unit 4 further includes a third optical fiber bundle 44, one end of the third optical fiber bundle 44 is configured to be connected with the optical interface of the second photoelectric conversion module 41, and the other end of the third optical fiber bundle 44 is configured to be connected with the optical connector of the fourth photoelectric hybrid connector 42. The optical signal of the second photoelectric conversion module 41 is transmitted to the optical connection portion of the fourth photoelectric hybrid connector 42 through the third optical fiber bundle 44, two ends of the third optical fiber bundle 44 are detachably connected with the second photoelectric conversion module 41 and the fourth photoelectric hybrid connector 42 respectively, so that the assembly is convenient, and the third optical fiber bundle 44 adopts a 24-core optical fiber array, so that the transmission of a high-speed optical signal is convenient.
In the optoelectronic hybrid backplane interconnection system provided in this embodiment, the low-speed signal transmission process is substantially as follows: the low-speed electrical signal is transmitted to the electrical connection portion of the fourth opto-electric hybrid connector 42 of the output unit 4 via the electrical connection portion of the third opto-electric hybrid connector 12 of the input unit 1, the electrical connection portion of the first opto-electric hybrid connector 22 of the switching unit 2, the electrical connection portion of the opto-electric hybrid backplane 21 of the switching unit 2, and the electrical connection portion of the second opto-electric hybrid connector 23 of the switching unit 2 in this order.
In the optoelectronic hybrid backplane interconnection system provided in this embodiment, the high-speed signal transmission process is substantially as follows: the high-speed electrical signal is converted into an optical signal by the first photoelectric conversion module 11 of the input unit 1, the optical signal is sequentially transmitted to the second photoelectric conversion module 41 of the output unit 4 via the first photoelectric conversion module 11 of the input unit 1, the first optical fiber bundle 14 of the input unit 1, the optical connection portion of the third photoelectric hybrid connector 12 of the input unit 1, the optical connection portion of the first photoelectric hybrid connector 22 of the switching unit 2, the second optical fiber bundle 31 of the transmission unit 3, the optical connection portion of the second photoelectric hybrid connector 23 of the switching unit 2, the optical connection portion of the fourth photoelectric hybrid connector 42 of the output unit 4, and the third optical fiber bundle 44 of the output unit 4, and the optical signal is converted into the high-speed electrical signal by the second photoelectric conversion module 41 of the output unit 4.
The photoelectric hybrid backplane interconnection system provided by the embodiment has the advantages of small occupied space, low cost, high reliability and convenience in assembly, the transmission unit 3 is configurable, and the high-speed signal connection relation between each input unit 1 and each output unit 4 is conveniently and flexibly configured, so that the backplane signal interconnection topology of the communication equipment is rapidly configured or switched.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. An optoelectronic hybrid backplane interconnection method, comprising the steps of:
the low-speed electric signal of the input unit (1) is transmitted to the output unit (4) through an electric connection part of the first photoelectric hybrid connector (22), an electric connection part of the photoelectric hybrid backboard (21) and an electric connection part of the second photoelectric hybrid connector (23) in sequence;
meanwhile, the high-speed electrical signal of the input unit (1) is converted into an optical signal, and is transmitted to the output unit (4) through the optical connection part of the first photoelectric hybrid connector (22), the optical connection part of the transmission unit (3) and the second photoelectric hybrid connector (23) in sequence, and then is converted into a high-speed electrical signal.
2. An optoelectronic hybrid backplane interconnection system, characterized by comprising an input unit (1), a switching unit (2), a transmission unit (3) and an output unit (4), wherein the input unit (1) is configured to input high-speed electrical signals and low-speed electrical signals and is configured to convert the high-speed electrical signals into optical signals, the switching unit (2) comprises an optoelectronic hybrid backplane (21) and a first optoelectronic hybrid connector (22) and a second optoelectronic hybrid connector (23) disposed on the optoelectronic hybrid backplane (21), the first optoelectronic hybrid connector (22) and the second optoelectronic hybrid connector (23) each comprise an optical connection portion and an electrical connection portion, the optoelectronic hybrid backplane (21) is configured to transmit the electrical signals of the first optoelectronic hybrid connector (22) to the second optoelectronic hybrid connector (23), the transmission unit (3) is configured to transmit the optical signal of the first opto-electric hybrid connector (22) to the second opto-electric hybrid connector (23), and the output unit (4) is configured to convert the optical signal into a high-speed electrical signal and configured to output the high-speed electrical signal and a low-speed electrical signal.
3. The optoelectronic hybrid backplane interconnection system of claim 2, wherein the input unit (1) comprises a first optoelectronic conversion module (11) and a third optoelectronic hybrid connector (12), the first optoelectronic conversion module (11) being configured to convert electrical signals into optical signals, the third optoelectronic hybrid connector (12) comprising an optical connection and an electrical connection, the optical interface of the first optoelectronic conversion module (11) being configured to connect with the optical connection of the third optoelectronic hybrid connector (12), the optical connection of the third optoelectronic hybrid connector (12) being configured to connect with the optical connection of the first optoelectronic hybrid connector (22), the electrical connection of the third optoelectronic hybrid connector (12) being configured to connect with the electrical connection of the first optoelectronic hybrid connector (22).
4. The optoelectronic hybrid backplane interconnection system of claim 3, wherein the input unit (1) further comprises a first interposer (13), and the first optoelectronic conversion module (11) and the third optoelectronic hybrid connector (12) are respectively disposed on the first interposer (13).
5. The optoelectronic hybrid backplane interconnection system of claim 3, wherein the input unit (1) further comprises a first optical fiber bundle (14), one end of the first optical fiber bundle (14) is configured to be connected with the first optoelectronic conversion module (11), and the other end of the first optical fiber bundle (14) is configured to be connected with an optical connection of the third optoelectronic hybrid connector (12).
6. The optoelectronic hybrid backplane interconnection system of claim 2, wherein the transmission unit (3) comprises a second optical fiber bundle (31), one end of the second optical fiber bundle (31) being configured to connect with an optical connection of the first optoelectronic hybrid connector (22) and the other end being configured to connect with an optical connection of the second optoelectronic hybrid connector (23).
7. The optoelectronic hybrid backplane interconnection system of claim 6, wherein the second optical fiber bundle (31) comprises an optical cable (311) and a first optical fiber array (312) and a second optical fiber array (313) respectively disposed at two ends of the optical cable (311), the first optical fiber array (312) being configured to connect with an optical connection of the first optoelectronic hybrid connector (22), the second optical fiber array (313) being configured to connect with an optical connection of the second optoelectronic hybrid connector (23).
8. The optoelectronic hybrid backplane interconnection system of claim 2, wherein the output unit (4) comprises a second optoelectronic conversion module (41) and a fourth optoelectronic hybrid connector (42), the second optoelectronic conversion module (41) being configured to convert an optical signal into an electrical signal, the fourth optoelectronic hybrid connector (42) comprising an optical connection portion and an electrical connection portion, the optical interface of the second optoelectronic conversion module (41) being configured to connect with the optical connection portion of the fourth optoelectronic hybrid connector (42), the optical connection portion of the fourth optoelectronic hybrid connector (42) being configured to connect with the optical connection portion of the second optoelectronic hybrid connector (23), the electrical connection portion of the fourth optoelectronic hybrid connector (42) being configured to connect with the electrical connection portion of the second optoelectronic hybrid connector (23).
9. The optoelectronic hybrid backplane interconnection system of claim 8, wherein the output unit (4) further comprises a second interposer (43), and the second optoelectronic conversion module (41) and the fourth optoelectronic hybrid connector (42) are respectively disposed on the second interposer (43).
10. The optoelectronic hybrid backplane interconnection system of claim 8, wherein the output unit (4) further comprises a third optical fiber bundle (44), one end of the third optical fiber bundle (44) is configured to be connected with an optical interface of the second optoelectronic conversion module (41), and the other end of the third optical fiber bundle (44) is configured to be connected with an optical connection of the fourth optoelectronic hybrid connector (42).
CN202110266749.0A 2021-03-11 2021-03-11 Photoelectric hybrid backplane interconnection method and system Pending CN112968731A (en)

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