CN112909521B

CN112909521B - Antenna device, chip and terminal

Info

Publication number: CN112909521B
Application number: CN201911137380.2A
Authority: CN
Inventors: 刘�英; 任爱娣; 赵畅; 岳震震; 陈月年; 张玉; 叶茂; 李堃
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2022-06-10
Anticipated expiration: 2039-11-19
Also published as: CN112909521A; WO2021098793A1

Abstract

The embodiment of the application provides an antenna device, a chip and a terminal, relates to the technical field of antennas, and can improve the end fire characteristic of an antenna on the premise of reducing interference of the outside world on the antenna. The antenna device includes: a horizontally polarized endfire antenna, the horizontally polarized endfire antenna comprising: the radiation layer is at least used for radiating millimeter wave signals, and the first dielectric layer is positioned between the radiation layer and the conductive floor; in the first medium layer, an included angle between the radiation direction end face and the bottom face is an acute angle, the radiation direction end face is located at one end, facing the radiation direction of the horizontal polarization end-fire antenna, of the first medium layer, and the bottom face is the surface of the first medium layer, close to one side of the conductive floor. The technical scheme of the application is mainly applied to wireless communication equipment.

Description

Antenna device, chip and terminal

Technical Field

The present application relates to the field of antenna technologies, and in particular, to an antenna device, a chip, and a terminal.

Background

The increasing demand of wireless communication is closely related to the design of antennas, and the current 4G wireless cellular system and related mobile antennas have difficulty in maintaining the continuously increasing demand of wireless communication traffic, so that 5G mobile communication technology is receiving wide attention. The 5G frequency spectrum can be divided into Sub-6Ghz and millimeter wave frequency bands, and researches about 5G show that the millimeter wave technology can become a key technology for improving the data transmission rate in the future due to abundant frequency spectrum resources.

Due to the limitation of antenna size, large-scale antenna arrays are used at the base station side in the low frequency band. As the frequency increases, the size of a single antenna can be reduced to the millimeter level, and it becomes possible to arrange more antennas on the terminal side. To accommodate the increasing functionality and increasing, i.e., integration, packaging techniques, mobile antennas are now located in a variety of sensors and components. The metallized portions of these components and the parasitic coupling effects produced by the mobile antenna adversely affect antenna performance.

Disclosure of Invention

The technical scheme of the application provides an antenna device, a chip and a terminal, and the end fire characteristic of the antenna can be improved on the premise of reducing the interference of the outside world to the antenna.

In a first aspect, a technical solution of the present application provides an antenna apparatus, including:

a horizontally polarized endfire antenna, said horizontally polarized endfire antenna comprising:

the antenna comprises a radiation layer, a first dielectric layer and a conductive floor, wherein the radiation layer, the first dielectric layer and the conductive floor are stacked, the radiation layer is at least used for radiating millimeter wave signals, and the first dielectric layer is positioned between the radiation layer and the conductive floor;

in the first dielectric layer, the included angle between radiation direction terminal surface and the bottom surface is the acute angle, radiation direction terminal surface is located this layer orientation the one end of the radiation direction of horizontal polarization end-fire antenna, the bottom surface is that this layer is close to the surface on one side of electrically conductive floor. On one hand, the adverse effect of coupling of an external device on the performance of the antenna is reduced through the shielding function of the conductive floor, on the other hand, the dielectric layer between the radiation layer and the conductive floor is provided with a chamfer angle, the beam upwarping caused by reflection of the conductive floor is inhibited through refraction of electromagnetic waves, and the end-fire characteristic of the antenna is improved.

In one possible design, the antenna device further includes: a second dielectric layer positioned between the first dielectric layer and the conductive floor, the second dielectric layer being adjacent to the first dielectric layer; the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂，E₁＜E₂. The beam reflected by the conductive floor is transmitted from the second medium layer to the first medium layer through the opposite mediumThe difference in electrical constants suppresses beam tilt.

In one possible design, in the first dielectric layer, an included angle between the radiation direction end face and the bottom face is θ₁(ii) a In the second dielectric layer, the included angle between the end face of the radiation direction and the bottom surface is theta₂，0°＜θ₂＜θ₁< 90 deg. The relative dielectric constant difference between different dielectric layers can be matched, and the emergent beam directions of different dielectric layers are further adjusted, so that when the beams are emergent from the dielectric layers with different relative dielectric constants, the emergent directions are close to the same, and the end-fire characteristic of the antenna is further improved.

In one possible design, the antenna device further includes: a third dielectric layer positioned between the second dielectric layer and the conductive floor, the third dielectric layer being adjacent to the second dielectric layer; the relative dielectric constant of the third dielectric layer is E ₃，E₂≤E₃。

In one possible design, the antenna device further includes: a second dielectric layer positioned between the first dielectric layer and the radiation layer, the second dielectric layer being adjacent to the first dielectric layer; the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂，E₂＜E₁。

In one possible design, the antenna device further includes: a third dielectric layer located between the second dielectric layer and the radiation layer, the third dielectric layer being adjacent to the second dielectric layer; the relative dielectric constant of the third dielectric layer is E₃，E₃≤E₂。

In one possible design, the antenna device further includes: a second dielectric layer positioned between the first dielectric layer and the conductive floor, the second dielectric layer being adjacent to the first dielectric layer; a third dielectric layer positioned between the first dielectric layer and the radiation layer, the third dielectric layer being adjacent to the first dielectric layer; the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂The relative dielectric constant of the third dielectric layer is E₃，E₃≤E₁≤E₂And E is₃＜E₂。

In one possible design, the antenna device further includes: a second dielectric layer and a third dielectric layer located between the first dielectric layer and the conductive floor, the first dielectric layer and the second dielectric layer being adjacent, the second dielectric layer and the third dielectric layer being adjacent, the second dielectric layer being located between the first dielectric layer and the third dielectric layer; the relative dielectric constant of the first dielectric layer is E ₁The relative dielectric constant of the second dielectric layer is E₂The relative dielectric constant of the third dielectric layer is E₃，E₁≤E₂≤E₃And E is₁＜E₃(ii) a In the first dielectric layer, the included angle between the end face of the radiation direction and the bottom face is theta₁(ii) a In the third dielectric layer, the included angle between the end face of the radiation direction and the bottom face is theta₃，0°＜θ₃＜θ₁＜90°。

In one possible design, the radiation layer includes a reflection plate and a dipole at an end of the reflection plate facing a radiation direction of the horizontally polarized endfire antenna; the antenna device further comprises an isolation layer located between the radiation layer and the conductive floor, the isolation layer is electrically connected to the conductive floor, and an orthographic projection of the isolation layer on the conductive floor and an orthographic projection of the reflection plate on the conductive floor are overlapped. The isolation layer is used for inhibiting the active radiation of the reflecting plate so as to improve the end-fire characteristic of the horizontally polarized end-fire antenna.

In one possible design, one of the two dielectric layers with different relative dielectric constants is a first via layer, the other of the two dielectric layers with different relative dielectric constants is a second via layer, and the first via layer and the second via layer are respectively provided with a via hole; the first via layer and the second via layer have different via structures, the via structures including one of: number of through holes, position of through holes, and aperture of through holes.

In one possible design, the first via layer is located between the radiation layer and the second via layer; the number and the positions of the through holes on the first through hole layer and the second through hole layer are the same; the through hole aperture of the first through hole layer is larger than that of the second through hole layer.

In one possible design, the first via layer is located between the radiation layer and the second via layer; the through hole apertures of the first through hole layer and the second through hole layer are the same; the via density of the first via layer is greater than the via density of the second via layer.

In one possible design, the horizontally polarized endfire antenna further comprises a feed layer located on a side of the radiating layer remote from the conductive floor;

the feed layer comprises a feed part and a balun, and the feed part is electrically connected to the radiation layer and the conductive floor through a grounding metal column.

In one possible design, the antenna device further includes: a vertically polarized endfire antenna positioned between a radiating layer of the horizontally polarized endfire antenna and a conductive floor.

In one possible design, the vertically polarized endfire antenna includes a cavity sidewall and a cavity top surface, the cavity top surface being connected to the conductive floor through the cavity sidewall.

In a second aspect, the present technical solution further provides a chip, including: radio frequency unit and antenna device as above.

In a third aspect, the present application further provides a terminal including the antenna apparatus.

Drawings

Fig. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present application;

fig. 2 is a schematic perspective view of the antenna device in fig. 1;

FIG. 3 is an exploded view of the antenna assembly of FIG. 1;

fig. 4 is an exploded view of another antenna arrangement in an embodiment of the present application;

fig. 5 is a schematic structural diagram of another antenna device in the embodiment of the present application;

FIG. 6 is an exploded view of the antenna assembly of FIG. 5;

fig. 7 is a schematic structural diagram of another antenna device according to an embodiment of the present application;

FIG. 8 is an exploded view of the antenna assembly of FIG. 7;

fig. 9 is an exploded view of another antenna arrangement in an embodiment of the present application;

fig. 10 is an exploded view of another antenna arrangement in an embodiment of the present application;

fig. 11 is a schematic structural diagram of another antenna device according to an embodiment of the present application;

FIG. 12 is an exploded view of the antenna assembly of FIG. 11;

fig. 13 is a partial structural schematic view of another antenna device in the embodiment of the present application;

Fig. 14 is a partial schematic structural view of another antenna device according to an embodiment of the present application;

fig. 15 is a schematic view of another antenna device according to an embodiment of the present application;

fig. 16 is a schematic perspective view of the antenna device in fig. 15;

fig. 17 is an exploded view of the antenna assembly of fig. 15;

fig. 18 is a schematic view of another antenna device according to an embodiment of the present application;

FIG. 19 is a schematic diagram of the antenna device of FIG. 18 without the dielectric layer;

fig. 20 is an exploded view of the antenna device of fig. 18 with the dielectric layer omitted;

fig. 21 is a diagram illustrating a simulation result of reflection coefficients of a horizontally polarized endfire antenna according to an embodiment of the present application;

fig. 22 is a graph illustrating simulation results of vertical plane gain of a horizontally polarized endfire antenna at 25GHz in an embodiment of the present application;

fig. 23 is a graph illustrating a simulation result of the vertical gain of a horizontally polarized endfire antenna at 27GHz in an embodiment of the present application;

fig. 24 is a diagram illustrating a simulation result of vertical plane gain of a horizontally polarized endfire antenna at 29GHz in an embodiment of the present application;

fig. 25 is a diagram illustrating simulation results of maximum gain of a horizontally polarized endfire antenna in the present embodiment varying with frequency in the horizontal plane;

fig. 26 is a diagram illustrating a simulation result of S parameters of a dual polarized antenna apparatus in the embodiment of the present application;

Fig. 27 is a diagram illustrating a simulation result of vertical plane gain of a dual-polarized antenna device at 27GHz in an embodiment of the present application.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

As shown in fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present application, fig. 2 is a schematic perspective structural diagram of the antenna device in fig. 1, and fig. 3 is an exploded view of the antenna device in fig. 1, the embodiment of the present application provides an antenna device, including: a horizontally polarized endfire antenna, the horizontally polarized endfire antenna comprising: the antenna comprises a radiation layer 11, a first dielectric layer 121 and a conductive floor 13 which are arranged in a stacked mode, wherein the radiation layer 11 is at least used for radiating millimeter wave signals, and the first dielectric layer 121 is located between the radiation layer 11 and the conductive floor 13; the first dielectric layer 121 includes a top surface 201, a bottom surface 202 and a radiation direction end surface 203, in the first dielectric layer 121, an included angle between the radiation direction end surface 203 and the bottom surface 202 is an acute angle, the radiation direction end surface 203 is located at one end of the layer facing to a radiation direction of the horizontally polarized endfire antenna, the bottom surface 202 is a surface of the layer near to the conductive floor 13, and the top surface 201 is a surface of the layer near to the radiation layer 11.

Specifically, the endfire antenna means that the antenna has a specific radiation direction, the radiation direction means the maximum radiation gain direction of the antenna, the conductive floor 13 is a conductive flat plate structure and can be made of a metal material, and the horizontally polarized endfire antenna means that the radiation direction of the endfire antenna is parallel to the plane of the conductive floor 13, that is, the plane of the conductive floor 13 is taken as a reference horizontal plane, and the radiation direction of the horizontally polarized endfire antenna is the horizontal direction. The radiation layer 11 is a part of a horizontally polarized endfire antenna, and is typically made of a conductive material such as metal, for radiating electromagnetic wave signals. For example, the plane of the conductive floor 13 is a plane defined by an x axis and a y axis, the thickness direction of the conductive floor 13 is a z axis direction, any two of the x axis, the y axis and the z axis are perpendicular to each other, the x axis direction is a radiation direction of the horizontally polarized endfire antenna, and the radiation direction end face 203 of the first dielectric layer 121 is an end face pointing to one side of the x axis direction. The conductive floor 13 arranged on the whole surface can be used for realizing the isolation between the horizontal polarization endfire antenna and other devices, when the horizontal polarization endfire antenna is arranged in a terminal, the adverse effect of other devices on the performance of the horizontal polarization endfire antenna through coupling can be reduced due to the isolation effect of the conductive floor 13, and a clearance area does not need to be arranged in an area covered by the conductive floor 13; on the other hand, since the whole conductive floor 13 is provided, the electric wave radiated by the horizontally polarized endfire antenna is reflected at the conductive floor 13 to cause the beam to tilt up, and thus the endfire characteristics of the antenna are not ideal, it should be noted that for convenience of description, it is defined in the following description that the direction from the conductive floor 13 to the radiation layer 11 on the z-axis is up, and the direction from the radiation layer 11 to the conductive floor 13 on the z-axis is down, and the beam tilts up, that is, the beam tilts up at the conductive floor 13, and in addition, the endfire characteristics are used to reflect the difference between the actual direction of the radiation direction of the antenna and the ideal direction, and the larger the difference is, the more ideal the endfire characteristics are, and the smaller the difference is, the ideal direction of the radiation direction of the horizontally polarized endfire antenna is the horizontal direction, and therefore, the smaller the beam in the non-horizontal direction is, the more ideal the endfire characteristics are. In the embodiment of the present application, in fig. 1, the radiation direction of the horizontally polarized endfire antenna is rightward, the rightmost end surface of the first dielectric layer 121 is a radiation direction end surface 203, the radiation direction end surface 203 is an interface between the first dielectric layer 121 and an air dielectric, that is, a cut angle is set in the first dielectric layer 121, when a beam reflected by the conductive floor 13 passes through the radiation direction end surface 203, the beam is refracted due to the cut angle of the first dielectric layer 121, and the beam upwarp caused by the reflection of the conductive floor 13 is suppressed by the refraction of the electromagnetic wave. It should be noted that the structures shown in fig. 1 to 3 are only examples, for example, two dielectric layers are disposed between the radiation layer 11 and the conductive floor 13, the number of the dielectric layers between the radiation layer 11 and the conductive floor 13 is not limited in the present embodiment, as long as there is the first dielectric layer 121 with the cut angle, for example, in other realizable embodiments, only one dielectric layer, i.e., the first dielectric layer with the cut angle, may be disposed between the radiation layer and the conductive floor, or five dielectric layers, including the first dielectric layer with the cut angle, may be disposed between the radiation layer and the conductive floor.

The antenna device in this application embodiment, on the one hand, reduce the harmful effects that external device coupling caused to the antenna performance through the shielding function on electrically conductive floor, on the other hand, have the corner cut through setting up the dielectric layer between radiation layer and the electrically conductive floor, utilize the refraction of electromagnetic wave to restrain the beam upwarp that electrically conductive floor reflection leads to, improved the endfire characteristic of antenna.

Optionally, as shown in fig. 1 to 3, the antenna apparatus further includes: a second dielectric layer 122 positioned between the first dielectric layer 121 and the conductive floor 13, the second dielectric layer 122 being adjacent to the first dielectric layer 121; the first dielectric layer 121 has a relative dielectric constant E₁The relative dielectric constant of the second dielectric layer 122 is E₂，E₁＜E₂。

Specifically, it should be noted that, in the embodiment of the present application, the dielectric layers are adjacent to each other, which means that two dielectric layers are in direct contact with each other, for example, the bottom surface 202 of the first dielectric layer 121 is in contact with the top surface 201 of the second dielectric layer 122, but other devices may exist between the first dielectric layer 121 and the second dielectric layer 122, and the device between the two dielectric layers only blocks the surface contact between the two dielectric layers in a partial region and does not completely block the surface contact between the two dielectric layers. In addition, the relative dielectric constant in the embodiments of the present application is not a characteristic value of the material itself, but means dielectric constant The equivalent relative dielectric constant of the dielectric layers is used to reflect the dielectric properties of the dielectric layers themselves, for example, the relative dielectric constant of the first dielectric layer 121 is smaller than that of the second dielectric layer 122, and the following methods can be applied for measurement and comparison: a first dielectric layer 121 is disposed between the two electrode plates, a voltage is applied to the two electrode plates, and a current value I on the electrode plates is detected₁(ii) a A second dielectric layer 122 is disposed between the same two electrode plates, a voltage is applied to the two electrode plates, and a current value I on the electrode plates is detected₂. Wherein, except two dielectric layers, other test parameters are the same, such as applied voltage value, arrangement position of the dielectric layers and the like, and the current value is in direct proportion to the relative dielectric constant, namely if I₁＜I₂It means that the relative dielectric constant of the first dielectric layer 121 is smaller than that of the second dielectric layer 122. The transmission of the electromagnetic wave satisfies Snell's Law, the relative dielectric constant of the medium is related to the transmission speed of the electromagnetic wave, when the electromagnetic wave is transmitted in two adjacent medium layers, the refraction of the electromagnetic wave can be caused due to the difference of the relative dielectric constants, in the embodiment of the application, in the first medium layer 121 and the second medium layer 122 which are adjacent, the relative dielectric constant of the first medium layer 121 is smaller than the relative dielectric constant of the second medium layer 122, so that the upwarp of the beam reflected by the conductive floor 13 can be inhibited due to the refraction when the beam is transmitted from the second medium layer 122 to the first medium layer 121, and the upwarp of the beam is inhibited together by matching with the tangential angle setting of the first medium layer 121, so that the beam direction is close to the ideal end-fire direction of the horizontally polarized antenna. The second dielectric layer 122 also has a top surface 201, a bottom surface 202, and a radiation direction end surface 203, where the top surface 201 is a surface of the layer close to the radiation layer 11, the bottom surface is a surface of the layer close to the conductive floor 13, and the radiation direction end surface 203 is located at an end of the layer facing the radiation direction of the horizontally polarized endfire antenna. The second dielectric layer 122 may be a dielectric layer without a chamfer, that is, the angle between the radiation direction end face 203 and the bottom face 202 of the second dielectric layer 122 may be a right angle.

Alternatively, as shown in fig. 4, fig. 4 is the embodiment of the present applicationAn exploded view of the another antenna device, the antenna device further comprising: a third dielectric layer 123 between the second dielectric layer 122 and the conductive floor 13, the third dielectric layer 123 being adjacent to the second dielectric layer 122; the third dielectric layer 123 has a relative dielectric constant E₃，E₂≤E₃。

Specifically, in the structure shown in fig. 4, the antenna device includes a first dielectric layer 121, a second dielectric layer 122, and a third dielectric layer 123, where the first dielectric layer 121 is a dielectric layer with a chamfer, and the second dielectric layer 122 and the third dielectric layer 123 may be dielectric layers without a chamfer, that is, an included angle between the radiation direction end surface 203 and the bottom surface 202 of the two dielectric layers may be a right angle. If the relative dielectric constant E of the second dielectric layer 122 is₂Equal to the relative dielectric constant E of the third dielectric layer 123₃The enhancement of upwarping wave beams can be avoided; if the relative dielectric constant E of the second dielectric layer 122 is₂Is less than the relative dielectric constant E of the third dielectric layer 123₃The beam can be suppressed from being tilted in the process of being transmitted from the third medium layer 123 to the second medium layer 122.

Alternatively, as shown in fig. 5, 6, 7 and 8, fig. 5 is a schematic structural diagram of another antenna device in the present embodiment, fig. 6 is an exploded view of the antenna device in fig. 5, fig. 7 is a schematic structural diagram of another antenna device in the present embodiment, fig. 8 is an exploded view of the antenna device in fig. 7, and the second dielectric layer 122 is adjacent to the first dielectric layer 121; the first dielectric layer 121 has a relative dielectric constant E ₁The relative dielectric constant of the second dielectric layer 122 is E₂，E₁＜E₂(ii) a In the first dielectric layer 121, the angle between the radiation direction end face 203 and the bottom face 202 is θ₁(ii) a In the second dielectric layer 122, the angle between the radiation direction end face 203 and the bottom face 202 is θ₂，0°＜θ₂＜θ₁＜90°。

Specifically, the structure shown in fig. 6 is similar to the structure shown in fig. 3, except that in the structure shown in fig. 3, the angle between the radiation-direction end face 203 and the bottom face 202 in the second dielectric layer 122 is a right angle, whereas in the figure, the angle is a right angle5, the angle between the end face 203 and the bottom face 202 in the second dielectric layer 122 is acute. The structure shown in fig. 8 is similar to the structure shown in fig. 4, except that in the structure shown in fig. 4, the angle between the radiation-direction end face 203 and the bottom face 202 in the second dielectric layer 122 is a right angle, whereas in the structure shown in fig. 8, the angle between the radiation-direction end face 203 and the bottom face 202 in the second dielectric layer 122 is an acute angle. And in the structures shown in fig. 5 to 8, the relative dielectric constant E of the first dielectric layer 121₁Is less than the relative dielectric constant E of the second dielectric layer 122₂When the beam reflected by the conductive floor 13 is transmitted from the second dielectric layer 122 to the first dielectric layer 121, the transmission direction is changed, and the beam tilt is suppressed, that is, the direction of the beam transmitted in the first dielectric layer 121 is different from the direction of the beam transmitted in the second dielectric layer 122 due to the difference of the relative dielectric constants, and therefore, θ is set ₂＜θ₁The relative dielectric constant difference between different dielectric layers can be matched, and the emergent beam directions of different dielectric layers are further adjusted, so that when the beams are emergent from the dielectric layers with different relative dielectric constants, the emergent directions are close to the same, and the end-fire characteristic of the antenna is further improved.

Optionally, as shown in fig. 9, fig. 9 is an exploded view of another antenna apparatus in an embodiment of the present application, where the antenna apparatus further includes: a second dielectric layer 122 disposed between the first dielectric layer 121 and the radiation layer 11, the second dielectric layer 122 being adjacent to the first dielectric layer 121; the first dielectric layer 121 has a relative dielectric constant E₁The relative dielectric constant of the second dielectric layer 122 is E₂，E₂＜E₁。

Specifically, in the embodiment of the present application, in the adjacent first dielectric layer 121 and the second dielectric layer 122, since the relative dielectric constant of the first dielectric layer 121 is greater than the relative dielectric constant of the second dielectric layer 122, when the beam reflected by the conductive floor 13 is transmitted from the first dielectric layer 121 to the second dielectric layer 122, the beam is inhibited from warping upwards due to refraction, so that the beam is inhibited from warping upwards together with the tangential angle of the first dielectric layer 121, so that the beam direction is close to the ideal end-fire direction of the horizontally polarized antenna. The second dielectric layer 122 also has a top surface 201, a bottom surface 202, and a radiation direction end surface 203, where the top surface 201 is a surface of the layer close to the radiation layer 11, the bottom surface is a surface of the layer close to the conductive floor 13, and the radiation direction end surface 203 is located at an end of the layer facing the radiation direction of the horizontally polarized endfire antenna. In the structure shown in fig. 9, the second dielectric layer 122 is a dielectric layer without a chamfer, that is, an included angle between the radiation direction end face 203 and the bottom face 202 of the second dielectric layer 122 is a right angle, and in other realizable embodiments, the second dielectric layer 122 may also be a dielectric layer with a chamfer.

Optionally, as shown in fig. 9, the antenna apparatus further includes: a third dielectric layer 123 between the second dielectric layer 122 and the radiation layer 11, the third dielectric layer 123 being adjacent to the second dielectric layer 122; the third dielectric layer 123 has a relative dielectric constant E₃，E₃≤E₂。

Specifically, in the structure shown in fig. 9, the antenna device includes a first dielectric layer 121, a second dielectric layer 122, and a third dielectric layer 123, where the first dielectric layer 121 is a dielectric layer with a chamfer, and the second dielectric layer 122 and the third dielectric layer 123 may be dielectric layers without a chamfer, that is, an included angle between the radiation direction end surface 203 and the bottom surface 202 of the two dielectric layers may be a right angle, and of course, in other realizable embodiments, the second dielectric layer 122 and the third dielectric layer 123 may also be dielectric layers with chamfers. If the relative dielectric constant E of the second dielectric layer 122 is₂Equal to the relative dielectric constant E of the third dielectric layer 123₃The enhancement of upwarping wave beams can be avoided; if the relative dielectric constant E of the second dielectric layer 122 is₂Greater than the relative dielectric constant E of the third dielectric layer 123₃The beam can be suppressed from being tilted in the process of being transmitted from the second medium layer 122 to the third medium layer 123.

Optionally, as shown in fig. 10, fig. 10 is an exploded view of another antenna device in the embodiment of the present application, where the antenna device further includes: a second dielectric layer 122 positioned between the first dielectric layer 121 and the conductive floor 13, the second dielectric layer 122 being adjacent to the first dielectric layer 121; is located at A third dielectric layer 123 between the first dielectric layer 121 and the radiation layer 11, the third dielectric layer 123 being adjacent to the first dielectric layer 121; the first dielectric layer 121 has a relative dielectric constant E₁The relative dielectric constant of the second dielectric layer 122 is E₂The third dielectric layer 123 has a relative dielectric constant E₃，E₃≤E₁≤E₂And E is₃＜E₂。

Specifically, in the structure shown in fig. 10, the antenna device includes a first dielectric layer 121, a second dielectric layer 122, and a third dielectric layer 123, where the first dielectric layer 121 is a dielectric layer with a chamfer, and the second dielectric layer 122 and the third dielectric layer 123 may be dielectric layers without a chamfer, that is, an included angle between the radiation direction end surface 203 and the bottom surface 202 of the two dielectric layers may be a right angle, and of course, in other realizable embodiments, the second dielectric layer 122 and the third dielectric layer 123 may also be dielectric layers with chamfers. The relative dielectric constants of the three dielectric layers can include the following setting modes: modes 1, E₃＜E₁＜E₂(ii) a Mode 2, E₃＜E₁＝E₂(ii) a Mode 3, E₃＝E₁＜E₂. That is, in each of the dielectric layers between the radiation layer 11 and the conductive floor 13, at least two adjacent dielectric layers have different relative dielectric constants, and in any two adjacent dielectric layers, the relative dielectric constant of one of the two adjacent dielectric layers close to the radiation layer is not greater than the relative dielectric constant of one of the two adjacent dielectric layers close to the conductive floor, and the beam upwarp is suppressed by the difference of the relative dielectric constants of the two adjacent dielectric layers, and the beam upwarp is suppressed by matching with the corner cut setting of the first dielectric layer 121.

Alternatively, as shown in fig. 11 and 12, fig. 11 is a schematic structural diagram of another antenna device in the embodiment of the present application, and fig. 12 is an exploded view of the antenna device in fig. 11, where the antenna device further includes: a second dielectric layer 122 and a third dielectric layer 123 between the first dielectric layer 121 and the conductive floor 13, wherein the first dielectric layer 121 is adjacent to the second dielectric layer 122, the second dielectric layer 122 is adjacent to the third dielectric layer 123, and the second dielectric layer 122 is located between the first dielectric layer 121 and the third dielectric layer 123; first mediumThe relative dielectric constant of the layer 121 is E₁The relative dielectric constant of the second dielectric layer 122 is E₂The third dielectric layer 123 has a relative dielectric constant E₃，E₁≤E₂≤E₃And E is₁＜E₃(ii) a In the first dielectric layer 121, the angle between the radiation direction end face 203 and the bottom face 202 is θ₁(ii) a In the third dielectric layer 123, the angle between the radiation direction end face 203 and the bottom face 202 is θ₃，0°＜θ₃＜θ₁＜90°。

Specifically, in the second dielectric layer 122, the included angle between the radiation direction end face 203 and the bottom face 202 may be a right angle or an acute angle, and may be equal to θ, for example₁Or theta₃. In the first dielectric layer 121, the second dielectric layer 122 and the third dielectric layer 123, the relative dielectric constants of the three dielectric layers may include the following setting modes: modes 1, E ₁＜E₂＜E₃I.e. in the direction from the radiating layer 11 to the conductive floor 13, the relative dielectric constants of the three dielectric layers increase; mode 2, E₁＜E₂＝E₃(ii) a Mode 3, E₁＝E₂＜E₃. That is to say, in each dielectric layer, at least two adjacent dielectric layers have different relative dielectric constants, and in any two adjacent dielectric layers, the relative dielectric constant of one of the two adjacent dielectric layers close to the radiation layer is not greater than the relative dielectric constant of one of the two adjacent dielectric layers close to the conductive floor, the beam upwarping is suppressed through the difference of the dielectric constants in the adjacent dielectric layers, and meanwhile, the direction of the beam emitted from different dielectric layers is further adjusted by matching with the different tangential angle settings of the first dielectric layer 121 and the third dielectric layer 123, so that the beam has an emission direction approaching to the same direction when emitted from the dielectric layers with different relative dielectric constants, and the end-fire characteristics of the antenna are further improved.

Alternatively, as shown in fig. 1 to 12, the radiation layer 11 includes a reflection plate 101 and a dipole 102, the dipole 102 is located at one end of the reflection plate 101 facing the radiation direction of the horizontally polarized endfire antenna, that is, the dipole 102 is located at one end of the reflection plate 101 facing the x-axis direction; the antenna device further comprises an isolation layer 14 located between the radiation layer 11 and the conductive floor 13, the isolation layer 14 being electrically connected to the conductive floor 13, an orthographic projection of the isolation layer 14 on the conductive floor 13 and an orthographic projection of the reflection plate 101 on the conductive floor 13 overlapping in a direction perpendicular to a thickness of the conductive floor 13.

Specifically, the reflection plate 101 is used for reflecting a beam, so as to cooperate with the dipole 102 to enable the horizontally polarized endfire antenna to have an antenna radiation direction facing the x-axis direction, however, the reflection plate 101 itself may also have a certain radiation, and the beam direction actively radiated by the reflection plate 101 is not the required radiation direction, thereby causing the endfire characteristics of the horizontally polarized endfire antenna to be unsatisfactory, therefore, the isolation layer 14 is disposed below the reflection plate 101, and due to the isolation effect of the isolation layer 14, the active radiation of the reflection plate 101 can be suppressed, thereby improving the endfire characteristics of the horizontally polarized endfire antenna.

Optionally, as shown in fig. 13 and 14, fig. 13 is a schematic partial structure diagram of another antenna device in this embodiment, fig. 14 is a schematic partial structure diagram of another antenna device in this embodiment, the antenna devices shown in fig. 13 and 14 respectively include two dielectric layers with different relative dielectric constants, one of the two dielectric layers with different relative dielectric constants is a first via layer 301, the other of the two dielectric layers with different relative dielectric constants is a second via layer 302, and the first via layer 301 and the second via layer 302 are respectively provided with a via 3; the first via layer 301 and the second via layer 302 have different via structures, the via structures including one of: number of through holes, position of through holes, and aperture of through holes.

Specifically, the first via layer 301 and the second via layer 302 in fig. 13 and 14 may be dielectric layers having different relative dielectric constants in the above-described embodiments, for example, in fig. 3, 4, 6, 8, 10 and 11, if the first dielectric layer 121 and the second dielectric layer 122 have different relative dielectric constants, the first via layer 301 may be the first dielectric layer 121 described above, and the second via layer 302 may be the second dielectric layer 122 described above. In order to enable different dielectric layers to have different relative dielectric constants, the relative dielectric constants of the dielectric layers can be matched in a mode that the through holes 3 are formed in the dielectric layers, the through holes 3 are hollow structures penetrating through the dielectric layers in the z-axis direction, the through holes 3 are different in structure for different dielectric layers, the dielectric layers can have different equivalent dielectric constants, and the dielectric layers with different relative dielectric constants can be made of the same material under the structure.

Alternatively, as shown in fig. 13, both the first via layer 301 and the second via layer 302 are located between the radiation layer 11 and the conductive floor 13, the first via layer 301 being located between the radiation layer 11 and the second via layer 302; the number and the positions of the through holes on the first through hole layer 301 and the second through hole layer 302 are the same; the via aperture of the first via layer 301 is larger than the via aperture of the second via layer 302. The aperture of the through hole 3 of the dielectric layer is inversely related to the relative dielectric constant, i.e. the relative dielectric constant of the dielectric layer can be matched by the aperture of the through hole 3.

Alternatively, as shown in fig. 14, both the first via layer 301 and the second via layer 302 are located between the radiation layer 11 and the conductive floor 13, the first via layer 301 being located between the radiation layer 11 and the second via layer 302; the first via layer 301 and the second via layer 302 have the same via hole diameter; the via density of the first via layer 301 is greater than the via density of the second via layer 302. The via density and the relative permittivity of the dielectric layer are inversely related, i.e. the relative permittivity of the dielectric layer can be matched by the via 3 density.

Optionally, as shown in fig. 1 to 12, the horizontally polarized endfire antenna further includes a feed layer 4, the feed layer 4 being located on a side of the radiation layer 11 away from the conductive floor 13; the feed layer 4 includes a feed 41 and a balun 42, and the feed 41 is electrically connected to the radiation layer 11 and the conductive ground 13 through the ground metal stud 5.

Specifically, for example, the feeding portion 41 may include a first feeding portion 411, a second feeding portion 412 and a third feeding portion 413, the third feeding portion 413 is located between the first feeding portion 411 and the second feeding portion 412 and is spaced from each other, the grounding metal pillar 5 may include a first grounding metal pillar 51 and a second grounding metal pillar 52, the first feeding portion 411 is connected to the conductive ground 13 through the first grounding metal pillar 51, the second feeding portion 412 is connected to the conductive ground 13 through the second grounding metal pillar 52, the first grounding metal pillar 51 and the second grounding metal pillar 52 are connected to the reflective plate 101 and the isolation layer 14 at the same time, the third feeding portion 413 is connected to the balun 42, the balun 42 may be a "Γ" type structure, and the first grounding metal pillar 51 and the second grounding metal pillar 52 penetrate through a dielectric layer between the radiation layer 11 and the conductive ground 13. A feed dielectric layer 21 is provided between the feed portion 41 and the radiation layer 11. In addition, the horizontally polarized endfire antenna may also include a director 6, the director 6 being located between the radiating layer 11 and the conductive floor 13, the director 6 and the isolation layer 14 may be located on the same layer or on different layers.

The following description of the present embodiment is made by referring to a specific structure of an antenna device, as shown in fig. 15, fig. 16 and fig. 17, fig. 15 is a schematic structural diagram of another antenna device in the present embodiment, fig. 16 is a schematic perspective structural diagram of the antenna device in fig. 15, fig. 17 is an exploded view of the antenna device in fig. 15, the antenna device includes a feeding dielectric layer 21, a dielectric layer 2a, a dielectric layer 2b, a dielectric layer 2c, a dielectric layer 2d and a dielectric layer 2e, which are sequentially stacked, a radiation layer 11 is located between the feeding dielectric layer 21 and the dielectric layer 2a, a conductive floor 13 is located on a side surface of the dielectric layer 2e away from the feeding dielectric layer 21, that is, the five dielectric layers from the dielectric layer 2a to the dielectric layer 2e are dielectric layers located between the radiation layer 11 and the conductive floor 13, the feeding dielectric layer 21, the dielectric layer 2a, the dielectric layer 2b, the dielectric layer 2d, and the conductive floor 13 are located between the five dielectric layers, The relative dielectric constants of the dielectric layer 2c, the dielectric layer 2d and the dielectric layer 2e are respectively epsilon 1, epsilon 2, epsilon 03, epsilon 14, epsilon 5 and epsilon 6 in sequence, and epsilon 1 is more than epsilon 2 and more than epsilon 3 and more than epsilon 4 and more than epsilon 5 and more than epsilon 6. Any one of the dielectric layers includes a top surface 201, a bottom surface 202 and a radiation direction end surface 203, where the top surface 201 is a surface of the layer near the radiation layer 11, the bottom surface 202 is a surface of the layer near the conductive floor 13, and the radiation direction end surface 203 is located at one end of the layer facing the radiation direction of the horizontally polarized endfire antenna. In any of the feed dielectric layer 21, the dielectric layer 2a, the dielectric layer 2b, the dielectric layer 2c, and the dielectric layer 2d, an angle between the radiation direction end surface 203 and the bottom surface 202 is an acute angle, and in the dielectric layer 2e, an angle between the radiation direction end surface 203 and the bottom surface 202 is a right angle. The dielectric layer 2a, the dielectric layer 2b, the dielectric layer 2c, and the dielectric layer 2d can be understood as the first dielectric layer 121. For example, in The first dielectric layer 121 is a dielectric layer 2a, the second dielectric layer 122 is a dielectric layer 2b, and the relative dielectric constant of the dielectric layer 2a is smaller than that of the dielectric layer 2 b; or, the first dielectric layer 121 is a dielectric layer 2b, the second dielectric layer 122 is a dielectric layer 2c, the relative dielectric constant of the dielectric layer 2b is smaller than the relative dielectric constant of the dielectric layer 2c, and the included angle between the end face 203 and the bottom face 202 in the radiation direction in the dielectric layer 2b is θ₁The angle between the end face 203 and the bottom face 202 in the radiation direction in the dielectric layer 2c is θ₂，0°＜θ₂＜θ₁Less than 90 degrees, and the third dielectric layer 123 is a dielectric layer 2d, and the relative dielectric constant of the dielectric layer 2c is smaller than that of the dielectric layer 2 d.

In one practical embodiment, as shown in fig. 15 to 17, in any one of the feed dielectric layer 21, the dielectric layer 2a and the dielectric layer 2b, the angle between the radiation direction end face 203 and the bottom face 202 is 30 ° to 45 °, for example, 40 °; in any of the

dielectric layers

2c and 2d, the angle between the radiation direction end face 203 and the bottom face 202 is 45 ° to 60 °, for example, 50 °. The length L of the conductive floor 13 is 4-8 mm, such as 5.9mm, the width W of the conductive floor 13 is 4.5-5.5 mm, such as 5mm, the height h1 of the feeding dielectric layer 21 is 0.1-0.2 mm, such as 0.15mm, and the relative dielectric constant ε 1 is 2-3, such as 2.5; the height h2 of the dielectric layer 2a is 0.2-0.3 mm, such as 0.22mm, and the relative dielectric constant ε 2 is 3-4, such as 3.5; the height h3 of the dielectric layer 2b is 0.2-0.4 mm, such as 0.3mm, and the relative dielectric constant epsilon 3 is 4-6, such as 5.5; the height h4 of the dielectric layer 2c is 0.2-0.4 mm, such as 0.3mm, and the relative dielectric constant epsilon 4 is 6-8, such as 6.5; the height h5 of the dielectric layer 2d is 0.1-0.3 mm, such as 0.2mm, and the relative dielectric constant ε 5 is 8-10, such as 9.5; the dielectric layer 2e has a height h5 of 0.3 to 0.5mm, for example 0.38mm, and a relative dielectric constant ε 6 of 10 to 12, for example 11.5. The length direction of the conductive floor 13 is the x-axis direction, the width direction is the y-axis direction, and the height direction of each dielectric layer is the z-axis direction.

In another practical implementation, as shown in fig. 15 to 17, by adjusting the above-mentioned parameters such as dimensions, an included angle between the radiation direction end surface 203 and the bottom surface 202 in any one of the feed dielectric layer 21, the dielectric layer 2a, and the dielectric layer 2b is 30 °, and an included angle between the radiation direction end surface 203 and the bottom surface 202 in any one of the dielectric layer 2c and the dielectric layer 2d is 45 °. The length L of the conductive floor 13 is 4mm, the width W thereof is 4.5mm, the height h1 of the feed dielectric layer 21 is 0.1mm, the relative dielectric constant ∈ 1 thereof is 2, the height h2 of the dielectric layer 2a is 0.2mm, the relative dielectric constant ∈ 2 thereof is 3, the height h3 of the dielectric layer 2b is 0.2mm, the relative dielectric constant ∈ 3 thereof is 4, the height h4 of the dielectric layer 2c is 0.2mm, the relative dielectric constant ∈ 4 thereof is 6, the height h5 of the dielectric layer 2d is 0.1mm, the relative dielectric constant ∈ 5 thereof is 8, the height h5 of the dielectric layer 2e is 0.3mm, and the relative dielectric constant ∈ 6 thereof is 10.

In another practical implementation, as shown in fig. 15 to 17, by adjusting the above parameters such as the size, the length L of the conductive floor 13 is 8mm, the width W thereof is 5.5mm, in any one of the feeding dielectric layer 21, the dielectric layer 2a and the dielectric layer 2b, the included angle between the radiation direction end surface 203 and the bottom surface 202 is 45 °, and in any one of the dielectric layer 2c and the dielectric layer 2d, the included angle between the radiation direction end surface 203 and the bottom surface 202 is 60 °. The height h1 of the feed dielectric layer 21 was 0.2mm, the relative dielectric constant ∈ 1 was 3, the height h2 of the dielectric layer 2a was 0.3mm, the relative dielectric constant ∈ 2 was 4, the height h3 of the dielectric layer 2b was 0.4mm, the relative dielectric constant ∈ 3 was 6, the height h4 of the dielectric layer 2c was 0.4mm, the relative dielectric constant ∈ 4 was 8, the height h5 of the dielectric layer 2d was 0.3mm, the relative dielectric constant ∈ 5 was 10, the height h5 of the dielectric layer 2e was 0.5mm, and the relative dielectric constant ∈ 6 was 12.

Alternatively, as shown in fig. 18, 19 and 20, fig. 18 is a schematic structural diagram of another antenna device in the embodiment of the present application, fig. 19 is a schematic structural diagram of the antenna device in fig. 18 with a dielectric layer omitted, fig. 20 is an exploded view of the antenna device in fig. 18 with the dielectric layer omitted, and the antenna device further includes: a vertically polarized endfire antenna 70, the vertically polarized endfire antenna 70 being located between the radiating layer 11 of the horizontally polarized endfire antenna and the conductive floor 13.

Specifically, the specific structure of the horizontally polarized endfire antenna shown in fig. 18 to 20 may be the same as that in the above-described embodiment, and all the same structural features in the drawings are not repeated, for example, the antenna apparatus includes a feed dielectric layer 21, a dielectric layer 2a, a dielectric layer 2b, a dielectric layer 2c, a dielectric layer 2d, and a dielectric layer 2e which are sequentially stacked, the radiation layer 11 is located between the feed dielectric layer 21 and the dielectric layer 2a, the conductive floor 13 is located on a side surface of the dielectric layer 2e away from the feed dielectric layer 21, that is, the five dielectric layers from the dielectric layer 2a to the dielectric layer 2e are dielectric layers located between the radiation layer 11 and the conductive floor 13, and one of the five dielectric layers may be used as the first dielectric layer 121 in the above-described embodiment. The structures shown in fig. 18 to 20 differ from the antenna devices shown in the other embodiments described above in that a vertically polarized endfire antenna 70 is added between the radiating layer 11 and the conductive floor 13. At this time, the antenna device is a dual-polarized antenna device, and the two polarized radiation directions do not affect each other.

Alternatively, as shown in fig. 18, 19 and 20, the vertically polarized endfire antenna 70 includes a cavity sidewall 71 and a cavity top surface 72, the cavity top surface 72 being connected to the conductive ground plane 13 by the cavity sidewall 71.

Specifically, the cavity top surface 72 may be located between the dielectric layer 2c and the dielectric layer 2d, the cavity side wall 71 penetrates through the dielectric layer 2d and the dielectric layer 2e, the cavity side wall 71 is a conductive structure, for example, a side wall formed by arranging metal pillars, the metal pillars may be hollow metal pillars or solid metal pillars, the cavity top surface 72 is a conductive structure, a feeding structure 73 is disposed inside the cavity, the feeding structure 73 is connected to the conductive floor 13, the vertical polarization end-fire antenna 70 is used for realizing electromagnetic wave radiation in a vertical direction, and a radiation direction of the vertical polarization end-fire antenna 70 is perpendicular to a plane direction of the conductive floor 13. The cavity top surface 72, in addition to forming a cavity for radiation, also serves to realize the function of an isolation layer, and suppresses active radiation of the reflective plate 101 in the horizontally polarized endfire antenna, that is, an orthographic projection of the cavity top surface 72 on the conductive floor 13 overlaps with an orthographic projection of the reflective plate 101 on the conductive floor 13. A metalized row hole 74 penetrating through the feed dielectric layer 21 may be disposed on the feed dielectric layer 21 to prevent electromagnetic leakage, and the metalized row hole 74 may be a hollow metal pillar.

The examples of the present application are further illustrated by simulation experimental data as follows:

as shown in fig. 21, fig. 21 is a graph of simulation results of reflection coefficients of a horizontally polarized endfire antenna in the embodiment of the present application, where the horizontal axis represents frequency and the vertical axis represents antenna reflection coefficients, i.e., S parameters. The curves in the figure represent the reflection coefficient simulation curves of the horizontally polarized end-fire antenna in the embodiment of the application. As can be seen from the curve of the change of the antenna reflection coefficient along with the frequency, the bandwidth of the antenna can cover 24.25GHz-27.5GHz and 26.5GHz-29.5GHz, and a large margin is left for the bandwidth.

As shown in fig. 22, fig. 22 is a graph of simulation results of gain of a horizontally polarized endfire antenna in a vertical plane (x-axis plane and z-axis plane) at 25GHz in the embodiment of the present application, where the horizontal axis represents azimuth angle and the vertical axis represents gain of the antenna. The curve in the figure represents a simulation curve of the gain of a horizontal polarized end-fire antenna in the vertical plane at 25 GHz. The change curve of the antenna gain along with the azimuth angle can be seen, so that the beam upwarp problem caused by the conductive floor can be improved.

As shown in fig. 23, fig. 23 is a graph of simulation results of gain of a horizontally polarized endfire antenna in the vertical plane (x-axis plane and z-axis plane) at 27GHz in the embodiment of the present application, where the horizontal axis represents azimuth angle and the vertical axis represents gain of the antenna. The curve in the figure represents a simulation curve of the gain of a horizontal polarized end-fire antenna in the vertical plane at 27 GHz. The change curve of the antenna gain along with the azimuth angle can be seen, so that the beam upwarp problem caused by the conductive floor can be improved.

As shown in fig. 24, fig. 24 is a graph of simulation results of gain of a horizontally polarized endfire antenna in the vertical plane (x-axis plane and z-axis plane) at 29GHz in the embodiment of the present application, where the horizontal axis represents azimuth angle and the vertical axis represents gain of the antenna. The curves in the figures represent the simulated gain curves for the horizontally polarized endfire antenna in fig. 4-6 in the vertical plane at 29 GHz. The change curve of the antenna gain along with the azimuth angle can be seen, so that the beam upwarp problem caused by the conductive floor can be improved.

As shown in fig. 25, fig. 25 is a graph of simulation results of the maximum gain of a horizontally polarized endfire antenna in the horizontal plane (x and y axes) as a function of frequency in the embodiment of the present application, where the horizontal axis represents frequency and the vertical axis represents the maximum gain in the horizontal plane. The curve in the figure represents a simulation curve of the maximum gain of the horizontally polarized endfire antenna in the horizontal plane as a function of frequency. It can be seen from the curve of the maximum gain of the antenna in the horizontal plane as a function of frequency that the maximum radiation gain of the antenna in the horizontal plane is greater than 4 dBi.

As shown in fig. 26, fig. 26 is a graph of simulation results of S parameters of a dual-polarized antenna device in the embodiment of the present application in the horizontal plane (x-axis plane and y-axis plane), where the horizontal axis represents frequency and the vertical axis represents antenna reflection coefficient. The curves in the figure represent reflection coefficient simulation curves for the antenna device. From the curve of the antenna reflection coefficient with the frequency, it can be seen that the bandwidth of the antenna device can cover 26.5GHz-29.5GHz, and the port isolation is up to 26 dB.

As shown in fig. 27, fig. 27 is a graph of simulation results of gain in vertical plane (x-axis plane and z-axis plane) at 27GHz of a dual-polarized antenna device in the embodiment of the present application, where the horizontal axis represents azimuth angle and the vertical axis represents gain of the antenna. The curves in the figure represent the gain simulation curves for the antenna arrangement in the vertical plane at 27 GHz. The change curve of the antenna gain along with the azimuth angle can be seen, so that the beam upwarp problem caused by the conductive floor can be improved.

An embodiment of the present application further provides a chip, including: and the antenna device, wherein the radio frequency unit is positioned on one side of the conductive floor 13 far away from the radiation layer 11, so that the conductive floor 13 shields the radio frequency unit from adverse effects on antenna performance caused by coupling.

The specific structure and principle of the antenna device may be the same as those of the above embodiments, and are not described herein again.

The chip in this application embodiment, with radio frequency unit and antenna device integration together, on the one hand, reduces the harmful effects that external device coupling caused to the antenna performance through the shielding function on electrically conductive floor, and on the other hand, has the corner cut through setting up the dielectric layer between radiation layer and the electrically conductive floor, utilizes the refraction of electromagnetic wave to restrain the beam upwarp that electrically conductive floor reflection leads to, has improved the end-fire characteristic of antenna.

The embodiment of the application also provides a terminal which comprises the antenna device.

The specific structure and principle of the antenna device may be the same as those of the above embodiments, and are not described again. A terminal, also called User Equipment (UE), is a device providing voice and/or data connectivity to a User, for example, a handheld device with a wireless connection function, a vehicle-mounted device, and so on. Common terminals include, for example: the mobile phone includes a mobile phone, a tablet computer, a notebook computer, a palm computer, a Mobile Internet Device (MID), and a wearable device such as a smart watch, a smart bracelet, a pedometer, and the like.

The terminal in the embodiment of the application, on the one hand, reduce the harmful effects that external device coupling caused to the antenna performance through the shielding function on electrically conductive floor, on the other hand, have the corner cut through setting up the dielectric layer between radiation layer and the electrically conductive floor, utilize the refraction of electromagnetic wave to restrain the beam upwarp that electrically conductive floor reflection leads to, improved the endfire characteristic of antenna.

In the embodiments of the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, and means that there may be three relationships, for example, a and/or B, and may mean that a exists alone, a and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An antenna device, comprising:

the antenna comprises a radiation layer, a plurality of dielectric layers and a conductive floor, wherein the radiation layer, the plurality of dielectric layers and the conductive floor are arranged in a stacked mode, the radiation layer is at least used for radiating millimeter wave signals, the plurality of dielectric layers are located between the radiation layer and the conductive floor, and the plurality of dielectric layers comprise a first dielectric layer;

in the first dielectric layer, an included angle between a radiation direction end face and a bottom face is an acute angle, the radiation direction end face is located at one end, facing the radiation direction of the horizontal polarization end-fire antenna, of the layer, and the bottom face is the surface of the layer, close to one side of the conductive floor;

in the plurality of dielectric layers, at least two adjacent dielectric layers have different relative dielectric constants, and the relative dielectric constant of one of the two adjacent dielectric layers close to the radiation layer is smaller than the relative dielectric constant of one of the two adjacent dielectric layers close to the conductive floor.

2. The antenna device of claim 1, wherein the plurality of dielectric layers comprises:

a second dielectric layer positioned between the first dielectric layer and the conductive floor, the second dielectric layer being adjacent to the first dielectric layer;

the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂，E₁＜E₂。

3. The antenna device according to claim 2,

in the first dielectric layer, the included angle between the end face of the radiation direction and the bottom face is theta₁；

In the second dielectric layer, the included angle between the end face of the radiation direction and the bottom surface is theta₂，0°＜θ₂＜θ₁＜90°。

4. The antenna device of claim 2, wherein the plurality of dielectric layers comprises:

a third dielectric layer positioned between the second dielectric layer and the conductive floor, the third dielectric layer being adjacent to the second dielectric layer;

the relative dielectric constant of the third dielectric layer is E₃，E₂≤E₃。

5. The antenna device of claim 3, wherein the plurality of dielectric layers comprises:

6. The antenna device of claim 1, wherein the plurality of dielectric layers comprises:

a second dielectric layer positioned between the first dielectric layer and the radiation layer, the second dielectric layer being adjacent to the first dielectric layer;

the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂，E₂＜E₁。

7. The antenna device of claim 6, wherein the plurality of dielectric layers comprises:

a third dielectric layer located between the second dielectric layer and the radiation layer, the third dielectric layer being adjacent to the second dielectric layer;

the relative dielectric constant of the third dielectric layer is E₃，E₃≤E₂。

8. The antenna device of claim 1, wherein the plurality of dielectric layers comprises:

a third dielectric layer positioned between the first dielectric layer and the radiation layer, the third dielectric layer being adjacent to the first dielectric layer;

the relative dielectric constant of the first dielectric layer is E ₁The relative dielectric constant of the second dielectric layer is E₂The relative dielectric constant of the third dielectric layer is E₃，E₃≤E₁≤E₂And E is₃＜E₂。

9. The antenna device of claim 1, wherein the plurality of dielectric layers comprises:

a second dielectric layer and a third dielectric layer located between the first dielectric layer and the conductive floor, the first dielectric layer and the second dielectric layer being adjacent, the second dielectric layer and the third dielectric layer being adjacent, the second dielectric layer being located between the first dielectric layer and the third dielectric layer;

the relative dielectric constant of the first dielectric layer is E₁The relative dielectric constant of the second dielectric layer is E₂The relative dielectric constant of the third dielectric layer is E₃，E₁≤E₂≤E₃And E is₁＜E₃；

In the third dielectric layer, the included angle between the end face of the radiation direction and the bottom face is theta₃，0°＜θ₃＜θ₁＜90°。

10. The antenna device of claim 1,

the radiation layer comprises a reflecting plate and a dipole, and the dipole is positioned at one end of the reflecting plate facing the radiation direction of the horizontally polarized endfire antenna;

The antenna device further comprises an isolation layer located between the radiation layer and the conductive floor, the isolation layer is electrically connected to the conductive floor, and an orthographic projection of the isolation layer on the conductive floor and an orthographic projection of the reflection plate on the conductive floor are overlapped.

11. The antenna device according to any of claims 2 to 9,

one of the two dielectric layers with different relative dielectric constants is a first through hole layer, the other one of the two dielectric layers with different relative dielectric constants is a second through hole layer, and through holes are respectively formed in the first through hole layer and the second through hole layer;

the first via layer and the second via layer have different via structures, the via structures including one of: number of through holes, position of through holes, and aperture of through holes.

12. The antenna device of claim 11,

the first via layer is located between the radiation layer and the second via layer;

the number and the positions of the through holes on the first through hole layer and the second through hole layer are the same;

the through hole aperture of the first through hole layer is larger than that of the second through hole layer.

13. The antenna device according to claim 11,

the through hole apertures of the first through hole layer and the second through hole layer are the same;

the via density of the first via layer is greater than the via density of the second via layer.

14. The antenna device of claim 1,

the horizontally polarized endfire antenna also comprises a feed layer, wherein the feed layer is positioned on one side of the radiation layer far away from the conductive floor;

15. The antenna device of claim 1, further comprising:

a vertically polarized endfire antenna positioned between a radiating layer of the horizontally polarized endfire antenna and a conductive floor.

16. The antenna device of claim 15,

the vertical polarization end-fire antenna comprises a cavity side wall and a cavity top surface, and the cavity top surface is connected to the conductive floor through the cavity side wall.

17. A chip, comprising:

a radio frequency unit and an antenna device as claimed in any one of claims 1 to 16.

18. A terminal, characterised in that it comprises an antenna device according to any one of claims 1 to 16.