CN112935442B - Method, device, equipment and medium for determining automatic welding process parameters - Google Patents

Abstract

The embodiment of the invention discloses a method, a device, equipment and a medium for determining automatic welding process parameters. The method comprises the following steps: acquiring a welding spot image of a welding spot to be welded; determining the inner diameter and the outer diameter of the welding pad of the welding spot to be welded according to the welding spot image; and determining the required volume of the welding flux matched with the welding spot to be welded and the heating time of the welding spot according to the inner diameter of the welding spot, the outer diameter of the welding spot and the pin size of the component to be welded so as to adjust the parameters of an automatic welding process. The technical scheme aims at determining the welding process parameters of the direct-insert type electronic components in the mixed printed circuit board, and improves the degree of automation and the system reliability.

Description

Method, device, equipment and medium for determining automatic welding process parameters

technical field

The embodiments of the present invention relate to the technical field of automatic welding, and in particular to a method, device, equipment and medium for determining automatic welding process parameters.

Background technique

With the development of digitalization, automation, computer and mechanical design technology, and the high emphasis on welding quality, automatic welding has developed into an advanced manufacturing technology.

Among them, wave soldering technology is often used for automatic soldering of in-line components. It is an automatic soldering technology that directly contacts the soldering surface of the plug-in board with high-temperature liquid tin to achieve the purpose of soldering. However, this technique has a high soldering temperature and is not suitable for hybrid printed circuit boards containing SMD components and in-line components.

For the soldering of in-line electronic components in hybrid printed circuit boards, manual soldering is currently the most commonly used method, but the manual soldering method has low efficiency, poor consistency of solder joints, and high cost. In response to this problem, automatic welding systems based on teaching and reproduction can be used instead of manual labor, but the degree of automation of these process systems is not high, and professional engineers are required to manually debug and determine welding process parameters (solder Demand, solder joint heating time), highly subjective, there is a certain degree of uncertainty.

Therefore, for the soldering of in-line electronic components in hybrid printed circuit boards, how to improve the degree of automation is an urgent problem to be solved.

Contents of the invention

Embodiments of the present invention provide a method, device, equipment and medium for determining automatic welding process parameters, so as to improve the automation degree of welding in-line electronic components in hybrid printed circuit boards.

In the first aspect, the embodiment of the present invention provides a method for determining automatic welding process parameters, including:

Obtain the solder joint image of the solder joint to be welded;

determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image;

According to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, the required volume of solder and the heating time of the solder spot matching the solder joint to be soldered are determined, so as to adjust the automatic welding process parameters.

In the second aspect, the embodiment of the present invention also provides a device for determining automatic welding process parameters, including:

Solder spot image obtaining module, is used for obtaining the spot image of spot to be welded;

A pad inner and outer diameter determining module, configured to determine the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image;

The welding process parameter determination module is used to determine the required volume of solder and the heating time of the solder spot matching the solder joint to be welded according to the inner diameter of the solder pad, the outer diameter of the solder pad and the pin size of the components to be welded, To adjust the automatic welding process parameters.

In the third aspect, the embodiment of the present invention also provides a computer device, including a memory, a processor, and a computer program stored on the memory and operable on the processor. When the processor executes the program, the computer program implemented in the present invention is realized The method for determining the automatic welding process parameters described in any of the examples.

In the fourth aspect, the embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, the automatic welding process parameters as described in any one of the embodiments of the present invention are realized. Determine the method.

In the technical solution provided by the embodiment of the present invention, the inner diameter and the outer diameter of the pad to be welded are first determined according to the image of the solder joint to be welded, and then according to the inner diameter of the solder pad, the outer diameter of the solder pad and The pin size of the components to be welded determines the required volume of solder and the heating time of the solder joints to adjust the automatic welding process parameters corresponding to the solder joints to be welded. The above technical scheme can determine the required volume of solder and the heating time of the solder joints that match the solder joints to be welded according to the inner diameter and outer diameter of the solder joints to be welded, which improves the accuracy of the automatic welding process parameters of different sizes of solder joints. Consistency, that is, the ability to determine the matching automatic welding process parameters according to the size of the solder joints to be welded. For the determination of the welding process parameters of the in-line electronic components in the hybrid printed circuit board, the degree of automation and system reliability are improved. Furthermore, the automation degree of the in-line electronic components in the soldering hybrid printed circuit board is improved, and the subjectivity and inconsistency of manually determining the soldering process parameters are avoided.

Description of drawings

Fig. 1 is a flowchart of a method for determining automatic welding process parameters in Embodiment 1 of the present invention;

FIG. 2 is an example diagram of a solder joint image in Embodiment 1 of the present invention;

3 is an example diagram of a foreground image of a pad in Embodiment 1 of the present invention;

Fig. 4 is an example diagram of the foreground image of the component through-hole in the first embodiment of the present invention;

FIG. 5 is an example diagram of a foreground denoising image of a pad in Embodiment 1 of the present invention;

FIG. 6 is an example diagram of a foreground denoising image of through holes of components in Embodiment 1 of the present invention;

FIG. 7 is an example diagram of a foreground edge image of a pad in Embodiment 1 of the present invention;

Fig. 8 is an example diagram of a foreground edge image of a through hole of a component in Embodiment 1 of the present invention;

FIG. 9 is an example diagram of the detection result of the outer circle of the pad in Embodiment 1 of the present invention;

FIG. 10 is an example diagram of the detection result of the inner circle of the pad in Embodiment 1 of the present invention;

Fig. 11 is a schematic cross-sectional view of solder joint solder in Embodiment 1 of the present invention;

Fig. 12 is a flowchart of a method for determining automatic welding process parameters in Embodiment 2 of the present invention;

Fig. 13 is a structural diagram of a device for determining automatic welding process parameters in Embodiment 3 of the present invention;

FIG. 14 is a schematic structural diagram of a computer device in Embodiment 4 of the present invention.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content. Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe various operations (or steps) as sequential processing, many of the operations may be performed in parallel, concurrently, or simultaneously. In addition, the order of operations can be rearranged. The process may be terminated when its operations are complete, but may also have additional steps not included in the figure. The processing may correspond to a method, function, procedure, subroutine, subroutine, or the like.

Embodiment one

Figure 1 is a flow chart of a method for determining automatic welding process parameters provided by Embodiment 1 of the present invention. This embodiment is applicable to the automatic welding of in-line electronic components in hybrid printed circuit boards. The method It can be performed by the device for determining automatic welding process parameters provided by the embodiment of the present invention. The device can be implemented in the form of software and/or hardware, and can generally be integrated in computer equipment, such as an industrial computer for controlling automatic welding. .

As shown in Figure 1, the method of this embodiment specifically includes:

S110. Obtain a solder joint image of the solder joint to be welded.

The solder joint to be soldered refers to an in-line solder joint to be soldered on a PCB (Printed Circuit Board, printed circuit board), for example, it may be an in-line solder joint to be soldered on a hybrid PCB. Wherein, the sizes of the solder joints to be welded are not exactly the same.

The solder spot images of the solder joints to be welded are collected by a camera, and can refer to the solder joint images shown in FIG.

S120. Determine the pad inner diameter and pad outer diameter of the solder joint to be soldered according to the solder joint image.

Recognize the image of the solder joint, identify the inner circle and outer circle of the pad to be welded, and determine the inner diameter and outer diameter of the pad respectively according to the inner circle and outer circle of the solder pad.

Wherein, the inner circle of the pad is the inner edge of the pad (that is, the outer edge of the through hole), and the outer circle of the pad is the outer edge of the pad.

If the imaging quality of the camera that collects the solder joint image is high and the noise in the solder joint image is less, the Hough transform process can be directly performed on the solder joint image to extract the inner circle and outer circle of the solder joint in the solder joint image, and then Obtain the pad inner diameter and pad outer diameter of the solder joint to be soldered.

If the imaging quality of the camera that collects the image of the solder joint is not high, and the response to light is more noisy in the image of the solder joint, you can first preprocess the image of the solder joint to eliminate noise, and then perform preprocessing on the solder joint after preprocessing The image is subjected to Hough transform processing to extract the inner circle and outer circle of the pad in the image of the solder joint, and then obtain the inner diameter and outer diameter of the solder joint to be welded.

As an optional implementation manner, determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image may specifically be:

extracting pad foreground images and component through-hole foreground images respectively according to the solder joint images;

After denoising the foreground image of the pad, extract the edge of the pad, and use the edge of the pad to perform Hough calculation, determine the outer circle of the pad, and obtain the outer diameter of the pad corresponding to the outer circle of the pad ;

After denoising the foreground image of the through hole of the component, extract the edge of the through hole of the component, and use the edge of the through hole of the component to perform Hough calculation to determine the inner circle of the pad, and obtain the inner circle of the pad. Corresponding pad inner diameter.

The foreground image of the pad refers to the image with the pad area as the region of interest; the foreground image of the through hole of the component refers to the image with the through hole of the component as the region of interest.

Due to the different colors of component through holes and pads, the solder joint image can be processed with masks of different color ranges to extract the pad foreground image and component through hole foreground image. Firstly, the solder joint image is converted from RGB image to HSV image, and then the color space converted solder joint image is processed by using masks with different color ranges respectively to obtain the pad foreground image and component via hole foreground image. Taking Figure 2 as an example, the foreground image of the pad is shown in Figure 3, and the foreground image of the through hole of the component is shown in Figure 4.

Due to the large amount of noise in the pad foreground image and component through-hole foreground image, in order to improve the effect of edge extraction, the pad foreground image and component through-hole foreground image are denoised separately to obtain the pad foreground denoised image and component through-hole foreground denoising image, for example, the pad foreground image and component through-hole foreground image can be respectively opened to eliminate noise in the pad foreground image and component through-hole foreground image. Exemplarily, the opening operation is performed on the foreground image of the pad as shown in Figure 3 to obtain the denoised image of the foreground of the pad as shown in Figure 5; the opening operation is performed on the foreground image of the through hole of the component as shown in Figure 4 Operation, to obtain the foreground denoising image of the component through-hole as shown in Figure 6.

After denoising the pad foreground image and component through-hole foreground image, edge extraction is performed to obtain the pad foreground edge image and component through-hole foreground edge image. Exemplarily, edge extraction is performed on the foreground denoising image of the pad as shown in FIG. 5 to obtain the foreground edge image of the pad as shown in FIG. 7; The edge is extracted, and the foreground edge image of the through hole of the component is obtained as shown in Figure 8.

Using the edge points in the foreground edge image of the pad and the foreground edge image of the through hole of the component to perform the Hough operation, the two circles with the highest probability in the parameter space are voted out as the outer circle of the pad and the inner circle of the pad. Exemplarily, use the edge points of the foreground edge image of the pad as shown in FIG. 7 to perform Hough operation, and vote the circle with the highest probability in the parameter space as the outer circle of the pad, as shown in circle 1 in FIG. 9; Hough operation is performed on the edge points of the foreground edge image of the through hole of the component shown in Figure 8, and the circle with the highest probability in the parameter space is voted as the inner circle of the pad, as shown in circle 2 in Figure 10.

After obtaining the outer circle of the pad and the inner circle of the pad, the outer diameter of the pad corresponding to the outer circle of the pad and the inner diameter of the pad corresponding to the inner circle of the pad can be determined.

To determine the automatic welding process parameters of in-line solder joints, first obtain the size information of the solder joints, including the inner diameter of the pad, the outer diameter of the pad, and the thickness of the printed circuit board. The thickness of the same batch of printed circuit boards can be obtained by one measurement. Therefore, in practical applications, it is only necessary to measure the inner and outer diameters of the solder pads of each in-line solder joint on the hybrid circuit board by means of machine vision. In the above embodiments, the size of the solder joints is measured by using the Hough transform method.

S130. According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be soldered, determine the required volume of solder matching the solder joint to be soldered and the heating time of the solder joint, so as to adjust the automatic welding process parameters.

The pin size of the component to be soldered can be the cross-sectional area of the pin or the cross-sectional diameter of the pin. Wherein, the pin size of the components to be welded can be obtained through pre-measurement or calculation.

The pad inner diameter and pad outer diameter of the solder joints to be soldered are different, and the pin sizes of the components to be soldered are different, and the automatic welding process parameters corresponding to the solder joints to be soldered and the components to be soldered are different. According to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered, as the automatic welding process parameters that match the solder joint to be soldered , so as to realize the automatic welding operation of the welding spot and components to be welded according to the automatic welding process parameters matched with the welding spot to be welded.

As an optional implementation, according to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder point that match the solder joint to be soldered , which can be specified as:

According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, according to the target welding related parameters, the required volume of solder and the heating time of the solder spot matching the solder joint to be welded are calculated.

Wherein, the target soldering related parameters refer to the soldering related parameters that match the same batch of printed circuit boards to be welded, for example, the thickness of the printed circuit board, the soldering height of the solder, the soldering temperature, the material of the solder, the shape of the solder (such as the shape of the wire solder) Radius), solder welding height, speed of solder conveyor, etc.

The solder on the ideal soldered spot should be evenly and symmetrically distributed, and a calculation model can be generated in advance according to the shape of the solder on the ideal soldered spot, and then according to the calculation model, according to the inner diameter of the pad, the solder The outer diameter of the disk, the pin size of the components to be welded, and the above-mentioned target welding related parameters are used to calculate the required volume of solder and the heating time of the solder joints matched by the solder joints to be welded.

Further, as an optional implementation, according to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, according to the target welding associated parameters, the calculation and the welding to be welded The volume of solder required for point matching and the heating time of solder joints are as follows:

Calculate the upper solder volume, through-hole solder volume, and lower solder volume of the solder joint to be soldered according to the inner diameter of the solder pad, the outer diameter of the solder pad, and the pin size of the components to be soldered, and according to the target soldering related parameters. , and the pin volume of the components to be welded;

taking the cumulative sum of the upper solder volume, the through-hole solder volume and the lower solder volume, and subtracting the pin volume as the required solder volume;

The solder spot heating time is calculated according to the required solder volume.

As shown in Figure 11, the solder volume can be roughly divided into upper solder volume, via solder volume and lower solder volume. It should be pointed out that the upper solder volume, the through-hole solder volume and the lower solder volume in this embodiment all include part of the lead volume of the components to be soldered.

According to the pre-generated calculation model, the upper solder volume V ₁ , the through-hole solder volume V ₂ and the lower solder volume V ₃ are respectively calculated according to the outer diameter R ₁ of the pad, the inner diameter R ₂ of the pad and the target soldering related parameters.

Assuming that the pin cross-sectional area of the component to be soldered is S _pin , the thickness of the printed circuit board is d, the height of the upper solder (that is, the soldering thickness of the upper solder) is H, and the height of the lower solder (that is, the soldering thickness of the lower solder) is h, then the required volume of solder is: V=V ₁ +V ₂ +V ₃ -S _pin ×(d+H+h).

where the through-hole solder volume is:

Further, calculating the heating time of the solder joint according to the required volume of the solder may be specifically:

计算所述待焊接焊点的焊点加热时间T；其中，by formula

Calculating the spot heating time T of the spot to be welded; Wherein,

V is the volume of solder required for the solder joint to be soldered, v _s is the speed of the solder conveying device, r ₀ is the radius of the filamentary solder.

As an optional implementation manner, the target soldering related parameters include: the solder height at the upper part of the solder joint to be soldered and the wetting angle of molten solder. Among them, the wetting angle of the molten solder is related to the welding material and the welding temperature, and can be determined by consulting the material wetting angle table after obtaining the solder used in the automatic welding system and the welding temperature.

Correspondingly, calculating the upper solder volume of the solder joint to be welded can be specifically:

According to the outer diameter of the pad, the height of the upper solder of the solder joint to be soldered and the wetting angle of the molten solder, determine the upper solder contour line in the form of a high-order curve corresponding to the solder joint to be soldered; The volume of the rotating body obtained by rotating the solder contour line around the central axis of the through hole for one revolution is used as the upper solder volume of the solder joint to be soldered.

Similarly, as an optional implementation manner, the target welding associated parameters further include: the height of the solder at the lower part of the solder joint to be soldered and the wetting angle of the molten solder; Volume, which can be specified as:

According to the inner diameter of the pad, the height of the solder at the lower part of the solder joint to be soldered and the wetting angle of the molten solder, determine the lower solder contour line in the form of a high-order curve corresponding to the solder joint to be soldered; The volume of the rotating body obtained by rotating the contour line around the central axis of the through hole for one revolution is used as the lower solder volume of the solder joint to be soldered.

The shape of the solder on the standard soldered spot is a concave cone. In this embodiment, a high-order curve can be used to approximate the longitudinal cross-sectional profile of the upper solder volume and the lower solder volume of the ideal solder joint. Specifically, firstly, the upper solder shape and the lower solder shape can be regarded as a body of revolution obtained by rotating a high-order curve around an axis, and the volume of this part of solder can be calculated by using a method for calculating the volume of a body of revolution.

Assume that the center of the pad to be soldered on the upper surface of the printed circuit board is the origin, the vertical upward direction is the positive direction of the z-axis, and the direction from the center of the through hole horizontally to the upper right edge of the pad is the positive direction of the x-axis. Therefore, as shown in Figure 11, taking the contour line of the left half of the upper solder joint as an example, the upper solder contour line can be expressed as:

z ₁ (x)=a ₃ (x+R ₁ ) ³ +a ₂ (x+R ₁ ) ² +a ₁ (x+R ₁ )+a ₀ ;

其中，Its boundary conditions are:

in,

a ₀ , a ₁ , a ₂ , and a ₃ are coefficients, R ₁ is the outer diameter of the pad, H is the height of the upper solder, and α is the wetting angle of the molten solder.

S₁为上部焊料任一横截面的面积。In turn, the upper solder volume is

S ₁ is the area of any cross-section of the upper solder.

Optionally, the height of the upper solder is 1.0-1.2 times the outer diameter of the pad.

Similarly, assume that the center of the pad to be soldered on the upper surface of the printed circuit board is the origin, the vertical upward direction is the positive direction of the z-axis, and the direction from the center of the through hole horizontally to the lower right edge of the pad is the positive direction of the x-axis (not shown in the figure) shown), taking the outline of the right half of the lower part of the solder joint as an example, the lower solder outline can be expressed as:

z ₂ (x)=b ₃ (xr) ³ +b ₂ (xr) ² +b ₁ (xr)+b ₀ ;

其中，Its boundary conditions are:

in,

b ₀ , b ₁ , b ₂ , b ₃ are coefficients, r is the radius of the maximum cross-sectional area of the lower solder, h is the height of the lower solder, and α is the wetting angle of the molten solder. Among them, r and h are related to the requirement of solder penetration rate.

S₂为下部焊料任一横截面的面积。In turn, the lower solder volume is

S ₂ is the area of any cross-section of the lower solder.

In the above embodiment, a mathematical modeling method for the shape of a standard solder joint is provided, using a high-order curve to fit the shape of the solder in the standard solder joint, and using the solution method for the volume of a rotating body to calculate the volume of the solder in the solder joint to It ensures the consistency of automatic welding process parameters of different sizes of solder joints.

As an optional implementation manner, the target welding related parameters also include: empirical parameters associated with the tin penetration rate; correspondingly, calculating the lower solder volume of the solder joint to be welded may be specifically:

The product of the upper solder volume of the solder joint to be soldered and the empirical parameter is used as the lower solder volume of the solder joint to be soldered.

The empirical parameters associated with the tin penetration rate are parameters pre-selected according to the individual requirements of the tin penetration rate, and its value range is (0,1].

In this embodiment, in order to reduce the amount of calculation of the solder volume, the upper solder volume and the empirical parameter γ can be used to estimate the lower solder volume, that is, the product of the upper solder volume and the empirical parameter γ is used as the upper solder volume, that is: V ₃ = γV ₁ , 0<γ≤1.

Further, in this embodiment, the calculation model for calculating the required volume of solder can be written as follows:

V=C(R ₁ ,R ₂ ,d,S _pin ,α,γ); Among them, the function C represents the calculation function of the required volume of solder, and its independent variables are: the size of the solder joint (R ₁ ,R ₂ ), the printed circuit Board thickness d, component pin cross-sectional area S _pin , molten solder wetting angle α related to soldering temperature and solder material, and empirical parameter γ.

In this embodiment, by modeling the topography of high-quality solder joints, the relationship between the amount of solder in standard solder joints and the size of solder joints is determined, and the automatic parameterization of solder joints can be improved by using a computer to automatically determine parameters based on the calculation model. consistency.

It should be pointed out that both the pin cross-sectional area S _pin and the thickness d of the printed circuit board can be determined by pre-measurement. Furthermore, based on the inner diameter and outer diameter of the solder pad measured by the machine vision, the required solder volume of the solder joint can be calculated, and the heating time of the solder joint can be calculated based on the required solder volume.

In the technical solution provided by the embodiment of the present invention, the inner diameter and the outer diameter of the pad to be welded are first determined according to the image of the solder joint to be welded, and then according to the inner diameter of the solder pad, the outer diameter of the solder pad and The pin size of the components to be welded determines the required volume of solder and the heating time of the solder joints to adjust the automatic welding process parameters corresponding to the solder joints to be welded. The above technical scheme can determine the required volume of solder and the heating time of the solder joints that match the solder joints to be welded according to the inner diameter and outer diameter of the solder joints to be welded, which improves the accuracy of the automatic welding process parameters of different sizes of solder joints. Consistency, that is, the ability to determine the matching automatic welding process parameters according to the size of the solder joints to be welded. For the determination of the welding process parameters of the in-line electronic components in the hybrid printed circuit board, the degree of automation and system reliability are improved. Furthermore, the automation degree of the in-line electronic components in the soldering hybrid printed circuit board is improved, and the subjectivity and inconsistency of manually determining the soldering process parameters are avoided.

Embodiment two

FIG. 12 is a flow chart of a method for determining automatic welding process parameters provided by Embodiment 2 of the present invention. This embodiment is embodied on the basis of the foregoing embodiments, wherein, after determining the required volume of solder and the heating time of the solder joint that match the solder joint to be welded, it further includes:

generating a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded according to the required volume of solder matched with the solder joint to be welded and the heating time of the solder joint;

Correspondingly, according to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered, which can be specifically:

If there is a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, then determine the solder that matches the solder joint to be welded according to the welding process parameter record Required volume and solder joint heating time;

If there is no welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, then according to the inner diameter of the pad, the outer diameter of the pad and the component to be welded According to the pin size of the device, according to the target welding related parameters, the required volume of solder and the heating time of the solder joint matching the solder joint to be welded are calculated.

In this embodiment, after determining the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered, the required volume of solder and the heating time of the solder joint can be combined with the solder joint to be soldered and the lead of the components to be soldered. The foot size information is stored together as a welding process parameter record. Among them, a welding process parameter record can include: pad inner diameter, pad outer diameter, pin size (cross-sectional area or pin cross-sectional diameter or pin cross-sectional radius), solder required volume and Solder spot heating time. Optionally, the welding process parameter record may also include the thickness of the printed circuit board, the wetting angle of the molten solder, empirical parameters, etc., which are not specifically limited in this embodiment.

Optionally, the generated welding process parameter records are stored in the welding point information database. Wherein, before the current batch of printed circuit boards is soldered, the solder joint information database corresponding to the current batch of printed circuit boards may be empty.

Furthermore, after determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image, firstly, according to the inner diameter of the solder pad, the outer diameter of the pad and the lead of the component to be welded Size, query the solder joint information database, and judge whether there is a matching welding process parameter record. If so, then determine the required volume of solder and the heating time of the solder joint according to the matching welding process parameter record. If not, then according to the inner diameter of the pad, The outer diameter of the pad and the pin size of the component to be welded are calculated according to the target soldering related parameters, and the required volume of solder and the heating time of the soldered spot that match the soldered spot to be welded are calculated, and according to the calculated required volume of solder and Solder spot heating time generates corresponding welding process parameter records for storage.

As shown in Figure 12, the method of this embodiment specifically includes:

S210. Obtain a solder joint image of the solder joint to be welded.

S220. Determine the pad inner diameter and pad outer diameter of the solder joint to be soldered according to the solder joint image.

Optionally, firstly, a pad foreground image and a component through-hole foreground image are respectively extracted according to the solder joint image.

Secondly, after denoising the foreground image of the pad, extract the edge of the pad, and use the edge of the pad to perform Hough calculation, determine the outer circle of the pad, and obtain the pad corresponding to the outer circle of the pad outer diameter;

Again, after denoising the foreground image of the through hole of the component, extract the edge of the through hole of the component, and use the edge of the through hole of the component to perform Hough calculation, determine the inner circle of the pad, and obtain the The inner diameter of the pad corresponding to the inner circle.

S230. Determine whether there is a welding process parameter record matching the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded. If yes, execute S240; if not, execute S250.

S240. According to the welding process parameter records, determine the required volume of solder and the heating time of the solder joints that match the solder joints to be welded, so as to adjust the automatic welding process parameters.

S250. According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the components to be welded, according to the target welding related parameters, calculate the required volume of solder and the heating time of the solder joints that match the solder joints to be welded.

Optionally, according to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be soldered, the upper solder volume V ₁ and the through hole of the solder joint to be soldered are respectively calculated according to the target soldering related parameters. Solder volume V ₂ , lower solder volume V ₃ , and the lead volume of the component to be soldered; the sum of the upper solder volume V ₁ , through-hole solder volume V ₂ and lower solder volume V ₃ is subtracted from the lead The difference obtained by the volume S _pin × (d+H+h) is used as the required volume V of the solder; the heating time T of the solder joint is calculated according to the required volume V of the solder.

in:

z ₁ (x)=a ₃ (x+R ₁ ) ³ +a ₂ (x+R ₁ ) ² +a ₁ (x+R ₁ )+a ₀ ;

V＝V ₁ +V ₂ +V ₃ -S _pin ×(d+H+h);

S260. Generate and store welding process parameter records matching the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded according to the required volume of solder and the heating time of the soldered joint.

For details not explained in this embodiment, please refer to the foregoing embodiments, and details are not repeated here.

In the above technical scheme, the volume of solder and heating time required for in-line solder joints of different sizes are calculated by scientific calculation methods, which improves the production efficiency of the automatic electronic welding system and avoids the subjectivity and inconsistency of manual parameter setting sex. In addition, the welding process parameter records are generated and stored for the same batch of printed circuit boards, avoiding repeated calculation of welding process parameters for the same size in-line solder joints, and reducing the waste of computing power.

Experiments have proved that the technical solution provided by this embodiment can accurately determine the automatic welding process parameters for solder joints of different sizes, so that the appearance of the welded joints obtained after automatic welding is standard and consistent. As shown in Table 1, the solder volume determined according to the technical solution is consistent with the optimized solder volume parameters determined by manual experiments.

Table 1

Embodiment three

Fig. 13 is a schematic structural diagram of a device for determining automatic welding process parameters provided by Embodiment 3 of the present invention. The device can be implemented in the form of software and/or hardware, and can generally be integrated in computing equipment, for example, it can be used for Control the industrial computer of automatic welding. As shown in FIG. 13 , the device includes: a welding point image acquisition module 310 , a welding pad inner and outer diameter determination module 320 and a welding process parameter determination module 330 . in,

Welding point image acquisition module 310, for obtaining the welding point image of the welding spot to be welded;

A pad inner and outer diameter determining module 320, configured to determine the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image;

The welding process parameter determination module 330 is used to determine the required volume of solder and the heating time of the welding spot matching the welding spot to be welded according to the inner diameter of the welding pad, the outer diameter of the welding pad and the pin size of the components to be welded , to adjust the automatic welding process parameters.

In the technical solution provided by the embodiment of the present invention, the inner diameter and the outer diameter of the pad to be welded are first determined according to the image of the solder joint to be welded, and then according to the inner diameter of the solder pad, the outer diameter of the solder pad and The pin size of the components to be welded determines the required volume of solder and the heating time of the solder joints to adjust the automatic welding process parameters corresponding to the solder joints to be welded. The above technical scheme can determine the required volume of solder and the heating time of the solder joints that match the solder joints to be welded according to the inner diameter and outer diameter of the solder joints to be welded, which improves the accuracy of the automatic welding process parameters of different sizes of solder joints. Consistency, that is, the ability to determine the matching automatic welding process parameters according to the size of the solder joints to be welded. For the determination of the welding process parameters of the in-line electronic components in the hybrid printed circuit board, the degree of automation and system reliability are improved. Furthermore, the automation degree of the in-line electronic components in the soldering hybrid printed circuit board is improved, and the subjectivity and inconsistency of manually determining the soldering process parameters are avoided.

In an optional implementation, the welding process parameter determination module 330 is specifically configured to calculate according to the target welding related parameters according to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the components to be welded. The required volume of solder and the heating time of the solder joints matched with the solder joints to be welded.

In an optional implementation manner, the above-mentioned device further includes: a welding process parameter record generation module, which is used to determine the required volume of solder and the heating time of the welding spot matching the welding spot to be welded, according to the The volume of solder required for welding the solder joint and the heating time of the solder joint are matched, and a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded is generated;

Correspondingly, the welding process parameter determination module 330 is specifically configured to, if there is a welding process parameter record corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad, and the pin size of the component to be welded, then according to the welding process Parameter records determine the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered; if there is no welding process corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be soldered According to the parameter record, according to the inner diameter of the pad, the outer diameter of the pad and the pin size of the components to be welded, according to the target welding related parameters, calculate the required volume of solder and the heating of the solder joints that match the solder joints to be welded time.

Further, the welding process parameter determination module 330 includes: a solder volume calculation unit and a solder spot heating time calculation unit, wherein,

The solder volume calculation unit is used to calculate the upper solder volume of the solder joint to be soldered according to the inner diameter of the solder pad, the outer diameter of the solder pad, and the pin size of the components to be soldered, and according to the target soldering related parameters. Hole solder volume, lower solder volume, and lead volume of the component to be soldered; subtract the lead volume from the cumulative sum of the upper solder volume, the through-hole solder volume, and the lower solder volume The difference obtained is used as the required volume of solder;

The solder joint heating time calculation unit is configured to calculate the solder joint heating time according to the required volume of solder.

Optionally, the target welding associated parameters include: the height of the upper solder of the solder joint to be soldered and the wetting angle of the molten solder; a solder volume calculation unit, specifically configured to The height of the upper solder and the wetting angle of the molten solder determine the upper solder contour line in the form of a high-order curve corresponding to the solder joint to be soldered; the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one revolution The volume of is used as the upper solder volume of the solder joint to be soldered.

Optionally, the target welding associated parameters further include: the height of the solder below the solder joint to be soldered; a solder volume calculation unit, specifically configured to calculate the The molten solder wetting angle determines the lower solder contour line in the form of a high-order curve corresponding to the solder joint to be soldered; the volume of the rotating body obtained by rotating the lower solder contour line around the central axis of the through hole for one week is used as the volume of the to-be-soldered solder joint The lower solder volume of the solder joint;

Optionally, the target welding associated parameters further include: empirical parameters associated with the tin penetration rate; a solder volume calculation unit, specifically configured to use the product of the upper solder volume of the solder joint to be welded and the empirical parameters as the Describes the lower solder volume of the solder joint to be soldered.

Optionally, the inner and outer diameter determination module 320 of the pad is specifically used to extract the foreground image of the pad and the foreground image of the through hole of the component according to the solder joint image; after denoising the foreground image of the pad, extract the solder joint The edge of the pad, and use the edge of the pad to perform Hough calculation to determine the outer circle of the pad, and obtain the outer diameter of the pad corresponding to the outer circle of the pad; after denoising the through-hole foreground image of the component , extract the edge of the through hole of the component, and use the edge of the through hole of the component to perform Hough calculation, determine the inner circle of the pad, and obtain the inner diameter of the pad corresponding to the inner circle of the pad.

The above-mentioned device for determining automatic welding process parameters can execute the method for determining automatic welding process parameters provided by any embodiment of the present invention, and has corresponding functional modules and beneficial effects of the executed automatic welding process parameter determining method.

Embodiment Four

FIG. 14 is a schematic diagram of a hardware structure of a computer device provided by Embodiment 4 of the present invention. As shown in Figure 14, the computer equipment includes a processor 410, a memory 420, an input device 430 and an output device 440; the number of processors 410 in the computer equipment can be one or more, and one processor 410 is taken as an example in Figure 14 ; The processor 410, the memory 420, the input device 430 and the output device 440 in the computer device can be connected through a bus or in other ways. In FIG. 14, the connection through a bus is taken as an example.

The memory 420, as a computer-readable storage medium, can be used to store software programs, computer-executable programs and modules, such as program instructions/modules corresponding to the method for determining automatic welding process parameters in the embodiment of the present invention (for example, as shown in FIG. 13 The solder joint image acquisition module 310, the welding pad inner and outer diameter determination module 320 and the welding process parameter determination module 330 in the automatic welding process parameter determination device shown in the figure). The processor 410 executes various functional applications and data processing of the computer equipment by running the software programs, instructions and modules stored in the memory 420 , that is, realizes the method for determining the above-mentioned automatic welding process parameters.

The memory 420 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system and at least one application required by a function; the data storage area may store data created according to the use of the computer device, and the like. In addition, the memory 420 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid-state storage devices. In some examples, the memory 420 may further include memory located remotely from the processor 410, and these remote memories may be connected to the computer device through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The input device 430 can be used to receive input numbers or character information, and generate key signal input related to user settings and function control of the computer equipment. The output device 440 may include a display device such as a display screen.

Embodiment five

Embodiment 5 of the present invention also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a computer processor, the computer program is used to perform a method for determining automatic welding process parameters, including:

Obtain the solder joint image of the solder joint to be welded;

determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image;

According to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, the required volume of solder and the heating time of the solder spot matching the solder joint to be soldered are determined, so as to adjust the automatic welding process parameters.

Of course, for the computer-readable storage medium stored with the computer program provided by the embodiment of the present invention, the computer program is not limited to the operation of the above method, and can also execute the method for determining the automatic welding process parameters provided by any embodiment of the present invention. related operations.

Through the above description about the implementation mode, those skilled in the art can clearly understand that the present invention can be realized by means of software and necessary general-purpose hardware, and of course it can also be realized by hardware, but in many cases the former is a better implementation mode . Based on this understanding, the essence of the technical solution of the present invention or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as a floppy disk of a computer , read-only memory (Read-Only Memory, ROM), random access memory (RandomAccess Memory, RAM), flash memory (FLASH), hard disk or optical disk etc., comprise several instructions in order to make a computer equipment carry out various embodiments of the present invention Methods.

It is worth noting that, in the above-mentioned embodiment of the automatic welding process parameter determination device, the included units and modules are only divided according to functional logic, but are not limited to the above-mentioned division, as long as the corresponding functions can be realized ; In addition, the specific names of each functional unit are only for the convenience of distinguishing each other, and are not used to limit the protection scope of the present invention.

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.

Claims (6)

1. A method for determining automatic welding process parameters, characterized in that, comprising: Obtain the solder joint image of the solder joint to be welded; determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image; According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder joint that match the solder joint to be welded, so as to adjust the automatic welding process parameters; According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered, including: Calculate the upper solder volume, through-hole solder volume, and lower solder volume of the solder joint to be soldered according to the inner diameter of the solder pad, the outer diameter of the solder pad, and the pin size of the components to be soldered, and according to the target soldering related parameters. , and the pin volume of the components to be welded; taking the cumulative sum of the upper solder volume, the through-hole solder volume and the lower solder volume, and subtracting the pin volume as the required solder volume; calculating the solder joint heating time according to the required volume of solder; The target soldering associated parameters include: the upper solder height and the molten solder wetting angle of the solder joint to be soldered; Calculate the upper solder volume of the solder joint to be soldered, including: determining an upper solder contour in the form of a high-order curve corresponding to the solder joint to be soldered according to the outer diameter of the pad, the height of the upper solder of the solder joint to be soldered, and the wetting angle of the molten solder; The volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one circle is used as the upper solder volume of the solder joint to be soldered; After the determination of the required volume of solder and the heating time of the solder joints matched with the solder joints to be welded, it also includes: generating a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded according to the required volume of solder matched with the solder joint to be welded and the heating time of the solder joint; According to the inner diameter of the pad, the outer diameter of the pad, and the pin size of the component to be welded, determine the required volume of solder and the heating time of the solder joint that match the solder joint to be soldered, including: If there is a welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, then determine the solder that matches the solder joint to be welded according to the welding process parameter record Required volume and solder joint heating time; If there is no welding process parameter record corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded, then according to the inner diameter of the pad, the outer diameter of the pad and the component to be welded According to the pin size of the device, according to the target welding related parameters, the required volume of solder and the heating time of the solder joint matching the solder joint to be welded are calculated. 2. The method according to claim 1, wherein the target welding related parameters further comprise: the height of the solder at the lower part of the solder joint to be welded; Calculate the lower solder volume of the solder joint to be soldered, including: determining a lower solder contour in the form of a high-order curve corresponding to the solder joint to be soldered according to the inner diameter of the pad, the height of the lower solder of the solder joint to be soldered, and the wetting angle of the molten solder; The volume of the rotating body obtained by rotating the lower solder contour line around the central axis of the through hole for a circle is used as the lower solder volume of the solder joint to be soldered; or, The target welding associated parameters also include: empirical parameters associated with tin penetration rate; Calculate the lower solder volume of the solder joint to be soldered, including: The product of the upper solder volume of the solder joint to be soldered and the empirical parameter is used as the lower solder volume of the solder joint to be soldered. 3. The method according to claim 1, wherein determining the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image comprises: extracting pad foreground images and component through-hole foreground images respectively according to the solder joint images; After denoising the foreground image of the pad, extract the edge of the pad, and use the edge of the pad to perform Hough calculation, determine the outer circle of the pad, and obtain the outer diameter of the pad corresponding to the outer circle of the pad ; After denoising the foreground image of the through hole of the component, extract the edge of the through hole of the component, and use the edge of the through hole of the component to perform Hough calculation to determine the inner circle of the pad, and obtain the inner circle of the pad. Corresponding pad inner diameter. 4. A device for determining automatic welding process parameters, characterized in that it comprises: Solder spot image obtaining module, is used for obtaining the spot image of spot to be welded; A pad inner and outer diameter determining module, configured to determine the pad inner diameter and pad outer diameter of the solder joint to be welded according to the solder joint image; The welding process parameter determination module includes: a solder volume calculation unit and a solder spot heating time calculation unit, wherein, The solder volume calculation unit is used to calculate the upper solder volume of the solder joint to be soldered according to the inner diameter of the solder pad, the outer diameter of the solder pad, and the pin size of the components to be soldered, and according to the target soldering related parameters. Hole solder volume, lower solder volume, and lead volume of the component to be soldered; subtract the lead volume from the cumulative sum of the upper solder volume, the through-hole solder volume, and the lower solder volume The obtained difference is used as the required volume of solder; A solder joint heating time calculation unit, configured to calculate the solder joint heating time according to the required volume of solder; The target welding related parameters include: the upper solder height of the solder joint to be soldered and the wetting angle of the molten solder; a solder volume calculation unit, which is specifically used to The height and the wetting angle of the molten solder determine the upper solder contour line in the form of a high-order curve corresponding to the solder joint to be soldered; the volume of the rotating body obtained by rotating the upper solder contour line around the central axis of the through hole for one cycle as the upper solder volume of the solder joint to be soldered; A welding process parameter record generating module, configured to generate a soldering point according to the required volume of solder and heating time of the soldering point matching the soldering point to be welded after determining the required volume of solder and the heating time of the soldering point matching the soldering point to be soldered A record of welding process parameters corresponding to the inner diameter of the pad, the outer diameter of the pad and the pin size of the component to be welded; The welding process parameter determination module is specifically configured to: if there is a welding process parameter record corresponding to the inner diameter of the welding pad, the outer diameter of the welding pad, and the pin size of the component to be welded, then according to the welding process parameter record Determine the required solder volume and solder spot heating time that match the solder joint to be soldered; if there is no welding process parameter record corresponding to the inner diameter of the solder pad, the outer diameter of the solder pad, and the pin size of the component to be soldered , then according to the inner diameter of the pad, the outer diameter of the pad and the pin size of the components to be welded, according to the target welding related parameters, calculate the required volume of solder and the heating time of the solder joints that match the solder joints to be soldered. 5. A computer device, comprising a memory, a processor, and a computer program stored on the memory and operable on the processor, characterized in that, when the processor executes the program, it realizes any of claims 1-3. A method for determining the automatic welding process parameters. 6. A computer-readable storage medium, on which a computer program is stored, wherein when the program is executed by a processor, the method for determining automatic welding process parameters according to any one of claims 1-3 is realized.

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