CN112880232A - Cooling water tank, cooling system and method - Google Patents
Cooling water tank, cooling system and method Download PDFInfo
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- CN112880232A CN112880232A CN202110083468.1A CN202110083468A CN112880232A CN 112880232 A CN112880232 A CN 112880232A CN 202110083468 A CN202110083468 A CN 202110083468A CN 112880232 A CN112880232 A CN 112880232A
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- water tank
- temperature
- water
- cooling
- tank body
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- 239000000498 cooling water Substances 0.000 title claims abstract description 42
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 122
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000005057 refrigeration Methods 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000013528 artificial neural network Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- 239000008399 tap water Substances 0.000 claims description 4
- 235000020679 tap water Nutrition 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 210000002569 neuron Anatomy 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
- F04C29/04—Heating; Cooling; Heat insulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a cooling water tank, a cooling system and a method, and the technical scheme is as follows: the water tank comprises a water tank body, wherein a semiconductor refrigerating sheet and a temperature sensor are arranged on the water tank body, and the semiconductor refrigerating sheet and the temperature sensor are respectively connected with a controller; the temperature sensor is used for detecting the water temperature of the water tank body and transmitting a signal to the controller, and the controller realizes the refrigeration and heating of the water tank body according to the signal and the current direction of the semiconductor refrigeration piece. The invention can not only effectively realize the function of cooling water temperature, but also reduce the volume of the cooling water tank, and flexibly control the temperature of the inlet water, so that the water tank is always at the optimal working temperature of the water ring type vacuum pump.
Description
Technical Field
The invention relates to the field of refrigeration equipment, in particular to a cooling water tank, a cooling system and a cooling method.
Background
The performance of the water-ring vacuum pump is mainly influenced by the temperature of inlet water, the flow rate of the inlet water, the pressure of a suction inlet and the like, wherein the most important is the temperature of the inlet water. The water-ring vacuum pump produces such things as: the ineffective power of the motor, the heat brought by the higher temperature of the sucked gas, the heat released by the steam contained in the sucked gas in the compression process and the like further aggravate the rising of the inlet water temperature and reduce the vacuum-pumping efficiency.
The water ring vacuum pump's the inflow adopts the running water mostly, because the influence of weather temperature can make the inflow water temperature too low, can not keep at best operating temperature, reduces work efficiency. The inventor finds that the traditional water tank mainly utilizes the contact of water and air, and the heat is dispelled through evaporation, and refrigeration effect is slow, and is bulky, restriction service environment, and can only realize refrigeration function, and when the temperature of intaking water is low, can not exert a function.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a cooling water tank, a cooling system and a cooling method, which can effectively realize the function of cooling water temperature, reduce the volume of the cooling water tank and flexibly control the temperature of inlet water so that the inlet water temperature is always at the optimal temperature for the operation of a water ring type vacuum pump.
In order to achieve the purpose, the invention is realized by the following technical scheme:
in a first aspect, an embodiment of the present invention provides a cooling water tank, including a water tank body, where the water tank body is provided with a semiconductor refrigeration sheet and a temperature sensor, and the semiconductor refrigeration sheet and the temperature sensor are respectively connected to a controller; the temperature sensor is used for detecting the water temperature of the water tank body and transmitting a signal to the controller, and the controller realizes the refrigeration and heating of the water tank body according to the signal and the current direction of the semiconductor refrigeration piece.
As a further implementation mode, one side of the water tank body is provided with a water inlet, and the other side of the water tank body is provided with a water outlet; and a heat radiation fan is arranged at the top of the water tank body.
As a further implementation mode, the semiconductor refrigeration pieces are symmetrically arranged on two sides of the water tank body and are connected with the heat dissipation fan through the heat dissipation copper pipes.
As a further implementation, the controller employs a BP neural network PID control.
As a further implementation mode, the inside of the water tank body is wrapped with ceramic fiber cloth.
As a further implementation, the water inlet is provided with a tap water connector.
In a second aspect, the embodiment of the invention also provides a cooling system, which comprises the cooling water tank.
As a further implementation mode, the cooling water system further comprises a water ring vacuum pump, and the water ring vacuum pump is connected with the cooling water tank.
As a further implementation mode, the water outlet of the cooling water tank is connected with the cooling water tank through a steam-water separator.
In a third aspect, an embodiment of the present invention further provides a method for operating a cooling system, including:
the water temperature when the working efficiency of the water ring type vacuum pump is the highest is taken as the optimal temperature, and the temperature which is higher than the optimal temperature set value is taken as the reference temperature;
the temperature sensor detects the water temperature of the water tank, and when the water temperature is lower than the optimal temperature, the system does not work;
when the water temperature is higher than the optimal temperature and lower than the reference temperature, the controller outputs a signal to the semiconductor chilling plate on one side of the cooling water tank, and only the semiconductor chilling plate on one side works until the water temperature is the optimal temperature;
when the water temperature is higher than the reference temperature, the controller sends signals to the semiconductor chilling plates on the two sides, and the semiconductor chilling plates on the two sides work until the water temperature is the optimal temperature.
The beneficial effects of the above-mentioned embodiment of the present invention are as follows:
(1) one or more embodiments of the present invention utilize a semiconductor chiller to directly refrigerate, with greater efficiency than previous methods that utilize water and air contact to dissipate heat through evaporation; the volume of the refrigerating element is small, and the volume of the cooling water tank is reduced; the semiconductor refrigerating plate is used for directly controlling the temperature, and the temperature is kept constant at the optimal temperature.
(2) One or more embodiments of the invention can carry out logic programming processing on the temperature of the water tank, and a novel BP neural network PID control algorithm is adopted, so that the control speed is high and the error is small.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic illustration of a water ring vacuum pump in accordance with one or more embodiments of the present invention in connection with a cooling water tank;
FIG. 2 is a schematic diagram of a controller architecture according to one or more embodiments of the present invention;
FIG. 3 is a schematic illustration of a tank body structure of a water tank according to one or more embodiments of the present invention;
FIG. 4 is a schematic illustration of a semiconductor chilling plate installation according to one or more embodiments of the present invention;
FIG. 5 is a schematic diagram of a heat dissipation fan according to one or more embodiments of the present invention;
FIG. 6 is a schematic diagram of a controller architecture according to one or more embodiments of the present invention;
FIG. 7 is a schematic diagram of a drive circuit for a semiconductor chilling plate according to one or more embodiments of the present invention;
FIG. 8 is a schematic diagram of a CPU control circuit according to one or more embodiments of the present invention;
FIG. 9 is a control circuit diagram of a BP based neural network in accordance with one or more embodiments of the present invention;
FIG. 10 is a flow diagram of a controller BP neural network PID control algorithm according to one or more embodiments of the invention;
the device comprises a water tank body 1, a water ring vacuum pump 2, a steam-water separator 3, a tap water connector 4, a controller 5, a ceramic fiber cloth 6, a heat radiation fan 7, a semiconductor refrigeration sheet 8, a heat radiation copper pipe 9.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and/or "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof;
for convenience of description, the words "up", "down", "left" and "right" in this application, if any, merely indicate correspondence with the directions of up, down, left and right of the drawings themselves, and do not limit the structure, but merely facilitate the description of the invention and simplify the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
The terms "mounted", "connected", "fixed", and the like in the present application should be understood broadly, and for example, the terms "mounted", "connected", and "fixed" may be fixedly connected, detachably connected, or integrated; the two components can be connected directly or indirectly through an intermediate medium, or the two components can be connected internally or in an interaction relationship, and the terms can be understood by those skilled in the art according to specific situations.
The first embodiment is as follows:
an embodiment of the invention provides a cooling water tank, as shown in fig. 1-4, which comprises a water tank body 1, wherein a semiconductor refrigerating sheet 8 and a temperature sensor are installed on the water tank body 1, and the semiconductor refrigerating sheet 8 and the temperature sensor are respectively connected with a controller 5; the temperature sensor detects the water temperature of the water tank body 1 and transmits a signal to the controller 5, and the controller 5 realizes the refrigeration and heating of the water tank body 1 according to the signal and the current direction of the semiconductor refrigeration piece 8.
As shown in fig. 3, a water inlet is arranged at one side of the water tank body 1, and a tap water joint 4 is arranged at the water inlet; the water inlet is directly connected with the outside water inlet. And the other side of the water tank body 1 is provided with a water outlet which is used for connecting a water ring vacuum pump 2.
In this embodiment, two phi 25 water inlets are reserved on one side of the water tank body 1, and one phi 25 water outlet is reserved on the other side. It will be appreciated that in other embodiments, the sizes of the water inlet and outlet may be selected according to actual requirements.
Further, as shown in fig. 5, a heat dissipation fan 7 is installed at the top of the water tank body 1; the temperature sensor and the controller 5 are arranged at the bottom of the water tank body. Semiconductor refrigeration piece 8 symmetry is installed in 1 both sides of water tank box, and semiconductor refrigeration piece 8 directly refrigerates cooling water tank, reduces the water tank volume, improves refrigeration efficiency.
In this embodiment, two semiconductor cooling plates 8 are respectively installed on two sides of the water tank body 1, and it can be understood that in other embodiments, the number of the semiconductor cooling plates 8 installed on the water tank body 1 may also be other values.
Further, the semiconductor refrigeration piece 8 is connected with the heat radiation fan 7 through the heat radiation copper pipe 9, and the heat radiation fan 7 absorbs heat generated in the working process of the semiconductor refrigeration piece 8. The inner container of the water tank body 1 is wrapped by ceramic fiber cloth 6 which is high-temperature-resistant heat-insulating cloth, and the heat of the heat-radiating copper pipe 9 can be isolated and dissipated into the water tank body 1.
Further, as shown in fig. 6, the controller 5 includes a power supply circuit, a digital input circuit, an analog input circuit, a digital output circuit, and a CPU controller circuit. And the power supply circuit, the digital input circuit, the analog input circuit and the digital output circuit are all connected with the CPU control circuit.
Controller circuit as shown in fig. 8, in the present embodiment, the controller selects the Stm32 chip, and the CPU controller is connected to the digital value input circuit: the PC6, the PC7 and the PDs 15-D1 are respectively connected with the DI00, the DI01 and the DI02, and three digital quantity inputs are reserved.
The CPU controller is connected with the analog input circuit: PAO-WKUP-TIM 21 is connected to DI03 for detecting the input signal of the temperature sensor. The CPU controller is connected with the digital quantity output circuit: PA11-USBDM, PA12-USBDP and PC5 are respectively connected with DO00, DO01 and DO02 and used for outputting potential signals of the semiconductor refrigeration piece 8.
Further, as shown in fig. 7, when the drive circuit of the TEC (semiconductor chilling plate) is set to be high at OUT3, low at OUT4, low at OUT2, and high at OUT1, Q3 and Q4 are turned off, Q1 and Q2 are turned on, and current flows from left to right through the TEC (semiconductor chilling plate) to chill the TEC; conversely, when OUT3 is low, OUT4 is high, OUT2 is high, and OUT1 is low, Q3 and Q4 are on, Q1 and Q2 are off, and current flows from right to left to heat the circuit.
The PWM duty ratio of OUT1 or OUT4 is controlled and set through PID control of a controller BP neural network, and the conduction time of Q1 or Q4 is controlled to control the working time of TEC (semiconductor refrigeration chip), so that the temperature control effect is achieved.
As shown in fig. 9 and 10, the algorithm steps of the controller BP neural network PID control are summarized as follows:
(1) determining the structure of a BP network, giving initial values of weighting coefficients of all layers, and selecting a learning rate and an inertia coefficient, wherein the proportional coefficient of a neuron is 1; sampling to obtain r (k) and y (k), and calculating the time error
e(k)＝r(k)-y(k)。
(2) Calculating the input and output of each layer of neuron of the neural network, and outputting three adjustable parameters Kp, Ki and Kd of the PID controller; calculating the output u (k) of the PID controller according to a control algorithm;
and (4) learning a neural network, adjusting the weight value on line and realizing the self-adaptive adjustment of the PID control parameter.
(3) K is set to k +1, and the process returns to (1).
In the embodiment, a BP neural network PID control algorithm is adopted, the control speed is high, and the system stability is improved.
Example two:
the embodiment provides a cooling system, as shown in fig. 1, including the cooling water tank of the first embodiment, and further including a water-ring vacuum pump 2, where the water-ring vacuum pump 2 is connected to the cooling water tank.
Further, a water inlet of the water ring vacuum pump 2 is connected with the cooling water tank, and a water outlet of the water ring vacuum pump is connected with the cooling water tank through the steam-water separator 3. The water inlet of the cooling water tank is directly connected with the external water inlet, and the cooling water tank needs 24VDC power supply. The connection direction of the water ring vacuum pump 2 and the cooling water tank can be actually installed on site, the water ring vacuum pump and the cooling water tank can be horizontally placed on the left and right sides, and the water ring vacuum pump and the cooling water tank can also be vertically placed up and down, so that the installation flexibility is improved.
Example three:
the embodiment provides an operating method of a cooling system, which comprises the following steps:
the water ring vacuum pump 2 has the highest working efficiency when the water temperature is 15 ℃ (the optimal temperature).
When the system starts to work, the temperature sensor detects the water temperature of the water tank, and when the water temperature is lower than 15 ℃, the system does not work; when the water temperature is higher than 15 ℃ and lower than 25 ℃ (reference temperature), the controller 5 outputs a signal to the semiconductor refrigerating sheet 8 on one side of the cooling water tank, and only the semiconductor refrigerating sheet 8 on one side works until the water temperature is 15 ℃.
When the water temperature is higher than 25 ℃, the controller 5 sends signals to the semiconductor refrigerating pieces 8 on the two sides, and the semiconductor refrigerating pieces 8 on the two sides work until the water temperature is 15 ℃.
This embodiment can effectively reduce the heat that water ring vacuum pump 2 produced at the during operation through this cooling water tank, and through output signal's two shelves settings, can practice thrift the electric energy moreover, improves system stability.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A cooling water tank is characterized by comprising a water tank body, wherein a semiconductor refrigerating sheet and a temperature sensor are mounted on the water tank body, and the semiconductor refrigerating sheet and the temperature sensor are respectively connected with a controller; the temperature sensor is used for detecting the water temperature of the water tank body and transmitting a signal to the controller, and the controller realizes the refrigeration and heating of the water tank body according to the signal and the current direction of the semiconductor refrigeration piece.
2. The cooling water tank as claimed in claim 1, wherein the tank body is provided with a water inlet at one side and a water outlet at the other side; and a heat radiation fan is arranged at the top of the water tank body.
3. The cooling water tank as claimed in claim 2, wherein the semiconductor refrigeration sheets are symmetrically arranged at two sides of the water tank body, and the semiconductor refrigeration sheets are connected with the heat dissipation fan through heat dissipation copper pipes.
4. The cooling water tank as claimed in claim 1, wherein the controller is controlled by BP neural network PID.
5. The cooling water tank as claimed in claim 1, wherein the inside of the tank body is wrapped with ceramic fiber cloth.
6. The cooling water tank as claimed in claim 2, wherein the water inlet is provided with a tap water joint.
7. A cooling system comprising the cooling water tank as claimed in any one of claims 1 to 6.
8. The cooling system of claim 7, further comprising a water ring vacuum pump connected to the cooling water tank.
9. The cooling system according to claim 8, wherein the water outlet of the cooling water tank is connected to the cooling water tank through a steam-water separator.
10. A method of operating a cooling system according to any one of claims 7 to 9, comprising:
the water temperature when the working efficiency of the water ring type vacuum pump is the highest is taken as the optimal temperature, and the temperature which is higher than the optimal temperature set value is taken as the reference temperature;
the temperature sensor detects the water temperature of the water tank, and when the water temperature is lower than the optimal temperature, the system does not work;
when the water temperature is higher than the optimal temperature and lower than the reference temperature, the controller outputs a signal to the semiconductor chilling plate on one side of the cooling water tank, and only the semiconductor chilling plate on one side works until the water temperature is the optimal temperature;
when the water temperature is higher than the reference temperature, the controller sends signals to the semiconductor chilling plates on the two sides, and the semiconductor chilling plates on the two sides work until the water temperature is the optimal temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110083468.1A CN112880232A (en) | 2021-01-21 | 2021-01-21 | Cooling water tank, cooling system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110083468.1A CN112880232A (en) | 2021-01-21 | 2021-01-21 | Cooling water tank, cooling system and method |
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| CN112880232A true CN112880232A (en) | 2021-06-01 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09170791A (en) * | 1995-12-21 | 1997-06-30 | Hitachi Ltd | Cooling device and ice heat reserving device |
| CN201818471U (en) * | 2010-10-15 | 2011-05-04 | 山东华腾环保科技有限公司 | Vacuum pump unit cooling system |
| CN105955336A (en) * | 2016-06-14 | 2016-09-21 | 国网浙江省电力公司衢州供电公司 | Semiconductor-cooling-based shielded cabinet temperature control apparatus and method |
| CN208587296U (en) * | 2018-08-01 | 2019-03-08 | 内蒙古赛宝伦科技有限公司 | A kind of monocrystalline silicon process apparatus has the water ring vacuum pump of cooling device |
| CN210889314U (en) * | 2019-09-03 | 2020-06-30 | 德耐尔能源装备有限公司 | Screw rod equidistance formula does not have oily vacuum pump |
| CN211082256U (en) * | 2019-11-11 | 2020-07-24 | 陈康生 | Automatic water supply device of water ring vacuum pump |
-
2021
- 2021-01-21 CN CN202110083468.1A patent/CN112880232A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09170791A (en) * | 1995-12-21 | 1997-06-30 | Hitachi Ltd | Cooling device and ice heat reserving device |
| CN201818471U (en) * | 2010-10-15 | 2011-05-04 | 山东华腾环保科技有限公司 | Vacuum pump unit cooling system |
| CN105955336A (en) * | 2016-06-14 | 2016-09-21 | 国网浙江省电力公司衢州供电公司 | Semiconductor-cooling-based shielded cabinet temperature control apparatus and method |
| CN208587296U (en) * | 2018-08-01 | 2019-03-08 | 内蒙古赛宝伦科技有限公司 | A kind of monocrystalline silicon process apparatus has the water ring vacuum pump of cooling device |
| CN210889314U (en) * | 2019-09-03 | 2020-06-30 | 德耐尔能源装备有限公司 | Screw rod equidistance formula does not have oily vacuum pump |
| CN211082256U (en) * | 2019-11-11 | 2020-07-24 | 陈康生 | Automatic water supply device of water ring vacuum pump |
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Effective date of registration: 20230403 Address after: 215557 Zhengwen Road, Yushan High-tech Industrial Park, Changshu, Suzhou, Jiangsu Province Applicant after: Jiangsu CRRC Huateng Environmental Protection Technology Co.,Ltd. Address before: 250101 No. 3666 Century Avenue, Jinan High-tech Zone, Shandong Province Applicant before: SHANDONG CRRC HUATENG ENVIRONMENT Co.,Ltd. |
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Application publication date: 20210601 |