CN112867245A - Flexible circuit board, display device and preparation method - Google Patents
Flexible circuit board, display device and preparation method Download PDFInfo
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- CN112867245A CN112867245A CN202110267728.0A CN202110267728A CN112867245A CN 112867245 A CN112867245 A CN 112867245A CN 202110267728 A CN202110267728 A CN 202110267728A CN 112867245 A CN112867245 A CN 112867245A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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Abstract
The embodiment of the application provides a flexible circuit board, a display device and a preparation method. The flexible circuit board includes: the main body part and at least one first-stage extension part connected with the main body part; one side of the main body part is provided with a first binding area; one side of the first-stage extension part is provided with a second binding area; under the flexible circuit board is in the final bending state, main part and first order extension portion all are located the one side that first module kept away from first face, the projection of main part on the first plane, and the projection of first order extension portion on the first plane all fall into the projection of first module on the first plane, the projection of first order extension portion on the first plane overlaps with the projection of main part on the first plane at least part, and the first face of district dorsad is bound to the second of first order extension portion, the first plane is on a parallel with the first face. The reverse binding of the reverse folding is adopted in the embodiment of the application, so that more complete machine space can be saved for the electronic equipment, and the function diversification development or miniaturization development of the electronic equipment is facilitated.
Description
Technical Field
The application relates to the technical field of flexible circuit boards, in particular to a flexible circuit board, a display device and a preparation method.
Background
In the development process of the electronic industry, the diversification of the functions of the electronic devices and the miniaturization of the electronic devices are two important directions of the development of the electronic industry. Among them, diversification of functions of electronic devices means increase in the number of components in the electronic devices, which is in conflict with the development of miniaturization of the electronic devices.
A Flexible Printed Circuit (FPC), which is also called a Flexible Circuit board or a Flexible Circuit board, is preferred for its excellent characteristics such as light weight, thin thickness, and flexibility and folding freedom, and can be used to electrically connect at least some components in an electronic device.
However, in the existing flexible circuit board application mode, the electronic device still has the defects of insufficient internal space capacity or low internal space utilization rate, and the miniaturization development of the electronic device is limited.
Disclosure of Invention
The application provides a flexible circuit board, a display device and a preparation method aiming at the defects of the existing mode, and aims to solve the technical problems that the internal space capacity of electronic equipment is insufficient or the internal space utilization rate is low in the prior art.
In a first aspect, an embodiment of the present application provides a flexible circuit board, including: the main body part and at least one first-stage extension part connected with the main body part;
one side of the main body part is provided with a first binding area which is used for binding with a module binding area of a flexible binding structure in a first module;
one side of the first-stage extension part is provided with a second binding region which is used for binding with the first device;
under the flexible circuit board is in the final bending state, main part and first order extension portion all are located the one side that first module kept away from first face, the projection of main part on the first plane, and the projection of first order extension portion on the first plane all fall into the projection of first module on the first plane, the projection of first order extension portion on the first plane overlaps with the projection of main part on the first plane at least part, and the first face of district dorsad is bound to the second of first order extension portion, the first plane is on a parallel with the first face.
In a second aspect, an embodiment of the present application provides a display device, including: a first module, a first device and the flexible circuit board as provided in the first aspect;
the first module comprises a flexible binding structure, and one side of the flexible binding structure is provided with a module binding area;
the first binding region of the main body part of the flexible circuit board is bound with the module binding region of the first module;
the first device is bound with the second binding region of the first-stage extension part of the flexible circuit board.
In a third aspect, embodiments of the present application provide a method for manufacturing a display device as provided in the second aspect, including:
binding the first device with a second binding region of the first-stage extension part in the flexible circuit board;
binding a first binding region of a main body part in the flexible circuit board with a module binding region of a flexible binding structure in a first module;
bending the flexible binding structure of the first module back to the first surface of the first module, so that the projection of the main body part of the flexible circuit board on the first plane is in the projection of the first module on the first plane, and the first plane is parallel to the first surface of the first module;
the first-stage extension portion of the flexible circuit board is bent back to the first face of the first module, so that the projection of the first-stage extension portion on the first plane falls into the projection of the first module on the first plane and at least partially overlaps with the projection of the first module on the first plane, and the second binding area of the first-stage extension portion is back to the first face of the first module.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise: the flexible circuit board is structurally optimized, when the flexible circuit board is in a final bending state, the projection of the main body part on the first plane is in the projection of the first module on the first plane, and at least part of the projection of the first-stage extension part on the first plane is overlapped with the projection of the first module on the first plane, reverse binding by reverse bending can save more complete machine space for electronic equipment compared with the traditional design, more components can be arranged by using the saved complete machine space, or the space occupation ratio of the components can be enlarged, so that the function diversification development of the electronic equipment is promoted or the performance of the electronic equipment is improved, the whole volume of the electronic equipment can be reduced by using the saved complete machine space, and the miniaturization development of the electronic equipment is facilitated. Moreover, the main body part and the first-stage extension part of the flexible circuit board are both bent to the state that the first module is far away from one side of the first face, the second binding area of the first-stage extension part faces away from the first face of the first module, the second binding area can be bound with the first device, and the layout of the first device can be facilitated.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a front view of a flexible circuit board and a first module in a first binding state according to an embodiment of the present disclosure;
fig. 3 is a schematic rear view of a flexible circuit board and a first module in a first binding state according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a front view of a flexible circuit board and a first module in a second binding state according to an embodiment of the present disclosure;
fig. 5 is a schematic rear view of a flexible printed circuit board and a first module in a second binding state according to an embodiment of the present disclosure
Fig. 6 is a schematic structural diagram of a front view of a flexible circuit board and a first module in a third binding state according to an embodiment of the present disclosure;
fig. 7 is a schematic rear view of a flexible circuit board and a first module in a third binding state according to an embodiment of the present disclosure;
fig. 8 is a schematic rear view of a flexible circuit board and a first module in a fourth binding state according to an embodiment of the present disclosure;
fig. 9 is a schematic flow chart of a method for manufacturing a display device according to an embodiment of the present application, the method being provided in any one of the foregoing embodiments;
fig. 10 is a schematic flow chart of another method for manufacturing a display device according to any one of the previous embodiments in the present application.
In the figure:
100-a flexible circuit board; 110-a body portion; 120-a first level of extensibility; 121-a second binding region; 130-second stage extension; 131-a third binding region;
200-a first module; 210-a flexible binding structure; 211-drive circuit.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The present application provides a flexible circuit board 100, a display device and a manufacturing method thereof, which aim to solve the above technical problems in the prior art.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the present application provides a flexible circuit board 100, and a schematic structural diagram of the flexible circuit board 100 is shown in fig. 1, including but not limited to: a main body portion 110, and at least one primary extension 120 connected to the main body portion 110.
One side of the main body 110 has a first binding region (not shown) for binding with a module binding region (not shown) of the flexible binding structure 210 of the first module 200.
One side of the first level extension 120 has a second binding region 121, and the second binding region 121 is used for binding with the first device.
When the flexible circuit board 100 is in the final bending state, as shown in fig. 8, the main body 110 and the first-stage extending portion 120 are both located on a side of the first module 200 away from the first surface, a projection of the main body 110 on the first plane and a projection of the first-stage extending portion 120 on the first plane both fall into a projection of the first module 200 on the first plane, a projection of the first-stage extending portion 120 on the first plane and a projection of the main body 110 on the first plane are at least partially overlapped, a second binding region 121 of the first-stage extending portion 120 faces away from the first surface, and the first plane is parallel to the first surface.
It should be noted that the first plane (not shown) is a virtual plane for clearly expressing the structure of the flexible circuit board 100 in the embodiments of the present application. In fig. 2-8, the front view is a view facing the first surface, and the rear view is a view facing away from the first surface.
In this embodiment, the structure of the flexible circuit board 100 is optimized, when the flexible circuit board 100 is in the final bending state, the projection of the main body 110 on the first plane falls within the projection of the first module 200 on the first plane, and the projection of the first-stage extending portion 120 on the first plane at least partially overlaps with the projection of the first module 200 on the first plane, the reverse binding by the reverse bending can save more overall space for the electronic device compared with the conventional design, the saved overall space can be used to arrange more components or enlarge the space proportion of the components, thereby promoting the function diversification development of the electronic device or improving the performance of the electronic device, the saved overall space can be used to reduce the overall volume of the electronic device, and further facilitating the miniaturization development of the electronic device. Moreover, under the state that the main body portion 110 and the first-stage extending portion 120 of the flexible circuit board 100 are both bent to the side of the first module 200 away from the first surface, the second binding region 121 of the first-stage extending portion 120 faces away from the first surface of the first module 200, which can be beneficial to binding the second binding region 121 with the first device and also beneficial to the layout of the first device.
Optionally, under the condition that the overall size of the electronic device is not changed, by using the flexible circuit board 100 provided in this embodiment, more overall space can be released, which is beneficial to increase the sizes of other components in the overall device. For example: the volume of the battery is increased, so that the capacity of the battery can be increased, and the endurance time can be prolonged; another example is: the size of the display screen is increased, the display size can be increased, and the visual experience is improved.
The present inventors have considered that the structure of the unfolded state of the flexible circuit board 100 may have an influence on the connection performance of the flexible circuit board 100. To this end, the present application provides one possible implementation manner for the flexible circuit board 100 as follows:
as shown in fig. 2 to 5, when the flexible circuit board 100 is in a flattened state, the projection of the first stage extension portion 120 on the first plane may at least partially extend out of the projection of the first module 200 on the first plane.
In this embodiment, when the flexible circuit board 100 is in the flat state, at least a part of the projection of the first-stage extending portion 120 on the first plane may extend out of the projection of the first module 200 on the first plane, that is, the first-stage extending portion 120 may exceed the size of the first module 200, so that a longer winding stroke may be provided, which is beneficial to routing the first-stage extending portion 120 of the flexible circuit board 100 inside the electronic device, and further improves the connection performance of the flexible circuit board 100.
In some possible embodiments, as shown in fig. 1, the first-stage extensions 120 have at least two, and each two of the first-stage extensions 120 are connected to opposite ends of the main body 110.
In this embodiment, every two first-stage extending portions 120 in the flexible circuit board 100 are respectively connected to two opposite ends of the main body portion 110, which is beneficial to reducing the overlapping rate of every two first-stage extending portions 120 after being bent, improving the space utilization rate, effectively controlling the thickness of the electronic device, and being beneficial to thinning the electronic device.
In some possible embodiments, the connection direction of the first-stage extending portion 120 and the main body portion 110 and the connection direction of the main body portion 110 and the first module 200 form an angle α, where α is greater than 0 and less than or equal to 90 °.
In this embodiment, the connection direction between the first-stage extending portion 120 and the main body portion 110 and the connection direction between the main body portion 110 and the first module 200 are at an angle α, so that on one hand, the overall shape of the flexible circuit board 100 can be controlled, for example, the overall structure of the flexible circuit board 100 is prevented from being too long and narrow, and on the other hand, the bending directions of the bending positions of the flexible circuit board 100 can be staggered, which is beneficial to improving the space utilization rate, effectively controlling the thickness of the electronic device, and reducing the thickness of the electronic device.
The present inventors have considered that the number of the bonding regions of the flexible circuit board 100 also affects the connection performance of the flexible circuit board 100. To this end, the present application provides one possible implementation manner for the flexible circuit board 100 as follows:
as shown in fig. 1, the flexible circuit board 100 further includes, but is not limited to: the second-stage extension 130.
At least one first stage extension 120 is connected to a second stage extension 130.
At least one side of the second-level extension 130 has a third binding region 131, and the third binding region 131 is used for binding with a second device.
When the flexible circuit board 100 is in the final bending state, the projection of the second-stage extension portion 130 on the first plane at least partially overlaps the projection of the first-stage extension portion 120 on the first plane, and the third binding region 131 of the second-stage extension portion 130 faces the first surface of the first module 200.
In this embodiment, the second-stage extension portion 130 may provide the third binding region 131 for the flexible circuit board 100, that is, the number of the binding regions of the flexible circuit board 100 may be increased, and then the number or types of components that may be bound may be enriched, so as to improve the connection performance of the flexible circuit board 100.
In some possible embodiments, the connection direction of the second-stage extending portion 130 and the first-stage extending portion 120 and the connection direction of the first-stage extending portion 120 and the main body portion 110 form an angle β, and β is greater than 0 and less than or equal to 90 °.
In this embodiment, the connection direction between the second-stage extending portion 130 and the first-stage extending portion 120 and the connection direction between the first-stage extending portion 120 and the main body portion 110 form a β -angle, so that on one hand, the overall shape of the flexible circuit board 100 can be controlled, for example, the overall structure of the flexible circuit board 100 is prevented from being too long and narrow, and on the other hand, the bending directions of the bending positions of the flexible circuit board 100 can be staggered, which is beneficial to improving the space utilization rate, effectively controlling the thickness of the electronic device, and reducing the thickness of the electronic device.
Optionally, a plurality of second-stage extending portions 130 are respectively connected with the same first-stage extending portion 120, and the connection direction of each second-stage extending portion 130 and the first-stage extending portion 120 is staggered by an angle γ, where γ is greater than 0 and less than or equal to 90 °.
Based on the same inventive concept, embodiments of the present application provide a display device, which is schematically shown in fig. 2 to 8, and includes but is not limited to: a first module 200, a first device and any one of the flexible circuit boards 100 as provided in the previous embodiments.
The first module 200 includes, but is not limited to, a flexible binding structure 210, and one side of the flexible binding structure 210 has a module binding region.
The first bonding region of the body portion 110 of the flexible circuit board 100 is bonded to the module bonding region of the first module 200.
The first device is bonded to the second bonding region 121 of the first-stage extension 120 of the flexible circuit board 100.
In the present embodiment, the display device employs the flexible circuit board 100 with optimized structure provided in the previous embodiments, in the final bending state of the flexible circuit board 100, the projection of the main body 110 on the first plane falls within the projection of the first module 200 on the first plane, and the projection of the first-stage extension part 120 on the first plane is at least partially overlapped with the projection of the first module 200 on the first plane, the reverse binding by the reverse folding can save more space of the whole display device compared with the traditional design, can use the saved space of the whole machine to arrange more components or enlarge the space proportion of the components, further, the function diversification development of the display device is promoted or the performance of the display device is improved, and the whole volume of the display device can be reduced by utilizing the saved whole machine space, so that the miniaturization development of the display device is facilitated. Moreover, under the state that the main body portion 110 and the first-stage extending portion 120 of the flexible circuit board 100 are both bent to the side of the first module 200 away from the first surface, the second binding region 121 of the first-stage extending portion 120 faces away from the first surface of the first module 200, which can be beneficial to binding the second binding region 121 with the first device and also beneficial to the layout of the first device.
Alternatively, the first module 200 may be any functional module in a display device, such as a display module or a touch module.
Alternatively, the first device may be a connector, or may be at least one of a T-IC (touch integrated circuit), a Flash (Flash memory), a resistor, and a capacitor.
Optionally, the driving circuit 211 may be integrated on the flexible bonding structure 210 of the first module 200.
In some possible embodiments, the display device further includes, but is not limited to, a second device. The second device is bonded to the third bonding region 131 of the second-stage extension 130 of the flexible circuit board 100.
Alternatively, the second device may be a connector, or may be at least one of a T-IC (touch integrated circuit), a Flash (Flash memory), a resistor, and a capacitor.
In some possible embodiments, the first module 200 includes, but is not limited to, a display panel. The display surface of the display panel forms the first surface of the first module 200.
Alternatively, the Display panel adopts a Display structure of an LCD (Liquid Crystal Display).
Alternatively, the display panel adopts a display structure such as an LED (Light Emitting Diode) or a Micro-LED (Micro Light Emitting Diode) or an OLED (Organic Light-Emitting Diode).
In some possible embodiments, the first module 200 includes, but is not limited to, a touch panel. The touch surface of the touch panel forms a first surface of the first module 200.
Based on the same inventive concept, the present application provides a method for manufacturing any one of the display devices provided in the foregoing embodiments, the method is schematically illustrated in fig. 9, and the method includes, but is not limited to, the following steps S101 to S104:
s101: and binding the first device with a second binding region of the first-stage extension part in the flexible circuit board.
S102: and binding a first binding region of the main body part in the flexible circuit board with a module binding region of the flexible binding structure in the first module.
The structural state after the present step S102 is as shown in fig. 2 and 3.
S103: the flexible binding structure of the first module is bent back to the first surface of the first module, so that the projection of the main body part of the flexible circuit board on the first plane is in the projection of the first module on the first plane, and the first plane is parallel to the first surface of the first module.
The structural state after the present step S103 is as shown in fig. 4 and 5.
S104: the first-stage extension portion of the flexible circuit board is bent back to the first face of the first module, so that the projection of the first-stage extension portion on the first plane falls into the projection of the first module on the first plane and at least partially overlaps with the projection of the first module on the first plane, and the second binding area of the first-stage extension portion is back to the first face of the first module.
The structural state after the present step S104 is as shown in fig. 6 and 7.
In this embodiment, the reverse binding by the reverse folding can save more overall space for the display device compared with the conventional design, and can utilize the saved overall space to arrange more components or enlarge the space occupation ratio of the components, thereby promoting the function diversification development of the display device or improving the performance of the display device, and also can utilize the saved overall space to reduce the overall volume of the display device, thereby being beneficial to the miniaturization development of the display device. Moreover, under the state that the main body portion 110 and the first-stage extending portion 120 of the flexible circuit board 100 are both bent to the side of the first module 200 away from the first surface, the second binding region 121 of the first-stage extending portion 120 faces away from the first surface of the first module 200, which can be beneficial to binding the second binding region 121 with the first device and also beneficial to the layout of the first device.
Alternatively, step S101 may be performed before step S102.
Alternatively, step S101 may be performed in synchronization with step S102.
Alternatively, step S101 may be performed after step S102 and before step S103.
Alternatively, step S101 may be performed in synchronization with step S103.
Alternatively, step S101 may be performed after step S103 and before step S104.
The embodiment of the present application provides another method for manufacturing any display device as provided in the previous embodiment, where a flow chart of the method is shown in fig. 10, and the method includes, but is not limited to, the following steps S201 to S206:
s201: and binding the first device with a second binding region of the first-stage extension part in the flexible circuit board.
S202: and binding the second device with a third binding region of the second-stage extension part in the flexible circuit board.
S203: the first bonding region of the main body portion in the flexible circuit board is bonded to the module bonding region of the flexible bonding structure 210 in the first module.
The structural state after the present step S203 is as shown in fig. 2 and 3.
S204: the flexible binding structure of the first module is bent back to the first surface of the first module, so that the projection of the main body part of the flexible circuit board on the first plane is in the projection of the first module on the first plane, and the first plane is parallel to the first surface of the first module.
The structural state after the present step S204 is as shown in fig. 4 and 5.
S205: the first-stage extension portion of the flexible circuit board is bent back to the first face of the first module, so that the projection of the first-stage extension portion on the first plane falls into the projection of the first module on the first plane and at least partially overlaps with the projection of the first module on the first plane, and the second binding area of the first-stage extension portion is back to the first face of the first module.
The structural state after the present step S205 is as shown in fig. 6 and 7.
S206: the second-stage extension part of the flexible circuit board is bent back to the first surface of the first module, so that the projection of the second-stage extension part on the first plane falls into the projection of the first module on the first plane and at least partially overlaps with the projection of the first-stage extension part on the first plane, and the third binding area of the second-stage extension part faces to the first surface of the first module.
The structural state after the present step S206 is shown in fig. 8.
On the basis of having all the advantages of the method for manufacturing a display device provided in the foregoing embodiment, the method for manufacturing another display device provided in this embodiment further provides a process step of binding the second device with the third binding region 131 of the second-stage extension portion 130, and a process step of bending the second-stage extension portion 130 away from the first surface of the first module 200. The second-stage extension portion 130 may be utilized to provide the third binding region 131 for the flexible circuit board 100, that is, the number of binding regions of the flexible circuit board 100 may be increased, and then the number or kinds of components that may be bound may be enriched, thereby improving the connection performance of the flexible circuit board 100.
Alternatively, step S202 may be performed before step S201.
Alternatively, step S202 may be performed in synchronization with step S201.
Alternatively, step S202 may be performed after step S201 and before step S206. Which comprises the following steps: step S202 may be executed simultaneously with any one of step S203, step S204, and step S205.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. the flexible circuit board 100 is structurally optimized, when the flexible circuit board 100 is in a final bending state, the projection of the main body part 110 on the first plane is in the projection of the first module 200 on the first plane, and the projection of the first-stage extension part 120 on the first plane is at least partially overlapped with the projection of the first module 200 on the first plane, compared with the traditional design, the reverse binding adopting the reverse bending can save more complete machine space for the electronic equipment, the space occupation ratio of more components or parts can be arranged by utilizing the saved complete machine space, the function diversification development of the electronic equipment is further promoted or the performance of the electronic equipment is further improved, the saved complete machine space can also be utilized to reduce the whole volume of the electronic equipment, and the miniaturization development of the electronic equipment is further facilitated. Moreover, under the state that the main body portion 110 and the first-stage extending portion 120 of the flexible circuit board 100 are both bent to the side of the first module 200 away from the first surface, the second binding region 121 of the first-stage extending portion 120 faces away from the first surface of the first module 200, which can be beneficial to binding the second binding region 121 with the first device and also beneficial to the layout of the first device.
2. When the flexible circuit board 100 is in the flat state, at least a part of the projection of the first-stage extending portion 120 on the first plane may extend out of the projection of the first module 200 on the first plane, that is, the first-stage extending portion 120 may exceed the size of the first module 200, so that a longer winding stroke may be provided, which is beneficial for routing the first-stage extending portion 120 of the flexible circuit board 100 inside the electronic device, and further improves the connection performance of the flexible circuit board 100.
3. Every two first-stage extending parts 120 in the flexible circuit board 100 are respectively connected to two opposite ends of the main body part 110, so that the overlapping rate of every two first-stage extending parts 120 after being bent is reduced, the space utilization rate is improved, the thickness of the electronic equipment can be effectively controlled, and the electronic equipment is thinned.
4. By adopting the structure that the connection direction between the first-stage extending portion 120 and the main body portion 110 and the connection direction between the main body portion 110 and the first module 200 form an included angle α, on one hand, the overall shape of the flexible circuit board 100 can be controlled, for example, the overall structure of the flexible circuit board 100 is prevented from being too long and narrow, and on the other hand, the bending directions of the bending positions of the flexible circuit board 100 can be staggered, so that the space utilization rate is improved, the thickness of the electronic device can be effectively controlled, and the electronic device can be thinned.
5. The second-stage extension portion 130 may provide the third binding region 131 for the flexible circuit board 100, that is, the number of the binding regions of the flexible circuit board 100 may be increased, and then the number or the types of components that may be bound may be enriched, thereby improving the connection performance of the flexible circuit board 100.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (12)
1. A flexible circuit board, comprising: a main body portion and at least one primary extension portion connected to the main body portion;
one side of the main body part is provided with a first binding area which is used for binding with a module binding area of a flexible binding structure in a first module;
one side of the first-stage extension part is provided with a second binding region which is used for binding with a first device;
the flexible circuit board is in under the final state of buckling, the main part with first order extension portion all is located one side that first face was kept away from to first module, the projection of main part on the first plane reaches first order extension portion is in projection on the first plane all falls into first module is in the projection on the first plane, first order extension portion is in projection on the first plane with the main part is in projection on the first plane is at least partly overlapped, just first order extension portion the district dorsad is bound to the second first face, the first plane is on a parallel with the first face.
2. The flexible circuit board of claim 1, wherein a projection of the first stage extension portion onto a first plane is at least partially extendable out of a projection of the first module onto the first plane when the flexible circuit board is in a flattened state.
3. The flexible circuit board of claim 1, wherein the first-stage extensions have at least two, and each two of the first-stage extensions are connected to opposite ends of the main body portion.
4. The flexible circuit board of claim 1, wherein an angle α is formed between a connection direction of the first-stage extending portion and the main body portion and a connection direction of the main body portion and the first module, and is greater than 0 and less than or equal to 90 °.
5. The flexible circuit board according to any one of claims 1-4, further comprising: a second-stage extending part;
at least one of the first level extensions is connected to the second level extension;
at least one side of the second-level extension part is provided with a third binding region which is used for binding with a second device;
when the flexible circuit board is in a final bending state, the projection of the second-stage extension part on the first plane is at least partially overlapped with the projection of the first-stage extension part on the first plane, and the third binding area of the second-stage extension part faces to the first surface of the first module.
6. The flexible circuit board of claim 5, wherein the connection direction between the second-stage extension portion and the first-stage extension portion and the connection direction between the first-stage extension portion and the main body portion form a beta angle, and beta is greater than 0 and less than or equal to 90 °.
7. A display device, comprising: a first module, a first device and the flexible circuit board of any one of claims 1-6;
the first module comprises a flexible binding structure, and one side of the flexible binding structure is provided with a module binding area;
a first binding region of the main body part of the flexible circuit board is bound with the module binding region of the first module;
the first device is bound with the second binding region of the first-stage extension part of the flexible circuit board.
8. The display device according to claim 7, further comprising a second device;
the second device is bound with a third binding region of the second-stage extension part of the flexible circuit board.
9. The display device according to claim 7 or 8, wherein the first module comprises a display panel;
the display surface of the display panel forms a first surface of the first module.
10. The display device according to claim 7 or 8, wherein the first module comprises a touch panel;
the touch surface of the touch panel forms a first surface of the first module.
11. A method of manufacturing a display device according to any one of claims 7 to 10, comprising:
binding the first device with a second binding region of the first-stage extension part in the flexible circuit board;
binding a first binding region of a main body part in the flexible circuit board with a module binding region of a flexible binding structure in a first module;
bending the flexible binding structure of the first module away from a first surface of the first module, so that the projection of the main body part of the flexible circuit board on a first plane is within the projection of the first module on the first plane, and the first plane is parallel to the first surface of the first module;
will the first order extension portion of flexible circuit board dorsad the first face of first module is buckled, makes first order extension portion be in projection on the first plane falls into first module is in the projection on the first plane, and with first module is in projection on the first plane at least part overlaps, just first order extension portion the second bind the district dorsad the first face of first module.
12. The method of manufacturing according to claim 11, further comprising:
binding a second device with a third binding region of a second-stage extension part in the flexible circuit board;
and bending the second-stage extension part of the flexible circuit board back to the first surface of the first module, so that the projection of the second-stage extension part on the first plane falls into the projection of the first module on the first plane and at least partially overlaps with the projection of the first-stage extension part on the first plane, and the third binding area of the second-stage extension part faces to the first surface of the first module.
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| CN202110267728.0A CN112867245B (en) | 2021-03-11 | 2021-03-11 | Flexible circuit board, display device and preparation method |
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| CN202110267728.0A CN112867245B (en) | 2021-03-11 | 2021-03-11 | Flexible circuit board, display device and preparation method |
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Also Published As
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| CN112867245B (en) | 2022-07-26 |
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