CN112812270A - Modified polyaspartic acid ester resin and synthetic method thereof - Google Patents
Modified polyaspartic acid ester resin and synthetic method thereof Download PDFInfo
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- CN112812270A CN112812270A CN202011633237.5A CN202011633237A CN112812270A CN 112812270 A CN112812270 A CN 112812270A CN 202011633237 A CN202011633237 A CN 202011633237A CN 112812270 A CN112812270 A CN 112812270A
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- 239000011347 resin Substances 0.000 title claims abstract description 78
- 229920005989 resin Polymers 0.000 title claims abstract description 75
- 150000002148 esters Chemical class 0.000 title claims abstract description 61
- 108010064470 polyaspartate Proteins 0.000 title claims abstract description 43
- 229920000805 Polyaspartic acid Polymers 0.000 title claims abstract description 29
- 238000010189 synthetic method Methods 0.000 title description 3
- 239000003822 epoxy resin Substances 0.000 claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 53
- 229920000608 Polyaspartic Polymers 0.000 claims abstract description 32
- 239000010703 silicon Substances 0.000 claims abstract description 16
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims description 43
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 claims description 41
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 claims description 41
- -1 aliphatic diamine Chemical class 0.000 claims description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 14
- 229920002396 Polyurea Polymers 0.000 claims description 12
- 125000003545 alkoxy group Chemical group 0.000 claims description 10
- 230000002194 synthesizing effect Effects 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims 1
- 238000001308 synthesis method Methods 0.000 abstract description 12
- 238000005260 corrosion Methods 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 abstract description 4
- 239000003513 alkali Substances 0.000 abstract description 3
- 239000003595 mist Substances 0.000 abstract description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract description 2
- 239000011780 sodium chloride Substances 0.000 abstract description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 24
- 238000006845 Michael addition reaction Methods 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 238000007259 addition reaction Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 238000010907 mechanical stirring Methods 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- YXRKNIZYMIXSAD-UHFFFAOYSA-N 1,6-diisocyanatohexane Chemical compound O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O YXRKNIZYMIXSAD-UHFFFAOYSA-N 0.000 description 2
- GZDFHIJNHHMENY-UHFFFAOYSA-N Dimethyl dicarbonate Chemical compound COC(=O)OC(=O)OC GZDFHIJNHHMENY-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 235000010300 dimethyl dicarbonate Nutrition 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GSSUDDYGPOVEMX-UHFFFAOYSA-N 2,2,4-trimethylcyclohexane-1,1-diamine Chemical compound CC1CCC(N)(N)C(C)(C)C1 GSSUDDYGPOVEMX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- AVKNGPAMCBSNSO-UHFFFAOYSA-N cyclohexylmethanamine Chemical compound NCC1CCCCC1 AVKNGPAMCBSNSO-UHFFFAOYSA-N 0.000 description 1
- OYOFUEDXAMRQBB-UHFFFAOYSA-N cyclohexylmethanediamine Chemical compound NC(N)C1CCCCC1 OYOFUEDXAMRQBB-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013535 sea water Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6407—Reaction products of epoxy resins with at least equivalent amounts of compounds containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/02—Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
- C08G2150/90—Compositions for anticorrosive coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention relates to the field of polyaspartic ester resin, in particular to modified polyaspartic ester resin and a synthesis method thereof. The modified polyaspartic acid ester resin obtained by modifying the polyaspartic acid ester resin through the epoxy resin modified by organic silicon has excellent saline resistance, acid and alkali resistance, salt mist resistance and corrosion resistance.
Description
Technical Field
The invention relates to the field of polyaspartic ester resin, in particular to modified polyaspartic ester resin and a synthetic method thereof.
Background
Today, the marine resource and marine vessel industry has become an important backbone of the world in economic development. The marine environment is a very harsh corrosive environment, and submarines, ships and the like in seawater or on the sea surface need to be made of high-strength and corrosion-resistant materials and are protected by coating an anti-corrosion coating. Therefore, the search for the most suitable marine anticorrosive coatings has attracted a great deal of attention.
At present, the existing anticorrosive coatings are various in types and are all thousands of years. Polyaspartate polyureas have many good properties: such as low viscosity, high solids; the reaction rate is adjustable, so that the construction and the substrate wetting are convenient (the adhesive force is improved); has good tolerance to ultraviolet rays, lasting gloss, stable color, no yellowing, low-temperature curing resistance and strong environmental erosion resistance. However, the viscosity of the polyaspartic ester polyurea intermediate, namely the polyaspartic ester resin, is easily increased in the process of synthesizing the polyaspartic ester polyurea intermediate, the processing difficulty is increased in the subsequent synthesis process of the polyaspartic ester polyurea, and meanwhile, the adhesion force of the polyaspartic ester polyurea coating and a metal matrix is low.
Disclosure of Invention
In view of the problems in the prior art, the first aspect of the present invention provides a modified polyaspartate resin, which is prepared from a silicone-modified or unmodified epoxy resin and a polyaspartate resin.
In a preferred embodiment of the present invention, the silicone-modified epoxy resin is 0.5 to 5 wt% of a silicone-modified epoxy resin.
As a preferred embodiment of the present invention, the epoxy resin and the poly (arylene ether)-NH-in aspartic ester resin2In a molar ratio of (0.9-1.1): 1.
the second aspect of the invention provides a method for synthesizing the modified polyaspartic ester resin, which comprises the following steps:
(1) aliphatic diamine and diethyl maleate react at 65-90 ℃ to obtain polyaspartic acid ester resin;
(2) adding organic silicon modified or unmodified epoxy resin, and continuing to react to obtain the epoxy resin.
As a preferred embodiment of the present invention, the step (1) includes: reacting aliphatic diamine and diethyl maleate at 65-90 ℃, stopping the reaction when the conversion rate of the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
In a preferred embodiment of the present invention, the molar ratio of the aliphatic diamine to diethyl maleate is 1: (2-3).
As a preferred embodiment of the present invention, the step (1) includes: reacting aliphatic diamine and diethyl maleate at 65-90 ℃ under the protection of inert gas, stopping the reaction when the conversion rate of the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
As a preferred embodiment of the present invention, the preparation method of the silicone-modified epoxy resin in step (2) comprises: the alkoxy-containing organic silicon, epoxy resin and catalyst react at 60-80 ℃.
In a preferred embodiment of the present invention, the catalyst is 0.5 to 3 wt% of the total amount of the alkoxy group-containing silicone and the epoxy resin.
The third aspect of the invention provides a polyaspartate polyurea synthesized from the modified polyaspartate resin.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the application, the polyaspartic ester resin is modified by the epoxy resin modified by organic silicon, so that the obtained modified polyaspartic ester resin has excellent saline water resistance, acid and alkali resistance, salt mist resistance and corrosion resistance;
(2) in the preparation process of the polyaspartic ester resin, the aliphatic diamine and the diethyl maleate react at a temperature higher than 65 ℃, so that the obtained polyaspartic ester resin is light in color and moderate in viscosity;
(3) when the conversion rate of the aliphatic diamine is 80-95 mol%, the reaction is stopped, and the finally obtained modified polyaspartic acid ester resin has high solid content and low viscosity, is beneficial to subsequent processing, and has good salt resistance, acid and alkali resistance, salt mist resistance and corrosion resistance.
Detailed Description
The present invention is illustrated by the following specific embodiments, but is not limited to the specific examples given below.
The invention provides a modified polyaspartic ester resin, which is prepared from organosilicon modified or unmodified epoxy resin and polyaspartic ester resin.
In one embodiment, the modified polyaspartic acid ester resin is prepared from raw materials including a silicone-modified epoxy resin and a polyaspartic acid ester resin.
Preferably, the organosilicon modified epoxy resin is 0.5-5 wt% of organosilicon modified epoxy resin; further preferably, the silicone-modified epoxy resin is 0.5 to 3 wt% silicone-modified epoxy resin.
Preferably, the epoxy resin and polyaspartic acid ester resin contains-NH2In a molar ratio of (0.9-1.1): 1; more preferably, the epoxy resin and polyaspartic acid ester resin contains-NH2In a molar ratio of 1:1.
in the present application-NH-in polyaspartic ester resins2Refers to-NH in which amine substances do not participate in the reaction in the synthesis of polyaspartic acid resin by amine substances such as aliphatic diamine and the like2。
In the present application-NH-in epoxy resins and polyaspartic acid ester resins2Mole ofThe ratio is (0.9-1.1): 1, namely the amount ratio of unreacted aliphatic diamine to the epoxy resin in the synthesized polyaspartic acid resin is (1.8-2.2): 1.
the second aspect of the invention provides a method for synthesizing the modified polyaspartic ester resin, which comprises the following steps:
(1) aliphatic diamine and diethyl maleate react at 65-90 ℃ to obtain polyaspartic acid ester resin;
(2) adding organic silicon modified or unmodified epoxy resin, and continuing to react to obtain the epoxy resin.
In one embodiment, the step (1) comprises: aliphatic diamine and diethyl maleate react at 65-90 ℃, when the conversion rate of amine in the aliphatic diamine is 80-95 mol%, the reaction is stopped, and unreacted diethyl maleate is removed, so that the polyaspartic acid ester resin containing unreacted aliphatic diamine is obtained.
Preferably, the molar ratio of the aliphatic diamine to diethyl maleate is 1: (2-3); more preferably, the molar ratio of the aliphatic diamine to diethyl maleate is 1: 2.
in experiments, the applicant finds that when the reaction speed of aliphatic diamine and diethyl maleate is low and the temperature is higher than 65 ℃, the generated polyaspartic ester resin can continuously react with diethyl maleate, and the performance of the resin is influenced.
In addition, the present applicant has found unexpectedly that when the molar ratio of the aliphatic diamine to diethyl maleate is 1: and (2-3) when the reaction temperature is higher than 65 ℃, the obtained polyaspartic ester resin is light in color, moderate in viscosity and compounded with the concept of high solid content and low viscosity.
In a further preferred embodiment, the step (1) comprises: reacting aliphatic diamine and diethyl maleate at 65-90 ℃ under the protection of inert gas, stopping the reaction when the amine conversion rate in the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
In a further preferred embodiment, the step (1) comprises: reacting aliphatic diamine and diethyl maleate at 80 ℃ under the protection of inert gas, stopping the reaction when the conversion rate of amine in the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate by reduced pressure distillation to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
The inert gas described herein is not particularly limited and may be routinely selected by those skilled in the art.
The addition of inert gas prevents the oxidation of aliphatic diamine and reduces the color of the product.
In one embodiment, the method for preparing the silicone-modified epoxy resin in the step (2) comprises: the alkoxy-containing organic silicon, epoxy resin and catalyst react at 60-80 ℃.
In a preferred embodiment, the method for preparing the silicone-modified epoxy resin in the step (2) comprises: the alkoxy-containing organic silicon, epoxy resin and catalyst react for 3 hours at 70 ℃.
Preferably, the catalyst accounts for 0.5-3 wt% of the total amount of the silicone containing alkoxy and the epoxy resin; more preferably, the catalyst comprises 1 wt% of the total amount of the alkoxy group-containing silicone and the epoxy resin.
The catalyst, epoxy resin, and silicone containing an alkoxy group described herein are not particularly limited and may be conventionally selected by those skilled in the art.
In one embodiment, the catalyst is a phosphoric acid catalyst.
In one embodiment, the epoxy resin is an E51 epoxy resin.
In one embodiment, the alkoxy-containing silicone is 4,4, -diaminocyclohexylmethane and/or 3,3, -dimethyl-4, 4, -diaminocyclohexylmethane.
The third aspect of the invention provides a polyaspartate polyurea synthesized from the modified polyaspartate resin.
The method of synthesis of the polyaspartate polyureas described herein is not particularly limited and can be routinely selected by one of skill in the art.
Examples
Hereinafter, the present invention will be described in more detail by way of examples, but it should be understood that these examples are merely illustrative and not restrictive. The starting materials used in the examples which follow are all commercially available unless otherwise stated.
Examples 1 to 8 of the present application provide a modified polyaspartic acid ester resin obtained by modifying an organosilicon-modified epoxy resin, wherein,
the synthesis method of the 0.5 wt% organosilicon modified E51 resin is as follows:
a250 ml four-necked flask was charged with 150g E51 epoxy resin, 0.75g polydimethylsiloxane and 1 wt% phosphoric acid catalyst, and reacted at 70 ℃ for 3 hours with mechanical stirring.
The synthesis method of 2 wt% organosilicon modified E51 resin is as follows:
a250 ml four-necked flask was charged with 150g E51 epoxy resin, 3g polydimethylsiloxane and 1 wt% phosphoric acid catalyst, and reacted at 70 ℃ for 3 hours with mechanical stirring.
The synthesis method of the 3 wt% organic silicon modified E51 resin comprises the following steps:
a250 ml four-necked flask was charged with 150g E51 epoxy resin, 4.5g polydimethylsiloxane and 1 wt% phosphoric acid catalyst, and reacted at 70 ℃ for 3 hours with mechanical stirring.
Example 1
The synthesis method of the polyaspartic ester resin in embodiment 1 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 90 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X1;
(2) 20.1g of 0.5 wt% organosilicon-modified E51 resin was added and the 4, 4' -one remaining from reaction (1)Performing addition reaction on diaminocyclohexylmethane and modified epoxy resin to synthesize a target product Y1The yield was 98.8 wt%.
Example 2
The synthesis method of the polyaspartic ester resin in embodiment 2 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 90 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X2。
(2) Adding 20.4g of 2 percent organic silicon modified E51 resin, carrying out addition reaction on the residual 4, 4' -diaminocyclohexylmethane in the reaction (1) and the modified epoxy resin to synthesize a target product Y2The yield was 97.3 wt%.
Example 3
The synthesis method of the polyaspartic ester resin in embodiment 3 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 90 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X3。
(2) Adding 20.6g of 3 percent organic silicon modified E51 resin, carrying out addition reaction on the residual 4, 4' -diaminocyclohexylmethane in the reaction (1) and the modified epoxy resin to synthesize a target product Y3The yield was 95.9 wt%.
Example 4
The synthesis method of polyaspartic ester resin in embodiment 4 of the invention specifically comprises the following steps:
(1) into a 500ml four-necked flask was charged 59.5g (0.25mol) of 3, 3' -bisMethyl-4, 4' -diaminocyclohexylmethane (DMDC), 86.1g (0.5mol) of diethyl maleate are added dropwise to DMDC and N is passed in2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 3, 3-dimethyl-4, 4-diaminocyclohexylmethane reaches 90 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X4。
(2) Adding 20.4g of 2% organic silicon modified E51 resin, carrying out addition reaction on the rest 3,3, -dimethyl-4, 4, -diaminocyclohexylmethane in the reaction (1) and modified epoxy resin to synthesize a target product Y4The yield was 99.1 wt%.
Example 5
The synthesis method of the polyaspartic ester resin in embodiment 5 of the invention specifically comprises the following steps:
(1) 50g (0.125mol) of polyetheramine T403 were placed in a 500ml four-necked flask, 64.58g (0.375mol) of diethyl maleate were added dropwise to T403, and N was introduced2Magnetically stirring, performing Michael addition reaction at 80 ℃, stopping reaction when the conversion rate of the polyetheramine T403 reaches 90 mol%, and removing unreacted diethyl maleate by reduced pressure distillation to obtain a product X5。
(2) Adding 15.3g of 2 percent organic silicon modified E51 resin, carrying out addition reaction on the residual T403 in the reaction (1) and the modified epoxy resin to synthesize a target product Y5The yield was 96.7 wt%.
Example 6
The synthesis method of the polyaspartic ester resin in embodiment 6 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 85 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X6。
(2) 30.6g of 2% silicone-modified E51 resin was added and the remaining 4, 4' -bis of reaction (1) was reactedPerforming addition reaction on aminocyclohexylmethane and modified epoxy resin to synthesize a target product Y6The yield was 98.1 wt%.
Example 7
The synthesis method of polyaspartic ester resin in embodiment 7 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 95 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X7。
(2) Adding 10.2g of 2% organic silicon modified E51 resin, and carrying out addition reaction on the residual 4, 4' -diaminocyclohexylmethane in the reaction (1) and the modified epoxy resin to synthesize a target product Y7The yield was 97.9 wt%.
Example 8
The synthesis method of polyaspartic ester resin in embodiment 8 of the invention specifically comprises the following steps:
(1) a500 ml four-necked flask was charged with 52.5g (0.25mol) of 4, 4' -diaminocyclohexylmethane (HMDA), 86.1g (0.5mol) of diethyl maleate was added dropwise to the HMDA, and N was introduced thereinto2Magnetically stirring, performing Michael addition reaction at 80 deg.C, stopping reaction until the conversion rate of 4, 4' -diaminocyclohexylmethane reaches 90 mol%, and distilling under reduced pressure to remove unreacted diethyl maleate to obtain product X8。
(2) Adding 20.6g of unmodified E51 resin, carrying out addition reaction on the residual 4, 4' -diaminocyclohexylmethane in the reaction (1) and the modified epoxy resin to synthesize a target product Y8The yield was 99.3 wt%.
Performance evaluation
Products Y obtained in examples 1 to 81、Y2、Y5、Y6、Y7、Y8Respectively reacting with HDI tripolymer at a molar ratio of 1:1.2 to obtain polyaspartic ester polyurea, p-polyasparticThe acid ester polyurea test results are shown in the table below.
TABLE 1
TABLE 1
Wherein the control group is obtained by reacting F420 polyaspartate resin and HDI trimer which are sourced from New Material GmbH of Feiyang Jun research, and the molar ratio of the resin to the HDI trimer is 1: 1.2.
The test results in the table show that the antiseptic property of the polyaspartic ester polyurea prepared by adopting the epoxy modified polyaspartic ester resin modified by organic silicon is greatly improved.
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (10)
1. The modified polyaspartic acid ester resin is characterized in that the preparation raw materials comprise organosilicon modified or unmodified epoxy resin and polyaspartic acid ester resin.
2. The modified polyaspartate resin of claim 1, wherein the silicone-modified epoxy resin is 0.5-5 wt% silicone-modified epoxy resin.
3. The modified polyaspartate resin of claim 2, wherein the epoxy resin and polyaspartate resin has-NH in them2In a molar ratio of (0.9-1.1): 1.
4. a method for synthesizing a modified polyaspartic acid ester resin according to any one of claims 1-3, comprising the steps of:
(1) aliphatic diamine and diethyl maleate react at 65-90 ℃ to obtain polyaspartic acid ester resin;
(2) adding organic silicon modified or unmodified epoxy resin, and continuing to react to obtain the epoxy resin.
5. The method for synthesizing a modified polyaspartic acid ester resin according to claim 4, wherein the step (1) comprises: reacting aliphatic diamine and diethyl maleate at 65-90 ℃, stopping the reaction when the conversion rate of the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
6. The method of synthesizing a modified polyaspartic acid ester resin as claimed in claim 5, wherein the molar ratio of the aliphatic diamine to diethyl maleate is 1: (2-3).
7. The method for synthesizing a modified polyaspartic acid ester resin according to claim 6, wherein the step (1) comprises: reacting aliphatic diamine and diethyl maleate at 65-90 ℃ under the protection of inert gas, stopping the reaction when the conversion rate of the aliphatic diamine is 80-95 mol%, and removing unreacted diethyl maleate to obtain the polyaspartic acid ester resin containing unreacted aliphatic diamine.
8. The method for synthesizing a modified polyaspartic ester resin as claimed in claim 4, wherein the method for preparing the silicone-modified epoxy resin in the step (2) comprises: the alkoxy-containing organic silicon, epoxy resin and catalyst react at 60-80 ℃.
9. The method of claim 8, wherein the catalyst is 0.5-3 wt% of the total amount of the silicone and epoxy resin containing alkoxy groups.
10. A polyaspartate polyurea synthesized from the modified polyaspartate resin of any one of claims 1-3.
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