CN112908594A - Low-temperature coefficient metal film resistor - Google Patents
Low-temperature coefficient metal film resistor Download PDFInfo
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- CN112908594A CN112908594A CN202110079496.6A CN202110079496A CN112908594A CN 112908594 A CN112908594 A CN 112908594A CN 202110079496 A CN202110079496 A CN 202110079496A CN 112908594 A CN112908594 A CN 112908594A
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- ring
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- resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/001—Mass resistors
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- Electromagnetism (AREA)
- Resistance Heating (AREA)
Abstract
The invention provides a low temperature coefficient metal film resistor, which comprises an array clamp, a resistor and a lead, wherein the resistor comprises a film wall, a wire resistance tube, a heat insulation layer and a bridging plate, the invention enables a tightening structure to be matched with an embedding ring through the bridging plate to concentrate a circuit in a bottom plate, a movable ring is pulled out from a closed ring through a clamping block and is connected with an opposite telescopic ring up and down, the telescopic ring forms a ring shape to be jointed with the lead, an oxidation film on the outer side can contract inwards when disappearing, thereby avoiding the loosening of a conductive cap, meanwhile, the invention can continuously heat the outer cover and the embedding hole when a gap exists between the outer cover and the embedding hole by generating heat through a heating pipe in the outer cover, the heat emitted by a probe is concentrated and emitted together by virtue of the distribution of heat dissipation holes, and partial heat can be absorbed into an arc block at the edge of an inner interlayer when flowing into a hollow tube, when the external temperature affects the inside, the absorbed heat can be radiated, thereby weakening the influence of temperature reduction on equipment.
Description
Technical Field
The invention relates to the technical field of resistors, in particular to a low-temperature coefficient metal film resistor.
Background
The low-temperature metal film resistor is a thermosensitive part in a capacitor, is easily influenced by temperature to adjust resistance, is widely applied to the electronic industry, and is used for blocking current through a resistor array.
In the use process of the low-temperature metal film resistor in the prior art, because the oxide film on the outer side of the low-temperature metal film resistor can be reduced along with the use time, the connection between the conductive cap of the tube body and the pins is not firm, the conduction between the lead and the resistance wire is not smooth, and the conductive cap falls off to enable the temperature to be isolated, so that the resistance value is improved, the workload of the resistor is aggravated, and the service life of the resistor is shortened.
Disclosure of the invention technical problem (1)
Aiming at the defects of the prior art, the invention provides a low-temperature coefficient metal film resistor to solve the existing use problem.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a low temperature coefficient metal film resistor, its structure includes array clamp, resistor, lead wire, array clamp block centre gripping is at the lead wire front end, the inside gomphosis with the lead wire of resistor is connected, the resistor includes the membrane wall, hinders a pipe, insulating layer, bridging plate, membrane wall welded connection hinders the outside of a pipe, hinder a tub tail end and insulating layer embedded solid and be connected, insulating layer rear end and bridging plate bolted connection.
Preferably, the bridging plate comprises an embedding and ejecting ring, a top mounting plate, a bottom plate and two tightening structures, wherein the embedding and ejecting ring is welded and connected inside the top mounting plate, the top mounting plate is connected at the front end of the bottom plate through bolts, the inside of the bottom plate is movably clamped with the tightening structures, and the two tightening structures are distributed on the bottom plate at equal intervals and correspond to the embedding and ejecting ring.
Preferably, the tightening structure comprises an outer ring, a connecting rod, a connecting block and telescopic rings, wherein the inner side of the outer ring is movably connected with the telescopic rings, the connecting rod is welded at the front end of the outer ring, the connecting block is movably embedded at the side end of the outer ring in a penetrating manner, and the telescopic rings are oppositely arranged on the inner side of the outer ring and are distributed in a vertically staggered manner.
Preferably, the telescopic ring comprises a closed ring, a movable ring and a clamping block, the inside of the closed ring is connected with the movable ring in an embedded mode, the side end of the movable ring is connected with the clamping block through a bolt, the clamping block is movably embedded at the right end of the closed ring, and the clamping block is arranged at the side end of the movable ring and is connected with an upper part component and a lower part component.
Preferably, the heat insulation layer comprises an outer cover, embedding holes, heating pipes and heated plates, the outer cover is connected to the outer sides of the heated plates in a welding mode, the embedding holes penetrate through the middle of the outer cover in an embedded mode, the heating pipes are connected to the inner side ends of the outer cover in an embedded mode, the outer ends of the heated plates are connected with the heating pipes in an embedded mode, the number of the heated plates is two, and the heated plates are arranged on the sides of the embedding holes.
Preferably, the heated plate comprises a plate body, probes and heat dissipation holes, the plate body is connected to the outer side of the heat dissipation holes in a welded mode, the probes are connected to the inner portion of the plate body in an embedded mode, and the heat dissipation holes are formed in the side edges of the probes and distributed in the plate body at equal intervals.
Preferably, the heat dissipation holes comprise hole walls, hollow pipes and inner insulation layers, the hole walls are connected to the outer ends of the inner insulation layers in a welded mode, the hollow pipes are connected to the middle portions of the inner insulation layers in an embedded mode, the inner insulation layers are made of soft porcelain materials, and arc-shaped blocks are filled at the connection portions of the inner insulation layers and the hollow pipes.
(II) advantageous effects
The invention provides a metal film resistor with a low temperature coefficient. The method has the following beneficial effects:
1. the tightening structure is matched with the embedding cap ring through the bridging plate to concentrate circuits in the bottom plate, the movable ring is pulled out from the closed ring through the clamping block and is connected with the opposite telescopic rings up and down, the telescopic rings are screwed tightly by the connecting block, the telescopic rings on the inner side of the outer ring form a ring shape to be attached to the lead, and the outer side oxidation film can shrink inwards when disappearing, so that the looseness of the conductive cap is avoided.
2. According to the invention, the heating pipe in the outer cover generates heat, so that the outer cover and the embedding hole can be continuously heated when a gap exists between the outer cover and the embedding hole, the heat emitted by the probe is distributed by virtue of the heat radiation holes, so that the heat is intensively emitted together, part of the heat can be absorbed into the arc-shaped block at the edge of the inner interlayer when flowing into the hollow pipe in the hole wall, and the absorbed heat can be emitted when the external temperature affects the inside, so that the influence of temperature reduction on equipment is weakened.
Drawings
FIG. 1 is a schematic diagram of a low temperature coefficient metal film resistor according to the present invention;
FIG. 2 is a schematic diagram of the structure of the resistor of the present invention;
FIG. 3 is a schematic structural view of a bridge plate according to the present invention;
figure 4 is a schematic structural view of a lacing structure of the present invention;
FIG. 5 is a schematic view of the telescopic ring of the present invention;
FIG. 6 is a schematic view of the structure of the thermal insulation layer of the present invention;
FIG. 7 is a schematic view of a heated plate according to the present invention;
FIG. 8 is a schematic view of a heat dissipation hole of the present invention;
in the figure: the array clamp comprises an array clamp-1, a resistor-2, a lead-3, a membrane wall-21, a filament-blocking tube-22, a heat insulation layer-23, a bridging plate-24, an embedding ring-241, a top mounting plate-242, a bottom plate-243, a tightening structure-244, an outer ring-a 1, a connecting rod-a 2, a connecting block-a 3, an expansion ring-a 4, a closed ring-a 41, a movable ring-a 42, a clamping block-a 43, an outer cover-231, an embedding hole-232, a heating tube-233, a heated plate-234, a plate body-b 1, a probe-b 2, a heat dissipation hole-b 3, a hole wall-b 31, a hollow tube-b 32 and an inner partition layer-b 33.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1 to 5, an embodiment of the invention provides a low temperature coefficient metal film resistor, which includes an array clip 1, a resistor 2, and a lead 3, wherein the array clip 1 is clamped at a front end of the lead 3, an inner portion of the resistor 2 is connected with the lead 3 in a fitting manner, the resistor 2 includes a film wall 21, a filament-resisting tube 22, a heat-insulating layer 23, and a bridge plate 24, the film wall 21 is connected to an outer side of the filament-resisting tube 22 in a welding manner, a tail end of the filament-resisting tube 22 is connected with the heat-insulating layer 23 in a fitting manner, and a rear end of the heat-insulating layer 23 is connected with the bridge plate.
The bridge plate 24 comprises an embedding ring 241, a top mounting plate 242, a bottom plate 243 and a tightening structure 244, wherein the embedding ring 241 is welded inside the top mounting plate 242, the top mounting plate 242 is connected to the front end of the bottom plate 243 through bolts, the bottom plate 243 is movably clamped with the tightening structure 244, the tightening structures 244 are two in number, are distributed on the bottom plate 243 at equal intervals and correspond to the embedding ring 241, and are used for intensively fixing the lines through the tightening structure 244, so that the lines are prevented from being entangled.
The lacing structure 244 comprises an outer ring a1, a connecting rod a2, a connecting block a3 and a telescopic ring a4, wherein the inner side of the outer ring a1 is movably connected with the telescopic ring a4, the connecting rod a2 is connected to the front end of the outer ring a1 in a welding mode, the connecting block a3 penetrates through the side end of the outer ring a1 in a movable embedded mode, the telescopic rings a4 are oppositely arranged on the inner side of the outer ring a1 in a vertical staggered mode, and when an outer oxidation film disappears, the outer oxidation film can contract inwards through the telescopic ring a4, so that loosening of a conductive cap is avoided.
The telescopic ring a4 comprises a closed ring a41, a movable ring a42 and a clamping block a43, the inside of the closed ring a41 is connected with the movable ring a42 in an embedded mode, the side end of the movable ring a42 is connected with the clamping block a43 through bolts, the clamping block a43 is movably embedded at the right end of the closed ring a41, the clamping block a43 is arranged at the edge end of the movable ring a42 and is connected with the upper and lower layer parts, and the movable ring a42 connects the clamping block a43 with the clamping block a43 of the opposite layer after being pulled out, so that the closed ring a41 is firmer.
The specific working process is as follows:
in the invention, a lead 3 is connected into a capacitor, the lead is straightened by an array clamp 1 to facilitate the installation of a resistor 2, the current is blocked by a filament-blocking pipe 22 in a film wall 21, a tightening structure 244 is matched with an embedding ring 241 of an upper top-mounting plate 242 by utilizing bridge plates 24 at the upper end and the lower end of a heat insulation layer 23, circuits are concentrated in a bottom plate 243, a movable ring a42 is pulled out from a closed ring a41 by a clamping block a43 and is connected with an opposite telescopic ring a4 up and down, the telescopic ring a4 is screwed by a connecting block a3, the telescopic ring a4 at the inner side of an outer ring a1 is formed into a ring shape to be attached to the lead 3, and when an outer side oxide film disappears, the lead can contract inwards, thereby avoiding the loosening of a conductive cap.
Example 2
As shown in fig. 6 to 8, an embodiment of the invention provides a low temperature coefficient metal film resistor, wherein the thermal insulation layer 23 includes an outer cover 231, fitting holes 232, heating pipes 233, and a heated plate 234, the outer cover 231 is welded and connected to the outer side of the heated plate 234, the fitting holes 232 are fixedly inserted and connected to the middle of the outer cover 231, the heating pipes 233 are fitted and connected to the inner side end of the outer cover 231, the outer ends of the heated plate 234 are connected to the heating pipes 233 in a snap-fit manner, the heated plates 234 are two in total and are arranged at the side of the fitting holes 232, and the heated plate 234 is subjected to heat dissipation through the heating pipes 233, so that the outer cover 231 and the fitting holes 232 can be continuously heated when a gap exists therebetween, and the circuit is prevented.
The heated plate 234 comprises a plate body b1, a probe b2 and a heat radiation hole b3, wherein the plate body b1 is connected with the outer side of the heat radiation hole b3 in a welding mode, the probe b2 is connected with the inner side of the plate body b1 in a embedding mode, the heat radiation hole b3 is arranged on the side edge of the probe b2 and is distributed in the plate body b1 at equal intervals, heat emitted by the probe b2 is exhausted from the heat radiation hole b3, and the heat is intensively emitted together through the distribution of the heat radiation hole b 3.
The heat dissipation holes b3 comprise hole walls b31, hollow pipes b32 and inner partition layers b33, the hole walls b31 are connected to the outer ends of the inner partition layers b33 in a welded mode, the hollow pipes b32 are connected to the middle of the inner partition layers b33 in an embedded mode, the inner partition layers b33 are made of soft porcelain, arc-shaped blocks are filled at the connection positions of the inner partition layers b33 and the hollow pipes b32, partial heat can be absorbed into the arc-shaped blocks when flowing into the hollow pipes b32, and absorbed heat can be dissipated when the external temperature affects the inside, so that the influence of the low temperature on equipment is reduced.
The specific working process is as follows:
in the invention, heat is generated by the heating pipe 233 in the outer cover 231 and is conducted to the embedding hole 232 from the heated plate 234, so that the outer cover 231 and the embedding hole 232 can be continuously heated when a gap exists between the outer cover 231 and the embedding hole 232, the heat is radiated by the probe b2 in the plate body b1 and is exhausted from the heat radiation hole b3, the heat is intensively radiated together by virtue of the distribution of the heat radiation hole b3, part of the heat is absorbed into the arc-shaped block at the edge of the inner interlayer b33 when flowing into the hollow pipe b32 in the hole wall b31, and the absorbed heat is radiated when the external temperature affects the inside, so that the excessive heat radiation is reduced, and the influence of the temperature reduction on equipment is weakened.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a low temperature coefficient metal film resistor, its structure includes array clamp (1), resistor (2), lead wire (3), array clamp (1) block centre gripping is in lead wire (3) front end, the inside and lead wire (3) gomphosis of resistor (2) are connected, its characterized in that:
the resistor (2) comprises a film wall (21), a wire blocking pipe (22), a heat insulation layer (23) and a bridging plate (24), wherein the film wall (21) is connected to the outer side of the wire blocking pipe (22) in a welding mode, the tail end of the wire blocking pipe (22) is fixedly connected with the heat insulation layer (23) in an embedding mode, and the rear end of the heat insulation layer (23) is connected with the bridging plate (24) through bolts.
2. The low temperature coefficient metal film resistor of claim 1, wherein: the bridge plate (24) comprises an embedding ring (241), a top mounting plate (242), a bottom plate (243) and a tightening structure (244), the embedding ring (241) is connected inside the top mounting plate (242) in a welding mode, the top mounting plate (242) is connected to the front end of the bottom plate (243) through bolts, and the inside of the bottom plate (243) is movably clamped with the tightening structure (244).
3. The low temperature coefficient metal film resistor of claim 2, wherein: the tightening structure (244) comprises an outer ring (a1), a connecting rod (a2), a connecting block (a3) and an expansion ring (a4), wherein the inner side of the outer ring (a1) is movably connected with the expansion ring (a4), the connecting rod (a2) is connected to the front end of the outer ring (a1) in a welding mode, and the connecting block (a3) penetrates through the side end of the outer ring (a1) and is movably embedded in the outer ring.
4. The low temperature coefficient metal film resistor of claim 3, wherein: the telescopic ring (a4) comprises a closing ring (a41), a movable ring (a42) and a clamping block (a43), wherein the inside of the closing ring (a41) is connected with the movable ring (a42) in a chimeric mode, the side end of the movable ring (a42) is connected with the clamping block (a43) through a bolt, and the clamping block (a43) is movably embedded at the right end of the closing ring (a 41).
5. The low temperature coefficient metal film resistor of claim 1, wherein: the heat insulation layer (23) comprises an outer cover (231), an embedding hole (232), a heating pipe (233) and a heated plate (234), the outer cover (231) is connected to the outer side of the heated plate (234) in a welding mode, the embedding hole (232) penetrates through and is fixedly connected to the middle of the outer cover (231), the heating pipe (233) is connected to the inner side end of the outer cover (231) in an embedding mode, and the outer end of the heated plate (234) is connected with the heating pipe (233) in a clamping mode.
6. The low temperature coefficient metal film resistor of claim 5, wherein: the heated plate (234) comprises a plate body (b1), a probe (b2) and a heat dissipation hole (b3), wherein the plate body (b1) is connected to the outer side of the heat dissipation hole (b3) in a welding mode, and the probe (b2) is connected to the inside of the plate body (b1) in a embedding mode.
7. The low temperature coefficient metal film resistor of claim 6, wherein: the heat dissipation hole (b3) comprises a hole wall (b31), a hollow pipe (b32) and an inner interlayer (b33), wherein the hole wall (b31) is connected to the outer end of the inner interlayer (b33) in a welding mode, and the hollow pipe (b32) is connected to the middle of the inner interlayer (b33) in a embedding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079496.6A CN112908594A (en) | 2021-01-21 | 2021-01-21 | Low-temperature coefficient metal film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110079496.6A CN112908594A (en) | 2021-01-21 | 2021-01-21 | Low-temperature coefficient metal film resistor |
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| Publication Number | Publication Date |
|---|---|
| CN112908594A true CN112908594A (en) | 2021-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110079496.6A Withdrawn CN112908594A (en) | 2021-01-21 | 2021-01-21 | Low-temperature coefficient metal film resistor |
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| CN (1) | CN112908594A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206569024U (en) * | 2017-03-16 | 2017-10-20 | 嵊州市艾诺威汽车配件有限公司 | A kind of automobile water pipe geometrical clamp |
| CN108442627A (en) * | 2018-05-22 | 2018-08-24 | 董帅 | Exchange heat decorative wall panels |
| CN111816396A (en) * | 2020-06-12 | 2020-10-23 | 安徽昭田电子科技有限公司 | Low-temperature coefficient metal film resistor and manufacturing process thereof |
| CN212136093U (en) * | 2020-05-27 | 2020-12-11 | 天津市三环电阻有限公司 | Metal film resistor with built-in low temperature coefficient |
| CN212303257U (en) * | 2020-06-07 | 2021-01-05 | 南京珀轩电子科技有限公司 | Low-temperature coefficient metal film resistor |
-
2021
- 2021-01-21 CN CN202110079496.6A patent/CN112908594A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206569024U (en) * | 2017-03-16 | 2017-10-20 | 嵊州市艾诺威汽车配件有限公司 | A kind of automobile water pipe geometrical clamp |
| CN108442627A (en) * | 2018-05-22 | 2018-08-24 | 董帅 | Exchange heat decorative wall panels |
| CN212136093U (en) * | 2020-05-27 | 2020-12-11 | 天津市三环电阻有限公司 | Metal film resistor with built-in low temperature coefficient |
| CN212303257U (en) * | 2020-06-07 | 2021-01-05 | 南京珀轩电子科技有限公司 | Low-temperature coefficient metal film resistor |
| CN111816396A (en) * | 2020-06-12 | 2020-10-23 | 安徽昭田电子科技有限公司 | Low-temperature coefficient metal film resistor and manufacturing process thereof |
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Application publication date: 20210604 |
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