CN112952416B - Connector for high-speed transmission - Google Patents
Connector for high-speed transmission Download PDFInfo
- Publication number
- CN112952416B CN112952416B CN201911264665.2A CN201911264665A CN112952416B CN 112952416 B CN112952416 B CN 112952416B CN 201911264665 A CN201911264665 A CN 201911264665A CN 112952416 B CN112952416 B CN 112952416B
- Authority
- CN
- China
- Prior art keywords
- contact
- connector
- portions
- shield
- speed transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 14
- 230000013011 mating Effects 0.000 claims description 6
- 238000005192 partition Methods 0.000 description 34
- 239000011347 resin Substances 0.000 description 30
- 229920005989 resin Polymers 0.000 description 30
- 238000000034 method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/06—Riveted connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention provides a connector for high-speed transmission, which can reduce the width of an opening part of a shell and ensure the rigidity of the shell. A terminal sandwiched between a shield plate (5P) of a main Connector (CNH) and a pad of an expansion board (91) is separated by a shield connector (4P) which is a member having contact portions (47aP, 47bP,47cP, 47dP) and a shield plate (5P) which is a member having a terminal portion with solder, an end portion of the shield connector (4P) on the side opposite to the side of the contact portions (47aP, 47bP,47cP, 47dP) and an end portion of the shield plate (5P) on the side opposite to the side of the terminal portion with solder are press-fitted into a long hole (17P) from the opposite direction, and both end portions are abutted in the long hole (17P).
Description
Technical Field
The present invention relates to a high-speed transmission connector mounted on a circuit board.
Background
Many high-speed transmission connectors mounted on circuit boards are configured by arranging a plurality of terminal rows including signal terminals and ground terminals in a housing. As a document disclosing a technique related to such a connector, there is patent document 1. The connector disclosed in patent document 1 has a structure in which a housing bottom wall has signal terminal receiving grooves as openings penetrating the housing bottom wall between the upper and lower sides thereof, ground terminals and signal terminals are alternately inserted in parallel into the signal terminal receiving grooves, lower end tails of the signal terminals are soldered to a mounting surface of a circuit board by solder balls, and terminals of a mating connector are held by elastic contact portions of the tail portions.
Patent document 1: japanese patent laid-open publication No. 2018-156936
Disclosure of Invention
However, the connector of patent document 1 has a problem that, since the terminal is a single plate, the opening of the housing has to be made to have a width dimension to allow the terminal to penetrate therethrough for the convenience of assembly, and sufficient rigidity cannot be secured.
The present invention has been made in view of the above problems, and an object thereof is to provide a high-speed transmission connector capable of reducing the width of an opening of a housing and ensuring the rigidity of the housing.
In order to solve the above problem, a high-speed transmission connector according to a preferred embodiment of the present invention includes: a housing having an elongated hole extending in one direction; and a plurality of terminals arranged in the elongated hole, each of the terminals having a contact portion to be brought into contact with a mating connector and a soldered terminal portion to which solder is applied to a mounting target substrate, the terminals being separated by a shield connector as a member having the contact portion and a shield plate as a member having the soldered terminal portion, an end portion of the shield connector opposite to one side of the contact portion and an end portion of the shield plate opposite to one side of the soldered terminal portion being press-fitted into the elongated hole from opposite directions, and both end portions of the terminals abutting in the elongated hole.
In this aspect, the solder-attached terminal portion may be a fork portion extending from the main body of the terminal into two strands, and the caulking solder may be interposed between the fork portion.
Further, a locking piece may be provided between inner wall surfaces facing each other in the elongated hole, and the shield connector and the shield plate may be positioned by the locking piece.
The shield connector may include a 1 st main body and a plurality of 1 st projecting portions projecting from a plurality of portions at one end of the 1 st main body, the shield plate may include a 2 nd main body and a 2 nd projecting portion projecting from a plurality of portions at one end of the 2 nd main body, the locking piece may be fitted between the plurality of 1 st projecting portions, and the plurality of 1 st projecting portions may be fitted between the plurality of 2 nd projecting portions. The contact portions may be bent and extended from a plurality of portions at one end of the main body portion of the terminal, and the bending directions of the inner contact portion and the outer contact portion in the arrangement direction of the contact portions among the plurality of contact portions may be opposite to each other.
The upper end of the outer contact portion and the upper end of the inner contact portion may be inclined in directions away from each other.
Further, a plurality of notches may be provided in the inner wall surfaces of the elongated holes facing each other, a 3 rd projecting portion may be formed in the side surface of the shield connector, a 4 th projecting portion may be formed in the side surface of the shield plate, and the 3 rd projecting portion and the 4 th projecting portion may be engaged with the notches, thereby preventing the shield connector and the shield plate from coming off.
In the present invention, the terminal of the long hole array of the housing having the long hole extending in one direction is divided by the shield connector as the member having the contact portion and the shield plate as the member having the soldered terminal portion, an end portion of the shield connector opposite to one side of the contact portion and an end portion of the shield plate opposite to one side of the soldered terminal portion are press-fitted into the long hole from opposite directions, and both end portions are abutted in the long hole. Therefore, by dividing the contact portion and the soldered terminal portion of the shielded connector, the opening of the elongated hole of the housing can be minimized, and the rigidity of the housing can be ensured. Further, by press-fitting the respective members to each other, performance equivalent to that of one structure can be ensured. Therefore, the width of the opening of the housing can be reduced, and the rigidity of the housing can be ensured.
Drawings
Fig. 1 (a) and (B) are perspective views of the main connector CNH as one embodiment of the present invention viewed from 2 directions, and (C) and (D) are perspective views of the plug connector CNP as one embodiment of the present invention viewed from two directions.
Fig. 2 is a view showing a cut parallel to the XZ plane between the contacts 3H-3 (S) and the contacts 3H-4 (S) when the main connector CNH and the plug connector CNP in fig. 1 are fitted.
Fig. 3 is a perspective view illustrating the main connector CNH of fig. 1 (B) in an exploded manner.
Fig. 4 (a) is a perspective view of a cutout section including the Y-direction center passing through the contacts 3H-15 (S) in the main connector CNH of fig. 1 (B), and (B) is a partial enlarged view thereof.
Fig. 5 is a perspective view of the housing 1H of fig. 3.
Fig. 6 (a) is a front view of the housing 1H of fig. 3 and a side view thereof as viewed from four directions, and (B) is a partial enlarged view of the front view.
Fig. 7 (a) is a rear view of the housing 1H in fig. 3, and (B) is an enlarged view of a part of the rear view.
Fig. 8 (a) is a perspective view of the central conductive resin 2HA in fig. 3, and (B) is a perspective view of the conductive resins 2HB on both sides thereof.
Fig. 9 is a perspective view of the contact 3H-j of fig. 3.
FIG. 10 is a view showing a process for machining the contact 3H-j shown in FIG. 3.
Fig. 11 is a perspective view of the shield plate 5H-m of fig. 3.
Fig. 12 is a perspective view illustrating the plug connector CNP of fig. 1 (D) in an exploded manner.
Fig. 13 is a perspective view of the housing 1P of fig. 12.
Fig. 14 (a) is a front view of the housing 1P of fig. 13 and a side view thereof as viewed from four directions, and (B) is a partial enlarged view of the front view.
Fig. 15 (a) is a rear view of the housing 1P in fig. 13, and (B) is a partially enlarged rear view.
Fig. 16 (a) is a perspective view of the conductive resin 2PA of fig. 1 (C), and (B) is a perspective view of the conductive resin 2PB on both sides thereof.
Fig. 17 is a perspective view of the contact 3P-j of fig. 12.
Fig. 18 is a perspective view of the shield contact 4P-m of fig. 12.
Fig. 19 is a perspective view of the shield plate 5P-m of fig. 12.
Fig. 20 is a perspective view including a cut-out section passing through the Y-direction center of the contact 3P-15 in fig. 1 (D).
Fig. 21 is a sectional view of a fitting portion of the shield plate 5P-4 and the shield contact 4P-4 in fig. 1 (D).
Fig. 22 is a diagram showing shield contacts 4PA-m and 4PB-m of plug connector CNP according to another embodiment of the present invention.
[ description of reference ]
1H shell; 1P shell; 2HA conductive resin; 2P conductive resin; a 3H contact; a 3P contact; a 4H shield plate; a 4P shield contact; 4PA shield contacts; a 4PB shield contact; a 5H shield plate; a 5P shield plate; a 10H slot; a 10P head; 11H bottom 11H;11P side walls; 12H a table portion 12H;12P bottom wall; a 13H reinforcing plate; 14H rib portion; 14P rib portion; 15H partition walls; a 16H plate support; a 16P slot; 17H long hole; a 17P long hole; an 18H open part; an 18P long hole; a 19H groove; 21HA 22HA 22HB sidewall; 21PA 21PB long plates; 22PA 22PB connecting piece; 23HA 23HB protrusions; 23PA 23PB partition sheet; 24HA 24HB flare; a 27P long hole; a 30H fork part; a 30P fork portion; 31H, a 1 st straight line part; 32H, a 2 nd straight line part; 33H, bend 1; a 33P bend; 34H, bend 2; a 35H inclined part; a 37H contact portion; a 37P contact portion; a 39aH lobe; a 39aP projection; a 39bH lobe; a 39bP projection; a 39cH lobe; 41P body portion; a 42aP projection; a 42bP projection; a 47aP contact portion; a 47bP contact; a 47cP contact; a 47dP contact; a 49aP projection; a 49bP projection; a 50aH fork; a 50aP fork; a 50bH fork; a 50bP fork; a 50cH fork; a 50cP fork; a 50dH fork; a 50dP fork; 51H body part; a 51P body portion; a 52aP projection; a 52bP projection; a 52cP lobe; a 52dP projection; a 56aP recess; a 57aH contact; a 57bH contact portion; 57c H contact; a 59aH projection; a 59aP projection; a 59bH projection; a 59bP projection; a 59cP projection; 90 an electronic substrate; 91 expanding the substrate; a 110H cut-out portion; 111H 112H recess; a 147aP contact portion; a 147bP contact portion; 177P locking pieces; 300 pieces.
Detailed Description
Hereinafter, a main connector CNH and a plug connector CNP, which are high-speed transmission connectors according to an embodiment of the present invention, will be described with reference to the drawings. The main connector CNH and the plug connector CNP are used by applying solder to pads of the electronic substrate 90 and the expansion substrate 91. When the main connector CNH and the plug connector CNP are fitted close to the thick arrow direction of fig. 1, the terminals of the main connector CNH and the terminals of the plug connector CNP are electrically connected, and high-speed transmission of up to 3.2Tbps between the electronic substrate 90 and the expansion substrate 91 can be performed, mounting the main connector CNH to the electronic substrate 90, and mounting the plug connector CNP on the expansion substrate 91.
In the following description, the fitting direction of the main connector CNH and the plug connector CNP is referred to as a Z direction, one direction orthogonal to the Z direction is referred to as an X direction, and a direction orthogonal to both the Z direction and the X direction is referred to as a Y direction. The side where the main connector CNH is present is referred to as an upper side when viewed from the Z-direction plug connector CNP, and the side where the plug connector CNP is present is referred to as a lower side when viewed from the main connector CNH.
As shown in fig. 3, the main connector CNH includes three slots 10H arranged in the X direction in the housing 1H, and the three slots 10H are each formed by attaching a conductive resin 2HA and 2HB, 2 columns of 28 contacts 3H-j (j =1 to 28), and four shield plates 5H-m (m =1 to 7). The contacts 3H-j (j =1 to 28) mounted in the slots 10H are all the same in shape. The shapes of the shield plates 5H-m (m =1 to 7) attached to the slots 10H are all the same.
As shown in fig. 5 and 6, the three slots 10H of the housing 1H penetrate three table portions 12H rising from the bottom portion 11H of the housing 1H in the vertical direction. As shown in fig. 6 (a), a plurality of reinforcing plates 13H are provided between the adjacent table portions 12H. Three recesses 111H are formed outside the terrace portion 12H on the + X side of the bottom portion 11H of the housing 1H. On the outer side of the terrace portion 12H on the-X side of the bottom portion 11H of the housing 1H, 2 depressions 112H are formed.
As shown in fig. 7 (a) and 7 (B), grooves 19H are provided around the three slots 10H on the upper surface of the housing 1H. The groove 19H has a horizontally long rectangular frame shape in the Y direction. The groove 19H is open outward as an open portion 18H on both sides in the Y direction.
The conductive resin 2HA shown in fig. 8 (a) is fitted into the peripheral groove 19H of the center socket 10H. The conductive resin 2HA HAs a rectangular frame shape having a size of being accommodated in the groove 19H. A plurality of protrusions 23HA are formed on the inner wall surface of the side wall 21HA opposed to the conductive resin 2HA in the X direction. The sidewalls 22HA opposed to each other in the Y direction of the conductive resin 2HA are formed with expansion portions 24HA protruding outward in the Y direction. In a state where the conductive resin 2HA is accommodated in the peripheral groove 19H of the center slot 10H, the expanded portion 24HA is fitted into the open portion 18H of the groove 19H. The upper surface of the conductive resin 2HA is flush with the upper surface of the case 1H.
The conductive resin 2HB shown in fig. 8 (B) is fitted into the peripheral groove 19H of the slot 10H on both sides in the X direction. The conductive resin 2HB has a rectangular frame shape having a size to be accommodated in the groove 19H. In the conductive resin 2HB, a plurality of protrusions 23HB are formed on the inner wall surface of the side walls 21HB facing in the X direction. In the conductive resin 2HB, on the side walls 22HB facing in the Y direction, expansion portions 24HB are formed to protrude outward in the Y direction. The expanded portion 24HB is fitted into the open portion 18H of the slot 19H in a state where the conductive resin 2HB is accommodated in the peripheral slot 19H of the slot 10H on both sides in the X direction at the center. The upper surface of conductive resin 2HB is flush with the upper surface of case 1H.
As shown in fig. 4 a, 6B, and 7B, 27 ribs 14H-k (k =1 to 27) are provided on inner wall surfaces of the table portion 12H of the housing 1H facing each other in the X direction with the slot 10H interposed therebetween. The ribs 14H-k slightly protrude inward from the inner wall surface. The ribs 14H-k (k =1 to 27) are arranged at the same interval in the Y direction. The interval between adjacent ribs 14H-k among the ribs 14H-k (k =1 to 27) is substantially the same as the width of the contact 3H-j in the Y direction.
On the upper side (+ Z side) of the insertion groove 10H in the table portion 12H of the housing 1H, there is a board support 16H extending in the Y direction. Partition walls 15H-k (k =1 to 27) are provided between the rib portions 14H-k (k =1 to 27) of the slot 10H and the board support 16H. As shown in fig. 4 (a), 6 (B), and 7 (B), the partition wall 15H-k rises from the inner end surface of the rib 14H-k toward the board support 16H. The plate support 16H is supported by the inner end of the partition wall 15H-k opposite to the rib 14H-k. The plate support 16H is provided with 7 elongated holes 17H-m (m =1 to 7) vertically penetrating the plate support 16H.
As shown in FIG. 9, the contact 3H-j has: a 1 st linear portion 31H extending in the Z direction; a 2 nd linear part 32H spaced apart from the 1 st linear part 31H toward the-X side and extending in parallel with the 1 st linear part 31H; a fork portion 30H extending from one end of the 1 st straight portion 31H while being bifurcated; a 1 st bent portion 33H bent from an end portion of the 1 st straight portion 31H opposite to the fork portion 30H side toward the 2 nd straight portion 32H side in the X direction and continuous with one end of the 2 nd straight portion 32H; a 2 nd bent portion 34H bent from the other end of the 2 nd straight portion 32H toward the opposite side of the 1 st straight portion 31H in the X direction; an inclined portion 35H extending slightly obliquely from the end of the 2 nd bent portion 34H on the side away from the 2 nd straight portion 32H; and a contact portion 37H extending from the tip of the inclined portion 35H in a bent manner in a hook shape.
On the side surface of the 1 st straight portion 31H, convex portions 39aH, 39bH, 39cH are formed to protrude outward in the Y direction. The contact portion 37H extends further obliquely from the base end connected to the inclined portion 35H to the side opposite to the 2 nd linear portion 32H, and then bends and extends in a shape of "く". The tip of the contact portion 37H faces the 1 st bent portion 33H. The Y-direction width of the contact portion 37H is narrowed at the base end of the contact portion 37H. The width of the contact portion 37H in the Y direction at the tip is substantially half the width of the contact portion 37H in the Y direction at the base end.
The fork 30H of the contact 3H-j is a terminal portion with solder to which solder is applied to a pad of the electronic substrate 90 to be mounted. A solder is sandwiched and caulked between fork portions 30H of contacts 3H-j. The fork 30H is fixed by soldering in the following order. First, as shown in fig. 10 (a), a cut piece 300 is prepared in which wire solder is cut to a length longer than the width of the fork 30H in the X direction. Next, as shown in fig. 10 (B), the cut piece 300 of wire solder is press-fitted between the fork portions 30H. Here, the solder may be cut and the fork 30H may be press-fitted into the plurality of contacts 3H-j collectively. In this case, the fork portions 30H of the plurality of contacts 3H-j continuously connected by press forming may be cut into an appropriate length after one long wire solder is passed. After the wire solder cut piece 300 is pressed into between the fork portions 30H, both ends of the wire solder cut piece 300 are sandwiched by a tool and pressed against the fork portions 30H.
As shown in fig. 10 (C), the solder fixed in this order spreads on the outer surface of the fork 30H, a part of the outer surface of the clamping surface of the fork 30H is covered with the solder, and the fork 30H and the solder are integrated.
Here, the contacts 3H-j (j =1 to 28) of each slot 10H include contacts 3H-j that function as ground terminals and contacts 3H-j that function as signal terminals. Hereinafter, the ground contact 3H-j is denoted by letter (G), and the signal contact 3H-j is denoted by letter (S), as appropriate, to distinguish them from each other.
As shown in fig. 4B, the elongated holes 17H-m (m =1 to 7) in each slot 10H have 2 rows of contacts 3H-j (j =1 to 28) on the + X side and the-X side, so that the 2 contacts for grounding and the 2 contacts for signal are alternately arranged in parallel, and are individually accommodated in the gaps between the adjacent partition walls 15H-k in the slot 10H. For example, on the + X side of the elongated hole 17H-1 shown in FIG. 6B and FIG. 7B, the contact 3H-1 (G) for grounding is housed in the gap between the inner wall of the terrace portion 12H on the + Y side and the partition wall 15H-1, and the contact 3H-2 (G) for grounding is housed in the gap between the partition wall 15H-1 and the partition wall 15H-2. The signal contact 3H-3 (S) is housed in the gap between the partition wall 15H-2 and the partition wall 15H-3, and the signal contact 3H-4 (S) is housed in the gap between the partition wall 15H-3 and the partition wall 15H-4. The same applies to the X side of the long hole 17H-1.
The solder fixed to the fork portion 30H of the contact 3H-j faces upward, and the contact portion 37H of the contact 3H-j faces downward. The solder of the contact 3H-j is supported by the upper end of the rib 14H-k, and the solder is exposed to the upper side of the upper surface of the housing 1H.
In the partition walls 15H-k (k =1 to 28) in the slot 10H, the height in the Z direction of the partition wall 15H-k between the grounding contacts 3H-j (G) and the signal contacts 3H-j (S) is lower than the height in the Z direction of the partition wall 15H-k between the grounding contacts 3H-j (G) and the partition wall 15H-k between the signal contacts 3H-j (S) which are the other partition walls 15H-k.
To explain in more detail, as shown in fig. 2, the lower end of a partition wall 15H-k (a partition wall 15H-1 that is deep in the Y direction in the cross section of fig. 2) between the grounding contacts 3H-j (G) is located at substantially the same position as the lower surface of the housing 1H, and the upper end is located at substantially the same position as the upper surface of the housing 1H. The same applies to the partition wall 15H-k between the signal contacts 3H-j (S).
On the other hand, the lower end of the partition wall 15H-k (the partition wall 15H-2 located in front in the Y direction in the cross section of fig. 2) between the ground contact 3H-j (G) and the signal contact 3H-j (S) is located substantially at the same position as the lower surface of the housing 1H, but the upper end thereof is located in the vicinity of the boundary between the 1 st linear portion 31H and the 2 nd bent portion 34H of the contact 3H-j below the upper surface of the housing 1H. The upper end of the partition wall 15H-k between the ground contact 3H-j (G) and the signal contact 3H-j (S) is formed in a slope shape gradually decreasing as it goes away from the center plate support 16H.
Further, a substantially rectangular portion of the front side surface of the contact portion 37H of the contact 3H-j of the partition wall 15H-k between the ground contact 3H-j (G) and the signal contact 3H-j (S) is notched as a notch 110H.
Therefore, the 1 st and 2 nd straight portions 31H and 32H of the ground contact 3H-j (G) and the 1 st and 2 nd straight portions 31H and 32H of the signal contact 3H-j (S) are separated by the partition wall 15H-k, but the 1 st and 2 nd bent portions 33H and 34H and the contact portion 37H of the ground contact 3H-j (G) and the 1 st and 2 nd bent portions 33H and 34H and 37H of the signal contact 3H-j (G) are not separated by the partition wall 15H-k. An air layer is formed between the 1 st bent portion 33H, the 2 nd bent portion 34H, and the contact portion 37H of the ground contact 3H-j (G) and the 1 st bent portion 33H, the 2 nd bent portion 34H, and the contact portion 37H of the signal contact 3H-j (S).
As shown in fig. 11, the shield plate 5H-m has: a body portion 51H; fork parts 50aH, 50bH, 50cH, 50dH, and 4 parts separated in the Y direction at the upper end of the main body part 51H extend in two strands; and contact portions 57aH, 57bH, and 57cH protruding from the portions sandwiching the 2 grooves at the lower end of the body portion 51H. On the side surface of the main body 51H, projections 59aH and 59bH are formed to project outward in the Y direction.
The fork portions 50aH, 50bH, 50cH, and 50dH of the contacts 3H to j are soldered terminal portions to which solder is applied to the pads of the electronic board 90 to be mounted. Caulking solder is sandwiched between the fork portions 50aH, 50bH, 50cH, and 50dH of the shield plate 5H-m. The solder pair prongs 50aH, 50bH, 50cH, and 50dH are fixed in the same order as the solder pair prongs 30H of the contacts 3H-j.
The shield plates 5H-m are press-fitted into the slots 17H-m of the plate support 16H in the slots 10H from above. The solder fixed to the fork portions 50aH, 50bH, 50cH, 50dH of the shield plates 5H-m is exposed to the upper side of the upper surface of the housing 1H.
As shown in fig. 12, the plug connector CNP includes three header portions 10P corresponding to the slots 10H of the main connector CNH in the housing 1P, and the three header portions 10P are each formed by mounting conductive resin 2PA and 2PB, and 2 rows of 28 contacts 3P-j (j =1 to 28), one row of 7 shield contacts 4P-m (m =1 to 7), and one row of 7 shield plates 5P-m (m =1 to 7). The contacts 3P-j (j =1 to 28) attached to the respective heads 10P are all the same in shape. The shield contacts 4P-m (m =1 to 7) attached to the respective header portions 10P have the same shape, and the shield plates 5P-m (m =1 to 7) have the same shape.
As shown in fig. 20, 27 ribs 14P-k (k =1 to 27) are provided on the outer wall surface of the head 10PX direction both sides. The rib portions 14P-k are thin rectangular in shape. The ribs 14P-k are arranged at the same interval in the Y direction. The interval between adjacent ribs 14P-k of the ribs 14P-k (k =1 to 27) is substantially the same as the width of the contact 3P-j in the Y direction.
A groove 16P is provided in the bottom wall 12P of the housing 1P at a position opposite to the head portion 10P. The upper end of the head 10P is located slightly lower than the upper edges of the side walls 11P on both sides of the housing 1P in the X direction. The lower end of the head portion 10P protrudes downward from the bottom surface of the groove 16P.
As shown in fig. 14 a and 14B, the head portion 10P is provided with 7 long holes 17P-m (m =1 to 7) penetrating the head portion 10P in the vertical direction. The lower portion of the elongated hole 17P-m has a smaller width in the X direction than the upper portion thereof. As shown in fig. 14 a, 14B and 20, 28 long holes 18P-j (j =1 to 28) are formed in bottom wall 12P at positions directly below the positions between adjacent ribs 14P-k on both sides in the X direction of the base end of head 10P. Long hole 18P-j (j =1 to 28) penetrates between the upper surface of bottom wall 12P and the bottom surface of groove 16P on the back surface thereof.
At the lower end of the center head 10P of the groove 16P, a conductive resin 2PA shown in fig. 16 (a) is embedded. The conductive resin 2PA is formed by opposing the 2 long plates 21PA with a slight gap therebetween, and connecting both ends of the 2 long plates 21PA in the Y direction via connecting pieces 22 PA. In the gap between the 2 long plates 21PA, 7 long holes 27P-m (m =1 to 7) partitioned by the partition piece 23PA are formed. In a state where conductive resin 2PA is fitted into the lower end of center header 10P, the lower surface of conductive resin 2PA is flush with the lower surface of 1P.
Conductive resin 2PB shown in fig. 16 (B) is fitted into the lower ends of head portions 10P on both sides in the X direction in groove 16P. The conductive resin 2PB is formed by opposing the 2 long plates 21PB with a slight gap therebetween, and connecting both ends of the 2 long plates 21PB in the Y direction via the connecting pieces 22 PB. In the gap between the 2 long plates 21PB, 7 long holes 27P-m (m =1 to 7) partitioned by the partition piece 23PB are formed. In a state where conductive resin 2PB is fitted into the lower end of central head portion 10P, the lower surface of conductive resin 2PB and the lower surface of 1P are flush with each other.
As shown in fig. 17, the contact 3P-j includes a contact portion 37P linearly extending in the Z direction, a bent portion 33P extending from a base end of the contact portion 37P to one side in the X direction in a bent manner, and a fork portion 30P extending from an end portion of the bent portion 33P opposite to the contact portion 37P in two. On the side surface of the contact portion 37P, convex portions 39aP and 39bP are formed to protrude outward in the Y direction. A hole 38 is formed in the middle of the bent portion 33P in the Y direction.
The fork 30P of the contact 3P-j is a terminal portion with solder to which solder is applied to a pad of the mounting-target expanded board 91. A solder is clamped and caulked between the fork portions 30P of the contacts 3P-j. The solder is fixed to the fork 30P in the same order as the fork 30P of the contact 3P-j.
As shown in fig. 2 and 20, the solder-fixed contacts 3P-j are accommodated one by one in the gaps between the adjacent ribs 14P-k of the head portion 10P from the lower side through the elongated holes 18P-j of the head portion 10P. The bent portion 33P of the contact 3P-j is supported by the edge portion of the elongated hole 18P-j of the bottom wall 12P of the housing 1P and is exposed to the lower side of the lower surface of the solder housing 1P of the contact 3P-j.
As shown in fig. 18, the shield contact 4P-m has: a body portion 41P; contact portions 47aP,47bP,47cP,47dP extending in a zigzag shape in the shape of "く" at 4 locations separated from the lower end of the main body portion 41P in the Y direction; and convex portions 42aP and 42bP protruding from 2 positions of the upper end of the main body portion 41P, the 2 positions being on the opposite side of the contact portion 47aP from the contact portion 47bP and on the opposite side of the contact portion 47cP from the contact portion 47 dP. On the side surface of the main body 41P, projections 49aP and 49bP projecting outward in the Y direction are formed.
Of the contact portions 47aP,47bP,47cP and 47dP, the bending directions of the outer 2 contact portions 47aP and 47dP and the inner 2 contact portions 47bP and 47cP in the Y direction, which are the arrangement direction of the contact portions, are opposite to each other. The upper ends of the outer 2 contact portions 47aP and 47dP and the upper ends of the inner 2 contact portions 47bP and 47cP are inclined in directions away from each other, and are opened when viewed from the Y direction
A word. The lower ends of the convex portions 42aP, 42bP are rounded.
As shown in fig. 19, the shield plate 5P-m has: a body portion 51P; projections 52aP, 52bP, 52cP, 52dP projecting from 4 locations separated in the Y direction at the lower end of the main body portion 51P; and fork portions 50aP, 50bP, 50cP, and 50dP extending in two strands from 4 locations separated in the Y direction at the lower end of the main body portion 51P. On the side surfaces of the main body 51P and the projections 52aP and 52dP, projections 59aP, 59bP, and 59cP projecting outward in the Y direction are formed. Recesses 56aP and 56bP are formed between the convex portion 52aP and the convex portion 52bP, and between the convex portion 52cP and the convex portion 52dP, respectively, at the upper end of the body portion 51P.
The fork portions 50aP, 50bP, 50cP, and 50dP of the shield plate 5P-m are soldered terminal portions with solder applied to the pads of the extended substrate 91 to be mounted. The fork portions 50aP, 50bP, 50cP, and 50dP of the shield plate 5P-m are caulked with solder interposed therebetween. The order of fixing the solder to the fork portions 50aP, 50bP, 50cP, and 50dP is the same as the order of fixing the solder to the fork portions 30P of the contacts 3P-j.
As shown in fig. 2 and 20, the shield contact 4P-m is press-fitted into the elongated hole 17P-m of the head portion 10P from above, and the solder-fixed shield plate 5P-m is press-fitted into the elongated hole 17P-m of the head portion 10P from below via the elongated hole 27P-m of the conductive resin 2PA (or 2 PB). The end of the shield contact 4P-m abuts the end of the shield plate 5P-m within the elongated hole 17P-m. To explain in more detail, as shown in fig. 21, rectangular locking pieces 177P-m are provided between inner wall surfaces of the elongated hole 17P-m of the head 10P facing in the X direction, and the shield contact 4P-m and the shield plate 5P-m are positioned by the locking pieces 177P-m.
The locking piece 177P-m is fitted into the recess between the convex portion 52bP and the convex portion 52cP of the shield plate 5P-m. The convex portion 42aP of the shield contact 4P-m is fitted into the concave portion between the convex portion 52aP and the convex portion 52bP of the shield plate 5P-m, and the convex portion 42bP of the shield contact 4P-m is fitted into the concave portion between the convex portion 52cP and the convex portion 52dP of the shield plate 5P-m. Further, a notch is provided in an inner wall surface of the head portion 10P facing the elongated hole 17P-m in the Y direction. The projections 49aP and 49bP of the shield contact 4P-m and the projections 59aP, 59bP, and 59cP of the shield plate 5P-m are engaged with the notches, thereby preventing the shield contact 4P-m and the shield plate 5P-m from coming off. The elongated holes 17H-m of the slot 10H of the main connector CNH also have cutouts that serve the same purpose.
In a state where the plug connector CNP is fitted to the main connector CNH as a mating connector, the contact portions 47aP,47bP,47cP,47dP of the shield contacts 4P-m of the plug connector CNP are brought into contact with the contact portions 57aH, 57bH, 57cH of the shield plate 5H-m of the main connector CNH, and the contact portions 37P of the contacts 3P-j of the plug connector CNP are brought into contact with the contact portions 37H of the contacts 3H-j of the main connector CNH.
The above is the structural details of the present embodiment, and according to the present embodiment, the following effects can be obtained. The plug connector CNP of the present embodiment includes: a housing 1P having an elongated hole 17P-m extending in one direction; and a plurality of terminals arranged in the elongated holes 17P-m and having contact portions 37P, 47aP,47bP,47cP,47dP for contacting a mating connector and soldered terminal portions for applying solder to a mounting target substrate, respectively. Thus, the terminals sandwiched between the shield plate 5H-m of the main connector CNH and the pads of the expansion board 91 among these terminals are separated by the shield contact 4P-m as a member having the contact portions 47aP,47bP,47cP,47dP and the shield plate 5P-m as a member having the terminal portion with solder, the end portion of the shield contact 4P-m opposite to the side of the contact portions 47aP,47bP,47cP,47dP and the end portion of the shield plate 5P-m opposite to the side of the terminal portion with solder are press-fitted into the elongated hole 17P-m from opposite directions, and both end portions abut inside the elongated hole 17P-m. Therefore, by dividing the contact portions 37P, 47aP,47bP,47cP,47dP of the shield contact 4P-m and the soldered terminal portion, the opening of the elongated hole 17P-m of the housing 1P can be minimized, and the rigidity of the housing 1P can be ensured. Further, by press-fitting the respective members into each other, performance equivalent to one structure can be ensured. Therefore, it is possible to provide a high-speed transmission connector in which the width of the opening of the housing 1P is reduced and the rigidity of the housing is ensured.
The main connector CNH of the present embodiment includes: a housing 1H having a plurality of slots 10H; the plurality of contacts 3H-j, which include contacts 3H-j (G) as ground terminals and contacts 3H-j (S) as signal terminals, are arranged in the slot 10H along a Y direction, which is a 1 st direction orthogonal to the fitting direction of the connector. Therefore, a partition wall 15H-k is provided between the adjacent contacts 3H-j in the slot 10H, and the height of the partition wall 15H-k in the fitting direction between the contact 3H-j (G) for grounding and the contact 3H-j (S) for signal is lower than the height of the partition wall 15H-k in the fitting direction other than that. Therefore, a space layer having a smaller dielectric constant than that of the partition wall 15H-k made of resin, that is, an air layer is formed between the signal contact 3H-j (S) and the ground contact 3H-j (G). Therefore, a high-speed transmission connector capable of reducing crosstalk between adjacent channels can be provided.
The main connector CNH of the present embodiment includes: a housing 1H; and a plurality of contacts 3H-j having contact portions 37H to be brought into contact with the mating connector and soldered terminal portions to be soldered on a substrate to be mounted, the contact portions 37H and the soldered terminal portions being arranged in the housing 1H so as to face opposite sides. Thus, the solder-attached terminal portion is the fork portion 30H, and the cut piece 300 of wire solder is caulked with the fork portion 30H. This can reduce the terminal heating step of the reflow layer required in the conventional solder ball type solder applying method, and can also reduce the influence of the heat treatment. Therefore, it is possible to provide a connector capable of reducing the overheating process of the terminal during reflow and reducing the adverse effect on the finished product due to the heat treatment.
Although the embodiment of the present invention has been described above, the following modifications may be made to the embodiment. (1) In the above embodiment, three slots 10H are present in the housing 1H of the main connector CNH, and three heads 10P are present in the housing 1P of the plug connector CNP. However, the number of the slots 10H and the header 10P may be 1, 2, or 4 or more.
(2) In the above embodiment, the contact portions 47aP,47bP,47cP, and 47dP of the shield contacts 4P-m of the plug connector CNP are bent and extended in a shape of 4 portions "く" separated in the Y direction from the lower end of the main body portion 41P. However, as in the shield contact 4PA-m of fig. 22 (a), the contact portions 47aP,47bP,47cP,47dP may be replaced by the contact portions 147aP, 147bP formed of a pair of plate bodies having cross sections of "く" words that are opposite to each other when viewed in the Y direction, so that the shield plate 5P-m of the main connector CNH is inserted between the contact portions 147aP and 147 bP. As in the shield contact 4PB-m of fig. 22 (B), it may be configured by a single plate member having a contact portion and a soldered terminal portion, without dividing the terminal pressed into the elongated hole 17P-m of the head portion 10P in the plug connector CNP into the shield contact 4P-m and the shield plate 5P-m.
(3) The number of the contacts 3H-j, 3P-j forming 1 row in the above embodiment may be less than 2, or may be more than 2. The number of the shield plates 4H-m, the shield contacts 4P-m, and the shield plates 5P-m constituting 1 row may be less than 7 or more than 7. The number of the ribs 14H-k, and partition walls 15H-k may be less than 27, or may be more than 27.
Claims (7)
1. A high-speed transmission connector is characterized by comprising:
a housing having an elongated hole extending in one direction;
a plurality of terminals arranged in the elongated hole and each having a contact portion to be brought into contact with a mating connector and a soldered terminal portion to be soldered on a mounting target substrate;
the terminals are separated by a shield connector as a component having the contact portion and a shield plate as a component having the soldered terminal portion,
an end portion of the shield connector opposite to the side of the contact portion and an end portion of the shield plate opposite to the side of the soldered terminal portion are press-fitted into the elongated hole from opposite directions, and both end portions are abutted in the elongated hole.
2. The connector for high-speed transmission according to claim 1,
the solder-attached terminal portion is a fork portion extending in two strands from a main body portion of the terminal, and caulking solder is sandwiched between the fork portions.
3. A connector for high-speed transmission according to claim 1 or 2,
clamping pieces are arranged between the opposite inner wall surfaces of the long holes,
the shield connector and the shield plate are positioned by the locking piece.
4. The connector for high-speed transmission according to claim 3,
the shielded connector has a 1 st body portion and a plurality of 1 st projections projecting from a plurality of portions in one end of the 1 st body portion,
the shielding plate has a 2 nd body portion and 2 nd convex portions discharged from a plurality of portions in one end of the 2 nd body portion,
the locking piece is inserted between the 1 st convex parts,
the plurality of 1 st projections are fitted between the plurality of 2 nd projections.
5. The connector for high-speed transmission according to claim 1,
the contact portion is bent and extended from a plurality of portions at one end of the main body portion of the terminal,
the contact portions on the inner side and the contact portions on the outer side in the arrangement direction of the contact portions are bent in opposite directions.
6. The connector for high-speed transmission according to claim 5,
the upper end of the outer contact portion and the upper end of the inner contact portion are inclined in directions away from each other.
7. The connector for high-speed transmission according to claim 1,
a plurality of notches are formed in the inner wall surfaces of the long holes facing each other,
on the side of the shield connector, a 3 rd convex part is formed,
on the side surface of the shielding plate, a 4 th convex part is formed,
the 3 rd protruding portion and the 4 th protruding portion are engaged with each other in the notch, thereby preventing the shield connector and the shield plate from coming off.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911264665.2A CN112952416B (en) | 2019-12-11 | 2019-12-11 | Connector for high-speed transmission |
| EP20212682.7A EP3836309B1 (en) | 2019-12-11 | 2020-12-09 | Connector for high-speed transmission |
| US17/116,245 US11626678B2 (en) | 2019-12-11 | 2020-12-09 | Connector for high-speed transmission and method for fixing solder to fork portion of connector for high-speed transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911264665.2A CN112952416B (en) | 2019-12-11 | 2019-12-11 | Connector for high-speed transmission |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112952416A CN112952416A (en) | 2021-06-11 |
| CN112952416B true CN112952416B (en) | 2023-01-31 |
Family
ID=73789883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911264665.2A Active CN112952416B (en) | 2019-12-11 | 2019-12-11 | Connector for high-speed transmission |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP3836309B1 (en) |
| CN (1) | CN112952416B (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227005A (en) * | 1996-07-31 | 1999-08-25 | 惠特克公司 | High frequency electrical connector |
| WO2003094304A1 (en) * | 2002-05-06 | 2003-11-13 | Molex Incorporated | High-speed differential signal connector with interstitial ground aspect |
| CN101459299A (en) * | 2007-12-11 | 2009-06-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102292874A (en) * | 2008-12-19 | 2011-12-21 | 莫列斯公司 | Board-to-board connector |
| CN202662874U (en) * | 2012-06-05 | 2013-01-09 | 深圳市长盈精密技术股份有限公司 | Board to board connector |
| CN203277695U (en) * | 2013-04-03 | 2013-11-06 | 正凌精密工业股份有限公司 | Connector module |
| CN105098516A (en) * | 2014-04-22 | 2015-11-25 | 泰科电子公司 | Interlayer type socket connector |
| CN206364299U (en) * | 2016-10-28 | 2017-07-28 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN107611717A (en) * | 2016-07-11 | 2018-01-19 | 广濑电机株式会社 | Band shielding board electrical connector |
| CN108631094A (en) * | 2017-03-16 | 2018-10-09 | 莫列斯有限公司 | Electric connector and electric connector combination |
| EP3448134A1 (en) * | 2017-08-25 | 2019-02-27 | Yamaichi Electronics Deutschland GmbH | Connector system, connector element and method for producing a connector element |
| CN209329213U (en) * | 2018-07-30 | 2019-08-30 | 番禺得意精密电子工业有限公司 | Electric connector and electric connector combination |
| CN209329318U (en) * | 2018-12-28 | 2019-08-30 | 富士康(昆山)电脑接插件有限公司 | Electric connector and its docking connector |
| CN211017467U (en) * | 2019-12-11 | 2020-07-14 | 山一电机株式会社 | Connector for high-speed transmission |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6648657B1 (en) * | 2002-06-10 | 2003-11-18 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having ground buses |
| TWM284091U (en) * | 2005-04-21 | 2005-12-21 | Molex Taiwan Ltd | Electrical connector |
| CN105098515B (en) * | 2014-04-22 | 2019-06-11 | 泰连公司 | Sandwich-type pin connector |
-
2019
- 2019-12-11 CN CN201911264665.2A patent/CN112952416B/en active Active
-
2020
- 2020-12-09 EP EP20212682.7A patent/EP3836309B1/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227005A (en) * | 1996-07-31 | 1999-08-25 | 惠特克公司 | High frequency electrical connector |
| WO2003094304A1 (en) * | 2002-05-06 | 2003-11-13 | Molex Incorporated | High-speed differential signal connector with interstitial ground aspect |
| CN101459299A (en) * | 2007-12-11 | 2009-06-17 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102292874A (en) * | 2008-12-19 | 2011-12-21 | 莫列斯公司 | Board-to-board connector |
| CN202662874U (en) * | 2012-06-05 | 2013-01-09 | 深圳市长盈精密技术股份有限公司 | Board to board connector |
| CN203277695U (en) * | 2013-04-03 | 2013-11-06 | 正凌精密工业股份有限公司 | Connector module |
| CN105098516A (en) * | 2014-04-22 | 2015-11-25 | 泰科电子公司 | Interlayer type socket connector |
| CN107611717A (en) * | 2016-07-11 | 2018-01-19 | 广濑电机株式会社 | Band shielding board electrical connector |
| CN206364299U (en) * | 2016-10-28 | 2017-07-28 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN108631094A (en) * | 2017-03-16 | 2018-10-09 | 莫列斯有限公司 | Electric connector and electric connector combination |
| EP3448134A1 (en) * | 2017-08-25 | 2019-02-27 | Yamaichi Electronics Deutschland GmbH | Connector system, connector element and method for producing a connector element |
| CN209329213U (en) * | 2018-07-30 | 2019-08-30 | 番禺得意精密电子工业有限公司 | Electric connector and electric connector combination |
| CN209329318U (en) * | 2018-12-28 | 2019-08-30 | 富士康(昆山)电脑接插件有限公司 | Electric connector and its docking connector |
| CN211017467U (en) * | 2019-12-11 | 2020-07-14 | 山一电机株式会社 | Connector for high-speed transmission |
Non-Patent Citations (1)
| Title |
|---|
| 高速传输信号连接器的设计与性能分析;汪静等;《遥测遥控》;20100715(第04期);第43-46页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3836309B1 (en) | 2023-07-26 |
| EP3836309A1 (en) | 2021-06-16 |
| CN112952416A (en) | 2021-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4708415A (en) | Electrical connectors | |
| JP2724657B2 (en) | Low profile electrical connector | |
| US20060040562A1 (en) | Connector with built-in substrate and its assembling method | |
| JP2005534142A (en) | Power connector | |
| US11626678B2 (en) | Connector for high-speed transmission and method for fixing solder to fork portion of connector for high-speed transmission | |
| JP4164520B2 (en) | Connector between printed wiring boards | |
| US8308513B2 (en) | Electrical connector | |
| JP3134262U (en) | Surface mount connector | |
| US7188408B2 (en) | Method of making a straddle mount connector | |
| US7112072B2 (en) | Ground bus for an electrical connector | |
| US20050048818A1 (en) | Grounded electrical connector | |
| JPH11502053A (en) | Electrical receptacle assembly and spring contact therefor | |
| JP2019091671A (en) | Movable connector | |
| CN211017467U (en) | Connector for high-speed transmission | |
| CN211017468U (en) | Connector for high-speed transmission | |
| CN210985006U (en) | Connector for high-speed transmission | |
| CN112952416B (en) | Connector for high-speed transmission | |
| CN112952417B (en) | Connector for high-speed transmission | |
| US6558173B1 (en) | Card edge connector with commoning contacts and individual contacts and method making the same | |
| US7004763B2 (en) | Board-to-board electrical connector assembly | |
| CN112952418B (en) | Connector for high-speed transmission and method for fixing fork part of connector for high-speed transmission by soldering tin | |
| KR101032933B1 (en) | Contact for press fit and press fit connector using the same | |
| JP4343029B2 (en) | Board mounting type electrical connector | |
| JP3297399B2 (en) | Electrical connector with terminals arranged in multiple stages | |
| JP2816435B2 (en) | Electrical connector with contact spacer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |