CN112961637A - Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof - Google Patents

Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof Download PDF

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CN112961637A
CN112961637A CN202110402666.XA CN202110402666A CN112961637A CN 112961637 A CN112961637 A CN 112961637A CN 202110402666 A CN202110402666 A CN 202110402666A CN 112961637 A CN112961637 A CN 112961637A
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epoxy resin
component
shrinkage
low
minutes
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曹国俊
王瑞琦
王成
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Haitainaxin Technology Chengdu Co ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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Abstract

The invention discloses a low-shrinkage two-component epoxy resin adhesive as well as a preparation method and application thereof, wherein the preparation method comprises the following steps: uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A; mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain a component B; and uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive. The low-shrinkage double-component epoxy resin adhesive disclosed by the invention has the advantages that the volume change rate is close to zero after curing, the tensile strength and the shear strength are high, the adhesive is suitable for bonding optical components, and the final imaging quality of the optical components cannot be influenced by the deviation of the optical components from the original positions after bonding.

Description

Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof
Technical Field
The invention belongs to the technical field of adhesives applied to optical devices, and particularly relates to a low-shrinkage two-component epoxy resin adhesive as well as a preparation method and application thereof.
Background
The epoxy resin adhesive is a liquid adhesive composed of epoxy resin, a curing agent, a diluent, a plasticizer, a filler and the like, and is widely applied to bonding and fixing of various materials. The common epoxy resin adhesives have volume shrinkage of different degrees during curing, the volume shrinkage is about 2% -5%, and if the epoxy resin adhesives are directly applied to bonding of optical components, the optical components are easy to deviate from the positions where the optical components are located before bonding, the integrity of a light path is damaged, and the imaging quality is reduced.
The two-component epoxy resin adhesive mainly comprises a prepolymer part (generally called component A including epoxy resin, diluent and other components) and a curing agent part (generally called component B including curing agent, curing accelerator and other components). Because the two components are stored separately, the storage condition of the two-component epoxy resin adhesive is generally mild, and the two-component epoxy resin adhesive can be stored for a long time (generally one year) at room temperature without refrigeration. However, the existing two-component epoxy resin adhesive still has unequal volume shrinkage of 2% -5% during curing, and cannot be directly applied to bonding of optical components.
Disclosure of Invention
In order to overcome the defect that the volume shrinkage rate of the existing two-component epoxy resin adhesive is large during curing, the invention aims to provide a preparation method of a low-shrinkage-rate two-component epoxy resin adhesive.
The invention also aims to provide the low-shrinkage two-component epoxy resin adhesive prepared by the preparation method, wherein the volume shrinkage rate of the low-shrinkage two-component epoxy resin adhesive is close to zero when the low-shrinkage two-component epoxy resin adhesive is cured.
The purpose of the invention is realized by the following technical scheme.
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is (50-80): (5-35): (5-15): (5-15);
in the step 1), the method for uniformly mixing the epoxy resin and the swelling polymerization monomer comprises the following steps: adjusting the temperature to 60-100 ℃ and stirring for 10-60 minutes.
In the step 1), the diluent and the plasticizer are added and uniformly stirred for 10-60 minutes.
In the step 1), the epoxy resin is bisphenol a type epoxy resin or bisphenol F type epoxy resin.
In the step 1), the swelling polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane or 3, 9-bis (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane.
In the step 1), the diluent is one or a mixture of several of n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether.
In the step 1), the plasticizer is dimethyl phthalate, dibutyl phthalate or dioctyl phthalate.
2) And uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: (1-5), the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain the component B, wherein the ratio of the curing agent to the curing accelerator is (90-99.9) in parts by mass: (0.1-10).
In the step 2), the curing agent is low molecular polyamide (linoleic acid dimer triethylene tetramine, linoleic acid dimer diethylene triamine or eleostearic acid dimer diethylene triamine).
In the step 2), the curing accelerator is DMP-30(2,4, 6-tris (dimethylaminomethyl) phenol) or N, N-dimethylethanolamine.
The low-shrinkage double-component epoxy resin adhesive prepared by the preparation method.
The low-shrinkage bi-component epoxy resin adhesive is applied to reducing shrinkage after curing.
In the technical scheme, the low-shrinkage two-component epoxy resin adhesive is placed at the temperature of 50-120 ℃ for 1 minute-2 hours to obtain the cured low-shrinkage two-component epoxy resin adhesive.
The low-shrinkage double-component epoxy resin adhesive disclosed by the invention has the advantages that the volume change rate is close to zero after curing, the tensile strength and the shear strength are high, the adhesive is suitable for bonding optical components, and the final imaging quality of the optical components cannot be influenced by the deviation of the optical components from the original positions after bonding.
Detailed Description
The technical scheme of the invention is further explained by combining specific examples.
The relevant information for the reagents used in the examples of the invention is shown in the following table:
Figure BDA0003021028140000021
Figure BDA0003021028140000031
the swelling polymerization monomers 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane, 3, 9-bis (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane used in the examples of the present invention were prepared according to the methods in the references (Yuan Gui. synthesis of spiro orthocarbonate swelling monomers [ J ]. China adhesive (03): 32-35.).
Example 1
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol A type epoxy resin, the expansion polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, the diluent is a mixture of n-butyl glycidyl ether and ethylene glycol diglycidyl ether, and the ratio of the n-butyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2, the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 650#The low molecular polyamide (eleostearic acid dimer diethylenetriamine) and the curing accelerator are DMP-30(2,4, 6-tri (dimethylaminomethyl) phenol).
Example 2
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol A type epoxy resin, the expansion polymerization monomer is 1,5,7, 11-tetraoxaspiro [5,5] undecane, the diluent is a mixture of 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether, the ratio of the 2-ethylhexyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2 in parts by mass, and the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 200#Low molecular polyamide (linoleic acid dimer triethylene tetramine)) The curing accelerator is DMP-30(2,4, 6-tris (dimethylaminomethyl) phenol).
Example 3
A preparation method of a low-shrinkage double-component epoxy resin adhesive comprises the following steps:
1) mixing epoxy resin and an expansion polymerization monomer in a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes until the mixture is uniform, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes until the mixture is uniform, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is 73: 13: 9: 5, the epoxy resin is bisphenol F type epoxy resin, the expansion polymerization monomer is 3, 9-di (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane, the diluent is allyl glycidyl ether, and the plasticizer is dioctyl phthalate;
2) uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 98: 2, the curing agent is 203#Low molecular polyamide (linoleic acid dimer diethylenetriamine) and a curing accelerator N, N-dimethylethanolamine.
Comparative example 1 (without the swelling polymerization monomer)
A preparation method of a two-component epoxy resin adhesive comprises the following steps:
1) adding epoxy resin into a reaction kettle, adjusting the temperature in the reaction kettle to 90 ℃, stirring for 60 minutes, adjusting the temperature in the reaction kettle to 50 ℃, adding a diluent and a plasticizer, stirring for 60 minutes till the mixture is uniformly stirred, and performing vacuum defoamation for 30 minutes to obtain a component A, wherein the ratio of the epoxy resin to the diluent to the plasticizer is 86: 9: 5, the epoxy resin is bisphenol A epoxy resin, the diluent is a mixture of n-butyl glycidyl ether and ethylene glycol diglycidyl ether, and the ratio of the n-butyl glycidyl ether to the ethylene glycol diglycidyl ether is 7:2, the plasticizer is dimethyl phthalate;
2) uniformly mixing the component A and the component B to obtain the two-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: 2.1, the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator in a reaction kettle, stirring at 70 ℃ for 40 minutes, and defoaming in vacuum for 30 minutes to obtain a component B, wherein the ratio of the curing agent to the curing accelerator is 97: 3, curing agent is 650#The low molecular polyamide (eleostearic acid dimer diethylenetriamine) and the curing accelerator are DMP-30(2,4, 6-tri (dimethylaminomethyl) phenol).
The low-shrinkage two-component epoxy resin adhesive prepared in examples 1-3 and the two-component epoxy resin adhesive prepared in comparative example 1 were left at 60 ℃ for 1.5 hours to cure.
The low-shrinkage two-component epoxy resin adhesive prepared in examples 1-3 of the invention and the two-component epoxy resin adhesive prepared in comparative example 1 were subjected to volume change rate, tensile strength and shear strength tests. Wherein, the volume change rate is tested according to ISO 3521-1997 determination of the total volume shrinkage of the unsaturated polyester resin and the epoxy resin, and the tensile strength and the shear strength are tested according to GB/T7124-2008 determination standard of the tensile shear strength of the adhesive. The test results are shown in table 1.
Table 1 test characterization results
Figure BDA0003021028140000051
Figure BDA0003021028140000061
Note: the rate of change in volume is positive and represents the volume expansion after curing; the rate of change in volume is negative and represents the volumetric shrinkage after curing.
As can be seen from the test results in table 1, comparative example 1 contains no swelling polymerization monomer and only epoxy resin, so that the adhesive shrinks significantly in volume after curing. In contrast, examples 1 to 3 contain both an epoxy resin and an expansion polymerization monomer. Although the epoxy resin shrinks in volume when cured, the swelling polymeric monomer increases in volume when cured. The invention can make the volume increase of the swelling polymerization monomer approximately equal to the volume reduction of the epoxy resin by creatively adjusting the relative proportion of the epoxy resin and the swelling polymerization monomer. Therefore, the volume change rate of the cured adhesives of examples 1-3 was close to zero. Meanwhile, the low-shrinkage two-component epoxy resin adhesive obtained in the embodiments 1 to 3 has small volume change and low internal stress after curing, so that the tensile strength and the shear strength are higher than those of the comparative example 1 which does not contain the expansion polymerization monomer.
The invention has been described in an illustrative manner, and it is to be understood that any simple variations, modifications or other equivalent changes which can be made by one skilled in the art without departing from the spirit of the invention fall within the scope of the invention.

Claims (10)

1. A preparation method of a low-shrinkage double-component epoxy resin adhesive is characterized by comprising the following steps:
1) uniformly mixing epoxy resin and an expansion polymerization monomer, adjusting the temperature to 40-80 ℃, adding a diluent and a plasticizer, uniformly stirring, and carrying out vacuum defoaming for 5-30 minutes to obtain a component A, wherein the ratio of the epoxy resin, the expansion polymerization monomer, the diluent and the plasticizer is (50-80): (5-35): (5-15): (5-15);
2) and uniformly mixing the component A and the component B to obtain the low-shrinkage double-component epoxy resin adhesive, wherein the ratio of the component A to the component B is 10: (1-5), the method for preparing the component B comprises the following steps: mixing a curing agent and a curing accelerator, stirring for 10-60 minutes at 50-90 ℃, and defoaming for 5-30 minutes in vacuum to obtain the component B, wherein the ratio of the curing agent to the curing accelerator is (90-99.9) in parts by mass: (0.1-10).
2. The method of claim 1, wherein in the step 1), the epoxy resin and the swelling polymerization monomer are uniformly mixed by: adjusting the temperature to 60-100 ℃ and stirring for 10-60 minutes.
3. The preparation method according to claim 1, wherein in the step 1), the diluent and the plasticizer are stirred for 10 to 60 minutes to achieve uniform stirring after the diluent and the plasticizer are added.
4. The production method according to claim 1, wherein in the step 1), the epoxy resin is a bisphenol a type epoxy resin or a bisphenol F type epoxy resin;
the swelling polymerization monomer is 1,4,6, 9-tetraoxaspiro [4,4] nonane, 1,5,7, 11-tetraoxaspiro [5,5] undecane or 3, 9-di (p-methoxybenzyl) -1,5,7, 11-tetraoxaspiro [5,5] undecane.
5. The preparation method according to claim 4, wherein in the step 1), the diluent is one or a mixture of n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether and ethylene glycol diglycidyl ether;
in the step 1), the plasticizer is dimethyl phthalate, dibutyl phthalate or dioctyl phthalate.
6. The method according to claim 1, wherein in the step 2), the curing agent is a low-molecular polyamide.
7. The production method according to claim 1, wherein in the step 2), the curing accelerator is DMP-30 or N, N-dimethylethanolamine.
8. The low-shrinkage two-component epoxy resin adhesive obtained by the preparation method of any one of claims 1-7.
9. The use of the low shrinkage two-part epoxy adhesive of claim 8 to reduce shrinkage after curing.
10. The application of claim 9, wherein the low-shrinkage two-component epoxy resin adhesive is placed at 50-120 ℃ for 1 minute-2 hours to obtain the cured low-shrinkage two-component epoxy resin adhesive.
CN202110402666.XA 2021-04-14 2021-04-14 Low-shrinkage two-component epoxy resin adhesive and preparation method and application thereof Pending CN112961637A (en)

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CN104356990A (en) * 2014-11-23 2015-02-18 桂林理工大学 Preparation method of adhesive for optical spare parts
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