CN112764315A - Photosensitive composition suitable for no-prebaking process and preparation method thereof - Google Patents
Photosensitive composition suitable for no-prebaking process and preparation method thereof Download PDFInfo
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- CN112764315A CN112764315A CN201911003276.4A CN201911003276A CN112764315A CN 112764315 A CN112764315 A CN 112764315A CN 201911003276 A CN201911003276 A CN 201911003276A CN 112764315 A CN112764315 A CN 112764315A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Abstract
A photosensitive composition suitable for a no-prebaking process comprises an alkali soluble resin, a photosensitive monomer, a photoinitiator and a solvent with a boiling point lower than 200 ℃; the alkali-soluble resin is selected from one or more of acrylic resin and acrylate resin, the acid value of the alkali-soluble resin is 50-180 mg KOH/g, the weight-average molecular weight is 2000-20000, and the double bond equivalent of at least one alkali-soluble resin is 400-800 g/mol; the usage of the alkali-soluble resin is 100 parts by weight, the usage of the photosensitive monomer is 50-400 parts by weight, and the usage of the photoinitiator is 3-9% of the total weight of the alkali-soluble resin and the photosensitive monomer. The photosensitive composition can be cured to form a photoresist film with good performance without a pre-baking process, and can be used as a color photoresist so as to prepare a color filter with good performance.
Description
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a photosensitive composition suitable for a no-prebaking process, a color filter and a preparation method thereof.
Background
The color filter is used as an important component of a liquid crystal display, the performance of the color filter directly affects the display effect of the liquid crystal display, generally, a color photoresist composition is used for gluing, vacuum drying (VCD) + prebaking (hereinafter referred to as 'HP'), exposing, developing and postbaking on a glass substrate, so as to prepare the color filter, and the specific process is shown in figure 1, wherein the vacuum drying is to volatilize a solvent by reducing pressure in a closed environment, high-temperature heating is not needed, and the energy consumption is low; the pre-baking is to evaporate the solvent at a high temperature (generally 80 to 150 ℃) and to improve the adhesion and uniformity of the composition on the substrate, and the solvent has a low flash point, which is dangerous.
Commonly used color photoresist compositions are mainly formed by dispersing pigments (pigments), resins (binders), monomers (monomers), photoinitiators (photo initiators) and other auxiliaries in a solvent. When HP is performed by coating the color photoresist on a glass substrate, there are several disadvantages: 1. the energy consumption is high; 2. the working time is long; 3. in the HP process, the temperature of the solvent in the photoresist on the surface of the substrate is high, and the volatile solvent and air form an explosive mixture, so that potential safety hazards exist; 4. in the HP process, the solvent is volatilized, and the odor is pungent, so that the physical health of staff is possibly influenced.
Disclosure of Invention
Problems to be solved by the invention
However, most of the conventional color photoresists need to be pre-baked to remove most of the solvent before the crosslinking reaction can be performed, so a photosensitive composition needs to be found, which can be cured without pre-baking (HP) to form a photoresist film with good performance, and can be used as a color photoresist to prepare a color filter with good performance.
Means for solving the problems
In order to solve the above-mentioned problems in the prior art, the inventors have made intensive studies and found that by selecting an appropriate kind and amount of the composition in the photosensitive composition, the crosslinking reaction proceeds well even without the pre-baking process, and the performance of the optical filter obtained therefrom substantially coincides with that of the optical filter including the pre-baking process.
Specifically, one of the objects of the present invention is to provide a photosensitive composition suitable for a no-bake process, characterized in that the photosensitive composition comprises an alkali-soluble resin, a photosensitive monomer, a photoinitiator, and a solvent having a boiling point of less than 200 ℃; the alkali-soluble resin is selected from one or more of acrylic resin and acrylate resin, the acid value of the alkali-soluble resin is 50-180 mg KOH/g, the weight-average molecular weight is 2000-20000, and the double bond equivalent of at least one alkali-soluble resin is 400-800 g/mol; the usage of the alkali-soluble resin is 100 parts by weight, the usage of the photosensitive monomer is 50-400 parts by weight, and the usage of the photoinitiator is 3-9% of the total weight of the alkali-soluble resin and the photosensitive monomer.
According to the invention, acrylic resin and/or acrylate resin with acid value, weight average molecular weight and double bond equivalent in a specific range is selected as alkali-soluble resin, and a photoinitiator with a specific dosage and a solvent with a low boiling point are selected, so that the photosensitive composition can be well crosslinked without a pre-baking process, the good performance of a cured photoresist film is ensured, and the high pattern integrity and good taper of the photoresist film are ensured. The principle is not clear, and it is presumed that the key point is the use of a specific alkali-soluble resin in a specific amount in combination with a specific photoinitiator and a solvent having a specific boiling point. Under the synergistic effect of the above-mentioned several factors, the goal of said invention can be implemented. In other words, none of the above factors is sufficient.
In the present specification, "acrylic resin" refers to a polymer having an acrylic structure, and "acrylate resin" refers to a polymer having an acrylate structure having a carboxyl group, wherein "acrylic" includes one or both of acrylic acid and methacrylic acid, and similarly, "acrylate" includes one or both of acrylate and methacrylate.
In the above-mentioned photosensitive composition of the present invention, the alkali-soluble resin may specifically be one or more of methacrylic resin, silicone-modified acrylate resin, epoxy acrylate resin, urethane acrylate resin, polyester acrylate resin, polyether acrylate resin, polypropylene acrylate resin, and the like.
In the above-mentioned photosensitive composition of the invention, the acid value of the alkali-soluble resin is controlled within the above-mentioned suitable range, which can ensure the developing performance of the photosensitive composition, if the acid value is less than 50mg KOH/g, it is not favorable for development, residual film occurs, resulting in too high line width and poor taper morphology, and if the acid value is more than 180mg KOH/g, the weight average molecular weight of the resin is too low, and the matching of the alkali-soluble resin with other components is deteriorated, resulting in the decrease of the stability of the photosensitive composition, and the line width is too narrow and the taper morphology is also deteriorated. The weight average molecular weight and double bond equivalent of the alkali soluble resin can be controlled within the proper range to ensure the progress of crosslinking reaction, which is beneficial to improving the uniform distribution of the composition and curing to form a film with good performance, if the double bond equivalent is too high, the crosslinking degree of the photosensitive composition is insufficient, the taper angle and line width after postbaking can not meet the process requirements, if the double bond equivalent is too low, the crosslinking degree is too high and is not easy to develop, and the solubility with other components is poor, so that the uniformity of the composition is poor. Specifically, the weight average molecular weight of the alkali-soluble resin may be 2500, 3000, 4000, 5000, 6000, 7000, 8000, 9000, 10000, 11000, 12000, 13000, 14000, 15000, 16000, 17000, 18000, 19000, 19500, or the like, for example. In the above-mentioned photosensitive composition of the present invention, the double bond equivalent of at least one alkali-soluble resin is preferably 600g/mol to 800 g/mol.
In the above-mentioned photosensitive composition of the present invention, the content of the benzene ring in the alkali-soluble resin is preferably 7 to 18% by weight, and the benzene ring is contained in a specific content to facilitate the close bonding of the resin and the pigment.
In the photosensitive composition of the present invention, the photosensitive composition preferably does not contain a dispersant. The inventors of the present invention have also found that, in addition to the excellent crosslinking of the photosensitive composition without the prebaking process, the pigment or dye can be uniformly dispersed therein without adding a dispersant under the synergistic effect of the above-mentioned several factors. Therefore, the photosensitive composition of the present invention preferably contains no dispersant from the viewpoint of cost saving and environmental protection. The dispersant used in the present invention is different from the solvent described later, and refers to a substance that disperses a pigment or a dye but does not dissolve in the system, and for example, a polymer dispersant having a functional group, preferably having a carboxyl group, a phosphoric acid group, a sulfonic acid group, or a basic form thereof; primary, secondary or tertiary amino groups; quaternary ammonium salt groups; and a polymer dispersant derived from a functional group such as a nitrogen-containing heterocyclic group such as pyridine, pyrimidine, or pyrazine. In addition, commercially available pigments and dyes are generally self-contained with small amounts of dispersants in order to maintain stable properties. Therefore, strictly speaking, when the dispersant-free photosensitive composition of the present invention is used, the final mixture may contain a small amount of a dispersant derived from a pigment or a dye; under the synergistic effect of the above factors, the pigment or dye can be uniformly dispersed even without adding a dispersant additionally.
In the photosensitive composition of the present invention, the photosensitive monomer may be a monomer having an unsaturated double bond, preferably an acrylate having an unsaturated double bond, and specifically, may be one or more of 3- (trimethoxysilane) propyl acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, benzyl methacrylate, dipentaerythritol hexaacrylate, trimethylolpropane triacrylate, and the like. The amount of the photosensitive monomer is preferably 200 to 300 parts by weight, and the amount of the photosensitive monomer is controlled within the above-specified range to ensure that a line width and a taper angle satisfying the process requirements are obtained.
In the above-mentioned photosensitive composition of the invention, the photoinitiator may be a cleavage radical type photoinitiator and/or a cationic type photoinitiator, and is, for example, one or more of a benzoyl type photoinitiator, benzoin and derivative photoinitiators, an alkylbenzene type photoinitiator, an acylphosphorus oxide photoinitiator, a benzophenone type photoinitiator, a thioxanthone type photoinitiator, a ketoxime ester type photoinitiator, an alkyl iodonium salt photoinitiator, and a cumeneferrocenium hexafluorophosphate photoinitiator, preferably 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, 4' -bis (diethylamino) benzophenone, 1- (6-O-methylbenzoyl-9-ethyl-9. H. -carbazol-3 yl) -ethanone oxime-O-acetate and 2, one or more of 4, 6-trimethylbenzoylphenylphosphonic acid ethyl ester. The photoinitiator is preferably used in an amount of 3 to 6% by weight based on the total weight of the alkali-soluble resin and the photosensitive monomer.
In the above-mentioned photosensitive composition of the present invention, the boiling point of the solvent is less than 200 ℃ to ensure that most of the solvent is removed at the time of vacuum drying, and the kind and amount are not particularly limited as long as the components of the photosensitive composition can be dissolved therein, and specific examples include, but are not limited to, one or more of propylene glycol methyl ether acetate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, dipropylene glycol methyl ether, ethylene glycol ethyl ether, propylene glycol methyl ether, cyclohexane, cyclohexanone, and the like, and the amount is preferably 500 to 1700 parts by weight.
In the photosensitive composition of the present invention, in order to increase the coating effect and the film forming quality of the photosensitive composition, some additives may be added, and the additives may be one or more of a sensitizer, a defoamer, a leveling agent, a coupling agent and a surfactant, and may be selected from the types and amounts of additives known to those skilled in the art.
The second purpose of the present invention is to provide a color photoresist, which is characterized in that the color photoresist comprises the photosensitive composition and a pigment or dye, and the amount of the pigment or dye is 100 parts by weight to 600 parts by weight, preferably 300 parts by weight to 500 parts by weight, relative to 100 parts by weight of alkali soluble resin, so that the photosensitive composition can meet the chromaticity requirement of the color filter, wherein the pigment is selected from one or more of red pigment, green pigment, blue pigment, yellow pigment and orange pigment, and can be inorganic pigment or organic pigment, and specifically, the types and the contents of the pigments known to those skilled in the art can be selected.
The invention also provides a color filter, which comprises a substrate and a photoresist film formed on the substrate, and is characterized in that the photoresist film is formed by curing the color photoresist, and the color filter can be applied to a liquid crystal display.
More specifically, the material of the substrate is not particularly limited, and a transparent substrate is mainly used, and examples thereof include polyester resins such as polyethylene terephthalate, thermoplastic resins such as polycarbonate and polymethyl methacrylate, thermosetting resins such as epoxy resins and poly (meth) acrylic resins, and various types of glass, and a glass substrate having heat resistance is preferable.
The invention also provides a preparation method of the color filter, which is characterized by comprising the following steps: coating the color photoresist on a substrate; and carrying out vacuum drying (VCD), exposure, development and baking on the color photoresist, and curing on the substrate to form a photoresist film. In this case, the resist film can be cured without a pre-baking process to form a resist film having good properties.
More specifically, the color photoresist may be coated on the substrate by a coating method known to those skilled in the art, such as spin coating, wire bar method, flow coating, die method, roll coating, spray coating. The amount of coating is determined by the desired film thickness after vacuum drying, and the film thickness may be, for example, 0.5 to 5 μm, preferably 1 to 3 μm, and more preferably 1.5 to 2.3 μm.
More specifically, in the present invention, vacuum drying, exposure, development and baking can be performed by any means conventional in the art: most of the solvent can be quickly removed by vacuum drying, and the drying can be finished in conventional equipment such as a vacuum drying oven and the like; then, a mask (photomask) is adopted to expose a specific part area of the color adhesive film through ultraviolet irradiation, and the exposed area is subjected to cross-linking polymerization reaction to form a polymerization network structure due to the fact that the photoinitiator induces the monomer, and is reserved in subsequent alkali liquor development; the developer used may be, for example, a developer comprising potassium hydroxide, sodium carbonate or sodium bicarbonate; the remaining pattern is cleaned and post-baked to obtain a color filter, and the post-baking temperature may be 230 ℃.
Effects of the invention
The invention selects the acrylic resin and/or acrylate resin with specific acid value, double bond equivalent weight and weight average molecular weight as alkali soluble resin, and matches with proper photoinitiator and low boiling point solvent, so that the photosensitive composition can well generate crosslinking reaction without pre-baking process, and can be applied to the color filter to ensure good performance of the filter.
Drawings
FIG. 1 is a flow chart of a prior art process for fabricating a color filter;
FIG. 2 is a graph comparing the topography of the taper of the inventive example and the comparative example.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention. In the following examples and comparative examples, temperatures are given in degrees celsius, parts are taken to account for percentages by weight, unless otherwise indicated.
Comparative example 1
100 parts by weight of an alkali-soluble resin SGAB-200 (having a double bond equivalent of 900) (SMS company), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC company), a photoinitiator OXE-01(Basf company) having a monomer resin solid content of 4%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol methyl ether acetate (boiling point 145 ℃ C.) (Dow company) as a solvent, and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available) were taken to obtain a photosensitive composition D1 of a comparative example.
Comparative example 2
100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS company), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC company), a photoinitiator OXE-01(Basf company) having a monomer resin solid content of 2%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol methyl ether acetate (boiling point 145 ℃ C.) (Dow company), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available) were taken to obtain a photosensitive composition D2 of a comparative example.
Comparative example 3
100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS company), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC company), a photoinitiator OXE-01(Basf company) having a monomer resin solid content of 4%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of solvent diethylene glycol butyl ether acetate (boiling point 245 ℃ C.) (Dow company), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available) were taken to obtain a photosensitive composition D3 of a comparative example.
Example 1
The photosensitive composition B1 of this example was obtained by using 100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS company), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC company), a photoinitiator OXE-01(Basf company) having a monomer resin solid content of 3.5%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol monomethyl ether acetate (boiling point 145 ℃ C.) (Dow company), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available).
Example 2
The photosensitive composition B2 of this example was obtained by using 100 parts by weight of an alkali-soluble resin SGAB-100 (double bond equivalent: 730) (SMS Co.), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC Co.), a photoinitiator OXE-01(Basf Co.) having a monomer resin solid content of 3.5%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol monomethyl ether acetate (boiling point: 145 ℃ C.) (Dow Co.), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available).
Example 3
The photosensitive composition B3 of this example was obtained by using 100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS company), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical), 300 parts by weight of G36+ Y156 pigment (DIC company), a photoinitiator OXE-01(Basf company) having a monomer resin solid content of 8.5%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol monomethyl ether acetate (boiling point 145 ℃ C.) (Dow company), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available).
Example 4
A photosensitive composition B4 of this example was obtained by using 100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS Co.), 200 parts by weight of dipentaerythritol hexaacrylate (Changxing chemical Co.), 300 parts by weight of a G36+ Y156 pigment (DIC Co.), a photoinitiator OXE-01(Basf Co.) having a monomer resin solid content of 3.5%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of a solvent 3-methoxybutyl acetate (boiling point 172 ℃ C.) (Dow Co.), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available).
Example 5
The photosensitive composition B5 of this example was obtained by using 100 parts by weight of an alkali-soluble resin SGAB-300 (having a double bond equivalent of 600) (SMS Co.), 200 parts by weight of trimethylolpropane triacrylate (Changxing chemical Co.), 300 parts by weight of G36+ Y156 pigment (DIC Co.), a photoinitiator OXE-01(Basf Co.) having a monomer resin solid content of 3.5%, 2 parts by weight of a leveling agent (commercially available), 500 parts by weight of propylene glycol monomethyl ether acetate (boiling point 145 ℃ C.) (Dow Co.), and 3 parts by weight of a silane coupling agent OFS-6030 (commercially available).
Test examples 1 to 5 and test comparative examples 1 to 3
First, a glass substrate is prepared, and the surface of the glass substrate is cleaned by deionized water. Then, the photosensitive compositions of comparative examples 1 to 3 and examples 1 to 5 were uniformly coated on the surface of the glass substrate by spin coating, respectively, and vacuum-dried at 22 ℃ for 55S; using 50mJ/cm2The exposure was carried out and developed for 55s in a sodium bicarbonate developer. And post-baking at 230 ℃ for 20min, and inspecting the pattern integrity and line width after post-baking, wherein the inspection results are shown in the following table 1 and fig. 2.
TABLE 1 Effect of variables on Photoresist Performance
As can be seen from the results of Table 1 and FIG. 2, the photosensitive compositions of examples 1 to 4 of the present invention, compared to comparative examples 1 to 3, can obtain a line width (here, more than 100 μm) and a taper angle satisfying the process requirements after the photolithography process without the pre-bake, and ensure the integrity of the pattern. The principle is not clear, but the following is presumed: when the double bond equivalent of the alkali-soluble resin is too high or the dosage of the photoinitiator is too low, the crosslinking reaction is not facilitated, so that the development effect is poor, and the adverse effects of line width reduction and taper angle increase are caused; when the boiling point of the solvent is too high, the content of the solvent is too high during development on the premise of not containing prebaking, and the development process cannot be completed.
Test example 6
The photosensitive composition of example 1 was subjected to the similar operation as in test example 1 except that an HP process was further included after vacuum drying and before exposure, under the condition of prebaking (HP) at 90 ℃ for 90s, and pattern integrity and line width after the postbaking were examined, and the results of the examination are shown in table 2 and fig. 2 below.
TABLE 2 Photoresist Performance with or without HP Process
As can be seen from the results of table 2 and fig. 2, although the line width obtained after the photo-lithography process without pre-baking of the photosensitive composition of example 1 was slightly lower than that obtained after the photo-lithography process with pre-baking, the line width was high, which is not the main criterion for judging the good performance of the photo-resist composition, it can be seen that the taper angle obtained after the photo-lithography process without pre-baking and the taper angle obtained after the photo-lithography process with pre-baking are substantially identical, and the pattern is complete, which has been sufficient to show that the photosensitive composition of the present invention is suitable for the photo-lithography process without pre-baking.
In addition, through energy consumption tests, the inventors found that the photo-etching process period without pre-baking (except post-baking) of the photosensitive composition B1 is 200s, the photo-etching process period with pre-baking (except post-baking) is 290s, and the added pre-baking process additionally generates the energy consumption of 0.25kW/h, so that the photosensitive composition of the invention has the advantages of simplifying the process and saving the energy consumption under the condition of not influencing the product performance when being used for the photo-etching process without pre-baking.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (11)
1. A photosensitive composition suitable for a no-bake process, comprising an alkali-soluble resin, a photosensitive monomer, a photoinitiator, and a solvent having a boiling point of less than 200 ℃;
wherein the alkali-soluble resin is selected from one or more of acrylic resin and acrylate resin, the acid value of the alkali-soluble resin is 50-180 mg KOH/g, the weight average molecular weight is 2000-20000, and the double bond equivalent of at least one alkali-soluble resin is 400-800 g/mol;
the alkali soluble resin is used in an amount of 100 parts by weight,
the dosage of the photosensitive monomer is 50 to 400 parts by weight,
the dosage of the photoinitiator is 3-9% of the total weight of the alkali-soluble resin and the photosensitive monomer.
2. The photosensitive composition according to claim 1, wherein the double bond equivalent of at least one alkali-soluble resin is 600 to 800g/mol, the photosensitive monomer is used in an amount of 200 to 300 parts by weight, and the photoinitiator is used in an amount of 3 to 6% by weight based on the total weight of the alkali-soluble resin and the photosensitive monomer.
3. The photosensitive composition according to claim 1, wherein the photosensitive composition contains no dispersant.
4. The photosensitive composition according to claim 1, wherein the photosensitive monomer is a monomer having an unsaturated double bond, preferably an acrylate having an unsaturated double bond, more preferably one or more selected from the group consisting of 3- (trimethoxysilane) propyl acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, benzyl methacrylate, dipentaerythritol hexaacrylate, and trimethylolpropane triacrylate.
5. The photosensitive composition according to claim 1, wherein the photoinitiator is a cleavage radical type photoinitiator and/or a cationic type photoinitiator, preferably one or more selected from the group consisting of benzoyl type photoinitiators, benzoin and derivatives photoinitiators, alkylbenzophenone type photoinitiators, acylphosphorus oxide photoinitiators, benzophenone type photoinitiators, thioxanthone type photoinitiators, ketoxime ester photoinitiators, alkyliodonium salt photoinitiators and cumenene iron hexafluorophosphate photoinitiators, more preferably selected from the group consisting of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone, 4' -bis (diethylamino) benzophenone, 1- (6-O-methylbenzoyl-9-ethyl-9. H. -carbazol-3 yl) -ethanone oxime-O-acetate and 2, one or more of 4, 6-trimethylbenzoylphenylphosphonic acid ethyl ester.
6. The photosensitive composition according to claim 1, wherein the solvent is one or more selected from propylene glycol methyl ether acetate, ethyl 3-ethoxypropionate, 3-methoxybutyl acetate, dipropylene glycol methyl ether, ethylene glycol ethyl ether, propylene glycol methyl ether, cyclohexane, and cyclohexanone; wherein the amount of the solvent is 500 to 1700 parts by weight based on 100 parts by weight of the alkali-soluble resin.
7. The photosensitive composition according to claim 1, further comprising an additive selected from one or more of a sensitizer, an antifoaming agent, a leveling agent, a coupling agent, and a surfactant.
8. Use of the photosensitive composition according to any one of claims 1 to 7 in a color filter.
9. A color photoresist comprising the photosensitive composition of any one of claims 1 to 7 and a pigment or dye, wherein the pigment or dye is used in an amount of 100 to 600 parts by weight, preferably 300 to 500 parts by weight, based on 100 parts by weight of the alkali-soluble resin, and wherein the pigment is one or more selected from the group consisting of a red pigment, a green pigment, a blue pigment, a yellow pigment and an orange pigment.
10. A color filter comprising a substrate and a resist film formed on the substrate, wherein the resist film is formed by curing the color photoresist of claim 9.
11. The preparation method of the color filter is characterized by comprising the following steps of:
coating the color photoresist of claim 9 on a substrate;
and carrying out vacuum drying, exposure, development and baking on the color photoresist, and curing on the substrate to form a photoresist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911003276.4A CN112764315A (en) | 2019-10-21 | 2019-10-21 | Photosensitive composition suitable for no-prebaking process and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114736550A (en) * | 2022-04-11 | 2022-07-12 | Tcl华星光电技术有限公司 | Composition, COA display panel, liquid crystal display device and display panel preparation method |
| CN115637060A (en) * | 2021-07-19 | 2023-01-24 | 三星Sdi株式会社 | Pigment dispersion, photosensitive resin composition comprising same, photosensitive resin layer, color filter, and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115637060A (en) * | 2021-07-19 | 2023-01-24 | 三星Sdi株式会社 | Pigment dispersion, photosensitive resin composition comprising same, photosensitive resin layer, color filter, and display device |
| CN114736550A (en) * | 2022-04-11 | 2022-07-12 | Tcl华星光电技术有限公司 | Composition, COA display panel, liquid crystal display device and display panel preparation method |
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