CN112911108A

CN112911108A - Camera module and electronic equipment

Info

Publication number: CN112911108A
Application number: CN202110074485.9A
Authority: CN
Inventors: 程宝佳; 徐波
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-01-20
Filing date: 2021-01-20
Publication date: 2021-06-04
Anticipated expiration: 2041-01-20
Also published as: CN112911108B

Abstract

The application provides a camera module and electronic equipment, the camera module comprises a shell, a first lens, a second lens, a circuit board and a mirror surface component, wherein the first lens, the second lens, the circuit board and the mirror surface component are fixedly connected with the shell, the circuit board is provided with a photosensitive component, and the photosensitive component is provided with a first photosensitive area and a second photosensitive area; the mirror surface assembly is provided with a first reflecting surface and a second reflecting surface, the first reflecting surface is arranged corresponding to the first lens and the first photosensitive area, and the second reflecting surface is arranged corresponding to the second lens and the second photosensitive area; the first lens receives external light rays, the first reflecting surface reflects the external light rays into the first photosensitive area, and the second lens receives external light rays, the second reflecting surface reflects the external light rays into the second photosensitive area. The embodiment of the application can reduce the occupied space of the camera module under the condition that the electronic equipment comprises a plurality of lenses.

Description

Camera module and electronic equipment

Technical Field

The application relates to the technical field of communication, especially, relate to a camera module and electronic equipment.

Background

With the continuous progress of the smart phone photographing technology, the requirement of the user on mobile phone photographing is higher and higher. The shooting is clear, beautiful and farther, and some of the shooting devices also have the functions of microspur and blurring. In order to realize the shooting performance of the mobile phone, the camera comprises a main camera, an ultra-wide angle camera, a periscopic camera, an ultra-micro distance camera, a blurring camera and the like according to the functions of a single module. In this way, the usage of cameras on a single mobile phone is increasing day by day, and the usage is gradually increased from the previous two-shot camera to three-shot camera, four-shot camera and even more cameras.

In the prior art, a camera module generally includes a lens, and a lens barrel, a filter, a support, a photo sensor chip, a Printed Circuit Board (PCB), a Flexible Printed Circuit Board (Flexible Printed Board), a connector, etc. that are correspondingly disposed. In the process of implementing the present application, the applicant finds that at least the following problems exist in the prior art: set up the space that a plurality of camera modules can increase camera module and occupy in electronic equipment inside. Therefore, in the prior art, the electronic device has the problem that the camera module occupies a large space under the condition that the electronic device comprises a plurality of lenses.

Disclosure of Invention

The embodiment of the application provides a camera module and electronic equipment to there is the great problem of camera module occupation space among the solution prior art.

In a first aspect, an embodiment of the present application provides a camera module, which includes a housing, a first lens, a second lens, a circuit board, and a mirror assembly, where the first lens, the second lens, the circuit board, and the mirror assembly are all fixedly connected to the housing,

the circuit board is provided with a photosensitive assembly, and the photosensitive assembly is provided with a first photosensitive area and a second photosensitive area;

the mirror surface assembly is provided with a first reflecting surface and a second reflecting surface, the first reflecting surface is arranged corresponding to the first lens and the first photosensitive area, and the second reflecting surface is arranged corresponding to the second lens and the second photosensitive area;

the first lens receives external light rays, the first reflecting surface reflects the external light rays into the first photosensitive area, and the second lens receives external light rays, the second reflecting surface reflects the external light rays into the second photosensitive area.

In a second aspect, an embodiment of the present application further provides an electronic device, including the camera module according to the first aspect.

The embodiment of the application sets up first camera lens, second camera lens, mirror surface subassembly and circuit board in the camera module, is equipped with photosensitive assembly on the circuit board, and photosensitive assembly has first sensitization region and second sensitization region, and in the camera module, the external light process that first camera lens was received first plane of reflection incides in the first sensitization region, the external light process that the second camera lens was received the second plane of reflection incides in the second sensitization region to same photosensitive assembly and circuit board can be shared to first camera lens and second camera lens, and under the condition that electronic equipment includes a plurality of camera lenses, the occupation space of camera module has been reduced.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure;

fig. 2 is a second schematic structural diagram of a camera module according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a combined structure of a photosensitive assembly and a circuit board according to an embodiment of the present disclosure;

fig. 4 is a second schematic view of a combined structure of the photosensitive assembly and the circuit board according to the embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1 to 4, an embodiment of the present application provides a camera module, which includes a housing 100, a first lens 200, a second lens 300, a circuit board 400, and a mirror assembly 500, wherein the first lens 200, the second lens 300, the circuit board 400, and the mirror assembly 500 are all fixedly connected to the housing 100, wherein,

the circuit board 400 is provided with a photosensitive assembly 600, and the photosensitive assembly 600 is provided with a first photosensitive area 610 and a second photosensitive area 620;

the mirror assembly 500 is provided with a first reflective surface 5011 and a second reflective surface 5021, the first reflective surface 5011 is disposed corresponding to the first lens 200 and the first photosensitive area 610, and the second reflective surface 5021 is disposed corresponding to the second lens 300 and the second photosensitive area 620;

the external light received by the first lens 200 is incident into the first photosensitive area 610 through the first reflection surface 5011, and the external light received by the second lens 300 is incident into the second photosensitive area 620 through the second reflection surface 5021.

In the embodiment of the present application, in order to improve the light shielding performance of the housing 100 and improve the accuracy of the photosensitive assembly 600, the housing 100 may be an integrally molded injection molding. The first lens 200, the second lens 300, the circuit board 400 and the mirror assembly 500 may be disposed inside the housing 100, and the connection manner may be set according to actual needs, and may specifically be fixedly connected to the housing 100 by means of adhesion, clamping, or thermal fusion, and the like, which is not limited herein.

The photosensitive assembly 600 may include at least one photosensitive chip, the photosensitive chip may be embodied as a Charge Coupled Device (CCD) or a Metal-Oxide Semiconductor (CMOS) Device, and the first photosensitive region 610 and the second photosensitive region 620 may receive light incident from the first lens 200 or the second lens 300 and convert the light into an electrical signal through a high-sensitivity Semiconductor material of the photosensitive chip.

In some embodiments, the photosensitive assembly 600 may include a photosensitive chip, and the two sides of the photosensitive chip may be a first photosensitive area 610 and a second photosensitive area 620. In some embodiments, the photosensitive assembly 600 may include two photosensitive chips, and the two photosensitive chips respectively have a first photosensitive region 610 and a second photosensitive region 620, which may be specifically configured according to actual requirements. The Circuit Board 400 may be used to support the photosensitive component 600, and may specifically be a Printed Circuit Board 400 (PCB), a Flexible Printed Circuit (FPC) Board, or a combination of a PCB and an FPC Board, and the Circuit Board 400 may be electrically connected to other Circuit boards 400 through a Board-to-Board (BTB) connector 800, and the Circuit Board 400 may be conveniently electrically connected to a battery or other Circuit boards 400 through the provision of the FPC Board 700. It should be understood that the circuit board 400 may include a transmission circuit and other electronic components besides the photosensitive assembly 600, so as to ensure the normal operation of the photosensitive assembly 600.

For the first lens 200 and the second lens 300, they may be lenses with different functions, corresponding to the first photosensitive area 610 and the second photosensitive area 620 of the photosensitive assembly 600, respectively. For example, a macro lens and a telephoto lens, or a front lens and a rear lens, time-division multiplex the circuit board 400 and the photosensitive assembly 600. In some embodiments, the number of the first lens 200 and the second lens 300 may be multiple, and multiple first lenses 200 or second lenses 300 with the same function may share the same photosensitive area of the photosensitive element 600, so as to further reduce the total occupied space of the camera module.

For example, the lens orientations and the setting heights of the front lens and the rear lens may be different because different lenses have different requirements for setting positions in the electronic device. Therefore, in the camera module described above. There are generally a horizontal distance and a vertical distance between the first lens 200 and the second lens 300. In order to ensure that the first light beam passing through the first lens 200 can enter the first light sensing area 610, a first reflection surface 5011 is disposed corresponding to the first lens 200 and the first light sensing area 610, so that the first light beam can enter the first light sensing area 610 after being reflected by the first reflection surface 5011. Similarly, a second reflecting surface 5021 may be disposed in the camera module between the second lens 300 and the second photosensitive area 620, so that the second light is reflected by the second reflecting surface 5021 and can be incident on the second photosensitive area 620.

The first reflective surface 5011 and the second reflective surface 5021 can be disposed on the mirror assembly 500. It is understood that the mirror assembly 500 described above may include at least one mirror piece. In some embodiments, the mirror assembly 500 may include a mirror member, and both sides of the mirror member may be provided with the first and second reflecting

surfaces

5011 and 5021, respectively. In some embodiments, the mirror assembly 500 may include two mirror pieces having the first reflective surface 5011 and the second reflective surface 5021, which may be set according to actual needs.

Specifically, the mirror surface member may be an element having a reflection surface, such as a coated prism, and is not limited thereto.

In the embodiment of the present application, the first lens 200, the second lens 300, the mirror assembly 500 and the circuit board 400 are disposed in the camera module, the photosensitive assembly 600 is disposed on the circuit board 400, the photosensitive assembly 600 has the first photosensitive area 610 and the second photosensitive area 620, in the camera module, the external light received by the first lens 200 is incident into the first photosensitive area 610 through the first reflection surface 5011, and the external light received by the second lens 300 is incident into the second photosensitive area 620 through the second reflection surface 5021, so that the first lens 200 and the second lens 300 can share the same photosensitive assembly 600 and the circuit board 400, and the occupied space of the camera module is reduced when the electronic device includes a plurality of lenses.

Alternatively, the housing 100 may be provided with an optical path transmission channel 101, the first lens 200 and the second lens 300 are located at two opposite ends of the optical path transmission channel 101, and the photosensitive element 600 is located in the optical path transmission channel 101 and between the first lens 200 and the second lens 300.

In an embodiment of the present invention, the housing 100 may be hollow, and the first lens 200 may be communicated with the first light sensing region 610 and the second lens 300 may be communicated with the second light sensing region 620 through the light path transmission channel 101. The cross section of the optical path transmission channel 101 may be rectangular, circular, elliptical, or the like, and may be specifically set according to actual needs. The first light can pass through the optical path transmission channel 101, and the first lens 200 is reflected by the first reflection surface 5011 and enters the first photosensitive area 610. The inner wall of the optical transmission channel 101 may be made of an opaque material, so that the optical transmission channel 101 may transmit light while blocking light.

Further, the mirror assembly 500 may include a first mirror 501 and a second mirror 502, the first mirror 501 having the first reflecting surface 5011, the second mirror 502 having the second reflecting surface 5021; the first mirror 501 and the second mirror 502 are disposed in the optical transmission path 101.

It is understood that, in the embodiment of the present application, the first mirror 501 and the second mirror 502 may be respectively disposed on two sides of the photosensitive assembly 600. The first mirror 501 may be disposed inside the optical transmission pipeline and between the first lens 200 and the photosensitive element 600. Meanwhile, as can be seen from the principle of specular reflection, the incident angle is equal to the reflection angle, and the first reflection surface 5011 of the first mirror 501 may be disposed toward the first lens 200 and the first photosensitive area 610 at the same time, and the specific orientation angle may be set according to the relative positions of the first lens 200 and the first photosensitive area 610, and is not further limited herein.

Similarly, the second mirror 502 may be disposed inside the optical transmission pipeline and between the second lens 300 and the photosensitive element 600. Meanwhile, the second reflecting surface 5021 of the second mirror member 502 may be simultaneously disposed toward the second lens 300 and the second photosensitive area 620, and the specific orientation angle may be set according to the relative positions of the second lens 300 and the second photosensitive area 620.

It is understood that, in alternative embodiments, the number of the first mirror members 501 may be multiple, and the first reflecting surfaces 5011 are disposed on each of the first mirror members 501, and the first light may be reflected by the first reflecting surfaces 5011 of the first mirror members 501 and finally incident to the first light sensing areas 610. Similarly, the number of the second mirror pieces 502 may be multiple, and each second mirror piece 502 is provided with the second reflecting surface 5021.

The first mirror piece 501 and the second mirror piece 502 are arranged in the embodiment of the application, so that the light rays of the first lens 200 and the second lens 300 at two ends of the light path transmission channel 101 can be reflected by the mirror surface and enter the first photosensitive area 610 and the second photosensitive area 620 of the photosensitive assembly 600, the first lens 200 and the second lens 300 can share the light path transmission channel 101 and the circuit board 400 of the same camera module, and the total occupied space of the camera module is reduced.

Further, the optical path transmission channel 101 is perpendicular to the central axes of the first lens 200 and the second lens 300, the central axis of the first lens 200 is disposed at an angle of 45 ° with the first reflection surface 5011, and the central axis of the second lens 300 is disposed at an angle of 45 ° with the second reflection surface 5021.

Referring to fig. 1, fig. 1 is a schematic diagram of a possible arrangement of the optical transmission channel 101. In this embodiment, the first lens 200 and the second lens 300 may be a front lens and a rear lens of an electronic device, respectively, the extending direction of the optical path transmission channel 101 may be a straight line, and the first lens 200 and the second lens 300 are disposed at two opposite ends of the optical path transmission channel 101, respectively.

The first lens 200 and the second lens 300 may be oriented oppositely, and a central axis of the first lens 200 and a central axis of the second lens 300 may be perpendicular to the optical transmission channel 101. In order to allow the first light and the second light to be incident on the first light sensing area 610 and the second light sensing area 620, respectively, the central axis of the first lens 200 and the first reflecting surface 5011 may be disposed at an angle of 45 °, so that the incident angle of the first light incident on the first lens 200 is 45 °, and the reflecting angle is also 45 °, and the first light is reflected by the first reflecting surface 5011 and then incident on the first light sensing area 610 along the extending direction of the optical path transmission channel 101.

Similarly, the central axis of the second lens 300 and the second reflecting surface 5021 may be disposed at an angle of 45 °. Specifically, referring to fig. 1 or 2, in fig. 1 or 2, both the α angle and the β angle may be 45 °, so that the angle of the first light reflected by the first reflecting surface 5011 is deflected to 90 °, the reflected light path is aligned with the extending direction of the light path transmission channel 101, the angle of the second light reflected by the second reflecting surface 5021 is also deflected to 90 °, and the reflected light path is aligned with the extending direction of the light path transmission channel 101. Meanwhile, the optical path transmission channel 101 may be perpendicular to the central axis of the first lens 200 and the central axis of the second lens 300, respectively, so that the occupied space of the camera module is reduced.

Of course, in other alternative embodiments, the optical path transmission channel 101 may also be provided with a plurality of right-angle bending portions according to the relative positions of the first lens 200 and the second lens 300, and each right-angle bending portion may be provided with a mirror, so that the first light ray and the second light ray are reflected for multiple times and respectively incident to the first light sensing area 610 and the second light sensing area 620, which is not described herein again.

Optionally, in order to reduce the width of the optical path transmission channel 101 to a certain extent, the photosensitive element 600 may be disposed obliquely with respect to the optical path transmission channel 101, and with continued reference to fig. 1, an included angle θ exists between the photosensitive element 600 and a horizontal plane shown by a dotted line in fig. 1, so that the projection length of the photosensitive element on the horizontal plane is correspondingly shortened, and the occupied space of the camera module may be further reduced.

Optionally, the photosensitive assembly 600 may include a first photosensitive chip 601 and a second photosensitive chip 602, where the first photosensitive chip 601 and the second photosensitive chip 602 are respectively disposed on two sides of the circuit board 400, and are fixed and electrically connected to the circuit board 400; the first photosensitive chip 601 has the first photosensitive area 610, and the second photosensitive chip 602 has the second photosensitive area 620.

Specifically, the first photosensitive chip 601 may include a first metal wiring layer 6011 and a first photosensitive element layer 6012, and the second photosensitive chip 602 may include a second metal wiring layer 6021 and a second photosensitive element layer 6022. In this case, a side of the first light-sensing element layer 6012 close to the first lens is the first light-sensing region 610, and a side of the second light-sensing element layer 6022 close to the second lens is the second light-sensing region 620.

In this embodiment, referring to fig. 3, the photosensitive assembly 600 may include a first photosensitive chip 601 and a second photosensitive chip 602, and the first photosensitive chip 601 and the second photosensitive chip 602 respectively have a first photosensitive area 610 and a second photosensitive area 620, and the first photosensitive chip 601 and the second photosensitive chip 602 are respectively disposed on two sides of the same circuit board 400, so that the first photosensitive chip 601 and the second photosensitive chip 602 can share the same circuit board 400, and when the cost is reduced, the occupied space of the camera module can be reduced.

Optionally, the photosensitive assembly 600 includes a third photosensitive chip 603, the third photosensitive chip 603 is fixed and electrically connected to the circuit board 400, the third photosensitive chip 603 includes a circuit layer 6032, a first photosensitive layer 6031 and a second photosensitive layer 6033, and the circuit layer 6032 is disposed between the first photosensitive layer 6031 and the second photosensitive layer 6033;

the first photosensitive layer 6031 has the first photosensitive region 610, and the second photosensitive layer 6033 has the second photosensitive region 620.

In the embodiment of the present invention, the photosensitive assembly 600 may only include the third photosensitive chip 603, and the third photosensitive chip 603 may include a first photosensitive layer 6031 and a second photosensitive layer 6033, wherein the first photosensitive layer 6031 and the second photosensitive layer 6033 are respectively provided with a first photosensitive region 610 and a second photosensitive region 620, the first photosensitive layer 6031 and the second photosensitive layer 6033 may be respectively electrically connected to the circuit layer 6032, and the circuit layer 6032 is further electrically connected to the circuit board 400. Thus, the first light and the second light can be received by the first photosensitive area 610 and the second photosensitive area 620 through the third photosensitive chip 603, so that the occupied space of the camera module is further reduced.

Further, in order to facilitate the arrangement of the third photosensitive chip 603 and the circuit board 400, the circuit board 400 is prevented from shielding the first photosensitive area 610 or the second photosensitive area 620, a first through hole may be formed in the middle of the circuit board 400, the third photosensitive chip 603 is disposed at the first through hole, and the first photosensitive layer 6031, the circuit layer 6032 and the second photosensitive layer 6033 are sequentially disposed along the extending direction of the first through hole.

In the embodiment of the present application, referring to fig. 4, fig. 4 is a schematic cross-sectional view of a camera module. The circuit board 400 may be processed using a local recess (cavity) process such that a first through hole is formed in the middle of the circuit board 400.

The circuit layer 6032 of the third photo-sensing chip 603 may be stacked on one side of the circuit board 400, and the first photo-sensing area 610 or the second photo-sensing area 620 is disposed opposite to the first through hole, so that incident light of the first photo-sensing area 610 or the second photo-sensing area 620 may be incident through the first through hole.

It should be understood that, in some embodiments, the third photo-sensing chip 603 may also be disposed inside the first through hole, and incident light rays of the first photo-sensing region 610 and the second photo-sensing region 620 may both enter through the first through hole.

In the embodiment of the present invention, the circuit board 400 is processed through a local recess (cavity) process, so that the incident light of the first photosensitive region 610 or the second photosensitive region 620 enters through the first through hole, thereby further reducing the occupied space of the camera module.

Optionally, the first photosensitive layer 6031 comprises a first alignment layer 60311 and at least one first photodiode 60312, the at least one first photodiode 60312 electrically coupled to the circuit layer 6032, the first alignment layer 60311 positioned between the circuit layer 6032 and the at least one first photodiode 60312;

the second photosensitive layer 6033 includes a second alignment layer 60331 and at least one second photodiode 60332, the at least one second photodiode 60332 is electrically connected to the circuit layer 6032, and the second alignment layer 60331 is located between the circuit layer 6032 and the at least one second photodiode 60332.

Referring to fig. 4, in the present embodiment, the first collimating layer 60311 can be a porous filter, so as to filter out scattered or deflected light, so that the light received by the first photosensitive region 610 is a collimated light beam. The first photodiode 60312 is configured to convert the received light into an electrical signal and output the electrical signal to the circuit layer 6032.

The second photosensitive layer 6033, similar to the first photosensitive layer 6031, can be disposed symmetrically with respect to the circuit layer 6032, and will not be described herein again.

The embodiment of the application also provides electronic equipment which comprises the camera module in any one of the embodiments. It is understood that the number of the camera modules may be specifically set according to the number of lenses required by the electronic device, and is not further limited herein.

Since the electronic device provided in the embodiment of the present application adopts all the technical solutions of the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and details are not repeated herein.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera module is characterized by comprising a shell, a first lens, a second lens, a circuit board and a mirror surface component, wherein the first lens, the second lens, the circuit board and the mirror surface component are all fixedly connected with the shell,

2. The camera module according to claim 1, wherein the housing defines a light path transmission channel, the first lens and the second lens are disposed at opposite ends of the light path transmission channel, and the photosensitive element is disposed in the light path transmission channel and between the first lens and the second lens.

3. The camera module of claim 2, wherein the mirror assembly comprises a first mirror piece having the first reflective surface and a second mirror piece having the second reflective surface; the first mirror surface piece and the second mirror surface piece are arranged in the light path transmission channel.

4. The camera module according to claim 3, wherein the optical transmission channel is perpendicular to the central axes of the first lens and the second lens, the central axis of the first lens is disposed at an angle of 45 ° with respect to the first reflection plane, and the central axis of the second lens is disposed at an angle of 45 ° with respect to the second reflection plane.

5. The camera module of claim 2, wherein the photosensitive element is disposed obliquely with respect to the optical transmission channel.

6. The camera module according to claim 2, wherein the photosensitive assembly includes a first photosensitive chip and a second photosensitive chip, and the first photosensitive chip and the second photosensitive chip are respectively disposed on two sides of the circuit board and are fixed and electrically connected to the circuit board; the first photosensitive chip is provided with the first photosensitive area, and the second photosensitive chip is provided with the second photosensitive area.

7. The camera module according to claim 2, wherein the photosensitive assembly comprises a third photosensitive chip, the third photosensitive chip is fixed to and electrically connected to the circuit board, the third photosensitive chip comprises a circuit layer, a first photosensitive layer and a second photosensitive layer, and the circuit layer is disposed between the first photosensitive layer and the second photosensitive layer;

the first photosensitive layer has the first photosensitive area, and the second photosensitive layer has the second photosensitive area.

8. The camera module as claimed in claim 7, wherein a first through hole is formed in a middle portion of the circuit board, the third photo sensor chip is disposed at the first through hole, and the first photo sensor layer, the circuit layer and the second photo sensor layer are sequentially disposed along an extending direction of the first through hole.

9. The camera module of claim 7, wherein the first photosensitive layer comprises a first collimating layer and at least one first photodiode, the at least one first photodiode being electrically connected to the circuit layer, the first collimating layer being located between the circuit layer and the at least one first photodiode;

the second photosensitive layer includes a second alignment layer and at least one second photodiode electrically connected to the circuit layer, the second alignment layer being located between the circuit layer and the at least one second photodiode.

10. An electronic device, comprising the camera module according to any one of claims 1 to 9.