CN112859256A - Grating coupler positioning measurement method based on image recognition - Google Patents

Grating coupler positioning measurement method based on image recognition Download PDF

Info

Publication number
CN112859256A
CN112859256A CN202110018302.1A CN202110018302A CN112859256A CN 112859256 A CN112859256 A CN 112859256A CN 202110018302 A CN202110018302 A CN 202110018302A CN 112859256 A CN112859256 A CN 112859256A
Authority
CN
China
Prior art keywords
grating coupler
chip
coupling
image recognition
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110018302.1A
Other languages
Chinese (zh)
Other versions
CN112859256B (en
Inventor
程振洲
胡浩丰
武靖雯
邢正锟
刘铁根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin University
Original Assignee
Tianjin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin University filed Critical Tianjin University
Priority to CN202110018302.1A priority Critical patent/CN112859256B/en
Publication of CN112859256A publication Critical patent/CN112859256A/en
Application granted granted Critical
Publication of CN112859256B publication Critical patent/CN112859256B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227Active alignment methods, e.g. procedures and algorithms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本发明公开一种基于图像识别的光栅耦合器定位测量方法,具体包括以下步骤:(1)在芯片设计图中定位光栅耦合器的位置坐标;(2)将芯片设计图与测量平台上芯片的尺寸进行映射匹配,从而得到芯片中的光栅耦合器在测量平台上的位置坐标;(3)利用程序控制位移台移动,实现耦合光纤与光栅耦合器位置的微米级定位;(4)使用空间扫描方法实现耦合光纤与光栅耦合器位置的百纳米级以下定位,找出最优的耦合位置进行芯片测量。

Figure 202110018302

The invention discloses a method for positioning and measuring a grating coupler based on image recognition, which specifically includes the following steps: (1) locating the position coordinates of the grating coupler in a chip design drawing; (2) comparing the chip design drawing with the position of the chip on the measuring platform The size is mapped and matched, so as to obtain the position coordinates of the grating coupler in the chip on the measuring platform; (3) Use the program to control the movement of the stage to realize the micron-level positioning of the coupled fiber and the grating coupler; (4) Use spatial scanning The method realizes the positioning of the position of the coupling fiber and the grating coupler below 100 nanometers, and finds the optimal coupling position for chip measurement.

Figure 202110018302

Description

Grating coupler positioning measurement method based on image recognition
Technical Field
The invention relates to the field of measurement of automatic coupling of optical fibers and photonic chips, in particular to a measurement method for positioning the position of a grating coupler based on image recognition and controlling the optical fibers to automatically find the optimal coupling position.
Background
The photonic chip not only has the advantages of high communication speed, electromagnetic interference resistance and the like, but also has the potential of realizing the monolithic integration of various devices, thereby having wide application prospect in the fields of Internet of things, artificial intelligence and the like. In recent years, the research and development and testing of photonic chips have attracted the attention of more and more researchers, and the coupling of optical fibers and chips is a very important chip packaging technology in the research and development and testing processes of photonic chips. If the coupling can be realized quickly, accurately and automatically, the labor and the time are undoubtedly saved, and the research and development and the test efficiency of the photonic chip are greatly improved. The couplers commonly used at present are wedge couplers, prism couplers, grating couplers and the like. Compared with other coupling methods, the grating coupler has the advantages of large alignment tolerance, no need of wafer or chip pretreatment, freer coupling position and the like, and therefore, the grating coupler plays a very important role in research, development and application of photonic chips.
A number of patents relating to the coupling of optical fibers and photonic chips have been reported. For example, a waveguide-optical fiber automatic core adjustment method and device based on a multi-target evolution algorithm, which are designed by Shanghai Richter university Chen snow and the like in 2007 (Chinese invention patent: 200710038988.0); an automatic control system for aligning and coupling an optical fiber and an electro-optical modulator, which is designed by Xuhaihua et al, semiconductor institute of Chinese academy of sciences in 2008, performs alignment by controlling the optical fiber to move and scan out a maximum power point (Chinese patent: 200810224107.9); the invention relates to a method for automatically positioning and placing optical fibers, which is invented by the 2016 Beijing aerospace university Lihuicheng et al, and the optical fibers are placed based on an image processing technology (Chinese invention patent: 201610270222.4); an optical fiber-waveguide automatic alignment coupler invented by Song Daizuan of Beijing aerospace university in 2018 based on image processing is used for determining the position of an output point by an image processing method (Chinese invention patent: 201810397010.1). However, for the grating coupler, there is no method that can automatically position the grating coupler, move the optical fiber to the grating coupler, and find the optimal coupling position for device testing.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a grating coupler positioning and measuring method based on image recognition.
The purpose of the invention is realized by the following technical scheme:
a grating coupler positioning measurement method based on image recognition specifically comprises the following steps:
(1) positioning the position coordinates of the grating coupler in the chip design drawing;
(2) mapping and matching the chip design drawing with the size of a chip on a measuring platform to obtain a position coordinate of a grating coupler in the chip on the measuring platform;
(3) the displacement table is controlled to move by a program, so that micron-scale positioning of the positions of the coupling optical fiber and the grating coupler is realized;
(4) and the space scanning method is used for realizing the positioning of the coupling fiber and the grating coupler below the hundred nanometers, and finding out the optimal coupling position for chip measurement.
Further, the positioning of the position coordinates of the grating coupler in step (1) can be performed by extracting the relevant layer of the grating coupler from the GDS file of the chip design drawing, and then positioning the grating coupler by using an image recognition method to find the position coordinates of the grating coupler.
Further, in the step (2), the chip design drawing and the chip on the measuring platform are subjected to size mapping matching, and position information of the GDS file of the chip design drawing and the position information of the plurality of markers on the chip can be respectively obtained by adopting an image recognition method, so that the position coordinates of the grating coupler on the measuring platform are obtained.
Further, the step (3) uses a program to control the movement of the displacement table to control the movement of the coupling optical fiber or to control the movement of the chip on the chip measuring platform.
Further, the spatial scanning method in the step (4) scans all positions in a certain area point by point with the precision of less than hundred nanometers, and can record and compare the coupling efficiency, or the coupling spectral bandwidth, or the coupling reflection power of the grating coupler under each position coordinate; the position with the highest coupling efficiency, or the maximum coupling spectral bandwidth, or the minimum coupling reflected power is obtained correspondingly, namely the optimal coupling position.
The invention also provides an image recognition-based grating coupler which comprises an optical fiber displacement table, a chip displacement table, a camera and a motor, wherein the optical fiber displacement table is arranged on two sides above the chip displacement table, the chip displacement table is used for fixing a chip, the optical fiber displacement table is used for fixing an optical fiber, the optical fiber is coupled with the chip in a near-vertical coupling mode, and the optical fiber displacement table and the chip displacement table are both controlled by the motor; grating couplers are designed on two sides of the waveguide in the chip, and three cross-shaped marks are designed in the chip; the camera is fixed right above the chip and used for collecting images of the chip.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1. the invention has the advantage of wide applicability. The method determines the coupling position according to the GDS file of the chip design diagram, is suitable for the production test of wafer level (wafer level) and the research and development of chip level (die level), and is efficient and flexible.
2. The invention utilizes the image recognition method to quickly position the general position of the grating coupler, and then utilizes the space scanning method to accurately scan out the optimal coupling position, and the coupling process has the advantages of quickness and accuracy.
3. The invention is a low-cost chip positioning measurement method, and the measurement method is based on the improvement of the conventional common photonic chip measurement system, and the change of hardware is small.
4. The invention has the advantage of high automation degree, can realize the coupling of full-automatic chip devices by optimizing the algorithm aiming at the structural characteristics of different waveguide devices, and reduces the manual test cost.
5. The invention is a coupling method combining hardware and algorithm, the coupling efficiency and speed can be improved by upgrading the algorithm, and the system has the advantage of later upgradability.
Drawings
Fig. 1 is a hardware diagram of an embodiment of a grating positioning and automatic coupling measurement method.
FIG. 2 is a hardware diagram of an embodiment of a grating positioning and automatic coupling measurement method.
Fig. 3 is a flow chart of the automatic coupling measurement of the grating positioning and automatic coupling measurement method.
FIG. 4 is a flow chart of grating positioning and automatic coupling measurement method.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 shows an embodiment of the present invention, in which an optical fiber 1 is fixed on an optical fiber displacement stage 3, and is coupled with a chip 5 in a near-vertical coupling manner, the chip 5 is fixed on a chip displacement stage 4, and the optical fiber displacement stage 3 and the chip displacement stage 4 are both controlled by a motor 8. Grating couplers 6 are designed in the chip 5 on both sides of the waveguide, while three cross-shaped markings 7 are designed in the chip. The camera 2 is responsible for capturing images of the chip 5. The physical diagram of the hardware of the specific embodiment is shown in FIG. 2.
The implementation flow of the specific embodiment is shown in fig. 3, after the chip 5 is fixed on the measurement platform, firstly, the chip design drawing is subjected to image processing to obtain the coordinates of the grating coupler 6 on the chip design drawing, then, the camera 2 is matched with the movement of the chip displacement table 4 to acquire the actual image of the chip 5, and the actual image and the chip design drawing are subjected to image processing and are matched with each other to obtain the coordinates of the chip 5 on the measurement platform. And then combining the coordinates of the grating coupler 6 on the chip design drawing with the coordinates of the chip 5 on the measuring platform to obtain the coordinates of the grating coupler 6 on the measuring platform. Next, after moving the optical fiber 1 to the micron-scale position of the grating coupler 6, performing spatial scanning to obtain an optimal coupling position with the precision below the hundred nanometers: the power and wavelength of input light are fixed, the optical fiber 1 is controlled to scan point by point along a certain path, the output power of each point is compared to obtain the position with the highest output power, namely the optimal coupling position, and the optimal coupling position is determined and then the measurement can be carried out.
Fig. 4 shows a specific flow of a grating coupler positioning method. In a first step, the coordinates of the grating coupler 6 on the chip design are determined. Converting an input chip design drawing into a gray level image, scanning the image line by line, finding out a region of each line of gray level change spatial frequency within a set threshold value, recording start and stop x-direction coordinates of the region, comparing results of each line, recording y-direction coordinates corresponding to the lines if regions with grating couplers exist in the same x-coordinate position in each line or every few lines in a certain number of continuous lines, positioning the regions with the grating couplers through the coordinates, screening according to the area size of the regions, wherein the rest regions are regions where the grating couplers 6 are located, and taking midpoint coordinates of the regions, namely coordinates of the grating couplers 6 on the chip design drawing.
Secondly, determining the coordinates of the chip 5 on the measuring platform: three marks 7 for determining positions are designed on the chip 5 in advance, edge processing and contour extraction are carried out on the binary image of the chip design drawing, and then the shape of the extraction guide is screened according to parameters such as preset area, length-width ratio and the like, so that the marks 7 are found out, and the coordinates of the marks 7 on the chip design drawing are obtained. Then, the chip displacement table 4 is moved, the camera 2 is matched to shoot the chip 5 on the measuring platform comprehensively, a series of pictures obtained by shooting are subjected to the same image processing, a picture with a mark 7 is found, and the coordinate of the mark 7 relative to the measuring platform is determined through the displacement of the chip displacement table 4 relative to the initial position and the position of the mark 7 on the picture when the picture is shot. After the coordinates of the three marks 7 relative to the measuring platform are obtained respectively, the coordinates are matched with the coordinates of the marks 7 relative to the chip design drawing, and accordingly the coordinates of the chip 5 on the measuring platform are obtained.
And thirdly, calculating and finding the coordinates of the grating coupler 6 on the measuring platform. And combining and comparing the coordinates of the grating coupler 6 on the chip design drawing obtained in the first two steps with the coordinates of the chip 5 on the measuring platform, and calculating the coordinates of the grating coupler 6 on the measuring platform, thereby finishing the positioning process of the grating coupler 6.
The present invention is not limited to the above-described embodiments. The foregoing description of the specific embodiments is intended to describe and illustrate the technical solutions of the present invention, and the above specific embodiments are merely illustrative and not restrictive. Those skilled in the art can make many changes and modifications to the invention without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (5)

1.一种基于图像识别的光栅耦合器定位测量方法,其特征在于,具体包括以下步骤:1. a grating coupler positioning measurement method based on image recognition, is characterized in that, specifically comprises the following steps: (1)在芯片设计图中定位光栅耦合器的位置坐标;(1) Position the position coordinates of the grating coupler in the chip design drawing; (2)将芯片设计图与测量平台上芯片的尺寸进行映射匹配,从而得到芯片中的光栅耦合器在测量平台上的位置坐标;(2) Mapping and matching the chip design drawing and the size of the chip on the measuring platform to obtain the position coordinates of the grating coupler in the chip on the measuring platform; (3)利用程序控制位移台移动,实现耦合光纤与光栅耦合器位置的微米级定位;(3) Using the program to control the movement of the displacement stage to realize the micron-level positioning of the position of the coupled optical fiber and the grating coupler; (4)使用空间扫描方法实现耦合光纤与光栅耦合器位置的百纳米级以下定位,找出最优的耦合位置进行芯片测量。(4) Use the spatial scanning method to realize the positioning of the position of the coupling fiber and the grating coupler below 100 nanometers, and find the optimal coupling position for chip measurement. 2.根据权利要求1所述的一种基于图像识别的光栅耦合器定位测量方法,其特征在于,步骤(1)中所述的定位光栅耦合器的位置坐标能够采用在芯片设计图GDS文件中提取光栅耦合器的相关层,然后采用图像识别的方法定位光栅耦合器,找到光栅耦合器的位置坐标。2. a kind of grating coupler positioning measurement method based on image recognition according to claim 1, is characterized in that, the positional coordinates of positioning grating coupler described in step (1) can be adopted in chip design drawing GDS file Extract the relevant layers of the grating coupler, and then use the method of image recognition to locate the grating coupler to find the position coordinates of the grating coupler. 3.根据权利要求1所述的一种基于图像识别的光栅耦合器定位测量方法,其特征在于,步骤(2)中将芯片设计图与测量平台上芯片的进行尺寸映射匹配能够采用图像识别的方法分别获得芯片设计图GDS文件和芯片上若干个标志物的位置信息,从而得到光栅耦合器在测量平台上的位置坐标。3. a kind of grating coupler positioning measurement method based on image recognition according to claim 1, is characterized in that, in step (2), the size mapping matching of chip design drawing and chip on the measuring platform can adopt image recognition method. Methods The GDS file of the chip design drawing and the position information of several markers on the chip were obtained respectively, so as to obtain the position coordinates of the grating coupler on the measuring platform. 4.根据权利要求1所述的一种基于图像识别的光栅耦合器定位测量方法,其特征在于,步骤(3)中利用程序控制位移台移动是控制耦合光纤的移动或者是控制芯片测量平台上芯片的移动。4. a kind of grating coupler positioning measurement method based on image recognition according to claim 1, is characterized in that, utilizes the program-controlled displacement stage to move in step (3) to control the movement of coupling optical fiber or on the control chip measurement platform chip movement. 5.根据权利要求1所述的一种基于图像识别的光栅耦合器定位测量方法,其特征在于,步骤(4)中空间扫描的方法是以百纳米以下的精度逐点扫描某一区域内的所有位置,并能够记录并比较每个位置坐标下的光栅耦合器的耦合效率,或耦合光谱带宽,或耦合反射功率;对应得到具有最高耦合效率,或最大耦合光谱带宽,或最小耦合反射功率的位置,即最优耦合位置。5. a kind of grating coupler positioning measurement method based on image recognition according to claim 1, is characterized in that, in step (4), the method of spatial scanning is to scan in a certain area point by point with the precision below 100 nanometers. All positions, and can record and compare the coupling efficiency, or coupling spectral bandwidth, or coupling reflected power of the grating coupler at each position coordinate; correspondingly obtain the one with the highest coupling efficiency, or the largest coupling spectral bandwidth, or the smallest coupling reflected power position, that is, the optimal coupling position.
CN202110018302.1A 2021-01-07 2021-01-07 A Grating Coupler Positioning Measurement Method Based on Image Recognition Active CN112859256B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110018302.1A CN112859256B (en) 2021-01-07 2021-01-07 A Grating Coupler Positioning Measurement Method Based on Image Recognition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110018302.1A CN112859256B (en) 2021-01-07 2021-01-07 A Grating Coupler Positioning Measurement Method Based on Image Recognition

Publications (2)

Publication Number Publication Date
CN112859256A true CN112859256A (en) 2021-05-28
CN112859256B CN112859256B (en) 2022-07-08

Family

ID=76004776

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110018302.1A Active CN112859256B (en) 2021-01-07 2021-01-07 A Grating Coupler Positioning Measurement Method Based on Image Recognition

Country Status (1)

Country Link
CN (1) CN112859256B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113237640A (en) * 2021-07-12 2021-08-10 南京光智元科技有限公司 Optical coupling test method and device, electronic equipment and storage medium
CN115423814A (en) * 2022-11-07 2022-12-02 江西兆驰半导体有限公司 Chip origin positioning method and device, readable storage medium and electronic equipment
CN116753837A (en) * 2023-06-25 2023-09-15 天津大学 Chip space mapping positioning method for waveguide device test
WO2024001781A1 (en) * 2022-06-29 2024-01-04 湖南超亟检测技术有限责任公司 Linearly arranged grating-based scanning and identification method and scanning and identification system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106932866A (en) * 2017-03-28 2017-07-07 中国电子科技集团公司第三十八研究所 The autofocus and method of a kind of silicon based photon device
US20180062748A1 (en) * 2016-09-01 2018-03-01 Luxtera, Inc. Method And System For Optical Alignment To A Silicon Photonically-Enabled Integrated Circuit
CN108646353A (en) * 2018-04-28 2018-10-12 北京航空航天大学 A kind of fiber-to-waveguide based on image procossing is automatically aligned to coupling instrument
CN109254277A (en) * 2017-07-12 2019-01-22 通用汽车环球科技运作有限责任公司 Chip-scale LIDAR with single 2D MEMS scanner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180062748A1 (en) * 2016-09-01 2018-03-01 Luxtera, Inc. Method And System For Optical Alignment To A Silicon Photonically-Enabled Integrated Circuit
CN106932866A (en) * 2017-03-28 2017-07-07 中国电子科技集团公司第三十八研究所 The autofocus and method of a kind of silicon based photon device
CN109254277A (en) * 2017-07-12 2019-01-22 通用汽车环球科技运作有限责任公司 Chip-scale LIDAR with single 2D MEMS scanner
CN108646353A (en) * 2018-04-28 2018-10-12 北京航空航天大学 A kind of fiber-to-waveguide based on image procossing is automatically aligned to coupling instrument

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113237640A (en) * 2021-07-12 2021-08-10 南京光智元科技有限公司 Optical coupling test method and device, electronic equipment and storage medium
CN113237640B (en) * 2021-07-12 2022-03-01 南京光智元科技有限公司 Optical coupling test method and device, electronic equipment and storage medium
WO2024001781A1 (en) * 2022-06-29 2024-01-04 湖南超亟检测技术有限责任公司 Linearly arranged grating-based scanning and identification method and scanning and identification system
CN115423814A (en) * 2022-11-07 2022-12-02 江西兆驰半导体有限公司 Chip origin positioning method and device, readable storage medium and electronic equipment
CN116753837A (en) * 2023-06-25 2023-09-15 天津大学 Chip space mapping positioning method for waveguide device test

Also Published As

Publication number Publication date
CN112859256B (en) 2022-07-08

Similar Documents

Publication Publication Date Title
CN112859256A (en) Grating coupler positioning measurement method based on image recognition
CN102636120B (en) Visual servo secondary locating system for LED (light emitting diode) chip and locating method of visual servo secondary locating system
CN103674839B (en) A kind of visual Sample location operating system based on spot detection and method
CN106019550B (en) Dynamic focusing device and focusing tracking for the micro- scanning of high speed
US9752992B2 (en) Variable image field curvature for object inspection
CN112432607A (en) Automatic zooming three-dimensional shape measurement system and method
CN108646353B (en) A Fiber-Waveguide Automatic Alignment Coupler Based on Image Processing
CN108333145B (en) A new detection device and positioning method for ICF target pellets
CN104181685A (en) Automatic digital slide focusing device and method based on microscope
CN114743259A (en) Pose estimation method, pose estimation system, terminal, storage medium and application
JP7037262B2 (en) How to speed up modeling of digital slide scanners
CN104049338A (en) Digital microscope apparatus, method of searching for in-focus position thereof, and program
TW202223471A (en) Deep learning model for auto-focusing microscope systems
CN106767497B (en) An Adaptive Planning Method for Spatial Scanning Range of White Light Interferometric Profiler
CN107092905A (en) A kind of instrument localization method to be identified of electric inspection process robot
CN116818762A (en) Optical detection device and method
US11356593B2 (en) Methods and systems for single frame autofocusing based on color- multiplexed illumination
CN116973380A (en) Wafer detection system, detection method, electronic device and storage medium
CN205920270U (en) A dynamic focusing mechanism for high -speed microscan
CN112752014B (en) Urine detection method, urine detection device, and computer-readable storage medium
CN208623750U (en) Intelligent industrial camera
CN119472188A (en) Exposure device and exposure method
CN114119556B (en) An automatic detection method for the quality of laser repair of surface defects of fused quartz components
CN112164661B (en) Wafer inspection equipment
CN118447010A (en) Image processing method, device, equipment and storage medium based on liquid microscope lens

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant