CN112802763A

CN112802763A - Integrated system for fabricating semiconductor devices

Info

Publication number: CN112802763A
Application number: CN201911114243.7A
Authority: CN
Inventors: 詹雅芳; 苏柏荣; 蒋源峰
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2019-11-14
Filing date: 2019-11-14
Publication date: 2021-05-14

Abstract

The disclosure relates to an integrated system for manufacturing a semiconductor device, which includes a first carrying cassette, an equipment front end module connected with the first carrying cassette, a first chamber connected with the equipment front end module, and a cutting module connected with the first chamber. The cutting module comprises a dry film supply unit for providing a dry film, a cutting unit for cutting the dry film and a film sucking unit capable of collecting the cut dry film. The first chamber includes a first cavity movable between the cutting module and the first chamber and a second cavity movable within the first cavity.

Description

Integrated system for fabricating semiconductor devices

Technical Field

The present disclosure relates to an integrated system and a film-pasting method for manufacturing a semiconductor device, and more particularly, to a film-pasting process for semiconductor packaging.

Background

In the semiconductor packaging process, the dry film (dry film) is generally adhered to the panel by the following steps: the front edge of the panel is clamped by a clamp, the dry film which is not cut is leveled on the panel by a roller, then the dry film is cut off by a cutter at the rear edge of the panel, and the part of the dry film which is cut but is not leveled on the panel is leveled on the panel by the roller.

Disclosure of Invention

In the traditional dry film pasting process, after the dry film is leveled on the panel, the dry film can be cut off in the air by a cutter; when the dry film is cut off, particles are not generated, and the particles fall on the panel and/or the dry film, so that bubbles are generated between the dry film and the panel due to the particles when the dry film and the panel are pressed in the subsequent process.

The disclosure relates to an integrated system and a film pasting method for semiconductor equipment, which can solve the problem that particles generated by cutting a dry film fall on the dry film and/or a panel, so that bubbles are generated after film pressing.

An aspect of the present disclosure relates to a film attaching apparatus for a semiconductor device, the film attaching apparatus including a dry film supplying unit, a cutting unit, a movable first chamber, and a movable film sucking unit. The dry film supplying unit may supply a dry film, and the cutting unit may cut the dry film supplied by the dry film supplying unit. The first cavity can be used for bearing a panel and can move between a first position and a second position. The film sucking unit can collect the dry film cut by the cutting unit and can move between a third position and a fourth position, wherein the fourth position can correspond to the first position of the first cavity.

Another aspect of the present disclosure relates to a film attaching method of a semiconductor device, the film attaching method comprising: the dry film cutting device comprises a dry film providing unit, a cutting unit, a film sucking unit and a panel, wherein the dry film is cut into a dry film with a preset size by the cutting unit, the film sucking unit is provided and can collect the dry film cut into the preset size, the film sucking unit is moved to simultaneously move the dry film cut into the preset size, and the dry film cut into the preset size and collected by the film sucking unit is placed on the panel.

Another aspect of the present disclosure relates to an integrated system for a semiconductor device, the system comprising a first carrier cassette, an equipment front end module coupled to the first carrier cassette, a first chamber coupled to the equipment front end module, and a dicing module coupled to the first chamber. The cutting module includes a dry film supply unit for supplying a dry film, a cutting unit for cutting the dry film supplied from the dry film supply unit, and a movable film suction unit for collecting the dry film cut by the cutting unit. The first chamber includes a first cavity movable between the cutting module and the first chamber and a second cavity movable within the first chamber.

Other aspects and embodiments of the present disclosure are also contemplated. The foregoing summary and the following detailed description are not intended to limit the present disclosure to any particular embodiment, but are merely intended to describe some embodiments of the present disclosure.

Drawings

For a better understanding of the nature and objects of some embodiments of the present disclosure, reference should be made to the following detailed description taken in conjunction with the accompanying drawings. In the drawings, like reference numerals refer to like elements unless the context clearly dictates otherwise.

Fig. 1 is a schematic diagram of an integrated system of semiconductor devices according to some embodiments of the present disclosure.

Fig. 2 is a schematic diagram of a first chamber and a dicing module of an integrated system of semiconductor equipment according to an embodiment of the disclosure.

Fig. 3A, 3B, 3C, 3D, 3E, and 3F are schematic diagrams illustrating operations of a first chamber and a dicing module of an integrated system of semiconductor equipment according to some embodiments of the present disclosure.

Fig. 4 is a schematic view of a second chamber and a dicing module of an integrated system of semiconductor equipment according to some embodiments of the present disclosure.

Fig. 5A, 5B, 5C, 5D, 5E, 5F are schematic diagrams illustrating operations of a second chamber and a dicing module of an integrated system of semiconductor devices according to some embodiments of the present disclosure.

Fig. 6 is a film pressing flow diagram of an integrated system of a semiconductor device according to some embodiments of the present disclosure.

Fig. 7 is a schematic diagram of an integrated system of semiconductor devices according to some embodiments of the present disclosure.

Fig. 8 is a schematic view of a first chamber and a dicing module of an integrated system of semiconductor devices according to an embodiment of the present disclosure.

Fig. 9A, 9B, 9C, 9D, 9E, and 9F are schematic diagrams illustrating operations of a first chamber and a dicing module of an integrated system of semiconductor equipment according to some embodiments of the present disclosure.

Fig. 10 is a schematic view of a second chamber and a dicing module of an integrated system of semiconductor devices according to some embodiments of the present disclosure.

Fig. 11A, 11B, 11C, 11D, 11E, 11F are schematic illustrations of operations of a second chamber and a dicing module of an integrated system of semiconductor devices according to some embodiments of the present disclosure.

Fig. 12 is a film pressing flow diagram of an integrated system of a semiconductor device according to some embodiments of the present disclosure.

Detailed Description

Fig. 1 is a schematic diagram of an integrated system 1 of semiconductor devices according to some embodiments of the present disclosure. As shown in fig. 1, an integrated system 1 of semiconductor devices includes a first cassette (cassette)11, a second cassette (cassette)12, an Equipment Front End Module (EFEM) 13, a first chamber 14, a second chamber 15, and a dicing module 16. The first carrying cassette 11 and the second carrying cassette 12 are connected with an equipment front end module 13, the equipment front end module 13 is connected with a first chamber 14 and a second chamber 15, and the first chamber 14 and the second chamber 15 are connected with the cutting module 16. In addition, the first chamber 14 and the second chamber 15 are disposed side by side, such that the same side of the first chamber 14 and the second chamber 15 is connected to the front end module 13, and the other side of the first chamber 14 and the second chamber 15 is connected to the cutting module 16, thereby greatly saving the volume occupied by the integrated system 1 of the semiconductor device, and particularly greatly reducing the overall length thereof.

When a user wants to use the integrated system 1 of the semiconductor apparatus, the user may place a panel to be film-pressed on the first carrying cassette 11 and/or the second carrying cassette 12, and the front end module 13 may be equipped to move the panel placed on the first carrying cassette 11 and/or the second carrying cassette 12 to the first chamber 14 and/or the second chamber 15 for a dry film pressing process. After the dry film is laminated on the panel, the front end module 13 may move the panel laminated with the dry film from the first cavity 14 and/or the second cavity 15 to the first cassette 11 and/or the second cassette 12, and the user may collect the panel laminated with the dry film from the first cassette 11 and/or the second cassette 12. As can be seen from the above, the integrated system 1 of semiconductor device only needs to be equipped with the front-end module 13 to complete the whole film pressing process, so that the cost of the integrated system 1 of semiconductor device can be greatly reduced. In addition, a user can place the panel to be dry film laminated on the first carrying cassette 11 and/or the second carrying cassette 12, and can take the panel which is dry film laminated on the first carrying cassette 11 and/or the second carrying cassette 12, so that the whole work flow can be greatly simplified. Generally, an integrated system uses a front-end module to transfer a panel from a carrying cassette into a laminating module, and then transfers the panel to another carrying cassette by using another front-end module after the laminating of the panel is completed, so that two front-end modules are required, and the panel is required to be placed into the system and the laminated panel is required to be obtained from the system at two ends of the system, so that the system is complicated and requires a larger space to accommodate the system.

As mentioned above, the front module 13 is equipped to move the panel placed on the first cassette 11 and/or the second cassette 12 to the first cavity 14 and/or the second cavity 15 for dry film lamination, and how the first cavity 14 and the second cavity 15 cooperate with the cutting module 16 to complete the dry film lamination process on the panel will be further described below.

Fig. 2 is a schematic diagram of the first chamber 14 and the dicing module 16 of the integrated system 1 of semiconductor equipment according to some embodiments of the present disclosure. As shown in fig. 2, the first chamber 14 has an upper chamber body 141, and the upper chamber body 141 is movable substantially vertically in the first chamber 14. The upper chamber 141 has a bladder contact surface 142, and further, a support member 144 for supporting a PE protective film 143 for protecting the bladder contact surface 142. Furthermore, the first chamber 14 has a lower cavity 145 that is movable between the first chamber 14 and the cutting module 16. The lower chamber 145 has a lower tray 146 thereon and a vacuum suction device 149. When the front end module 13 is equipped to move the panel to be dry film bonded from the first cassette 11 or the second cassette 12 into the first chamber 14, the panel will be placed on the lower tray 146 of the lower cavity 145; when the panel is placed on the lower tray 146 of the lower chamber 145, the vacuum suction device 149 operates to flatly adhere the panel to the lower tray 146, thereby reducing the occurrence of unnecessary warpage of the panel in the subsequent process.

Also, referring to fig. 2, the cutting module 16 may have a dry film wheel 161, a cover film wheel 162, a waste film wheel 163, a rotary knife cylinder 165, and a receiving cylinder 167. The dry film 50 can be loaded on the dry film wheel 161, and the dry film 50 has a dry film body 51 and a cover film 52 attached on the dry film body 51; a cover film wheel 162 for loading a film to be peeled off the cover film 52 from the dry film 50, a rolling cutter cylinder 165 for cutting the dry film body 51 to which the cover film 52 is not attached, the dry film body cut by the rolling cutter cylinder 165 being loaded on a receiving cylinder 167, and the waste film 53 cut by the rolling cutter cylinder 165 but not loaded on the receiving cylinder 167 being recovered by a waste film wheel 163; in addition, the

transfer wheels

1611 and 1612 are used to assist in feeding out the dry film 50 from the dry film wheel 161, the transfer wheel 1621 is used to assist in transferring the cover film 52 to the cover film wheel 162, and the transfer wheel 1631 is used to assist in transferring the waste film 53 to the waste film wheel 163, as shown in fig. 2, when the dry film 50 passes through the

transfer wheels

1612 and 1621, the dry film body 51 and the cover film 52 are separated from each other, wherein the dry film body 51 is continuously transferred to the roller cylinder 165, and the cover film 52 is transferred to the cover film wheel 162. Among them, the dry film wheel 161 and the cover film wheel 162 may be regarded as a dry film supplying unit for supplying the dry film 50, and the waste film wheel 163 may be regarded as a waste film recovering unit for recovering the waste film 53, and thus, the roller 165 may be regarded as a cutting unit, and particularly, as shown in fig. 2, the cutting unit is disposed between the dry film supplying unit and the waste film recovering unit. Furthermore, the hob drum 165 is arranged at the lower side of the dry film body 51 and is provided with a negative pressure device 169; when the roller 165 cuts the dry film body 51, particles generated from the dry film body 51 due to the cutting can be directly sucked away by the negative pressure device 169; thus, the chance of particles falling onto the dry film body cut by the hob 165 is greatly reduced.

Fig. 3A, 3B, 3C, 3D, 3E, and 3F are schematic diagrams illustrating operations of the first chamber 14 and the dicing module 16 of the integrated system 1 of semiconductor equipment according to some embodiments of the present disclosure. Referring to fig. 3A, as mentioned above, the front-end-of-equipment module 13 can move the panel 17 from the first carrying cassette 11 or the second carrying cassette 12 to the first chamber 14, and the panel 17 moved to the first chamber 14 is placed on the down-loading tray 146 of the lower cavity 145, and at the same time, the vacuum suction device 149 can flatly adsorb the panel 17 on the down-loading tray 146. Referring to fig. 3B, after the panel 17 is placed on the download tray 146 of the lower cavity 145, the lower cavity 145 may be moved from the first chamber 14 to a position in the cutting module 16, such that the panel 17 is moved from the first chamber 14 into the cutting module 16; at the same time, the receiving cylinder 167 is located at a position corresponding to the hobbing cylinder 165. Referring to fig. 3C, the dry film wheel 161 starts to rotate to supply the dry film 50 to the hob cylinder 165 through the

guide wheels

1611, 1612, and at the same time, the cover film wheel 162 starts to collect the cover film 52 peeled from the dry film 50 through the guide wheel 1621, and the dry film body 51 of the peeled cover film 52 is supplied toward the hob cylinder 165; when the dry film body 51 passes above the position of the hob drum 165, the hob drum 165 will start to cut the dry film body 51. Since the receiving cylinder 167 is located at a position corresponding to the rolling cylinder 165, the dry film body 51' cut by the rolling cylinder 165 is simultaneously loaded on the receiving cylinder 167, and the waste film 53 cut by the rolling cylinder 165 but not loaded on the receiving cylinder 167 is loaded and recovered by the waste film wheel 163 via the conduction wheel 1631. In addition, as mentioned above, when the dry film body 51 is cut by the hob 165, the negative pressure device 169 is operated at the same time to suck away the particles generated by cutting the dry film body 51, so as to reduce the chance of the particles falling onto the cut dry film body 51'.

As shown in fig. 3D, after the cut dry film body 51 'is loaded on the receiving cylinder 167, the receiving cylinder 167 moves to the position of the lower cavity 145, and the cut dry film body 51' loaded on the receiving cylinder 167 is placed on the panel 17 carried by the lower cavity 145. Referring to fig. 3E, after the dry film bodies 51 'are placed on the panel 17 carried by the lower cavity 145 by the receiving cylinder 167, which is not loaded with any dry film bodies 51', can be returned to the original position corresponding to the hob 165.

Subsequently, as shown in fig. 3F, the lower cavity 145 is returned to the first cavity 14, and the panel 17 with the cut dry film body 51' is moved to the first cavity 14, wherein the lower cavity 145 is located substantially below the upper cavity 141. After the lower cavity 145 moves the panel 17 with the cut dry film body 51' back to the first chamber 14, the inside of the first chamber 14 is evacuated to below 1 torr; after the interior of the first chamber 14 is evacuated to below 1 torr, the upper cavity 141 moves vertically downward to press the cut dry film body 51' on the panel 17 against the panel 17. Under the condition that the interior of the first chamber 14 is first evacuated to below 1 torr, air between the panel 17 and the lower tray 146 and between the panel 17 and the dry film body 51' can be completely evacuated, so that the panel 17 can be more flatly attached to the lower tray 146, and the dry film body 51' can be more flatly attached to the panel 17, and when the upper chamber 141 is pressed, unwanted air bubbles can be prevented from being generated between the panel 17 and the dry film body 51 '.

Thereafter, as mentioned above, the dry film body 51' and the panel 17 are selectively moved from the first chamber 14 to the first carrying cassette 11 or the second carrying cassette 12 via the front module 13, and the user can take the panel 17 that has been pressed with the dry film at the first carrying cassette 11 or the second carrying cassette 12.

As can be understood from the above, the first cavity 14 and the cutting module 16 mainly perform the process of pressing the dry film 50 onto the panel 17, and the first cassette 11, the second cassette 12 and the equipment front module 13 are mainly used for transferring the panel 17 into the first cavity 14 and the cutting module 16 to perform the dry film pressing process and transferring the panel 17 that has completed the dry film pressing process. Therefore, the elements and structures of the first chamber 14 and the dicing module 16 can be regarded as a device for semiconductor film pasting.

Further, fig. 4 is a schematic view of the second chamber 15 and the dicing module 16 of the integrated system 1 of semiconductor equipment according to some embodiments of the present disclosure. As shown in fig. 4, the second chamber 15 has an upper chamber 151, and the upper chamber 151 is movable substantially vertically within the second chamber 15. The upper chamber 151 has an airbag contact surface 152, and further, a support member 154 for supporting a PE protective film 153 for protecting the airbag contact surface 152. Furthermore, the second chamber 15 has a lower cavity 155 that is movable between the second chamber 15 and the cutting module 16. The lower chamber 155 has a lower tray 156 thereon and a vacuum suction device 159. When the front end module 13 is equipped to move the panel to be dry film bonded from the first cassette 11 or the second cassette 12 into the second chamber 15, the panel will be placed on the lower tray 156 of the lower chamber 155; when the panel is placed on the lower tray 156 of the lower chamber 155, the vacuum suction device 159 is operated to attach the panel to the lower tray 145 in a flat manner, thereby reducing unwanted warping of the panel during subsequent processing.

In addition, the components and the connection relationship of the cutting module 16 shown in fig. 4 are already shown in the description of fig. 2, and thus are not repeated.

Fig. 5A, 5B, 5C, 5D, 5E, 5F are schematic diagrams illustrating operations of the second chamber 15 and the dicing module 16 of the integrated system 1 of semiconductor equipment according to some embodiments of the present disclosure. Referring to FIG. 5A, as mentioned above, the front module 13 may be equipped to move the panel 18 from the first cassette 11 or the second cassette 12 to the second chamber 15, and the panel 18 moved to the second chamber 15 is placed on the load tray 156 of the lower chamber 155, and at the same time, the vacuum suction device 159 may flatly attach the panel 18 to the load tray 156. Referring to fig. 5B, after the panel 18 is placed on the download tray 156 of the lower cavity 155, the lower cavity 155 may be moved from the second chamber 15 to a position in the cutting module 16, such that the panel 18 is moved from the second chamber 15 into the cutting module 16; at this time, the receiving cylinder 167 is located at a position corresponding to the hobbing cylinder 165. Referring to fig. 5C, the dry film wheel 161 starts to rotate to supply the dry film 50 to the hob cylinder 165 through the

guide wheels

1611, 1612, and at the same time, the cover film wheel 162 starts to collect the cover film 52 peeled from the dry film 50 through the guide wheel 1621, and the dry film body 51 of the peeled cover film 52 is supplied toward the hob cylinder 165; when the dry film body 51 passes above the position of the hob drum 165, the hob drum 165 will start to cut the dry film body 51. Since the receiving cylinder 167 is located at a position corresponding to the rolling cylinder 165, the dry film body 51 cut by the rolling cylinder 165 is loaded on the receiving cylinder 167 at the same time; the waste film 53 cut by the rotary cutter 165 and not loaded on the receiving drum 167 is loaded and recovered by the waste film wheel 163 via the transfer wheel 1631. In addition, as mentioned above, when the dry film body 51 is cut by the hob 165, the negative pressure device 169 is operated at the same time to suck away the particles generated by cutting the dry film body 51, so as to reduce the chance of the particles falling onto the cut dry film body 51.

As shown in fig. 5D, after the cut dry film body 51 is loaded on the receiving cylinder 167, the receiving cylinder 167 moves to the position of the lower cavity 155, and the cut dry film body 51' loaded on the receiving cylinder 167 is placed on the panel 18 carried by the lower cavity 155. Referring to fig. 5E, after the dry film bodies 51 'are placed on the panel 18 carried by the lower cavity 155 by the receiving cylinder 167, which is not loaded with any dry film bodies 51', can be returned to the original position corresponding to the hob 165.

Subsequently, as shown in fig. 5F, the lower cavity 155 is returned to the second cavity 15, and the panel 18 with the cut dry film body 51' is moved into the second cavity 15, wherein the lower cavity 155 is located substantially below the upper cavity 151. After the lower cavity 155 moves the panel 18 on which the cut dry film body 51' is placed back to the second cavity 15, the inside of the second cavity 15 is evacuated to below 1 torr; after the interior of the second chamber 15 is evacuated to below 1 torr, the upper chamber 151 moves vertically downward to press the cut dry film body 51 placed on the panel 18 against the panel 18. In the case that the interior of the second chamber 15 is first evacuated to below 1 torr, air between the panel 18 and the lower tray 156 and between the panel 18 and the dry film body 51' can be completely evacuated, so that the panel 18 can be more flatly attached to the lower tray 156, and the dry film body 51' can be more flatly attached to the panel 18, and when the upper chamber 151 is pressed, unwanted air bubbles can be prevented from being generated between the panel 18 and the dry film body 51 '.

Thereafter, as mentioned above, the dry film body 51' and the panel 18 are moved from the second chamber 15 to the first cassette 11 or the second cassette 12 via the front module 13, and the user can take the panel 18 that has been subjected to the dry film pressing process from the first cassette 11 or the second cassette 12.

As can be understood from the above, the second chamber 15 and the cutting module 16 mainly perform the process of pressing the dry film 50 onto the panel 18, and the first cassette 11, the second cassette 12 and the equipment front end module 13 are mainly used for transferring the panel 18 into the second chamber 15 and the cutting module 16 to perform the dry film pressing process and transferring the panel 18 that has been subjected to the dry film pressing process out. Therefore, the elements and structures of the second chamber 15 and the dicing module 16 can be regarded as a device for semiconductor film pasting.

Fig. 6 is a film lamination flow diagram 2 of an integrated system 1 using a semiconductor device according to some embodiments of the present disclosure. In step 21, the user may place the faceplate 17 in the first carrying cassette 11, and place the faceplate 18 in the second carrying cassette 12. In step 22, the front end module 13 may be equipped to move the panel 17 placed in the first carrying cassette 11 into the first chamber 14. At step 23, the lower cavity 145 of the first chamber 14 may move the panel 17 into the cutting module 16 for the operation of placing the dry film body 51' on the panel 17. In step 24, the front end module 13 may be equipped to move the panel 18 placed in the second carrying cassette 12 into the second chamber 15. Wherein, step 23 and step 24 can be performed substantially simultaneously. In step 25, the lower cavity 145 can move the panel 17 with the dry film body 51 'placed thereon into the first cavity 14, and the upper cavity 141 of the first cavity 14 can perform a pressing operation on the dry film body 51' and the panel 17. At step 26, the lower cavity 155 of the second chamber 15 may move the panel 18 into the cutting module 16 for the operation of placing the dry film body 51' on the panel 18. Wherein, the

steps

25 and 26 can be performed substantially simultaneously. In step 27, the equipment front end module 13 may move the pressed panel 17 from the first chamber 14 into the first cassette 11 for the user to take up the pressed panel 17. In step 28, the lower cavity 155 can move the panel 18 with the dry film body 51 'placed therein to the second cavity 15, and the upper cavity 151 of the second cavity 15 can perform a pressing operation on the dry film body 51' and the panel 18. Wherein, the

steps

25 and 26 can be performed substantially simultaneously. In step 29, the equipment front end module 13 may move the pressed panel 18 from the second chamber 15 into the second cassette 12 for the user to pick up the pressed panel 18.

As can be understood from the film pressing flowchart 2 shown in fig. 6, when the integrated system 1 of the semiconductor device is used to perform the film pressing process, the film pressing process of the panel 18 can be performed by using the first chamber 14 and the second chamber 15 in turn without waiting for the panel 17 to completely complete the film pressing process; if the panel 17 returns to the first cavity 14 for pressing after the dry film body 51 'is placed on the panel 17 in the cutting module 16 (step 25), the panel 18 is moved from the second cavity 15 to the cutting module to perform the operation of placing the dry film body 51' on the panel 18 (step 26); therefore, the film pressing efficiency of the panel can be greatly improved.

Fig. 7 is a schematic diagram of an integrated system 3 of semiconductor devices according to some embodiments of the present disclosure. As shown in fig. 7, the integrated system 1 of semiconductor devices has a first carrying cassette 31, a second carrying cassette 32, an Equipment Front End Module (EFEM)33, a first chamber 34, a second chamber 35, and a dicing module 36. The first loading cassette 31 and the second loading cassette 32 are connected to the front end of the equipment module 33, the front end of the equipment module 33 is connected to the first chamber 34 and the second chamber 35, and the first chamber 34 and the second chamber 35 are connected to the cutting module 36. In addition, the first chamber 34 and the second chamber 35 are disposed side by side, such that the same side of the first chamber 34 and the second chamber 35 is connected to the front end module 33, and the other side of the first chamber 34 and the second chamber 35 is connected to the cutting module 36, thereby greatly saving the volume occupied by the integrated system 3 of the semiconductor device, and particularly greatly reducing the overall length thereof.

When a user wants to use the integrated system 3 of the semiconductor device, the user may place a panel to be film-pressed on the first carrying cassette 31 and/or the second carrying cassette 32, and the front end module 33 may be equipped to move the panel placed on the first carrying cassette 31 and/or the second carrying cassette 32 to the first chamber 34 and/or the second chamber 35 for a dry film pressing process. After the dry film is laminated on the panel, the front end module 33 may move the panel laminated with the dry film from the first cavity 34 and/or the second cavity 35 to the first cassette 31 and/or the second cassette 32, and the user may collect the panel laminated with the dry film from the first cassette 31 and/or the second cassette 32. As can be seen from the above, the integrated system 3 of semiconductor device only needs to be equipped with the front-end module 33 to complete the whole film pressing process, so that the cost of the integrated system 3 of semiconductor device can be greatly reduced. In addition, a user may place a panel to be dry-film bonded on the first loading cassette 31 and/or the second loading cassette 32, or may take the dry-film bonded panel from the first loading cassette 31 and/or the second loading cassette 32, so that the overall work flow may be greatly simplified.

As mentioned above, the front end module 33 may move the panel placed on the first carrying cassette 31 and/or the second carrying cassette 32 to the first cavity 34 and/or the second cavity 35 for dry film lamination, and how the first cavity 34 and the second cavity 35 cooperate with the cutting module 36 to complete the dry film lamination process on the panel will be further described below.

Generally, an integrated system uses a front-end module to transfer a panel from a carrying cassette into a laminating module, and then transfers the panel to another carrying cassette by using another front-end module after the laminating of the panel is completed, so that two front-end modules are required, and the panel is required to be placed into the system and the laminated panel is required to be obtained from the system at two ends of the system, so that the system is complicated and requires a larger space to accommodate the system.

Fig. 8 is a schematic diagram of the first chamber 34 and the dicing module 36 of the integrated system 3 of semiconductor equipment according to some embodiments of the present disclosure. As shown in fig. 8, the first chamber 34 has an upper chamber body 341, and the upper chamber body 341 is movable substantially vertically within the first chamber 34. The upper chamber 341 has a bladder contact surface 342, and further, a support 344 for supporting a PE protective film 343 for protecting the bladder contact surface 342. Furthermore, the first chamber 34 has a lower cavity 345, which is movable between the first chamber 34 and the cutting module 36. The lower chamber 345 has a lower tray 346 thereon and a vacuum pumping arrangement 349. When the front end module 33 is equipped to move the panel to be dry film bonded from the first carrying cassette 31 or the second carrying cassette 32 into the first chamber 34, the panel will be placed on the downloading tray 346 of the lower cavity 345; when the panel is placed on the lower tray 346 of the lower chamber 345, the vacuum pumping device 349 is operated to flatly attach the panel to the lower tray 346, thereby reducing the panel from being unnecessarily warped in the following processes.

Referring also to fig. 8, cutting module 36 may have a dry film wheel 361, a cover film wheel 362, a waste film wheel 363, a rotary knife cylinder 365, and a suction film member 367. The dry film 50 can be loaded on the dry film wheel 361, and the dry film 60 has a dry film body 61 and a cover film 62 attached on the dry film body 61; the cover film wheel 362 is used for loading the cover film 62 to be stripped from the dry film 60, the cutter set 365 is used for cutting the dry film body 61 without the cover film 62 attached, the dry film body 61 cut by the cutter set 365 can be loaded by the film sucking member 367, and the waste film 63 cut by the cutter set 365 but not loaded by the film sucking member 367 can be recovered by the waste film wheel 363; in addition, the transmission wheel 3611 is used to assist the dry film 50 to be fed out from the dry film wheel 161, the transmission wheels 3621 and 3622 are used to assist the cover film 62 to be conveyed to the cover film wheel 362, and the transmission wheel 3631 is used to assist the waste film 63 to be conveyed to the waste film wheel 363, as shown in fig. 2, when the dry film 60 passes through the transmission wheel 3622, the dry film body 61 and the cover 652 are separated from each other, wherein the dry film body 61 is continuously conveyed to the cutter set 365, and the cover film 62 is conveyed to the cover film wheel 362. The dry film wheel 361 and the cover film wheel 362 can be regarded as a dry film supplying unit for supplying the dry film 60, and the waste film wheel 363 can be regarded as a waste film recycling unit for recycling the waste film 63, so that the cutting knife set 365 can be regarded as a cutting unit, and particularly, as shown in fig. 8, the cutting unit is disposed between the dry film supplying unit and the waste film recycling unit. Furthermore, the cutting knife set 365 is disposed at the lower side of the dry film body 61 and has a negative pressure device 369; when the cutting blade 365 cuts the dry film body 61, particles generated from the cutting of the dry film body 61 can be directly sucked away by the negative pressure device 369, so that the chance of the particles falling on the dry film body 61 cut by the cutting blade 365 is greatly reduced. In addition, the cutting blade set 365 may be a four-blade cutter (not shown) configured to move two in parallel with each other, so that the cutting blade set 365 can cut the dry film body 61 into a rectangular shape; in addition, the film sucking member 367 can have a plane 368, so that the film sucking member 367 can use the plane 368 to carry the dry film body cut into a rectangular shape by the cutting blade 365; further, when the film sucking member 367 carries the dry film body cut into a rectangular shape by the cutting blade 365 by using the plane 368 thereof, the tension of the cut dry film can be maintained.

Fig. 9A, 9B, 9C, 9D, 9E, and 9F are schematic diagrams illustrating operations of the first chamber 34 and the dicing module 36 of the integrated system 3 of semiconductor equipment according to some embodiments of the present disclosure. Referring to fig. 9A, as mentioned above, the front-end-of-equipment module 33 may move the panel 37 from the first carrying cassette 31 or the second carrying cassette 32 to the first chamber 34, and the panel 37 moved to the first chamber 34 is placed on the loading tray 346 of the lower chamber 345, and at the same time, the vacuum pumping device 349 may flatly adsorb the panel 37 on the loading tray 346. Referring to fig. 9B, after the panel 37 is placed on the download tray 346 of the lower cavity 345, the lower cavity 345 may be moved from the first chamber 34 to a position in the cutting module 36, such that the panel 37 is moved from the first chamber 34 into the cutting module 36; at the same time, the blotting member 367 is positioned at the position of the cutter set 365. Referring to fig. 9C, the dry film wheel 361 starts to rotate to supply the dry film 60 to the cutter set 365 via the conduction wheel 3611, while the coverlay wheel 362 starts to collect the coverlay film 62 stripped from the dry film 60 via the

conduction wheels

3622 and 3621, and the dry film body 61 stripped of the coverlay film 62 is supplied toward the cutter set 365; when the dry film body 61 passes above the cutting blade 365, the cutting blade 365 starts to cut the dry film body 61, and particularly, the cutting blade 365 cuts the dry film body 61 into a rectangular shape. After the dry film body 61 is cut into a rectangular shape by the cutter set 365, the film sucking member 367 can suck the dry film body 61' which has been cut into a rectangular shape, by using the plane 368 thereof. The waste films 63 cut by the cutter 365 but not loaded on the film suction member 367 are loaded and recovered by the waste film wheel 363 via the conduction wheel 3631. In addition, as mentioned above, when the cutting blade 365 cuts the dry film body 61, the negative pressure device 369 is operated to suck particles generated by cutting the dry film body 61, so as to reduce the chance of the particles falling onto the cut dry film body 61'.

As shown in fig. 9D, after the film sucking member 367 loads the cut dry film body 61', the film sucking member 367 moves to the position of the lower cavity 345, and the cut dry film body 61' loaded on the film sucking member 367 is placed on the panel 37 carried by the lower cavity 345. Referring to fig. 9E, after the film sucking member 367 places the cut dry film bodies 61 'on the panel 37 carried by the lower cavity 345, the film sucking member 367, which is not loaded with any dry film bodies 61', may be returned to the original position corresponding to the cutting blade 365.

Subsequently, as shown in fig. 9F, the lower cavity 345 is returned to the first cavity 34, and the panel 37 with the cut dry film body 61' is moved into the first cavity 34, wherein the lower cavity 345 is located substantially below the upper cavity 341. After the lower cavity 345 moves the panel 37 on which the cut dry film body 61' is placed back to the first chamber 34, the inside of the first chamber 34 is evacuated to below 1 torr; after the interior of the first chamber 34 is evacuated to below 1 torr, the upper cavity 341 is moved vertically downward to press the cut dry film body 61' on the panel 37 against the panel 37. In the case that the interior of the first chamber 34 is first evacuated to below 1 torr, air between the panel 37 and the loading tray 346 and between the panel 37 and the dry film body 61' can be completely evacuated, so that the panel 37 can be more flatly attached to the loading tray 346, and the dry film body 61' can be more flatly attached to the panel 37, and when the upper chamber 341 is pressed, unwanted air bubbles can be prevented from being generated between the panel 37 and the dry film body 61 '.

Thereafter, as mentioned above, the dry film body 61' and the panel 37 after being pressed are selectively moved from the first chamber 34 to the first carrying cassette 31 or the second carrying cassette 32 through the front end module 33, and the user can take the panel 37 after the dry film pressing process is completed at the first carrying cassette 31 or the second carrying cassette 32.

As can be understood from the above, the first cavity 34 and the cutting module 36 mainly perform the dry film 60 pressing process on the panel 37, and the first carrying cassette 31, the second carrying cassette 32 and the equipment front module 33 are mainly used for transferring the panel 37 into the first cavity 34 and the cutting module 36 to perform the dry film pressing process and transferring the panel 37 that has completed the dry film pressing process out. Therefore, the elements and structures of the first chamber 34 and the dicing module 36 can be regarded as a device for semiconductor film pasting.

Further, fig. 10 is a schematic view of the second chamber 35 and the dicing module 36 of the integrated system 3 of semiconductor equipment according to some embodiments of the present disclosure. As shown in fig. 10, the second chamber 35 has an upper cavity 351, and the upper cavity 351 is substantially vertically movable within the second chamber 35. The upper chamber 351 has a bladder contact surface 352, and further has a support member 354 for supporting a PE protective film 353 for protecting the bladder contact surface 352. Further, the second chamber 35 has a lower cavity 355 that is movable between the second chamber 35 and the cutting module 36. The lower chamber 355 has a lower tray 356 thereon, and the lower tray 356 has a vacuum pumping device 359. When the front end module 33 is equipped to move the panel to be dry film bonded from the first carrying cassette 31 or the second carrying cassette 32 into the second chamber 35, the panel will be placed on the lower tray 356 of the lower cavity 355; when the panel is placed on the lower tray 356 of the lower chamber 355, the vacuum suction device 359 operates to adhere the panel to the lower tray 356, thereby reducing unwanted warping of the panel during subsequent processing.

In addition, the components and the connection relationship of the cutting module 36 shown in fig. 10 are already shown in the description of fig. 8, and thus are not repeated herein.

Fig. 11A, 11B, 11C, 11D, 11E, 11F are schematic diagrams illustrating operations of the second chamber 35 and the dicing module 36 of the integrated system 3 of semiconductor equipment according to some embodiments of the present disclosure. Referring to fig. 11A, as mentioned above, the front-end module 33 may move the panel 38 from the first carrying cassette 31 or the second carrying cassette 32 to the second chamber 35, and the panel 37 moved to the second chamber 35 is placed on the lower tray 356 of the lower chamber 355, and at the same time, the vacuum device 359 may flatly adhere the panel 38 to the lower tray 356. Referring to fig. 11B, after the panel 38 is placed on the download tray 356 of the lower cavity 355, the lower cavity 355 may be moved from the second chamber 35 to a position in the cutting module 36, such that the panel 38 is moved from the second chamber 35 into the cutting module 36; at the same time, the blotting member 367 is positioned at the position of the cutter set 365. Referring to fig. 11C, the dry film wheel 361 starts to rotate to supply the dry film 60 to the cutter set 365 via the conduction wheel 3611, while the coverlay wheel 362 starts to collect the coverlay film 62 stripped from the dry film 60 via the

conduction wheels

As shown in fig. 11D, after the film sucking member 367 loads the cut dry film body 61', the film sucking member 367 moves to the position of the lower cavity 355, and the cut dry film body 61' loaded on the film sucking member 367 is placed on the panel 38 carried by the lower cavity 355. Referring to fig. 11E, after the film sucking member 367 places the cut dry film body 61 'on the panel 38 carried by the lower cavity 355, the film sucking member 367, which is not loaded with any dry film body 61', may be returned to the position corresponding to the cutter set 365.

Subsequently, as shown in fig. 11F, the lower cavity 355 is returned to the second cavity 35, and the panel 38 with the cut dry film body 61' is moved to the second cavity 35, wherein the lower cavity 355 is located substantially below the upper cavity 351. After the lower cavity 355 moves the panel 36 on which the cut dry film body 61' is placed back to the first cavity 35, the inside of the second cavity 35 is evacuated to below 1 torr; after the interior of the second chamber 35 is evacuated to below 1 torr, the upper cavity 351 moves vertically downward to press the cut dry film body 61' on the panel 38 against the panel 38. In the case that the interior of the second chamber 35 is first evacuated to below 1 torr, the air between the panel 38 and the lower tray 356 and between the panel 38 and the dry film body 61' can be completely evacuated, so that the panel 38 can be more flatly attached to the lower tray 356, and the dry film body 61' can be more flatly attached to the panel 38, and when the upper chamber 351 is pressed, the unwanted air bubbles between the panel 38 and the dry film body 61' can be avoided.

Thereafter, as mentioned above, the dry film body 61' and the panel 38 are moved from the second chamber 35 to the first cassette 31 or the second cassette 32 through the front module 33, and the user can take the panel 38 that has been subjected to the dry film laminating process from the first cassette 31 or the second cassette 32.

As can be understood from the above, the second chamber 35 and the cutting module 36 mainly perform the process of pressing the dry film 60 onto the panel 38, and the first cassette 31, the second cassette 32 and the equipment front module 33 are mainly used for transferring the panel 38 into the second chamber 35 and the cutting module 36 to perform the dry film pressing process and transferring the panel 38 that has completed the dry film pressing process. Therefore, the elements and structures of the second chamber 35 and the dicing module 36 can be regarded as a device for semiconductor film pasting.

Fig. 12 is a film lamination flow diagram 4 of an integrated system 3 using a semiconductor apparatus of some embodiments of the present disclosure. At step 41, the user may place the panel 37 in the first carrying cassette 31 and place the panel 38 in the second carrying cassette 32. At step 42, the equipment front end module 33 may move the panel 37 placed in the cassette of the first carrying cassette 31 into the first chamber 34. At step 33, the lower cavity 345 of the first chamber 34 may move the panel 37 into the cutting module 36 for placing the dry film body on the panel 37. At step 44, the equipment front end module 33 may move the panel 38 placed in the second cassette 32 into the second chamber 35. Step 43 and step 44 may be performed substantially simultaneously. In step 45, the lower cavity 345 can move the panel 37 with the dry film body 61 'placed therein into the first cavity 34, and the upper cavity 341 of the first cavity 34 can perform a pressing operation on the dry film body 61' and the panel 37. At step 46, the lower cavity 355 of the second chamber 35 may move the panel 38 into the cutting module 36 for placing the dry film body 61' on the panel 38. Wherein, step 45 and step 46 can be performed substantially simultaneously. In step 47, the equipment front end module 33 may move the pressed panel 37 from the first chamber 34 into the first cassette of the carrying cassette 31 for the user to take up the pressed panel 37. In step 48, the lower cavity 355 may move the panel 38 with the dry film body 61 'placed therein to the second cavity 35, and the upper cavity 351 of the second cavity 35 may perform a pressing operation on the dry film body 61' and the panel 38. Wherein, step 45 and step 46 can be performed substantially simultaneously. At step 49, the equipment front end module 33 may move the stitched panel 38 from the second chamber 35 into the second cassette 32 for the user to pick up the stitched panel 38.

As can be understood from the film pressing flowchart 4 shown in fig. 12, when the integrated system 3 of the semiconductor device is used to perform the film pressing process, the first chamber 34 and the second chamber 35 can be used to perform the film pressing process in turn without waiting for the panel 37 to complete the film pressing process and then performing the film pressing process on the panel 38; if the panel 37 returns to the first cavity 34 for pressing after the dry film body 61 'is placed on the panel 37 in the cutting module 36 (step 45), the panel 38 is moved from the second cavity 35 to the cutting module to perform the operation procedure of placing the dry film body 61' on the panel 38 (step 46); therefore, the film pressing efficiency of the panel can be greatly improved.

Reference throughout this specification to "some embodiments," "one embodiment," "another example," "an example," "a specific example," or "a partial example" means that a particular feature, structure, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example in this application. Thus, throughout the specification, descriptions appear, for example: "in some embodiments," "in an embodiment," "in one embodiment," "in another example," "in one example," "in a particular example," or "by example," which do not necessarily refer to the same embodiment or example in this application.

As used herein, spatially relative terms, such as "under," "below," "lower," "above," "upper," "lower," "left," "right," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening components may be present.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, the terms can refer to an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. As used herein with respect to a given value or range, the term "about" generally means within ± 10%, ± 5%, ± 1%, or ± 0.5% of the given value or range. Ranges may be expressed herein as from one end point to another end point or between two end points. Unless otherwise specified, all ranges disclosed herein are inclusive of the endpoints. The term "substantially coplanar" may refer to two surfaces located within a few micrometers (μm) along the same plane, e.g., within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm located along the same plane. When referring to "substantially" the same numerical value or property, the term can refer to values that are within ± 10%, ± 5%, ± 1%, or ± 0.5% of the mean of the stated values.

As used herein, the terms "approximately," "substantially," "essentially," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, the terms can refer to an instance in which the event or circumstance occurs precisely as well as an instance in which the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the terms can refer to a range of variation that is less than or equal to ± 10% of the stated numerical value, e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, two numerical values are considered to be "substantially" or "about" the same if the difference between the two numerical values is less than or equal to ± 10% (e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%) of the mean of the values. For example, "substantially" parallel may refer to a range of angular variation of less than or equal to ± 10 ° from 0 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °. For example, "substantially" perpendicular may refer to a range of angular variation of less than or equal to ± 10 ° from 90 °, e.g., less than or equal to ± 5 °, less than or equal to ± 4 °, less than or equal to ± 3 °, less than or equal to ± 2 °, less than or equal to ± 1 °, less than or equal to ± 0.5 °, less than or equal to ± 0.1 °, or less than or equal to ± 0.05 °.

As used herein, the singular terms "a" and "the" may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided "on" or "over" another element may encompass the case where the preceding element is directly on the succeeding element (e.g., in physical contact with the succeeding element), as well as the case where one or more intervening elements are located between the preceding and succeeding elements.

Unless otherwise specified, spatial descriptions such as "above," "below," "upper," "left," "right," "lower," "top," "bottom," "vertical," "level," "side," "above," "below," "upper," "on … …," "under … …," "down," and the like are indicated with respect to the orientation shown in the figures. It is to be understood that the spatial descriptions used herein are for purposes of illustration only and that actual implementations of the structures described herein may be spatially arranged in any orientation or manner provided that the embodiments of the present invention are not biased by such arrangements.

While the present disclosure has been described and illustrated with reference to particular embodiments thereof, such description and illustration are not intended to limit the present disclosure. It will be clearly understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be drawn to scale. There may be a distinction between artistic renditions in the present disclosure and actual equipment due to manufacturing process variables, etc. There may be other embodiments of the disclosure that are not specifically illustrated. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, substance, method or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. Although the methods disclosed herein have been described with reference to particular operations performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations is not a limitation of the present disclosure.

The foregoing outlines features of several embodiments and detailed aspects of the present disclosure. The embodiments described in this disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same or similar purposes and/or obtaining the same or similar advantages of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the present disclosure.

Description of the symbols

1 Integrated System of semiconductor devices

11 first carrying cassette

12 second carrying cassette

13 equip the front end module

14 first chamber

141 upper chamber

142 air bag contact surface

143 PE protective film

145 lower cavity

146 download disk

15 second chamber

151 upper chamber body

152 air bag contact surface

153 PE protective film

155 lower cavity

156 download disk

16 cutting module

161 dry film wheel

1611 conducting wheel

1612 conducting wheel

162 covering film wheel

1621 conducting wheel

163 waste film wheel

1631 conducting wheel

165 hob barrel

167 reception tube

169 negative pressure equipment

17 Panel

18 panel

2 film pressing flow chart

Step 21

22 step

23 step (ii)

24 step

25 step

26 step

27 step

28 step

29 step

3 Integrated System of semiconductor devices

31 first carrying cassette

32 second carrying cassette

33 equipment front end module

34 first chamber

341 upper cavity

342 air bag contact surface

343 PE protective film

345 lower cavity

346 download disk

35 second chamber

351 upper cavity

352 air bag contact surface

353 PE protective film

355 lower cavity

356 download disc

36 cutting module

361 dry film wheel

3611 conducting wheel

362 covering film wheel

3621 conducting wheel

3622 conducting wheel

363 waste film wheel

3631 conducting wheel

365 cutting knife group

367 inhale membrane spare

368 plane

369 negative pressure equipment

37 Panel

38 panel

4 film pressing flow chart

Step 41

Step 42

43 step

44 step

45 step

46 step

Step 47

48 step

Step 49

50 dry film

51 Dry film body

51' Dry film body

52 cover film

53 waste film

60 Dry film

61 Dry film body

61' Dry film body

62 cover film

63 waste film

Claims

1. A film attachment device for a semiconductor apparatus, comprising:

a dry film supply unit for supplying a dry film;

a cutting unit to cut the dry film supplied from the dry film supplying unit;

a first movable cavity for supporting the panel, an

A film suction unit movable between a first position and a second position, wherein the film suction unit collects the dry film cut by the cutting unit at the first position, and wherein the film suction unit places the dry film cut by the cutting unit on the panel supported by the first cavity at the second position.

2. The film laminating apparatus for semiconductor devices according to claim 1, further comprising a waste film recovery unit for loading the dry film cut by the cutting unit but not carried by the film suction unit.

3. The film laminating apparatus for semiconductor devices according to claim 2, wherein said dry film supplying unit comprises a dry film wheel loading said dry film and a cover film wheel loading a cover film stripped from said dry film, and wherein said waste film recovering unit is a waste film wheel.

4. The film laminating apparatus for semiconductor devices according to claim 2, wherein the cutting unit is disposed between the dry film supplying unit and the waste film recovering unit.

5. The film attaching device for semiconductor equipment according to claim 3, wherein the cutting unit is provided at a lower side of the dry film from which the cover film has been removed.

6. The film attaching device for semiconductor equipment according to claim 1, wherein said cutting unit further has a negative pressure device.

7. The film attaching device for semiconductor equipment according to claim 1, further comprising a movable second chamber, wherein said second chamber is movable up and down with respect to said first chamber.

8. The film laminating apparatus for semiconductor devices according to claim 1, wherein the cutting unit is a roller.

9. The film laminating apparatus for semiconductor devices according to claim 8, wherein said film suction unit is a receiving cylinder.

10. The film attaching device for semiconductor equipment according to claim 1, wherein said cutting unit is a cutter group.

11. The film laminating apparatus for semiconductor devices according to claim 10, wherein said cutter group has four blades.

12. The film attaching device for semiconductor equipment according to claim 10, wherein the film suction unit has a flat surface.

13. The film attaching device for semiconductor apparatus according to claim 1, wherein said first chamber has an adsorbing means for adsorbing said panel.

14. The film sticking apparatus for semiconductor devices according to claim 1, further comprising a third movable chamber for supporting a panel, wherein the film sucking unit collects the dry film cut by the cutting unit at the first position, and wherein the film sucking unit places the dry film cut by the cutting unit on the panel supported by the third chamber at the second position.

15. The film attachment apparatus for semiconductor devices as claimed in claim 14, further comprising a movable fourth chamber, wherein the fourth chamber moves up and down with respect to the third chamber.

16. A method of film attachment for a semiconductor device, the method comprising:

providing a dry film;

providing a cutting unit, and cutting the dry film into dry films with preset sizes by using the cutting unit;

providing a film sucking unit which can collect the dry film cut to a predetermined size;

moving the film suction unit to simultaneously carry the dry film cut to a predetermined size; and

and placing the dry film cut to a predetermined size collected by the film suction unit on a panel.

17. The method of claim 16, further comprising pressing the dry film cut to a predetermined size against the panel.

18. The film attaching method of a semiconductor apparatus according to claim 16, wherein the cutting unit cuts the dry film from a lower side of the dry film.

19. An integrated system for fabricating a semiconductor device, comprising:

a first carrying cassette for carrying a panel;

a second carrying cassette for carrying the panel;

an equipment front end module connected with the first carrying cassette and also connected with the second carrying cassette, wherein the equipment front end module can selectively pick up the panel from the first carrying cassette or the second carrying cassette;

a first chamber connected with the equipment front end module;

a second chamber connected with the equipment front end module; and

the cutting module is connected with the first cavity and the second cavity;

wherein the cutting module comprises:

a dry film supply unit for supplying a dry film;

a cutting unit for cutting the dry film supplied from the dry film supplying unit; and

a movable film suction unit which can collect the dry film cut by the cutting unit;

and wherein the first chamber comprises:

a first cavity movable between the cutting module and the first chamber; and

a second chamber movable within the first chamber;

and wherein the second chamber comprises:

a third cavity movable between the cutting module and the second cavity; and

a fourth chamber movable within the second chamber.

20. The integrated system for fabricating semiconductor devices according to claim 19, wherein the cutting unit is a roller or a group of cutting blades.