CN112895180A - Integrated circuit chip base material processing method - Google Patents
Integrated circuit chip base material processing method Download PDFInfo
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- CN112895180A CN112895180A CN202110083870.XA CN202110083870A CN112895180A CN 112895180 A CN112895180 A CN 112895180A CN 202110083870 A CN202110083870 A CN 202110083870A CN 112895180 A CN112895180 A CN 112895180A
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- cutting
- plate
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- polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a method for processing a base material of an integrated circuit chip, which uses a cutting and polishing device, the cutting and polishing device comprises a rectangular frame, a rotating device, a cylinder, an alternating device and a fixing device, the rotating device is adopted, the output end of the rotating motor is started to drive a rotating plate to rotate, the rotating plate drives a driving magnetic block above the rotating plate to rotate when rotating, the fixed silicon crystal bar can be cut and polished in a rotating way, the alternating device is adopted, the output end of the alternating motor drives a driving gear to rotate by starting the alternating motor, two swing rods alternately drive a sliding plate to alternately cut and polish the silicon crystal bar in a mutually matched way, the fixing device is adopted, the driven wedge block is pushed to move upwards when the driving wedge block at the top of a polishing cavity moves towards the right, the silicon crystal at the upper part after cutting is moved upwards, two cutting surfaces of the cut silicon crystal bar are convenient to polish on two sides.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a method for processing a base material of an integrated circuit chip.
Background
The integrated circuit is a miniature electronic device or component, and adopts a certain process to interconnect the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and the wiring together, and make them on a small piece or several small pieces of semiconductor wafer or medium substrate, then package them in a tube shell to form the miniature structure with required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. The circuit is indicated by a letter 'IC', common semiconductor wafers are silicon wafers, the silicon wafers are produced after silicon crystal bars are cut and polished before processing and forming, the silicon crystal bars need to be cut before the silicon crystal bars are made into the silicon wafers, and polishing is carried out after cutting is finished;
the following problem exists at the during operation in current cutting equipment of polishing:
(1) the shape of the silicon crystal bar is a cylindrical mechanism, and in order to ensure that the cutting effect is better and the cutting is uniform when the silicon crystal bar is cut, the silicon crystal bar needs to be rotationally cut when being cut into silicon wafers, and the conventional device cannot rotationally cut the silicon crystal bar;
(2) after a silicon crystal bar is cut, two cut surfaces need to be polished, and the conventional device cannot synchronously polish the two cut surfaces and cannot realize the mutual alternate matching of cutting and polishing;
(3) when two cut terminal surfaces after cutting are polished, because two tangent planes after cutting are clung to, the current device can't realize polishing two tangent planes that are clung to after cutting in step.
Disclosure of Invention
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a method for processing an integrated circuit chip base material uses a cutting and polishing device, the cutting and polishing device comprises a rectangular frame, a rotating device, a cylinder, an alternating device and a fixing device, and the method for processing the integrated circuit chip base material by adopting the cutting and polishing device comprises the following steps:
s1, placing a silicon crystal bar: placing a silicon crystal bar which is to be cut into silicon wafers and polished into a cylinder and a fixing cavity to fix the silicon crystal bar before operation;
s2, adjusting the distance: the supporting plate is driven to move by rotating the adjusting screw so as to be applied to the rotary cutting and polishing of silicon crystal rods with different diameters into silicon wafers;
s3, cutting and polishing are performed alternately: the silicon crystal bar is mutually matched with the cutting and polishing by starting the alternating motor, so that two cutting surfaces contacted with the cutting knife can be synchronously polished after one silicon crystal bar is cut;
the rotating device is placed on the upper surface of the rectangular frame, the cylinder is placed on the upper portion of the rotating device, the alternating device fixedly connected with the rectangular frame is placed on the right side of the cylinder, and the fixing device is installed on the lower portion of the alternating device
The rotating device comprises a rotating motor, a rotating plate, a driving magnetic block, a sliding circular groove, a driven magnetic block, an adjusting plate, a supporting column, an adjusting screw rod and a supporting plate, wherein the rotating motor is fixedly arranged in the middle of the lower surface of an inner cavity of the rectangular frame through a motor plate, the output end of the rotating motor is fixedly provided with the rotating plate, the driving magnetic block is fixedly arranged on one side of the upper surface of the rotating plate, the sliding circular groove is formed in the upper part and the lower part of a top plate of the rectangular frame, the driving magnetic block is positioned in the sliding circular groove in the lower part, the driven magnetic block corresponding to the driving magnetic block is arranged in the sliding grass in the upper part, the adjusting plate is fixedly arranged at the top of the driven magnetic block, the adjusting plate is in an inverted L shape, the lower part of one end, away from the, a supporting plate is fixedly arranged at the top of the supporting column, a rotating motor is started, the output end of the rotating motor drives a rotating plate to rotate, and when the rotating plate rotates, a driving magnetic block above the rotating plate is driven to rotate, so that the fixed silicon crystal bar can be cut and polished;
the alternating device comprises a vertical plate, an alternating motor, a driving gear, driven gears, driving blocks, a swing rod, a driving groove, a transverse sliding groove, a sliding plate, a cutting cavity, a grinding cavity, a driving wedge block and a cutting grinding branch chain, wherein the vertical plate is fixedly arranged in the middle of the upper surface of a supporting plate, the alternating motor is fixedly arranged on the front side of the vertical plate through a motor plate, the driving gear is fixedly arranged at the output end of the alternating motor, the driven gears meshed with the driving gear are rotatably arranged on the front and rear sides of the vertical plate, the driving blocks are fixedly arranged on the opposite sides of the two driven gears, the directions of the two driving blocks are opposite, the swing rod hinged with the supporting plate is arranged on each side of the front side of the vertical plate, the driving groove is formed in the swing rod, the driving groove is sleeved on the outer side of the driving block, the transverse, a grinding cavity is fixedly arranged at the top of the rear sliding plate, a driving wedge block is fixedly arranged on the front side of the upper surface of the grinding cavity, cutting and grinding branch chains are arranged in the grinding cavity and the cutting cavity, when a cut silicon gold bar is ground and cut and matched, the output end of an alternating motor drives a driving gear to rotate by starting an alternating motor, and two swing rods alternately drive sliding plates to be alternated, so that cutting and grinding are matched and ground when the silicon crystal bar is operated;
the fixing device comprises an L-shaped plate, a top frame, a sliding rod, sliding blocks, synchronous gears, rack plates, a collision spring, a stabilizer bar, a connecting rod, a fixing cavity, a driven wedge block and a guide rod, wherein the L-shaped plate is fixedly arranged on the right side of the upper surface of the rectangular frame, the lower part of the L-shaped plate is fixedly provided with the top frame, the middle part of the inner cavity of the top frame is fixedly provided with the sliding rod, the two sides of the sliding rod are respectively provided with the sliding block in a sliding manner, the middle part of one opposite side of the two sliding blocks is provided with the synchronous gears which are rotatably connected with the top, the upper parts of the two sliding blocks are respectively provided with the rack plates which are meshed with the synchronous gears, the teeth of the two rack plates are oppositely arranged, one opposite side of the two sliding blocks is respectively provided with the collision spring which is sleeved on the, the right side slider lower part fixed mounting has driven wedge, and fixed chamber right side fixed mounting has the guide bar, promotes driven wedge rebound when the initiative wedge at chamber top of polishing moves right, and the slider that drives the right side when driven wedge rebound slides right, and the rack board drives synchronous gear and rotates to realize fixed chamber rebound, be convenient for carry out two-sided polishing to two cutting planes of silicon crystal stick after the cutting.
Preferably, the cutting polishing branched chain comprises a cutting motor, a cutting knife, a polishing motor and a polishing knife, a cutting cavity inner cavity is provided with the cutting motor through a motor plate fixed mounting, the cutting motor output end fixed mounting is provided with the cutting knife, the polishing cavity is provided with the polishing motor through a motor plate fixed mounting, the polishing motor output end fixed mounting is provided with the polishing knife, the cutting knife is driven to rotate through the cutting motor output end, thereby the cutting is rotated to the silicon crystal bar, when the silicon crystal bar after cutting is polished, the polishing motor output end is opened to drive the polishing motor to rotate, and the polishing motor output end drives the polishing knife to rotate and polish the silicon crystal bar.
Preferably, the polishing cavity inner chamber is provided with a sponge, the sponge is located on the upper side and the lower side of the polishing knife, and when the polishing knife rotates to the polishing cavity inner chamber after polishing the silicon crystal bar, the polishing knife after polishing two end faces of the silicon crystal bar is cleaned through contact of the sponge and the polishing knife.
Preferably, drum inner chamber bottom is equipped with the hydraulic stem, and the drum is installed the check lock with the equal screw thread rotation in fixed chamber both sides, and the check lock runs through the drum respectively and the equal fixed mounting in fixed chamber one end has the arc, and drum arc inboard is equipped with the gyro wheel, and through rotating the check lock, the arc that the check lock rotated the drive check lock top is fixed the silicon crystal bar, makes whole device can cut into slices to the silicon crystal bar of different scales and polish.
Preferably, the L template inboard has been seted up the direction spout, is equipped with the guide block in the spout, guide block one side and guide bar fixed connection, and the guide bar is kept away from guide block one side and fixed chamber one side fixed connection, and fixed chamber drives one section silicon wafer after the cutting and rises, slides in the spout through the guide bar, avoids fixed chamber to take place to rock when being close to silicon crystal stick one side to silicon crystal stick top and silicon wafer and polish.
Preferably, the annular groove has been seted up to the rotor plate downside, and rectangle frame inner chamber lower surface is provided with the bearing post along its annular groove circumference, and bearing capital portion is equipped with the ball, and the ring channel is arranged in to the ball, and the rotor plate of being convenient for through setting up of ball is more stable when rotating.
The invention has the beneficial effects that:
according to the rotating device adopted by the invention, the rotating motor is started, the output end of the rotating motor drives the rotating plate to rotate, and the rotating plate drives the active magnetic block above the rotating plate to rotate when rotating, so that the fixed silicon crystal bar can be subjected to rotating cutting and rotating polishing;
according to the alternating device adopted by the invention, the output end of the alternating motor drives the driving gear to rotate by starting the alternating motor, and the two swing rods alternately drive the sliding plates to alternate, so that the silicon crystal bar is cut and polished to operate in a mutually matched manner when the silicon crystal bar is operated;
according to the fixing device adopted by the invention, the driven wedge block is pushed to move upwards when the driving wedge block at the top of the grinding cavity moves rightwards, the slide block at the right side is driven to slide rightwards when the driven wedge block moves upwards, and the rack plate drives the synchronous gear to rotate, so that the fixing cavity moves upwards, the silicon wafer at the upper part after cutting is moved upwards, and double-side grinding is conveniently carried out on two cutting surfaces of the silicon wafer rod after cutting.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a flow chart of a method of cutting and grinding apparatus of the present invention;
FIG. 2 is a schematic front perspective view of the cutting and grinding apparatus of the present invention;
FIG. 3 is a schematic view of the rear side construction of the cutting and grinding apparatus of the present invention;
FIG. 4 is a schematic view of the part A-A of the cutting and grinding apparatus of the present invention shown in FIG. 2;
FIG. 5 is a schematic front sectional view of a fixing device of the cutting and polishing apparatus according to the present invention;
FIG. 6 is a schematic front cross-sectional view of a cutting chamber of the cutting and grinding apparatus of the present invention;
fig. 7 is a schematic front sectional view of a grinding chamber of the cutting and grinding apparatus of the present invention.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 1 to 7, a method for processing an integrated circuit chip base material, which uses a cutting and polishing device, the cutting and polishing device comprises a rectangular frame 1, a rotating device 2, a cylinder 3, an alternating device 4 and a fixing device 5, the method for processing the integrated circuit chip base material by using the cutting and polishing device comprises the following steps:
s1, placing a silicon crystal bar: a silicon crystal bar which is to be cut into silicon wafers and polished is placed in the cylinder 3 and the fixing cavity 590 to be fixed before operation;
s2, adjusting the distance: the supporting plate 29 is driven to move by rotating the adjusting screw 28 so as to be applied to the rotary cutting and polishing of silicon crystal rods with different diameters into silicon wafers;
s3, cutting and polishing are performed alternately: the silicon crystal bar is mutually matched with the cutting and polishing by starting the alternating motor 42, so that two cutting surfaces contacted with the cutting knife 62 are synchronously polished after one silicon crystal bar is cut;
a rotating device 2 is arranged on the upper surface of the rectangular frame 1, a cylinder 3 is arranged on the upper part of the rotating device 2, an alternating device 4 fixedly connected with the rectangular frame 1 is arranged on the right side of the cylinder 3, and a fixing device 5 is arranged on the lower part of the alternating device 4;
the rotating device 2 comprises a rotating motor 21, a rotating plate 22, a driving magnetic block 23, a sliding circular groove 24, a driven magnetic block 25, an adjusting plate 26, a supporting column 27, an adjusting screw 28 and a supporting plate 29, wherein the rotating motor 21 is fixedly arranged in the middle of the lower surface of an inner cavity of the rectangular frame 1 through a motor plate, the rotating plate 22 is fixedly arranged at the output end of the rotating motor 21, the driving magnetic block 23 is fixedly arranged on one side of the upper surface of the rotating plate 22, the sliding circular grooves 24 are respectively formed in the upper part and the lower part of a top plate of the rectangular frame 1, the driving magnetic block 23 is positioned in the sliding circular groove 24 in the lower part, a driven magnetic block 25 corresponding to the driving magnetic block 23 is arranged in a sliding mode in the upper sliding mode, an adjusting plate 26 is fixedly arranged at the top of the driven magnetic block 25, the adjusting plate 26 is inverted L-shaped, the, an adjusting screw 28 is fixedly installed on one side of the supporting column 27, the adjusting screw 28 penetrates through the right side of the adjusting plate 26, a supporting plate 29 is fixedly installed at the top of the supporting column 27, when the ring-shaped cutting or polishing is carried out on the fixed silicon crystal bar, the rotating motor 21 is started, the output end of the rotating motor 21 drives the rotating plate 22 to rotate, the driving magnetic block 23 above the rotating plate 22 is driven to rotate when the rotating plate 22 rotates, the driving magnetic block 23 attracts the driven magnetic block 25 to synchronously rotate along with the driving magnetic block, and the supporting plate 29 above the driven magnetic block 25 is driven to rotate when the driven magnetic block 25 rotates, so that the silicon crystal bar is cut and polished in a rotating;
the alternating device 4 comprises a vertical plate 41, an alternating motor 42, a driving gear 43, a driven gear 44, a driving block 45, a swing rod 46, a driving groove 47, a transverse sliding groove 48, a sliding plate 49, a cutting cavity 490, a polishing cavity 491, a driving wedge-shaped block 492 and a cutting polishing branch chain 6, the vertical plate 41 is fixedly arranged in the middle of the upper surface of the supporting plate 29, the alternating motor 42 is fixedly arranged at the front side of the vertical plate 41 through a motor plate, the driving gear 43 is fixedly arranged at the output end of the alternating motor 42, the driven gear 44 meshed with the driving gear 43 is rotatably arranged at the front side and the rear side of the vertical plate 41, the driving blocks 45 are fixedly arranged at the opposite sides of the two driven gears 44, the directions of the two driving blocks 45 are opposite, the swing rods 46 hinged with the supporting plate 29 are arranged at the two sides of the front side of the vertical plate 41, the driving groove, the top of the swing rod 46 is hinged with a sliding plate 49 which is connected with the transverse sliding chute 48 in a sliding way, the top of the front sliding plate 49 is fixedly provided with a cutting cavity 490, the top of the rear sliding plate 49 is fixedly provided with a grinding cavity 491, an active wedge-shaped block 492 is fixedly arranged on the front side of the upper surface of the grinding cavity 491, a cutting grinding branch chain 6 is arranged in the grinding cavity 491 and the cutting cavity 490, when the cut silicon gold rod is polished, the alternating motor 42 is started, the output end of the alternating motor 42 drives the driving gear 43 to rotate, the driving gear 43 drives the two driven gears 44 to rotate by being meshed with the driven gears 44, the driving block 45 above the driven gears 44 is driven when the driven gears 44 rotate so as to drive the swing rods 46 to alternate left and right, the two swing rods 46 alternately drive the sliding plates 49 to alternate, then the rotating motor 21 is started, the driven magnetic block 25 above the rotating plate 22 rotates, thereby the sliding plate 49 at the rear side moves outwards to carry out rotation grinding on the cut silicon crystal bar;
the fixing device 5 comprises an L-shaped plate 51, a top frame 52, a sliding rod 53, a sliding block 54, a synchronous gear 55, a rack plate 56, a collision spring 57, a stabilizer bar 58, a connecting rod 59, a fixing cavity 590, a driven wedge 591 and a guide rod 592, wherein the L-shaped plate 51 is fixedly arranged on the right side of the upper surface of the rectangular frame 1, the top frame 52 is fixedly arranged on the lower part of the L-shaped plate 51, the sliding rod 53 is fixedly arranged in the middle of the inner cavity of the top frame 52, the sliding blocks 54 are respectively and slidably arranged on two sides of the sliding rod 53, the synchronous gear 55 which is rotatably connected with the top is arranged in the middle of one opposite side of the two sliding blocks 54, the rack plates 56 which are meshed with the synchronous gear 55 are respectively arranged on the upper parts of the two sliding blocks 54, the collision spring 57 which is sleeved on the sliding rod 53 is arranged on one opposite side of the two sliding blocks 54, the stabilizer bar, the lower parts of the two sliding blocks 54 are respectively hinged with a connecting rod 59, the lower parts of the two connecting rods 59 are jointly hinged with a fixed cavity 590, the lower part of the right sliding block 54 is fixedly provided with a driven wedge-shaped block 591, the right side of the fixed cavity 590 is fixedly provided with a guide rod 592, before the sliding plate 49 at the rear side moves outwards to rotate and grind the cut silicon crystal bar, the driving wedge block 492 at the top of the grinding chamber 491 moves rightwards to push the driven wedge block 591 to move upwards, the driven wedge block 591 moves upwards to drive the slide block 54 at the right side to slide rightwards, the slide block 54 at the right side drives the synchronous gear 55 to rotate through the rack plate 56 above the slide block 54 at the right side when sliding rightwards, thereby driving the left rack plate 56 and the left slider 54 to move leftwards, so that the two connecting rods 59 move relatively to drive the fixed cavity 590 to move upwards, and facilitating simultaneous grinding of two end faces of the silicon crystal bar which is attached together after cutting.
The intracavity of polishing chamber 491 is equipped with sponge 7, and sponge 7 is located polishing knife 64's upper and lower both sides, when polishing knife 64 rotates to polishing chamber 491 inner chamber after polishing silicon crystal bar, through sponge 7 and polishing knife 64's contact, realizes cleaning polishing knife 64 after polishing two terminal surfaces of silicon crystal bar, when avoiding polishing knife 64 to silicon crystal bar secondary, the impurity influence that persists on the polishing knife 64 polishes the effect.
3 inner chamber bottoms of drum are equipped with hydraulic stem 8, drum 3 and the equal screw thread rotation in fixed chamber 590 both sides install check lock lever 81, check lock lever 81 runs through drum 3 respectively and the equal fixed mounting in fixed chamber 590 one end has arc 82, 3 arc 82 inboards of drum are equipped with the gyro wheel, when fixing the silicon crystal stick of different diameters, through rotating check lock lever 81, check lock lever 81 rotates arc 82 that drives check lock lever 81 top and fixes the silicon crystal stick, make whole device can carry out the section to the silicon crystal stick of different scales and polish, through the height that constantly improves hydraulic stem 8, the silicon crystal stick of placing makes hydraulic stem 8 upper end promote.
Guide chute 9 has been seted up to L template 51 inboard, is equipped with guide block 91 in the spout, guide block 91 one side and guide bar 592 fixed connection, guide bar 592 keep away from guide block 91 one side and fixed chamber 590 one side fixed connection, and fixed chamber 590 drives one section silicon wafer after the cutting and rises, slides in the spout through guide bar 592, avoids taking place to rock fixed chamber 590 when being close to silicon crystal stick one side to silicon crystal stick top and silicon wafer and polish.
An annular groove is formed in the lower side of the rotating plate 22, the supporting column 10 is arranged on the lower surface of the inner cavity of the rectangular frame 1 along the circumferential direction of the annular groove, and balls are arranged at the top of the supporting column 10 and are arranged in the annular groove.
The present invention is not limited to the above-described embodiments, which are described in the specification and illustrated only to illustrate the principle of the present invention, but various changes and modifications may be made within the scope of the present invention as claimed without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A processing method of an integrated circuit chip base material uses a cutting and polishing device, the cutting and polishing device comprises a rectangular frame (1), a rotating device (2), a cylinder (3), an alternating device (4) and a fixing device (5), and is characterized in that: the method for processing the integrated circuit chip base material by adopting the cutting and polishing equipment comprises the following steps:
s1, placing a silicon crystal bar: placing a silicon crystal bar which is to be cut into silicon wafers and polished into a cylinder (3) and a fixing cavity (590) to fix the silicon crystal bar before operation;
s2, adjusting the distance: the supporting plate (29) is driven to move by rotating the adjusting screw rod (28) so as to be applied to the rotary cutting and polishing of silicon crystal rods with different diameters into silicon wafers;
s3, cutting and polishing are performed alternately: the silicon crystal bar is matched with the cutting and polishing by starting the alternating motor (42), so that two cutting surfaces contacted with the cutting knife (62) can be polished synchronously after one silicon crystal bar is cut;
a rotating device (2) is placed on the upper surface of the rectangular frame (1), a cylinder (3) is placed on the upper portion of the rotating device (2), an alternating device (4) fixedly connected with the rectangular frame (1) is placed on the right side of the cylinder (3), and a fixing device (5) is installed on the lower portion of the alternating device (4);
the rotating device (2) comprises a rotating motor (21), a rotating plate (22), a driving magnetic block (23), a sliding circular groove (24), a driven magnetic block (25), an adjusting plate (26), a supporting column (27), an adjusting screw rod (28) and a supporting plate (29), the rotating motor (21) is fixedly arranged in the middle of the lower surface of an inner cavity of the rectangular frame (1) through a motor plate, the rotating plate (22) is fixedly arranged at the output end of the rotating motor (21), the driving magnetic block (23) is fixedly arranged on one side of the upper surface of the rotating plate (22), the sliding circular grooves (24) are formed in the upper portion and the lower portion of a top plate of the rectangular frame (1), the driving magnetic block (23) is positioned in the lower sliding circular groove (24), the driven magnetic block (25) corresponding to the driving magnetic block (23) is arranged in sliding mode on the upper portion of the sliding yard, the adjusting plate (26) is inverted L-shaped, the lower portion of one end, away from the driven magnetic block (25), of the adjusting plate (26) is connected with the upper portion of the rectangular frame (1) in a sliding mode, a supporting column (27) is installed on the left side of the upper surface of the adjusting plate (26) in a sliding mode, an adjusting screw rod (28) is fixedly installed on one side of the supporting column (27), the adjusting screw rod (28) penetrates through the right side of the adjusting plate (26), a supporting plate (29) is fixedly installed on the top of the supporting column (27), and when the fixed silicon crystal;
the alternating device (4) comprises a vertical plate (41), an alternating motor (42), a driving gear (43), a driven gear (44), a driving block (45), a swing rod (46), a driving groove (47), a transverse sliding groove (48), a sliding plate (49), a cutting cavity (490), a grinding cavity (491), a driving wedge-shaped block (492) and a cutting grinding branch chain (6), wherein the vertical plate (41) is fixedly arranged in the middle of the upper surface of a supporting plate (29), the alternating motor (42) is fixedly arranged on the front side of the vertical plate (41) through a motor plate, the driving gear (43) is fixedly arranged at the output end of the alternating motor (42), the driven gear (44) meshed with the driving gear (43) is rotatably arranged on the front side and the rear side of the vertical plate (41), the driving blocks (45) are fixedly arranged on the opposite sides of the two driven gears (44), the directions of the two driving blocks (45) are opposite, the swing rods (46), a driving groove (47) is formed in the swing rod (46), the driving groove (47) is sleeved on the outer side of the driving block (45), transverse sliding grooves (48) are formed in the front side of the vertical plate (41), a sliding plate (49) in sliding connection with the transverse sliding grooves (48) is hinged to the top of the swing rod (46), a cutting cavity (490) is fixedly installed at the top of the front sliding plate (49), a polishing cavity (491) is fixedly installed at the top of the rear sliding plate (49), an active wedge-shaped block (492) is fixedly installed on the front side of the upper surface of the polishing cavity (491), and cutting polishing branched chains (6) are arranged in the polishing cavity (491) and the cutting cavity (490);
the fixing device (5) comprises an L-shaped plate (51), a top frame (52), a sliding rod (53), sliding blocks (54), a synchronous gear (55), rack plates (56), a collision spring (57), a stabilizer bar (58), a connecting rod (59), a fixing cavity (590), driven wedge blocks (591) and a guide rod (592), wherein the L-shaped plate (51) is fixedly arranged on the right side of the upper surface of the rectangular frame (1), the top frame (52) is fixedly arranged on the lower portion of the L-shaped plate (51), the sliding rod (53) is fixedly arranged in the middle of the inner cavity of the top frame (52), the sliding blocks (54) are respectively slidably arranged on two sides of the sliding rod (53), the synchronous gear (55) rotatably connected with the top is arranged in the middle of one opposite side of the two sliding blocks (54), the rack plates (56) meshed with the synchronous gear (55) are respectively arranged on the upper portions of the two, two slider (54) relative one side all are equipped with the conflict spring (57) of establishing on slide bar (53), slide bar (53) go up the downside and all be equipped with top frame (52) fixed connection's stabilizer bar (58), stabilizer bar (58) run through and slide in two slider (54) inner chambers, two slider (54) below all articulate has connecting rod (59), two connecting rod (59) lower part articulates jointly has fixed chamber (590), right side slider (54) lower part fixed mounting has driven wedge (591), fixed chamber (590) right side fixed mounting has guide bar (592).
2. The integrated circuit chip base material processing method according to claim 1, wherein: cutting branch chain (6) of polishing include cutting motor (61), cutting knife (62), grinding motor (63) and grinding knife (64), and there are cutting motor (61) cutting chamber (490) inner chamber through motor board fixed mounting, and cutting motor (61) output end fixed mounting has cutting knife (62), and there are grinding motor (63) through motor board fixed mounting in grinding chamber (491), and grinding motor (63) output end fixed mounting has grinding knife (64).
3. The integrated circuit chip base material processing method according to claim 2, wherein: the inner cavity of the grinding cavity (491) is provided with a sponge (7), and the sponge (7) is positioned at the upper side and the lower side of the grinding knife (64).
4. The integrated circuit chip base material processing method according to claim 1, wherein: the hydraulic rod (8) is arranged at the bottom of the inner cavity of the cylinder (3), the locking rods (81) are rotatably arranged on two sides of the cylinder (3) and the fixed cavity (590) in a threaded manner, the locking rods (81) respectively penetrate through the cylinder (3) and one end of the fixed cavity (590) and are fixedly provided with arc plates (82), and rollers are arranged on the inner sides of the arc plates (82) of the cylinder (3).
5. The integrated circuit chip base material processing method according to claim 1, wherein: guide sliding grooves (9) are formed in the inner sides of the L-shaped plates (51), guide blocks (91) are arranged in the sliding grooves, one sides of the guide blocks (91) are fixedly connected with guide rods (592), and one sides of the guide rods (592) far away from the guide blocks (91) are fixedly connected with one sides of the fixed cavities (590).
6. The integrated circuit chip base material processing method according to claim 1, wherein: an annular groove is formed in the lower side of the rotating plate (22), a bearing column (10) is arranged on the lower surface of the inner cavity of the rectangular frame (1) along the circumferential direction of the annular groove, a ball is arranged at the top of the bearing column (10), and the ball is arranged in the annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110083870.XA CN112895180A (en) | 2021-01-21 | 2021-01-21 | Integrated circuit chip base material processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114147560A (en) * | 2021-12-13 | 2022-03-08 | 深圳明嘉瑞科技有限公司 | Core material silicon chip processing and polishing device of chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114147560A (en) * | 2021-12-13 | 2022-03-08 | 深圳明嘉瑞科技有限公司 | Core material silicon chip processing and polishing device of chip |
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