CN112961354A - Reactive fluorosilicone resin and preparation method and application thereof - Google Patents

Reactive fluorosilicone resin and preparation method and application thereof Download PDF

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Publication number
CN112961354A
CN112961354A CN202110183821.3A CN202110183821A CN112961354A CN 112961354 A CN112961354 A CN 112961354A CN 202110183821 A CN202110183821 A CN 202110183821A CN 112961354 A CN112961354 A CN 112961354A
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substituted
unsubstituted
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reactive
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潘庆崇
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Guangdong Guangshan New Materials Co ltd
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Guangdong Guangshan New Materials Co ltd
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Priority to PCT/CN2021/126577 priority Critical patent/WO2022089460A1/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
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    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C07F7/1872—Preparation; Treatments not provided for in C07F7/20
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    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1896—Compounds having one or more Si-O-acyl linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K5/541—Silicon-containing compounds containing oxygen
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

Abstract

The invention provides reactive fluorosilicone resin, a preparation method and application thereof, wherein the reactive fluorosilicone resin serving as an additive can enable an added material to have low dielectric constant, self-cleaning performance and excellent adhesion performance.

Description

Reactive fluorosilicone resin and preparation method and application thereof
Technical Field
The invention belongs to the field of functional resin, and relates to reactive fluorosilicone resin, polymeric fluorosilicone resin, and preparation methods and applications thereof.
Background
Self-cleaning mainly comprises two aspects: firstly, the super-hydrophobic material or the super-oleophobic material takes away the super-hydrophobic self-cleaning coating of the surface pollutants by the scouring action of water or oil; and secondly, preparing the super-hydrophobic or super-oleophobic self-cleaning coating with photocatalytic activity by compounding with a photocatalyst. The self-cleaning function of the super-hydrophobic or super-oleophobic coating is mainly represented by the self-cleaning function of the super-hydrophobic or super-oleophobic coating on inorganic stains such as dust, mud and the like, which is endowed by the special wettability of the super-hydrophobic or super-oleophobic coating, and the self-cleaning function of the super-hydrophobic or super-oleophobic coating is usually realized by means of the washing of rainwater and a certain inclination angle. When water drops or oil drops fall on the inclined super-hydrophobic or super-oleophobic surface, the water drops or the oil drops are spherical and easy to roll, so that hydrophilic substances such as dust, mud and the like adhered to the surface of the matrix are adhered, and the self-cleaning of the surface of the matrix is finally realized. The latter is a coating containing photocatalytically active particles which can degrade organic pollutants by the catalytic action of light. The most commonly used are particles with ultraviolet catalytic activity such as titanium dioxide, zinc oxide, zinc sulfide, tin oxide, etc., the photocatalytic activity of which depends on the transition of valence band electrons to conduction band and the formation of electron-hole pairs of the semiconductor nanomaterial under the condition of light. The application field of the self-cleaning coating is more and more diversified, and the self-cleaning coating has potential application prospects in various fields, such as self-cleaning clothes in the textile industry field, self-cleaning windshields in the automobile industry field, biological adhesion resistance self-cleaning of building structures in ocean engineering, self-cleaning coatings of roof solar cells, self-cleaning paint coatings and the like, so that the research on the self-cleaning coating has profound significance for engineering application and industrial production.
The 5G network is a fifth generation communication network, and its performance is superior to the 4G network technology used today. The 5G network technology is obviously embodied in the aspects of transmission timeliness, coverage, communication safety guarantee and the like of wireless signals. The 5G network communication technology is deeply combined with other wireless mobile technologies to form a brand new communication network, and the requirement of the internet mobile communication network for increasing speed is met. Moreover, the 5G mobile network technology can also realize mutual adjustment between intellectualization and automation, and has certain flexibility, because the communication technology and wireless technology used by people nowadays lay a good foundation for the 5G communication system.
The communication material for 5G requires a material with very low dielectric constant and dielectric loss, and the materials used in the current 4G communication take polytetrafluoroethylene as the main material, but the polytetrafluoroethylene has poor compatibility with the material and only has hydrophobicity, almost has no self-cleaning performance on organic pollutants such as oil drops, and has a barrier when being applied to a 5G communication terminal. And the glass transition temperature of the polytetrafluoroethylene is low, and the stability of the polytetrafluoroethylene is also defective because a large amount of heat is generated by high-power communication transmission.
Disclosure of Invention
In order to solve the technical problems, the application provides reactive fluorosilicone resin, polymeric fluorosilicone resin, and a preparation method and application thereof, wherein the reactive fluorosilicone resin has low dielectric constant, self-cleaning performance and excellent adhesion performance.
One of the objectives of the present invention is to provide a reactive fluorosilicone resin, which has a structure as shown in formula 1:
Figure BDA0002942233220000021
wherein R is1～R6Any group that satisfies its chemical environment, said R1～R6At least one of which is a fluorine-containing group, said fluorine-containing group being-CaHbFcSaid R is1～R6At least one of the groups contains reactive groups, X and Y are any groups meeting the chemical environment, n is more than or equal to 0, a is more than or equal to 1, b is more than or equal to 0, and c is more than or equal to 1.
Where n is 1, 5, 10, 20, 50, 80, 100, 150, 200, or 500, etc., a is 2, 3, 5, 8, 10, 12, 15, 18, 20, 25, 30, 40, or 50, etc., b is 1, 2, 3, 5, 8, 10, 12, 15, 18, 20, 25, 30, 40, or 50, etc., and c is 2, 3, 5, 8, 10, 12, 15, 18, 20, 25, 30, 40, or 50, etc., but is not limited to the recited values, and other values not recited within the above numerical ranges are equally applicable.
As a preferred embodiment of the present invention, R is1～R6Each independently preferably includes any one or a combination of at least two of a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heteroaryl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted cycloalkoxy group, a substituted or unsubstituted aryloxy group, or a substituted or unsubstituted heteroaryloxy group.
As a preferred embodiment of the present invention, R is1～R6The aryl group independently and preferably comprises any one or a combination of at least two of C1-C12 substituted or unsubstituted alkyl, C3-C12 substituted or unsubstituted cycloalkyl, C6-C12 substituted or unsubstituted aryl, C5-C12 substituted or unsubstituted heteroaryl, C1-C12 substituted or unsubstituted alkoxy, C3-C12 substituted or unsubstituted cycloalkoxy, C6-C12 substituted or unsubstituted aryloxy, and C5-C12 substituted or unsubstituted heteroaryloxy.
Among them, the substituted or unsubstituted alkyl group is preferably a substituted or unsubstituted alkyl group having C1 to C12, and may be, for example, a substituted or unsubstituted alkyl group having C2, C3, C4, C5, C6, C7, C8, C9, C10, or C11;
the substituted or unsubstituted cycloalkyl group is preferably a cycloalkyl group having C3 to C12, and may be, for example, a substituted or unsubstituted cycloalkyl group having C4, C5, C6, C7, C8, C9, C10, or C11;
the substituted or unsubstituted aromatic group is preferably a C5-C12 aromatic group, and may be, for example, a substituted or unsubstituted aromatic group of C6, C7, C8, C9, C10 or C11;
the substituted or unsubstituted heteroaryl group is preferably a C5 to C12 heteroaryl group, and may be, for example, a substituted or unsubstituted heteroaryl group of C6, C7, C8, C9, C10, or C11;
the substituted or unsubstituted alkoxy group is preferably a substituted or unsubstituted alkoxy group having C1 to C12, and may be, for example, a substituted or unsubstituted alkoxy group having C2, C3, C4, C5, C6, C7, C8, C9, C10, or C11;
the substituted or unsubstituted cycloalkoxy group is preferably a C3 to C12 cycloalkoxy group, and may be, for example, a C4, C5, C6, C7, C8, C9, C10 or C11 substituted or unsubstituted cycloalkoxy group;
the substituted or unsubstituted aromatic oxy group is preferably a C6 to C12 aromatic oxy group, and may be, for example, a substituted or unsubstituted aromatic oxy group of C7, C8, C9, C10, or C11;
the substituted or unsubstituted heteroaryloxy group is preferably a C5 to C12 heteroaryloxy group, and may be, for example, a substituted or unsubstituted heteroaryloxy group of C6, C7, C8, C9, C10 or C11.
In a preferred embodiment of the present invention, the reactive group preferably includes any one or a combination of at least two of a hydroxyl group, an amine group, an unsaturated group, a carboxyl group, an epoxy group, an ester group, an acid anhydride, an isocyanate group, and a cyano group.
In a preferred embodiment of the present invention, X and Y each independently preferably include any one of a substituted or unsubstituted alkylene group, a substituted or unsubstituted arylene group, an imino group, O, S, an amide group, or an ester group.
Among them, the substituted or unsubstituted alkylene group is preferably a substituted or unsubstituted alkylene group having C1 to C12, and may be, for example, a substituted or unsubstituted alkylene group having C2, C3, C4, C5, C6, C7, C8, C9, C10, or C11;
the substituted or unsubstituted arylene group is preferably a substituted or unsubstituted arylene group having from C6 to C12, and may be, for example, a substituted or unsubstituted arylene group having from C7, C8, C9, C10, or C11.
The second object of the present invention is to provide a method for preparing the reactive fluorosilicone resin, comprising: the compound containing silicon element and the fluorine-containing compound are prepared through substitution reaction.
In a preferred embodiment of the present invention, the compound containing elemental silicon includes any one or a combination of at least two of substituted or unsubstituted silane, substituted or unsubstituted siloxane, polysilane, and polysiloxane.
Preferably, the polysilane comprises a polymer obtained by self-polymerization of silane or copolymerization of silane and a chain extender.
Preferably, the polysiloxane comprises a polymer resulting from the polymerisation of a siloxane or the copolymerisation of a siloxane with a chain extender.
The silane is preferably C1-C12 substituted or unsubstituted alkyl silane, C3-C12 substituted or unsubstituted naphthenic silane, C6-C12 substituted or unsubstituted aromatic silane or C5-C12 substituted or unsubstituted heteroaryl silane, C1-C12 substituted or unsubstituted alkoxy, C3-C12 substituted or unsubstituted cycloalkoxy, C6-C12 substituted or unsubstituted aromatic oxy or C5-C12 substituted or unsubstituted heteroaryloxy.
Wherein, the substituted or unsubstituted alkylsilane of C1-C12 can be substituted or unsubstituted alkylsilane of C2, C3, C4, C5, C6, C7, C8, C9, C10 or C11;
the C3-C12 substituted or unsubstituted cycloalkylsilane can be C4, C5, C6, C7, C8, C9, C10 or C11 substituted or unsubstituted cycloalkylsilane;
the substituted or unsubstituted aryl silane of C6-C12 can be substituted or unsubstituted aryl silane of C7, C8, C9, C10 or C11;
the C5-C12 substituted or unsubstituted heteroaryl silane can be C6, C7, C8, C9, C10 or C11 substituted or unsubstituted heteroaryl silane;
the substituted or unsubstituted alkoxy group having C1 to C12 may be, for example, a substituted or unsubstituted alkoxysilane having C2, C3, C4, C5, C6, C7, C8, C9, C10 or C11;
C3-C12 cycloalkoxy group, which may be, for example, C4, C5, C6, C7, C8, C9, C10 or C11 substituted or unsubstituted cycloalkoxysilane;
a C6-C12 aryloxy group which may be, for example, a substituted or unsubstituted aryloxysilane of C7, C8, C9, C10 or C11;
the heteroaryloxy group having at least one carbon atom from the group consisting of C5 to C12 may be, for example, a substituted or unsubstituted heteroaryloxysilane having at least one carbon atom from the group consisting of C6, C7, C8, C9, C10 and C11.
In a preferred embodiment of the present invention, the fluorine-containing compound preferably includes one or a combination of at least two of an alcohol compound, a carboxylic acid compound, an ester compound, an amine compound, a thiol compound, and a halogenated hydrocarbon compound, in which at least one hydrogen atom is substituted with a fluorine atom.
As a preferred embodiment of the present invention, the halogenated hydrocarbon compound preferably includes any one of chlorinated hydrocarbon, brominated hydrocarbon, or iodo hydrocarbon, or a combination of at least two of them.
Preferably, the fluorine compound includes any one of or a combination of at least two of perfluoro-substituted alcohol compounds, carboxylic acid compounds, ester compounds, amine compounds or thiol compounds.
Among them, the alcohol compound is preferably an alcohol compound of C2 to C18, and may be, for example, an alcohol compound of C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, or C17;
the carboxylic acid compound is preferably a C2 to C18 carboxylic acid compound, and may be, for example, a C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, or C17 carboxylic acid compound;
the ester compound is preferably an ester compound of C2-C18, and may be, for example, an ester compound of C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16 or C17;
the amine compound is preferably a C2-C18 amine compound, and may be, for example, a C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16 or C17 amine compound;
the thiol compound is preferably a thiol compound of C2 to C18, and may be, for example, a thiol compound of C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16 or C17.
The third object of the present invention is to provide a polymeric fluorosilicone resin prepared by self-polymerization or copolymerization of any one of the reactive fluorosilicone resins described above.
In a preferred embodiment of the present invention, the polymeric fluorosilicone resin is prepared by copolymerizing any one of the reactive fluorosilicone resins described above and a compound containing a reactive group.
The fourth purpose of the invention is to provide application of the reactive fluorosilicone resin, and the application fields of the compound comprise the field of insulating materials, the field of hydrophobic coatings, the field of thermosetting resins, the field of photosensitive resins, the field of engineering plastics, the field of elastomers, the field of rubber and the field of nylon.
In the invention, the reactive fluorosilicone resin has reactive groups and can react with raw materials such as resin of added materials, so that the reactive fluorosilicone resin has excellent compatibility with resin and paint. Meanwhile, the reactive fluorosilicone resin contains silicon elements, so that the dispersion performance of the reactive fluorosilicone resin in added resin and paint is improved. The polymeric fluorosilicone resin has a high molecular structure, so that the polymeric fluorosilicone resin has good compatibility with high molecular materials, such as engineering plastics, coatings and the like, without the participation of reactive groups in reaction. Due to the addition of the silicon element, the adhesion of the added coating to the coated substrate is increased. The reactive fluorosilicone resin and the polymeric fluorosilicone resin simultaneously contain silicon element and fluorine element, so that the reactive fluorosilicone resin has certain hydrophobic and oleophobic characteristics, and the surface of the formed coating has good self-cleaning performance. The fluorine content of the reactive fluorosilicone resin and the fluorine content of the polymeric fluorosilicone resin provided by the invention are high, and the dielectric constant and node loss of the added resin or paint can be effectively reduced, so that the added resin or paint can be applied to the communication fields of 5G and the like. Compared with the traditional polytetrafluoroethylene material, the reactive fluorosilicone resin and the polymeric fluorosilicone resin provided by the invention have better compatibility with the added resin or paint, can reduce the use of additives such as a dispersing agent, a solubilizer and the like, have obviously better processing performance than the traditional polytetrafluoroethylene material, and can improve the self-cleaning performance and the adhesion performance of the added material.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) the invention discloses a reactive fluorine-silicon resin and a preparation method and application thereof, wherein the reactive fluorine-silicon resin can be used as an additive and can be an added material with low dielectric constant, self-cleaning property and adhesive force;
(2) the invention discloses a reactive fluorosilicone resin and a preparation method and application thereof, wherein the reactive fluorosilicone resin is added into an epoxy resin composition or thermosetting phenolic resin as an additive, so that the dielectric loss and the dielectric constant of the epoxy resin composition or thermosetting phenolic resin can be reduced, and the surface of the epoxy resin composition or thermosetting phenolic resin has excellent self-cleaning performance;
(3) the invention discloses reactive fluorosilicone resin and polymeric fluorosilicone resin, wherein the reactive fluorosilicone resin and the polymeric fluorosilicone resin are added into a coating as an additive, such as an organic silicon resin coating, an acrylic resin coating, an epoxy resin coating or a polyester resin coating, so that the dielectric loss and the dielectric constant of the coating can be reduced, the adhesion performance of the coating is improved, and the surface of a coating formed by the coating has excellent self-cleaning performance.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 2:
Figure BDA0002942233220000081
the preparation method of the compound shown in the formula 2 comprises the following steps: dissolving 1mol of diphenyl dimethoxysilane in 100mLNMP, adding 1mol of perfluorododecanol and 0.01mol of dibutyltin oxide, reacting for 2.5h at 100 ℃, separating the solvent by distillation to obtain a product, adding 1mol of epichlorohydrin, reacting for 2h at 80 ℃, and purifying the product after the reaction is finished to obtain the compound shown in the formula 2.
1H NMR(CDCl3,500MHz):δ7.60～7.52(m，2H，Ar-H)，7.48～7.40(m，4H，Ar-H)，7.36～7.27(m，4H，Ar-H)，4.19～4.11(s，2H，CH2)，4.10～4.02(d，H，CH2)，3.77～3.71(d，H，CH2)，2.69～2.62(m，H，CH2)，2.69～2.62(m，H，CH)，2.36～2.58(m，H，CH2)。
Example 2
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 3:
Figure BDA0002942233220000091
the preparation method of the compound shown in the formula 3 comprises the following steps: dissolving 1mol of dimethylvinylmethoxysilane in 100mL of NMP, adding 1mol of perfluorobutanol and 0.01mol of dibutyltin oxide, reacting for 2h at 100 ℃, separating the solvent by distillation, and purifying the product to obtain the compound shown in the formula 3.
1H NMR(CDCl3,500MHz):δ5.43～5.36(t，H，CH＝CH 2)，5.35～5.29(t，H，CH＝CH2)，5.19～5.11(t，H，CH＝CH 2)，4.15～4.08(s，2H，CH2)，0.22～0.15(s，6H，CH3)。
Example 3
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 4:
Figure BDA0002942233220000101
the preparation method of the compound shown in the formula 4 comprises the following steps: dissolving 1mol of chloromethyl dimethoxysilane in 100mLNMP, adding 1mol of perfluorooctanol and 0.01mol of dibutyltin oxide, reacting for 4.5h at 135 ℃, separating the solvent by distillation, mixing the product with 1mol of aminoacetic acid and 0.01mol of dibutyltin oxide, reacting for 2h at 80 ℃, and purifying the product to obtain the compound shown in formula 4.
1H NMR(CDCl3,500MHz):δ4.15～4.08(s，2H，CH2)，3.83～3.75(t，2H，CH2)，3.58～3.51(s，3H，CH3)，2.67～2.59(s，H，CH2)，1.55～1.47(t，2H，NH2)，0.25～0.17(s，3H，CH3)。
Example 4
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 5:
Figure BDA0002942233220000102
the preparation method of the compound shown in the formula 5 comprises the following steps: dissolving 1mol of diphenyl methoxysilane in 100m of NMP, adding 1mol of perfluorohexanoic acid and 0.01mol of dibutyltin oxide, reacting for 2h at 120 ℃, separating the solvent by distillation, mixing the product with 1mol of acetonitrile chloride, reacting for 2.5h at 75 ℃, and purifying the product to obtain the compound shown in the formula 5.
1H NMR(CDCl3,500MHz):δ7.58～7.51(m，2H，Ar-H)，7.49～7.42(m，4H，Ar-H)，7.37～7.29(m，4H，Ar-H)，4.99～4.92(t，2H，CH2)。
Example 5
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 6:
Figure BDA0002942233220000111
the preparation method of the compound shown in the formula 6 comprises the following steps: dissolving 1mol of vinyl trimethoxy silane in 100mLNMP, adding 1mol of perfluorononanoic acid and 0.01mol of dibutyltin oxide, reacting for 3 hours at 100 ℃, separating the solvent by distillation, and purifying the product to obtain the compound shown in the formula 6.
1H NMR(CDCl3,500MHz):δ5.42～5.35(t，H，CH＝CH 2)，5.33～5.26(t，H，CH＝CH2)，5.19～5.11(t，H，CH＝CH 2)，3.58～3.51(s，6H，CH3)。
Example 6
The embodiment provides a reactive fluorosilicone resin, which has a structure shown in formula 7:
Figure BDA0002942233220000121
the preparation method of the compound shown in the formula 7 comprises the following steps: dissolving 1mol of polymethylphenylsiloxane (with the polymerization degree of 200) in 100mL of NMP, adding 1mol of perfluorooctadecanoic acid and 0.01mol of dibutyltin oxide, reacting for 12h at 180 ℃, separating the solvent by distillation, then combining the product with 1mol of aminoacetic acid, reacting for 3h at 60 ℃, and purifying the product to obtain the compound shown in the formula 7.
A nuclear magnetic resonance hydrogen spectrum test shows that the compound prepared by the preparation method has an N-H peak between 1.55 and 1.47, and a C-H peak of methoxyl groups between 4.25 and 4.18.
Application in epoxy resin
Example 7
In this example, 100 parts by weight of bisphenol A epoxy resin having an epoxy equivalent of 360/eq and 6 parts by weight of dicyandiamide were mixed with 8 parts by weight of the reactive fluorosilicone resin shown in examples 1 to 6, respectively, and cured at 120 ℃ for 1.5 hours to obtain epoxy resin cured products a to f.
Comparative example 1
In this comparative example, 100 parts by weight of an epoxy resin having an epoxy equivalent of 360/eq was added with 6 parts by weight of dicyandiamide, and then 30 parts by weight of polytetrafluoroethylene was added and cured at 120 ℃ for 1.5 hours to obtain a cured product g of the epoxy resin.
The epoxy resin cured products a-g provided in example 7 and comparative example 1 were tested for dielectric constant (Dk) and dielectric loss (Df) according to GB1049-78(10 GHz); the self-cleaning performance of the surface of the cured epoxy resin is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the cured epoxy resin, and the contact angles formed by the water droplets and the oil droplets were measured, and the results are shown in Table 1.
TABLE 1
Figure BDA0002942233220000131
It can be seen from the test results in table 1 that the reactive fluorosilicone resin provided by the present application effectively reduces the dielectric constant and dielectric loss of the epoxy resin system after being added into the epoxy resin system, and simultaneously enables the epoxy resin to have excellent self-cleaning performance.
The application of the thermosetting phenolic resin comprises the following steps:
example 8
In this example, 260 parts by weight of the reactive fluorosilicone resin prepared in examples 1 to 6, 500 parts by weight of phenol, 539 parts by weight of formaldehyde, and 10 parts by weight of triethanolamine catalyst were reacted at 50 ℃ for 2 hours, and after the reaction was completed, the temperature was reduced to 30 ℃ and 1 part by weight of silane coupling agent was added to obtain thermosetting phenol resins a to f.
Comparative example 2
In the comparative example, 260 parts by weight of polytetrafluoroethylene, 500 parts by weight of phenol, 539 parts by weight of formaldehyde and 10 parts by weight of triethanolamine catalyst were reacted at 50 ℃ for 2 hours, and after the reaction was completed, the temperature was reduced to 30 ℃ and 1 part by weight of silane coupling agent was added to obtain thermosetting phenol resin g.
The thermosetting phenolic resins a-g provided in example 8 and comparative example 2 were tested for dielectric constant (Dk) and dielectric loss (Df), which were measured by GB1049-78(10 GHz); the self-cleaning performance of the surface of the thermosetting phenolic resin is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the thermosetting phenol resin, respectively, and the contact angle formed by the water drop and the oil drop was measured, and the results are shown in table 2.
TABLE 2
Figure BDA0002942233220000141
Figure BDA0002942233220000151
As can be seen from the test results in table 2, after the reactive fluorosilicone resin provided by the present application is added into the thermosetting phenolic resin system, the dielectric constant and the dielectric loss of the thermosetting phenolic resin system are effectively reduced, and the thermosetting phenolic resin has excellent self-cleaning performance.
Application of organic silicon resin coating
Example 9
This example provides a silicone resin coating, the raw materials of which include: 45 parts of methyl silicone resin, 45 parts of urushiol resin, 20 parts of alcohol-soluble barium phenol, 20 parts of methyl silicone oil, 20 parts of fluorosilicone resin provided in examples 1 to 6, 10 parts of methacrylic acid, 10 parts of kaolin, 10 parts of soft black, 4 parts of organic boron-containing soil, 4 parts of nano silicon dioxide, 2 parts of a polyether defoaming agent and 1 part of a polyacrylate leveling agent. The raw materials are mixed to obtain the organic silicon resin coatings a-f.
Comparative example 3
The present comparative example provides a silicone resin coating, the coating comprising the following raw materials: 45 parts of methyl silicone resin, 45 parts of urushiol resin, 20 parts of alcohol-soluble barium phenolate, 20 parts of methyl silicone oil, 20 parts of polytetrafluoroethylene, 10 parts of methacrylic acid, 10 parts of kaolin, 10 parts of soft black, 4 parts of organic boron-moist soil, 4 parts of nano silicon dioxide, 2 parts of polyether defoaming agent and 1 part of polyacrylate leveling agent. The raw materials are mixed to obtain the organic silicon resin coating g.
The silicone resin coatings a-g provided in example 9 and comparative example 3 were tested for dielectric constant (Dk) and dielectric loss (Df) according to GB1049-78(10 GHz); testing the adhesive force of a coating formed by the organic silicon resin coating on the fiber cement board, wherein the adhesive force test adopts a hundred-grid test; the self-cleaning performance of the coating formed by the organic silicon resin coating is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the coating layer formed of the silicone resin coating, respectively, and the contact angles formed by the water droplets and the oil droplets were measured, and the results of the measurements are shown in table 3.
TABLE 3
Figure BDA0002942233220000161
It can be seen from the test results in table 3 that the reactive fluorosilicone resin provided by the present application effectively reduces the dielectric constant and dielectric loss of the silicone resin coating system after being added into the silicone resin coating system, and simultaneously enables the silicone resin coating to have excellent adhesion and self-cleaning performance.
Application of acrylic resin coating
Example 10
The embodiment provides an acrylic resin coating, which comprises the following raw materials: 60 parts of epoxy modified acrylic resin, 20 parts of titanium dioxide, 10 parts of fluorosilicone resin provided in examples 1 to 6, 5 parts of xylene, 3 parts of ethyl acetate, 5 parts of ethylene glycol ethyl ether acetate, 0.5 part of BYK-190 dispersing agent, 0.5 part of BYK-022 organic silicon defoaming agent, 0.5 part of BYK-333 organic silicon leveling agent and 0.5 part of BYK-420 anti-settling agent. The raw materials are mixed to obtain the acrylic resin coatings a-f.
Dispersing the fluorosilicone resin provided in example 2 in NMP, adding azobisisobutyronitrile as an initiator, reacting at 180 ℃ for 2h, 190 ℃ for 2h, and 200 ℃ for 2h in sequence, separating the solvent by distillation, and purifying the product to obtain polymeric fluorosilicone resin I. The acrylic resin coating g is prepared according to the above proportions.
Dispersing the fluorosilicone resin provided in example 5 in NMP, adding azobisisobutyronitrile as an initiator, reacting at 180 ℃ for 2h, 190 ℃ for 2h, and 200 ℃ for 2h in sequence, separating the solvent by distillation, and purifying the product to obtain polymeric fluorosilicone resin II. And preparing the acrylic resin coating h according to the proportion.
Comparative example 4
The present comparative example provides an acrylic resin coating, which comprises the following raw materials: 60 parts of epoxy modified acrylic resin, 20 parts of titanium dioxide, 10 parts of polytetrafluoroethylene, 5 parts of xylene, 3 parts of ethyl acetate, 5 parts of ethylene glycol ethyl ether acetate, 0.5 part of BYK-190 dispersing agent, 0.5 part of BYK-022 organic silicon defoaming agent, 0.5 part of BYK-333 organic silicon flatting agent and 0.5 part of BYK-420 anti-settling agent. And mixing the raw materials to obtain the acrylic resin coating i.
The silicone resin coatings a-g provided in example 10 and comparative example 4 were tested for dielectric constant (Dk) and dielectric loss (Df) according to GB1049-78(10 GHz); testing the adhesive force of a coating formed by the acrylic resin coating on the fiber cement board, wherein the test adopts a hundred-grid test; the self-cleaning performance of the coating formed by the acrylic resin coating is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the coating layer formed of the acrylic resin paint, respectively, and the contact angles formed by the water drops and the oil drops were measured, and the results of the measurements are shown in table 4.
TABLE 4
Figure BDA0002942233220000181
From the test results in table 4, it can be seen that the reactive fluorosilicone resin provided by the present application effectively reduces the dielectric constant and dielectric loss of the acrylic resin coating system after being added into the acrylic resin coating system, and simultaneously enables the acrylic resin coating to have excellent adhesion and self-cleaning performance.
Application of polyester resin coating
Example 11
The embodiment provides a polyester resin coating, and the raw materials of the polyester resin comprise: 60 parts of 312C saturated polyester resin composition, 15 parts of fluorosilicone resin provided in examples 1 to 6, 30 parts of methyltriethoxysilane, 20 parts of dimethyldichlorosilane, 5 parts of methyl silicone oil, 5 parts of nano barium sulfate, 10 parts of oxidized polyacrylate, 2 parts of dicyandiamide and 3 parts of glycerol. The raw materials are mixed to obtain the polyester resin coatings a-f.
Comparative example 5
The embodiment provides a polyester resin coating, and the raw materials of the polyester resin comprise: 60 parts of 312C saturated polyester resin composition, 15 parts of polytetrafluoroethylene, 30 parts of methyltriethoxysilane, 20 parts of dimethyldichlorosilane, 5 parts of methyl silicone oil, 5 parts of nano barium sulfate, 10 parts of oxidized polyacrylate, 2 parts of dicyandiamide and 3 parts of glycerol. The above raw materials were mixed to obtain a polyester resin coating g.
The polyester resin coatings a-g provided in example 11 and comparative example 5 were tested for dielectric constant (Dk) and dielectric loss (Df) according to GB1049-78(10 GHz); testing the adhesive force of a coating formed by the polyester resin coating on the fiber cement board, wherein the test adopts a hundred-grid test; the self-cleaning performance of the coating formed by the polyester resin coating is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the coating layer formed of the polyester resin paint, respectively, and the contact angles formed by the water droplets and the oil droplets were measured, and the results of the measurements are shown in table 5.
TABLE 5
Figure BDA0002942233220000191
Figure BDA0002942233220000201
It can be seen from the test results in table 5 that the reactive fluorosilicone resin provided by the present application effectively reduces the dielectric constant and dielectric loss of the polyester resin coating system after being added into the polyester resin coating system, and simultaneously enables the polyester resin coating to have excellent adhesion and self-cleaning performance.
Application of epoxy resin coating
Example 12
The embodiment provides an epoxy resin coating, which comprises the following raw materials: 50 parts of epoxy resin with the epoxy equivalent of 320/eq, 15 parts of fluorosilicone resin provided in examples 1-6, 10 parts of distilled water, 10 parts of water-soluble cellulose ether, 10 parts of polyacrylate, 10 parts of titanium dioxide, 2 parts of hexadecyl trimethyl ammonium bromide, 2 parts of an acrylate leveling agent, 2 parts of diethyl triamine, 1 part of a polyether defoamer, 1 part of bentonite and 1 part of glycerol. The raw materials are mixed to obtain the epoxy resin coatings a-f.
Comparative example 6
The embodiment provides an epoxy resin coating, which comprises the following raw materials: 50 parts of epoxy resin with the epoxy equivalent of 320/eq, 15 parts of polytetrafluoroethylene, 10 parts of distilled water, 10 parts of water-soluble cellulose ether, 10 parts of polyacrylate, 10 parts of titanium dioxide, 2 parts of hexadecyl trimethyl ammonium bromide, 2 parts of an acrylate leveling agent, 2 parts of diethyl triamine, 1 part of a polyether defoamer, 1 part of bentonite and 1 part of glycerol. The raw materials are mixed to obtain an epoxy resin coating g.
The polyester resin coatings a-g provided in example 12 and comparative example 6 were tested for dielectric constant (Dk) and dielectric loss (Df) according to GB1049-78(10 GHz); testing the adhesive force of a coating formed by the epoxy resin coating on the fiber cement board, wherein the test adopts a hundred-grid test; the self-cleaning performance of the coating formed by the epoxy resin coating is tested, and the self-cleaning performance testing method comprises the following steps: water and vegetable oil were dropped on the surface of the coating layer formed of the epoxy resin paint, respectively, and the contact angles formed by the water droplets and the oil droplets were measured, and the results are shown in table 6.
TABLE 6
Figure BDA0002942233220000211
From the test results in table 6, it can be seen that the reactive fluorosilicone resin provided by the present application effectively reduces the dielectric constant and dielectric loss of the epoxy resin coating system after being added into the epoxy resin coating, and simultaneously enables the epoxy resin coating to have excellent adhesion and self-cleaning performance.
In the invention, the adhesion method comprises the following steps: spraying the coating on a concrete plate, completely drying (70-80 ℃ C. by 8H), after cooling, marking 1x1mm hundreds of grids on the film surface, testing the adhesive force between the coated concrete substrates according to a GB/T1720 method (5B-the edge of a notch is smooth, the grid edge does not peel off, 4B-the intersection of the notch has small pieces peeling off, the actual damage in the grid area is not more than 5%, 3B-the edge and/or the intersection of the notch has peeling off, the area of the edge and/or the intersection is more than 5% but less than 15%, 2B-the edge of the notch has partial peeling off or the whole peeling off, and/or part of the grid is peeled off by the whole piece, the area of the peeled off exceeds 15% but less than 35%, 1B-the edge of the notch has partial peeling off or the whole peeling off, and/or part of the grid is peeled off by the whole piece, the area of the peeled off exceeds 35% but less than 65%, 0B-the edge of the cut has partial peeling off or the whole peeling off, and/or some of the cells are exfoliated by more than 65% of the area.
In the invention, the self-cleaning performance test method comprises the following steps: and (3) dripping a water drop or an oil drop on the surface of the paint, and testing the contact angle formed by the water drop or the oil drop on the surface of the paint by using a contact angle measuring device. The larger the contact angle, the poorer the wettability of water or oil on the coating surface, and the better the self-cleaning effect.
The applicant states that the present invention is illustrated by the above examples to show the detailed process equipment and process flow of the present invention, but the present invention is not limited to the above detailed process equipment and process flow, i.e. it does not mean that the present invention must rely on the above detailed process equipment and process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

Claims (12)

1. A reactive fluorosilicone resin is characterized in that the structure of the reactive fluorosilicone resin is as shown in formula 1:
Figure FDA0002942233210000011
wherein R is1～R6Any group that satisfies its chemical environment, said R1～R6At least one of which is a fluorine-containing group, said fluorine-containing group being-CaHbFcSaid R is1～R6At least one of the groups contains reactive groups, X and Y are any groups meeting the chemical environment, n is more than or equal to 0, a is more than or equal to 1, b is more than or equal to 0, and c is more than or equal to 1.
2. The reactive fluorosilicone resin of claim 1, wherein R is1～R6Each independently preferably includes any one or a combination of at least two of a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heteroaryl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted cycloalkoxy group, a substituted or unsubstituted aryloxy group, or a substituted or unsubstituted heteroaryloxy group.
3. The reactive fluorosilicone resin of claim 2, wherein R is1～R6Independently preferably comprises C1-C12 substituted or unsubstituted alkyl, C3-C12 substituted or unsubstituted cycloalkyl, C6-C12 substituted or unsubstituted aryl, C5-C12 substituted or unsubstituted heteroaryl, C1-C12 substituted or unsubstituted alkoxy, C3-C12, C6-C12 substituted or unsubstituted aromatic oxy or C5-C12 substituted or unsubstituted hetero aryloxy or a combination of at least two of the above.
4. The reactive fluorosilicone resin of any one of claims 1 to 3, wherein the reactive group preferably comprises any one or a combination of at least two of a hydroxyl group, an amine group, an unsaturated group, a carboxyl group, an epoxy group, an ester group, an acid anhydride, an isocyanate group, or a cyano group.
5. The reactive fluorosilicone resin of any one of claims 1 to 4, wherein each of X and Y independently preferably comprises any one of a substituted or unsubstituted alkylene group, a substituted or unsubstituted arylene group, an imine group, O, S, an amide group, or an ester group.
6. A method for preparing the reactive fluorosilicone resin of any one of claims 1 to 5, comprising: the compound containing silicon element and the fluorine-containing compound are prepared through substitution reaction.
7. The method according to claim 6, wherein the compound containing elemental silicon comprises any one or a combination of at least two of a substituted or unsubstituted silane, a substituted or unsubstituted siloxane, a polysilane, or a polysiloxane;
preferably, the polysilane comprises a polymer obtained by self polymerization of silane or copolymerization of silane and a chain extender;
preferably, the polysiloxane comprises a polymer resulting from the polymerisation of a siloxane or the copolymerisation of a siloxane with a chain extender.
8. The method according to claim 6 or 7, wherein the fluorine-containing compound preferably comprises any one or a combination of at least two of an alcohol compound, a carboxylic acid compound, an ester compound, an amine compound, a thiol compound, and a halogenated hydrocarbon compound in which at least one hydrogen atom is substituted with a fluorine atom.
9. The production method according to claim 8, wherein the halogenated hydrocarbon compound preferably comprises any one of chlorinated hydrocarbon, brominated hydrocarbon or iodo hydrocarbon or a combination of at least two thereof;
preferably, the fluorine compound includes any one of or a combination of at least two of perfluoro-substituted alcohol compounds, carboxylic acid compounds, ester compounds, amine compounds or thiol compounds.
10. A polymeric fluorosilicone resin prepared by the self-polymerization or copolymerization reaction of the reactive fluorosilicone resin according to any one of claims 1 to 6.
11. A polymeric fluorosilicone resin prepared by copolymerizing the reactive fluorosilicone resin according to any one of claims 1 to 6 with a compound containing a reactive group.
12. The use of the fluorosilicone resin of any one of claims 1 to 6, 10, or 11, wherein the compound is used in the fields of insulation materials, hydrophobic coatings, thermosetting resins, photosensitive resins, engineering plastics, elastomers, rubbers, and nylons.
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Application publication date: 20210615