CN112894226A - High-efficient welding mold is used in chip production - Google Patents
High-efficient welding mold is used in chip production Download PDFInfo
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- CN112894226A CN112894226A CN202011492383.0A CN202011492383A CN112894226A CN 112894226 A CN112894226 A CN 112894226A CN 202011492383 A CN202011492383 A CN 202011492383A CN 112894226 A CN112894226 A CN 112894226A
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- 238000003466 welding Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 126
- 230000007246 mechanism Effects 0.000 claims abstract description 91
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims abstract description 17
- 238000001914 filtration Methods 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 10
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000741 silica gel Substances 0.000 claims description 17
- 229910002027 silica gel Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 5
- 241001330002 Bambuseae Species 0.000 claims description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 5
- 239000011425 bamboo Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
The invention discloses a high-efficiency welding mould for chip production, which comprises a base station, wherein cylinders are fixedly connected to the left side and the right side of the lower end of the base station, a reinforcing mechanism is arranged at the lower end of each cylinder, a touch screen is fixedly connected to the front side of the base station, a PLC (programmable logic controller) is fixedly connected to the lower end of the base station, a mould main body is fixedly connected to the upper end of the base station, a positioning plate is fixedly connected to the upper end of the mould main body, mounting grooves are formed in the left side and the right side of the upper end of the mould main body, a transmission mechanism is arranged on the inner side of each mounting groove, a telescopic mechanism is fixedly connected to the upper end of the transmission mechanism, sliding grooves are formed. Water is introduced through the water guide plate and the water inlet cavity, and through the drainage of the sealing plate with the through holes in the filter box, the filter screen is used for filtering, so that impurities generated in the cooling process can be reduced, the pipeline blockage is avoided, and the heat dissipation effect of the die main body is influenced.
Description
Technical Field
The invention relates to the technical field of welding dies, in particular to an efficient welding die for chip production.
Background
The mould is basic technological equipment widely used in industrial production, and the mould industry is the basic industry of national economy. In modern industrial production, product parts are widely processed by stamping, forging, die-casting, extrusion, plastic injection or other forming methods, and are matched with forming dies to form blanks into parts meeting the product requirements. Various tools and products used in daily production and life are large as a base and a machine body shell of a machine tool and small as a shell of a head screw, a button and various household appliances, and have no close relation with a die. The shape of the mold determines the shape of the products, and the processing quality and precision of the mold determine the quality of the products. In recent years, the mold industry is rapidly developed, graphite materials, new processes and increasing mold factories continuously impact the mold market, and graphite is gradually the first choice material for mold manufacturing due to good physical and chemical properties of graphite.
Chinese patent CN201511015648.7 discloses a protective welding mould, which comprises a positioning device and a protective device, wherein the positioning device comprises a base, an upper edge strip of the mould, a lower edge strip of the mould and a left edge strip of the mould, edge strip in mould right side strake and the mould, each strake encloses into battery fuse and holds the district, the left part and the right part symmetry of strake are equipped with the rectangular hole under mould upper strake and the mould, the bolt passes rectangular hole with mould upper strake and mould lower strake respectively with the both ends fixed connection of mould left side strake and mould right strake, strake includes the higher authority in the mould, the left side and the right, be equipped with the recess track on the base, the higher authority slides the setting from top to bottom along the recess track, be equipped with the setting element on the recess track, mould left side strake, all set firmly the magnetic stripe on the strake in mould right side strake and the mould, protector include with mould upper strake and higher authority swing joint's protection casing, the size and the.
However, the central point location needs to be fixed to the PCB electronic board through the welding mould during chip bonding, and the welding mould among the above-mentioned background is not convenient for find the central point fast, and the PCB board needs to be fixed through the mould when the welding moreover, and fixed mode dynamics inequality among the above-mentioned background leads to the PCB board to damage easily, causes the material waste.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a high-efficiency welding mold for chip production.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A high-efficiency welding mould for chip production comprises a base station, wherein cylinders are fixedly connected to the left and right sides of the lower end of the base station, a reinforcing mechanism is arranged at the lower end of each cylinder, a touch screen is fixedly connected to the front side of the base station, a PLC (programmable logic controller) is fixedly connected to the lower end of the base station, a mould main body is fixedly connected to the upper end of the base station, a positioning plate is fixedly connected to the upper end of the mould main body, mounting grooves are formed in the left and right sides of the upper end of the mould main body, a transmission mechanism is arranged on the inner side of each mounting groove, a telescopic mechanism is fixedly connected to the upper end of the transmission mechanism, sliding grooves are formed in the left and right sides of the upper end of the mould main body, a linkage mechanism is slidably connected to the upper end of the mould main body through the sliding grooves, a, the output end of the servo motor is fixedly connected with the transmission mechanism;
the telescopic mechanism comprises a partition plate, a first sliding pipe and a second sliding pipe, the upper end of the transmission mechanism is fixedly connected with the second sliding pipe, the middle part of the inner side of the second sliding pipe is fixedly connected with the partition plate, the inner side of the second sliding pipe is slidably connected with the first sliding pipe, the upper end of the second sliding pipe is provided with a forced pressing assembly, the outer side of the second sliding pipe is fixedly connected with a propping mechanism, and the first sliding pipe is fixedly connected with the linkage mechanism;
the abutting mechanism comprises a rubber strip, a heat resistance layer and an anti-static coating, the outer side of the second sliding tube is fixedly connected with the rubber strip, the inner side of the rubber strip is provided with a pressure sensor, and the heat resistance layer is arranged between the rubber strip and the anti-static coating.
Further, strengthening mechanism includes tripod, first bolt and tight loop, the outside fixedly connected with tripod of tight loop, the outside threaded connection of tight loop has first bolt, the outside of tight loop is swing joint through first bolt and cylinder, owing to set up strengthening mechanism, can improve the stability of mould main part through the tripod with setting up of first bolt and tight loop, produces the deviation when avoiding the chip welding.
Further, the water cooling mechanism comprises a silica gel block, a heat absorption copper body, a cold water pipe, a spiral pipe, a hot water pipe, a water tank and a water pump, a perforation is arranged at the upper end of the mould main body, a pressing frame is arranged at the outer side of the perforation, the silica gel block is clamped at the inner side of the perforation, the heat absorption copper body is fixedly connected at the inner side of the silica gel block, the spiral pipe is connected at the lower end of the heat absorption copper body in a winding manner, the hot water pipe is fixedly connected at the left side of the spiral pipe, the cold water pipe is fixedly connected at the right side of the spiral pipe, the water tank is fixedly connected at the lower end of the base station, the water pump is fixedly connected at the lower end of the base station, the hot water pipe is fixedly connected at the left side of the water tank, the water pump is fixedly connected at the right side of, due to the fact that the water cooling mechanism is arranged, the bottom of the PCB can be welded to dissipate heat through the arrangement of the silica gel block, the heat absorption copper body, the cold water pipe, the spiral pipe, the hot water pipe, the water tank and the water pump, and electronic elements on the PCB are prevented from being baked at welding temperature.
Further, heat dissipation mechanism includes aluminum plate, heat dissipation wing, installation piece, fan frame and fan, the back fixedly connected with aluminum plate of water tank, aluminum plate's outside fixed connection heat dissipation wing, the outside fixedly connected with installation piece of heat dissipation wing, the same fan frame of offside fixedly connected with of installation piece, the inboard fixedly connected with fan of fan frame owing to set up heat dissipation mechanism, utilizes the fan to dispel the heat through aluminum plate among the heat dissipation mechanism and heat dissipation wing heat absorption, can cool down to the water tank.
Further, drive mechanism includes ejector pad, slide bar and lead screw, the inboard of mounting groove is rotated and is connected with the lead screw, the other end of lead screw runs through mounting groove lateral wall and servo motor fixed connection, the shape of mounting groove is T shape, the inboard fixedly connected with slide bar of mounting groove, the both sides at the lead screw are established to the slide bar symmetry, the outside threaded connection of lead screw has the ejector pad, the ejector pad is sliding connection with the slide bar, the upper end and the second slip tube of ejector pad are fixed connection, owing to set up drive mechanism, through lead screw and ejector pad threaded connection cooperation ejector pad and slide bar sliding connection, can make the ejector pad remove along the orientation of lead screw.
Further, the forced compression subassembly includes screw hole, knot circle and second bolt, the upper end of second sliding tube is equipped with the screw hole, the inboard threaded connection of screw hole has the second bolt, the outside of second bolt is equipped with the knot circle, owing to set up the forced compression subassembly, carries out fixed fit through second bolt and screw hole and detains the circle, can increase the stability of fastening, and the different materials of reply PCB board that can be nimble is fixed.
Further, the filter mechanism comprises a sealing plate, a filter box, a water guide plate, a through hole, a screen, a water filtering cavity and a water inlet cavity, the filter box is fixedly connected to the outer side of the hot water pipe, the sealing plate is fixedly connected to the inner side of the filter box, the through hole is formed in the outer side of the sealing plate, the water filtering cavity and the water inlet cavity are respectively arranged on the inner side of the filter box through the sealing plate, the water guide plate is fixedly connected to the inner side of the hot water pipe, one end of the water guide plate is fixedly connected with the edge of the water inlet cavity, the screen is fixedly mounted on the inner side of the water filtering cavity, the impurity box is connected to the outer side of the filter box in an inserting mode, and due to the fact that the filter mechanism is arranged, the water is drained through the sealing plate with the through hole in the filter box through the water guide plate and the water inlet cavity.
Further, link gear includes slider, connecting rod, the lantern ring and section of thick bamboo post, the outside fixedly connected with lantern ring of first slip pipe, the lantern ring rotate with the connecting rod to be connected, the lower extreme fixedly connected with slider of connecting rod, slider and spout are sliding connection, the upper end fixedly connected with section of thick bamboo post of connecting rod owing to set up link gear, can tackle multiple not equidimension PCB board through setting up connecting rod and slider and the lantern ring and section of thick bamboo post and fix a position.
3. Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the servo motor and the driver are arranged on the die main body, the PLC is programmed by setting parameters through the touch screen, the PLC transmits pulses to the driver and receives signals returned by the pressure sensor at the same time, the pulses generate coding parameters to drive the servo motor to rotate, and the control force of the PCB is controlled through the abutting mechanism, so that the problem of damage caused by uneven pressure of the PCB during chip welding can be avoided.
(2) According to the invention, the transmission mechanism is arranged on the die main body, the PCB is firstly placed on the positioning plate on the die main body, the servo motor is used for driving the screw rod to rotate, so that the push block on the screw rod can slide on the slide rod, and the push block on the die main body synchronously pushes towards one direction, so that the central point positioning of the PCB can be rapidly carried out, and the chip welding efficiency is further improved.
(3) According to the invention, the water cooling mechanism is arranged on the die main body, when the PCB is welded with the chip on the die main body, the silica gel block is contacted with the bottom of the PCB through the through hole on the die main body, the inner side of the silica gel block is provided with the heat absorption copper body, so that the temperature on the PCB can be conducted, the lower end of the heat absorption copper body is provided with the spiral pipe, and the water in the water tank enters the spiral pipe through the cold water pipe by the water pump to be cooled, so that the electronic elements can be prevented from being damaged by a large amount of temperature generated when the chips are welded in batch.
(4) According to the invention, through the arranged filtering mechanism, the water guide plate and the water inlet cavity are communicated with the sealing plate with the through hole in the filtering box for water drainage, and the water is filtered by the screen, so that impurities generated in the cooling process can be reduced, and the influence on the heat dissipation effect of the die main body due to pipeline blockage is avoided.
(5) According to the invention, the linkage mechanism is arranged, when the push block moves, the linkage mechanisms at two ends of the telescopic mechanism are driven to move, and as the sliding grooves on the die main body face the central area, the moving linkage mechanism slides in the same direction in the sliding grooves through the sliding blocks at the lower ends of the connecting rods, so that the PCB boards with different shapes and sizes can be positioned and fixed, and the actual utilization effect of the welding die can be improved.
(6) According to the invention, through the arranged heat dissipation mechanism, heat is absorbed by the aluminum plate and the heat dissipation fins on the water tank, and the fan is arranged on the fan frame on the mounting block for heat dissipation, so that heat in the water tank can be dissipated, and the cooling effect of the die main body is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of the positioning plate of the present invention;
FIG. 3 is a perspective view of a heat absorbing copper body of the present invention;
FIG. 4 is a schematic view of the internal structure of the present invention;
FIG. 5 is a top view of the mold body of the present invention;
FIG. 6 is a schematic view of the internal structure of the fastening mechanism of the present invention;
FIG. 7 is a cross-sectional view of a filter mechanism of the present invention;
FIG. 8 is a schematic structural view of a linkage mechanism of the present invention;
FIG. 9 is a schematic view of the internal structure of the mounting groove of the present invention;
FIG. 10 is a schematic view of an electrical connection module according to the present invention;
FIG. 11 is a schematic structural diagram of a heat dissipation mechanism according to the present invention;
FIG. 12 is a schematic view of the telescoping mechanism of the present invention;
fig. 13 is a schematic structural diagram of a high-pressure assembly according to the present invention.
The reference numbers in the figures illustrate:
1. a pressure sensor; 2. a base station; 3. a mold body; 4. a filtering mechanism; 5. a linkage mechanism; 6. positioning a plate; 7. perforating; 8. a water cooling mechanism; 9. a heat dissipation mechanism; 10. a fixing plate; 11. a transmission mechanism; 12. a telescoping mechanism; 13. mounting grooves; 14. a pressing frame; 15. a chute; 16. a cylinder; 17. a reinforcement mechanism; 18. a propping and fixing mechanism; 19. a pressure intensifying assembly; 20. a PLC controller; 21. a touch screen; 22. a servo motor; 23. a driver; 111. a push block; 112. a slide bar; 113. a screw rod; 121. a partition plate; 122. a first sliding tube; 123. a second sliding tube; 501. a slider; 502. a connecting rod; 503. a collar; 504. a cylinder; 801. a silica gel block; 802. a heat absorbing copper body; 803. a spiral tube; 804. a cold water pipe; 805. a hot water pipe; 806. a water tank; 807. a water pump; 901. an aluminum plate; 902. heat dissipation fins; 903. mounting blocks; 904. a fan frame; 905. a fan; 171. a tripod; 172. a first bolt; 173. a fastening ring; 191. a threaded hole; 192. buckling a ring; 193. a second bolt; 181. a rubber strip; 182. a thermal barrier layer; 183. an anti-static coating; 401. closing the plate; 402. a filter box; 403. a water guide plate; 404. a through hole; 405. screening a screen; 406. a water filtering cavity; 407. a water inlet cavity; 408. and (5) impurity boxes.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
referring to fig. 1-13, the embodiment discloses a high-efficiency welding mold for chip production, which includes a base table 2, wherein cylinders 16 are fixedly connected to left and right sides of a lower end of the base table 2, a reinforcing mechanism 17 is arranged at a lower end of the cylinder 16, a mold main body 3 is fixedly connected to an upper end of the base table 2, a positioning plate 6 is fixedly connected to an upper end of the mold main body 3, mounting grooves 13 are arranged on left and right sides of an upper end of the mold main body 3, a transmission mechanism 11 is arranged inside the mounting grooves 13, an extension mechanism 12 is fixedly connected to an upper end of the transmission mechanism 11, sliding grooves 15 are arranged on left and right sides of an upper end of the mold main body 3, a linkage mechanism 5 is slidably connected to an upper end of the mold main body 3 through the sliding grooves 15, a water cooling mechanism 8 is arranged inside the mold main body, the upper end of the fixed plate 10 is fixedly connected with a servo motor 22 and a driver 23 respectively, and the output end of the servo motor 22 is fixedly connected with the transmission mechanism 11;
referring to fig. 1, 4 and 10, a touch screen 21 is fixedly connected to the front surface of the base platform 2, the model of the touch screen 21 is GT1045-QSBD-C, a PLC controller 20 is fixedly connected to the lower end of the base platform 2, the model of the PLC controller 20 is KV-DH1 programmable controller, the model of the servo motor 22 is JSMA-LC08ABK00, the model of the driver 23 is MR-J4-10B, a pressure sensor 1 is arranged on the inner side of the rubber strip 181, the model of the pressure sensor 1 is BMP180,
referring to fig. 12, the telescopic mechanism 12 includes a partition plate 121, a first sliding tube 122 and a second sliding tube 123, the upper end of the transmission mechanism 11 is fixedly connected with the second sliding tube 123, the middle part of the inner side of the second sliding tube 123 is fixedly connected with the partition plate 121, the arrangement of the partition plate 121 enables the first sliding tube 122 at the two ends of the second sliding tube 123 to be uniformly telescopic, the inner side of the second sliding tube 123 is slidably connected with the first sliding tube 122, the upper end of the second sliding tube 123 is provided with a pressure-intensifying assembly 19, the outer side of the second sliding tube 123 is fixedly connected with a fastening mechanism 18, and the first sliding tube 122 is fixedly connected with the linkage mechanism 5;
referring to fig. 6, the abutting mechanism 18 includes a rubber strip 181, a heat-resistant layer 182 and an anti-static plating layer 183, the rubber strip 181 is fixedly connected to the outer side of the second sliding tube 123, the heat-resistant layer 182 is disposed between the rubber strip 181 and the anti-static plating layer 183, and due to the arrangement of the anti-static layer, components and parts can be prevented from being damaged by static electricity at a contact point when a PCB is welded, and the heat-resistant layer 182 can perform heat insulation protection on the rubber strip 181, so that the service life of the rubber strip 181 is prolonged.
Referring to fig. 1, the reinforcing mechanism 17 includes a tripod 171, a first bolt 172 and a fastening ring 173, the tripod 171 is fixedly connected to the outer side of the fastening ring 173, the first bolt 172 is threadedly connected to the outer side of the fastening ring 173, the outer side of the fastening ring 173 is movably connected to the column 16 through the first bolt 172, and due to the arrangement of the reinforcing mechanism 17, sufficient stability of the mold body 3 can be ensured when the chip is soldered to the PCB.
Referring to fig. 1 and 4, the water cooling mechanism 8 includes a silica gel block 801, a heat absorbing copper body 802, a cold water pipe 804, a spiral pipe 803, a hot water pipe 805, a water tank 806 and a water pump 807, the upper end of the mold main body 3 is provided with a through hole 7, the outer side of the through hole 7 is provided with a pressing frame 14, the inner side of the through hole 7 is clamped with the silica gel block 801, the upper end of the silica gel block 801 and the upper end of the mold main body 3 are in the same plane for dissipating heat to the central welding area, the inner side of the silica gel block 801 is fixedly connected with the heat absorbing copper body 802, the upper end of the heat absorbing copper body 802 is wrapped by the silica gel block 801, the distance from the bottom of the PCB board is 11mm, the heat absorbing copper body can be close to the heating element for rapid heat dissipation, the lower end of the heat absorbing copper body 802 is connected with the spiral pipe 803 in a winding manner, the left side of the spiral, the lower extreme fixedly connected with water pump 807 of base station 2, the left side and the hot-water line 805 fixed connection of water tank 806, the right side and the water pump 807 fixed connection of water tank 806, the other end and the cold water pipe 804 fixed connection of water pump 807, the outside of hot-water line 805 is equipped with filter mechanism 4, the outside of water tank 806 is equipped with heat dissipation mechanism 9.
Referring to fig. 1, 4 and 11, the heat dissipation mechanism 9 includes an aluminum plate 901, a heat dissipation fin 902, an installation block 903, a fan frame 904 and a fan 905, the aluminum plate 901 is fixedly connected to the back of the water tank 806, the heat dissipation fin 902 is fixedly connected to the outer side of the aluminum plate 901, the installation block 903 is fixedly connected to the outer side of the heat dissipation fin 902, the same fan frame 904 is fixedly connected to the opposite side of the installation block 903, the fan 905 is fixedly connected to the inner side of the fan frame 904, and the plurality of fans 905 are arranged on the aluminum plate 901, so that heat in the water tank 806 can be quickly dissipated.
Referring to fig. 9, the transmission mechanism 11 includes a push block 111, a slide rod 112 and a screw rod 113, the screw rod 113 is rotatably connected to the inner side of the mounting groove 13, the other end of the screw rod 113 penetrates through the side wall of the mounting groove 13 and is fixedly connected to the servo motor 22, the mounting groove 13 is T-shaped, the slide rod 112 is fixedly connected to the inner side of the mounting groove 13, the slide rods 112 are symmetrically arranged on two sides of the screw rod 113, the push block 111 is connected to the outer side of the screw rod 113 through a screw thread, the push block 111 is slidably connected to the slide rod 112, the upper end of the push block 111 is fixedly connected to the second sliding pipe 123, and the mounting groove 13 is T-shaped, so that the upper end of the push block 111 is provided with a protruding block, and.
Referring to fig. 13, the forced compression assembly 19 includes a threaded hole 191, a fastening ring 192 and a second bolt 193, the threaded hole 191 is formed in the upper end of the second sliding pipe 123, the second bolt 193 is connected to the inner side of the threaded hole 191 through a thread, the fastening ring 192 is arranged on the outer side of the second bolt 193, and the forced compression assembly 19 can fix and weld the i-shaped PCB with special texture, so that the practicability of the welding mold can be improved.
Referring to fig. 7, the filter mechanism 4 includes a sealing plate 401, a filter box 402, a water guide plate 403, a through hole 404, a screen 405, a water filtering cavity 406 and a water inlet cavity 407, the filter box 402 is fixedly connected to the outer side of the hot water pipe 805, the sealing plate 401 is fixedly connected to the inner side of the filter box 402, the through hole 404 is disposed on the outer side of the sealing plate 401, the filter cavity 406 and the water inlet cavity 407 are respectively disposed on the inner side of the filter box 402 through the sealing plate 401, the filter cavity 406 is disposed on the left side of the water inlet cavity 407, the water guide plate 403 is fixedly connected to the inner side of the hot water pipe 805, one end of the water guide plate 403 is fixedly connected to a rim of the water inlet cavity 407, the screen 405 is fixedly mounted on the inner side of the filter cavity 406, the impurity box 408 is connected to the outer side of the filter box 402 in an inserting manner, an opening is disposed between the filter cavity 406 and the impurity box 408, the screen 405 is designed to, the collection is convenient.
Referring to fig. 8, the linkage mechanism 5 includes a sliding block 501, a connecting rod 502, a collar 503 and a cylinder 504, the collar 503 is fixedly connected to the outer side of the first sliding tube 122, the collar 503 is rotatably connected to the connecting rod 502, the sliding block 501 is fixedly connected to the lower end of the connecting rod 502, the sliding block 501 is slidably connected to the chute 15, and the cylinder 504 is fixedly connected to the upper end of the connecting rod 502.
The invention relates to a high-efficiency welding die for chip production, which has the following working principle: when the device is used, firstly, a PCB can be placed at the upper end of a die and is parallel to the positioning plate 6, then the PLC 20 is programmed by setting parameters through the touch screen 21, the PLC 20 transmits pulses to the driver 23 and receives signals returned by the pressure sensor 1 at the same time, the pulses generate coding parameters to drive the servo motor 22 to rotate, the control strength of the PCB is controlled through the abutting mechanism 18, the lead screw 113 rotates along with the rotation of the servo motor 22, so that the push block 111 on the lead screw 113 can slide on the slide bar 112, and the push block 111 on the die body 3 synchronously pushes in one direction, so that the center point of the PCB can be rapidly positioned, the manual measuring and positioning process is omitted, the welding efficiency of chips is improved, and meanwhile, the bottom of the placement area of the PCB is contacted with the silica gel block 801 on the die body 3, the silica gel block 801 quickly transfers heat generated by welding a PCB to a heat absorption copper body 802 through heat conduction, the lower end of the heat absorption copper body 802 is provided with a spiral pipe 803, water in a water tank 806 enters the spiral pipe 803 through a cold water pipe 804 through a water pump 807 to be cooled, the other end of the spiral pipe 803 is connected with a hot water pipe 805, the hot water pipe 805 takes away the heat on the heat absorption copper body 802 and returns to the water tank 806 again, the back of the water tank 806 is provided with a heat dissipation mechanism 9, the heat is absorbed through an aluminum plate 901 and heat dissipation fins 902 on the water tank 806, meanwhile, a fan 905 is arranged on a fan frame 904 on an installation block 903 to dissipate heat, so that the heat in the water tank 806 can be dissipated, the problem of pipeline blockage caused by long-term use is solved, the filter mechanism 4 is additionally arranged on the hot water pipe 805, water enters through a water guide plate 403 and a water inlet cavity 407 and is drained through a sealing plate 401, filter through screen cloth 405, collect by impurity box 408, can reduce the produced impurity in the cooling process, avoid the pipeline to block up, influence the radiating effect of mould main part 3.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (8)
1. The utility model provides a chip production is with high-efficient welding mould, includes base station (2), its characterized in that: the die comprises a base platform (2), cylinders (16) are fixedly connected to the left and right sides of the lower end of the base platform (2), a reinforcing mechanism (17) is arranged at the lower end of each cylinder (16), a touch screen (21) is fixedly connected to the front side of the base platform (2), a PLC (programmable logic controller) is fixedly connected to the lower end of the base platform (2), a die main body (3) is fixedly connected to the upper end of the base platform (2), a positioning plate (6) is fixedly connected to the upper end of the die main body (3), mounting grooves (13) are formed in the left and right sides of the upper end of the die main body (3), a transmission mechanism (11) is arranged on the inner side of each mounting groove (13), a telescopic mechanism (12) is fixedly connected to the upper end of each transmission mechanism (11), sliding grooves (15) are formed in the left and right sides of the upper end of, the inner side of the die main body (3) is provided with a water cooling mechanism (8), the left side and the right side of the die main body (3) are both fixedly connected with a fixing plate (10), the upper end of the fixing plate (10) is respectively and fixedly connected with a servo motor (22) and a driver (23), and the output end of the servo motor (22) is fixedly connected with a transmission mechanism (11);
the telescopic mechanism (12) comprises a partition plate (121), a first sliding pipe (122) and a second sliding pipe (123), the upper end of the transmission mechanism (11) is fixedly connected with the second sliding pipe (123), the middle part of the inner side of the second sliding pipe (123) is fixedly connected with the partition plate (121), the inner side of the second sliding pipe (123) is slidably connected with the first sliding pipe (122), the upper end of the second sliding pipe (123) is provided with a forced compression assembly (19), the outer side of the second sliding pipe (123) is fixedly connected with a propping and fixing mechanism (18), and the first sliding pipe (122) is fixedly connected with the linkage mechanism (5);
the abutting and fixing mechanism (18) comprises a rubber strip (181), a heat-resisting layer (182) and an anti-static coating (183), the rubber strip (181) is fixedly connected to the outer side of the second sliding pipe (123), a pressure sensor (1) is arranged on the inner side of the rubber strip (181), and the heat-resisting layer (182) is arranged between the rubber strip (181) and the anti-static coating (183);
the touch screen (21) is provided with parameters to program the PLC controller (20), the PLC controller (20) transmits pulses to the driver (23) and receives signals returned by the pressure sensor (1), the pulses generate coding parameters to drive the servo motor (22) to rotate, and the control force of the PCB is controlled by the abutting mechanism (18), so that the central point positioning of the PCB is realized uniformly and rapidly.
2. The efficient welding die for chip production according to claim 1, wherein the efficient welding die comprises: the reinforcing mechanism (17) comprises a tripod (171), a first bolt (172) and a fastening ring (173), the tripod (171) is fixedly connected to the outer side of the fastening ring (173), the first bolt (172) is in threaded connection with the outer side of the fastening ring (173), and the outer side of the fastening ring (173) is movably connected with the cylinder (16) through the first bolt (172).
3. The efficient welding die for chip production according to claim 1 or 2, wherein the efficient welding die comprises: the water cooling mechanism (8) comprises a silica gel block (801), a heat absorption copper body (802), a cold water pipe (804), a spiral pipe (803), a hot water pipe (805), a water tank (806) and a water pump (807), a perforation (7) is arranged at the upper end of the mold main body (3), a pressing frame (14) is arranged on the outer side of the perforation (7), the silica gel block (801) is clamped on the inner side of the perforation (7), the heat absorption copper body (802) is fixedly connected to the inner side of the silica gel block (801), the spiral pipe (803) is connected to the lower end of the heat absorption copper body (802) in a winding manner, the hot water pipe (805) is fixedly connected to the left side of the spiral pipe (803), the cold water pipe (804) is fixedly connected to the right side of the spiral pipe (803), the water tank (806) is fixedly connected to the lower end of the base platform (2), the water pump (807) is fixedly connected to the lower end of, the right side of water tank (806) and water pump (807) fixed connection, the other end and cold water pipe (804) fixed connection of water pump (807), the outside of hot-water line (805) is equipped with filtering mechanism (4), the outside of water tank (806) is equipped with heat dissipation mechanism (9).
4. The efficient welding mold for chip production as set forth in any one of claims 1 to 3, wherein: the heat dissipation mechanism (9) comprises an aluminum plate (901), heat dissipation fins (902), an installation block (903), a fan frame (904) and a fan (905), the back of the water tank (806) is fixedly connected with the aluminum plate (901), the outer sides of the aluminum plate (901) are fixedly connected with the heat dissipation fins (902), the outer sides of the heat dissipation fins (902) are fixedly connected with the installation block (903), the opposite sides of the installation block (903) are fixedly connected with the same fan frame (904), and the inner sides of the fan frame (904) are fixedly connected with the fan (905).
5. The efficient welding die for chip production according to claim 1, wherein the efficient welding die comprises: drive mechanism (11) are including ejector pad (111), slide bar (112) and lead screw (113), the inboard rotation of mounting groove (13) is connected with lead screw (113), the other end of lead screw (113) runs through mounting groove (13) lateral wall and servo motor (22) fixed connection, the shape of mounting groove (13) is the T shape, the inboard fixedly connected with slide bar (112) of mounting groove (13), the both sides at lead screw (113) are established to slide bar (112) symmetry, the outside threaded connection of lead screw (113) has ejector pad (111), ejector pad (111) are sliding connection with slide bar (112), the upper end and the second sliding tube (123) of ejector pad (111) are fixed connection.
6. The efficient welding die for chip production according to claim 1, wherein the efficient welding die comprises: the forced compression assembly (19) comprises a threaded hole (191), a buckling ring (192) and a second bolt (193), the threaded hole (191) is formed in the upper end of the second sliding pipe (123), the second bolt (193) is connected to the inner side of the threaded hole (191) in a threaded mode, and the buckling ring (192) is arranged on the outer side of the second bolt (193).
7. The efficient welding die for chip production as recited in claim 3, wherein: the filtering mechanism (4) comprises a sealing plate (401), a filtering box (402), a water guide plate (403), through holes (404), a screen (405), an impurity box (408), a water filtering cavity (406) and a water inlet cavity (407), the outer side of the hot water pipe (805) is fixedly connected with a filter box (402), the inner side of the filter box (402) is fixedly connected with a sealing plate (401), the outer side of the sealing plate (401) is provided with a through hole (404), the inner side of the filter box (402) is respectively provided with a water filtering cavity (406) and a water inlet cavity (407) through the sealing plate (401), the water filtering cavity (406) is arranged at the left side of the water inlet cavity (407), the inner side of the hot water pipe (805) is fixedly connected with a water guide plate (403), one end of the water guide plate (403) is fixedly connected with the edge of the water inlet cavity (407), the inner side of the water filtering cavity (406) is fixedly provided with a screen (405), and the outer side of the filtering box (402) is connected with an impurity box (408) in an inserting manner.
8. The efficient welding die for chip production according to claim 1, wherein the efficient welding die comprises: link gear (5) include slider (501), connecting rod (502), the lantern ring (503) and section of thick bamboo post (504), the outside fixedly connected with lantern ring (503) of first slip pipe (122), lantern ring (503) with connecting rod (502) rotate to be connected, the lower extreme fixedly connected with slider (501) of connecting rod (502), slider (501) are sliding connection with spout (15), the upper end fixedly connected with section of thick bamboo post (504) of connecting rod (502).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011492383.0A CN112894226A (en) | 2020-12-17 | 2020-12-17 | High-efficient welding mold is used in chip production |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011492383.0A CN112894226A (en) | 2020-12-17 | 2020-12-17 | High-efficient welding mold is used in chip production |
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| KR20150061235A (en) * | 2013-11-27 | 2015-06-04 | 김득일 | Work device for machine center |
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| CN210745838U (en) * | 2019-10-15 | 2020-06-12 | 广州市伟达力电器有限公司 | Be applied to heat abstractor on mine locomotive converter |
| CN210754580U (en) * | 2019-10-22 | 2020-06-16 | 上海双顺钢铁材料有限公司 | Mechanical transmission precision lubrication type high-speed punch press |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150061235A (en) * | 2013-11-27 | 2015-06-04 | 김득일 | Work device for machine center |
| CN206702451U (en) * | 2017-03-29 | 2017-12-05 | 天津源泰德润钢管制造集团有限公司 | Rectangular tube production line welding cooling water circulation feeding mechanism |
| CN210125683U (en) * | 2019-07-03 | 2020-03-06 | 葛晨宇 | Quick accurate positioning workbench of mould |
| CN210745838U (en) * | 2019-10-15 | 2020-06-12 | 广州市伟达力电器有限公司 | Be applied to heat abstractor on mine locomotive converter |
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Application publication date: 20210604 |