CN112954166A

CN112954166A - Camera module and camera equipment

Info

Publication number: CN112954166A
Application number: CN202110183482.9A
Authority: CN
Inventors: 吴云昆
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2021-02-08
Filing date: 2021-02-08
Publication date: 2021-06-11

Abstract

The invention discloses a camera module and camera equipment, wherein the camera module comprises: the PCB is provided with a mounting hole penetrating through the PCB; the sensing chip and the flexible circuit board are both arranged in the mounting hole, the flexible circuit board is connected between the sensing chip and the PCB, and the PCB is electrically connected with the sensing chip through the flexible circuit board; the driving piece is suitable for driving the sensing chip to move so as to realize anti-shake of the sensing chip. From this, through PCB board, sensor chip, flexible circuit board and driving piece cooperation, when carrying out the anti-shake drive to sensor chip, compare with prior art, need not to carry out synchronous drive to sensor chip and PCB board, only need to drive alone sensor chip can, can reduce the energy consumption of the module of making a video recording to can improve the working property of the module of making a video recording.

Description

Camera module and camera equipment

Technical Field

The invention relates to the field of camera shooting, in particular to a camera shooting module and camera shooting equipment with the same.

Background

The current market of camera equipment (mobile phone) still keeps a rapidly growing trend, the number of camera modules which are standard matched with the current smart phone is more and more demanded, the excellent pursuit of the performance of the camera modules becomes the key technical field of intense competition of various large mobile phone manufacturers, and in addition, with the continuous development of scientific technology, the situation that the camera modules need to be applied appears in other various industries, such as the fields of medicine, military and the like.

Among the correlation technique, the anti-shake structure among the module of making a video recording is sensor shift (image chip anti-shake), the anti-shake structure is most for sensor chip and PCB (Printed circuit board) integrative drive of board, because PCB board and sensor chip are fixed together, PCB board and sensor chip's weight is too big, when the module of making a video recording carries out anti-shake drive, need carry out synchronous drive to sensor chip and PCB board, this kind of drive mode is higher than independent drive sensor chip energy consumption, and the technique of independent drive sensor chip has not yet on the existing market, need be to current camera module

The group is improved.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a camera module. This module of making a video recording is when carrying out sensor chip anti-shake drive, compares with prior art, need not to carry out synchronous drive to sensor chip and PCB board, only need to drive alone to sensor chip can, can reduce the drive energy consumption of the module of making a video recording, improved the working property of the module of making a video recording.

The invention further provides an image pickup apparatus.

The camera module according to the present invention comprises: the PCB is provided with a mounting hole penetrating through the PCB; the sensing chip and the flexible circuit board are both arranged in the mounting hole, the flexible circuit board is connected between the sensing chip and the PCB, and the PCB is electrically connected with the sensing chip through the flexible circuit board; the driving piece is suitable for driving the sensing chip to move so as to realize anti-shake of the sensing chip.

According to the camera module, the PCB, the sensing chip, the flexible circuit board and the driving piece are matched, when the camera module is driven in an anti-shake mode, compared with the prior art, the sensor chip and the PCB are not required to be driven synchronously, only the sensing chip is required to be driven independently, the driving energy consumption of the camera module can be reduced, and the working performance of the camera module is improved.

In some examples of the present invention, one end of the flexible circuit board is connected to a sidewall of the sensor chip, and the other end of the flexible circuit board is connected to a sidewall of the mounting hole.

In some examples of the present invention, the flexible circuit board is plural, and the plural flexible circuit boards are spaced apart in a circumferential direction of the sensor chip.

In some examples of the present invention, the camera module further includes: the length of the memory alloy wire is adjustable after the memory alloy wire is connected with currents of different magnitudes, one end of the memory alloy wire is connected with the sensing chip, and the other end of the memory alloy wire is connected with the driving piece.

In some examples of the present invention, the memory alloy wire is a plurality of memory alloy wires, each of the plurality of memory alloy wires is provided on a surface of the sensor chip opposite to the driver, and the plurality of memory alloy wires are spaced apart.

In some examples of the invention, the number of the memory alloy wires is four, the sensing chip has four corners, and the four memory alloy wires and the four corners correspond to each other one by one.

In some examples of the invention, the driving member is connected to the PCB such that the PCB supplies power to the memory alloy wire through the driving member.

In some examples of the present invention, the camera module further includes: the mounting seat, the sensing chip is located in the mounting seat, the mounting seat with the pad is equipped with the shell fragment between the sensing chip.

In some examples of the invention, the mount includes: the memory alloy wire penetrates through the first mounting seat and is connected with the driving piece.

The camera shooting device comprises the camera shooting module.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an exploded view of a camera module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a camera module according to an embodiment of the invention;

fig. 3 is a partial cross-sectional view of a camera module according to an embodiment of the invention.

Reference numerals:

a camera module 100;

a PCB board 10; a mounting hole 11;

a sensor chip 20; a flexible circuit board 30; a drive member 40; a memory alloy wire 50;

a first mount 60; a second mount 61; a spring plate 62;

a lens 70; pin protection glue 80; a connector 90; and a circuit board 91.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The camera module 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 3, and the camera module 100 may be mounted on a camera apparatus, for example, the camera module 100 is mounted on a mobile phone.

As shown in fig. 1 to 3, a camera module 100 according to an embodiment of the present invention includes: PCB board 10, sensor chip 20, flexible circuit board 30 and driving member 40. The PCB 10 is provided with a mounting hole 11 penetrating through the PCB 10, it should be noted that the mounting hole 11 penetrates through the PCB 10 in the thickness direction of the PCB 10, the mounting hole 11 can be used for mounting a flexible circuit board 30, both the sensor chip 20 and the flexible circuit board 30 can be disposed in the mounting hole 11, the flexible circuit board 30 is connected between the sensor chip 20 and the PCB 10, and the PCB 10 is electrically connected with the sensor chip 20 through the flexible circuit board 30, and the driving member 40 is suitable for driving the sensor chip 20 to move, so that the anti-shake of the sensor chip 20 can be realized. It should be explained that the PCB 10 may be a wire Circuit board, the wire Circuit board may be a hard board, the PCB 10 is a provider for electrically connecting other electronic components in the camera module 100, the Flexible Circuit board 30 is abbreviated as an FPC (Flexible Printed Circuit board), the Flexible Circuit board 30 is a soft board, the Flexible Circuit board 30 has the advantages of high wiring density, light weight, thin thickness, etc., the sensor chip 20 may be a sensor chip, the sensor chip 20 is a core of the camera module 100, the PCB 10, the sensor chip 20 and the Flexible Circuit board 30 are all electrically connected, the Flexible Circuit board 30 is located between the PCB 10 and the sensor chip 20, the PCB 10 and the sensor chip 20 are connected through the Flexible Circuit board 30, and the driving element 40 may be set as a motor.

Wherein, the middle part of the PCB 10 in the camera module 100 is hollowed out (mounting hole 11), then the sensing chip 20 is arranged in the mounting hole 11 in the middle of the PCB 10, the area of the mounting hole 11 is larger than the area of the sensing chip 20, so that the sensing chip 20 can move in the PCB 10, then the sensing chip 20 and the PCB 10 are connected into a whole through the flexible circuit board 30, by arranging the mounting hole 11, the whole weight of the sensing chip 20 and the PCB 10 can be reduced, the current when the camera module 100 works can be reduced, when the sensing chip 20 of the camera module 100 is driven in an anti-shake way, the sensing chip 20 and the PCB 10 do not need to be driven synchronously, only the sensing chip 20 needs to be driven independently, thereby the energy consumption for driving the camera module 100 is reduced, and, because the sensing chip 20 is connected with the PCB 10 through the flexible circuit board 30, the sensing chip 20 can be suspended completely, the sensing chip 20 is not directly contacted with the PCB board 10, and compared with the prior art, when the baking and curing of the sensing chip 20 and the PCB board 10 are performed, the situation that the sensing chip 20 is bent due to the stress of the glue can be avoided, so that the risk that the sensing chip 20 is damaged is reduced, and the working performance of the camera module 100 is improved.

From this, through the cooperation of PCB board 10, sensor chip 20, flexible circuit board 30 and driving piece 40, when carrying out the anti-shake drive to sensor chip 20, compare with prior art, need not to carry out synchronous drive to sensor chip 20 and PCB board 10, only need to carry out drive alone to sensor chip 20 can, can reduce the drive energy consumption of module 100 of making a video recording, improved the working property of module 100 of making a video recording.

In some embodiments of the present invention, as shown in fig. 1, one end of the flexible circuit board 30 is connected to a sidewall of the sensor chip 20, and the other end of the flexible circuit board 30 opposite to the one end is connected to a sidewall of the mounting hole 11. It can also be explained that the two ends of the flexible circuit board 30 are respectively connected to the side wall of the sensor chip 20 and the side wall of the mounting hole 11, so that the sensor chip 20 can be completely suspended, the sensor chip 20 is not directly contacted with the PCB 10, and when the sensor chip 20 and the PCB 10 are baked and cured, the situation that the sensor chip 20 is bent due to the stress of glue can be avoided, thereby reducing the risk of damaging the sensor chip 20.

In some embodiments of the present invention, the flexible circuit board 30 may be provided in plurality, and the plurality of flexible circuit boards 30 are spaced apart in the circumferential direction of the sensor chip 20. Preferably, the number of the flexible circuit boards 30 may be four, the sensor chip 20 may be square, and the four flexible circuit boards 30 are disposed on four sides of the sensor chip 20 and are uniformly spaced apart from each other, so that the connection stability of the PCB 10 and the sensor chip 20 may be improved, the overall structural strength of the PCB 10 and the sensor chip 20 may be enhanced, and the electrical connection effect may also be improved.

In some embodiments of the present invention, as shown in fig. 1 to 3, the camera module 100 may further include: the length of the memory alloy wire 50 can be adjusted after the memory alloy wire 50 is electrified with currents of different magnitudes, one end of the memory alloy wire 50 is connected with the sensing chip 20, and the other end of the memory alloy wire 50 is connected with the driving piece 40. It should be explained that the Memory Alloy wire 50 is made of Shape Memory Alloy (Shape Memory Alloy, SMA for short), one end of the Memory Alloy wire 50 is connected to the sensing chip 20, the other end of the Memory Alloy wire 50 is connected to the base of the driving member 40, the PCB board 10, the driving member 40 and the Memory Alloy wire 50 are electrically connected to form a loop, the Memory Alloy wire 50 expands and contracts when powered on, when the sensing chip 20 in the camera module 100 is inclined, currents of different magnitudes can be applied to the Memory Alloy wire 50 according to the inclination degree of the sensing chip 20, so that the Memory Alloy wire 50 expands and contracts, the position of the sensing chip 20 can be changed through the expansion and contraction of the Memory Alloy wire 50, the inclination of the sensing chip 20 can be corrected, and thus the camera module 100 can better image on the sensing chip 20 when in operation, the problem of imaging blurring generated during shooting is avoided.

In some embodiments of the present invention, the memory alloy wire 50 may be provided in plurality, a plurality of memory alloy wires 50 are each provided on a surface of the sensor chip 20 opposite to the driving member 40, and the plurality of memory alloy wires 50 are provided at intervals. It can also be explained that a plurality of memory alloy wires 50 are arranged on the sensing chip 20 at intervals, and the driving member 40 is connected with the plurality of memory alloy wires 50 of the sensing chip 20, so that the position of the sensing chip 20 can be adjusted more comprehensively, and the problem of inclination of the sensing chip 20 is further solved.

In some embodiments of the present invention, as shown in fig. 1, preferably, the memory alloy lines 50 may be arranged in four, the sensor chip 20 has four corners, and the four memory alloy lines 50 and the four corners are arranged in a one-to-one correspondence. It can also be explained that the four memory alloy wires 50 are respectively arranged at the four corners of the sensing chip 20, so that when currents with different magnitudes are applied to the memory alloy wires 50, the positions of the sensing chip 20 can be changed by stretching and contracting the memory alloy wires 50, the positions of the sensing chip 20 can be adjusted more comprehensively, the problem of inclination of the sensing chip 20 is further solved, and the arrangement positions of the memory alloy wires 50 are appropriate.

In some embodiments of the present invention, the driving member 40 is connected to the PCB 10, and further, the pins of the driving member 40 are soldered to the PCB 10, so that the PCB 10 can supply power to the memory alloy wires 50 through the driving member 40. It should be noted that the pins of the driving element 40 are connected with the pads of the PCB 10 by welding, the driving element 40 is powered by the PCB 10, and then the memory alloy wire 50 is powered by the driving element 40, so that currents of different magnitudes can be supplied to the memory alloy wire 50, the contraction effect of the memory alloy wire 50 can be regulated and controlled by the driving element 40, the position of the sensing chip 20 can be adjusted, and the problem that the sensing chip 20 is inclined is further solved.

In some embodiments of the present invention, as shown in fig. 1 to 3, the camera module 100 may further include: the mounting seat, sensing chip 20 can be located the mounting seat, can fill up between mounting seat and sensing chip 20 and be equipped with shell fragment 62. It should be noted that the mounting seat can protect the sensing chip 20, the elastic sheet 62 can be disposed between the mounting seat and the sensing chip 20, and the elastic sheet 62 can support the sensing chip 20, so that the stability of the sensing chip 20 can be ensured without continuously energizing the memory alloy wire 50.

In some embodiments of the present invention, as shown in fig. 1-3, the mount may include: the sensing chip 20 is arranged between the first mounting seat 60 and the second mounting seat 61, the memory alloy wire 50 passes through the first mounting seat 60 to be connected with the driving part 40, and the elastic sheet 62 is arranged between the second mounting seat 61 and the sensing chip 20 in a cushioning manner. It should be explained that the first mounting base 60 and the second mounting base 61 can protect the sensor chip 20, the first mounting base 60 is a mirror base, and the second mounting base 61 is a substrate. Set up like this and can improve the overall stability of module 100 of making a video recording, improved the performance of module 100 of making a video recording.

In some embodiments of the present invention, as shown in fig. 1, the camera module 100 may further include: lens 70, stitch protection glue 80, connector 90 and circuit board 91, lens 70 is the optical component who generates the image, and stitch protection glue 80 can play the guard action to the stitch of driving piece 40, and connector 90 can be with making a video recording module 100 connection on camera equipment, and PCB board 10 and connector 90 pass through circuit board 91 and link to each other.

According to the embodiment of the invention, the camera shooting device comprises the camera shooting module 100, the camera shooting module 100 is arranged on the camera shooting device, and when the camera shooting module 100 is driven in an anti-shake mode, compared with the prior art, the sensor chip 20 and the PCB 10 do not need to be driven synchronously, and only the sensor chip 20 needs to be driven independently, so that the driving energy consumption of the camera shooting module 100 can be reduced, and the working performance of the camera shooting module 100 can be improved.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a module of making a video recording which characterized in that includes:

the PCB is provided with a mounting hole penetrating through the PCB;

the sensing chip and the flexible circuit board are both arranged in the mounting hole, the flexible circuit board is connected between the sensing chip and the PCB, and the PCB is electrically connected with the sensing chip through the flexible circuit board;

the driving piece is suitable for driving the sensing chip to move so as to realize anti-shake of the sensing chip.

2. The camera module according to claim 1, wherein one end of the flexible circuit board is connected to a side wall of the sensor chip, and the other end of the flexible circuit board is connected to a side wall of the mounting hole.

3. The camera module according to claim 1 or 2, wherein the number of the flexible circuit boards is plural, and the plural flexible circuit boards are spaced apart in a circumferential direction of the sensor chip.

4. The camera module of claim 1 or 2, further comprising: the length of the memory alloy wire is adjustable after the memory alloy wire is connected with currents of different magnitudes, one end of the memory alloy wire is connected with the sensing chip, and the other end of the memory alloy wire is connected with the driving piece.

5. The camera module of claim 4, wherein the memory alloy wire is a plurality of memory alloy wires, the plurality of memory alloy wires are arranged on the surface of the sensing chip opposite to the driving member, and the plurality of memory alloy wires are spaced apart.

6. The camera module of claim 5, wherein the number of the memory alloy wires is four, the sensor chip has four corners, and the four memory alloy wires and the four corners are in one-to-one correspondence.

7. The camera module of claim 4, wherein the driving member is connected to the PCB such that the PCB supplies power to the memory alloy wire through the driving member.

8. The camera module of claim 1 or 2, further comprising: the mounting seat, the sensing chip is located in the mounting seat, the mounting seat with the pad is equipped with the shell fragment between the sensing chip.

9. The camera module of claim 4, wherein the mount comprises: the memory alloy wire penetrates through the first mounting seat and is connected with the driving piece.

10. An image pickup apparatus characterized by comprising the image pickup module according to any one of claims 1 to 9.