CN112941481A - Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film - Google Patents
Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film Download PDFInfo
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- CN112941481A CN112941481A CN202110171884.7A CN202110171884A CN112941481A CN 112941481 A CN112941481 A CN 112941481A CN 202110171884 A CN202110171884 A CN 202110171884A CN 112941481 A CN112941481 A CN 112941481A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The invention belongs to the technical field of lithium battery packaging materials, and particularly discloses a method for sputtering an aluminum layer on a copper substrate and an aluminum atom transfer copper-plastic film. The method for sputtering the aluminum layer on the copper substrate is characterized in that an alloy aluminum target doped with bridging metal is used as a first target material, and the surface of the first target material is bombarded by inert gas ions, so that atoms on the surface of the first target material overflow and are deposited on the surface of the copper substrate to form a pre-shot layer; and then, using a pure aluminum target as a second target material, bombarding the surface of the second target material through inert gas ions, and enabling atoms on the surface of the second target material to overflow and cover the surface of the pre-shooting layer to form a main body layer. The invention can overcome the problem of high bonding difficulty between the copper substrate and the aluminum layer, and the prepared aluminum atom transfer copper plastic film is not easy to delaminate, thereby ensuring the safety of the soft package battery.
Description
Technical Field
The invention belongs to the technical field of lithium battery packaging materials, and particularly relates to a method for sputtering an aluminum layer on a copper substrate and an aluminum atom transfer copper-plastic film.
Background
A lithium ion battery is a secondary battery (rechargeable battery) that mainly operates by movement of lithium ions between a positive electrode and a negative electrode. The lithium ion battery consists of a positive electrode, a negative electrode, a diaphragm, electrolyte, a current collector and an outer packaging shell. The chemical properties of the active ingredients of the lithium ion battery are very active, and the lithium ion battery is very easy to catch fire or even explode when placed in the air, so that the packaging shell of the lithium ion battery has certain corrosion resistance and very good barrier property.
The common packing of present lithium ion battery has steel casing, aluminum hull and plastic-aluminum membrane, and wherein the plastic-aluminum membrane is from inside to outside including heat-seal layer, aluminium lamination and protective layer, and heat-seal layer and protective layer are the plastics material, adopt the plastic-aluminum membrane to pack the battery, and light in weight can promote the specific energy of battery by a wide margin, but metal aluminium is more expensive, therefore the cost of manufacture of plastic-aluminum membrane is higher. In order to solve the problems, some merchants provide a copper plastic film, namely a copper foil layer replaces an aluminum layer to reduce the cost, but a passivation layer is not easily formed on the surface of the copper foil layer, so that the copper foil layer and a protective layer are not firmly bonded, and the copper foil layer and a heat sealing layer are easy to fall off.
Patent CN206076293U discloses an improved copper-plastic film, the middle is a copper layer, both sides of the copper layer are plated or pasted with aluminum layers, and the aluminum layers on both sides of the copper layer are respectively combined with a protective layer and a heat sealing layer through adhesives. Because form the passivation layer easily on the aluminium lamination, the copper layer of membrane is moulded to copper just can bond firmly with protective layer and heat-seal layer through the aluminium lamination well, makes protective layer and heat-seal layer be difficult for droing, has improved the safety in utilization of lithium cell, but this patent also has the defect: the aluminum layer and the copper layer are difficult to combine, the aluminum-plated layer on the copper layer is easy to fall off, and the aluminum-plated layer pasted on the copper layer is easy to delaminate in the bending and shaping process of the material, so that the copper layer is easy to be partially or completely exposed in electrolyte and still has a large risk.
Disclosure of Invention
The invention aims to provide a method for sputtering an aluminum layer on a copper substrate, which can ensure that the aluminum layer is firmly attached to the copper substrate, the obtained composite material is not easy to delaminate in subsequent processing, and a good structural foundation is improved for a copper plastic film.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
a method for sputtering an aluminum layer on a copper substrate is characterized in that an alloy aluminum target doped with bridging metal is used as a first target material, and inert gas ions bombard the surface of the first target material (the inert gas ions are generated by the fact that electrons collide with inert gas atoms in the process of flying to the substrate under the action of an electric field to ionize the inert gas atoms), so that the atoms on the surface of the first target material overflow and are deposited on the surface of the copper substrate to form a pre-ejection layer; then, using a pure aluminum target (the aluminum purity is more than 99.9%) as a second target material, and bombarding the surface of the second target material through inert gas ions to enable atoms on the surface of the second target material to overflow and cover the surface of the pre-shooting layer to form a main body layer; the pre-shot layer and the bulk layer constitute an aluminum layer. The bridging metal is a metal with good affinity with both copper and aluminum, and can be one metal or a mixture of multiple metals.
Aiming at the problem that the aluminum layer and the copper layer of the existing copper plastic film are difficult to combine, the invention firstly adopts a sputtering mode to coat aluminum on copper, compared with the electroplating or aluminum layer coating in the prior art, the sputtering aluminum layer has good compactness and high structural strength, and the combination level with the copper layer is also improved; however, the affinity ratio of aluminum atoms to copper atoms is poor, and the conventional sputtering method cannot enable aluminum to achieve a high adhesion level on copper, so that the sputtering method is optimized, the alloy modified aluminum target doped with bridging metal is used as a first target material, a pure aluminum target is used as a second target material, a single aluminum target used in conventional sputtering is replaced, after inert gas ions bombard the surface of the first target material, the aluminum atoms and the bridging metal atoms on the surface of the first target material are sputtered onto the surface of a copper foil layer together, and the bridging metal atoms play a role in connecting the aluminum atoms and the copper atoms.
Preferably, the bridging metal at least comprises nickel, i.e. the bridging metal may be nickel alone or consist of nickel and other metals.
Preferably, the method for sputtering the aluminum layer on the copper substrate specifically comprises the following steps:
starting a magnetron sputtering coating machine, loading a first target material and a second target material in a sputtering cavity, loading a copper substrate on a roller, and adjusting the target base distance;
step two, vacuumizing the sputtering cavity, introducing inert gas (the purity is more than 99.9%), setting the flow of the inert gas at 400-;
conveying the base material into a sputtering cavity, enabling the base material to be parallel to the target material, adjusting the positions of magnetic beads to enable the base material to be uniformly distributed, and controlling the magnetic field intensity in the sputtering cavity to be 525 +/-30T (the magnetic field intensity is improved by 50% compared with the magnetic field intensity of conventional aluminum target sputtering, and the magnetic field is enabled to be uniformly distributed by adjusting the positions of the magnetic beads and improving the magnetic field intensity, so that the uniformity of a sputtering layer is improved); turning on a radio frequency power supply, starting sputtering, adjusting the sputtering speed and the radio frequency power, and controlling the thickness of a sputtering layer; and sputtering the substrate by the first target and the second target in sequence to obtain the aluminum layer.
Preferably, in the third step, the sputtering process comprises a pre-sputtering stage and a sputtering stage, wherein the radio frequency power of the pre-sputtering stage is controlled to be 3.0-3.5Kw, and the radio frequency power of the sputtering stage is controlled to be 4.0-4.6 Kw. The pre-sputtering stage corresponds to the sputtering process of the first target, the sputtering stage corresponds to the sputtering process of the second target, and the radio frequency power of the pre-sputtering stage is smaller than that of the sputtering stage, so that a compact pre-shot layer firmly attached to the copper substrate is stably formed, and meanwhile, the main body layer and the pre-shot layer are tightly combined. Therefore, the invention obviously improves the adhesive force of the sputtered aluminum layer by adopting the special aluminum target and combining the precise control of the radio frequency power.
Preferably, in the third step, the sputtering speed is controlled to be 1-5 m/min. The sputtering speed is the speed of conveying the copper base material by the roller, the sputtering speed is matched with radio frequency power parameters except controlling the thickness of the aluminum layer, the aluminum layer is ensured to be uniform and compact, the sputtering speed exceeds 5m/min, and the copper base material has local exposure risk.
Preferably, in the first step, the starting mode of the magnetron sputtering coating machine is cold machine starting; and in the second step, the introduction amount of the inert gas is controlled in a closed loop mode when the inert gas is introduced. The target poisoning phenomenon is reduced by starting the cold machine and controlling the introduction amount of inert gas in a closed loop mode.
The second purpose of the invention is to provide an aluminum atom transfer copper-plastic film, which comprises a copper foil layer, a protective layer arranged on the outer side of the copper foil layer and a heat sealing layer arranged on the inner side of the copper foil layer, wherein a first barrier layer is arranged between the copper foil layer and the protective layer, and a second barrier layer is arranged between the copper foil layer and the heat sealing layer; the first barrier layer and the second barrier layer are aluminum layers which are obtained by adopting the method of sputtering the aluminum layers on the copper base material and are attached to the surface of the copper foil layer, the surface of one side, away from the copper foil layer, of the first barrier layer is bonded with the protective layer through an adhesive, and the surface of one side, away from the copper foil layer, of the second barrier layer is bonded with the heat sealing layer through an adhesive. According to the aluminum atom transfer copper plastic film, the first barrier layer and the second barrier layer are attached to the copper foil layer by the method of sputtering the aluminum layer on the copper substrate, so that the exposure of the copper foil layer in electrolyte is effectively avoided, and the use safety of the battery is improved.
Preferably, a surface of one side of the first barrier layer far away from the copper foil layer and a surface of one side of the second barrier layer far away from the copper foil layer are provided with passivation films. The passive film makes the aluminium lamination can bond firmly with heat-seal layer and protective layer, ensures that heat-seal layer and protective layer can not drop, further promotes laminate polymer battery's safety in utilization.
Preferably, the protective layer is a PA layer or a PET layer. The thickness of the PA layer/PET layer is 5-50 μm.
Preferably, the heat sealing layer is a CPP layer. The thickness of the CPP layer is 10-100 mu m.
Preferably, the thickness of the aluminum layer is 0.5 to 3 μm, and more preferably 0.5 to 1 μm.
Preferably, the adhesive is maleic acid modified polypropylene.
The invention has the following beneficial effects:
1. the method for sputtering the aluminum layer on the copper substrate takes the alloy aluminum target doped with the bridging metal as the first target material to form a pre-shot layer on the copper substrate, and the bridging metal is utilized to connect copper atoms and aluminum atoms, so that the bonding difficulty of a copper layer and the aluminum layer is effectively overcome, the adhesion level of aluminum on copper is greatly improved, and on the basis, the adhesion level is further improved through the staged accurate control of radio frequency power, and the aluminum layer can not fall off and be layered.
2. The sputtering method is used for plating aluminum on the copper base material, so that the adhesion is high, the palladium poisoning phenomenon is not easy to occur in the sputtering process, and the plated aluminum layer has good uniformity.
3. The copper plastic film replaces the electroplating or pasting aluminum layer in the prior art with the sputtered aluminum layer obtained by the method, so that the combination level of the aluminum layer and the copper foil layer is obviously improved, a layer of compact aluminum atoms is accumulated on the surface of the copper foil layer, and the aluminum can be better bonded with the protective layer/heat sealing layer after passivation, so that the aluminum layer of the copper plastic film is firmly combined with the copper foil layer inwards and firmly combined with the protective layer/heat sealing layer outwards, the base material (copper) is not directly contacted with electrolyte, and the safety performance of a finished lithium battery is ensured.
4. Compared with the aluminum plastic film with the same thickness, the copper plastic film has the advantages of low water vapor transmission rate, high structural strength and small number of pinholes.
Drawings
FIG. 1: the structure of the aluminum atom transferring copper plastic film described in example 2 is schematically shown.
FIG. 2: and (6) comparing test results.
In the figure: 1-copper foil layer, 2-protective layer, 3-heat sealing layer, 4-first barrier layer and 5-second barrier layer.
Detailed Description
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Example 1
The embodiment provides a method for sputtering an aluminum layer on a copper substrate, which comprises the steps of taking an alloy aluminum target doped with metallic nickel as a first target material, bombarding the surface of the first target material through inert gas ions, and enabling atoms on the surface of the first target material to overflow and deposit on the surface of the copper substrate to form a pre-ejection layer; then, using a pure aluminum target (the aluminum purity is 99.9999%) as a second target material, and bombarding the surface of the second target material through inert gas ions to enable atoms on the surface of the second target material to overflow and cover the surface of the pre-shooting layer to form a main body layer; the pre-shot layer and the bulk layer constitute an aluminum layer. The method for sputtering the aluminum layer on the copper base material specifically comprises the following steps:
step one, starting a magnetron sputtering coating machine by a cold machine, loading a first target material and a second target material in a sputtering cavity, loading a copper substrate on a roller, and adjusting the target base distance to 80mm +/-1 mm;
step two, vacuumizing the sputtering cavity to ensure that the vacuum degree of the back bottom reaches 0.17 Pa, introducing argon with the purity of 99.999 percent, controlling the introduction amount of the argon by adopting a closed loop, setting the flow of the argon at 600sccm and the temperature at-25 ℃;
conveying the base material to a sputtering cavity through a roller and enabling the base material to be parallel to the target material; the positions of the magnetic beads are adjusted to be uniformly distributed, and the magnetic field intensity in the sputtering cavity is controlled to be 525T; and starting a radio frequency power supply to sputter, wherein the sputtering speed is controlled to be 2m/min, the radio frequency power of the first target sputtering process (pre-sputtering stage) is controlled to be 3.2Kw, the radio frequency power of the second target sputtering process (sputtering stage) is controlled to be 4.3Kw, and the copper substrate is sputtered by the first target and the second target in sequence to obtain the aluminum layer.
Example 2
The embodiment provides an aluminum atom transfer copper plastic film, as shown in fig. 1, which includes a copper foil layer 1, a protective layer 2 disposed on an outer side of the copper foil layer 1, and a heat seal layer 3 disposed on an inner side of the copper foil layer 1, wherein a first barrier layer 4 is disposed between the copper foil layer 1 and the protective layer 2, and a second barrier layer 5 is disposed between the copper foil layer 1 and the heat seal layer 3; the first barrier layer 4 and the second barrier layer 5 are aluminum layers attached to the surface of the copper foil layer 1 by adopting a sputtering process, and a passivation film is arranged on the surface of each aluminum layer; the surface of one side, away from the copper foil layer 1, of the first barrier layer 4 is bonded with the protective layer 2 through an adhesive, the surface of one side, away from the copper foil layer 1, of the second barrier layer 5 is bonded with the heat sealing layer 3 through an adhesive, and the adhesive is maleic acid modified polypropylene; the protective layer 2 is a PA layer, and the heat sealing layer 3 is a CPP layer; the thickness of the aluminum layer is 1 μm, the thickness of the PA layer is 20 μm, and the thickness of the CPP layer is 25 μm.
The embodiment also provides a manufacturing method of the aluminum atom transferability copper plastic film, which specifically comprises the following steps:
s1, attaching aluminum layers to the upper surface and the lower surface of a copper foil layer 1 by the method of sputtering the aluminum layers on the copper substrate in the embodiment 1 to obtain a first barrier layer 4 and a second barrier layer 5;
s2, passivating the surfaces of the first barrier layer 4 and the second barrier layer 5 to form an aluminum oxide protective film (namely a passivation film);
s3, coating maleic acid modified polypropylene on the surface of the passivated first barrier layer 4, then dry-coating the protective layer 2, and heating and curing;
s4, coating maleic acid modified polypropylene on the surface of the passivated second barrier layer 5, then dry-coating the heat seal layer 3, and heating and curing to obtain a semi-finished product;
s5, coating a slipping agent on the surface of the semi-finished product for finishing, and then slitting according to the size requirement to obtain the aluminum atom transfer copper plastic film product.
Comparative test
Taking the copper-coated aluminum material obtained in example 1 as a test sample, taking conventional copper on the market as a base material, and taking a copper-aluminum composite film (obtained by outsourcing processing) with an aluminum layer sputtered on the surface of the base material as a control sample, respectively carrying out peeling tests on the test sample and the control sample, wherein the control sample is subjected to a 3M adhesive tape peeling test, the test sample is subjected to a Baige test, and the test method is as follows:
3M tape peeling test: applying a 3M adhesive tape on the surface of a sample, rolling the adhesive tape back and forth for 6 times by using a pressing wheel with the weight of 3KG, standing the sample for 5 minutes to rapidly peel the adhesive tape from the surface of the sample at 90 degrees, and finally observing the peeling condition of a sputtering layer on the surface of the sample under an electron microscope with the weight of 50 times;
and (3) testing the grids: the surface of the sample having the sputtered layer was scribed with a knife and a checkerboard into 100 squares of 2mm × 2mm, and then the "3M tape peeling test" was performed along the diagonal direction of the squares.
As shown in fig. 2, the test results show that the aluminum layer and the copper foil can be visually observed to fall off after the 3M tape stripping test is performed on the control sample; the test sample of the invention has no aluminum layer falling phenomenon after more rigorous 'one hundred lattice test' is carried out, and the advantage is obvious.
This detailed description is to be construed as illustrative only and is not to be taken as limiting the invention, as any changes that may be made by a person skilled in the art after reading the present specification will be protected by the patent laws within the scope of the appended claims.
Claims (10)
1. A method of sputtering an aluminum layer onto a copper substrate, comprising: using an alloy aluminum target doped with bridging metal as a first target material, and bombarding the surface of the first target material through inert gas ions to enable atoms on the surface of the first target material to overflow and deposit on the surface of a copper substrate to form a pre-shot layer; and then, using a pure aluminum target as a second target material, bombarding the surface of the second target material through inert gas ions, and enabling atoms on the surface of the second target material to overflow and cover the surface of the pre-shooting layer to form a main body layer.
2. The method of claim 1, wherein the sputtering of the aluminum layer onto the copper substrate comprises: the bridging metal includes at least nickel.
3. The method of claim 1, wherein the sputtering of the aluminum layer onto the copper substrate comprises: the method specifically comprises the following steps:
starting a magnetron sputtering coating machine, loading a first target material and a second target material in a sputtering cavity, loading a copper substrate on a roller, and adjusting the target base distance;
step two, vacuumizing the sputtering cavity, and then introducing inert gas, wherein the flow of the inert gas is 400-600sccm, and the temperature is-25 +/-15 ℃;
conveying the base material into a sputtering cavity, enabling the base material to be parallel to the target material, adjusting the positions of magnetic beads to enable the magnetic beads to be uniformly distributed, and controlling the magnetic field intensity in the sputtering cavity to be 525 +/-30T; turning on a radio frequency power supply, starting sputtering, adjusting the sputtering speed and the radio frequency power, and controlling the thickness of a sputtering layer; and sputtering the copper base material by the first target material and the second target material in sequence to obtain the aluminum layer.
4. A method of sputtering an aluminum layer onto a copper substrate as claimed in claim 3 wherein: in the third step, the sputtering process comprises a pre-sputtering stage and a sputtering stage, wherein the radio frequency power of the pre-sputtering stage is controlled to be 3.0-3.5Kw, and the radio frequency power of the sputtering stage is controlled to be 4.0-4.6 Kw.
5. The method of claim 4, wherein the sputtering of the aluminum layer onto the copper substrate comprises: in the third step, the sputtering speed is controlled to be 1-5 m/min.
6. An aluminum atom transferability copper plastic film, which is characterized in that: the packaging film comprises a copper foil layer (1), a protective layer (2) arranged on the outer side of the copper foil layer (1) and a heat sealing layer (3) arranged on the inner side of the copper foil layer (1), wherein a first barrier layer (4) is arranged between the copper foil layer (1) and the protective layer (2), and a second barrier layer (5) is arranged between the copper foil layer (1) and the heat sealing layer (3);
the first barrier layer (4) and the second barrier layer (5) are aluminum layers attached to the surface of the copper foil layer (1) and obtained by the method of sputtering the aluminum layers on the copper substrate according to claim 1, one side surface of the first barrier layer (4) far away from the copper foil layer (1) is bonded with the protective layer (2) through an adhesive, and one side surface of the second barrier layer (5) far away from the copper foil layer (1) is bonded with the heat-seal layer (3) through an adhesive.
7. The aluminum atom-transferring copper plastic film according to claim 6, wherein: the surface of one side of copper foil layer (1) is kept away from in first barrier layer (4) and the surface of one side of copper foil layer (1) is kept away from in second barrier layer (5) has the passive film.
8. The aluminum atom-transferring copper plastic film according to claim 6, wherein: the protective layer (2) is a PA layer or a PET layer.
9. The aluminum atom-transferring copper plastic film according to claim 6, wherein: the heat sealing layer (3) is a CPP layer.
10. The aluminum atom-transferring copper plastic film according to claim 6, wherein: the adhesive is maleic acid modified polypropylene.
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| CN202110171884.7A CN112941481B (en) | 2021-02-08 | 2021-02-08 | Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film |
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| CN202110171884.7A CN112941481B (en) | 2021-02-08 | 2021-02-08 | Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
| US6619537B1 (en) * | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
| CN206076293U (en) * | 2016-09-26 | 2017-04-05 | 东莞市卓越新材料科技有限公司 | The copper plastic film of improvement |
| CN108251800A (en) * | 2018-04-15 | 2018-07-06 | 山东建筑大学 | A kind of Cu-Al gradient films material and preparation method thereof |
-
2021
- 2021-02-08 CN CN202110171884.7A patent/CN112941481B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
| US6619537B1 (en) * | 2000-06-12 | 2003-09-16 | Tosoh Smd, Inc. | Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers |
| CN206076293U (en) * | 2016-09-26 | 2017-04-05 | 东莞市卓越新材料科技有限公司 | The copper plastic film of improvement |
| CN108251800A (en) * | 2018-04-15 | 2018-07-06 | 山东建筑大学 | A kind of Cu-Al gradient films material and preparation method thereof |
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