CN112837936A - Direct current group film capacitor - Google Patents
Direct current group film capacitor Download PDFInfo
- Publication number
- CN112837936A CN112837936A CN202110234970.8A CN202110234970A CN112837936A CN 112837936 A CN112837936 A CN 112837936A CN 202110234970 A CN202110234970 A CN 202110234970A CN 112837936 A CN112837936 A CN 112837936A
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- Prior art keywords
- capacitor
- air
- cooling
- pipe
- positioning frame
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- 239000003990 capacitor Substances 0.000 title claims abstract description 97
- 238000001816 cooling Methods 0.000 claims abstract description 74
- 239000010409 thin film Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to the technical field of capacitors, and particularly discloses a direct current group thin film capacitor which comprises a capacitor shell and a capacitor core group; the inside cover of condenser casing is equipped with cooling casing, is provided with the cooling chamber between cooling casing and the condenser casing, and the inside in cooling chamber sets up the air-cooled pipe of intercommunication each other. The capacitor core set comprises a capacitor core set, a positioning frame, an air cooling pipe, a positioning frame, a capacitor core set and a capacitor, wherein the positioning frame is arranged on the capacitor core set, the air cooling pipe is arranged between the positioning frame and the capacitor core set, the positioning frame is arranged on the positioning frame, the air cooling pipe is arranged between the cooling shell and the capacitor core set, the positioning frame is arranged on the positioning frame, the air cooling pipe is arranged on the positioning frame, the.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a direct current group thin film capacitor.
Background
With the development of the technical level, the upgrading period of various industries such as electronics, household appliances, communication and the like is shorter and shorter, and the thin film capacitor becomes an indispensable electronic element for promoting the upgrading of the industries by virtue of good electrical performance and high reliability.
The direct current film capacitor can effectively integrate an electrical structure as a key component of a plurality of circuits, directly connects a capacitor electrode with the IGBT (insulated gate bipolar translator), effectively reduces the inductance of a system, saves the cost of an external bus bar, reduces the assembly difficulty and saves the installation time.
However, in the actual operation of such capacitors, the film capacitor generates a certain amount of heat (energy loss) during charging and discharging, and although the amount of heat generated by the film capacitor is not large, the temperature rises with the heat accumulation until thermal equilibrium is reached. The overall performance of the capacitor (lifetime, safety, etc.) is reduced as the temperature increases.
Disclosure of Invention
The present invention is directed to a dc group thin film capacitor, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: a direct current group thin film capacitor comprises a capacitor shell and a capacitor core group; the capacitor shell is of a rectangular structure, an installation groove for installing a capacitor core group is formed in the capacitor shell, the capacitor core group is installed in the installation groove, and the upper end and the lower end of the capacitor core group are respectively provided with a busbar copper plate with a hollow structure; the capacitor core group comprises a plurality of independent cores which are connected in parallel, and a ventilating duct with a square-square structure is arranged in the busbar copper plate; the capacitor comprises a capacitor shell, a busbar copper plate, a positive wiring end, a negative wiring end, a moisture-proof sealing cover and a connecting hole, wherein the busbar copper plate is welded with the positive wiring end and the negative wiring end; the inside cover of condenser casing is equipped with cooling casing, is provided with the cooling chamber between cooling casing and the condenser casing, and the inside in cooling chamber sets up the air-cooled pipe that communicates each other, and the air-cooled pipe is fixed on the inner wall in cooling chamber, and both ends are provided with air intake and air outlet respectively about the air-cooled pipe.
Preferably, a plurality of cooling air ports are arranged on the cooling cavity at intervals and communicated with the cooling air pipe.
Preferably, one end of the cooling air pipe, which is far away from the cooling air port, is communicated with a positioning frame for fixing the capacitor core group, the positioning frame is of a hollow rectangular frame structure, and a heat exchange cavity is arranged inside the positioning cavity.
Preferably, a plurality of air guide pipes are arranged in the heat exchange cavity at intervals, the cross sections of the air guide pipes are of Y-shaped structures, and a plurality of air outlets are formed in the circumferential outer walls of the air guide pipes.
Preferably, one end of the air guide pipe is provided with two air collecting ports used for communicating the cooling air pipe, and the other end of the air guide pipe is provided with an air guide port.
Preferably, the bottom of locating frame has seted up the air exit, and the air exit passes through the exhaust pipe and communicates the heat extraction fan, and air pipe's air intake and air outlet all set up in the inside in heat transfer chamber to communicate with the heat transfer chamber.
Preferably, the cross-section of the ventilation pipeline is of an arc-shaped structure, and the convex surface of the ventilation pipeline faces the independent core.
Preferably, a heat exchange air port is formed in the dustproof sealing cover at the top end of the cooling cavity, and a dustproof filter screen is arranged inside the heat exchange air port.
Preferably, the cooling and solidifying high-thermal-conductivity polyurethane material is filled between the outer side wall of the positioning frame and the inner side wall of the cooling shell and between the inner side wall of the positioning frame and the capacitor core set.
Preferably, a moisture absorption and moisture prevention layer is arranged on the inner wall of the cooling cavity, and a moisture-proof agent is filled in the moisture absorption and moisture prevention layer.
Compared with the prior art, the invention has the beneficial effects that:
the capacitor comprises a capacitor shell, a capacitor core group, a positioning frame, a heat extraction cavity, a heat extraction fan, an air cooling pipe, a positioning frame, a heat extraction pipe and a cooling pipe, wherein the positioning frame is arranged in the capacitor shell, the positioning frame is used for fixing the capacitor core group, part of heat generated on the capacitor core group is led out to the heat extraction cavity through the positioning frame and the air extraction pipe, hot air in the capacitor core group is exhausted to the outside of the capacitor through the air extraction fan, the air cooling pipe is arranged between the cooling shell and the capacitor shell, the purpose of cooling the positioning frame can be achieved, the purpose of cooling the capacitor core group is achieved through the contact between the positioning frame and the capacitor core group, a large number of external electrode ends on the capacitor core group can timely conduct.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the present invention;
FIG. 3 is a schematic partial cross-sectional view of the present invention;
FIG. 4 is a schematic view of a connection structure of the positioning frame and the capacitor core set according to the present invention;
fig. 5 is a specific structural schematic diagram of the ventilation duct of the present invention.
In the figure: 1. a capacitor case; 2. a capacitor core set; 3. mounting grooves; 4. a positive terminal; 5. a negative terminal; 6. cooling the shell; 7. a cooling cavity; 8. an air-cooled pipe; 9. a cooling air pipe; 10. a positioning frame; 11. an air guide pipe; 12. an air outlet; 13. an air collecting opening; 14. a wind guide opening; 15. an exhaust duct; 16. a heat exhausting fan; 17. a heat exchange tuyere; 18. a high thermal conductivity polyurethane material; 19. a moisture-absorbing and moisture-proof layer; 20. a moisture-proof sealing cover; 21. a busbar copper plate; 22. a ventilation duct; 23. a heat exchange cavity.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "level" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-5, the present invention provides a technical solution: a direct current group thin film capacitor comprises a capacitor shell 1 and a capacitor core group 2; the capacitor shell 1 is of a rectangular structure, a mounting groove 3 for mounting the capacitor core group 2 is formed in the capacitor shell 1, the capacitor core group 2 is mounted in the mounting groove 3, and the upper end and the lower end of the capacitor core group 2 are respectively provided with a busbar copper plate 21 with a hollow structure; the capacitor core group 2 comprises a plurality of independent cores which are mutually connected in parallel, and a ventilation pipeline 22 with a square-square structure is arranged in the busbar copper plate 21; the positive terminal 4 and the negative terminal 5 are welded on the busbar copper plate 21, the top end of the capacitor shell 1 is provided with a moisture-proof sealing cover 20, and the positions of the moisture-proof sealing cover 20 corresponding to the positive terminal 4 and the negative terminal 5 are provided with connecting holes matched with the structure of the moisture-proof sealing cover; the inside cover of condenser housing 1 is equipped with cooling casing 6, is provided with cooling chamber 7 between cooling casing 6 and the condenser housing 1, and the inside in cooling chamber 7 sets up the air-cooled pipe 8 that communicates each other, and air-cooled pipe 8 is fixed on the inner wall in cooling chamber 7, and both ends are provided with air intake and air outlet respectively about air-cooled pipe 8.
Furthermore, a plurality of cooling air ports are arranged on the cooling cavity 7 at intervals and communicated with a cooling air pipe 9.
Furthermore, one end of the cooling air pipe 9, which is far away from the cooling air port, is communicated with a positioning frame 10 for fixing the capacitor core group 2, the positioning frame 10 is of a hollow rectangular frame structure, and a heat exchange cavity 23 is arranged inside the positioning cavity 10.
Further, a plurality of air guide pipes 11 are arranged in the heat exchange cavity 23 at intervals, the cross sections of the air guide pipes 11 are of a Y-shaped structure, and a plurality of air outlets 12 are formed in the circumferential outer walls of the air guide pipes 11.
Furthermore, one end of the air duct 11 is provided with two air collecting ports 13 for communicating with the cooling air duct 9, and the other end of the air duct 11 is provided with an air guiding port 14.
Furthermore, the bottom end of the positioning frame 10 is provided with an air outlet, the air outlet is communicated with the air exhaust fan 16 through an air exhaust pipe 15, and the air inlet and the air outlet of the ventilation pipeline 22 are both arranged inside the heat exchange cavity 23 and communicated with the heat exchange cavity 23.
Further, the cross section of the ventilation duct 22 is an arc-shaped structure, and the convex surface of the ventilation duct 22 faces the independent core.
Further, a dustproof sealing cover 20 at the top end of the cooling cavity 7 is provided with a heat exchange air port 17, and a dustproof filter screen is arranged inside the heat exchange air port 17.
Further, a cooled and solidified high thermal conductivity polyurethane material 18 is filled between the outer side wall of the positioning frame 10 and the inner side wall of the cooling shell 6, and between the inner side wall of the positioning frame 10 and the capacitor core group 2.
Furthermore, a moisture absorption and moisture prevention layer 19 is arranged on the inner wall of the cooling cavity 7, and a moisture-proof agent is filled in the moisture absorption and moisture prevention layer 19.
The working principle is as follows: when the capacitor is in actual use, the air inlet and the air outlet of the air cooling pipe 8 can be respectively connected with external air cooling equipment for use because the heat dissipation mechanisms of the capacitor are all of a pre-embedded structure. In the working process of the capacitor, part of heat generated by the capacitor core group 2 is conducted out in time through a large number of external electrode terminals on the capacitor core group 2, and the part of heat is conducted out of a cavity outside the positioning frame 10 through the positioning frame 10 and a ventilation pipeline 22 in the busbar copper plate 21. The power supply of the heat exhausting fan 16 is connected, so that the heat exhausting fan 16 exhausts the hot air inside the positioning frame 10 to the outside of the capacitor, meanwhile, the air guide opening 14 on the moisture-proof sealing cover 20 guides the outside air into the cooling cavity 7, the air cooling pipe 8 cools the outside air, the cooled air guides the low-temperature air in the cooling cavity 7 to the positioning frame 10 through the matching between the cooling air pipe 9 and the air guide pipe 11, the purpose of cooling the positioning frame 10 is achieved, and the purpose of cooling the capacitor core group 2 is achieved through the contact between the positioning frame 10 and the capacitor core group 2.
It is worth noting that: the whole device realizes control over the device through the controller, and because the equipment matched with the controller is common equipment, the device belongs to the existing mature technology, and the electrical connection relation and the specific circuit structure are not repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A direct current group film capacitor is characterized in that: comprises a capacitor shell (1) and a capacitor core group (2); the capacitor shell (1) is of a rectangular structure, a mounting groove (3) for mounting a capacitor core group (2) is formed in the capacitor shell (1), the capacitor core group (2) is mounted in the mounting groove (3), and the upper end and the lower end of the capacitor core group (2) are respectively provided with a busbar copper plate (21) with a hollow structure; the capacitor core group (2) comprises a plurality of independent cores which are connected in parallel, and a ventilating duct (22) with a clip structure is arranged in the busbar copper plate (21); the capacitor is characterized in that a positive terminal (4) and a negative terminal (5) are welded on the busbar copper plate (21), a moisture-proof sealing cover (20) is arranged at the top end of the capacitor shell (1), and connecting holes matched with the moisture-proof sealing cover (20) in structure are formed in positions, corresponding to the positive terminal (4) and the negative terminal (5), of the moisture-proof sealing cover (20); the capacitor shell comprises a capacitor shell body (1), wherein a cooling shell body (6) is sleeved inside the capacitor shell body (1), a cooling cavity (7) is arranged between the cooling shell body (6) and the capacitor shell body (1), an air cooling pipe (8) which is communicated with the cooling cavity (7) is arranged inside the cooling cavity (7), the air cooling pipe (8) is fixed on the inner wall of the cooling cavity (7), and an air inlet and an air outlet are formed in the left end and the right end of the air cooling pipe (8) respectively.
2. The thin film dc capacitor of claim 1, wherein: a plurality of cooling air ports are arranged on the cooling cavity (7) at intervals and communicated with a cooling air pipe (9).
3. The thin film dc capacitor of claim 2, wherein: one end of the cooling air pipe (9) far away from the cooling air port is communicated with a positioning frame (10) used for fixing the capacitor core group (2), the positioning frame (10) is of a hollow rectangular frame structure, and a heat exchange cavity (23) is arranged inside the positioning cavity (10).
4. The DC set thin film capacitor according to claim 3, wherein: a plurality of air guide pipes (11) are arranged in the heat exchange cavity (23) at intervals, the cross sections of the air guide pipes (11) are Y-shaped structures, and a plurality of air outlets (12) are formed in the circumferential outer walls of the air guide pipes (11).
5. The DC set thin film capacitor according to claim 4, wherein: one end of the air guide pipe (11) is provided with two air collecting ports (13) used for communicating the cooling air pipe (9), and the other end of the air guide pipe (11) is provided with an air guide port (14).
6. The DC set thin film capacitor according to claim 3, wherein: the air outlet has been seted up to the bottom of posting (10), and the air outlet passes through exhaust pipe (15) and communicates heat extraction fan (16), and the air intake and the air outlet of air pipe (22) all set up the inside in heat transfer chamber (23) to communicate with heat transfer chamber (23).
7. The thin film dc capacitor of claim 1, wherein: the cross-section of ventilation pipe (22) is arc structure, and ventilation pipe (22)'s convex surface sets up towards independent core.
8. The thin film dc capacitor of claim 1, wherein: a dustproof sealing cover (20) at the top end of the cooling cavity (7) is provided with a heat exchange air port (17), and a dustproof filter screen is arranged inside the heat exchange air port (17).
9. The DC set thin film capacitor according to claim 3, wherein: and a cooling and solidifying high-thermal-conductivity polyurethane material (18) is filled between the outer side wall of the positioning frame (10) and the inner side wall of the cooling shell (6) and between the inner side wall of the positioning frame (10) and the capacitor core group (2).
10. The thin film dc capacitor of claim 1, wherein: and a moisture absorption and moisture prevention layer (19) is arranged on the inner wall of the cooling cavity (7), and a moisture-proof agent is filled in the moisture absorption and moisture prevention layer (19).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110234970.8A CN112837936A (en) | 2021-03-03 | 2021-03-03 | Direct current group film capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110234970.8A CN112837936A (en) | 2021-03-03 | 2021-03-03 | Direct current group film capacitor |
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CN112837936A true CN112837936A (en) | 2021-05-25 |
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CN202110234970.8A Pending CN112837936A (en) | 2021-03-03 | 2021-03-03 | Direct current group film capacitor |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117524728A (en) * | 2024-01-03 | 2024-02-06 | 深圳市汇北川电子技术有限公司 | High-temperature-stability high-power thin film capacitor and preparation method thereof |
-
2021
- 2021-03-03 CN CN202110234970.8A patent/CN112837936A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117524728A (en) * | 2024-01-03 | 2024-02-06 | 深圳市汇北川电子技术有限公司 | High-temperature-stability high-power thin film capacitor and preparation method thereof |
CN117524728B (en) * | 2024-01-03 | 2024-03-22 | 深圳市汇北川电子技术有限公司 | High-temperature-stability high-power thin film capacitor and preparation method thereof |
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