CN112736656A - Negative ion generating device - Google Patents
Negative ion generating device Download PDFInfo
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- CN112736656A CN112736656A CN202011561152.0A CN202011561152A CN112736656A CN 112736656 A CN112736656 A CN 112736656A CN 202011561152 A CN202011561152 A CN 202011561152A CN 112736656 A CN112736656 A CN 112736656A
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- groove
- negative ion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T23/00—Apparatus for generating ions to be introduced into non-enclosed gases, e.g. into the atmosphere
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/20—Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
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Abstract
The invention relates to the technical field of negative ions and provides a negative ion generating device which comprises a first groove; the ceramic substrate is fixed in the first groove; the ceramic substrate comprises a high-voltage negative ion coating discharge area, a positive high-voltage negative ion coating contact electrode and a negative high-voltage negative ion coating contact electrode; the discharge needle is connected with the negative high-voltage negative ion coating contact electrode; the first spring is connected with the positive high-voltage wire, one end of the first spring is pressed against the positive high-voltage negative ion coating contact electrode, and the other end of the first spring is pressed against the bottom of the first groove; and the second spring is connected with the negative high-voltage wire, one end of the second spring is abutted against the negative high-voltage negative ion coating contact electrode, and the other end of the second spring is abutted against the bottom of the first groove. According to the invention, the first spring and the second spring are arranged in the first groove to fix the ceramic substrate, so that the ceramic substrate is not easy to displace and stably generates negative ions, and the first spring and the second spring are used as conductive media to communicate the ceramic substrate and a high-voltage wire.
Description
Technical Field
The invention relates to the technical field of negative ions, in particular to a negative ion generating device.
Background
The negative ion generating device is a device that generates negative ions by ionizing air with high voltage. The negative ion pair can eliminate micro particles suspended in the environment and has good purifying and cleaning effects.
The anion generating device is widely applied due to good purifying and cleaning effects, and is widely applied to refrigerators, air conditioners, air purifiers, automobiles and the like.
In the prior art, the negative ion generating device comprises a housing and a negative ion generating device body, wherein the housing is integrally formed. Because the shell is in an integrally formed state, the negative ion generating device body is inconvenient to install in the shell, and the negative ion generating device body is difficult to accurately and quickly install in the corresponding position in the shell. After the negative ion generating device body is installed in the shell, the negative ion generating device body is required to be adjusted to a certain degree, and then the negative ion generating device can be installed at a correct position. The integrally formed housing brings inconvenience to the adjustment of the negative ion generating device body.
In the prior art, an anion generating device has a housing and an anion generating device body. The negative ion generating device body is a component for generating negative ions. And the back is installed on anion generating device to the anion generating device body, the anion generating device body is not hard up easily, leads to the anion to produce the effect not good, is unfavorable for anion generating device to use for a long time.
Disclosure of Invention
The invention aims to overcome the defect that the negative ion generating device body in the prior art is easy to loosen to cause poor negative ion generating effect, and provides the negative ion generating device, so that the negative ion generating device can stably generate negative ions, the production cost is reduced, and the long-term use of the negative ion generating device is facilitated.
The invention adopts the technical scheme that the negative ion generating device comprises a positive high-voltage wire, a negative high-voltage wire and an upper cover, wherein a first connecting part extending downwards is arranged on the outer side of the upper cover; the lower cover comprises a first groove and a second connecting part arranged on the outer wall of the first groove; the ceramic substrate is fixed in the first groove and is in insulation connection with the upper cover and the lower cover; the ceramic substrate comprises a high-voltage negative ion coating discharge area, a positive high-voltage negative ion coating contact electrode and a negative high-voltage negative ion coating contact electrode, wherein the positive high-voltage negative ion coating contact electrode and the negative high-voltage negative ion coating contact electrode are connected with the high-voltage negative ion coating discharge area; the discharge needle is connected with the negative high-voltage negative ion coating contact electrode; the first spring is connected with the positive high-voltage wire, one end of the first spring is pressed against the positive high-voltage negative ion coating contact electrode, and the other end of the first spring is pressed against the bottom of the first groove; the second spring is connected with the negative high-voltage wire, one end of the second spring is pressed against the negative high-voltage negative ion coating contact electrode, and the other end of the second spring is pressed against the bottom of the first groove; the first connecting part is detachably connected with the second connecting part, and the upper cover and the lower cover enclose a space for forming the ceramic substrate and the discharge needles; the discharge needles and the discharge area of the high-voltage negative ion coating form a strong electric field so as to generate negative ion groups through a corona effect.
The elastic force of the first spring and the elastic force of the second spring are utilized to press the ceramic substrate, so that the ceramic substrate is stably fixed in the first groove. Compared with the prior art, the ceramic substrate is not easy to displace, so that negative ions can be stably generated, and the long-term use of the negative ion generating device is facilitated.
The positive high-voltage wire is conducted to the positive high-voltage negative ion coating contact electrode through the first spring, and the positive high-voltage negative ion coating contact electrode is conducted to the high-voltage negative ion coating discharge area; the negative high-voltage wire is electrically conducted to the negative high-voltage negative ion coating contact electrode through the second spring, and the negative high-voltage negative ion coating contact electrode is electrically conducted to the discharge needle. The discharge needles and the discharge area of the high-voltage negative ion coating form a strong electric field so as to generate negative ion groups through a corona effect.
In summary, the first spring and the second spring can play a role of a conductive medium besides the role of stabilizing the ceramic substrate, so that the purpose of one object for multiple purposes is achieved, the design is greatly simplified, the miniaturization of the negative ion generating device is facilitated, and the production cost can be reduced.
The first connecting portion and the second connecting portion are detachably connected, namely, the ceramic substrate can be quickly and conveniently adjusted in the process of being mounted, so that the ceramic substrate can be mounted in the correct position in the first groove.
Preferably, the upper cover is provided with a second groove, and the outer walls of two sides of the second groove are provided with the first connecting parts; the outer walls of two sides of the first groove are provided with the second connecting parts, and the second connecting parts correspond to the first connecting parts. In this scheme, the upper cover passes through the second recess, so that ceramic substrate with certain distance has between the upper cover, makes the anion that ceramic substrate produced has sufficient release space, so that the anion spreads out.
Preferably, the side wall of the first connecting part is provided with a clamping hole, the second connecting part is a protrusion, and the protrusion is clamped in the clamping hole. In this scheme, utilize card hole and bellied matching, so that anion generating device's upper cover and lower cover can dismantle the connection, and is simple and convenient. Compared with the technical means that the upper cover is connected with the lower cover by utilizing fasteners such as bolts, screws and the like in the prior art, the scheme directly utilizes the clamping holes and the bulges to save cost and install more quickly.
Preferably, four clamping holes are formed in the second groove and are symmetrically distributed on the outer walls of the two sides of the second groove; the number of the protrusions is four, and the protrusions are symmetrically distributed on the outer walls of the two sides of the first groove. This scheme so sets up, can make the upper cover with the lower cover is connected stably, and wherein when the second recess is with arbitrary card hole of one side or when arbitrary protruding damage of one side of first recess, anion generating device still can the steady operation, is favorable to anion generating device's long-term use.
Preferably, a pressing column is arranged in the second groove and abuts against the ceramic substrate, so that the ceramic substrate is stable. In this scheme, the upper cover presses the ceramic substrate by arranging the pressing column in the second groove to offset the pressure exerted on the ceramic substrate by the first spring and the second spring, so that the ceramic substrate is stable.
Preferably, the inner side wall of the first groove is provided with a limiting structure, a gap is formed between the limiting structure and the bottom of the first groove, and the ceramic substrate is clamped in the gap. The position of the ceramic substrate in the first groove is limited through the gap, and the ceramic substrate can be accurately and quickly pressed to the bottom of the limiting structure by adopting the technical means of the first spring and the second spring.
Preferably, the bottom of the first groove is provided with a first mounting groove and a second mounting groove, and the first mounting groove and the second mounting groove accommodate the first spring and the second spring, respectively. In the scheme, the first spring and the second spring are respectively installed in the first installation groove and the second installation groove, so that the first spring and the second spring can be prevented from displacing in the first groove; simultaneously, first spring with the second spring can find corresponding mounted position rapidly, improves the installation effectiveness.
Preferably, a first insulating material layer is arranged between the positive high-voltage negative ion coating material contact electrode and the negative high-voltage negative ion coating material contact electrode. The arrangement of the scheme can prevent the phenomenon of arc discharge and avoid damage to the negative ion generating device.
Preferably, the outer surface of the spring is provided with a second layer of insulating material. The arrangement of the scheme can prevent the phenomenon of arc discharge and avoid damage to the negative ion generating device.
Preferably, the ceramic substrate is provided with third grooves, and two high-voltage negative ion coating discharge areas are arranged and are respectively positioned on two sides of the third grooves; the discharge needle is positioned between the two high-voltage negative ion coating discharge areas and welded on the ceramic substrate. This scheme so sets up, can make all have the air in 360 degrees around the discharge needle to discharge with high-pressure anion coating discharge area and produce a great amount of anions.
Compared with the prior art, the invention has the beneficial effects that: the ceramic substrate is protected by the upper cover and the lower cover; the ceramic substrate is fixed by the first spring and the second spring in the first groove, so that the ceramic substrate is not easy to displace and stably generates negative ions, and the first spring and the second spring are used as conductive media to be communicated with the ceramic substrate and a high-voltage wire, so that the purpose of one object for multiple purposes is achieved. The invention also improves the upper cover, the lower cover, the ceramic substrate and the connection relation thereof, so as to achieve the purposes of quick installation and stable ceramic substrate.
Drawings
FIG. 1 is a block diagram of the present invention.
Fig. 2 is a diagram of the present invention in an exploded view.
Fig. 3 is an exploded view of the present invention.
Fig. 4 is a structural view of the upper cover 1.
Fig. 5 is a structural view of the lower cover 2.
FIG. 6 is a cross-sectional view of a portion of the structure of the present invention.
Fig. 7 is a structural view of the ceramic substrate 3.
Reference numerals: the high-voltage negative ion coating discharge device comprises an upper cover 1, a second groove 11, a first connecting portion 12, a clamping hole 121, a compression column 13, a first middle plate 14, a first side plate 15, a second side plate 16, a lower cover 2, a first groove 21, a limiting structure 211, a first mounting groove 212, a second mounting groove 213, a second connecting portion 22, a first mounting hole 23, a second mounting hole 24, a first through hole 241, a second through hole 242, a second middle plate 25, a third side plate 26, a first baffle 261, a second baffle 262, a third baffle 263, a fourth side plate 27, a bearing structure 28, a filling groove 29, a ceramic substrate 3, a high-voltage negative ion coating discharge area 31, a positive high-voltage negative ion coating contact electrode 32, a negative high-voltage negative ion coating contact electrode 33, a first insulating material layer 34, a third groove 35, a welding disc 36, a discharge needle 4, a first spring 51, a second spring 52, a positive high-voltage wire 61 and a negative high-voltage wire 62.
Detailed Description
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1 and 2, the present embodiment provides a negative ion generating device, which includes an upper cover 1, a lower cover 2, a ceramic substrate 3, a discharge needle 4, a first spring 51, a second spring 52, a positive high voltage line 61, and a negative high voltage line 62.
As shown in fig. 3, in order to facilitate understanding of the negative ion generating apparatus according to the embodiment of the present application, the negative ion generating apparatus will be first described. The anion generating device has the functions of sterilization, purification and cleaning, and can be applied to the fields of refrigerators, air conditioners, air purifiers, automobiles and the like. The upper cover 1 and the lower cover 2 together enclose a space for accommodating and protecting the ceramic substrate 3. The ceramic substrate 3 is mounted in a first recess 21 provided in the lower cover 2. In order to make the ceramic substrate 3 less likely to be displaced, the first spring 51 and the second spring 52 are pressed against the lower surface of the ceramic substrate 3 by elastic force. The discharge needles 4 are fixed to the ceramic substrate 3. Since the ceramic substrate 3 is provided with positive and negative electrodes on the lower surface thereof, the first and second springs 51 and 52 serve as conductive media to connect the positive and negative high- voltage lines 61 and 62 to the positive and negative electrodes of the ceramic substrate 3, respectively, to form a strong electric field, and generate negative ion clusters by a corona effect.
As shown in fig. 4, the upper cover 1 includes a first middle plate 14, a first side plate 15, and a second side plate 16, where the first side plate 15 and the second side plate 16 are respectively distributed on two sides of the first middle plate 14. The first middle plate 14, the first side plate 15 and the second side plate 16 together form a second groove 11. Specifically, the first middle panel 14, the first side panel 15, and the second side panel 16 are integrally formed, but are not limited to an integrally formed arrangement. The cover 1 may be plastic. In order to facilitate the connection of the upper cover 1 and the lower cover 2, a first connection portion 12 extending downward is provided at an outer side of the upper cover 1. Specifically, the first connecting portion 12 is provided on the outer wall of both sides of the second groove 11. That is, the first connecting portion 12 is disposed outside the first side plate 15 and the second side plate 16 and extends downward. Specifically, as shown in fig. 2, the first connecting portion 12 has a card hole 121 on a side wall thereof. The upper cap 1 is coupled to the lower cap 2 through the chucking hole 121.
In order to counteract the pressure of the first spring 51 and the second spring 52 to keep the ceramic substrate 3 stable, the upper cover 1 is further provided with a press stud 13. The lower surface of the pressure column 13 is substantially flush with the lower surfaces of the first side plate 15 and the second side plate 16.
In another embodiment, the upper cover 1 includes a first middle plate 14, and first connection portions 12, wherein the first connection portions 12 are disposed on both sides of the first middle plate 14 and extend downward. The first connecting portions 12 on both sides and the first middle plate 14 together enclose a second groove 11. In order to keep a certain distance between the first intermediate plate 14 and the ceramic substrate 3, a certain distance is provided between the upper surface and the lower surface of the first connection portion 12. Specifically, the bottom of the sidewall of the first connecting portion 12 has a locking hole 121. The upper cap 1 is coupled to the lower cap 2 through the chucking hole 121.
In another embodiment, the upper cover 1 includes a first middle plate 14, and first connection portions 12, wherein the first connection portions 12 are disposed on both sides of the first middle plate 14 and extend downward. The first connecting portions 12 on both sides and the first middle plate 14 together enclose a second groove 11. Specifically, the first connection portion 12 has a card hole 121 on a side wall thereof. The upper cap 1 is coupled to the lower cap 2 through the chucking hole 121.
As shown in fig. 3 and 5, the lower cover 2 includes a second middle plate 25, a third side plate 26, and a fourth side plate 27. The third side plate 26 and the fourth side plate 27 are respectively distributed on two sides of the second middle plate 25. The second middle plate 25, the third side plate 26 and the fourth side plate 27 together form a first recess 21. Specifically, the second middle panel 25, the third side panel 26, and the fourth side panel 27 are integrally formed, but are not limited to an integrally formed arrangement. The lower cover 2 may be plastic. In order to facilitate the connection between the upper cover 1 and the lower cover 2, the outer wall of the lower cover 2 is provided with the second connecting portion 22, that is, the outer walls of the two sides of the first groove 21 are provided with the second connecting portions 22, that is, the outer walls of the third side plate 26 and the fourth side plate 27 are provided with the second connecting portions 22. The second connection portion 22 corresponds to the first connection portion 12. Specifically, the second connection portion 22 is a protrusion. The protrusion of the lower cap 2 is matched with the catching hole 121 of the upper cap 1.
In another embodiment, the second connecting portions 22 are through holes, and the through holes correspond to the fastening holes 121 one to one. The negative ion generating device is connected with the through hole and the clamping hole 121 through a fastener such as a screw, a bolt and the like.
In one embodiment, four fastening holes 121 are provided and symmetrically distributed on the outer walls of two sides of the second groove 11. Specifically, the first side plate 15 and the second side plate 16 are symmetrically distributed on two sides of the first middle plate 14, and the first connecting portion 12 is also symmetrically distributed on two sides of the first middle plate. Each of the first connecting portions 12 has two card holes 121, and the card holes 121 are symmetrically disposed about the first middle plate 14. The number of the protrusions is four, and the protrusions are symmetrically distributed on the outer walls of the two sides of the first groove 21. Specifically, the third and fourth side plates 26, 27 are symmetrically disposed on both sides of the second middle plate 25. Two bulges are respectively arranged on the outer walls of the third side plate 26 and the fourth side plate 27. The protrusions correspond to the chucking holes 121 one to one.
In order to limit the position of the ceramic substrate 3 and accurately and quickly find the position of the ceramic substrate 3, the inner side wall of the first groove 21 is provided with a limiting structure 211. The position-limiting structure 211 is also convex and is integrally formed with the third side plate 26 and the fourth side plate 27. The limiting structure 211 and the bottom of the first groove 21 have a gap, and the ceramic substrate 3 is clamped in the gap. In order to facilitate the mounting and dismounting of the ceramic substrate 3 in the gap, the present application provides a certain elastic force to the areas of the third side plate 26 and the fourth side plate 27 where the limiting structure 211 is located. Here, the third side plate 26 is taken as an example for explanation, and the fourth side plate 27 is also provided similarly to the third side plate 26. Specifically, the third side plate 26 includes a first baffle 261, a second baffle 262, and a third baffle 263. First baffle 261, second baffle 262, third baffle 263 arrange in proper order, and all have certain distance between first baffle 261 and the second baffle 262, between second baffle 262 and the third baffle 263, limit structure 211 sets up in the upper end of second baffle 262.
In order to prevent the first spring 51 and the second spring 52 from being displaced in the first groove 21 and to improve the installation efficiency, the first groove 21 is provided at the bottom thereof with a first installation groove 212 and a second installation groove 213. The first and second mounting grooves 212 and 213 are generally cylindrical to conform to the shape and configuration of the first and second springs 51 and 52. The first and second springs 51 and 52 are installed in the first and second installation grooves 212 and 213, respectively.
In order to keep the ceramic substrate 3 stable, the lower cover 2 is further provided with a receiving structure 28 and a filling groove 29. Specifically, the receiving structure 28 is disposed on the inner wall of the first groove 21, that is, the receiving structure 28 is disposed on the inner walls of the third and fourth side panels 26 and 27. The receiving structure 28 is a protruding structure having an upper surface that is substantially flush with the upper surfaces of the first and second mounting grooves 212 and 213. In particular, the filling channel 29 is provided by several protruding plates together with parts of said protruding structure around the first mounting channel 212, i.e. the first mounting channel 212 is located within the filling channel 29. The first mounting groove 212 is disposed on one side of the protruding structure, and the second mounting groove 213 is disposed at a position where the protruding plate is connected to the protruding plate, so that the specific positions of the first mounting groove 212 and the second mounting groove 213 can be conveniently determined. The upper surface of the boss is substantially flush with the upper surfaces of the first and second mounting grooves 212 and 213. When the ceramic substrate 3 is mounted on the lower cover 2, the ceramic substrate 3 is seated on the receiving structure 28 and the second receiving structure 29. And the filling groove is filled with insulating glue to adhere the ceramic substrate 3, and the first spring 51 and the second spring 52 are isolated, so that discharge arc discharge is avoided. The pasting process specifically comprises the following steps: the filling groove 29 is filled with insulating glue, and the insulating glue is placed upside down and then is adhered to the ceramic substrate 3 for drying and curing.
In order to facilitate the installation of the positive and negative high voltage lines 61 and 62, the lower cover 2 is provided at the bottom thereof with first and second installation holes 23 and 24. The first mounting hole 23 communicates with the first mounting groove 212, and the second mounting hole 24 communicates with the second mounting groove 213. The positive high voltage wire 61 is inserted into the first mounting hole 23 and connected to the first spring 51, and the negative high voltage wire 62 is inserted into the second mounting hole 24 and connected to the second spring 52.
As shown in fig. 6, in order to make the positive high voltage line 61 and the negative high voltage line 62 less prone to be pulled, the first mounting hole 23 and the second mounting hole 24 each include a first through hole 241 and a second through hole 242, the first through hole 241 is communicated with the second through hole 241, and an axis of the first through hole 241 is spaced from an axis of the second through hole 242. Specifically, the axis of the first through hole 241 and the axis of the second through hole 242 are parallel to each other, but not limited to the case of being parallel to each other.
The ceramic substrate 3 is fixed in the first groove 21 and is connected with the upper cover 1 and the lower cover 2 in an insulating way. Specifically, the inner surfaces of the upper and lower covers 1 and 2 may be provided with insulating layers so that the ceramic substrate 3 is insulated from the upper and lower covers 1 and 2.
In one of the application embodiments, the ceramic substrate 3 is clamped in the gap of the lower cover 2, and is pressed against the lower surface of the ceramic substrate 3 by the first spring 51 and the second spring 52, so that the ceramic substrate 3 is pressed against the limiting structure 211. To further maintain stability, the press stud 13 of the upper cover 1 is pressed against the upper surface of the ceramic substrate 3.
In one of the embodiments, the lower cover 2 is not provided with the stopper 211. The ceramic substrate 3 is mounted in the first recess 21 of the lower cover 2. After the lower cover 2 and the upper cover 1 are matched and installed, the ceramic substrate 3 is pressed by the first spring 51, the second spring 52 and the pressing column 13.
In one of the claimed embodiments, the upper lid 1 is not provided with the press stud 13. The ceramic substrate 3 is clamped in the gap of the lower cover 2, and is pressed against the lower surface of the ceramic substrate 3 by the first spring 51 and the second spring 52, so that the ceramic substrate 3 is pressed against the limiting structure 211.
The positive high-voltage line 61 and the negative high-voltage line 62 are non-concentric wires. The outside of the positive high-voltage wire 61 and the negative high-voltage wire 62 is provided with insulating glue, and the inside of the insulating glue is provided with a wire core. The wire core of the connecting end of the positive high-voltage wire 61 and the negative high-voltage wire 62 is in a hook shape. After the wire cores at the connecting ends of the positive high-voltage wire 61 and the negative high-voltage wire 62 are respectively connected to the first spring 51 and the second spring 52, the wire cores are not easy to pull and fall off.
The outside of the positive high-voltage wire 61 and the outside of the negative high-voltage wire 62 are made of insulating glue, and the inside of the insulating glue is made of wire cores. The wire core of the connecting end of the positive high-voltage wire 61 and the negative high-voltage wire 62 is in a hook shape. After the wire cores at the connecting ends of the positive high-voltage wire 61 and the negative high-voltage wire 62 are respectively connected to the first spring 51 and the second spring 52 through the first through hole 241 and the second through hole 242 in sequence, the wire cores are not easy to be pulled and fall off.
In one of the application embodiments, the first and second mounting holes 23 and 24 are only one through hole, respectively, and are not divided into the first and second through holes 241 and 242, and the cores of the connecting ends of the positive and negative high- voltage lines 61 and 62 are connected to the first and second springs 51 and 52 through the first and second mounting holes 23 and 24, respectively.
As shown in fig. 7, the ceramic substrate 3 includes a high-voltage negative ion paint discharge region 31, a positive high-voltage negative ion paint contact electrode 32, and a negative high-voltage negative ion paint contact electrode 33. The positive high-voltage negative ion coating contact electrode 32 is connected with the high-voltage negative ion coating discharge area 31, so that the positive high-voltage negative ion coating contact electrode 32 supplies power to the high-voltage negative ion coating discharge area 31.
In order to facilitate welding of the discharge needle 4, a pad 36 is further provided on the ceramic substrate 3, and the pad 36 is connected to the negative high-voltage negative ion coating contact electrode 33. The discharge needle 4 is electrically connected to the negative high-voltage negative ion paint contact electrode 33 by being soldered to the pad 36. The ceramic substrate 3 is provided with a third groove 35, and two high-voltage negative ion coating discharge regions 31 are arranged and are respectively positioned on two sides of the third groove 35. The bonding pad 36 is arranged on one side of the third groove 35, and after the discharge needle 4 is welded on the bonding pad 36, the discharge needle 4 is positioned between the two high-voltage negative ion coating discharge areas 31.
In order to obtain high-quality negative ions, the negative ion paint arranged on the high-voltage negative ion paint discharge area 31 and/or the positive high-voltage negative ion paint contact electrode 32 and/or the negative high-voltage negative ion paint contact electrode 33 is formed by mixing epoxy resin, mica powder, tourmaline powder, carbon powder, silicate powder and zirconium oxide. In the prior art, a common steel needle or carbon fiber negative ion discharge is adopted, but the generated negative ion group is too large, the action distance is short, the range of the negative ion generating effect area is small, and more ozone is generated along with the negative ion group. Compared with the prior art, the negative ion coating is adopted in the embodiment of the application, so that the negative ion generating device generates a small negative ion group, the action range of the negative ions generated by the common steel needle is more than 2 times larger than that of the negative ions generated by the common steel needle, the concentration of the negative ions is more than 2 times larger than that generated by the common steel needle, and the ozone generation amount is less than that generated by the common steel needle.
In order to avoid the phenomenon of discharge arcing to damage the negative ion generating device, a first insulating material layer 34 is arranged between the positive high-voltage negative ion coating material contact electrode 32 and the negative high-voltage negative ion coating material contact electrode 33. The first insulating material layer 34 is provided along a connection line between the positive high-voltage negative ion coating material contact electrode 32 and the negative high-voltage negative ion coating material contact electrode 33, and is provided around the pad 36 and the periphery of the negative high-voltage negative ion coating material contact electrode 33. In order to avoid the phenomenon of discharge arcing and damage to the negative ion generating device, the outer surfaces of the first spring 51 and the second spring 52 are provided with a second insulating material layer.
In order to achieve the purpose of one object with multiple purposes, the first spring 51 is in contact with the positive high-voltage negative ion paint contact electrode 32, and the second spring 52 is in contact with the negative high-voltage negative ion paint contact electrode 33, so that the first spring 51 electrically conducts the positive high-voltage wire 61 to the positive high-voltage negative ion paint contact electrode 32, and the second spring 52 electrically conducts the negative high-voltage wire 62 to the negative high-voltage negative ion paint contact electrode 33, and therefore the positive and negative electrodes of the ceramic substrate 3 are electrically communicated. The positive high-voltage wire 61 and the negative high-voltage wire 62 are conducted, and the discharge needles 4 and the high-voltage negative ion coating discharge area 31 form a strong electric field to generate negative ion clusters through a corona effect.
In one of the embodiments, during installation, the positive high-voltage wire 61 and the negative high-voltage wire 62 are respectively installed into the first installation hole 23 and the second installation hole 24, and the wire ends of the positive high-voltage wire 61 and the negative high-voltage wire 62 are respectively inserted into the first installation groove 212 and the second installation groove 213. Next, the first spring 51 and the second spring 52 are installed into the first installation groove 212 and the second installation groove 213, respectively. Then, the ceramic substrate 3 is clamped in the gap and abuts against the limiting structure 211. Thirdly, the upper cover 1 is matched with the protrusion of the lower cover 2 through the clamping hole 121 on the first connecting portion 12, so that the upper cover 1 and the lower cover 2 are installed in a matching manner, the upper cover 1 and the lower cover 2 enclose a space for forming the ceramic substrate 3 and the discharge needles 4, and at this time, the pressure columns 13 in the upper cover 1 are pressed against the ceramic substrate 3.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.
Claims (10)
1. The negative ion generating device comprises a positive high-voltage wire (61) and a negative high-voltage wire (62), and is characterized by also comprising
An upper cover (1) provided with a first connecting part (12) extending downwards on the outer side;
the lower cover (2) comprises a first groove (21) and a second connecting part (22) arranged on the outer wall of the first groove (21);
the ceramic substrate (3) is fixed in the first groove (21) and is in insulated connection with the upper cover (1) and the lower cover (2); the ceramic substrate (3) comprises a high-voltage negative ion coating discharge area (31), a positive high-voltage negative ion coating contact electrode (32) connected with the high-voltage negative ion coating discharge area (31), and a negative high-voltage negative ion coating contact electrode (33);
a discharge needle (4) connected to the negative high-voltage negative ion paint contact electrode (33);
the first spring (51) is connected with the positive high-voltage wire (61), one end of the first spring is pressed against the positive high-voltage negative ion coating contact electrode (32), and the other end of the first spring is pressed against the bottom of the first groove (21);
the second spring (52) is connected with the negative high-voltage wire (62), one end of the second spring is pressed against the negative high-voltage negative ion coating contact electrode (33), and the other end of the second spring is pressed against the bottom of the first groove (21);
wherein the first connecting part (12) is detachably connected with the second connecting part (22), and the upper cover (1) and the lower cover (2) enclose a space for forming the ceramic substrate (3) and the discharge needle (4); the discharge needles (4) and the high-voltage negative ion coating discharge area (31) form a strong electric field to generate negative ion clusters through a corona effect.
2. The anion generating device as claimed in claim 1, wherein said upper cover (1) is provided with a second groove (11), and the outer walls of both sides of said second groove (11) are provided with said first connecting portion (12);
the outer walls of two sides of the first groove (21) are provided with the second connecting parts (22), and the second connecting parts (22) correspond to the first connecting parts (12).
3. The anion generator as claimed in claim 1, wherein said first connecting portion (12) has a locking hole (121) on a side wall thereof, and said second connecting portion (22) is a protrusion, and said protrusion is locked in said locking hole (121).
4. The anion generating device as claimed in claim 3, wherein four of said fastening holes (121) are symmetrically distributed on the outer wall of the two sides of said second groove (11); the number of the protrusions is four, and the protrusions are symmetrically distributed on the outer walls of the two sides of the first groove (21).
5. The anion generating device according to claim 1, wherein a pressing column (13) is arranged in the second groove (11), and the pressing column (13) presses against the ceramic substrate (3) to stabilize the ceramic substrate (3).
6. The anion generating device as claimed in claim 1, wherein a limiting structure (211) is disposed on an inner side wall of the first groove (21), a gap is formed between the limiting structure (211) and the bottom of the first groove (21), and the ceramic substrate (3) is clamped in the gap.
7. The anion generating apparatus as claimed in claim 6, wherein said first recess (21) is provided at the bottom with a first mounting groove (212) and a second mounting groove (213), said first mounting groove (212) and said second mounting groove (213) respectively accommodating said first spring (51) and said second spring (52).
8. A negative ion generating device according to claim 1, wherein a first layer of insulating material (34) is provided between the positive high voltage negative ion coating material contact electrode (32) and the negative high voltage negative ion coating material contact electrode (33).
9. A device according to claim 1, wherein the outer surface of the spring (5) is provided with a second layer of insulating material.
10. The anion generating device according to any of the claims 1 to 9, wherein said ceramic substrate (3) is provided with a third groove (35), and said high-pressure anion paint discharging area (31) is provided with two and located at two sides of said third groove (35); the discharge needles (4) are positioned between the two high-voltage negative ion coating discharge areas (31) and welded on the ceramic substrate (3).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011561152.0A CN112736656B (en) | 2020-12-25 | 2020-12-25 | Negative ion generating device |
| PCT/CN2020/141189 WO2022134158A1 (en) | 2020-12-25 | 2020-12-30 | Negative ion generating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011561152.0A CN112736656B (en) | 2020-12-25 | 2020-12-25 | Negative ion generating device |
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| Publication Number | Publication Date |
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| CN112736656A true CN112736656A (en) | 2021-04-30 |
| CN112736656B CN112736656B (en) | 2022-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011561152.0A Active CN112736656B (en) | 2020-12-25 | 2020-12-25 | Negative ion generating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112736656B (en) |
| WO (1) | WO2022134158A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581616A (en) * | 2003-08-13 | 2005-02-16 | 株式会社村田制作所 | Ion generating device, ion generating unit and ion generating apparatus |
| CN203250984U (en) * | 2010-09-09 | 2013-10-23 | 株式会社村田制作所 | Ion generating apparatus |
| CN103623924A (en) * | 2012-08-22 | 2014-03-12 | 三菱电机株式会社 | Discharge device and air conditioner |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5151599B2 (en) * | 2008-03-26 | 2013-02-27 | 株式会社村田製作所 | Ion generator |
| CN208337987U (en) * | 2018-05-08 | 2019-01-04 | 宋佳佳 | A kind of multipoint mode plasma generator |
| CN112751261A (en) * | 2020-12-25 | 2021-05-04 | 广州奥松电子有限公司 | Negative ion generator |
-
2020
- 2020-12-25 CN CN202011561152.0A patent/CN112736656B/en active Active
- 2020-12-30 WO PCT/CN2020/141189 patent/WO2022134158A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581616A (en) * | 2003-08-13 | 2005-02-16 | 株式会社村田制作所 | Ion generating device, ion generating unit and ion generating apparatus |
| CN203250984U (en) * | 2010-09-09 | 2013-10-23 | 株式会社村田制作所 | Ion generating apparatus |
| CN103623924A (en) * | 2012-08-22 | 2014-03-12 | 三菱电机株式会社 | Discharge device and air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112736656B (en) | 2022-05-31 |
| WO2022134158A1 (en) | 2022-06-30 |
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