CN112902712A - Chip cooling heat exchanger - Google Patents
Chip cooling heat exchanger Download PDFInfo
- Publication number
- CN112902712A CN112902712A CN202110331032.XA CN202110331032A CN112902712A CN 112902712 A CN112902712 A CN 112902712A CN 202110331032 A CN202110331032 A CN 202110331032A CN 112902712 A CN112902712 A CN 112902712A
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- China
- Prior art keywords
- plate
- heat exchanger
- channel
- liquid outlet
- liquid inlet
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention provides a chip cooling heat exchanger, and belongs to the technical field of heat exchangers. The chip cooling heat exchanger comprises a heat exchanger main body, wherein the heat exchanger main body is formed by superposing a first plate and a second plate, a liquid inlet channel, a liquid outlet channel and at least one intermediate channel are formed between the first plate and the second plate, the liquid inlet channel is connected with a liquid inlet connecting pipe, the liquid outlet channel is connected with a liquid outlet connecting pipe, and the intermediate channel is connected between the liquid inlet channel and the liquid outlet channel. Compared with the traditional chip cooler, the channel and the plate body are integrated, the structure is simple, the operation is reliable, high pressure resistance is realized, and the risk that the heat exchange is influenced because the channel is separated from a heat source or a gap exists between the channel and the heat source is avoided; the structure is simple, the manufacture is simple, the cost is low, and the heat exchange medium directly enters the cooling heat exchanger to ensure the stable operation of the chip.
Description
Technical Field
The invention belongs to the technical field of heat exchangers, and relates to a chip cooling heat exchanger.
Background
Traditional radiator is the inside U type copper pipe of inserting of section bar aluminium pig mostly, and the heat dissipation original paper gives the aluminium pig to heat transfer, and the aluminium pig gives the copper pipe to heat transfer, and the inside fluid of copper pipe takes away the heat, has aluminium pig and copper pipe contact failure like this, influences the heat transfer effect, but also has passageway and heat source break away from the contact or have the gap, influences the risk of heat transfer.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a chip cooling heat exchanger.
The purpose of the invention can be realized by the following technical scheme: a chip cooling heat exchanger comprises a heat exchanger main body and is characterized in that the heat exchanger main body is formed by superposing a first plate and a second plate, a liquid inlet channel, a liquid outlet channel and at least one intermediate channel are formed between the first plate and the second plate, the liquid inlet channel is connected with a liquid inlet connecting pipe, the liquid outlet channel is connected with a liquid outlet connecting pipe, and the intermediate channel is connected between the liquid inlet channel and the liquid outlet channel.
In the chip cooling heat exchanger, the inner wall surface of the plate II is provided with a liquid inlet cavity, a liquid outlet cavity and at least one intermediate cavity, the liquid inlet cavity and the inner wall surface of the plate I are concave inwards, the liquid inlet cavity and the inner wall surface of the plate I form a liquid inlet channel together, the liquid outlet cavity and the inner wall surface of the plate I form a liquid outlet channel together, and the intermediate cavity and the inner wall surface of the plate I form an intermediate channel together.
In the chip cooling heat exchanger, the first plate is a plane plate, and the inner wall surfaces of the second plate, which are positioned at the peripheries of the liquid inlet cavity, the liquid outlet cavity and the middle cavity, are welded and connected with the inner wall surface of the first plate through flat edges.
In the above chip cooling heat exchanger, the cross section of the intermediate channel is circular, semicircular, elliptical, semi-elliptical or square.
In the above chip cooling heat exchanger, the projection shape of the intermediate channel is a linear type or a wave type.
In the chip cooling heat exchanger, the outer edge of the first plate is provided with a first flanging protruding towards one side of the second plate, the outer edge of the second plate is provided with a second flanging protruding towards one side of the first plate, the outer contour of the second flanging is matched with the inner contour of the first flanging, when the inner wall face of the second plate is abutted against the inner wall face of the first plate, the outer wall face of the second flanging is abutted against the inner wall face of the first flanging, and the second flanging and the first flanging are connected through flat edge welding.
In the chip cooling heat exchanger, the first plate sheet is provided with a positioning edge turned over towards one side of the second plate sheet, and the inner wall surface of the second plate sheet is provided with a connecting pipe accommodating cavity.
In foretell chip cooling heat exchanger, slab one and slab two are the rectangular plate, the inlet channel all sets up along the length direction of rectangle heat exchanger main part with going out the liquid channel, the inlet channel is taken over the one end that sets up the length direction in rectangle heat exchanger main part, go out the liquid and take over the setting and take over homonymy, offside or avris at the inlet channel.
In the above chip cooling heat exchanger, the liquid inlet channel is a plurality of, and a plurality of liquid inlet channel intervals set up, and each liquid inlet channel all is connected with a feed liquor and takes over, the liquid outlet channel is a plurality of, and a plurality of liquid outlet channel intervals set up, and each liquid outlet channel all is connected with one and goes out the liquid and take over.
In the chip cooling heat exchanger, the first plate is provided with a plurality of through positioning holes I, the second plate is provided with a plurality of through positioning holes II, and the positions of the positioning holes II and the positions of the positioning holes I are arranged in a one-to-one correspondence manner. And the inner wall surface of the first plate positioned on the periphery of the first positioning hole is connected with the inner wall surface of the second plate positioned in the second positioning hole through flat edge welding.
Compared with the prior art, the invention combines the original two independent section aluminum blocks and the U-shaped copper pipe into a component, compared with the traditional chip cooler, the channel and the plate body are integrated, the structure is simple, the operation is reliable, the high pressure is resistant, and the risk that the heat exchange is influenced because the channel is separated from the heat source or a gap exists between the channel and the heat source is avoided; the structure is simple, the manufacture is simple, the cost is low, and the heat exchange medium directly enters the cooling heat exchanger to ensure the stable operation of the chip.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention.
Fig. 2 is a front view of the first embodiment of the present invention.
Fig. 3 is a sectional view a-a of fig. 2.
Fig. 4 is a sectional view B-B of fig. 2.
Fig. 5 is an exploded view of a first embodiment of the present invention.
Fig. 6 is a front view of the second embodiment of the present invention.
Fig. 7 is a front view of a third embodiment of the present invention.
Fig. 8 is a front view of a fourth embodiment of the present invention.
Fig. 9 is a front view of a fifth embodiment of the present invention.
Fig. 10 is a front view of a sixth embodiment of the present invention.
Fig. 11 is a front view of a seventh embodiment of the invention.
In the figure, 1, a first plate; 101. flanging one; 102. a first positioning hole; 103. positioning the edge; 2. a second plate sheet; 201. a liquid inlet cavity; 202. a liquid outlet cavity; 203. a middle cavity; 204. flanging two; 205. a connecting pipe accommodating cavity; 206. a second positioning hole; 3. a liquid inlet channel; 4. a liquid outlet channel; 5. a middle channel; 6. a liquid inlet connecting pipe; 7. and (4) a liquid outlet connecting pipe.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
The first embodiment is as follows:
referring to fig. 1 to 5, the first embodiment is a chip cooling heat exchanger, which includes a heat exchanger main body, the heat exchanger main body is formed by stacking a first plate 1 and a second plate 2 made of a stainless steel plate, a liquid inlet channel 3, a liquid outlet channel 4 and at least one intermediate channel 5 are formed between the first plate 1 and the second plate 2, the liquid inlet channel 3 is connected with a liquid inlet connection pipe 6, the liquid outlet channel 4 is connected with a liquid outlet connection pipe 7, and the intermediate channel 5 is connected between the liquid inlet channel 3 and the liquid outlet channel 4. Specifically, the inner wall surface of the plate piece two 2 is provided with a liquid inlet cavity 201, a liquid outlet cavity 202 and at least one intermediate cavity 203 which are concave relative to the plate piece one 1, the plate piece one 1 is a plane plate, the inner wall surfaces of the plate piece two 2, which are positioned on the periphery of the liquid inlet cavity 201, the liquid outlet cavity 202 and the intermediate cavity 203, are connected with the inner wall surface of the plate piece one 1 through flat edge welding, the liquid inlet cavity 201 and the inner wall surface of the plate piece one 1 form a liquid inlet channel 3 together, the liquid outlet cavity 202 and the inner wall surface of the plate piece one 1 form a liquid outlet channel 4 together, and the intermediate cavity 203 and the inner wall. The first plate 1 is provided with a positioning edge 103 turned over towards one side of the second plate 2, the inner wall surface of the second plate 2 is provided with a connecting pipe accommodating cavity 205, and the liquid inlet connecting pipe 6 and the liquid outlet connecting pipe 7 are respectively inserted into the positioning edge 103 and welded on the positioning edge 103 and the connecting pipe accommodating cavity 205. In this embodiment one, slab 1 and slab two 2 are the rectangular plate, and slab 1 and slab two 2 form the heat exchanger main part of rectangle jointly, and inlet channel 3 and outlet channel 4 all set up along the length direction of rectangle heat exchanger main part, and inlet channel 6 sets up the one end at the length direction of rectangle heat exchanger main part, and outlet channel 7 sets up the homonymy of taking over 6 at the inlet channel, realizes that the homonymy advances, and the homonymy is gone out. The first plate 1 is provided with a plurality of penetrating positioning holes 102, the second plate 2 is provided with a plurality of penetrating positioning holes 206, the positions of the positioning holes 206 and the positions of the positioning holes 102 are arranged in a one-to-one correspondence mode, the inner wall surface of the first plate 1, located on the periphery of the first positioning holes 102, is connected with the inner wall surface of the second plate 2, located on the second positioning holes 206, through flat edge welding, and mounting holes are formed after the first positioning holes 102 and the second positioning holes 206 are combined and used for fixing the heat exchanger main body.
The liquid inlet connecting pipe 6 and the liquid outlet connecting pipe 7 in the first embodiment can be stainless steel pipes, red copper pipes or cupronickel pipes, the liquid inlet connecting pipe 6, the liquid outlet connecting pipe 7, the first plate sheet 1 and the second plate sheet can be welded into a whole in the modes of brazing, laser welding and the like, the structure is simple, the manufacturing is simple, the cost is low, compared with a traditional chip cooler, a channel and a plate body are integrated, the structure is simple, and the operation is reliable.
Example two:
referring to fig. 6, the structure of the second embodiment is substantially the same as that of the first embodiment, and the difference is that the number of the liquid inlet connection pipe 6, the liquid outlet connection pipe 7, the liquid inlet channels 3 and the liquid outlet channels 4 in the second embodiment is two, the two liquid inlet channels 3 are arranged at intervals, each liquid inlet channel 3 is connected with one liquid inlet connection pipe 6, the two liquid outlet channels 4 are arranged at intervals, each liquid outlet channel 4 is connected with one liquid outlet connection pipe 7, and the second embodiment can realize two inlets and two outlets of the heat exchanger.
In addition, the heat exchanger can realize multi-input and multi-output by increasing the number of the liquid inlet connecting pipe 6, the liquid outlet connecting pipe 7, the liquid inlet channel 3 and the liquid outlet channel 4.
Example three:
referring to fig. 7, the third embodiment has a structure substantially the same as the first embodiment, and is different in that the outer edge of the first plate 1 in the third embodiment has a first flange 101 protruding toward one side of the second plate 2, the outer edge of the second plate 2 has a second flange 204 protruding away from one side of the first plate 1, the outer contour of the second flange 204 is matched with the inner contour of the first flange 101, the outer wall surface of the second flange 204 abuts against the inner wall surface of the first flange 101, and the second flange 204 and the first flange 101 are connected by flat edge welding, so that the welding area can be further increased, and the welding is firmer.
Example four:
referring to fig. 8, the structure of the fourth embodiment is basically the same as that of the third embodiment, but the difference is that the projection shape of the middle channel 5 of the fourth embodiment is a wave shape, the channel is longer, and the heat exchange effect is better.
Example five:
referring to fig. 9, the fifth embodiment is basically the same as the third embodiment in structure, and is different in that the projection shape of the middle channel 5 of the fifth embodiment is a straight line type, and the cross section is a square type.
Example six:
referring to fig. 10, the structure of the sixth embodiment is substantially the same as that of the third embodiment, and the difference is that the liquid outlet connection pipe 7 of the sixth embodiment is connected to the side edge of the rectangular heat exchanger main body, so as to realize one end inlet and one side outlet.
Example seven:
referring to fig. 11, the seventh embodiment has substantially the same structure as the third embodiment, and the difference is that the liquid outlet connection pipe 7 of the sixth embodiment is connected to the other end of the rectangular heat exchanger main body in the length direction, so as to realize one end inlet and the other end outlet.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides a chip cooling heat exchanger, includes the heat exchanger main part, its characterized in that, the heat exchanger main part is formed by slab (1) and slab two (2) looks superpose, form inlet channel (3), liquid outlet channel (4) and at least one intermediate passage (5) between slab (1) and slab two (2), inlet channel (3) are connected with the feed liquor and take over (6), liquid outlet channel (4) are connected with liquid outlet take over (7), intermediate passage (5) are connected between inlet channel (3) and liquid outlet channel (4).
2. The chip cooling heat exchanger according to claim 1, wherein the inner wall surface of the second plate (2) is provided with a liquid inlet cavity (201), a liquid outlet cavity (202) and at least one intermediate cavity (203) which are recessed relative to the first plate (1), the liquid inlet cavity (201) and the inner wall surface of the first plate (1) jointly form a liquid inlet channel (3), the liquid outlet cavity (202) and the inner wall surface of the first plate (1) jointly form a liquid outlet channel (4), and the intermediate cavity (203) and the inner wall surface of the first plate (1) jointly form an intermediate channel (5).
3. The chip cooling heat exchanger according to claim 2, wherein the first plate (1) is a flat plate, and inner wall surfaces of the second plate (2) on the peripheries of the liquid inlet cavity (201), the liquid outlet cavity (202) and the intermediate cavity (203) are connected with inner wall surfaces of the first plate (1) through flat edge welding.
4. Chip cooling heat exchanger according to claim 1 or 2 or 3, wherein the cross-section of the intermediate channel (5) is circular, semicircular, elliptical, semi-elliptical or square.
5. The chip cooling heat exchanger according to claim 4, wherein the projected shape of the intermediate channel (5) is linear or wavy.
6. The chip cooling heat exchanger according to claim 1, 2 or 3, characterized in that the outer edge of the first plate (1) is provided with a first flanging (101) protruding towards one side of the second plate (2), the outer edge of the second plate (2) is provided with a second flanging (204) protruding away from one side of the first plate (1), the outer contour of the second flanging (204) is matched with the inner contour of the first flanging (101), the outer wall surface of the second flanging (204) abuts against the inner wall surface of the first flanging (101), and the second flanging (204) and the first flanging (101) are connected through flat edge welding.
7. The chip-cooling heat exchanger according to claim 1, 2 or 3. The first plate (1) is provided with a positioning edge (103) turned over towards one side of the second plate (2), and the inner wall surface of the second plate (2) is provided with a connecting pipe accommodating cavity (205).
8. The chip cooling heat exchanger according to claim 1, 2 or 3, wherein the first plate (1) and the second plate (2) are rectangular plates, the liquid inlet channel (3) and the liquid outlet channel (4) are both arranged along the length direction of the rectangular heat exchanger body, the liquid inlet connecting pipe (6) is arranged at one end of the length direction of the rectangular heat exchanger body, and the liquid outlet connecting pipe (7) is arranged at the same side, opposite side or lateral side of the liquid inlet connecting pipe (6).
9. The chip cooling heat exchanger according to claim 1, 2 or 3, wherein the number of the liquid inlet channels (3) is several, the number of the liquid inlet channels (3) are arranged at intervals, each liquid inlet channel (3) is connected with a liquid inlet connecting pipe (6), the number of the liquid outlet channels (4) is several, the number of the liquid outlet channels (4) are arranged at intervals, and each liquid outlet channel (4) is connected with a liquid outlet connecting pipe (7).
10. The chip cooling heat exchanger according to claim 1, 2 or 3, wherein the first plate (1) is provided with a plurality of through type positioning holes (102), the second plate (2) is provided with a plurality of through type positioning holes (206), and the positions of the positioning holes (206) are arranged in one-to-one correspondence with the positions of the positioning holes (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331032.XA CN112902712A (en) | 2021-03-29 | 2021-03-29 | Chip cooling heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331032.XA CN112902712A (en) | 2021-03-29 | 2021-03-29 | Chip cooling heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112902712A true CN112902712A (en) | 2021-06-04 |
Family
ID=76109155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110331032.XA Pending CN112902712A (en) | 2021-03-29 | 2021-03-29 | Chip cooling heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112902712A (en) |
-
2021
- 2021-03-29 CN CN202110331032.XA patent/CN112902712A/en active Pending
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