CN112901508A - Liquid-cooled heat dissipation system and serial pump thereof - Google Patents

Liquid-cooled heat dissipation system and serial pump thereof Download PDF

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Publication number
CN112901508A
CN112901508A CN201911202268.2A CN201911202268A CN112901508A CN 112901508 A CN112901508 A CN 112901508A CN 201911202268 A CN201911202268 A CN 201911202268A CN 112901508 A CN112901508 A CN 112901508A
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CN
China
Prior art keywords
liquid
flow
housing
fan
tandem pump
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Pending
Application number
CN201911202268.2A
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Chinese (zh)
Inventor
洪银树
尹佐国
李明聪
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Sunonwealth Electric Machine Industry Co Ltd
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Sunonwealth Electric Machine Industry Co Ltd
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Publication of CN112901508A publication Critical patent/CN112901508A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00Pumping installations or systems
    • F04D13/02Units comprising pumps and their driving means
    • F04D13/06Units comprising pumps and their driving means the pump being electrically driven
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00Pumping installations or systems
    • F04D13/12Combinations of two or more pumps
    • F04D13/14Combinations of two or more pumps the pumps being all of centrifugal type
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/42Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/426Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/42Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/426Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
    • F04D29/4293Details of fluid inlet or outlet
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/40Casings; Connections of working fluid
    • F04D29/42Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/44Fluid-guiding means, e.g. diffusers
    • F04D29/445Fluid-guiding means, e.g. diffusers especially adapted for liquid pumps

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The invention provides a liquid-cooled heat dissipation system and a tandem pump thereof, which are used for solving the problems caused by the fact that a stator of the conventional pump needs to be isolated from a rotor. The tandem pump of the present invention can be used to drive the flow of the non-conductive liquid, and comprises: a shell, which is provided with a liquid injection port and a liquid discharge port communicated with the interior; and a plurality of diversion fans which are arranged in the shell in series, each diversion fan is provided with a fan frame, the fan frame is provided with a liquid inlet and a liquid outlet, a driving component is positioned in the shell and can drive an impeller positioned in the fan frame to rotate so as to guide the non-conductive liquid to flow into the shell from the liquid inlet and flow out from the liquid outlet of the shell after flowing through the liquid inlet and the liquid outlet of each fan frame.

Description

Liquid-cooled heat dissipation system and serial pump thereof
Technical Field
The present invention relates to a pump for driving liquid to flow and a liquid cooling heat dissipation system, and more particularly, to a tandem pump with an internal portion capable of flowing a non-conductive liquid, and a liquid cooling heat dissipation system having the same.
Background
Referring to fig. 1, a conventional pump 9 is shown, the conventional pump 9 includes a housing 91, a rotor set 92 and a stator set 93. The housing 91 is formed by combining a housing seat 911 and a housing cover 912, and a fluid flow space 913 is formed between the interior of the housing seat 911 and the housing cover 912. The housing 91 further has an input port 914 and an output port 915 which are connected to the liquid flow space 913, and the bottom end of the interior of the housing 911 has a shaft connecting portion 916. The rotor assembly 92 is disposed in the flow space 913, the rotor assembly 92 has an impeller 921 rotatably disposed on the coupling portion 916, and a magnet ring 922 is coupled to the impeller 921 and disposed on the outer periphery of the coupling portion 916. The stator assembly 93 is coupled to the housing seat 911 and located outside the fluid flow space 913, and the stator assembly 93 is radially opposite to the magnet ring 922 across the housing seat 911. When the conventional pump 9 is operated, the magnetic field generated by the stator assembly 93 can penetrate the housing 911 and magnetically repel each other with the magnet ring 922, so as to drive the impeller 921 to rotate, so that the liquid can flow into the liquid flow space 913 through the input port 914 and then be guided to be discharged from the output port 915. An embodiment similar to the conventional pump 9 is disclosed in taiwan patent No. 587784.
In the conventional pump 9, since it is necessary to avoid short circuit of the stator set 93 due to contact with liquid, the stator set 93 is selectively disposed outside the liquid flow space 913, so as to ensure that no liquid contacts the stator set 93 when guiding liquid into and out of the liquid flow space 913. However, this arrangement makes the magnetic distance between the stator 93 and the magnet ring 922 difficult to reduce and affects the driving performance because the housing 911 is required to be separated between the stator and the magnet ring 922. In addition, the prior pump 9 can only pressurize liquid in a single stage, and is still insufficient for applications with high pressurization requirements.
In view of the above, there is a need for improvement of the existing pump.
Disclosure of Invention
To solve the above problems, an objective of the present invention is to provide a liquid-cooled heat dissipation system and a tandem pump thereof, which can utilize a plurality of flow-guiding fans to pressurize a non-conductive liquid in multiple stages to increase the hydraulic pressure leaving the tandem pump.
Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a tandem pump thereof, in which the stator and the rotor of each fan can be disposed in the same space without isolation by using a non-conductive liquid, so that the magnetic induction distance between the stator and the rotor can be reduced.
Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a tandem pump thereof, in which a guiding fan for driving a gas to flow can be directly applied to the tandem pump to drive a non-conductive liquid, so that the structure of the guiding fan can be different for driving the gas or the liquid.
It is still another object of the present invention to provide a tandem pump, which can improve the smoothness and efficiency of the conduction of the non-conductive liquid.
In the invention, the relation between any two adjacent guide fans is defined according to the flowing direction of the non-conductive liquid, and the guide fan which is firstly passed by the non-conductive liquid is called as a 'previous guide fan', and the guide fan which is subsequently passed by the non-conductive liquid is called as a 'next guide fan'; that is, the non-conducting liquid flows out from the "previous guiding fan" and then flows into the "next guiding fan".
All directions or similar expressions such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are mainly used to refer to the directions of the drawings, and are only used to assist the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.
The use of the terms a or an for the elements and components described throughout this disclosure are for convenience only and provide a general sense of the scope of the invention; in the present invention, it is to be understood that the singular includes plural unless it is obvious that it is meant otherwise.
The terms "combined", "combined" and "assembled" as used herein include the separation of the components without damaging the components after connection, and the inseparable components after connection, which can be selected by one of ordinary skill in the art according to the material and assembly requirements of the components to be connected.
The invention relates to a tandem pump for driving a non-conductive liquid to flow, comprising: the shell is internally provided with a liquid flow space and is provided with a liquid injection port and a liquid discharge port which are communicated with the liquid flow space; and a plurality of diversion fans which are arranged in series in the liquid flow space, each diversion fan is provided with a fan frame, the fan frame is provided with a liquid inlet and a liquid outlet, a driving component is positioned in the liquid flow space and can drive an impeller positioned in the fan frame to rotate so as to guide the non-conductive liquid to flow into the liquid flow space from a liquid injection port of the shell together and flow out from a liquid discharge port of the shell after flowing through the liquid inlet and the liquid outlet of each fan frame.
The liquid cooling type heat dissipation system of the present invention comprises: a tandem pump as described above; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe set, which is connected in series with the serial pump, the heat absorption unit and the heat dissipation unit, so as to make the non-conductive liquid flow circularly when the serial pump operates.
Therefore, the liquid-cooled heat dissipation system and the tandem pump thereof of the invention can pressurize the non-conductive liquid in multiple stages by the plurality of guide fans to improve the hydraulic pressure leaving the tandem pump, so the number of the guide fans in the tandem pump can be selected according to the pressurizing requirement, the liquid-cooled heat dissipation system can be suitable for various pressurizing requirements, and the liquid-cooled heat dissipation system has the efficacy of improving the practicability. In addition, the liquid cooling type heat dissipation system adopts non-conductive liquid as working liquid, so that the stator and the rotor of the flow guiding fan in the serial pump can be arranged in the same space without isolation, and the problem of short circuit can not occur during operation; therefore, the magnetic induction distance between the stator and the rotor of the flow guiding fan can be reduced, the efficiency of the stator driving the rotor to rotate can be improved, and the reduction of the volume of the whole series pump is facilitated. In addition, because the stator and the rotor of the guide fan in the serial pump do not need to be isolated, the guide fan for driving the gas to flow can be directly applied to the serial pump to drive the non-conductive liquid, so that the structure of the guide fan can be different without driving the gas or the liquid, and a manufacturer does not need to additionally manufacture the guide fan with a specific structure for driving the liquid to flow, and the guide fan has the effects of reducing the manufacturing and storage management cost and the like.
Wherein, can have a drainage piece between arbitrary two adjacent water conservancy diversion fans, this drainage piece is located this liquid flow space, and this drainage piece can have an inclined plane towards preceding water conservancy diversion fan. Therefore, the flow direction of the non-conductive liquid can be guided by the drainage piece, so that the non-conductive liquid can flow into the next diversion fan more smoothly after flowing out of the previous diversion fan, and the drainage piece has the effects of improving the flowing smoothness of the non-conductive liquid and the like.
The liquid flow space can be provided with at least one pressing part which is abutted against the fan frame, and the pressing part can be provided with a flow guide surface which is parallel to the inclined surface of the flow guide piece. Therefore, the method has the effects of improving the flowing smoothness of the non-conductive liquid and the like.
The casing can form the liquid flow space by a first casing and a second casing which are combined together, one end of the fan frame can be abutted against the first casing, at least one pressing part can be connected with the second casing and abutted against the other end of the fan frame, and the pressing part can not shield the liquid inlet and the liquid outlet of the fan frame. Therefore, the plurality of flow guide fans can be stably arranged at the preset position in the shell, the pressing and supporting part and the corresponding flow guide piece can limit the flowing range of the non-conductive liquid together, the situation of non-conductive liquid backflow is reduced, and the flow guide efficiency of the non-conductive liquid is improved.
The liquid flow space can be formed by a first shell and a second shell which are combined together, the first shell can be provided with a base, the periphery of the base can be connected with a ring wall, the second shell can be provided with two opposite flow limiting walls, the two flow limiting walls can extend into the space surrounded by the ring wall, and the liquid injection port and the liquid discharge port can be aligned between the two flow limiting walls. Therefore, most of the non-conductive liquid flowing into the liquid flow space can flow between the two flow limiting walls, and the non-conductive liquid flow space has the effects of improving the flow guide efficiency of the non-conductive liquid and the like.
The housing can be formed by a first housing and a second housing which are combined together to form the liquid flow space, the first housing can be provided with a base, the inner surface of the base can be provided with a plurality of limiting grooves, and the fan frames of the plurality of flow guiding fans can be respectively placed into the corresponding limiting grooves. Therefore, the assembly device has the effects of improving the assembly convenience and the combination stability of the plurality of flow guide fans and the shell and the like.
Wherein the drive assembly may not be waterproofed. Therefore, the manufacturing cost is reduced.
The driving assembly can be provided with a plurality of circuit substrates, the circuit substrates are respectively positioned in the fan frames, and each circuit substrate can be provided with a stator coil group and a plurality of electronic parts. Therefore, the components arranged in the fan frames can be assembled in advance, when the tandem pump is assembled, the fan frames are only required to be arranged at the preset positions in the shell in an opposite mode, and the serial pump has the effects of improving the assembling convenience and the like.
The driving assembly may have a plurality of electronic components, and the plurality of electronic components may not be located in the plurality of fan frames. Therefore, the axial height of each guide fan can be reduced.
The driving assembly can have a circuit substrate connected to the inner surface of the housing, each fan frame has a side wall capable of abutting against the inner surface of the housing or the circuit substrate, the driving assembly can have a plurality of stator coil group wiring formed on the circuit substrate, and the plurality of stator coil groups can be respectively located in the plurality of fan frames. Therefore, the axial height of each guide fan can be reduced.
The inner surface of the shell can be provided with a containing groove, and the circuit substrate is contained in the containing groove. Therefore, the axial height of the whole shell is reduced.
Wherein, the plurality of guide fans can be inverted at intervals. Therefore, the conductive liquid conveying device has the effects of improving the smoothness of the conductive liquid and the like.
Drawings
FIG. 1: a combined cross-sectional view of a prior pump;
FIG. 2: the invention relates to the structure diagram of the liquid cooling heat radiation system;
FIG. 3: an exploded perspective view of a tandem pump of a first embodiment of the present invention;
FIG. 4: a combined cross-sectional side view of a tandem pump of a first embodiment of the present invention;
FIG. 5: a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6: a combined cross-sectional side view of a tandem pump of a second embodiment of the present invention;
FIG. 7: a cross-sectional view taken along line B-B of FIG. 6;
FIG. 8: a combined cross-sectional side view of a tandem pump of a third embodiment of the present invention;
FIG. 9: top view of a tandem pump of a fourth embodiment of the present invention.
Description of the reference numerals
1 Heat absorption Unit
2 Heat dissipation Unit
3 pipe fitting group
3a, 3b, 3c pipe fitting
4 outer cover
41 liquid flow space
42 liquid filling opening
43 liquid discharge port
44 first shell
441 base
441a inner surface
442 ring wall
443 catheter
444 limit groove
445 container
45 second shell
451 flow-limiting wall
452 bump
46 drainage member
461 inclined plane
462 facade
47 pressing part
471 flow guiding surface
5 flow guiding fan
51 fan frame
511 liquid inlet
512 liquid outlet
513 bottom plate
514 coupling part
515 side wall
516 header
52 drive assembly
521 Circuit Board
522 stator coil group
523 electronic component
53 impeller
531 wheel hub
532 blade
533 magnetic element
H heat source
P tandem type pump
[ Prior Art ]
9 pumps
91 casing
911 case base
912 casing cover
913 liquid flow space
914 input port
915 output port
916 shaft connecting part
92 rotor set
921 impeller
922 magnetic ring
93 stator groups.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the invention more comprehensible, preferred embodiments accompanied with figures are described in detail below:
referring to fig. 2, a preferred embodiment of the liquid-cooled heat dissipation system of the present invention includes a serial pump P, a heat absorption unit 1, a heat dissipation unit 2, and a tube assembly 3, wherein the tube assembly 3 is connected in series with the serial pump P, the heat absorption unit 1, and the heat dissipation unit 2, so that a nonconducting liquid (e.g., a liquid with good fluidity but no conductivity, such as an electronic engineering liquid) with a dielectric strength of not less than 30kV can flow circularly.
In detail, the tube assembly 3 can connect the tandem pump P and the heat absorption unit 1 through a tube 3a, and the heat absorption unit 1 can be attached to a heat source H of an electronic device, for example; the tube assembly 3 can further include a tube 3b connecting the serial pump P and the heat dissipation unit 2, and a tube 3c connecting the heat absorption unit 1 and the heat dissipation unit 2; the serial pump P and the tube assembly 3 have a non-conductive liquid therein. Therefore, the non-conductive liquid in the tube assembly 3 and located at the heat absorption unit 1 can absorb heat energy to raise the temperature, and is guided to the heat dissipation unit 2 through the operation of the serial pump P, so as to be cooled when passing through the heat dissipation unit 2, and is guided to the heat absorption unit 1 again after being cooled; the circulation is continuously carried out, so that the heat source H can be effectively cooled.
The invention does not limit the shapes of the heat absorption unit 1 and the heat dissipation unit 2, and does not limit the circulating direction of the non-conductive liquid; that is, the warmed non-conductive liquid can flow through the serial pump P and then be guided to the heat dissipation unit 2 (clockwise circulation as shown in fig. 2), or reversely circulate, so that the cooled non-conductive liquid flows through the serial pump P and then is guided to the heat absorption unit 1.
Referring to fig. 2 and 3, a first embodiment of a tandem pump P according to the present invention includes a housing 4 and a plurality of guiding fans 5 disposed in the housing 4, wherein the housing 4 can be assembled and connected with the pipe assembly 3, so that non-conductive liquid can flow into the housing 4 and be pumped out by the guiding fans 5.
Referring to fig. 3 and 4, the housing 4 has a liquid flow space 41 therein, and the housing 4 has a liquid injection port 42 and a liquid discharge port 43 communicating the liquid flow space 41 with the outside. The present invention does not limit the form of the housing 4; in this embodiment, the housing 4 may have a first shell 44 and a second shell 45, the first shell 44 and the second shell 45 may be made of plastic or metal, and the first shell 44 and the second shell 45 may be combined together to form the liquid flow space 41.
For example, but not limited to, the first shell 44 may be a rectangular shell with an open upper end, that is, the first shell 44 has a base 441, a circumferential edge of the base 441 is connected with a circumferential wall 442, and the liquid injection port 42 and the liquid discharge port 43 may be selectively disposed at two opposite ends of the circumferential wall 442 for the pipe set 3 (shown in fig. 2) to pass through respectively; alternatively, as shown in FIG. 4, the liquid injection port 42 and the liquid discharge port 43 are formed by the ports of the two conduits 443 connecting the annular wall 442, so as to improve the assembly convenience and the leakage-proof effect when connecting the pipe assembly 3. The two conduits 443 can be integrally formed with the annular wall 442 or can be assembled and combined with the annular wall 442 in a fluid-tight manner. In addition, the inner surface 441a of the base 441 may further have a plurality of limiting grooves 444, so that the plurality of guide fans 5 can be inserted when being assembled.
The second housing 45 may have a substantially plate shape, and the lower surface of the second housing 45 may have two opposite flow-limiting walls 451, and a protrusion 452 may be respectively disposed between two adjacent ends of the two flow-limiting walls 451. The second shell 45 can cover the upper end of the first shell 44 to close the opening formed at the top end of the annular wall 442, and when the second shell 45 and the first shell 44 are made of metal, the end edges of the second shell 45 joined to the first shell 44 can be welded by laser, so that the liquid flow space 41 is formed inside the first shell 44 and the second shell 45. Wherein, the two flow-limiting walls 451 can extend into the space surrounded by the annular wall 442, the liquid injection port 42 and the liquid discharge port 43 are aligned between the two flow-limiting walls 451, so that most of the non-conductive liquid flowing into the liquid flow space 41 can flow between the two flow-limiting walls 451; the two bumps 452 are located approximately at the middle positions of the liquid injection port 42 and the liquid discharge port 43, respectively, and the two bumps 452 do not completely cover the liquid injection port 42 and the liquid discharge port 43, so that the non-conductive liquid can be shunted by the two bumps 452 when passing through the liquid injection port 42 and the liquid discharge port 43, thereby achieving a rectification effect and improving the smoothness of the flow of the non-conductive liquid.
In addition, a flow guiding member 46 may be disposed between any two adjacent guiding fans 5, and the flow guiding member 46 is disposed in the liquid flowing space 41 to guide the flowing direction of the non-conductive liquid, so that the non-conductive liquid can flow into the next guiding fan 5 more smoothly after flowing out from the previous guiding fan 5. In this embodiment, the drainage member 46 can be selectively connected to the base 441 of the first shell 44 and located between any two adjacent limiting grooves 444; the flow guiding element 46 may have a slope 461 facing the previous guiding fan 5, and the flow guiding element 46 may have a vertical surface 462 approximately perpendicular to the base 441 facing the next guiding fan 5. The housing 4 may further have at least one pressing portion 47 for pressing the plurality of guiding fans 5, so that the plurality of guiding fans 5 can be more stably disposed at predetermined positions inside the housing 4. For example, but not limiting to the invention, the pressing portion 47 of the present embodiment can be connected to the second shell 45, and can be selected as a transverse rib disposed between the two flow-limiting walls 451. Additionally, the pressing portion 47 approximately corresponds to the drainage member 46, and the pressing portion 47 may have a flow guiding surface 471 parallel to the inclined surface 461 of the drainage member 46, so as to improve the smoothness of guiding the non-conductive liquid to flow.
In order to pressurize the non-conductive liquid in multiple stages, the plurality of guiding fans 5 are arranged in series, the number of the guiding fans 5 can be selected according to the degree of pressurization, and in the drawings of the present embodiment, three guiding fans 5 are taken as an example, but not limited thereto. Each diversion fan 5 has a fan frame 51, the fan frame 51 has a liquid inlet 511 and a liquid outlet 512, a driving component 52 is located in the liquid flow space 41 of the housing 4 and can drive an impeller 53 located in the fan frame 51 to rotate, so that the non-conductive liquid can flow into the fan frame 51 from the liquid inlet 511 and then flow out from the liquid outlet 512. In this embodiment, the diversion fan 5 can be a centrifugal fan, that is, the fan frame 51 has a bottom plate 513, the bottom plate 513 has an axial connection portion 514, a side wall 515 is connected to the bottom plate 513 and located at the periphery of the axial connection portion 514, a top cover 516 is connected to the top end of the side wall 515, the liquid inlet 511 is located at the top cover 516, and the liquid outlet 512 is located at the side wall 515.
When the device is installed, the fan frames 51 of a plurality of diversion fans 5 can be respectively placed into the corresponding limiting grooves 444 of the first shell 44, and the liquid outlet 512 of one diversion fan 5 is communicated with the liquid outlet 43 of the shell 4, preferably directly faces to the liquid outlet 43, and the liquid outlets 512 of the other diversion fans 5 face to the corresponding diversion member 46, so that the liquid inlet 511 of the next diversion fan 5 can be communicated with the liquid outlet 512 of the previous diversion fan 5; after the second shell 45 is closed, a gap is reserved between the second shell 45 and the liquid inlets 511 of the plurality of guide fans 5, so that the liquid inlet 511 of the guide fan 5 closest to the liquid inlet 42 of the outer shell 4 can be communicated with the liquid inlet 42. The pressing portion 47 of the housing 4 can press against the top cover 516 of the fan frame 51, and the pressing portion 47 preferably does not shield the liquid inlet 511 and the liquid outlet 512 of the fan frame 51, so as to prevent the flow of the non-conductive liquid, and the pressing portion 47 and the corresponding drainage member 46 can limit the flow range of the non-conductive liquid together, so that the non-conductive liquid flowing out of the liquid outlet 512 is not easy to flow back to the liquid inlet 511.
Referring to fig. 3 and 5, the driving assembly 52 of the present embodiment may include a plurality of circuit boards 521 respectively disposed in the plurality of fan frames 51, each circuit board 521 has a stator coil group 522, the stator coil group 522 is preferably formed on the circuit board 521 in a wiring manner to reduce the axial height, and each circuit board 521 may further include electronic components 523 such as a hall sensor and a driving IC. When the tandem pump P is operated, the working fluid flowing through the fluid space 41 is a non-conductive fluid, so the driving assembly 52 can be selected without waterproof treatment, which not only prevents short circuit, but also reduces the manufacturing cost.
The impeller 53 in each fan frame 51 may include a hub 531, the hub 531 being rotatably connected to the coupling portion 514 of the fan frame 51, a plurality of blades 532 connected to the hub 531, and a magnetic member 533 connected to the hub 531 and opposite to the stator coil assembly 522. After the driving assembly 52 is powered on, the magnetic field generated by the stator coil set 522 and the magnetic member 533 repel magnetically, so as to push the hub 531 to drive the plurality of blades 532 to rotate synchronously, so that the non-conductive liquid can flow into the fan frame 51 through the liquid inlet 511 and then flow out from the liquid outlet 512.
Referring to fig. 2 and 4, according to the above structure, when the liquid-cooled heat dissipation system with the tandem pump of the present embodiment operates, the non-conductive liquid at the heat absorption unit 1 can absorb heat energy, so as to raise the temperature of the non-conductive liquid. When the serial pump P is operated, the non-conductive liquid in the liquid flow space 41 of the housing 4 is discharged, so that the liquid flow space 41 forms a negative pressure to introduce the high-temperature non-conductive liquid from the heat absorbing unit 1; after the high-temperature non-conductive liquid flows into the liquid flow space 41 through the liquid injection port 42 of the housing 4, the high-temperature non-conductive liquid can flow into the fan frame 51 from the liquid inlet 511 of the guide fan 5 nearest to the liquid injection port 42, is pressurized by the impeller 53, then flows out from the liquid outlet 512 of the guide fan 5, and rises along the inclined surface 461 of the corresponding flow guide member 46 so as to smoothly flow into the liquid inlet 511 of the next guide fan 5; in this way, after passing through the liquid inlet 511 and the liquid outlet 512 of each fan frame 51, the high-temperature non-conductive liquid can be pressurized in multiple stages, and flows out from the liquid outlet 512 of the guiding fan 5 nearest to the liquid outlet 43 of the housing 4, and finally leaves the housing 4 through the liquid outlet 43 and is guided to the heat dissipation unit 2. The high-temperature non-conductive liquid can be cooled when passing through the heat dissipation unit 2, and is guided to the heat absorption unit 1 again after being cooled; the circulation is continued, so that the heat source H at the heat absorption unit 1 can be effectively cooled.
Referring to fig. 6 and 7, which are second embodiments of the tandem pump of the present invention, in the present embodiment, the driving component 52 of each guide fan 5 can move its electronic component 523 to other positions in the housing 4 instead of being located in the fan frame 51, which helps to reduce the axial height of each guide fan 5. Preferably, the bottom plate 513 (shown in fig. 5) may be omitted from the fan frame 51 of each guide fan 5, so as to further reduce the axial height of each guide fan 5, which is helpful to reduce the axial height of the entire housing 4. Specifically, the axial connection portion 514 of each fan frame 51 may be connected to the base 441 of the first casing 44, and the plurality of guide fans 5 may share one circuit board 521, the circuit board 521 may have a plurality of stator coil groups 522 formed in a wiring manner, and the axial connection portion 514 of each fan frame 51 penetrates through the circuit board 521, so that the plurality of stator coil groups 522 are respectively arranged around the outer periphery of each axial connection portion 514; the sidewall 515 of each fan frame 51 may abut against the circuit substrate 521 or the inner surface 441a of the base 441 of the housing 4. In addition, the first shell 44 may further include a receiving groove 445 on the inner surface 441a of the base 441, so that the circuit substrate 521 is received in the receiving groove 445, which also helps to reduce the axial height of the entire housing 4.
Referring to fig. 8, which is a third embodiment of the tandem pump of the present invention, in this embodiment, a plurality of flow guiding fans 5 can be selectively placed upside down at intervals to improve the smoothness of guiding the non-conductive liquid; for example, in the embodiment where three guide fans 5 are provided, the second guide fan 5 may be inverted from the pouring port 42 of the casing 4, or the first and third guide fans 5 may be inverted from the pouring port 42 of the casing 4. In detail, for example, by inverting the second guiding fan 5, the drainage member 46 adjacent to the liquid outlet 512 of the first guiding fan 5 may be connected to the second casing 45 instead, so that the non-conductive liquid flowing out from the liquid outlet 512 of the first guiding fan 5 may be guided by the inclined surface 461 of the drainage member 46 and directly flow from the lower end to the liquid inlet 511 of the second guiding fan 5, and the non-conductive liquid flowing out from the liquid outlet 512 of the second guiding fan 5 may directly flow from the upper end to the liquid inlet 511 of the third guiding fan 5, so as to improve the smoothness of guiding the non-conductive liquid. The non-conductive liquid flowing out from the liquid outlet 512 of the first flow guiding fan 5 can also be subjected to the reduction of the cross section of the flow passage by the inclined surface 461 of the flow guiding element 46 before flowing into the second flow guiding fan 5, so as to improve the flow velocity and the dynamic pressure, thereby achieving a better pressurizing effect.
Referring to fig. 9, which is a fourth embodiment of the tandem pump of the present invention, in this embodiment, the liquid injection port 42 and the liquid discharge port 43 of the casing 4 can be selectively disposed on two adjacent sides of the circular wall 442 according to the configuration requirement of the liquid-cooled heat dissipation system, and a single flow guiding channel can be still isolated by a plurality of flow guiding members 46 and other structures in the liquid flow space 41 of the casing 4, so that the non-conductive liquid can be sequentially discharged after being pressurized by a plurality of flow guiding fans 5 along the direction of the arrow in the figure without interfering with each other in the liquid flow space 41.
In summary, the liquid-cooled heat dissipation system and the tandem pump thereof of the present invention can utilize a plurality of diversion fans to pressurize the non-conductive liquid in multiple stages to increase the hydraulic pressure leaving the tandem pump, so that the number of diversion fans in the tandem pump can be selected according to the pressurization requirement, and the present invention can be applied to the liquid-cooled heat dissipation systems with various pressurization requirements, and has the efficacy of improving the practicability. In addition, the liquid cooling type heat dissipation system adopts non-conductive liquid as working liquid, so that the stator and the rotor of the flow guiding fan in the serial pump can be arranged in the same space without isolation, and the problem of short circuit can not occur during operation; therefore, the magnetic induction distance between the stator (the stator coil group of the driving assembly) and the rotor (the magnetic part of the impeller) of the flow guiding fan is reduced, the efficiency of the stator driving the rotor to rotate is improved, and the reduction of the volume of the whole tandem pump is facilitated.
It is worth mentioning that, because the stator and the rotor of the diversion fan in the tandem pump do not need to be isolated, the diversion fan for driving the gas to flow can be directly applied to the tandem pump to drive the non-conductive liquid, so that the structure of the diversion fan can be different without driving the gas or the liquid, and a manufacturer does not need to additionally manufacture the diversion fan with a specific structure for driving the liquid to flow, thereby having the effects of reducing the manufacturing and storage management cost and the like.
Although the present invention has been described with reference to the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes and modifications to the above embodiments without departing from the spirit and scope of the present invention.

Claims (13)

1. A tandem pump for driving a flow of a non-conductive fluid, comprising:
the shell is internally provided with a liquid flow space and is provided with a liquid injection port and a liquid discharge port which are communicated with the liquid flow space; and
a plurality of water conservancy diversion fans, be the series arrangement and lie in this liquid flow space, each water conservancy diversion fan all has a fan frame, and this fan frame has one and goes into liquid mouth and a liquid outlet, and a drive assembly is arranged in this liquid flow space and is used for the drive to lie in an impeller rotation in this fan frame to guide non-conducting liquid to flow into this liquid flow space from the notes liquid mouth of this shell jointly, and behind the income liquid mouth and the liquid outlet of each fan frame, flow out from the leakage fluid dram of this shell.
2. The tandem pump of claim 1, wherein any two adjacent guide fans have a flow guide therebetween, the flow guide being located in the flow space, the flow guide having an inclined surface facing the previous guide fan.
3. The tandem pump of claim 2, wherein the fluid flow space has at least one pressing portion abutting against the fan frame, the pressing portion having a flow guiding surface parallel to the inclined surface of the flow guiding member.
4. The tandem pump of claim 1, wherein the housing forms the fluid space by a first housing and a second housing combined together, one end of the fan frame abuts against the first housing, at least one pressing portion is connected to the second housing and abuts against the other end of the fan frame, and the pressing portion does not shield the fluid inlet and the fluid outlet of the fan frame.
5. The tandem pump of claim 1, wherein the housing forms the fluid flow space by combining a first housing and a second housing, the first housing having a base with a surrounding wall attached to a circumferential edge of the base, the second housing having two opposing flow restricting walls, both flow restricting walls extending into the space surrounded by the surrounding walls, the fluid injection port and the fluid discharge port being aligned between the two flow restricting walls.
6. The tandem pump of claim 1, wherein the housing forms the fluid flow space by combining a first housing and a second housing, the first housing has a base, the inner surface of the base has a plurality of limiting grooves, and the fan frames of the plurality of guiding fans are respectively disposed in the corresponding limiting grooves.
7. The tandem pump of claim 1, wherein the drive assembly is not waterproofed.
8. The tandem pump of claim 1, wherein the driving module has a plurality of circuit boards, the circuit boards are respectively disposed in the fan frames, and each circuit board has a stator coil set and a plurality of electronic components thereon.
9. The tandem pump of claim 1, wherein the drive assembly has a plurality of electronic components that are not located in the plurality of fan frames.
10. The tandem pump of claim 7, wherein the driving assembly has a circuit substrate attached to the inner surface of the housing, each of the fan frames has a side wall abutting against the inner surface of the housing or the circuit substrate, the driving assembly has a plurality of stator coil group wirings formed on the circuit substrate, and the plurality of stator coil groups are respectively located in the plurality of fan frames.
11. The tandem pump of claim 10, wherein the inner surface of the housing is provided with a receiving groove, and the circuit substrate is received in the receiving groove.
12. The tandem pump of claim 1, wherein the plurality of guide fans are inverted at intervals.
13. A liquid-cooled heat dissipation system, comprising:
a tandem pump as claimed in any one of claims 1 to 12;
a heat absorbing unit;
a heat dissipating unit;
a non-conductive liquid; and
and the pipe group is connected in series with the serial pump, the heat absorption unit and the heat dissipation unit so as to enable the non-conducting liquid to flow circularly when the serial pump operates.
CN201911202268.2A 2019-11-19 2019-11-29 Liquid-cooled heat dissipation system and serial pump thereof Pending CN112901508A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI718766B (en) * 2019-11-19 2021-02-11 建準電機工業股份有限公司 Liquid cooling system and series-connected pump thereof
TWI784649B (en) * 2021-07-29 2022-11-21 建準電機工業股份有限公司 Liquid driving assembly and electronic device including the same

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87202696U (en) * 1987-03-05 1988-06-01 李运正 Miniature submersible pump
CN1603591A (en) * 2003-09-30 2005-04-06 株式会社东芝 Electronic apparatus having pump unit
JP2007027257A (en) * 2005-07-13 2007-02-01 Toshiba Corp Cooling system and electronic equipment
CN101228495A (en) * 2005-05-06 2008-07-23 阿塞泰克公司 Cooling system for computer system
CN101255868A (en) * 2007-12-10 2008-09-03 兰州理工大学 Embedded vane pump of motor
CN103174655A (en) * 2011-12-23 2013-06-26 吴昌龙 Integral sealed refrigeration peripheral pump
CN204442899U (en) * 2015-03-26 2015-07-01 讯凯国际股份有限公司 Electronic installation and liquid-cooling type radiator structure thereof
CN107013467A (en) * 2016-01-27 2017-08-04 讯凯国际股份有限公司 Heat exchange module and its pumps in series
CN109075622A (en) * 2016-04-19 2018-12-21 阿莫泰克有限公司 Thin stator, single-phase motor and cooling fan using it
CN109154309A (en) * 2017-02-22 2019-01-04 信浓绢糸株式会社 centrifugal pump
CN211370749U (en) * 2019-11-19 2020-08-28 建准电机工业股份有限公司 Liquid-cooled heat dissipation system and serial pump thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM321949U (en) * 2007-05-18 2007-11-11 Liou Kuen Hua Improved structure of a cooling pump
CN204572499U (en) * 2015-04-13 2015-08-19 张国贤 A kind of multistage vacuum pump
TWI688326B (en) * 2018-01-17 2020-03-11 緯創資通股份有限公司 Coolant replenishment assembly, cooling cycle system, and electronic device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87202696U (en) * 1987-03-05 1988-06-01 李运正 Miniature submersible pump
CN1603591A (en) * 2003-09-30 2005-04-06 株式会社东芝 Electronic apparatus having pump unit
CN101228495A (en) * 2005-05-06 2008-07-23 阿塞泰克公司 Cooling system for computer system
JP2007027257A (en) * 2005-07-13 2007-02-01 Toshiba Corp Cooling system and electronic equipment
CN101255868A (en) * 2007-12-10 2008-09-03 兰州理工大学 Embedded vane pump of motor
CN103174655A (en) * 2011-12-23 2013-06-26 吴昌龙 Integral sealed refrigeration peripheral pump
CN204442899U (en) * 2015-03-26 2015-07-01 讯凯国际股份有限公司 Electronic installation and liquid-cooling type radiator structure thereof
CN107013467A (en) * 2016-01-27 2017-08-04 讯凯国际股份有限公司 Heat exchange module and its pumps in series
CN109075622A (en) * 2016-04-19 2018-12-21 阿莫泰克有限公司 Thin stator, single-phase motor and cooling fan using it
CN109154309A (en) * 2017-02-22 2019-01-04 信浓绢糸株式会社 centrifugal pump
CN211370749U (en) * 2019-11-19 2020-08-28 建准电机工业股份有限公司 Liquid-cooled heat dissipation system and serial pump thereof

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