CN112862046A - Passive extensible wireless sensor and manufacturing method thereof - Google Patents

Passive extensible wireless sensor and manufacturing method thereof Download PDF

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Publication number
CN112862046A
CN112862046A CN202110172089.XA CN202110172089A CN112862046A CN 112862046 A CN112862046 A CN 112862046A CN 202110172089 A CN202110172089 A CN 202110172089A CN 112862046 A CN112862046 A CN 112862046A
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CN
China
Prior art keywords
impedance
passive
wireless sensor
antenna
sensing
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Pending
Application number
CN202110172089.XA
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Chinese (zh)
Inventor
林阿霞
李忠明
吕益清
林鸿伟
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Xiamen Innov Information Science & Technology Co ltd
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Xiamen Innov Information Science & Technology Co ltd
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Priority to CN202110172089.XA priority Critical patent/CN112862046A/en
Publication of CN112862046A publication Critical patent/CN112862046A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)

Abstract

The invention provides a passive extensible wireless sensor and a manufacturing method thereof, wherein the passive extensible wireless sensor comprises a plurality of sensing chips, impedance rings and antenna lines; the sensing chips are connected with the impedance ring, and the impedance ring is detachably connected with the antenna circuit; the impedance ring is connected with the antenna circuit, the impedance ring is detachably connected with the antenna circuit, the sensing chip can charge the sensing chip by the signal of the antenna circuit to realize passive work, external charging is not needed, the sensing chip can adapt to a severe working environment, meanwhile, the impedance ring is detachably connected with the antenna circuit, so that the sensing chip can be flexibly combined with different antenna circuits in different scenes, and the application flexibility of the sensor is improved.

Description

Passive extensible wireless sensor and manufacturing method thereof
Technical Field
The invention relates to the field of sensors, in particular to a passive extensible wireless sensor and a manufacturing method thereof.
Background
Most of the existing sensors are active and can work only by external power supply, however, the industrial practical application has more scenes which cannot guarantee power supply, the traditional sensor models are fixed and cannot be expanded, the output also depends on a wired method, the application limitation is large, the wiring is troublesome, the changeable requirements in the practical application cannot be comprehensively met, and particularly, in some scenes with high standard requirements, the existing sensors cannot realize a better monitoring effect.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the passive extensible wireless sensor and the manufacturing method thereof are provided, and the application scene of the sensor is expanded.
In order to solve the technical problems, the invention adopts a technical scheme that:
a passive expandable wireless sensor comprises a plurality of sensing chips, impedance rings and an antenna circuit;
the sensing chips are connected with the impedance ring, and the impedance ring is connected with the antenna circuit;
the sensing chip is detachably connected with the impedance ring or the impedance ring is detachably connected with the antenna circuit.
In order to solve the technical problem, the invention adopts another technical scheme as follows:
a method for manufacturing a passive expandable wireless sensor can manufacture the passive expandable wireless sensor, and comprises the following steps:
etching a preset impedance ring and an input terminal into a roll-shaped or sheet-shaped sensor circuit in a mode of PET/PI/PP composite aluminum foil/copper foil or FR4 PCB composite copper foil;
and fixing the sensing chip at a preset position on the sensor line in a preset fixing mode.
The invention has the beneficial effects that: the sensing chip is connected with the impedance ring, the impedance ring is connected with the antenna line, and the connection between the impedance ring and the antenna line is for dismantling the connection, the sensing chip can realize passive work for self charging through the signal of antenna line, need not the outside and charge, can adapt to harsher operational environment, can dismantle the connection between impedance ring and the antenna line simultaneously and make the sensing chip can make up with different antenna line flexibility under the scene of difference, the flexibility that the sensor was used has been increased, and can integrate a plurality of sensing chips on the antenna line, promote the signal transmission quantity and the transmission efficiency of single antenna.
Drawings
Fig. 1 is a schematic diagram of a parallel scheme of a passive scalable wireless sensor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a series arrangement of a passive scalable wireless sensor according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an optical coupling type input parallel scheme of a passive scalable wireless sensor according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an exemplary embodiment of a switched-input parallel scheme for a passive scalable wireless sensor;
fig. 5 is a schematic diagram of an optical coupling type input series scheme of a passive scalable wireless sensor according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of an exemplary embodiment of a switched input series scheme for a passive scalable wireless sensor;
fig. 7 is a schematic diagram of an optical coupler type access according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a switched access according to an embodiment of the present invention;
fig. 9 is a schematic diagram of an antenna circuit according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a parallel impedance design according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a series impedance design according to an embodiment of the present invention;
description of reference numerals:
1. a sensing chip; 2. an impedance loop; 3. an antenna line.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a passive expandable wireless sensor is characterized by comprising a plurality of sensing chips, impedance loops and antenna lines;
the sensing chips are connected with the impedance ring, and the impedance ring is detachably connected with the antenna circuit.
From the above description, the beneficial effects of the present invention are: the sensing chip is connected with the impedance ring, the impedance ring is connected with the antenna line, and the connection between the impedance ring and the antenna line is for dismantling the connection, the sensing chip can realize passive work for self charging through the signal of antenna line, need not the outside and charge, can adapt to harsher operational environment, can dismantle the connection between impedance ring and the antenna line simultaneously and make the sensing chip can make up with different antenna line flexibility under the scene of difference, the flexibility that the sensor was used has been increased, and can integrate a plurality of sensing chips on the antenna line, promote the signal transmission quantity and the transmission efficiency of single antenna.
Furthermore, the sensor further comprises a plurality of input terminals, one ends of the plurality of input terminals are connected with the plurality of sensor chips in a one-to-one correspondence manner, and the other ends of the plurality of input terminals are external interfaces.
It can be known from the above description that the input port is provided, one end of the input port is connected with the sensor chip, the other end of the input port is provided with the external interface, different induction lines can be connected according to different environments, such as the optical coupler type shown in fig. 7 and the switch type shown in fig. 8, and application scenes of the sensor chip are increased.
Furthermore, there are a plurality of impedance rings, the plurality of impedance rings are connected with the plurality of sensing chips in a one-to-one correspondence, and the plurality of impedance rings are connected to the antenna circuit. And outputting a signal through the antenna line.
As can be seen from the above description, the plurality of impedance rings are connected to the plurality of sensor chips in a one-to-one correspondence, and the chips are connected to the antenna line through the impedance rings, and output/receive signals through the antenna line, so that the plurality of sensor chips can be integrated on one antenna line as needed, thereby improving the utilization efficiency of the antenna line.
Furthermore, the number of the impedance rings is 1, a plurality of chips are connected to one impedance ring, and the impedance ring is detachably connected to the antenna line.
According to the above description, an impedance ring is provided, the plurality of chips are connected to the impedance ring, the impedance ring is detachably connected to the antenna line, and the antenna line and the impedance ring can be combined to achieve the best communication effect according to different application scenarios.
Further, the sensing chip is an RFID chip.
As can be seen from the above description, the RFID chip can provide power for itself to work by receiving wireless signals, and an external power line is not needed, so that the size of the sensor is further reduced, and the restriction of the use environment is reduced.
Further, the impedance loop and the antenna line are etched on a flexible FPC board or an FR4 PCB board.
As can be seen from the above description, if the circuit is etched on the flexible FPC board, the flexible material can be adhered to an irregular surface, and the FR4 PCB board is a rigid material, which can adapt to different usage scenarios.
A method for manufacturing a passive expandable wireless sensor can manufacture the passive expandable wireless sensor, and comprises the following steps:
etching a preset impedance ring and an input terminal into a roll-shaped or sheet-shaped sensor circuit in a mode of PET/PI/PP composite aluminum foil/copper foil or FR4 PCB composite copper foil;
and fixing the sensing chip at a preset position on the sensor line in a preset fixing mode.
According to the description, the passive extensible wireless sensor can be obtained through the method, the sensing chip is connected with the impedance ring, the impedance ring is connected with the antenna line, the impedance ring is detachably connected with the antenna line, the sensing chip can charge for self through signals of the antenna line to realize passive work, external charging is not needed, the passive extensible wireless sensor can adapt to a severe working environment, meanwhile, the impedance ring is detachably connected with the antenna line, so that the sensing chip can be flexibly combined with different antenna lines in different scenes, the application flexibility of the sensor is improved, a plurality of sensing chips can be integrated on the antenna line, and the signal transmission quantity and the transmission efficiency of a single antenna are improved.
Referring to fig. 1, fig. 3, and fig. 7 to fig. 9, a first embodiment of the present invention is:
a passive expandable wireless sensor comprises a plurality of sensing chips 1, a plurality of impedance rings 2, an antenna line 3 and a plurality of input terminals (1 # -n #' in figures 1 and 2); in the embodiment, the sensor chips are connected in parallel;
the sensing chips 1 are connected with the impedance ring 2, and the impedance ring is detachably connected with the antenna circuit 3;
one end of each input terminal is connected with the corresponding sensing chip one by one, and the other end of each input terminal is an external interface;
referring to fig. 7, in an alternative embodiment, the external interface is connected to a photoelectric coupler, and can detect wired high and low voltage input and signal input;
referring to fig. 8, in an alternative embodiment, the external interface is connected to the wired switch to directly detect the operating status of the target device, where the operating status may include on/off;
in an optional implementation mode, an external interface is led to a switch circuit to be detected through methods of conductive glue, solder paste, rivets and the like, if an application scene has a high-voltage problem, the switch circuit can be connected after being isolated through a photoelectric coupler, and after the sensor is normally connected, the unique UID (user identification) ID (identifier) number can be acquired and read one by one or in batches through a handheld RFID reader-writer or a fixed RFID reader-writer;
referring to fig. 1, a plurality of the impedance rings are connected to a plurality of the sensor chips in a one-to-one correspondence, and the plurality of the impedance rings are connected to the antenna line. Outputting a signal through the antenna line;
in an alternative embodiment, the antenna line radiating arm is a metal conductor such as aluminum, copper, printed silver paste, etc.; the antenna circuit may be a special antenna body as shown in fig. 9, or may be a metal conductor casing (for example, the device casing is directly used as the antenna circuit);
the sensing chip is an RFID chip, and the RFID chip converts radio into electric energy to supply power to realize passive work by receiving the radio;
in an alternative embodiment, the sensing chip is a chip with a pointer Detection function, such as the types: sensor chips of EM4423T, EM4425T, G2IL +, G2IM +, KX2005XBL, and the like;
in an optional implementation mode, a certain distance is required to be kept between the sensing chips 1, so that the phenomenon that signals between the sensors are affected with each other to cause the sensors to be out of work or unstable is avoided;
in an alternative embodiment, the distance between the individual sensor chips 1 is at least 5 mm;
the impedance loop and the antenna line are etched on a flexible FPC board or an FR4 PCB board.
Referring to fig. 2, 4 and 7 to 9, a second embodiment of the present invention is:
a passive, scalable wireless sensor that differs from embodiment one in that:
in the embodiment, the sensing chips 1 are connected in series;
the number of the impedance rings 2 is 1, a plurality of chips are connected to one impedance ring, and the impedance ring is detachably connected with the antenna circuit.
Referring to fig. 10 to fig. 11, a third embodiment of the present invention is:
a method for manufacturing a passive expandable wireless sensor, which can be used to manufacture a passive expandable wireless sensor according to the first embodiment or the second embodiment, comprising the steps of:
etching a preset impedance ring and an input terminal into a roll-shaped or sheet-shaped sensor circuit in a mode of PET/PI/PP composite aluminum foil/copper foil or FR4 PCB composite copper foil;
fixing a sensing chip at a preset position on the sensor circuit in a preset fixing mode;
in an optional implementation manner, the fixing manner includes a Flip-chip Flip packaging manner, a COB binding manner, or an SMT chip mounting technique, and the sensing chip is packaged to a preset position on the sensor circuit through a glue/gold wire/aluminum wire or solder paste and other curing materials;
if all the sensing chips are connected in parallel, each sensor is fixed on the corresponding impedance ring;
if all the sensing chips are connected in series, all the sensors are sequentially fixed on an impedance ring, and a certain distance is ensured to be kept between all the sensors;
referring to fig. 11, in an alternative embodiment, the sensing chip is a G2TL + chip, the matching parameter is 915Mhz, and its own impedances Z1, Z2 and Z3 are 23-j224, if two sensing chips are designed to be connected in series on a single impedance ring, the final impedance of the impedance ring should be Z1+ Z2 46-j 448; referring to fig. 10, if it is designed that one sensing chip is disposed on each impedance ring and the sensing chips are connected in parallel, the impedance of the impedance ring may be equal to each other, that is, Z1 ═ Z2 ═ Z3 ═ Z4 ═ Z … … ═ 23-j224, or the impedance of each impedance ring is equal to the sensing chip disposed thereon; if two chips are connected in parallel, the total impedance is Z ═ 23-j2242/(46-j448)；
If each sensing chip corresponds to the impedance ring one by one, the sensing module consisting of the sensing chip and the impedance ring is connected or stuck to the antenna circuit at a certain interval;
if a plurality of sensing chips are arranged on one impedance ring, a sensing module formed by the sensing chips and the impedance ring is erected or stuck on the antenna circuit.
In summary, the present invention provides a passive expandable wireless sensor and a method for manufacturing the same, wherein a sensor chip is connected to an impedance loop, and the impedance loop is detachably connected to an antenna line, so that different antennas can be flexibly configured to adapt to different application scenarios; meanwhile, the number of the sensing chips can be flexibly configured according to actual scenes, and the RFID sensing chips can supply energy to the RFID sensing chips from wireless signals to realize passive work.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.

Claims (7)

1. A passive expandable wireless sensor is characterized by comprising a plurality of sensing chips, impedance rings and antenna lines;
the sensing chips are connected with the impedance ring, and the impedance ring is detachably connected with the antenna circuit.
2. The passive expandable wireless sensor according to claim 1, further comprising a plurality of input terminals, wherein one ends of the plurality of input terminals are connected to the plurality of sensing chips in a one-to-one correspondence, and the other ends of the plurality of input terminals are external interfaces.
3. The passive expandable wireless sensor according to claim 1, wherein there are a plurality of impedance loops, a plurality of the impedance loops are connected to a plurality of the sensing chips in a one-to-one correspondence, and a plurality of the impedance loops are connected to the antenna line, and output signals through the antenna line.
4. The passive expandable wireless sensor of claim 1, wherein the number of impedance loops is 1, and a plurality of chips are connected to one of the impedance loops, and the impedance loop is detachably connected to the antenna line.
5. The passive, expandable wireless sensor of claim 1 wherein the sensing chip is an RFID chip.
6. The passive expandable wireless sensor of claim 1, wherein the impedance loop and the antenna line are etched on a flexible FPC board or FR4 PCB board.
7. A method of manufacturing a passive, expandable wireless sensor, for manufacturing a passive, expandable wireless sensor according to any of claims 1-6, comprising the steps of:
etching a preset impedance ring and an input terminal into a roll-shaped or sheet-shaped sensor circuit in a mode of PET/PI/PP composite aluminum foil/copper foil or FR4 PCB composite copper foil;
and fixing the sensing chip at a preset position on the sensor line in a preset fixing mode.
CN202110172089.XA 2021-02-08 2021-02-08 Passive extensible wireless sensor and manufacturing method thereof Pending CN112862046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110172089.XA CN112862046A (en) 2021-02-08 2021-02-08 Passive extensible wireless sensor and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110172089.XA CN112862046A (en) 2021-02-08 2021-02-08 Passive extensible wireless sensor and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN112862046A true CN112862046A (en) 2021-05-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110172089.XA Pending CN112862046A (en) 2021-02-08 2021-02-08 Passive extensible wireless sensor and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN112862046A (en)

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