CN112848603A - Pressure-sensitive backing plate and preparation method thereof - Google Patents
Pressure-sensitive backing plate and preparation method thereof Download PDFInfo
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- CN112848603A CN112848603A CN202110020409.XA CN202110020409A CN112848603A CN 112848603 A CN112848603 A CN 112848603A CN 202110020409 A CN202110020409 A CN 202110020409A CN 112848603 A CN112848603 A CN 112848603A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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Abstract
The invention belongs to the technical field of material preparation, and discloses a pressure-sensitive backing plate and a preparation method thereof. The preparation method of the pressure-sensitive backing plate comprises the following steps: and adding an adhesive between the two phenolic resin plates, hot-pressing, and adding a layer of silica gel with the thickness of 0.5-1 mm. According to the invention, the thickness of the pressure-sensitive backing plate is controlled by limiting the phenolic resin plate, the phenolic resin plates are combined by coating the adhesive between the two phenolic resin plates, the connection of the phenolic resin plates is tighter, and the prepared pressure-sensitive backing plate is not easy to crack; the setting on silica gel layer can realize reducing the destruction to its collision production to the protection of pressure sensitive backing plate self, and increase of service life can conveniently detect simultaneously. The pressure-sensitive backing plate has the advantages of simple structure and convenience in preparation, and the prepared pressure-sensitive backing plate has better performance.
Description
Technical Field
The invention belongs to the technical field of material preparation, and particularly relates to a pressure-sensitive backing plate and a preparation method thereof.
Background
At present: the pressure-sensitive backing plate belongs to a single-chip pressure-sensitive adhesive gasket, and has the advantages of no toxicity, no smell, strong sealing property and good chemical property. Pressure sensitive mats are used in applications to sense the presence of a person being monitored on a surface. Pressure switch mats known in the art are not very reliable. The basic pressure sensitive pad is designed to have a specific force sensitivity, and the value thereof must be carefully selected. If the pressure sensitive pad is too sensitive, the detection of the pressure sensitive pad is triggered by the pressure sensitive pad; if the pressure sensitive pad detection value is too loose, it may not be able to detect the presence of a light weight person. The accuracy of the pressure sensitive pad is particularly important since the weight of a person is distributed over different areas. However, the accuracy of the current pressure-sensitive backing plate is poor, and accurate determination of relative weight cannot be realized.
Through the above analysis, the problems and defects of the prior art are as follows: the accuracy degree of the existing pressure-sensitive backing plate is poor, and the accurate measurement of the relative weight cannot be realized.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a pressure-sensitive backing plate and a preparation method thereof.
The invention is realized in such a way that a method for preparing a pressure-sensitive backing plate comprises the following steps:
weighing 19-25 parts of phenolic compound, 7-10 parts of aldehyde compound, 3-4 parts of cross-linking agent, 4-6 parts of modifier and 1-2 parts of catalyst according to parts by weight; mixing phenolic resin raw materials, dissolving a phenolic compound to obtain a phenolic compound solution, placing the phenolic compound solution in a three-necked bottle, heating the three-necked bottle in a water bath, and adding a catalyst and a cross-linking agent in the heating process; dividing the aldehyde compound into three equal parts, and adding the three parts of the aldehyde compound into the mixed solution of the phenol compound for three times after the water bath is finished; keeping the temperature of the three-mouth bottle to be not lower than 55 ℃; simultaneously adding a modifier into the three-mouth bottle;
step two, extending a stirring rod into a three-mouth bottle to stir the phenolic mixture-aldehyde compound, and magnetically stirring for 10-15 minutes to obtain a uniform dispersion; sealing the three-mouth bottle, introducing nitrogen into the three-mouth bottle, slowly heating to 90 ℃ at the speed of 3 ℃/min, and carrying out heat preservation for 30-50 min; then slowly cooling to 65 ℃, and opening a sealing cover of the three-mouth bottle; adjusting the pH value of the solution in the three-mouth bottle to 7-8 to obtain a phenolic resin premix; carrying out vacuum preliminary dehydration on the obtained phenolic resin premix to obtain a phenolic resin dehydrated premix;
step three, introducing the dehydrated premix into a liquid hot-pressing tank for heating; after the dehydrated premix is introduced into a liquid hot-pressing tank and heated, an atomizing nozzle is connected; introducing strong wind into the liquid autoclave through the vent pipe and enabling the atomizing nozzle to spray atomized urotropine with the mass concentration of 8% into the vent pipe to finish dehydration; obtaining modified phenolic resin; taking out the phenolic resin after the modification is finished, and cutting off the redundant phenolic resin and other adherends; cleaning phenolic resin by using clear water, and simultaneously washing a workbench for cutting off the phenolic resin;
placing 20-mesh coarse diamond sand mud on an hourglass of a grinding machine, pouring a small amount of clear water on the hourglass, and turning on the grinding machine to grind the surface of the phenolic resin when sand water flows onto a grinding disc; polishing the edges of the phenolic resin; meanwhile, modifying the burr position and the bubble position of the phenolic resin by adopting a fine modification pen; obtaining the polished phenolic resin plate; weighing 6-8 parts of styrene-isoprene-styrene block copolymer, 4-5 parts of acrylic acid, 1-2 parts of rubber, 2-3 parts of tackifying resin and 1-3 parts of mercaptan according to the mass parts, mixing the raw materials of the adhesive, and preparing the adhesive;
step five, obtaining two polished phenolic resin plates obtained in the step four, adding an adhesive between the two phenolic resin plates, and preheating and pressurizing a hot-pressing laminating machine; placing thermoplastic polyimide between two pieces of phenolic resin, placing the phenolic resin and the thermoplastic polyimide on a hot-pressing laminating machine for preheating and prepressing, closing the hot-pressing laminating machine at the speed of 0.5-0.6mm/s, then controlling the hot-pressing laminating machine to carry out hot pressing on the phenolic resin and the thermoplastic polyimide at 90 ℃, wherein the positive pressure is 1.5-1.8MPa, and the lateral pressure is 0.8-1MPa, and carrying out heat preservation and pressure maintaining for 15 minutes;
step six, carrying out secondary staged hot pressing on the phenolic resin and the thermoplastic polyimide after the primary hot pressing; after the hot pressing is finished, primarily releasing the pressure of the hot pressing laminating machine to 0.3-0.5MPa, and simultaneously, the steam discharging time is not more than 6 times of the primary pressure boosting stabilizing time; meanwhile, the pressure is increased to 1.20-1.30MPa for the second time, the duration time is not longer than the primary pressure-increasing stabilization time, and secondary pressure relief is carried out after stabilization; when the pressure is released to 0MPa for the second time, taking out the phenolic resin and the thermoplastic polyimide, and naturally cooling to obtain a semi-finished product of the pressure-sensitive backing plate; and laying silica gel with the thickness of 0.5-1mm on the upper surface and the lower surface of the obtained semi-finished product of the pressure-sensitive pad plate, so that the silica gel is fully combined with the semi-finished product of the pressure-sensitive pad plate to obtain the pressure-sensitive pad plate.
Further, in the first step, the thickness of the phenolic resin plate is 0.3 mm.
Further, in the first step, a catalyst and a crosslinking agent are added in the heating process, and the method comprises the following steps: adding catalyst, keeping temperature for 10-15 min, and adding cross-linking agent.
Further, in the first step, the water bath heating comprises: heating in 55-58 deg.C water bath for 10-20 min.
Further, in the second step, the slowly cooling to 65 ℃ comprises: slowly cooling to 65 ℃ at the speed of 5 ℃/min.
Further, in the second step, the adjusting of the pH value of the solution in the three-necked bottle to 7-8 comprises: acetic acid was added to the three-necked flask to adjust the pH.
Further, in the sixth step, the performing of the secondary staged hot pressing on the phenolic resin and the thermoplastic polyimide after the primary hot pressing includes: hot pressing at 125 deg.C for 10 min, at 175 deg.C for 30 min, and at 85 deg.C for 15 min.
Further, in the sixth step, the type of the silica gel is silica gel G.
Another object of the present invention is to provide a pressure-sensitive adhesive sheet prepared by the method for preparing a pressure-sensitive adhesive sheet.
Further, the pressure-sensitive backing plate is composed of a phenolic resin plate, an adhesive, thermoplastic polyimide and silica gel.
By combining all the technical schemes, the invention has the advantages and positive effects that: according to the invention, the thickness of the pressure-sensitive backing plate is controlled by limiting the phenolic resin plate, the phenolic resin plates are combined by coating the adhesive between the two phenolic resin plates, the connection of the phenolic resin plates is tighter, and the prepared pressure-sensitive backing plate is not easy to crack; the setting on silica gel layer can realize reducing the destruction to its collision production to the protection of pressure sensitive backing plate self, and increase of service life can conveniently detect simultaneously. The pressure-sensitive backing plate has the advantages of simple structure and convenience in preparation, and the prepared pressure-sensitive backing plate has better performance.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained from the drawings without creative efforts.
FIG. 1 is a method flow diagram of a method of making a pressure sensitive mat according to an embodiment of the present invention.
FIG. 2 is a flow chart of a method for making a phenolic resin board according to an embodiment of the present invention.
FIG. 3 is a flow chart of a method for modifying phenolic resin according to an embodiment of the present invention.
FIG. 4 is a flow chart of a method of dewatering provided by an embodiment of the present invention.
Fig. 5 is a flow chart of a method for hot-pressing a thermoplastic polyimide and a phenolic resin plate by a hot-press laminator according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In view of the problems of the prior art, the present invention provides a pressure-sensitive backing plate and a method for manufacturing the same, which will be described in detail with reference to the accompanying drawings.
The pressure-sensitive backing plate provided by the embodiment of the invention consists of a phenolic resin plate, an adhesive, thermoplastic polyimide and silica gel.
As shown in fig. 1, the method for preparing a pressure-sensitive backing plate according to an embodiment of the present invention includes the following steps:
s101, weighing 19-25 parts of phenolic compound, 7-10 parts of aldehyde compound, 3-4 parts of cross-linking agent, 4-6 parts of modifier and 1-2 parts of catalyst according to the mass parts, mixing phenolic resin raw materials, and preparing a phenolic resin plate;
s102, weighing 6-8 parts of styrene-isoprene-styrene block copolymer, 4-5 parts of acrylic acid, 1-2 parts of rubber, 2-3 parts of tackifying resin and 1-3 parts of mercaptan according to parts by mass, mixing the raw materials of the adhesive, and preparing the adhesive;
s103, preparing two phenolic resin plates, adding an adhesive between the phenolic resin plates, and carrying out hot pressing on the thermoplastic polyimide and the phenolic resin plates by using a hot pressing laminating machine to obtain a semi-finished product of the pressure-sensitive pad plate;
and S104, paving silica gel with the thickness of 0.5-1mm on the upper surface and the lower surface of the semi-finished product of the pressure-sensitive backing plate, and fully combining the silica gel with the semi-finished product of the pressure-sensitive backing plate to obtain the pressure-sensitive backing plate.
In step S101, the thickness of the phenolic resin plate provided in the embodiment of the present invention is 0.3 mm.
As shown in fig. 2, in step S101, the preparation of the phenolic resin board according to the embodiment of the present invention includes:
s201, dissolving a phenolic compound to obtain a phenolic compound solution, placing the phenolic compound solution in a three-necked bottle, heating in a water bath at 55-58 ℃ for 10-20 minutes, and adding a catalyst and a cross-linking agent in the heating process;
s202, dividing the aldehyde compound into three equal parts, and adding the three parts of the aldehyde compound into the mixed solution of the phenol compound for three times after the water bath is finished;
s203, preserving the heat of the three-mouth bottle, and keeping the temperature in the bottle to be not lower than 55 ℃;
s204, adding a modifier into the three-necked bottle, stirring, heating, and modifying to obtain phenolic resin;
and S205, taking out the phenolic resin after the modification is finished, and cutting and modifying to obtain the phenolic resin plate.
In step S201, adding a catalyst and a crosslinking agent in the heating process provided by the embodiment of the present invention includes: adding catalyst, keeping temperature for 10-15 min, and adding cross-linking agent.
As shown in fig. 3, in step S204, the phenolic resin obtained by modification provided by the embodiment of the present invention includes:
s301, extending a stirring rod into a three-mouth bottle to stir the phenolic mixture-aldehyde compound, and magnetically stirring for 10-15 minutes to obtain a uniform dispersion;
s302, sealing the three-mouth bottle, introducing nitrogen into the three-mouth bottle, slowly heating to 90 ℃ at the speed of 3 ℃/min, and carrying out heat preservation for 30-50 min;
s303, slowly cooling to 65 ℃ at the speed of 5 ℃/min, and then opening a sealing cover of the three-mouth bottle;
s304, adjusting the pH value of the solution in the three-mouth bottle to 7-8 to obtain a phenolic resin premix, and dehydrating to obtain the phenolic resin.
In step S304, the adjusting of the pH value of the solution in the three-necked bottle to 7 to 8 according to the embodiment of the present invention includes: acetic acid was added to the three-necked flask to adjust the pH.
As shown in fig. 4, in step S304, the dehydration provided by the embodiment of the present invention includes:
s401, after the phenolic resin premix is subjected to vacuum preliminary dehydration to obtain a dehydrated premix, introducing the dehydrated premix into a liquid hot-pressing tank for heating;
s402, after the dehydrated premix is introduced into a liquid hot-pressing tank and heated, an atomizing nozzle is connected;
and S403, introducing strong wind into the liquid autoclave through the vent pipe, and spraying atomized urotropine with the mass concentration of 8% into the vent pipe by the atomizing nozzle to finish dehydration.
As shown in fig. 5, in step S103, the hot pressing of the thermoplastic polyimide and the phenolic resin plate by the hot press laminator according to the embodiment of the present invention includes:
s501, preheating and pressurizing a hot-pressing laminating machine; placing thermoplastic polyimide between two pieces of phenolic resin, and placing the phenolic resin and the thermoplastic polyimide on a hot-pressing laminating machine for preheating and prepressing;
s502, closing the hot-pressing laminating machine at the speed of 0.5-0.6mm/S, then controlling the hot-pressing laminating machine to carry out hot pressing on the phenolic resin and the thermoplastic polyimide at 90 ℃ under the conditions that the positive pressure is 1.5-1.8MPa and the lateral pressure is 0.8-1MPa, and carrying out heat preservation and pressure maintaining for 15 minutes;
s503, carrying out secondary staged hot pressing on the phenolic resin and the thermoplastic polyimide after the primary hot pressing; after the hot pressing is finished, primarily releasing the pressure of the hot pressing laminating machine to 0.3-0.5MPa, and simultaneously, the steam discharging time is not more than 6 times of the primary pressure boosting stabilizing time;
s504, boosting the pressure for the second time to 1.20-1.30MPa, wherein the duration time is not longer than the primary boosting stabilization time, and performing secondary pressure relief after stabilization; and when the pressure is released to 0MPa for the second time, taking out the phenolic resin and the thermoplastic polyimide, and naturally cooling to obtain a semi-finished product of the pressure-sensitive backing plate.
In step S503, the secondary staged hot pressing of the phenolic resin and the thermoplastic polyimide after the primary hot pressing provided by the embodiment of the present invention includes: hot pressing at 125 deg.C for 10 min, at 175 deg.C for 30 min, and at 85 deg.C for 15 min.
In step S104, the type of the silica gel provided in the embodiment of the present invention is silica gel G.
The thermoplastic polyimide TPI provided by the invention is developed on the basis of the traditional thermosetting Polyimide (PI),polyimide, polyimide resin composition and polyimide resin composition(PI) refers to a heterocyclic polymer containing imine groups in a macromolecular main chain, and is one of organic macromolecular materials with the best comprehensive performance. It has the characteristics of corrosion resistance, fatigue resistance, damage resistance, impact resistance, small density, low noise, long service life and the like, and excellent high and low temperature performance (no deformation at 269-280 ℃ for a long time); the thermal decomposition temperature can reach 600 ℃ at most, and is one of the varieties with highest thermal stability of polymers so far. The composite material is widely applied to a plurality of high and new technical fields of aerospace, aviation, space, automobiles, microelectronics, nano-grade, liquid crystal, separation membranes, lasers, electrical appliances, medical instruments, food processing and the like, and is called as 'problem-solving ability' and 'gold plastic'. However, the difficulty of forming and the high manufacturing cost have been two key factors that restrict the rapid development of the product. In order to overcome the defects that the thermosetting PI is insoluble, infusible and difficult to process and form and keep good performance, the invention uses Thermoplastic Polyimide (TPI) instead, thereby bringing good application effect.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The above description is only for the purpose of illustrating the present invention and the appended claims are not to be construed as limiting the scope of the invention, which is intended to cover all modifications, equivalents and improvements that are within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method for preparing a pressure-sensitive backing plate is characterized by comprising the following steps:
weighing 19-25 parts of phenolic compound, 7-10 parts of aldehyde compound, 3-4 parts of cross-linking agent, 4-6 parts of modifier and 1-2 parts of catalyst according to parts by weight; mixing phenolic resin raw materials, dissolving a phenolic compound to obtain a phenolic compound solution, placing the phenolic compound solution in a three-necked bottle, heating the three-necked bottle in a water bath, and adding a catalyst and a cross-linking agent in the heating process; dividing the aldehyde compound into three equal parts, and adding the three parts of the aldehyde compound into the mixed solution of the phenol compound for three times after the water bath is finished; keeping the temperature of the three-mouth bottle to be not lower than 55 ℃; simultaneously adding a modifier into the three-mouth bottle;
step two, extending a stirring rod into a three-mouth bottle to stir the phenolic mixture-aldehyde compound, and magnetically stirring for 10-15 minutes to obtain a uniform dispersion; sealing the three-mouth bottle, introducing nitrogen into the three-mouth bottle, slowly heating to 90 ℃ at the speed of 3 ℃/min, and carrying out heat preservation for 30-50 min; then slowly cooling to 65 ℃, and opening a sealing cover of the three-mouth bottle; adjusting the pH value of the solution in the three-mouth bottle to 7-8 to obtain a phenolic resin premix; carrying out vacuum preliminary dehydration on the obtained phenolic resin premix to obtain a phenolic resin dehydrated premix;
step three, introducing the dehydrated premix into a liquid hot-pressing tank for heating; after the dehydrated premix is introduced into a liquid hot-pressing tank and heated, an atomizing nozzle is connected; introducing strong wind into the liquid autoclave through the vent pipe and enabling the atomizing nozzle to spray atomized urotropine with the mass concentration of 8% into the vent pipe to finish dehydration; obtaining modified phenolic resin; taking out the phenolic resin after the modification is finished, and cutting off the redundant phenolic resin and other adherends; cleaning phenolic resin by using clear water, and simultaneously washing a workbench for cutting off the phenolic resin;
placing 20-mesh coarse diamond sand mud on an hourglass of a grinding machine, pouring a small amount of clear water on the hourglass, and turning on the grinding machine to grind the surface of the phenolic resin when sand water flows onto a grinding disc; polishing the edges of the phenolic resin; meanwhile, modifying the burr position and the bubble position of the phenolic resin by adopting a fine modification pen; obtaining the polished phenolic resin plate; weighing 6-8 parts of styrene-isoprene-styrene block copolymer, 4-5 parts of acrylic acid, 1-2 parts of rubber, 2-3 parts of tackifying resin and 1-3 parts of mercaptan according to the mass parts, mixing the raw materials of the adhesive, and preparing the adhesive;
step five, obtaining two polished phenolic resin plates obtained in the step four, adding an adhesive between the two phenolic resin plates, and preheating and pressurizing a hot-pressing laminating machine; placing thermoplastic polyimide between two pieces of phenolic resin, placing the phenolic resin and the thermoplastic polyimide on a hot-pressing laminating machine for preheating and prepressing, closing the hot-pressing laminating machine at the speed of 0.5-0.6mm/s, then controlling the hot-pressing laminating machine to carry out hot pressing on the phenolic resin and the thermoplastic polyimide at 90 ℃, wherein the positive pressure is 1.5-1.8MPa, and the lateral pressure is 0.8-1MPa, and carrying out heat preservation and pressure maintaining for 15 minutes;
step six, carrying out secondary staged hot pressing on the phenolic resin and the thermoplastic polyimide after the primary hot pressing; after the hot pressing is finished, primarily releasing the pressure of the hot pressing laminating machine to 0.3-0.5MPa, and simultaneously, the steam discharging time is not more than 6 times of the primary pressure boosting stabilizing time; meanwhile, the pressure is increased to 1.20-1.30MPa for the second time, the duration time is not longer than the primary pressure-increasing stabilization time, and secondary pressure relief is carried out after stabilization; when the pressure is released to 0MPa for the second time, taking out the phenolic resin and the thermoplastic polyimide, and naturally cooling to obtain a semi-finished product of the pressure-sensitive backing plate; and laying silica gel with the thickness of 0.5-1mm on the upper surface and the lower surface of the obtained semi-finished product of the pressure-sensitive pad plate, so that the silica gel is fully combined with the semi-finished product of the pressure-sensitive pad plate to obtain the pressure-sensitive pad plate.
2. The method of producing a pressure-sensitive adhesive sheet according to claim 1, wherein in the first step, the thickness of the phenolic resin plate is 0.3 mm.
3. The method of making a pressure sensitive backing sheet according to claim 1 wherein in step one, a catalyst and a crosslinking agent are added during said heating, comprising: adding catalyst, keeping temperature for 10-15 min, and adding cross-linking agent.
4. The method of making a pressure sensitive backing sheet according to claim 1 wherein in step one, said water bath heating comprises: heating in 55-58 deg.C water bath for 10-20 min.
5. The method of making a pressure sensitive backing sheet of claim 1 wherein in step two, said slowly cooling to 65 ℃ comprises: slowly cooling to 65 ℃ at the speed of 5 ℃/min.
6. The method for preparing a pressure sensitive adhesive sheet according to claim 1, wherein the step two, the adjusting the pH of the solution in the three-necked flask to 7 to 8, comprises: acetic acid was added to the three-necked flask to adjust the pH.
7. The method for preparing a pressure sensitive backing plate according to claim 1, wherein in the sixth step, the secondary staged hot pressing of the phenolic resin and the thermoplastic polyimide after the primary hot pressing comprises: hot pressing at 125 deg.C for 10 min, at 175 deg.C for 30 min, and at 85 deg.C for 15 min.
8. The method for preparing a pressure-sensitive backing plate according to claim 1, wherein in the sixth step, the type of the silica gel is silica gel G.
9. A pressure-sensitive adhesive sheet produced by the method for producing a pressure-sensitive adhesive sheet according to claims 1 to 8.
10. The pressure-sensitive backing plate of claim 9 wherein said pressure-sensitive backing plate is comprised of a phenolic resin plate, an adhesive, a thermoplastic polyimide, a silicone.
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|---|---|---|---|---|
| US20100279468A1 (en) * | 2009-04-30 | 2010-11-04 | Nitto Denko Corporation | Laminated film and process for producing semiconductor device |
| CN208733008U (en) * | 2018-08-22 | 2019-04-12 | 苏州速传导热电子材料科技有限公司 | A kind of slim high-temperature insulation silica gel pad |
| CN111087562A (en) * | 2019-12-10 | 2020-05-01 | 沈阳化工大学 | Preparation method of blending modified phenolic resin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100279468A1 (en) * | 2009-04-30 | 2010-11-04 | Nitto Denko Corporation | Laminated film and process for producing semiconductor device |
| CN208733008U (en) * | 2018-08-22 | 2019-04-12 | 苏州速传导热电子材料科技有限公司 | A kind of slim high-temperature insulation silica gel pad |
| CN111087562A (en) * | 2019-12-10 | 2020-05-01 | 沈阳化工大学 | Preparation method of blending modified phenolic resin |
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| Title |
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| 徐菘: "压敏胶研究进展", 《化学反应工程与工艺》 * |
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