CN112862052A - Smart card and manufacturing method thereof - Google Patents

Smart card and manufacturing method thereof Download PDF

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Publication number
CN112862052A
CN112862052A CN202110191484.2A CN202110191484A CN112862052A CN 112862052 A CN112862052 A CN 112862052A CN 202110191484 A CN202110191484 A CN 202110191484A CN 112862052 A CN112862052 A CN 112862052A
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CN
China
Prior art keywords
layer
substrate
forming
smart card
grating
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Pending
Application number
CN202110191484.2A
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Chinese (zh)
Inventor
杨德奎
欧益
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Jiede China Technology Co ltd
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Jiede China Technology Co ltd
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Priority to CN202110191484.2A priority Critical patent/CN112862052A/en
Publication of CN112862052A publication Critical patent/CN112862052A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Abstract

The invention discloses an intelligent card and a manufacturing method thereof, wherein the intelligent card comprises a card base, the card base comprises a front substrate part and a back substrate part which are arranged in a stacking way, and the front substrate part comprises: a first substrate having a first surface facing away from the opposite substrate portion and a second surface facing toward the opposite substrate portion in a thickness direction; the first shading ink layer is arranged on the side of the second surface of the first substrate; the grating processing layer is arranged on the side of the first surface of the first substrate; a grating pattern layer positioned between the first substrate and the first shading ink layer; and a pattern effect layer disposed in at least one of the following positions: between the first substrate and the grating processing layer; and the grating pattern layer and the first shading ink layer. The invention can enable the smart card to have not only the grating effect but also other individual effects, and can meet the requirements of users on the surface effect of the smart card.

Description

Smart card and manufacturing method thereof
Technical Field
The invention relates to the technical field of smart card manufacturing, in particular to a smart card and a manufacturing method of the smart card.
Background
With the development of electronic technology, smart cards are increasingly widely used due to the advantages of large amount of stored information and high security.
The smart card with the grating effect on the surface displays the three-dimensional pattern by using the grating, has a very strong pattern expression effect, and meets the new requirements of users on the traditional cards. However, the inventor finds that the texture on the surface of the grating card can not apply other personalized effect patterns such as silk-screen gold and silver, pearlescence and the like on the surface of the card body, so that the surface effect of the grating card is single.
Disclosure of Invention
The embodiment of the invention provides an intelligent card and a manufacturing method of the intelligent card.
In a first aspect, an embodiment of the present invention provides a smart card, including a card base, where the card base includes a front substrate portion and a back substrate portion, which are stacked, and the front substrate portion includes: a first substrate having a first surface facing away from the opposite substrate portion and a second surface facing toward the opposite substrate portion in a thickness direction; the first shading ink layer is arranged on the side of the second surface of the first substrate; the grating processing layer is arranged on the side of the first surface of the first substrate; a grating pattern layer positioned between the first substrate and the first shading ink layer; and a pattern effect layer disposed in at least one of the following positions: between the first substrate and the grating processing layer; and the grating pattern layer and the first shading ink layer.
According to the foregoing embodiment of the first aspect of the present invention, the pattern effect layer includes a flat ironing film layer disposed between the first substrate and the grating processing layer.
According to any of the preceding embodiments of the first aspect of the invention, the pattern effect layer comprises a raised gold layer, the raised gold layer being disposed between the first substrate and the grating treatment layer.
According to any of the preceding embodiments of the first aspect of the invention, the raster processed layer comprises a raster processed portion and a non-processed portion, the non-processed portion covering the riser layer.
According to any of the preceding embodiments of the first aspect of the present invention, the pattern effect layer includes a first silk-screen effect film layer, and the first silk-screen effect film layer is disposed between the first substrate and the grating processing layer.
According to any of the foregoing embodiments of the first aspect of the present invention, the pattern effect layer includes a second silk-screen effect film layer, and the second silk-screen effect film layer is disposed between the grating pattern layer and the first shading ink layer.
According to any of the preceding embodiments of the first aspect of the invention, the front substrate portion further comprises a first protective film layer disposed between the first substrate and the grating process layer.
According to any one of the preceding embodiments of the first aspect of the present invention, the pattern effect layer comprises a raised gold layer, the raised gold layer being disposed between the first substrate and the first protective film layer; and/or the pattern effect layer comprises a flat ironing film layer, and the flat ironing film layer is arranged between the first protection film layer and the grating processing layer.
According to any of the preceding embodiments of the first aspect of the invention, the front substrate portion and the back substrate portion are attached by a layer of adhesive.
According to any preceding embodiment of the first aspect of the invention, the opposite substrate portion comprises: a second substrate having a third surface and a fourth surface in a thickness direction, the third surface facing away from the front substrate portion; the winding antenna layer is arranged on the side of the fourth surface of the second substrate; and the compensation layer is arranged on one side of the winding antenna layer, which is deviated from the second substrate.
According to any preceding embodiment of the first aspect of the invention, the opposite substrate portion further comprises: the second shading ink layer is arranged on the fourth surface of the second substrate, and the winding antenna layer is positioned on one side, away from the second substrate, of the second shading ink layer; the reverse printing layer is arranged on the third surface of the second substrate; and the second protective film layer is arranged on one side of the reverse side printing layer, which is deviated from the second substrate, and the second protective film layer is provided with a magnetic stripe.
According to any one of the foregoing embodiments of the first aspect of the present invention, the card base further includes a groove disposed in the thickness direction, the chip is embedded in the groove, and the chip is electrically connected to the wire-wound antenna layer.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a smart card, including forming a front substrate portion, where the forming the front substrate portion includes: providing a first substrate having a first surface and a second surface in a thickness direction; forming a grating pattern layer on the side of the second surface of the first substrate; forming a pattern effect layer, wherein the pattern effect layer is formed on the first surface side of the first substrate and/or the grating pattern layer is away from the first substrate side; forming a first shading ink layer on the side of the grating pattern layer, which is far away from the first substrate; and forming a grating processing layer on the side of the first surface of the first substrate, wherein the step of forming the grating processing layer is positioned after the step of forming the pattern effect layer.
According to the foregoing embodiment of the second aspect of the present invention, forming the pattern effect layer includes: and forming a flat ironing film layer on the side of the first surface of the first substrate.
According to any one of the preceding embodiments of the second aspect of the invention, forming the pattern effect layer comprises: a gold layer is formed on the first surface side of the first substrate.
According to any one of the preceding embodiments of the second aspect of the invention, forming the pattern effect layer comprises: and forming a first silk-screen effect film layer on the side of the first surface of the first substrate.
According to any one of the preceding embodiments of the second aspect of the invention, forming the pattern effect layer comprises: and forming a second silk-screen effect film layer on the side of the grating pattern layer, which is far away from the first substrate, wherein the step of forming the second silk-screen effect film layer is positioned before the first shading ink layer is formed.
According to any of the preceding embodiments of the second aspect of the invention, forming the front side substrate portion further comprises: and forming a first protective film layer on the first surface side of the first substrate, wherein the step of forming the grating processing layer is positioned after the step of forming the first protective film layer.
According to any one of the foregoing embodiments of the second aspect of the present invention, the forming of the pattern effect layer includes forming a vertical gold layer on the side of the first surface of the first substrate, the step of forming the vertical gold layer being located before the step of forming the first protective film layer; and/or forming the pattern effect layer comprises forming a flat ironing film layer on the side of the first surface of the first substrate, wherein the step of forming the flat ironing film layer is positioned after the step of forming the first protective film layer.
According to any of the preceding embodiments of the second aspect of the invention, further comprising: forming a reverse substrate portion; and the front substrate part and the back substrate part are stacked in a mode that the grating processing layer deviates from the back substrate part, and the front substrate part and the back substrate part are fixed into a whole through the adhesive layer to form the card base.
According to any preceding embodiment of the second aspect of the invention, forming the counter substrate portion comprises: providing a second substrate having a third surface and a fourth surface in a thickness direction; forming a second shading ink layer on the fourth surface side of the second substrate; forming a reverse printing layer on the third surface side of the second substrate; providing a winding antenna layer, and arranging the winding antenna layer on one side of the second shading ink layer, which is far away from the second substrate; a compensation layer is formed on the side of the wound antenna layer facing away from the second substrate.
According to any of the preceding embodiments of the second aspect of the invention, after the step of forming the card base, further comprising: the chip is packaged to a card substrate to form a smart card.
According to the smart card and the manufacturing method of the smart card provided by the embodiment of the invention, the smart card has other individual effects by arranging the pattern effect layer, and the pattern effect layer is arranged on one side of the grating treatment layer facing to the reverse substrate part, so that the pattern effect layer does not need to be applied to the surface of the grating treatment layer, and the problems that the pattern effect layer is difficult to process and easy to fall off are avoided. In addition, the grating pattern layer and the grating processing layer are respectively arranged on two sides of the first substrate, grating lines of the grating processing layer and the transparent first substrate can form a series of lenses, so that the grating pattern layer forms a three-dimensional or dynamic effect, and the smart card has a grating effect.
Drawings
Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
Fig. 1 is a schematic structural diagram of a smart card according to an embodiment of the present invention;
FIG. 2 is an example of a front substrate portion in a smart card according to an embodiment of the present invention;
FIG. 3 is another example of a front substrate portion in a smart card according to an embodiment of the present invention;
FIG. 4 is yet another example of a front substrate portion in a smart card according to an embodiment of the present invention;
FIG. 5 is yet another example of a front substrate portion in a smart card according to an embodiment of the present invention;
FIG. 6 is yet another example of a front substrate portion in a smart card according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of another structure of a smart card according to an embodiment of the present invention;
FIG. 8 is an illustration of a reverse substrate portion of a smart card provided in accordance with an embodiment of the present invention;
fig. 9 is a schematic diagram of another structure of a smart card according to an embodiment of the present invention;
FIG. 10 is a flowchart of a method for manufacturing a smart card according to an embodiment of the present invention;
FIG. 11 is a flowchart of a method for manufacturing a smart card according to another embodiment of the present invention;
fig. 12 is a flow chart of a method of manufacturing a smart card forming a card base according to an embodiment of the present invention;
FIG. 13 is a flow chart of a method of forming a reverse substrate portion of a method of making a smart card according to an embodiment of the present invention;
fig. 14 is a flowchart of a method for manufacturing a smart card according to another embodiment of the present invention.
Description of reference numerals:
100-a front side substrate portion; 110-a first substrate; 120-a first opacifying ink layer; 130-a grating pattern layer; 140-a grating treatment layer; 150-a pattern effect layer; 151-ironing film layer; 152-a cubic gold layer; 153-a first silk-screen effect film layer; 154-second silk-screen effect film layer; 160-a first protective film layer;
200-a reverse substrate portion; 210-a second substrate; 220-a compensation layer; 230-a wire wound antenna layer; 240-a second shading ink layer; 250-reverse side printing layer; 260-a second protective film layer;
300-pressing the adhesive layer;
400-chip.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
With the development of electronic technology, smart cards are increasingly widely used due to the advantages of large amount of stored information and high security. The smart card with the grating effect on the surface displays the three-dimensional pattern by using the grating, has a very strong pattern expression effect, and meets the new requirements of users on the traditional cards. However, the inventor finds that the texture on the surface of the grating card can not apply other personalized effect patterns such as silk-screen gold and silver, pearlescence and the like on the surface of the card body, so that the surface effect of the grating card is single.
Based on the above problems, embodiments of the present invention provide an intelligent card and a method for manufacturing the intelligent card, so that the intelligent card has not only a grating effect but also other personalized effects, and can meet the requirements of users on the surface effect of the intelligent card.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a smart card according to an embodiment of the present invention.
The smart card provided by the embodiment of the invention comprises a card base, wherein the card base comprises a front substrate part 100 and a back substrate part 200 which are arranged in a laminated manner, and the front substrate part 100 comprises a first substrate 110, a first shading ink layer 120, a grating processing layer 140, a grating pattern layer 130 and a pattern effect layer 150.
The first substrate 110 has a first surface facing away from the opposite substrate portion 200 and a second surface facing toward the opposite substrate portion 200 in the thickness direction. The first light-shielding ink layer 120 is disposed on the second surface side of the first substrate 110. The grating processing layer 140 is disposed on the first surface side of the first substrate 110. The grating pattern layer 130 is positioned between the first substrate 110 and the first light-shielding ink layer 120. The pattern effect layer 150 is disposed in at least one of the following positions: between the first substrate 110 and the grating treatment layer 140; between the grating pattern layer 130 and the first opacifying ink layer 120.
According to the smart card provided by the embodiment of the invention, the smart card has other individual effects by arranging the pattern effect layer 150, and the pattern effect layer 150 is arranged on one side of the grating processing layer 140 facing the reverse substrate part 200, so that the pattern effect layer 150 does not need to be applied to the surface of the grating processing layer 140, and the problems that the pattern effect layer 150 is difficult to process and easy to fall off are avoided.
It is understood that the first substrate 110 is typically a transparent substrate; the first light-shielding ink layer 120 may be formed by screen-printing white ink on the side of the first surface of the first substrate 110. The first substrate 110 may be made of PVC, PET, etc., for example, and the present application is not limited thereto.
The grating processing layer 140 is the outermost layer of the front substrate portion 100 on the side away from the back substrate portion 200, and during manufacturing, a grating pattern can be directly processed on the outer surface of the front substrate portion 100 to form the grating processing layer 140. The grating pattern of the grating processing layer 140 may be a strip or a ring, which is not limited in the present invention.
The grating pattern layer 130 and the grating processing layer 140 are respectively disposed on two sides of the first substrate 110, the gratings of the grating processing layer 140 and the grating pattern layer 130 are closely corresponding to each other, the grating lines of the grating processing layer 140 and the transparent first substrate 110 form a series of lenses, and when the lens is observed by human eyes, hidden changing double patterns, changing three patterns and changing multiple patterns can be clearly observed at different angles due to refraction and diffraction of the lenses to the observation light, so that a dynamic or depth-of-field effect is formed.
In summary, the smart card provided by the embodiment of the present invention has not only the grating effect, but also other personalized effects, and can meet the requirements of the user on the surface effect of the smart card.
It should be noted that the pattern effect layer 150 has a plurality of types, and may include one or more of a flat ironing film layer, a gold-setting film layer, a silk-screen effect film layer, and the like, and may be specifically selected according to actual needs.
Fig. 2 is an illustration of a front substrate portion 100 in a smart card according to an embodiment of the present invention. In some alternative embodiments, as shown in fig. 2, the pattern effect layer 150 may include a flat ironing film layer 151, and the flat ironing film layer 151 is disposed between the first substrate 110 and the grating processing layer 140. The flat ironing film layer 151 may be, for example, a flat ironing gold and silver film tape, a flat ironing black and white film tape, or a flat ironing color film tape. When manufacturing the smart card, a flat ironing film layer 151 may be formed on a film tape required for flat ironing the first surface of the first substrate 110, and then a grating pattern forming grating processing layer 140 may be processed on the side of the first surface of the first substrate 110.
It is understood that the flat ironing film layer 151 may partially cover the first surface of the first substrate 110, and in this case, the grating processing layer 140 may completely cover the flat ironing film layer 151 and the first surface of the first substrate 110, or may cover only a portion of the first substrate 110 where the flat ironing film layer 151 is not disposed.
Fig. 3 is another example of a front substrate portion 100 in a smart card according to an embodiment of the present invention. In some alternative embodiments, as shown in fig. 3, the pattern effect layer 150 may include a raised gold layer 152, and the raised gold layer 152 is disposed between the first substrate 110 and the grating processing layer 140. The riser layer 152 may be, for example, a riser of various colors, and the riser layer 152 may be formed by attaching a riser to the first surface of the first substrate 110.
In order to fix the metal riser layer 152 more reliably, the metal riser may be fixed to a predetermined position on the first surface of the first substrate 110 by spot welding, and then the metal riser and the first substrate 110 may be pressed together by a lamination process.
Alternatively, in order to provide better stereoscopic effect to the raised gold layer 152, the grating treatment layer 140 may include a grating treatment portion and a non-treatment portion, the non-treatment portion covers the raised gold layer 152, that is, the grating treatment layer 140 does not cover the raised gold layer 152, and the raised gold layer 152 is exposed on the outer surface of the front substrate portion 100.
In some optional embodiments, the pattern effect layer 150 may include a silk-screen effect film layer, and the silk-screen effect film layer may have silk-screen gold and silver, pearl, temperature variation or light variation effects, for example, which is not particularly limited in the present invention.
Fig. 4 is yet another example of a front substrate portion 100 in a smart card according to an embodiment of the present invention. In some alternative embodiments, as shown in fig. 4, the pattern effect layer 150 may include a first silk-screen effect film layer 153, and the first silk-screen effect film layer 153 is disposed between the first substrate 110 and the grating processing layer 140.
The first silk-screen effect film 153 is located between the grating pattern layer 130 and the grating processing layer 140, and in order that the first silk-screen effect film 153 does not affect the grating effect, optionally, a projection of the first silk-screen effect film 153 on the first substrate 110 partially covers the first substrate 110.
Fig. 5 is yet another example of a front substrate portion 100 in a smart card according to an embodiment of the present invention. In some alternative embodiments, as shown in fig. 5, the pattern effect layer 150 may include a second silk-screen effect film layer 154, and the second silk-screen effect film layer 154 is disposed between the grating pattern layer 130 and the first black-out ink layer 120. At this time, the projection of the second silk-screen effect film layer 154 on the first substrate 110 may completely cover the first substrate 110.
Fig. 6 is yet another example of a front substrate portion 100 in a smart card according to an embodiment of the present invention. In the smart card provided by the embodiment of the present invention, the front substrate portion 100 may further include a first protection film layer 160, and the first protection film layer 160 is disposed between the first substrate 110 and the grating processing layer 140.
Optionally, the pattern effect layer 150 includes a metal layer 152, the metal layer 152 may be disposed between the first substrate 110 and the first protection film layer 160, and the first protection film layer 160 may protect the metal layer from being damaged when the metal layer and the first substrate 110 are pressed together through a lamination process.
Optionally, the pattern effect layer 150 may include a flat ironing film layer 151, the flat ironing film layer 151 is disposed between the first protection film layer 160 and the grating processing layer 140, and the flat ironing film layer 151 is disposed on a side of the first protection film layer 160 departing from the first substrate 110, so that a display effect of the flat ironing film layer 151 may be ensured.
Fig. 7 is a schematic structural diagram of a smart card according to an embodiment of the present invention. As shown in fig. 7, in the smart card according to the embodiment of the present invention, the front substrate portion 100 and the back substrate portion 200 may be attached by an adhesive layer 300. When the smart card is manufactured, the adhesive layer 300 is arranged between the front substrate part 100 and the back substrate part 200, and the front substrate part, the back substrate part and the back substrate part are pressed into a whole through a laminating process.
Optionally, the adhesive layer 300 may be, for example, a low-temperature adhesive, and the reaction temperature is low during lamination, so as to ensure that the grating lines of the grating processing layer 140 are not melted during lamination.
Fig. 8 is an illustration of a reverse substrate portion 200 of a smart card provided in accordance with an embodiment of the present invention.
In some alternative embodiments of the smart card provided by embodiments of the present invention, the opposite substrate portion 200 of the card base may include a second substrate 210, a wound antenna layer 230, and a compensation layer 220.
The second substrate 210 has a third surface and a fourth surface in the thickness direction, the third surface facing away from the front substrate part 100. The wire wound antenna layer 230 is disposed on the fourth surface of the second substrate 210, the compensation layer 220 is disposed on a side of the wire wound antenna layer 230 away from the second substrate 210, and the compensation layer 220 can compensate for the thickness of the card substrate.
In order to fix the wound antenna layer 230 more reliably, the wound antenna layer 230 may be fixed at a predetermined position on the fourth surface of the second substrate 210 by spot welding, and the wound antenna layer 230, the compensation layer 220 and the second substrate 210 may be pressed together by a lamination process.
Alternatively, the second substrate 210 and the first substrate 110 may be made of the same material, and the second substrate 210 may be a transparent substrate.
Optionally, the reverse substrate portion 200 may further include a second light-shielding ink layer 240, the second light-shielding ink layer 240 is disposed on the fourth surface of the second substrate 210, and the second light-shielding ink layer 240 may be formed by screen printing white ink on the fourth surface of the second substrate 210. The winding antenna layer 230 is located on the side of the second shading ink layer 240 departing from the second substrate 210, and the winding antenna layer 230 can be shielded by the second shading ink layer 240, so that the winding antenna layer 230 is prevented from being exposed to human eyes.
Optionally, the reverse substrate portion 200 may further include a reverse printing layer 250 and a second protective film layer 260, the reverse printing layer 250 is disposed on the third surface of the second substrate 210, the second protective film layer 260 is disposed on a side of the reverse printing layer 250 facing away from the second substrate 210, and the second protective film layer 260 is provided with a magnetic stripe.
The reverse printing layer 250 is a reverse pattern layer of the smart card, and specifically, an offset printing process may be used to form a reverse pattern of the smart card on the third surface of the second substrate 210. The second protective film layer 260 can protect the reverse side pattern of the smart card from abrasion.
Fig. 9 is a schematic structural diagram of a smart card according to an embodiment of the present invention. In some optional embodiments, as shown in fig. 9, the smart card provided in the embodiments of the present invention may further include a chip 400, a groove may be disposed in the thickness direction of the card base, the chip 400 is embedded in the groove, and the chip 400 is electrically connected to the wound antenna layer 230.
Optionally, a recess extends through the front substrate portion 100 and the chip 400 is exposed on the front side of the smart card.
In addition, the embodiment of the invention also provides a manufacturing method of the smart card, which can be used for manufacturing the smart card.
Fig. 10 is a flowchart of a method for manufacturing a smart card according to an embodiment of the present invention. Referring to fig. 10, a method for manufacturing a smart card according to an embodiment of the present invention may include step S100.
In step S100, the front substrate portion 100 is formed.
As shown in fig. 10, step S100 may include: providing a first substrate 110, the first substrate 110 having a first surface and a second surface in a thickness direction; forming a grating pattern layer 130 on the second surface side of the first substrate 110; forming a pattern effect layer 150, wherein the pattern effect layer 150 is formed on the first surface side of the first substrate 110 and/or the side of the grating pattern layer 130 facing away from the first substrate 110; forming a first light-shielding ink layer 120 on the side of the grating pattern layer 130 facing away from the first substrate 110; and forming a grating-processed layer 140 on the first surface side of the first substrate 110, wherein the step of forming the grating-processed layer 140 is subsequent to the step of forming the pattern effect layer 150.
According to the method for manufacturing the smart card provided by the embodiment of the invention, the pattern effect layer 150 is formed at the preset position, and the grating processing layer 140 is formed on the side of the first surface of the first substrate 110, so that the manufactured smart card has the grating effect and other individual effects, and the requirements of a user on the surface effect of the smart card can be met. In addition, since the pattern effect layer 150 does not need to be applied to the surface of the grating processing layer 140, the problems that the pattern effect layer 150 is not easy to process and fall off are avoided.
Alternatively, the grating pattern layer 130 may be formed by offset printing a pattern on the side of the second surface of the first substrate 110, and the first light shielding ink layer 120 may be formed by screen printing white ink on the side of the grating pattern layer 130 facing away from the first substrate 110.
Alternatively, the grating treatment layer 140 may be formed by directly processing a grating pattern on the outer surface of the front substrate portion 100. The grating pattern of the grating processing layer 140 may be a strip or a ring, which is not limited in the present invention.
It should be noted that there are many types of pattern effect layers 150, which may include one or more of a flat ironing film layer 151, a gold foil layer 152, a silk screen printing effect film layer, and the like, and accordingly, there are many alternatives for the step of forming the pattern effect layer 150.
In some alternative embodiments, the step of forming the pattern effect layer 150 may include: a flat ironing film layer 151 is formed on the first surface side of the first substrate 110.
In some alternative embodiments, the step of forming the pattern effect layer 150 may include: a gold layer 152 is formed on the first surface side of the first substrate 110.
Alternatively, in order to make the fixing of the riser layer 152 more reliable, the riser may be fixed to a predetermined position on the first surface of the first substrate 110 by spot welding, and then the riser and the first substrate 110 may be pressed together by a lamination process.
In some alternative embodiments, the step of forming the pattern effect layer 150 may include: a first silk-screen effect film 153 is formed on the first surface of the first substrate 110.
In some alternative embodiments, the step of forming the pattern effect layer 150 may include: a second silk-screen effect film layer 154 is formed on the side of the grating pattern layer 130 away from the first substrate 110, wherein the step of forming the second silk-screen effect film layer 154 is performed before the step of forming the first light-shielding ink layer 120, so that the second silk-screen effect film layer 154 can be positioned between the grating pattern layer 130 and the first light-shielding ink layer 120.
Fig. 11 is a flowchart of a method for manufacturing a smart card according to another embodiment of the present invention. As shown in fig. 11, in some alternative embodiments, step S100 may include steps S110 to S180.
In step S110, a first substrate 110 is provided.
In step S120, a first silk-screen effect film 153 is formed on the first surface of the first substrate 110.
In step S130, a gold stud layer 152 is formed by attaching a gold stud on a side of the first silk-screen effect film 153 away from the first substrate 110.
In step S140, a flat ironing film layer 151 is formed on a side of the riser layer 152 facing away from the first substrate 110.
In step S150, the grating pattern layer 130 is formed on the second surface side of the first substrate 110.
In step S160, a second silk-screen effect film layer 154 is formed on a side of the grating pattern layer 130 facing away from the first substrate 110.
In step S170, a first light-shielding ink layer 120 is formed on the side of the grating pattern layer 130 facing away from the first substrate 110.
In step S180, the grating processing layer 140 is formed on the first surface side of the first substrate 110.
The front substrate portion 100 of the smart card manufactured by the above method simultaneously includes a flat ironing film layer 151, a gold upright layer 152, a first silk-screen effect film layer 153, and a second silk-screen effect film layer 154.
In some optional embodiments, step S100 may further include: a first protective film layer 160 is formed on the first surface side of the first substrate 110, and the step of forming the rasterization layer 140 is located after the step of forming the first protective film layer 160, so that in the manufactured smart card, the first protective film layer 160 is located between the first substrate 110 and the rasterization layer 140.
Alternatively, the step of forming the pattern effect layer 150 may include forming a gold layer 152 on the side of the first surface of the first substrate 110, the step of forming the gold layer 152 being before the step of forming the first protective film layer 160; therefore, when the first substrate 110 and the first protective film layer 160 of the riser metal layer 152 are laminated into a whole with the first substrate 110 through the lamination process, the first protective film layer 160 can protect the riser metal from being damaged.
Alternatively, the step of forming the pattern effect layer 150 may include forming a flat ironing film layer 151 on the side of the first surface of the first substrate 110, the step of forming the flat ironing film layer 151 being located after the step of forming the first protective film layer 160; the flat ironing film layer 151 is located on the side of the first protective film layer 160 departing from the first substrate 110, so that the display effect of the flat ironing film layer 151 can be ensured.
Fig. 12 is a flowchart of forming a card base of a method of manufacturing a smart card according to an embodiment of the present invention. In some optional embodiments, the method for manufacturing a smart card according to the embodiments of the present invention may further include step S200 and step S300.
In step S100, the front substrate portion 100 is formed.
In step S200, the reverse substrate portion 200 is formed.
In step S300, the front substrate portion 100 and the back substrate portion 200 are stacked in such a manner that the grating processing layer 140 is away from the back substrate portion 200, and the front substrate portion 100 and the back substrate portion 200 are integrally fixed by the adhesive layer 300 to form a card base.
It is understood that the sequence of step S100 and step S200 is not sequential, that is, when manufacturing the smart card, the front substrate portion 100 may be first manufactured and then the back substrate portion, or the back substrate portion may be first manufactured and then the front substrate portion 100 may be manufactured, or the front substrate portion 100 and the back substrate portion may be manufactured simultaneously.
Alternatively, the front substrate portion 100, the adhesive layer 300, and the back substrate portion 200 may be integrally bonded through a lamination process. The adhesive layer 300 may be, for example, a low-temperature adhesive, and the reaction temperature is low during lamination, so that the grating lines of the grating processing layer 140 are not melted during lamination.
In order to prevent the front substrate portion 100 and the back substrate portion 200 from being misaligned during lamination, the front substrate portion 100 and the back substrate portion 200 may be spot-fixed by a spot welding process before lamination.
Fig. 13 is a flow chart of a method of forming a reverse substrate portion 200 for making a smart card according to an embodiment of the present invention. In some alternative embodiments, step S200 may include steps S210 to S250.
In step S210, a second substrate 210 is provided, the second substrate 210 having a third surface and a fourth surface in the thickness direction.
In step S220, a second light-shielding ink layer 240 is formed on the fourth surface side of the second substrate 210.
In step S230, a reverse printing layer 250 is formed on the third surface side of the second substrate 210.
In step S240, a wire wound antenna layer 230 is provided, and the wire wound antenna layer 230 is disposed on a side of the second shading ink layer 240 facing away from the second substrate 210.
In step S250, the compensation layer 220 is formed on the side of the wire wound antenna layer 230 facing away from the second substrate 210.
It should be noted that the compensation layer 220 is used for compensating the thickness of the card substrate. The sequence of steps S220 and S230 is not sequential, and may be replaced.
The reverse printing layer 250 is a reverse pattern layer of the smart card, and specifically, an offset printing process may be used to form a reverse pattern of the smart card on the third surface of the second substrate 210.
In order to fix the wound antenna layer 230 more reliably, the wound antenna layer 230 may be fixed at a predetermined position on the fourth surface of the second substrate 210 by spot welding, and the wound antenna layer 230, the compensation layer 220, and the second substrate 210 may be pressed together by a lamination process.
It should be noted that, in step S300, when the front substrate portion 100 and the back substrate portion 200 are stacked and fixed by the adhesive layer 300, the third surface of the second substrate 210 faces away from the front substrate portion 100, so that the winding antenna layer 230 is located between the first substrate 110 and the second substrate 210.
Optionally, step S200 may further include: a second protective film layer 260 is formed on the side of the reverse printing layer 250 departing from the second substrate 210, the second protective film layer 260 is arranged on the side of the reverse printing layer 250 departing from the second substrate 210, and a magnetic stripe is arranged on the second protective film layer 260. The second protective film layer 260 can protect the reverse side pattern of the smart card from abrasion.
Fig. 14 is a flowchart of a method for manufacturing a smart card according to another embodiment of the present invention. In some optional embodiments, the method for manufacturing a smart card according to the embodiments of the present invention may further include step S400.
In step S100, the front substrate portion 100 is formed.
In step S200, the reverse substrate portion 200 is formed.
In step S300, the front substrate part 100 and the back substrate part 200 are fixed as a single body by the adhesive layer 300 to form a card base.
In step S400, the chip 400 is packaged to a card substrate to form a smart card.
Alternatively, a groove may be formed in the thickness direction of the card substrate, and when the chip 400 is packaged, the chip 400 is embedded in the groove, and the chip 400 is electrically connected to the wire-wound antenna layer 230.
It is understood that, in the whole process of manufacturing the smart card, when the front substrate portion 100 and the back substrate portion 200 are manufactured, the first substrate 110 and the second substrate 210 may be selected to have a size corresponding to that of a single card base, and each card base is manufactured one by one, but this is inefficient. In order to improve the manufacturing efficiency of the smart card, when the front substrate part 100 and the back substrate part 200 are manufactured, the first substrate 110 and the second substrate 210 can be selected from large sheets of substrates, after printing is completed, large sheet inspection is performed, the large sheets of front substrate part 100 and the large sheets of back substrate part 200 are formed, after the large sheets of front substrate part 100 and the large sheets of back substrate part 200 are pressed into a whole, a plurality of single card bases are formed through punching, after detection, the chips 400 are packaged on the card bases in a one-to-one correspondence mode, and the smart card is formed.
In accordance with the above-described embodiments of the present invention, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims (22)

1. A smart card comprising a card base including a front substrate portion and a back substrate portion arranged in a stacked configuration, the front substrate portion comprising:
a first substrate having a first surface facing away from the reverse substrate portion and a second surface facing toward the reverse substrate portion in a thickness direction;
the first shading ink layer is arranged on the side of the second surface of the first substrate;
the grating processing layer is arranged on the side of the first surface of the first substrate;
a grating pattern layer positioned between the first substrate and the first shading ink layer; and
a pattern effect layer disposed in at least one of the following positions: the first substrate and the grating processing layer; and the grating pattern layer is arranged between the grating pattern layer and the first shading ink layer.
2. The smart card of claim 1, wherein the pattern effect layer comprises a flat ironing film layer disposed between the first substrate and the photofinishing layer.
3. The smart card of claim 1 wherein the pattern effect layer comprises a riser layer disposed between the first substrate and the photofinishing layer.
4. The smart card of claim 3 wherein the rasterized layer includes a rasterized portion and a non-processed portion, the non-processed portion overlying the riser layer.
5. The smart card of claim 1, wherein the pattern effect layer comprises a first silk-screen effect film layer disposed between the first substrate and the grating processing layer.
6. The smart card of claim 1, wherein the pattern effect layer comprises a second silk-screen effect film layer disposed between the grating pattern layer and the first black-out ink layer.
7. The smart card of claim 1 wherein the front substrate portion further comprises a first protective film layer disposed between the first substrate and the photofinishing layer.
8. The smart card of claim 7, wherein the pattern effect layer comprises a riser layer disposed between the first substrate and the first protective film layer; and/or
The pattern effect layer comprises a flat ironing film layer, and the flat ironing film layer is arranged between the first protection film layer and the grating processing layer.
9. The smart card of claim 1 wherein the front substrate portion and the back substrate portion are attached by a layer of adhesive.
10. The smart card of any one of claims 1 to 9, wherein the reverse substrate portion comprises:
a second substrate having a third surface and a fourth surface in a thickness direction, the third surface facing away from the front substrate portion;
the winding antenna layer is arranged on the side of the fourth surface of the second substrate;
and the compensation layer is arranged on one side of the winding antenna layer, which is deviated from the second substrate.
11. The smart card of claim 10, wherein the reverse substrate portion further comprises:
the second shading ink layer is arranged on the fourth surface of the second substrate, and the winding antenna layer is positioned on one side, away from the second substrate, of the second shading ink layer;
a reverse side printing layer disposed on the third surface of the second substrate;
and the second protective film layer is arranged on one side of the reverse side printing layer, which is deviated from the second substrate, and the second protective film layer is provided with a magnetic stripe.
12. The smart card of claim 10, further comprising a chip, wherein a groove is disposed in the thickness direction of the card base, the chip is embedded in the groove, and the chip is electrically connected to the wire-wound antenna layer.
13. A method of making a smart card comprising forming a front substrate portion, the forming a front substrate portion comprising:
providing a first substrate having a first surface and a second surface in a thickness direction;
forming a grating pattern layer on the side of the second surface of the first substrate;
forming a pattern effect layer, wherein the pattern effect layer is formed on the first surface side of the first substrate and/or the grating pattern layer side facing away from the first substrate;
forming a first shading ink layer on the side, away from the first substrate, of the grating pattern layer; and
forming a grating processing layer on the first surface side of the first substrate,
wherein the step of forming a grating treatment layer is located after the step of forming a pattern effect layer.
14. The method of claim 13, wherein the patterning a layer comprises:
and forming a flat ironing film layer on the side of the first surface of the first substrate.
15. The method of claim 13, wherein the patterning a layer comprises:
and forming a metal layer on the side of the first surface of the first substrate.
16. The method of claim 13, wherein the patterning a layer comprises:
and forming a first silk-screen effect film layer on the side of the first surface of the first substrate.
17. The method of claim 13, wherein the patterning a layer comprises:
forming a second silk-screen effect film layer on the side of the grating pattern layer, which is far away from the first substrate,
and the step of forming the second silk-screen effect film layer is positioned before the step of forming the first shading ink layer.
18. The method of claim 13, wherein said forming a front substrate portion further comprises:
forming a first protective film layer on the first surface side of the first substrate,
wherein the step of forming a grating treatment layer is located after the step of forming a first protective film layer.
19. The method of claim 18, wherein the forming the patterned effect layer comprises forming a gold layer on the first surface of the first substrate, the forming the gold layer being before the forming the first protective film layer; and/or
The forming of the pattern effect layer comprises forming a flat ironing film layer on the side of the first surface of the first substrate, and the step of forming the flat ironing film layer is located after the step of forming the first protective film layer.
20. The method of manufacturing a smart card according to claim 13, further comprising:
forming a reverse substrate portion;
and the front substrate part and the back substrate part are stacked in a mode that the grating processing layer deviates from the back substrate part, and the front substrate part and the back substrate part are fixed into a whole through an adhesive layer to form a card base.
21. The method of claim 20, wherein said forming a reverse substrate portion comprises:
providing a second substrate having a third surface and a fourth surface in a thickness direction;
forming a second light-shielding ink layer on the fourth surface side of the second substrate;
forming a reverse printing layer on the third surface side of the second substrate;
providing a winding antenna layer, and arranging the winding antenna layer on one side of the second shading ink layer, which is far away from the second substrate;
and forming a compensation layer on the side of the winding antenna layer, which is far away from the second substrate.
22. The method of claim 20, further comprising, after the step of forming the card base:
and packaging a chip to the card substrate to form the smart card.
CN202110191484.2A 2021-02-20 2021-02-20 Smart card and manufacturing method thereof Pending CN112862052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110191484.2A CN112862052A (en) 2021-02-20 2021-02-20 Smart card and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110191484.2A CN112862052A (en) 2021-02-20 2021-02-20 Smart card and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN112862052A true CN112862052A (en) 2021-05-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110191484.2A Pending CN112862052A (en) 2021-02-20 2021-02-20 Smart card and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN112862052A (en)

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