CN112929039A

CN112929039A - High-frequency module and communication device

Info

Publication number: CN112929039A
Application number: CN202110213295.0A
Authority: CN
Inventors: 李品晖; 赵鲁豫; 何刚; 康超
Original assignee: Zhejiang Haitong Communication Electronics Co ltd
Current assignee: Zhejiang Haitong Communication Electronics Co ltd
Priority date: 2021-02-25
Filing date: 2021-02-25
Publication date: 2021-06-08
Anticipated expiration: 2041-02-25
Also published as: CN112929039B

Abstract

The invention relates to a high-frequency module and a communication device, which are characterized in that: including first power amplifier and second power amplifier, still built-in first switch and second switch of having, be provided with first output port between first power amplifier and the first switch, the opposite side of first switch is provided with the connection port with external intercommunication, first switch is provided with the first input port that is in first output port one side, be provided with the second output port between second power amplifier and the second switch, the opposite side of first switch is provided with the first connection port with external intercommunication, the opposite side of second switch is provided with the second connection port with external intercommunication, first switch is provided with the first input port that is in first output port one side, the second switch is provided with the second input port that is in second output port one side. The invention has the advantages of miniaturization and low cost.

Description

High-frequency module and communication device

Technical Field

The invention relates to the technical field of communication, in particular to a high-frequency module and a communication device.

Background

In recent years, as the demand for frequency bands has increased, 3GPP has defined many frequency bands for 4G/5G, and thus it is required that a communication terminal can support a plurality of communication bands and a plurality of modes. However, with the increase of the supported frequency bands, the number of components and the board layout area of the PCB of the terminal device are inevitably increased, which brings a problem to the trend of terminal miniaturization.

Some designs have been developed in consideration of the fact that the reception frequency of some bands overlaps with the transmission frequency of other bands, for example, the reception Band of Band29 is included in the transmission Band of Band 28A, and the reception filter of Band29 can be shared with the transmission filter of Band 28A. This makes it possible to realize a circuit configuration in which a filter dedicated to Band29 is not provided.

However, in such a high-frequency module, a first switch disposed between the antenna and the duplexer and a second switch disposed between the duplexer and the amplifier circuit are provided. This configuration therefore has the following problems: despite the elimination of filters dedicated to band29, the space occupation is still large with the addition of switches and thus remains to be improved.

Disclosure of Invention

In view of the disadvantages of the prior art, an object of the present invention is to provide a high frequency module and a communication device, which have the advantages of miniaturization and low cost.

In order to achieve the purpose, the invention provides the following technical scheme: a high frequency module, characterized by: including first power amplifier and second power amplifier, still built-in first switch and second switch of having, be provided with first output port between first power amplifier and the first switch, the opposite side of first switch is provided with the connection port with external intercommunication, first switch is provided with the first input port that is in first output port one side, be provided with the second output port between second power amplifier and the second switch, the opposite side of first switch is provided with the first connection port with external intercommunication, the opposite side of second switch is provided with the second connection port with external intercommunication, first switch is provided with the first input port that is in first output port one side, the second switch is provided with the second input port that is in second output port one side.

Preferably, the first connection port and the second connection port may be provided in plurality.

Another object of the present invention is to provide a communication device including a high frequency module, further comprising a duplexer, a main switch, an antenna, an RF signal processing circuit, and a baseband signal processing circuit, wherein the duplexer includes four multiplexers, and the four multiplexers are respectively named as a first multiplexer, a second multiplexer, a third multiplexer, and a fourth multiplexer.

Preferably, the communication device may transmit an a high frequency signal and a C high frequency signal, the communication device may receive a B band signal and a D band signal, the transmission band of the band a includes a reception band signal of the band B, and the transmission band of the band C includes a reception band of the band D.

In conclusion, the invention has the following beneficial effects:

the present invention is applicable to the use of two frequency bands having an inclusion relationship in which the transmission frequency band of one communication band and the reception frequency band of the other communication band overlap, and also to the use of a plurality of frequency bands having an inclusion relationship in which the reception filter is common to the transmission filter.

The present invention can simplify and miniaturize a circuit configuration while transmitting a high-frequency signal of a frequency band, simplify a circuit configuration when transmitting a high-frequency signal of a plurality of communication bands including two or more communication bands, and provide a high-frequency module and a communication device which can realize miniaturization and low cost.

Drawings

Fig. 1 is a circuit configuration diagram of a high-frequency module 100 and a communication apparatus 1;

fig. 2 is a diagram illustrating a portion of a communication band applicable to the high frequency module 100 of the present invention;

fig. 3 illustrates the signal path in the frequency band C, taking the n74 frequency band as an example;

fig. 4 illustrates signal paths in the frequency band D by taking the n76 frequency band as an example.

Reference numerals: 100. a high frequency module; 110. a first power amplifier; 130. a second power amplifier; 120. a first switch; 140. a second switch; 123. a first port; 124. a second port; 125. a third port; 143. a fourth port; 144. a fifth port; 145. a sixth port; 121. a first input port; 122. a first output port; 141. a second input port; 142. a second output port; 210. a first tool; 220. a second tool; 230. a third tool; 240. a fourth tool; 300. a master switch; 400. an antenna; 500. an RF signal processing circuit; 600. and a baseband signal processing circuit.

Detailed Description

The invention is further described with reference to the accompanying drawings.

A high frequency module 100, as shown in fig. 1 to 4, includes a first power amplifier 110 and a second power amplifier 130, and further includes a first switch 120 and a second switch 140, a first output port 122 is provided between the first power amplifier 110 and the first switch 120, the other side of the first switch 120 is provided with a connection port communicating with the outside, the first switch 120 is provided with a first input port 121 at one side of a first output port 122, a second output port 142 is disposed between the second power amplifier 130 and the second switch 140, the other side of the first switch 120 is provided with a first connection port communicating with the outside, the other side of the second switch 140 is provided with a second connection port communicating with the outside, the first switch 120 is provided with a first input port 121 on the side of a first output port 122, the second switch 140 is provided with a second input port 141 on the side of a second output port 142.

The first connection port and the second connection port may be provided in plurality. The first connection ports include a first port 123, a second port 124 and a third port 125, and the second connection ports include a fourth port 143, a fifth port 144 and a sixth port 145.

A high frequency module 100 has a first power amplifier 110 and a second power amplifier 130, a first switch 120 and a second switch 140. The high frequency module 100 has two operating states and two operating ranges, the operating states are a transmitting state and a receiving state, and the frequency ranges are 450-915MHz (low frequency) and 1427-2025MHz (intermediate frequency), respectively. The first switch 120 of the first power amplifier 110 operates in a low frequency range, and in a transmitting state, the first power amplifier 110 amplifies a signal and transmits the amplified signal to the first output port 122 of the first switch 120, and then selects one of the first port 123, the second port 124, and the third port 125 according to a difference in an operating frequency band, and transmits the amplified signal to an external duplexer. In the receive state, the first switch 120 selects one of the first port 123, the second port 124, and the third port 125, transmits a signal received by the external duplexer to the receive path RX1 through the first input port 121, and is then processed by the RFIC 500. The switch 140 of the power amplifier 130 operates in the intermediate frequency range, and the operation mechanism is the same as that of the first power amplifier 110 and the first switch 120, which is not described herein again. It should be noted that the low frequency part and the intermediate frequency part are operated independently, and the intermediate frequency part may be operated in a transmitting or receiving state when the low frequency part is operated in a transmitting state, and vice versa.

The high-frequency module 100 has a function of amplifying a plurality of high-frequency signals including the frequency band A, C, incorporates the first power amplifier 110 and the second power amplifier 130, amplifies power signals in different frequency ranges, and outputs the amplified transmission signals to the duplexer via the first switch 120 and the second switch 140. The high frequency module 100 may also transmit the reception signal of the frequency band B, D to the RDIC 500 through the reception paths RX1 and RX2 through the first switch 120 and the second switch 140.

A communication apparatus includes a high frequency module, and further includes a duplexer, a main switch 300, an antenna 400, an RF signal processing circuit 500, and a baseband signal processing circuit 600. The duplexer includes four multiplexers, which are named a first multiplexer 210, a second multiplexer 220, a third multiplexer 230, and a fourth multiplexer 240, respectively. The RF signal processing circuit may be named RFIC. The baseband signal processing circuit may be named BBIC.

The RF signal processing circuit 500 can process high frequency signals transmitted and received by the antenna. The RF signal processing circuit 500 down-converts a high-frequency signal input through a reception path including one of the antenna 400, the main switch 300 and the duplexer and the high-frequency module 100, and outputs a baseband signal generated by the signal processing to the baseband signal processing circuit. Further, the RFIC500 may process a transmission signal input from the BBIC600 by up-conversion, and output a high frequency signal generated by the signal processing to a transmission path of the high frequency module 100, to be transmitted to the antenna 400 via one of the duplexers and the main switch 300.

The RFIC500 also has a function as a control unit that controls the connection of the main switch 300 of the high frequency module 100 based on the frequency band used. The control unit may also be provided outside the RFIC500, for example in the high frequency module 100 or the BBIC 600.

The high-frequency module and the communication device of the present invention transmit and receive high-frequency signals of frequency bands a (first communication frequency band), B (second communication frequency band), C (third communication frequency band) and D (fourth communication frequency band) of different frequency bands from each other. The transmission band of band a includes the reception band of band B, and the transmission band of band C includes the reception band of band D.

If the main switch 300 is a switch that can support simultaneous operation of low frequency and intermediate frequency, such as DPxT, or the main switch 300 is replaced by a low frequency and intermediate frequency combiner, the communication device 1 may implement at least the following inter-band CA: 1) frequency band A + C; 2) frequency band A + D; 3) frequency band B + C; 4) band B + D. Since the first switch 120 and the second switch 140 of the high frequency module 100 can have more paths, the communication device 1 can realize more CA combinations, which is not listed here.

Next, the operation of the high frequency module 100 and the communication device 1 will be described with two specific frequency bands.

Fig. 2 is a diagram showing an example of frequency allocation of a communication band that can be used in the low frequency part in the high frequency module 100 of the present invention. In this embodiment, the band A (the first communication band) is, for example, n28A of 5G (transmission band: 703-.

Fig. 3 illustrates the signal path in the operating band C, taking the n74 band as an example. The transmission path is as follows: the BBIC600 generates a baseband signal, transmits the baseband signal to the RFIC500 for up-conversion, and then transmits the baseband signal to the second power amplifier 130 in the high frequency module 100, and then the second switch 140 is in a conductive state of 141 and 143, and transmits the baseband signal to the port 231 of the duplexer 230 via 143, and then transmits the baseband signal to the antenna 400 via the overall switch 300. The receive path is as follows: signals received by the antenna 400 are transmitted via the master switch 300 to the duplexer 230 and then transmitted via the port 232 to the RFIC500 for down-conversion, and then the processed signals are transmitted to the BBIC 600.

Fig. 4 illustrates the signal path in the operating band D, taking the n76 band as an example. Since the duplex mode of n76 is SDL, only in the receiving path, the signal received by the antenna 400 is transmitted to the duplexer 230 via the switch 300, then transmitted to the fourth port 143 in the high frequency module 100 through the third duplexer 230, and then the operating state of the second switch 140 is the on state of 143 and 142, transmitted to the RFIC500 via the second output port 142 for down-conversion, and then transmitted to the BBIC 600.

In the above operation process, the band C can also operate in the path of the duplexer 240, at this time, the operation state of the second switch 140 is the conduction state of 141-144, and the switch 300 is the conduction state of the path of the duplexer 240. The band D can also work in the path of the duplexer 240, and at this time, the working state of the second switch 140 is 142 and 144, and the total switch 300 is the conducting state of the path of the duplexer 240. This design can bring great convenience to the development process of the communication device 1, is not limited to the selection of a specific port, and has great flexibility in the PCB layout and layout stages.

As described above, the present invention can be widely used in communication devices such as mobile phones as a high frequency module and a communication device suitable for a multiband system, and realizes support for more frequency bands without increasing the number of components and the layout area of PCBs.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.

Claims

1. A high frequency module (100), characterized by: the power amplifier comprises a first power amplifier (110) and a second power amplifier (130), a first switch (120) and a second switch (140) are arranged in the power amplifier, a first output port (122) is arranged between the first power amplifier (110) and the first switch (120), a connecting port communicated with the outside is arranged on the other side of the first switch (120), the first switch (120) is provided with a first input port (121) positioned on one side of the first output port (122), a second output port (142) is arranged between the second power amplifier (130) and the second switch (140), a first connecting port communicated with the outside is arranged on the other side of the first switch (120), a second connecting port communicated with the outside is arranged on the other side of the second switch (140), and the first input port (121) positioned on one side of the first output port (122) is arranged on the first switch (120), the second switch (140) is provided with a second input port (141) on the side of a second output port (142).

2. A high-frequency module (100) according to claim 1, characterized in that: the first connection port and the second connection port may be provided in plurality.

3. A communication device comprising a high frequency module (100) according to claims 1-2, characterized in that: the duplexer comprises a duplexer, a main switch (300), an antenna (400), an RF signal processing circuit (500) and a baseband signal processing circuit (600), wherein the duplexer comprises four multiplexers which are named as a first multiplexer (210), a second multiplexer (220), a third multiplexer (230) and a fourth multiplexer (240) respectively.

4. The communication device of claim 3, wherein: the communication device may transmit an a high frequency signal and a C high frequency signal, the communication device may receive a B band signal and a D band signal, a transmission band of a band includes a reception band signal of B, and a transmission band of C band includes a reception band of D band.

5. The communication device of claim 4, wherein: an RX1 receive path is connected between the first input port (121) and the RF signal processing circuit (500), and an RX2 receive path is connected between the second input port (141) and the RF signal processing circuit (500).