CN112951532B - High-gradient resistor disc and manufacturing method thereof - Google Patents
High-gradient resistor disc and manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses a high-gradient resistor disc and a manufacturing method thereof, wherein the method optimizes the components of the resistor disc and adjusts the whole preparation process according to the change of the components, in the preparation process, the grinding and uniform mixing of an additive are firstly carried out by a grinding machine, in the mixing process of the additive and zinc oxide, the uniform mixing of the zinc oxide and the additive is achieved by a method of planetary high-speed stirring and colloid ball milling high-speed dispersion, and the particles of the zinc oxide and the additive are further ground to be finer. In the forming process, a pressing curve formed by five times of air exhaust and one-time pressure maintaining is adopted, so that the cylindricity, the end face parallelism and the perpendicularity error of the end face and the axis of the resistor disc are kept below 0.02mm, and a solid foundation is laid for ensuring the operability of the lightning arrester assembling process. The resistance card is successfully researched and developed, so that the manufacturing cost of the resistance card is reduced, and the overall dimension of the lightning arrester is greatly reduced.
Description
[ technical field ] A
The invention belongs to the technical field of resistance cards, and particularly relates to a high-gradient resistance card and a manufacturing method thereof.
[ background of the invention ]
With the development of the power industry, the requirement on overvoltage protection of a power system is higher and higher, and the development of zinc oxide lightning arresters specially used for overvoltage protection equipment is limited by short plates developed by the technology, so that the development of the zinc oxide lightning arrester has no major breakthrough. At present, the manufacturing technology adopted in the domestic lightning arrester industry still takes the introduction of the Japanese technology as the mainstream, and the domestic process improvement is an auxiliary production mode. In particular, the manufacturing technology of the zinc oxide resistor disc which is the core component of the lightning arrester still adopts the technology introduced into Japan. Although the production cost of the zinc oxide resistor disc is reduced to some extent along with the improvement of the automation degree of equipment, the total manufacturing cost of the zinc oxide resistor disc is high along with the domestic increase of labor cost, and the development and the promotion of the lightning arrester technology are limited.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art and provide a high-gradient resistor disc and a manufacturing method thereof so as to solve the problems of high preparation cost and immature preparation process of the zinc oxide resistor disc in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a manufacturing method of a high-gradient resistor disc comprises the following steps:
step 1, grinding and uniformly mixing bismuth oxide, cobalt oxide, antimony oxide, nickel oxide, manganese oxide, chromium oxide and silicon dioxide by a grinder to obtain an additive; by mass percent, the mass fraction of bismuth oxide is 3-5%, the mass fraction of cobalt oxide is 1.5-3.5%, the mass fraction of antimony oxide is 4-6%, the mass fraction of nickel oxide is 0.1-0.5%, the mass fraction of manganese oxide is 0.8-2.0%, the mass fraction of chromium oxide is 0.6-1.5%, and the mass fraction of silicon dioxide is 1-3%;
step 2, adding the additive and zinc oxide into a mixer, mixing uniformly, and then ball-milling in a ball mill to obtain granulated materials; wherein the mass fraction of the zinc oxide is 82-89%, and the total mass of the zinc oxide and each substance in the step 1 is 100%;
step 3, pressing and molding the granulated material, performing air exhaust for a plurality of times in the molding process, and performing pressure maintaining molding once to obtain a process resistor disc;
step 4, sintering the process resistance card to obtain a sintered resistance card;
and 5, spraying an aluminum electrode on the surface of the sintered resistance card to obtain the high-gradient resistance card.
The invention is further improved in that:
preferably, in step 1, the sanding medium is zirconia beads with a diameter of 0.4 to 0.5mm, and the particles of the D50 after grinding are less than 0.4 μm.
Preferably, in step 2, the solid content in the mixer is 58-63%.
Preferably, in the step 3, each time of air exhaust is 4 to 6s, the dwell time is 8 to 20s, and the air exhaust times are 5 to 7.
Preferably, in step 4, the sintering includes pre-sintering, firing and heat treatment.
Preferably, the pre-sintering temperature is 700-950 ℃, and the pre-sintering time is 3-10 hours.
Preferably, the sintering temperature is 1100-1200 ℃, and the sintering heat preservation time is not less than 10h.
Preferably, the temperature of the heat treatment is 600-700 ℃, and the heat preservation is carried out for 2-3 hours at the target temperature.
Preferably, in the heat treatment process, the speed of raising the temperature from room temperature to the target heat treatment temperature is 150 ℃/h, and the cooling speed after the heat preservation target time is 80 ℃/h;
before heat treatment, the side surface of the fired resistance card is coated with a layer of lead-free glass glaze.
Preferably, the thickness of the aluminum electrode on the surface of the resistor is 0.07 mm-0.1 mm, and the gradient of the resistor is 300-330V/mm.
Compared with the prior art, the invention has the following beneficial effects:
the invention discloses a method for manufacturing a high-gradient resistor disc, which optimizes the components of the resistor disc and adjusts the whole preparation process according to the change of the components, wherein in the preparation process, an additive is uniformly ground and mixed by a grinding machine, and in the mixing process of the additive and zinc oxide, the uniform mixing and the fine grinding of particles of the zinc oxide and the additive are achieved by a method of planetary high-speed stirring and external stirring ball milling. And a pressing curve formed by five times of exhaust and one-time pressure maintaining is adopted in the forming process, so that the cylindricity, the end face parallelism and the perpendicularity error of the end face and the axis of the resistor disc which are sintered are kept below 0.02mm, and a solid foundation is laid for ensuring the operability of the lightning arrester assembly process. The successful research and development of the resistor disc not only reduces the manufacturing cost of the resistor disc, but also greatly reduces the overall dimension of the lightning arrester.
Further, the compounding in-process adds the zirconia pearl, grinds, drives the zirconium pearl high-speed motion in the grinding jar under the high-speed rotation of motor, makes the additive thick liquids in the grinding jar under the zirconium ball striking of high-speed motion, and the additive granule is ground, can make the granule of additive more tiny.
Furthermore, the zinc oxide slurry is uniformly mixed by a mixer and a ball mill, so that the zinc oxide and additive particles are further ground to be finer in the uniform dispersion and emulsification process, the fluidity of the granulated material is greatly enhanced, and easier operation conditions are provided for the operation of the subsequent forming process.
Furthermore, the sintering process is divided into three parts, including three sintering stages of pre-sintering, sintering and heat treatment, the high-resistance layer and the resistance chip body can form a ceramic whole body only by keeping the shrinkage rates of the high-resistance layer and the resistance chip body consistent while the resistance chip is subjected to glue removal through the pre-sintering, the high-resistance layer is not layered or falls off, and the capability of the side surface of the resistance chip for bearing heavy current impact is improved; through the sintering process, the resistor disc can generate a target crystal phase under the design composition of the invention, so that the resistor disc has the characteristics of high tolerance of 2ms square wave and excellent residual voltage protection level. And then the ageing resistance of the resistance card can be further improved through heat treatment. According to the process, the sintering process of the common resistance chip is divided into three parts, the three sintering processes are carried out layer by layer, the deformation rate is controlled firstly, then the crystalline phase is controlled, the integral endurance capacity is improved finally, the three stages complement each other, and the performance of the resistance chip is improved integrally.
[ description of the drawings ]
FIG. 1 is a flow chart of the present invention;
[ detailed description ] embodiments
The invention is described in further detail below with reference to the accompanying drawings:
in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, both fixed and removable connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention discloses a high-gradient resistance card and a manufacturing method thereof, and the high-gradient resistance card comprises the following components:
| name (R) | Weight percent of |
| Zinc oxide | 82～89 |
| Bismuth oxide | 3～5 |
| Cobalt oxide | 1.5～3.5 |
| Antimony oxide | 4～6 |
| Nickel oxide | 0.1～0.5 |
| Manganese oxide | 0.8～2.0 |
| Chromium oxide | 0.6～1.5 |
| Silicon dioxide | 1～3 |
The protection performance of the zinc oxide resistance card is mainly that the zinc oxide and other various chemical raw materials (hereinafter, collectively called additives) are mixed to form granulated materials, the granulated materials are put into a kiln for sintering after being formed into a blank, and the maximum sintering temperature can be between 1100 ℃ and 1250 ℃. The zinc oxide green body can generate a series of physical and chemical changes in the high-temperature sintering process, and the specific changes are as follows: melting of additives (bismuth oxide and antimony oxide) with low melting points, replacement and co-melting of the additives; melting of fine zinc oxide grains and growth and development of coarse zinc oxide grains; various solid solutions, spinel phases, liquid phases, formation of grain boundary layers, and the like. The end result of this physicochemical change is the formation of zinc oxide grains with semiconducting properties, surrounded by a grain boundary layer formed by various additives during sintering. Due to the pressure-sensitive characteristic of the grain boundary layer, the zinc oxide grains have the nonlinear pressure-sensitive protection characteristic.
The invention adopts an eight-element formula, and because various oxides play different roles in a zinc oxide grain boundary layer in the resistor disc sintering process, the adding amount of the oxides is adjusted, and the main adjustment is to increase the amounts of antimony oxide and silicon dioxide.
The spinel has the main functions that the antimony trioxide is positioned at the intersection of zinc oxide crystal grains, the growth of the zinc oxide crystal grains is inhibited in the sintering process, the uniform growth of the zinc oxide crystal grains is facilitated, the breakdown voltage can be obviously improved, and the purpose of improving the potential gradient is achieved.
The use amount of the silicon dioxide is increased, the silicon dioxide, bismuth oxide and zinc oxide form a glass phase with higher viscosity in the resistor disc sintering process, the silicon dioxide exists at the intersection of a grain boundary layer and zinc oxide grains in the form of zinc silicate in the cooling process, and the viscosity of the glass phase is increased, so that the zinc oxide grain growth inhibiting effect is achieved, the silicon dioxide and antimony oxide have similar effects, the size of the zinc oxide grains is determined to be uniformly distributed with the grain boundary layer, the barrier of the grain boundary layer is improved, and the potential gradient is improved.
The manufacturing process of the resistor disc specifically comprises the following steps:
step 1, mixing materials by a grinding machine to form an additive, mixing all materials except zinc oxide, placing all the materials in a sand grinding machine, wherein the sand grinding medium is zirconia beads with the diameter of 0.4-0.5 mm, after sand grinding, the D50 particles are smaller than 0.4 mu m, and mixing the materials to obtain a uniform mixture which is the additive.
The additive is the main component of a grain boundary layer among zinc oxide grains, the grain size of the additive determines the thickness of the grain boundary layer, and the height of an electric potential barrier of the grain boundary layer is determined on the electrical parameters of the resistance sheet, namely the height of a breakdown voltage and the height of a potential gradient of the resistance sheet. Therefore, the ball milling of the additive particles to the minimum particle size determines the breakdown voltage of the resistor disc, and at present, the ball milling method commonly used in the industry is a method of adding slurry into a stirred ball mill for circulation, wherein zirconia balls with the diameter of 5mm are used as a ball milling medium in the ball mill. Through the ball milling process, the particle diameter of the additive can be ground until the D50 is about 1 micron. In order to make the particles of the additive finer, a sand mill process is adopted when the high potential gradient resistance card is manufactured, and the outstanding characteristics are as follows: the grinding medium adopts zirconia beads with the diameter of 0.4-0.5 mm as the grinding medium, the zirconium beads in the grinding tank are driven to move at high speed under the high-speed rotation of the motor, so that additive slurry in the grinding tank is impacted by the zirconium beads moving at high speed, additive particles are ground, after the sand grinding process is adopted, the particle diameter of the additive can be ground to D50 below 0.4 micron, and is reduced by about one time compared with the 1 micron particle diameter of a common process, so that a more uniform grain boundary layer is formed in the sintering process of the zinc oxide resistance chip and is wrapped on zinc oxide crystal grains, and the current impact bearing capacity of the resistance chip is greatly improved.
Step 2, granulation Process
Adding the additive and zinc oxide into a high-speed stirring tank, stirring for more than 4 hours at the speed of 800 revolutions per minute by a planetary high-speed stirrer, uniformly mixing, wherein the solid content is 58-63%, and after granulation, the average particle size of particles is 70 micrometers, and the bulk density is 1.55 g/cm.
The granulation process is the most critical process in the zinc oxide resistor chip manufacturing process and determines whether the whole process flow is smoothly executed as the final result, so the granulation process is controlled as a process control point regardless of any formula system. In the conventional granulation process, the uniform mixing of the zinc oxide and the additive is achieved by adopting a method of planetary high-speed stirring and high-speed dispersion of a colloid mill in the slurry emulsification stage. The invention adds a set of ball milling circulation process operation method on the basis of the process method, so that the zinc oxide slurry further grinds the particles of the zinc oxide and the additive to be finer in the process of uniform dispersion and emulsification. In the control of the solid content of the slurry, the solid content of the granulating slurry of the high-gradient resistance card formula is controlled to be about 60 percent, and is slightly lower than the conventional 64 percent. Through the improvement of the process, the average grain diameter of the granulating material is reduced from 100 microns to about 70 microns, the bulk density is increased from 1.3 g/cm to 1.55 g/cm, the flowability of the granulating material is greatly enhanced, and easier operating conditions are provided for the operation of the subsequent forming process.
Step 3, forming process
And (3) distributing the granules manufactured in the step (2) into a forming machine for press forming, wherein a press curve of five times of air exhaust and one time of pressure maintaining forming is adopted in the forming process, the air exhaust time is 4-6 seconds, the pressure maintaining time is 8-20 seconds, and the cylindricity, the end face parallelism and the perpendicularity errors of the end face and the axis of the resistor disc after forming are all less than 0.02mm. And determining the pressure maintaining time according to the diameter of the product, wherein the larger the diameter of the product is, the longer the pressure maintaining time is.
The forming process is a key process for converting raw materials into the resistor disc with a regular geometric shape, and whether the density of the formed resistor disc is uniform and the exhaust is thorough has great influence on whether homogeneous zinc oxide ceramics can be sintered later. The invention adopts a fully digital controlled forming machine to carry out compression forming, adopts a compression curve of five times of air exhaust and one time of pressure maintaining forming in the forming process, the air exhaust time is between 4 and 6 seconds, the pressure maintaining time is between 8 and 20 seconds, and in order to ensure the standard of the geometric shape of the resistance card in the sintering process, the density of a conventional blank is reduced from 3.2 g/cubic centimeter to 2.8 g/cubic centimeter. Through the improvement of the forming process, the cylindricity, the end face parallelism and the perpendicularity error of the end face and the resistor disc axis of the fired resistor disc are kept below 0.02mm, and a solid foundation is laid for ensuring the operability of the lightning arrester assembling process.
Step 4, sintering process
The sintering process is an important process for forming the zinc oxide semiconductor, and the process of sintering the zinc oxide blank in a kiln is the vitrification process of the zinc oxide resistance card. The whole sintering process of the high-gradient resistance card adopts three sintering stages of pre-sintering, sintering and heat treatment.
Step 4.1 Pre-burning
The pre-sintering is to keep the resistance card at the highest temperature of 700-950 ℃ for 3-10 hours, and the temperature rising speed in the temperature rising stage is kept between 10-30 ℃. The pre-sintering process not only carries out glue removal on the resistor disc, but also ensures that the shrinkage rate of the resistor disc is between 12% and 15% in the pre-sintering stage so as to ensure that when a high-resistance layer is coated in the next process, the shrinkage rates of the high-resistance layer and the resistor disc body are kept consistent, so that the high-resistance layer on the side face and the resistor disc body form a ceramic whole, the high-resistance layer is not layered or does not fall off, and the capability of bearing heavy current impact on the side face of the resistor disc is improved.
Step 4.2 firing
The stage is a resistor disc ceramic stage, and the resistor disc sintered by the process has a nonlinear protection characteristic. The sintering process curve adopted by the invention is characterized by a sintering process curve with slow heating rate and long heat preservation time, the specific process heating rate is 30 ℃/h, the target temperature is 1100-1200 ℃, and the heat preservation time is not less than 10h. The resistance card produced by the sintering process curve has the characteristics of high tolerance of 2ms square wave and excellent residual voltage protection level. Through the sintering process, the component design is combined, and the temperature and time are controlled in the sintering process, so that the obtained crystal phase of the resistor disc is the target crystal phase.
Step 4.3 Heat treatment Process
And (3) a heat treatment stage: the heat treatment is to further optimize the performance of the resistance card, particularly improve the aging characteristic of the resistance card, a heat treatment curve with the target temperature of 600-700 ℃, the heating rate of 150 ℃/h and the cooling rate of 80 ℃/h is adopted, the heating rate in the whole heating process is high, the crystalline phase can be quickly adjusted, after the temperature is raised to the target temperature, the temperature is preserved for 2-3 h, and then the temperature is quickly reduced. Before heat treatment, a layer of high-temperature lead-free glass glaze is coated on the side surface of the resistor disc, and the side surface glass glaze is sintered on the side surface of the resistor disc together during the heat treatment, so that the large-current impact resistance of the resistor disc is further improved, and a convenient and simple process is provided for manufacturing the liquid-immersed lightning arrester.
Step 5, resistance spraying process
And spraying an aluminum electrode on the end face of the sintered resistance card by an automatic spraying machine, wherein the thickness of the sprayed aluminum electrode is 0.07-0.1 mm.
After the resistor disc is sintered, spraying an aluminum electrode on the end face of the resistor disc by using an automatic spraying machine, wherein the thickness of the aluminum electrode is 0.07-0.1 mm, after the electrode spraying is finished, the density of the resistor disc is 2.8 g/cubic centimeter, the gradient of the resistor disc is 300-330V/mm, and the whole manufacturing process of the resistor disc is finished. According to the requirements of national standards, the resistance card can be used for manufacturing lightning arresters with various voltage levels and various purposes after being subjected to parameter detection of a plurality of items. The invention will be further illustrated with reference to the following specific examples:
example 1: the following description takes a resistor sheet with a diameter of 64mm and a height of 22mm as an example
Step 1: and (3) granulation: 300 kg of zinc oxide and 60 kg of additive are added into each batch, and the mixture is stirred and ball-milled for 5 hours in a planetary way, and then is subjected to spray granulation to obtain granules, wherein the physical parameters of the granules are as follows: firstly, the average particle size is 70 microns; and the bulk density is as follows: 1.55 g/cc, and water content of the ground material is 1.8%; (4) the solids content was 60%.
In the additive, 4% of bismuth oxide, 3.5% of cobalt oxide, 4% of antimony oxide, 0.5% of nickel oxide, 1% of manganese oxide, 1% of chromium oxide and 3% of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number is the additive and the zinc oxide.
Step 2: molding: the diameter of the blank: 80mm, weight 390 g, compression curve 7 times exhaust, exhaust time 6 seconds, dwell time 15 seconds.
Step three: pre-burning: presintering temperature is 900 ℃, and heat preservation time is 7 hours;
step four: and (3) firing: the maximum temperature is 1100 ℃; the heat preservation time is 10 hours;
step five: and (3) heat treatment: the maximum temperature is 650 ℃, and the holding time is 2 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
The detailed electrical parameters of the product are as follows:
example 2
Step 1: and (3) granulation: 300 kg of zinc oxide and 59 kg of additive are added into each batch, and the mixture is stirred and ball-milled by a planet for 5 hours, then is subjected to spray granulation to obtain granules, wherein the physical parameters of the granules are as follows: making a mean grain diameter of 70 microns; and the bulk density is as follows: 1.55 g/cubic centimeter, and 1.8% of water content; (4) the solids content was 59%.
In the additive, 4% of bismuth oxide, 3.3% of cobalt oxide, 5% of antimony oxide, 0.1% of nickel oxide, 2% of manganese oxide, 1.5% of chromium oxide and 1% of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number is the additive and the zinc oxide.
Step 2: molding: diameter of the blank: 80mm, weight 390 g, pressing curve 7 times exhaust, exhaust time 6 seconds, dwell time 10 seconds.
Step three: pre-burning: presintering at 950 deg.c for 3 hr;
step four: and (3) firing: the maximum temperature is 1200 ℃; the heat preservation time is 10 hours;
step five: and (3) heat treatment: the maximum temperature is 700 ℃, and the holding time is 2 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
Example 3
Step 1: and (3) granulation: adding 58 kg of additive into 300 kg of zinc oxide in each batch, stirring and ball milling in a planet way for 5 hours, then carrying out spray granulation, and obtaining physical parameters of granules: making a mean grain diameter of 70 microns; and the bulk density is as follows: 1.55 g/cubic centimeter, and 1.8% of water content; (4) the solids content was 58%.
In the additive, 5 percent of bismuth oxide, 3.5 percent of cobalt oxide, 6 percent of antimony oxide, 0.1 percent of nickel oxide, 1 percent of manganese oxide, 0.6 percent of chromium oxide and 2 percent of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number of the substances is the additive and the zinc oxide.
Step 2: molding: the diameter of the blank: 80mm, weight 390 g, compression curve 5 times exhaust, exhaust time 6 seconds, dwell time 20 seconds.
Step three: pre-burning: presintering temperature is 700 ℃, and heat preservation time is 10 hours;
step four: and (3) firing: the maximum temperature is 1115 ℃; the heat preservation time is 12 hours;
step five: and (3) heat treatment: the maximum temperature is 600 ℃, and the holding time is 3 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
Example 4
Step 1: and (3) granulation: 300 kg of zinc oxide and 59 kg of additive are added into each batch, and the mixture is stirred and ball-milled by a planet for 5 hours, then is subjected to spray granulation to obtain granules, wherein the physical parameters of the granules are as follows: firstly, the average particle size is 70 microns; secondly, packing density: 1.55 g/cc, and water content of the ground material is 1.8%; (4) the solids content was 63%.
In the additive, 3% of bismuth oxide, 1.5% of cobalt oxide, 5% of antimony oxide, 0.2% of nickel oxide, 1.2% of manganese oxide, 1.2% of chromium oxide and 3% of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number of the substances is the additive and the zinc oxide.
Step 2: molding: the diameter of the blank: 80mm, weight 390 g, pressing curve 5 times exhaust, exhaust time 4 seconds, dwell time 12 seconds.
Step three: pre-burning: presintering temperature is 800 ℃, and heat preservation time is 6 hours;
step four: and (3) firing: the maximum temperature is 1200 ℃; the heat preservation time is 10 hours;
step five: and (3) heat treatment: the maximum temperature is 650 ℃, and the holding time is 2.5 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
Example 5
Step 1: and (3) granulation: adding 59 kg of additive into 300 kg of zinc oxide in each batch, stirring and ball milling in a planet way for 5 hours, then performing spray granulation, and obtaining physical parameters of granules: firstly, the average particle size is 70 microns; and the bulk density is as follows: 1.55 g/cubic centimeter, and 1.8% of water content; (4) the solids content was 62%.
In the additive, 4% of bismuth oxide, 1.5% of cobalt oxide, 4% of antimony oxide, 0.1% of nickel oxide, 0.8% of manganese oxide, 0.6% of chromium oxide and 1% of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number of the substances is the additive and the zinc oxide.
Step 2: molding: diameter of the blank: 80mm, weight 390 g, press curve 6 outgas, degassing time 5 seconds, dwell time 18 seconds.
Step three: pre-burning: the presintering temperature is 750 ℃, and the heat preservation time is 7 hours;
step four: and (3) firing: the maximum temperature is 1100 ℃; the heat preservation time is 11 hours;
step five: and (3) heat treatment: the maximum temperature is 620 ℃, and the holding time is 2 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
Example 6
Step 1: and (3) granulation: 300 kg of zinc oxide and 59 kg of additive are added into each batch, and the mixture is stirred and ball-milled by a planet for 5 hours, then is subjected to spray granulation to obtain granules, wherein the physical parameters of the granules are as follows: firstly, the average particle size is 70 microns; and the bulk density is as follows: 1.55 g/cubic centimeter, and 1.8% of water content; (4) the solids content was 61%.
In the additive, 3 percent of bismuth oxide, 1.5 percent of cobalt oxide, 4 percent of antimony oxide, 0.1 percent of nickel oxide, 0.8 percent of manganese oxide, 0.6 percent of chromium oxide and 1 percent of silicon dioxide; the mass fraction is the mass percentage of each substance in the total resistance card components, namely the base number is the additive and the zinc oxide.
Step 2: molding: diameter of the blank: 80mm, weight 390 g, compression curve 6 times exhaust, 5 seconds exhaust time, 8 seconds dwell time.
Step three: pre-burning: presintering temperature is 850 ℃, and heat preservation time is 8 hours;
step four: and (3) firing: the maximum temperature is 1200 ℃; the heat preservation time is 11 hours;
step five: and (3) heat treatment: the maximum temperature is 680 ℃, and the holding time is 3 hours.
Step six: grinding, spraying aluminum, detecting electrical parameters and warehousing finished products.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. A manufacturing method of a high-gradient resistor disc is characterized by comprising the following steps:
step 1, grinding and uniformly mixing bismuth oxide, cobalt oxide, antimony oxide, nickel oxide, manganese oxide, chromium oxide and silicon dioxide by a grinder to obtain an additive; by mass percent, the mass fraction of bismuth oxide is 3-5%, the mass fraction of cobalt oxide is 1.5-3.5%, the mass fraction of antimony oxide is 4-6%, the mass fraction of nickel oxide is 0.1-0.5%, the mass fraction of manganese oxide is 0.8-2.0%, the mass fraction of chromium oxide is 1-1.5%, and the mass fraction of silicon dioxide is 2-3%;
step 2, adding the additive and zinc oxide into a mixer, mixing uniformly, and then ball-milling in a ball mill to obtain granulated materials; the additive particles of the milled D50 were less than 0.4 μm; wherein the mass fraction of the zinc oxide is 82-89%, and the total mass of the zinc oxide and each substance in the step 1 is 100%;
step 3, pressing and molding the granulated material, performing air exhaust for a plurality of times in the molding process, and performing pressure maintaining molding once to obtain a process resistor disc;
step 4, sintering the process resistance card to obtain a sintered resistance card;
in step 4, sintering comprises pre-sintering, sintering and heat treatment;
the pre-sintering temperature is 700-950 ℃, and the pre-sintering time is 3-10 hours;
the sintering temperature is 1100-1200 ℃, and the sintering heat preservation time is not less than 10h;
the temperature of the heat treatment is 600-700 ℃, and the heat is preserved for 2-3 hours at the target temperature;
in the heat treatment process, the speed of raising the temperature from room temperature to the target heat treatment temperature is 150 ℃/h, and the cooling speed after the heat preservation target time is 80 ℃/h;
before heat treatment, coating a layer of lead-free glass glaze on the side surface of the fired resistor disc;
and 5, spraying an aluminum electrode on the surface of the sintered resistance card to obtain the high-gradient resistance card.
2. A method for manufacturing a high gradient resistor disc as described in claim 1, wherein in step 1, the grinding medium is zirconia beads with a diameter of 0.4-0.5 mm.
3. The method for manufacturing the high-gradient resistor disc as claimed in claim 1, wherein in the step 2, the solid content in the mixing machine is 58-63%.
4. The method for manufacturing a high gradient resistor disc as claimed in claim 1, wherein in step 3, each exhaust time is 4-6s, the dwell time is 8-20s, and the number of exhaust times is 5-7.
5. A high-gradient resistor sheet manufactured by the manufacturing method of any one of claims 1 to 4, wherein the thickness of the aluminum electrode on the surface of the resistor sheet is 0.07mm to 0.1mm, and the gradient of the resistor sheet is 300V/mm to 330V/mm.
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| CN101436456A (en) * | 2008-12-11 | 2009-05-20 | 中国西电电气股份有限公司 | Method for preparing zinc oxide resistance card |
| CN106803449A (en) * | 2016-01-16 | 2017-06-06 | 国家电网公司 | A kind of Large Copacity small size high gradient ac oxide zinc resistor disc and its preparation technology |
| CN109192420A (en) * | 2018-08-22 | 2019-01-11 | 国家电网公司 | A kind of preparation method of high-performance zinc oxide resistor disc |
| CN110060829A (en) * | 2019-05-14 | 2019-07-26 | 固力发电气有限公司 | A kind of oxide resistor machining process |
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2021
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436456A (en) * | 2008-12-11 | 2009-05-20 | 中国西电电气股份有限公司 | Method for preparing zinc oxide resistance card |
| CN106803449A (en) * | 2016-01-16 | 2017-06-06 | 国家电网公司 | A kind of Large Copacity small size high gradient ac oxide zinc resistor disc and its preparation technology |
| CN109192420A (en) * | 2018-08-22 | 2019-01-11 | 国家电网公司 | A kind of preparation method of high-performance zinc oxide resistor disc |
| CN110060829A (en) * | 2019-05-14 | 2019-07-26 | 固力发电气有限公司 | A kind of oxide resistor machining process |
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