CN112935442B - Method, device, equipment and medium for determining automatic welding process parameters - Google Patents
Method, device, equipment and medium for determining automatic welding process parameters Download PDFInfo
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- CN112935442B CN112935442B CN202110152554.3A CN202110152554A CN112935442B CN 112935442 B CN112935442 B CN 112935442B CN 202110152554 A CN202110152554 A CN 202110152554A CN 112935442 B CN112935442 B CN 112935442B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The embodiment of the invention discloses a method, a device, equipment and a medium for determining automatic welding process parameters. The method comprises the following steps: acquiring a welding spot image of a welding spot to be welded; determining the inner diameter and the outer diameter of the welding pad of the welding spot to be welded according to the welding spot image; and determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded so as to adjust the parameters of an automatic welding process. The technical scheme aims at determining the welding process parameters of the direct-insert type electronic components in the mixed printed circuit board, and improves the degree of automation and the system reliability.
Description
Technical Field
The embodiment of the invention relates to the technical field of automatic welding, in particular to a method, a device, equipment and a medium for determining automatic welding process parameters.
Background
With the development of digitization, automation, computers, mechanical design techniques, and high emphasis on welding quality, automated welding has evolved into an advanced manufacturing technique.
The wave soldering technology is commonly used for automatic soldering of direct-insert type components, and is an automatic soldering technology for achieving the purpose of soldering by directly contacting a soldering surface of a plug-in board with high-temperature liquid tin. However, this technique is not suitable for a hybrid printed circuit board including a chip-type component and an in-line component because of its high soldering temperature.
For the welding of direct-insert type electronic components in a hybrid printed circuit board, the method which is commonly used at present is manual welding, but the efficiency of the manual welding method is lower, the consistency of welding spots is poorer, and the cost is higher. For this problem, an automatic welding system based on teaching reproduction can be used instead of manual work, but the automation degree of these process systems is not high, and professional engineers are required to manually debug and empirically determine welding process parameters (solder demand, solder joint heating time) before mass welding, so that the subjectivity is strong and a certain uncertainty exists.
Therefore, how to improve the degree of automation for soldering in-line electronic components in hybrid printed circuit boards is a problem to be solved.
Disclosure of Invention
The embodiment of the invention provides a method, a device, equipment and a medium for determining automatic welding process parameters so as to improve the degree of automation of in-line electronic components in a welding hybrid printed circuit board.
In a first aspect, an embodiment of the present invention provides a method for determining an automatic welding process parameter, including:
acquiring a welding spot image of a welding spot to be welded;
determining the inner diameter and the outer diameter of the welding pad of the welding spot to be welded according to the welding spot image;
and determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded so as to adjust the parameters of an automatic welding process.
In a second aspect, an embodiment of the present invention further provides a device for determining an automatic welding process parameter, including:
the welding spot image acquisition module is used for acquiring a welding spot image of a welding spot to be welded;
the inner and outer pad diameter determining module is used for determining the inner and outer pad diameters of the welding points to be welded according to the welding point images;
and the welding process parameter determining module is used for determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded so as to adjust the automatic welding process parameters.
In a third aspect, an embodiment of the present invention further provides a computer device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the processor executes the program to implement a method for determining an automatic welding process parameter according to any one of the embodiments of the present invention.
In a fourth aspect, embodiments of the present invention further provide a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements a method for determining an automated welding process parameter according to any of the embodiments of the present invention.
In the technical scheme provided by the embodiment of the invention, firstly, the inner diameter and the outer diameter of a welding pad of the welding spot to be welded are determined according to the welding spot image of the welding spot to be welded, and then the required volume of welding flux matched with the welding spot to be welded and the heating time of the welding spot are determined according to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of a component to be welded so as to adjust the automatic welding process parameters corresponding to the welding spot to be welded. According to the technical scheme, the welding flux demand volume and the welding spot heating time matched with the welding spots to be welded can be determined according to the welding spot inner diameter and the welding spot outer diameter of the welding spots to be welded, the consistency of the welding spot automatic welding process parameters with different sizes is improved, namely, the matched automatic welding process parameters can be determined according to the size of the welding spots to be welded, the welding process parameters of the direct-insert type electronic components in the mixed type printed circuit board are determined, the automation degree and the system reliability are improved, the automation degree of the direct-insert type electronic components in the welded mixed type printed circuit board is further improved, and subjectivity and inconsistency of the manual determination welding process parameters are avoided.
Drawings
FIG. 1 is a flow chart of a method for determining parameters of an automatic welding process according to a first embodiment of the present invention;
FIG. 2 is an exemplary view of a solder joint image in accordance with a first embodiment of the present invention;
FIG. 3 is an exemplary view of a foreground image of a bonding pad in accordance with a first embodiment of the present invention;
FIG. 4 is a diagram showing an example of a foreground image of a through hole of a component in accordance with a first embodiment of the present invention;
FIG. 5 is an exemplary view of a foreground de-noised image of a bonding pad in accordance with a first embodiment of the present invention;
FIG. 6 is an exemplary view of a foreground denoising image of a component via in a first embodiment of the present invention;
FIG. 7 is an exemplary view of a foreground edge image of a bonding pad in accordance with a first embodiment of the present invention;
FIG. 8 is a diagram showing an example of a foreground edge image of a through hole of a component in accordance with a first embodiment of the present invention;
fig. 9 is an exemplary diagram of a pad outer circle detection result in the first embodiment of the present invention;
FIG. 10 is a graph showing an example of the detection result of the inner circle of the bonding pad in the first embodiment of the present invention;
FIG. 11 is a schematic cross-sectional view of a solder joint according to a first embodiment of the invention;
FIG. 12 is a flow chart of a method for determining parameters of an automatic welding process according to a second embodiment of the present invention;
FIG. 13 is a block diagram of an apparatus for determining parameters of an automatic welding process according to a third embodiment of the present invention;
fig. 14 is a schematic structural diagram of a computer device in a fourth embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
It should be further noted that, for convenience of description, only some, but not all of the matters related to the present invention are shown in the accompanying drawings. Before discussing exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart depicts operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently, or at the same time. Furthermore, the order of the operations may be rearranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figures. The processes may correspond to methods, functions, procedures, subroutines, and the like.
Example 1
Fig. 1 is a flowchart of a method for determining an automatic soldering process parameter according to an embodiment of the present invention, where the method may be applied to the case of automatically soldering an in-line electronic component in a hybrid printed circuit board, and the method may be performed by a device for determining an automatic soldering process parameter according to an embodiment of the present invention, where the device may be implemented in software and/or hardware, and may generally be integrated in a computer device, for example, may be an industrial personal computer for controlling automatic soldering.
As shown in fig. 1, the method in this embodiment specifically includes:
s110, acquiring a welding spot image of a welding spot to be welded.
The solder joint to be soldered refers to an in-line solder joint to be soldered on a PCB (Printed Circuit Board ), and may be, for example, an in-line solder joint to be soldered on a hybrid PCB. Wherein the sizes of the welding spots to be welded are not identical.
The image of the welding spot to be welded is acquired by a camera, and reference is made to the image of the welding spot shown in fig. 2 (in this embodiment, fig. 2, 9 and 10 are each shown in gray scale).
S120, determining the inner diameter and the outer diameter of the welding spot to be welded according to the welding spot image.
And identifying the welding spot image, identifying the inner circle and the outer circle of the welding spot to be welded, and respectively determining the inner diameter and the outer diameter of the welding spot according to the inner circle and the outer circle of the welding spot.
The inner circle of the bonding pad is the inner edge of the bonding pad (namely the outer edge of the through hole), and the outer circle of the bonding pad is the outer edge of the bonding pad.
If the imaging quality of a camera for acquiring the welding spot image is high, the noise in the welding spot image is less, the welding spot image can be directly subjected to Hough transformation, the inner circle and the outer circle of the welding pad in the welding spot image are extracted, and then the inner diameter and the outer diameter of the welding pad to be welded are obtained.
If the imaging quality of the camera for collecting the welding spot image is low and the noise in the welding spot image is more in response to illumination, the welding spot image can be preprocessed to eliminate the noise, then the preprocessed welding spot image is subjected to Hough transformation, the inner circle and the outer circle of the welding spot in the welding spot image are extracted, and then the inner diameter and the outer diameter of the welding spot to be welded are obtained.
As an alternative embodiment, determining the inner diameter of the pad and the outer diameter of the pad to be soldered according to the solder joint image may be specifically:
respectively extracting a welding pad foreground image and a component through hole foreground image according to the welding spot image;
after denoising the foreground image of the bonding pad, extracting the edge of the bonding pad, and carrying out Hough calculation by utilizing the edge of the bonding pad to determine the outer circle of the bonding pad so as to obtain the outer diameter of the bonding pad corresponding to the outer circle of the bonding pad;
and after denoising the foreground image of the component through hole, extracting the edge of the component through hole, and carrying out Hough calculation by utilizing the edge of the component through hole to determine the inner circle of the bonding pad so as to obtain the inner diameter of the bonding pad corresponding to the inner circle of the bonding pad.
The pad foreground image refers to an image taking a pad area as an interested area; the component through hole foreground image refers to an image taking the component through hole as an interested area.
Because the colors of the component through holes and the bonding pads are different, the mask with different color ranges can be used for processing the welding spot images so as to extract the foreground images of the bonding pads and the foreground images of the component through holes. Firstly, converting a welding spot image from an RGB image to an HSV image, and then respectively processing the welding spot image after the color space conversion by using masks with different color ranges to obtain a welding spot foreground image and a component through hole foreground image. Taking fig. 2 as an example, the foreground image of the bonding pad is shown in fig. 3, and the foreground image of the through hole of the component is shown in fig. 4.
Because a large amount of noise exists in the foreground image of the bonding pad and the foreground image of the through hole of the component, in order to improve the effect of edge extraction, the foreground image of the bonding pad and the foreground image of the through hole of the component are respectively subjected to denoising treatment to obtain the foreground denoising image of the bonding pad and the foreground denoising image of the through hole of the component, for example, the foreground image of the bonding pad and the foreground image of the through hole of the component can be respectively subjected to open operation to eliminate the noise in the foreground image of the bonding pad and the foreground image of the through hole of the component. Illustratively, performing an on operation on the foreground image of the bonding pad shown in fig. 3 to obtain a foreground denoising image of the bonding pad shown in fig. 5; and performing open operation on the foreground image of the through hole of the component shown in fig. 4 to obtain a foreground denoising image of the through hole of the component shown in fig. 6.
And after denoising the foreground image of the welding disc and the foreground image of the through hole of the component, extracting edges to obtain the foreground edge image of the welding disc and the foreground edge image of the through hole of the component. Illustratively, edge extraction is performed on the foreground denoising image of the bonding pad shown in fig. 5, so as to obtain a foreground edge image of the bonding pad shown in fig. 7; and carrying out edge extraction on the component through hole foreground denoising image shown in fig. 6 to obtain the component through hole foreground edge image shown in fig. 8.
And respectively carrying out Hough operation by utilizing edge points in the foreground edge image of the bonding pad and the foreground edge image of the through hole of the component, and voting out two circles with the maximum probability in the parameter space as an outer circle and an inner circle of the bonding pad. Illustratively, hough operation is performed by using edge points of the foreground edge image of the bonding pad shown in fig. 7, and a circle with the highest probability in the parameter space is voted out as an outer circle of the bonding pad, as shown by a circle 1 in fig. 9; the hough operation is performed by using the edge points of the foreground edge image of the through hole of the component shown in fig. 8, and the circle with the highest probability in the parameter space is voted as the inner circle of the bonding pad, as shown by circle 2 in fig. 10.
After the outer circle and the inner circle of the bonding pad are obtained, the outer diameter of the bonding pad corresponding to the outer circle of the bonding pad and the inner diameter of the bonding pad corresponding to the inner circle of the bonding pad can be determined.
To determine the automatic welding process parameters of the in-line welding spot, firstly, the size information of the welding spot is obtained, including the inner diameter of the welding spot, the outer diameter of the welding spot and the thickness of the printed circuit board. The thickness of the same batch of printed circuit boards can be obtained through one-time measurement, so that in practical application, only the inner and outer diameters of the bonding pads of each in-line welding spot on the mixed circuit board are measured through a machine vision mode. In the above embodiment, the method of hough transform is adopted to measure the size of the solder joint.
S130, determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the size of the pin of the component to be welded so as to adjust the parameters of the automatic welding process.
The size of the pin of the component to be welded can be the cross-sectional area of the pin or the cross-sectional diameter of the pin. The pin size of the component to be soldered can be obtained by pre-measurement or calculation.
The inner diameter and the outer diameter of the welding pad of the welding spot to be welded are different, the sizes of pins of the components to be welded are different, and the parameters of the automatic welding process corresponding to the welding spot to be welded and the components to be welded are different. According to the difference of the inner diameter of the bonding pad, the outer diameter of the bonding pad and the size of a pin of a component to be welded, determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot to be welded as automatic welding process parameters matched with the welding spot to be welded, so as to realize automatic welding operation of the welding spot to be welded and the component to be welded according to the automatic welding process parameters matched with the welding spot to be welded.
As an optional implementation manner, determining the solder requirement volume and the solder joint heating time matched with the solder joint to be soldered according to the inner diameter of the solder joint, the outer diameter of the solder joint and the size of the pin of the component to be soldered may specifically be:
and calculating the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded and the target welding correlation parameters.
The target soldering related parameter refers to a soldering related parameter matched with soldering the same batch of printed circuit boards, and may be, for example, a thickness of the printed circuit boards, a soldering height, a soldering temperature, a solder material, a solder shape (such as a radius of a wire-shaped solder), a soldering height, a speed of a solder transfer device, and the like.
The solder on the ideal soldered joint should be uniformly and symmetrically distributed, and a calculation model can be generated in advance according to the solder shape on the ideal soldered joint, and then according to the calculation model, the solder requirement and the solder joint heating time matched with the soldered joint are calculated according to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be soldered and the target soldering related parameters.
Further, as an optional implementation manner, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad, and the size of the pin of the component to be soldered, according to the target soldering association parameter, the required volume of the solder and the heating time of the soldering point matched with the soldering point to be soldered may be calculated, specifically:
according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, respectively calculating the upper solder volume, the through hole solder volume, the lower solder volume of the welding spot to be welded and the pin volume of the component to be welded according to target welding related parameters;
taking the sum of the upper solder volume, the through hole solder volume and the lower solder volume and subtracting the difference value obtained by the pin volume as the solder required volume;
and calculating the heating time of the welding spot according to the required volume of the welding flux.
As shown in fig. 11, the solder volume can be roughly divided into an upper solder volume, a through-hole solder volume, and a lower solder volume. It should be noted that, in the embodiment, the upper solder volume, the through hole solder volume, and the lower solder volume include part of the lead volume of the component to be soldered.
According to a pre-generated calculation model and according to the outer diameter R of the bonding pad 1 Inner diameter R of bonding pad 2 The upper solder volume V is calculated by the related parameters of target soldering 1 Volume of solder V for through holes 2 And a lower solder volume V 3 。
Assume that the cross-sectional area of the pin of the component to be soldered is S pin The thickness of the printed circuit board is d, the height of the upper solder (namely, the welding thickness of the upper solder) is H, the height of the lower solder (namely, the welding thickness of the lower solder) is H, and the required volume of the solder is: v=v 1 +V 2 +V 3 -S pin ×(d+H+h)。
Wherein, the through hole solder volume is:
further, the calculation of the solder joint heating time according to the solder demand volume may specifically be:
by the formula
Calculating the welding spot heating time T of the welding spot to be welded; wherein, the liquid crystal display device comprises a liquid crystal display device,
v is the volume of the solder needed by the welding spot to be welded, V s R is the speed of the solder transfer device 0 Is the radius of the filiform solder.
As an alternative embodiment, the target welding-related parameters include: and the upper solder height and the molten solder wetting angle of the welding spot to be welded. Wherein the molten solder wetting angle is related to the solder material and the soldering temperature, and can be determined by referring to a material wetting angle table after obtaining the solder used in the automatic soldering system and the soldering temperature.
Correspondingly, calculating the volume of the upper solder of the welding spot to be welded can be specifically:
determining an upper solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the outer diameter of the welding pad, the upper solder height of the welding point to be welded and the wetting angle of the molten solder; and taking the volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one circle as the upper solder volume of the welding spot to be welded.
Similarly, as an optional embodiment, the target welding-related parameter further includes: the lower solder height of the welding spot to be welded and the wetting angle of the molten solder; correspondingly, calculating the volume of the lower solder of the welding spot to be welded can be specifically:
determining a lower solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the inner diameter of the welding pad, the lower solder height of the welding point to be welded and the wetting angle of the molten solder; and taking the volume of the rotating body obtained by rotating the lower solder contour line around the central axis of the through hole for one circle as the lower solder volume of the welding spot to be welded.
The shape of the solder on a standard soldered joint is a concave cone, and in this embodiment a higher order curve can be used to approximate the longitudinal cross-sectional profile of the upper and lower solder volumes of the ideal solder joint. Specifically, the upper solder shape and the lower solder shape may be regarded as a rotating body obtained by rotating the upper curve around the axis for one revolution, respectively, and the volume of the partial solder may be calculated by using a method of calculating the volume of the rotating body.
Assuming that the center of a welding spot to be welded on the upper surface of the printed circuit board is an origin, the vertical upward direction is the positive direction of the z axis, and the direction from the center of the through hole to the upper right edge of the welding spot is the positive direction of the x axis. Thus, as shown in fig. 11, taking the outline of the left half of the solder joint upper solder as an example, the upper solder outline can be expressed as:
z 1 (x)＝a 3 (x+R 1 ) 3 +a 2 (x+R 1 ) 2 +a 1 (x+R 1 )+a 0 ；
the boundary conditions are as follows:
wherein, the liquid crystal display device comprises a liquid crystal display device,
a 0 ,a 1 ,a 2 ,a 3 is the coefficient, R 1 Is the pad outer diameter, H is the upper solder height, and α is the molten solder wetting angle.
Further, the upper solder volume is
S 1 Is the area of any cross section of the upper solder.
Optionally, the upper solder height is 1.0-1.2 times the outer diameter of the pad.
Similarly, assuming that the center of the pad of the solder joint to be soldered on the upper surface of the printed circuit board is the origin, the vertical upward direction is the positive z-axis direction, the direction from the center of the through hole to the right lower edge of the pad is the positive x-axis direction (not shown), taking the outline of the right half of the solder at the lower part of the solder joint as an example, the lower solder outline can be expressed as:
z 2 (x)＝b 3 (x-r) 3 +b 2 (x-r) 2 +b 1 (x-r)+b 0 ；
the boundary conditions are as follows:
wherein, the liquid crystal display device comprises a liquid crystal display device,
b 0 ,b 1 ,b 2 ,b 3 r is the radius of the largest cross-sectional area of the lower solder, h is the lower solder height, and α is the molten solder wetting angle. Where r and h are related to the solder penetration requirements.
Furthermore, the lower solder volume is
S 2 Is the area of any cross section of the lower solder.
In the embodiment, a mathematical modeling method for the appearance of a standard welding spot is provided, a higher-order curve is used for fitting the appearance of the welding flux of the standard welding spot, and the volume of the welding flux in the welding spot is calculated by utilizing a solving method of the volume of a rotating body, so that the consistency of the automatic welding process parameters of welding spots with different sizes is ensured.
As an alternative embodiment, the target welding-related parameter further includes: empirical parameters associated with tin penetration; correspondingly, calculating the volume of the lower solder of the welding spot to be welded can be specifically:
taking the product of the upper solder volume of the welding spot to be welded and the experience parameter as the lower solder volume of the welding spot to be welded.
The empirical parameters related to the tin permeability are preselected parameters according to the personalized requirements of the tin permeability, and the range of the empirical parameters is (0, 1).
In the present embodiment, in order to reduce the calculation amount of the solder volume, the upper solder volume and the empirical parameter γ can be used to estimate the lower solder volume, that is, the upper solder volume and the empirical parameter γThe product is taken as the upper solder volume, namely: v (V) 3 ＝γV 1 ,0＜γ≤1。
Further, in the present embodiment, a calculation model for calculating the solder demand volume may be written as follows:
V＝C(R 1 ,R 2 ,d,S pin α, γ); wherein, the function C represents a solder demand volume calculation function, and the independent variable is: size of solder joint (R 1 ,R 2 ) Printed circuit board thickness d, component pin cross-sectional area S pin A molten solder wetting angle α related to the soldering temperature and the solder material, and an empirical parameter γ.
In the embodiment, the relationship between the standard welding spot welding flux and the welding spot size is determined by modeling the appearance of the high-quality welding spot, and the consistency of the welding spot automatic welding parameters can be improved by utilizing a computer to automatically determine parameters according to a calculation model.
It should be noted that the pin cross-sectional area S pin And the printed circuit board thickness d, can be determined by a preliminary measurement. Furthermore, the welding flux demand volume of the welding spot can be calculated based on the inner diameter and the outer diameter of the welding pad measured by machine vision, and the heating time of the welding spot can be calculated based on the welding flux demand volume.
In the technical scheme provided by the embodiment of the invention, firstly, the inner diameter and the outer diameter of a welding pad of the welding spot to be welded are determined according to the welding spot image of the welding spot to be welded, and then the required volume of welding flux matched with the welding spot to be welded and the heating time of the welding spot are determined according to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of a component to be welded so as to adjust the automatic welding process parameters corresponding to the welding spot to be welded. According to the technical scheme, the welding flux demand volume and the welding spot heating time matched with the welding spots to be welded can be determined according to the welding spot inner diameter and the welding spot outer diameter of the welding spots to be welded, the consistency of the welding spot automatic welding process parameters with different sizes is improved, namely, the matched automatic welding process parameters can be determined according to the size of the welding spots to be welded, the welding process parameters of the direct-insert type electronic components in the mixed type printed circuit board are determined, the automation degree and the system reliability are improved, the automation degree of the direct-insert type electronic components in the welded mixed type printed circuit board is further improved, and subjectivity and inconsistency of the manual determination welding process parameters are avoided.
Example two
Fig. 12 is a flowchart of a method for determining parameters of an automatic welding process according to a second embodiment of the present invention. The embodiment is embodied based on the foregoing embodiment, wherein after determining the volume of the solder requirement and the solder joint heating time matched with the solder joint to be soldered, the method further includes:
generating welding process parameter records corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of the component to be welded according to the welding flux demand volume and the welding spot heating time matched with the welding spot to be welded;
correspondingly, determining the solder requirement volume and the solder joint heating time matched with the solder joint to be welded according to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be welded can be specifically as follows:
if welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded exist, determining the required volume of the welding flux and the heating time of the welding spot matched with the welding spot to be welded according to the welding process parameter records;
if the welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded do not exist, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, according to the target welding association parameters, the required volume of the welding material matched with the welding point to be welded and the heating time of the welding point are calculated.
In this embodiment, after determining the required volume of the solder and the heating time of the solder joint matched with the solder joint to be soldered, the required volume of the solder and the heating time of the solder joint can be stored together with the pin size information of the solder joint to be soldered and the component to be soldered, and used as a record of soldering process parameters. Wherein, a welding process parameter record may include: pad inside diameter, pad outside diameter, pin size (cross-sectional area or pin cross-sectional diameter or pin cross-sectional radius) of the component to be soldered, solder requirement volume, and solder joint heating time. Optionally, the soldering process parameter record may further include a printed circuit board thickness, a molten solder wetting angle, an empirical parameter, and the embodiment is not limited in particular.
Optionally, the generated welding process parameter record is stored in a welding spot information base. Before the present batch of printed circuit boards are soldered, the solder joint information base corresponding to the present batch of printed circuit boards may be empty.
And after determining the inner diameter of the welding pad and the outer diameter of the welding pad according to the welding pad image, firstly, inquiring a welding pad information base according to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of a component to be welded, judging whether a matched welding process parameter record exists, if so, determining the required volume of welding flux and the heating time of the welding pad according to the matched welding process parameter record, and if not, calculating the required volume of welding flux and the heating time of the welding pad matched with the welding pad according to the target welding related parameters and generating a corresponding welding process parameter record according to the calculated required volume of welding flux and the welding pad heating time for storage.
As shown in fig. 12, the method of this embodiment specifically includes:
s210, acquiring a welding spot image of a welding spot to be welded.
S220, determining the inner diameter and the outer diameter of the welding spot to be welded according to the welding spot image.
Optionally, first, a pad foreground image and a component through hole foreground image are respectively extracted according to the welding spot image.
Secondly, after denoising the foreground image of the bonding pad, extracting the edge of the bonding pad, and carrying out Hough calculation by utilizing the edge of the bonding pad to determine the outer circle of the bonding pad, so as to obtain the outer diameter of the bonding pad corresponding to the outer circle of the bonding pad;
and thirdly, after denoising the foreground image of the component through hole, extracting the edge of the component through hole, and carrying out Hough calculation by utilizing the edge of the component through hole to determine the inner circle of the bonding pad so as to obtain the inner diameter of the bonding pad corresponding to the inner circle of the bonding pad.
And S230, judging whether welding process parameter records matched with the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded exist, if so, executing S240, and if not, executing S250.
S240, determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the welding process parameter record so as to adjust the automatic welding process parameter.
S250, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, according to the target welding association parameters, calculating the required volume of the welding flux matched with the welding point to be welded and the heating time of the welding point.
Optionally, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be soldered, respectively calculating the upper solder volume V of the bonding spot to be soldered according to the target soldering related parameters 1 Volume of solder V for through holes 2 Lower solder volume V 3 And the pin volume of the component to be welded; the upper solder volume V 1 Volume of solder V for through holes 2 And a lower solder volume V 3 Is to subtract the pin volume S pin The difference obtained by x (d+h+h) is taken as the solder demand volume V; and calculating the heating time T of the welding spot according to the required volume V of the welding flux.
Wherein:
z 1 (x)＝a 3 (x+R 1 ) 3 +a 2 (x+R 1 ) 2 +a 1 (x+R 1 )+a 0 ；
V＝V 1 +V 2 +V 3 -S pin ×(d+H+h)；
and S260, generating and storing welding process parameter records matched with the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded according to the required volume of the welding flux matched with the welding point to be welded and the heating time of the welding point.
The present embodiment is not explained in detail herein, and reference is made to the foregoing embodiments.
In the technical scheme, the volume and the heating time of the welding flux required by the direct-insert welding spots with different sizes are calculated by a scientific calculation method, so that the production efficiency of an automatic electronic welding system is improved, and subjectivity and inconsistency of manual parameter determination are avoided. In addition, the welding process parameter records generated by the printed circuit boards in the same batch are stored, repeated calculation of the welding process parameters for the direct-insert welding spots with the same size is avoided, and the waste of calculation force is reduced.
Experiments prove that the technical scheme provided by the embodiment can accurately determine the automatic welding process parameters aiming at welding spots with different sizes, so that the appearance standard and consistency of the welded welding spots obtained by automatic welding are high. As shown in table 1, the solder volume determined according to the present technical solution is consistent with the optimized solder volume parameters determined by manual experiments.
TABLE 1
Example III
Fig. 13 is a schematic structural diagram of an apparatus for determining parameters of an automatic welding process according to a third embodiment of the present invention, where the apparatus may be implemented in software and/or hardware, and may be generally integrated in a computing device, for example, an industrial personal computer for controlling automatic welding. As shown in fig. 13, the apparatus includes: a solder joint image acquisition module 310, a solder joint inner and outer diameter determination module 320, and a solder joint process parameter determination module 330. Wherein, the liquid crystal display device comprises a liquid crystal display device,
a welding spot image obtaining module 310, configured to obtain a welding spot image of a welding spot to be welded;
a pad inside and outside diameter determining module 320, configured to determine a pad inside diameter and a pad outside diameter of the to-be-welded welding spot according to the welding spot image;
and the welding process parameter determining module 330 is configured to determine a required volume of solder and a heating time of the solder joint, which are matched with the solder joint to be welded, according to the inner diameter of the solder joint, the outer diameter of the solder joint, and the pin size of the component to be welded, so as to adjust the automatic welding process parameter.
In the technical scheme provided by the embodiment of the invention, firstly, the inner diameter and the outer diameter of a welding pad of the welding spot to be welded are determined according to the welding spot image of the welding spot to be welded, and then the required volume of welding flux matched with the welding spot to be welded and the heating time of the welding spot are determined according to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of a component to be welded so as to adjust the automatic welding process parameters corresponding to the welding spot to be welded. According to the technical scheme, the welding flux demand volume and the welding spot heating time matched with the welding spots to be welded can be determined according to the welding spot inner diameter and the welding spot outer diameter of the welding spots to be welded, the consistency of the welding spot automatic welding process parameters with different sizes is improved, namely, the matched automatic welding process parameters can be determined according to the size of the welding spots to be welded, the welding process parameters of the direct-insert type electronic components in the mixed type printed circuit board are determined, the automation degree and the system reliability are improved, the automation degree of the direct-insert type electronic components in the welded mixed type printed circuit board is further improved, and subjectivity and inconsistency of the manual determination welding process parameters are avoided.
In an alternative embodiment, the soldering process parameter determining module 330 is specifically configured to calculate, according to the inner diameter of the pad, the outer diameter of the pad, and the size of the pin of the component to be soldered, a required volume of solder and a heating time of the solder joint matched with the solder joint to be soldered according to the target soldering related parameter.
In an alternative embodiment, the apparatus further comprises: the welding process parameter record generating module is used for generating welding process parameter records corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of the component to be welded according to the welding process parameter records matched with the welding spot to be welded after determining the welding flux requirement volume and the welding spot heating time matched with the welding spot to be welded;
correspondingly, the welding process parameter determining module 330 is specifically configured to determine, if there is a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, a required volume of solder and a heating time of the solder joint matched with the solder joint to be welded according to the welding process parameter record; if the welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded do not exist, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, according to the target welding association parameters, the required volume of the welding material matched with the welding point to be welded and the heating time of the welding point are calculated.
Further, the welding process parameter determination module 330 includes: a solder volume calculation unit and a solder joint heating time calculation unit, wherein,
the solder volume calculating unit is used for calculating the upper solder volume, the through hole solder volume, the lower solder volume of the welding spot to be welded and the pin volume of the component to be welded according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded and the target welding related parameters; taking the sum of the upper solder volume, the through hole solder volume and the lower solder volume and subtracting the difference value obtained by the pin volume as the solder required volume;
and the welding spot heating time calculation unit is used for calculating the welding spot heating time according to the required volume of the welding flux.
Optionally, the target welding-related parameters include: the height of the solder at the upper part of the welding spot to be welded and the wetting angle of the molten solder; the solder volume calculating unit is specifically used for determining an upper solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the outer diameter of the welding pad, the upper solder height of the welding point to be welded and the molten solder wetting angle; and taking the volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one circle as the upper solder volume of the welding spot to be welded.
Optionally, the target welding-related parameters further include: the height of the solder at the lower part of the welding spot to be welded; the solder volume calculating unit is specifically used for determining a lower solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the inner diameter of the welding pad, the lower solder height of the welding point to be welded and the wetting angle of the molten solder; taking the volume of the rotating body obtained by rotating the lower solder contour line around the central axis of the through hole for one circle as the lower solder volume of the welding spot to be welded;
optionally, the target welding-related parameters further include: empirical parameters associated with tin penetration; and the solder volume calculating unit is specifically used for taking the product of the upper solder volume of the welding spot to be welded and the empirical parameter as the lower solder volume of the welding spot to be welded.
Optionally, the pad inner and outer diameter determining module 320 is specifically configured to extract a pad foreground image and a component through hole foreground image according to the solder joint image respectively; after denoising the foreground image of the bonding pad, extracting the edge of the bonding pad, and carrying out Hough calculation by utilizing the edge of the bonding pad to determine the outer circle of the bonding pad so as to obtain the outer diameter of the bonding pad corresponding to the outer circle of the bonding pad; and after denoising the foreground image of the component through hole, extracting the edge of the component through hole, and carrying out Hough calculation by utilizing the edge of the component through hole to determine the inner circle of the bonding pad so as to obtain the inner diameter of the bonding pad corresponding to the inner circle of the bonding pad.
The automatic welding process parameter determining device can execute the automatic welding process parameter determining method provided by any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the executed automatic welding process parameter determining method.
Example IV
Fig. 14 is a schematic hardware structure of a computer device according to a fourth embodiment of the present invention. As shown in fig. 14, the computer apparatus includes a processor 410, a memory 420, an input device 430, and an output device 440; the number of processors 410 in the computer device may be one or more, one processor 410 being taken as an example in fig. 14; the processor 410, memory 420, input device 430, and output device 440 in the computer device may be connected by a bus or other means, for example in fig. 14.
The memory 420 is used as a computer readable storage medium for storing software programs, computer executable programs, and modules, such as program instructions/modules corresponding to the method for determining automatic welding process parameters in the embodiment of the present invention (e.g., the welding spot image obtaining module 310, the inner and outer diameter determining module 320, and the welding process parameter determining module 330 in the automatic welding process parameter determining apparatus shown in fig. 13). The processor 410 executes various functional applications of the computer device and data processing, i.e., implements the above-described method of determining the parameters of the automated welding process, by running software programs, instructions, and modules stored in the memory 420.
The input means 430 may be used to receive entered numeric or character information and to generate key signal inputs related to user settings and function control of the computer device. The output 440 may include a display device such as a display screen.
Example five
A fifth embodiment of the present invention also provides a computer-readable storage medium storing a computer program for executing a method of determining an automatic welding process parameter when executed by a computer processor, comprising:
Acquiring a welding spot image of a welding spot to be welded;
determining the inner diameter and the outer diameter of the welding pad of the welding spot to be welded according to the welding spot image;
and determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded so as to adjust the parameters of an automatic welding process.
Of course, the computer readable storage medium storing the computer program provided by the embodiments of the present invention is not limited to the above method operations, and may also perform the related operations in the method for determining the automatic welding process parameter provided by any embodiment of the present invention.
From the above description of embodiments, it will be clear to a person skilled in the art that the present invention may be implemented by means of software and necessary general purpose hardware, but of course also by means of hardware, although in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as a floppy disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a FLASH Memory (FLASH), a hard disk or an optical disk of a computer, etc., comprising several instructions for causing a computer device to perform the method of the embodiments of the present invention.
It should be noted that, in the embodiment of the above-mentioned determination device for automatic welding process parameters, each unit and module included are only divided according to the functional logic, but not limited to the above-mentioned division, so long as the corresponding functions can be implemented; in addition, the specific names of the functional units are also only for distinguishing from each other, and are not used to limit the protection scope of the present invention.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (6)
1. A method for determining parameters of an automated welding process, comprising:
acquiring a welding spot image of a welding spot to be welded;
Determining the inner diameter and the outer diameter of the welding pad of the welding spot to be welded according to the welding spot image;
determining a solder required volume and a solder joint heating time matched with the solder joint to be welded according to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be welded so as to adjust automatic welding process parameters;
determining a solder requirement volume and a solder joint heating time matched with the solder joint to be welded according to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be welded, wherein the method comprises the following steps:
according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, respectively calculating the upper solder volume, the through hole solder volume, the lower solder volume of the welding spot to be welded and the pin volume of the component to be welded according to target welding related parameters;
taking the sum of the upper solder volume, the through hole solder volume and the lower solder volume and subtracting the difference value obtained by the pin volume as the solder required volume;
calculating the heating time of the welding spot according to the required volume of the welding flux;
the target welding-related parameters include: the upper solder height and the molten solder wetting angle of the welding spot to be welded;
Calculating the upper solder volume of the welding spot to be welded, comprising:
determining an upper solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the outer diameter of the welding pad, the upper solder height of the welding point to be welded and the wetting angle of the molten solder;
taking the volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one circle as the upper solder volume of the welding spot to be welded;
after the determining the volume of the solder requirement matched with the solder joint to be soldered and the heating time of the solder joint, the method further comprises:
generating welding process parameter records corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of the component to be welded according to the welding flux demand volume and the welding spot heating time matched with the welding spot to be welded;
determining a solder requirement volume and a solder joint heating time matched with the solder joint to be welded according to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be welded, wherein the method comprises the following steps:
if welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded exist, determining the required volume of the welding flux and the heating time of the welding spot matched with the welding spot to be welded according to the welding process parameter records;
If the welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded do not exist, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, according to the target welding association parameters, the required volume of the welding material matched with the welding point to be welded and the heating time of the welding point are calculated.
2. The method of claim 1, wherein the target weld-related parameter further comprises: the height of the solder at the lower part of the welding spot to be welded;
calculating the lower solder volume of the welding spot to be welded, comprising:
determining a lower solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the inner diameter of the welding pad, the lower solder height of the welding point to be welded and the wetting angle of the molten solder;
taking the volume of the rotating body obtained by rotating the lower solder contour line around the central axis of the through hole for one circle as the lower solder volume of the welding spot to be welded;
or alternatively, the process may be performed,
the target welding-related parameters further include: empirical parameters associated with tin penetration;
calculating the lower solder volume of the welding spot to be welded, comprising:
taking the product of the upper solder volume of the welding spot to be welded and the experience parameter as the lower solder volume of the welding spot to be welded.
3. The method of claim 1, wherein determining the inner and outer pad diameters of the pads to be soldered based on the solder joint image comprises:
respectively extracting a welding pad foreground image and a component through hole foreground image according to the welding spot image;
after denoising the foreground image of the bonding pad, extracting the edge of the bonding pad, and carrying out Hough calculation by utilizing the edge of the bonding pad to determine the outer circle of the bonding pad so as to obtain the outer diameter of the bonding pad corresponding to the outer circle of the bonding pad;
and after denoising the foreground image of the component through hole, extracting the edge of the component through hole, and carrying out Hough calculation by utilizing the edge of the component through hole to determine the inner circle of the bonding pad so as to obtain the inner diameter of the bonding pad corresponding to the inner circle of the bonding pad.
4. An apparatus for determining parameters of an automated welding process, comprising:
the welding spot image acquisition module is used for acquiring a welding spot image of a welding spot to be welded;
the inner and outer pad diameter determining module is used for determining the inner and outer pad diameters of the welding points to be welded according to the welding point images;
a welding process parameter determination module comprising: a solder volume calculation unit and a solder joint heating time calculation unit, wherein,
The solder volume calculating unit is used for calculating the upper solder volume, the through hole solder volume, the lower solder volume of the welding spot to be welded and the pin volume of the component to be welded according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded and the target welding related parameters; taking the sum of the upper solder volume, the through hole solder volume and the lower solder volume and subtracting the difference value obtained by the pin volume as a solder demand volume;
a solder joint heating time calculation unit, configured to calculate the solder joint heating time according to the solder demand volume;
the target welding-related parameters include: the upper solder height and the molten solder wetting angle of the welding spot to be welded; the solder volume calculating unit is specifically used for determining an upper solder contour line in a higher-order curve form corresponding to the welding point to be welded according to the outer diameter of the welding pad, the upper solder height of the welding point to be welded and the molten solder wetting angle; taking the volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one circle as the upper solder volume of the welding spot to be welded;
The welding process parameter record generating module is used for generating welding process parameter records corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of the component to be welded according to the welding process parameter records matched with the welding spot to be welded after determining the welding flux requirement volume and the welding spot heating time matched with the welding spot to be welded;
the welding process parameter determining module is specifically configured to determine a required volume of solder and a heating time of a solder joint matched with the solder joint to be welded according to the welding process parameter record if there are welding process parameter records corresponding to the inner diameter of the solder joint, the outer diameter of the solder joint and the pin size of the component to be welded; if the welding process parameter records corresponding to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded do not exist, according to the inner diameter of the bonding pad, the outer diameter of the bonding pad and the pin size of the component to be welded, according to the target welding association parameters, the required volume of the welding material matched with the welding point to be welded and the heating time of the welding point are calculated.
5. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the method of determining the automatic welding process parameters according to any one of claims 1-3 when executing the program.
6. A computer-readable storage medium, on which a computer program is stored, characterized in that the program, when being executed by a processor, implements a method for determining an automatic welding process parameter according to any one of claims 1-3.
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| TWI774513B (en) * | 2021-08-12 | 2022-08-11 | 台達電子工業股份有限公司 | Automatic soldering processing system and automatic soldering processing method |
| CN114161075B (en) * | 2022-02-14 | 2022-04-29 | 北京东方国信科技股份有限公司 | Tubular workpiece synchronous rotation clamping mechanism and welding system based on visual detection |
| CN114980527B (en) * | 2022-06-24 | 2024-02-09 | 中国科学院深圳先进技术研究院 | Circuit board soldering path planning method and device and electronic equipment |
| CN115178909B (en) * | 2022-07-11 | 2023-10-27 | 苏州汇川控制技术有限公司 | Welding quality detection method and device, terminal equipment and medium |
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| CN105729475B (en) * | 2016-04-28 | 2017-11-21 | 迈力（北京）机器人科技有限公司 | Soldering tin technique storehouse method for building up and the system applied to the soldering tin technique storehouse |
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