CN112735965B - Semiconductor device and bearing device thereof - Google Patents
Semiconductor device and bearing device thereof Download PDFInfo
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- CN112735965B CN112735965B CN202011559740.0A CN202011559740A CN112735965B CN 112735965 B CN112735965 B CN 112735965B CN 202011559740 A CN202011559740 A CN 202011559740A CN 112735965 B CN112735965 B CN 112735965B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 80
- 230000008569 process Effects 0.000 claims abstract description 80
- 238000009529 body temperature measurement Methods 0.000 claims description 9
- 230000005693 optoelectronics Effects 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 48
- 238000010438 heat treatment Methods 0.000 description 28
- 238000007872 degassing Methods 0.000 description 8
- 230000008054 signal transmission Effects 0.000 description 7
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
The invention provides a semiconductor device and a bearing device thereof, wherein each bearing component of the bearing device comprises a bearing main body fixed on the bottom wall of the inner cavity of the cavity of a process chamber and bearing convex parts arranged on the side wall of the bearing main body, and a plurality of bearing convex parts bear a workpiece to be processed; the temperature measuring component is arranged on at least one bearing component; the rotating piece of the temperature measuring assembly is rotatably arranged on the bearing main body and is provided with an upper abutting end and a lower abutting end; the first temperature measuring component is arranged on the upper abutting end; the lower abutting end abuts against the lower surface of the workpiece to be processed in the process that the workpiece to be processed is placed on the bearing convex part, and the upper abutting end is driven to move towards the upper surface of the workpiece to be processed; when the workpiece to be processed contacts with the bearing convex part, the upper abutting end abuts against the upper surface of the workpiece to be processed, so that the first temperature measuring component is attached to the upper surface of the workpiece to be processed, the accuracy of temperature control of the semiconductor process can be improved, the yield of the workpiece to be processed is improved, the cost is reduced, and the utilization rate of semiconductor equipment is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to semiconductor equipment and a bearing device thereof.
Background
Semiconductor degassing processes typically utilize a degassing chamber with a heating lamp positioned at the top of the degassing chamber to irradiate the wafer toward the upper surface of the heating lamp to bring the temperature of the wafer to the process temperature, thereby removing water vapor and other volatile impurities from the wafer. The surface temperature change of the wafer is an important parameter in the degassing process, and how to accurately obtain the surface temperature of the wafer is a key to realizing accurate temperature control. In the prior art, a temperature measuring device is usually installed at the bottom of the degassing chamber, and the temperature of the lower surface of the wafer, which is away from the heating lamps, is measured by the temperature measuring device so as to obtain the surface temperature of the wafer in the degassing process.
However, the light emitted by the heating lamp directly acts on the upper surface of the wafer, and the heat of the lower surface of the wafer is conducted only through the heat of the upper surface, if the temperature of the lower surface of the wafer is directly utilized to control the temperature, the temperature of the upper surface of the wafer exceeds the process temperature, so that the temperature of the lower surface of the wafer can only be used as a reference. In addition, the above-mentioned temperature measurement mode still needs to cooperate the use of Wafer thermocouple (TC Wafer) before the use of degassing cavity to can obtain the temperature of more accurate Wafer upper surface in degassing cavity use, make current Wafer temperature measurement scheme comparatively complicated, and the cost is higher.
Disclosure of Invention
The invention aims at solving at least one of the technical problems in the prior art, and provides semiconductor equipment and a bearing device thereof, which can directly measure the temperature of one side face of a workpiece to be processed, which faces a heating source, so that the accuracy of temperature control of a semiconductor process can be improved, and the semiconductor equipment does not need to be matched with other temperature measuring elements for use, thereby improving the yield of the workpiece to be processed, reducing the cost and improving the utilization rate of the semiconductor equipment.
In order to achieve the object of the present invention, there is provided a carrier for a semiconductor device, disposed in a cavity of a semiconductor process chamber, for carrying a workpiece to be processed, comprising:
the bearing components comprise a bearing main body and bearing convex parts, the bearing main body is fixed on the bottom wall of the inner cavity of the cavity, the bearing convex parts are arranged on the side wall of the bearing main body, and the bearing convex parts are used for bearing the workpiece to be processed;
the temperature measuring assembly is arranged on at least one bearing assembly; the temperature measurement assembly includes: the rotating piece is rotatably arranged on the bearing main body, the rotating piece is provided with an upper abutting end and a lower abutting end, and the first temperature measuring part is arranged on the upper abutting end;
the lower abutting end is used for abutting against the lower surface of the workpiece to be processed and driving the upper abutting end to move towards the upper surface of the workpiece to be processed in the process that the workpiece to be processed is placed on the bearing convex part;
the upper abutting end is used for abutting against the upper surface of the workpiece to be processed when the workpiece to be processed contacts with the bearing convex part, so that the first temperature measuring component is attached to the upper surface of the workpiece to be processed.
Preferably, the rotating member includes a first connecting member, a second connecting member and a rotating connecting member, the rotating connecting member is rotationally connected with the bearing main body, the first end of the first connecting member and the first end of the second connecting member are fixedly connected with the rotating connecting member, the second end of the first connecting member and the second end of the second connecting member are separated from each other, the second end of the first connecting member is the upper abutting end, and the second end of the second connecting member is the lower abutting end.
Preferably, the bearing body is provided with an axially-through accommodating cavity and an avoidance port which is arranged on the side wall of the bearing body and communicated with the accommodating cavity, the rotary connecting piece is positioned in the accommodating cavity, and the upper abutting end and the lower abutting end extend out of the bearing body through the avoidance port.
Preferably, the workpiece processing device further comprises a reset piece connected with the rotating piece, wherein the reset piece is used for enabling the rotating piece to return to an initial position when the workpiece to be processed leaves the bearing convex part, the initial position is that the lower abutting end is located on a path of the workpiece to be processed moving towards the bearing convex part, and the upper abutting end is located on the outer side of the path of the workpiece to be processed moving towards the bearing convex part.
Preferably, the reset piece is a weight piece, the weight piece is located in the accommodating cavity, one end of the weight piece is connected with the rotating connecting piece, and the other end of the weight piece is suspended.
Preferably, the device further comprises a detecting member, wherein the detecting member is disposed in the accommodating cavity, and the detecting member can be used for confirming whether the rotating member is located at the initial position.
Preferably, the detecting member is a photoelectric proximity switch, when the rotating member is at the initial position, the first connecting member shields the light of the photoelectric proximity switch, and when the rotating member leaves the initial position, the first connecting member does not shield the light of the photoelectric proximity switch.
Preferably, the bearing surfaces formed by the rotating connecting piece and the bearing convex parts and used for bearing the workpiece to be processed are positioned on the same plane, and the rotating radius of the upper abutting end is the same as the distance between the bearing convex parts and the rotating connecting piece.
Preferably, the temperature measuring assembly further comprises a second temperature measuring component, the second temperature measuring component is arranged on the lower abutting end, and is used for being attached to the lower surface of the workpiece to be processed when the workpiece to be processed is in contact with the bearing convex part, so as to detect the temperature of the lower surface of the workpiece to be processed.
The invention also provides semiconductor equipment which comprises a process chamber and a bearing device, wherein the bearing device provided by the invention is adopted, and the bearing device is arranged in the process chamber and is used for bearing a workpiece to be processed.
The invention has the following beneficial effects:
according to the bearing device of the semiconductor equipment, the temperature measuring assembly is arranged on at least one bearing assembly, so that the lower abutting end of the rotating piece arranged on the bearing main body by means of rotation of the temperature measuring assembly is abutted against the lower surface of the workpiece to be processed in the process of placing the workpiece on the bearing convex part, and the upper abutting end is driven to move towards the upper surface of the workpiece to be processed, when the workpiece to be processed is contacted with the bearing convex part, the upper abutting end is abutted against the upper surface of the workpiece to be processed, so that the first temperature measuring component of the temperature measuring assembly arranged on the upper abutting end is abutted against the upper surface of the workpiece to be processed when the workpiece to be processed is contacted with the bearing convex part, and the upper surface of the workpiece to be processed can be directly measured in the semiconductor process, namely, the temperature measuring assembly can be used for directly measuring the side of the workpiece to be processed towards the heating source in real time, so that the accuracy of the temperature control of the semiconductor process can be improved, and the yield of the workpiece to be processed can be improved.
According to the semiconductor device provided by the invention, the workpiece to be processed is carried by the carrying device provided by the invention, so that the temperature of one side surface of the workpiece to be processed, which faces the heating source, can be measured directly, the accuracy of temperature control of the semiconductor process can be improved, and the semiconductor device does not need to be matched with other temperature measuring elements for use, so that the yield of the workpiece to be processed is improved, the cost is reduced, and the utilization rate of the semiconductor device is improved.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor device and a carrier device thereof according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a semiconductor device and a carrying device thereof according to an embodiment of the present invention in a process of placing a workpiece to be processed on a carrying protrusion;
fig. 3 is a schematic structural diagram of a semiconductor device and a carrying device thereof according to an embodiment of the present invention when a workpiece to be processed contacts with a carrying protrusion;
reference numerals illustrate:
11-a carrying body; 12-carrying the convex part; 13-rotating the connection; 14-a first connector; 15-a second connector; 16-a first temperature measurement component; 17-a second temperature measurement component; 18-a weight; 19-a receiving chamber; 21-a detection member; 22-a fixed connection; 23-signal transmission means; 24-a process chamber; 25-heating source; 26-a workpiece to be processed.
Detailed Description
In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following describes in detail the semiconductor device and the carrying device thereof provided by the present invention with reference to the accompanying drawings.
As shown in fig. 2 and 3, the present embodiment provides a carrying device of a semiconductor apparatus, which is disposed in a cavity of a semiconductor process chamber 24, and is configured to carry a workpiece 26 to be processed, and includes: the bearing assembly comprises a bearing main body 11 and a bearing convex part 12, wherein the bearing main body 11 is fixed on the bottom wall of the inner cavity of the cavity, the bearing convex part 12 is arranged on the side wall of the bearing main body 11, and the bearing convex parts 12 are used for bearing a workpiece 26 to be processed; the temperature measuring assembly is arranged on the at least one bearing assembly; the temperature measurement subassembly includes: the rotating piece and the first temperature measuring part 16 are arranged on the bearing main body 11 in a rotating way, the rotating piece is provided with an upper abutting end and a lower abutting end, and the first temperature measuring part 16 is arranged on the upper abutting end; the lower abutting end is used for abutting against the lower surface of the workpiece 26 to be processed and driving the upper abutting end to move towards the upper surface of the workpiece 26 to be processed in the process that the workpiece 26 to be processed is placed on the bearing convex part 12; the upper abutting end is used for abutting against the upper surface of the workpiece 26 to be processed when the workpiece 26 to be processed contacts with the bearing convex part 12, so that the first temperature measuring component 16 is attached to the upper surface of the workpiece 26 to be processed.
According to the bearing device of the semiconductor equipment, the temperature measuring component is arranged on at least one bearing component, so that the lower abutting end of the rotating piece arranged on the bearing main body 11 by means of rotation of the temperature measuring component is abutted against the lower surface of the workpiece 26 to be processed in the process of arranging the workpiece 26 to be processed on the bearing convex portion 12, and drives the upper abutting end to move towards the upper surface of the workpiece 26 to be processed, so that the upper abutting end abuts against the upper surface of the workpiece 26 to be processed when the workpiece 26 to be processed is contacted with the bearing convex portion 12, the first temperature measuring component 16 of the temperature measuring component arranged on the upper abutting end is abutted against the upper surface of the workpiece 26 to be processed, and therefore the upper surface of the workpiece 26 to be processed can be directly measured in the semiconductor process, namely, the temperature of one side, facing the heating source 25, of the workpiece 26 to be processed can be directly measured in real time by means of the temperature measuring component, and the accuracy of the temperature control of the semiconductor process can be improved, and the yield of the workpiece 26 to be processed can be improved.
In the semiconductor process, as the semiconductor process is continuously performed, heat is continuously accumulated in the inner cavity of the process chamber 24, and the temperature in the inner cavity of the process chamber 24 is gradually increased, so that the workpieces 26 to be processed which are placed into the inner cavity of the process chamber 24 at different times are heated to different process temperatures, and by means of the temperature measuring component of the carrying device of the semiconductor equipment provided by the embodiment, the temperature of one side surface of the workpiece 26 to be processed, which faces the heating source 25, is measured in real time in the semiconductor process, so that the time for heating the workpiece 26 to be processed to the process temperature in the semiconductor process can be accurately obtained in the process of continuously performing the semiconductor process, the heating time of the workpiece 26 to be processed can be accurately controlled, the temperature of the workpiece 26 to be processed is prevented from exceeding the process temperature, and the process result of the workpiece 26 to be processed is improved.
As shown in fig. 1, each carrying body 11 may be mounted on a bottom wall of an inner cavity of the process chamber 24, and carrying protrusions 12 are disposed on side walls of each carrying body 11, during a semiconductor process, all carrying protrusions 12 are abutted against a lower surface of a workpiece to be processed, so as to carry the workpiece to be processed in the inner cavity of the process chamber 24, a heating source 25 is disposed at a top of the process chamber 24, and the heating source 25 is used for heating the workpiece 26 to be processed during the semiconductor process.
Alternatively, the heating source 25 may include a heating lamp, and during the semiconductor process, the light emitted from the heating lamp can irradiate the upper surfaces of the workpieces 26 to be processed carried on all the carrying protrusions 12, that is, the side of the workpieces 26 to be processed facing the heating source 25, so as to heat the workpieces 26 to be processed by using heat generated by the light emitted from the heating source 25.
Alternatively, the heating lamp may comprise a halogen lamp.
As shown in fig. 2 and 3, in a preferred embodiment of the present invention, the rotating member may include a first connecting member 14, a second connecting member 15 and a rotating connecting member 13, the rotating connecting member 13 is rotatably connected with the carrier body 11, a first end of the first connecting member 14 and a first end of the second connecting member 15 are fixedly connected with the rotating connecting member 13, a second end of the first connecting member 14 and a second end of the second connecting member 15 are separated from each other, the second end of the first connecting member 14 is an upper abutting end, and the second end of the second connecting member 15 is a lower abutting end.
As shown in fig. 1, taking a workpiece 26 to be processed as a wafer, in semiconductor processing, the wafer is typically carried by a robot into the interior of the process chamber 24. As shown in fig. 2, after the wafer is carried by the robot (not shown) into the inner cavity of the process chamber 24, the robot will carry the wafer to between the second end (i.e., the upper abutting end) of the first connecting member 14 and the second end (i.e., the lower abutting end) of the second connecting member 15, at this time, the second end of the first connecting member 14 is located above the upper surface of the wafer and has a gap with the upper surface of the wafer, the second end of the second connecting member 15 is located below the lower surface of the wafer and has a gap with the lower surface of the wafer, then the robot carries the wafer to move downward, during the process of carrying the wafer by the robot, the lower surface of the wafer will abut against the second end of the second connecting member 15 first, after the lower surface of the wafer abuts against the second end of the second connecting member 15, the robot will carry the wafer to move downward, during the process of carrying the wafer to apply downward pressure to the second end of the second connecting member 15, so that the first connecting member 15 will continuously rotate the first connecting member 13 continuously, and the first connecting member 13 will continuously rotate. As shown in fig. 3, when the robot moves the wafer downward until the lower surface of the wafer contacts with all the carrying protrusions 12, that is, the wafer is carried on all the carrying protrusions 12, the first connection member 14, the second connection member 15 and the rotating connection member 13 stop rotating, at this time, the continuous rotation of the rotating connection member 13 drives the first connection member 14 to rotate until the second end of the first connection member 14 abuts against the upper surface of the wafer, so that the first temperature measuring component 16 disposed on the second end of the first connection member 14 abuts against the upper surface of the wafer, that is, the first temperature measuring component 16 abuts against a side of the wafer facing the heating source 25, so that the upper surface of the wafer can be measured directly in real time, that is, the side of the wafer facing the heating source 25, by the first temperature measuring component 16 in the semiconductor process.
After the semiconductor process is finished, the manipulator stretches into the inner cavity of the process chamber 24 to lift up the wafers carried on all carrying convex parts 12, so that the lower surface of the wafers are separated from all carrying convex parts 12, then the manipulator carries the wafers to move upwards, in the process that the manipulator carries the wafers to move upwards, the first end of the second connecting piece 15 drives the rotating connecting piece 13 to rotate under the self gravity action of the second connecting piece 15, so that the rotating connecting piece 13 continuously drives the first end of the first connecting piece 14 to rotate, the second end of the first connecting piece 14 is separated from the upper surface of the wafers, namely, gaps are formed between the second end of the first connecting piece 14 and the wafers, when the first end of the second connecting piece 15 does not drive the rotating connecting piece 13 to rotate any more under the self gravity action of the second connecting piece 15, the first connecting piece 14 stops rotating, and the manipulator carries the wafers to move upwards, namely, gaps are formed between the lower surface of the wafers and the second end of the second connecting piece 15, the second end of the wafers and the second connecting piece 14 can be removed from the process chamber 24, and then gaps are formed between the upper surface of the wafers and the second connecting piece 14 and the first connecting piece 14.
By disposing the first temperature measuring part 16 at one end of the first connecting member 14, the first temperature measuring part 16 can be made to be close to the center of the wafer, so as to further improve the accuracy of temperature measurement.
As shown in fig. 2 and 3, the rotary joint 13 may alternatively comprise a rotary shaft.
In a preferred embodiment of the present invention, the material of the first connecting member 14 may include a high temperature resistant material, and the material of the second connecting member 15 may include a high temperature resistant material, so as to avoid deformation of the first connecting member 14 and the second connecting member 15 at high temperature, thereby improving the service life and the service stability of the first connecting member 14 and the second connecting member 15.
Alternatively, the angle between the first end of the first connector 14 and the first end of the second connector 15 is between 50 ° and 60 °, in particular may be 55 °.
As shown in fig. 1-3, the bearing body 11 may be provided with an accommodating cavity 19 that is axially penetrated and an avoiding port that is disposed on a sidewall of the bearing body 11 and is communicated with the accommodating cavity 19, the rotary connecting piece 13 is located in the accommodating cavity 19, and the upper abutting end and the lower abutting end extend out of the bearing body 11 through the avoiding port.
As shown in fig. 1-3, the first end of the first connecting member 14 and the first end of the second connecting member 15 are fixedly connected with the rotating connecting member 13 and located in the accommodating cavity 19, the first connecting member 14 and the second connecting member 15 pass through the escape opening, so that the second end (i.e., the upper abutting end) of the first connecting member 14 and the second end (i.e., the lower abutting end) of the second connecting member 15 are located outside the accommodating cavity 19, and the first connecting member 14 and the second connecting member 15 can rotate in the escape opening.
As shown in fig. 1-3, the relief opening may alternatively include a first opening through which the upper abutment end extends out of the carrier body 11 and a second opening through which the lower abutment end extends out of the carrier body 11. However, the form of the relief port is not limited thereto, and for example, the relief port may be a port for allowing the upper abutment end and the lower abutment end to pass through the extension bearing body 11.
Alternatively, the first temperature measuring part 16 may include a temperature measuring thermocouple, and the signal transmitting part 23 of the temperature measuring thermocouple may protrude to the outside of the carrying body 11 through the receiving cavity 19 of the carrying body 11 to be connected with the signal receiving part located at the outside of the carrying body 11.
The temperature measuring thermocouple generates an electric signal when measuring temperature, the electric signal is transmitted to the signal receiving component through the signal transmission component 23, the signal receiving component can convert the electric signal into a temperature value corresponding to the electric signal after receiving the electric signal, so that the temperature value detected by the temperature measuring thermocouple is obtained, and the signal transmission component 23 passes through the accommodating cavity 19 of the bearing main body 11, so that the damage caused by the influence of high temperature or corrosion of a semiconductor process due to the fact that the signal transmission component 23 is exposed in the inner cavity of the process chamber 24 can be avoided, and the service life and the service stability of the first temperature measuring component 16 are improved.
As shown in fig. 2 and 3, in a preferred embodiment of the present invention, the rotary connector 13 may be located on the same plane as a bearing surface formed by the plurality of bearing protrusions 12 for bearing the workpiece 26 to be processed, and the radius of rotation of the upper abutment end is the same as the distance between the bearing protrusions 12 and the rotary connector 13. In this way, when the workpiece 26 to be processed is carried on the carrying surfaces formed by all the carrying protrusions 12 and used for carrying the workpiece 26 to be processed, the upper abutting end just rotates to the carrying protrusions 12, namely, the carrying protrusions 12, the workpiece 26 to be processed and the first temperature measuring component 16 are sequentially overlapped, so that the first temperature measuring component 16 and the first connecting piece 14 can be supported by the carrying protrusions 12, the weight of the first connecting piece 14 and the first temperature measuring component 16 is prevented from being carried by the workpiece 26 to be processed, the workpiece 26 to be processed is prevented from being damaged due to overlarge external force, and the safety and the service stability of the carrying device are improved. Further, the distance between the lower abutting end and the rotating connecting piece 13 is smaller than the distance between the upper abutting end and the rotating connecting piece 13, so that when the upper abutting end abuts against the workpiece 26 to be processed, the lower abutting end can abut against the edge of the workpiece 26 to be processed, namely, the area surrounded by the lower abutting ends of the bearing assemblies is larger than the area surrounded by the upper abutting ends of the bearing assemblies, and the workpiece 26 to be processed can be positioned more reliably.
Optionally, each carrying assembly may further include a fixed connection member 22, where the fixed connection member 22 may be fixedly connected to the carrying body 11 and detachably connected to the bottom wall of the inner cavity of the process chamber 24, so that the carrying assembly is detachably connected to the process chamber 24, thereby facilitating maintenance or replacement of the carrying assembly and improving flexibility of use of the carrying device.
As shown in fig. 1, in a preferred embodiment of the present invention, the number of temperature measuring assemblies may be the same as the number of carrying assemblies, and each temperature measuring assembly is disposed on each carrying assembly in a one-to-one correspondence manner, that is, each carrying assembly is provided with a temperature measuring assembly, so as to measure temperature of different positions of the workpiece 26 to be processed through a plurality of temperature measuring assemblies, thereby further improving accuracy of temperature measurement of the workpiece 26 to be processed.
In a preferred embodiment of the present invention, the carrier device of the semiconductor apparatus may further include a reset member connected to the rotating member, where the reset member is configured to restore the rotating member to an initial position when the workpiece 26 to be processed leaves the carrying protrusion 12, where the initial position is that the lower abutment end is located on a path along which the workpiece 26 to be processed moves toward the carrying protrusion 12, and the upper abutment end is located outside the path along which the workpiece 26 to be processed moves toward the carrying protrusion 12.
When the workpiece 26 to be processed leaves the carrying convex part 12, the rotating part is restored to the initial position by means of the resetting part, on one hand, the rotating part can be restored to the position that the lower abutting end is located on the path of the workpiece 26 to be processed moving towards the carrying convex part 12, and the phenomenon that when the next workpiece 26 to be processed enters the inner cavity of the process chamber 24, the lower abutting end does not rotate to the initial position, the workpiece 26 to be processed interferes with the lower abutting end, so that the workpiece 26 to be processed is damaged, the lower surface of the workpiece 26 to be processed which enters the inner cavity of the process chamber 24 next can be smoothly abutted with the lower abutting end, so that the upper abutting end can be smoothly driven to move towards the upper surface of the workpiece 26 to be processed by the lower abutting end, and the upper abutting end can be abutted with the upper surface of the workpiece 26 to be processed when the workpiece 26 to be processed is carried on all the carrying convex parts 12, thereby enabling the first temperature measuring part 16 to be abutted with the upper surface of the workpiece 26 to be processed, and further improving the safety and the use stability of the carrying device.
On the other hand, the upper abutting end can be located at the outer side of a path along which the workpiece 26 to be processed moves towards the bearing convex part 12, so that when the workpiece 26 to be processed leaves the bearing convex part 12, the first end of the second connecting piece 15 cannot drive the rotating connecting piece 13 to rotate under the action of self gravity of the second connecting piece 15, so that the rotating connecting piece 13 cannot drive the first connecting piece 14 to rotate through the first end of the first connecting piece 14, the second end of the first connecting piece 14 cannot be separated from the upper surface of the workpiece 26 to be processed, interference is caused to the movement of the workpiece 26 to be processed, damage to the workpiece 26 to be processed is caused, and the fact that the next workpiece 26 to be processed does not rotate in place when entering the inner cavity of the process chamber 24, interference is caused to the movement of the workpiece 26 to be processed in the process chamber 24, damage to the workpiece 26 to be processed is caused, and therefore the safety and the service stability of the bearing device are improved.
As shown in fig. 2 and fig. 3, the restoring member is used for restoring the rotating member to the initial position, for example, may be a torsion spring, where the torsion spring is sleeved on the rotating connecting member 13, one end of the torsion spring is connected with the rotating connecting member 13, and the other end is connected with the bearing main body 11, where those skilled in the art can implement the restoring function to achieve the above effects, all shall belong to the scope of protection of the present application. In a preferred embodiment of the present invention, the reset element may be a weight element 18, the weight element 18 is located in the accommodating cavity 19, one end of the weight element 18 is connected to the rotating connection element 13, and the other end of the weight element 18 is suspended. The weight member 18 is connected with the rotating connecting member 13, and is used for being matched with the second connecting member 15 to drive the rotating connecting member 13 to rotate under the action of gravity of the two when the workpiece 26 to be processed leaves the bearing convex portion 12, so that the first end of the first connecting member 14 rotates along with the rotating connecting member 13, and the second end of the first connecting member 14 is separated from the upper surface of the workpiece 26 to be processed. Preferably, the first connecting member 14, the second connecting member 15, the rotating connecting member 13 and the weight member 18 are integrally formed, so that the position accuracy and the structural strength can be improved.
As shown in fig. 2 and 3, in a preferred embodiment of the present invention, the temperature measuring assembly may further include a second temperature measuring part 17, where the second temperature measuring part 17 is disposed on the lower abutting end, and is used for attaching the second temperature measuring part 17 to the lower surface of the workpiece 26 to be processed when the workpiece 26 to be processed contacts the carrying protrusion 12, so as to detect the temperature of the lower surface of the workpiece 26 to be processed.
When the lower surface of the workpiece 26 to be processed contacts with the bearing convex part 12, the second temperature measuring component 17 arranged on the lower abutting end is attached to the lower surface of the workpiece 26 to be processed, so that the lower surface of the workpiece 26 to be processed can be directly measured in real time by means of the second temperature measuring component 17 in the semiconductor process, and thus the lower surface and the upper surface of the workpiece 26 to be processed can be directly measured in real time in the semiconductor process by matching with the first temperature measuring component 16, and the accuracy of measuring the temperature of the workpiece 26 to be processed is further improved.
Alternatively, the second temperature measuring part 17 may include a temperature measuring thermocouple, and the signal transmitting part 23 of the temperature measuring thermocouple may protrude to the outside of the carrying body 11 through the receiving cavity 19 of the carrying body 11 to be connected with the signal receiving part located at the outside of the carrying body 11.
The temperature measuring thermocouple generates an electric signal when measuring temperature, the electric signal is transmitted to the signal receiving component through the signal transmission component 23, the signal receiving component can convert the electric signal into a temperature value corresponding to the electric signal after receiving the electric signal, so that the temperature value detected by the temperature measuring thermocouple is obtained, and the signal transmission component 23 passes through the accommodating cavity 19 of the bearing main body 11, so that the damage caused by the influence of high temperature or corrosion of a semiconductor process due to the fact that the signal transmission component 23 is exposed in the inner cavity of the process chamber 24 can be avoided, and the service life and the service stability of the second temperature measuring component 17 are improved.
Alternatively, the signal transmission part 23 may include a wire.
As shown in fig. 2 and 3, in a preferred embodiment of the present invention, the carrying device may further include a detecting member 21, where the detecting member 21 is disposed in the accommodating cavity 19, and the detecting member 21 may be used to confirm whether the rotating member is located at the initial position.
The detecting member 21 is used to determine whether the rotating member is located at the initial position, so as to determine whether the upper abutting end and the lower abutting end are located at the initial position, if the upper abutting end and the lower abutting end are located at the initial position, the workpiece 26 to be processed can be conveyed into the inner cavity of the process chamber 24, the workpiece 26 to be processed conveyed into the inner cavity of the process chamber 24 cannot collide with the upper abutting end and the lower abutting end, if the upper abutting end and the lower abutting end are not located at the initial position, conveying of the workpiece 26 to be processed into the inner cavity of the process chamber 24 is stopped, and therefore the workpiece 26 to be processed is prevented from colliding with the first connecting member 14 or the second connecting member 15 after being conveyed into the inner cavity of the process chamber 24, and damage to the workpiece 26 to be processed is avoided.
Moreover, by confirming whether the rotating member is located at the initial position by means of the detecting member 21, it is possible to know whether the workpiece 26 to be processed is carried on the carrying protrusion 12 through the rotating positions of the first connecting member 14 and the second connecting member 15, if the upper abutting end and the lower abutting end are located at the initial positions, it is indicated that the workpiece 26 to be processed is not carried on the carrying protrusion 12, the workpiece 26 to be processed can be transferred into the inner cavity of the process chamber 24, if the upper abutting end and the lower abutting end are not located at the initial positions, it is indicated that the workpiece 26 to be processed is possibly carried on the carrying protrusion 12, and the transfer of the workpiece 26 to be processed into the inner cavity of the process chamber 24 is stopped, so that it is possible to determine whether the workpiece 26 to be processed can be transferred into the inner cavity of the process chamber 24, and further stability of the carrying device can be improved. In order to avoid that the weight member 18 affects the accuracy of detection of the detecting member 21, the weight member 18 and the first connecting member 14 have a certain interval in the axial direction of the rotational connecting member 13 so that the weight member 18 avoids the detection area of the detecting member 21.
By arranging the detecting element 21 in the accommodating cavity 19, the detecting element 21 can be prevented from being damaged due to the influence of the high temperature of the semiconductor process, so that the detection is inaccurate, and the service life and the service stability of the detecting element 21 are improved.
In a preferred embodiment of the present invention, as shown in fig. 2 and 3, the detecting member 21 is an optoelectronic proximity switch, the first connecting member 14 blocks the light of the optoelectronic proximity switch when the rotating member is in the initial position, and the first connecting member 14 does not block the light of the optoelectronic proximity switch when the rotating member is away from the initial position. When the first link 14 blocks the light of the photoelectric proximity switch as shown in fig. 2, the rotating member is at the initial position, and when the first link 14 does not block the light of the photoelectric proximity switch as shown in fig. 3, the rotating member is away from the initial position.
As another technical solution, an embodiment of the present invention further provides a semiconductor apparatus, which includes a process chamber 24 and a carrying device, where the carrying device is provided in the process chamber 24 and is used for carrying a workpiece 26 to be processed.
According to the semiconductor device provided by the embodiment of the invention, the workpiece 26 to be processed is carried by the carrying device provided by the embodiment of the invention, so that the temperature of one side surface of the workpiece 26 to be processed, which faces the heating source 25, can be measured directly, the accuracy of temperature control of the semiconductor process can be improved, and the semiconductor device does not need to be matched with other temperature measuring elements for use, so that the yield of the workpiece 26 to be processed is improved, the cost is reduced, and the use rate of the semiconductor device is improved.
As shown in fig. 1, the carrying device may be disposed on a bottom wall of an inner cavity of the process chamber 24, and a heating source 25 may be disposed at a top of the process chamber 24, where the heating source 25 is configured to heat an upper surface of the workpiece 26 to be processed carried on the carrying device, that is, a side surface of the workpiece 26 to be processed facing the heating source 25.
In summary, the semiconductor device and the carrying device thereof provided in the embodiments of the present invention can directly measure the temperature of the side of the workpiece 26 to be processed facing the heating source 25, so as to improve the accuracy of temperature control in the semiconductor process, and no need to cooperate with other temperature measuring elements, thereby improving the yield of the workpiece 26 to be processed, reducing the cost, and improving the utilization rate of the semiconductor device.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but the invention is not limited thereto. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a semiconductor device's carrier, sets up in the cavity of semiconductor process chamber for bear the weight of the work piece of waiting to process, its characterized in that includes:
the bearing components comprise a bearing main body and bearing convex parts, the bearing main body is fixed on the bottom wall of the inner cavity of the cavity, the bearing convex parts are arranged on the side wall of the bearing main body, and the bearing convex parts are used for bearing the workpiece to be processed;
the temperature measuring assembly is arranged on at least one bearing assembly; the temperature measurement assembly includes: the rotating piece is rotatably arranged on the bearing main body, the rotating piece is provided with an upper abutting end and a lower abutting end, and the first temperature measuring part is arranged on the upper abutting end;
the lower abutting end is used for abutting against the lower surface of the workpiece to be processed and driving the upper abutting end to move towards the upper surface of the workpiece to be processed in the process that the workpiece to be processed is placed on the bearing convex part;
the upper abutting end is used for abutting against the upper surface of the workpiece to be processed when the workpiece to be processed contacts with the bearing convex part, so that the first temperature measuring component is attached to the upper surface of the workpiece to be processed.
2. The carrier of claim 1, wherein the rotating member comprises a first connecting member, a second connecting member, and a rotating connecting member, the rotating connecting member is rotatably connected with the carrier body, the first end of the first connecting member and the first end of the second connecting member are fixedly connected with the rotating connecting member, the second end of the first connecting member and the second end of the second connecting member are separated from each other, the second end of the first connecting member is the upper abutting end, and the second end of the second connecting member is the lower abutting end.
3. The carrier of semiconductor equipment according to claim 2, wherein the carrier body is provided with an accommodation chamber penetrating in an axial direction and an escape port provided on a side wall of the carrier body and communicating with the accommodation chamber, the rotary connecting member is located in the accommodation chamber, and the upper abutting end and the lower abutting end extend out of the carrier body through the escape port portion.
4. The carrier of semiconductor equipment according to claim 3, further comprising a reset member connected to the rotating member, wherein the reset member is configured to restore the rotating member to an initial position when the workpiece to be processed leaves the carrying protrusion, the initial position is that the lower abutment end is located on a path along which the workpiece to be processed moves toward the carrying protrusion, and the upper abutment end is located outside the path along which the workpiece to be processed moves toward the carrying protrusion.
5. The carrier of claim 4, wherein the reset member is a weight member, the weight member is disposed in the accommodating cavity, one end of the weight member is connected to the rotating connection member, and the other end of the weight member is suspended.
6. The carrier of claim 5, further comprising a detecting member disposed in the receiving chamber, the detecting member being operable to confirm whether the rotating member is located at the initial position.
7. The carrier of semiconductor device as recited in claim 6, wherein the detecting member is an optoelectronic proximity switch, the first connecting member blocks light from the optoelectronic proximity switch when the rotating member is in the initial position, and the first connecting member does not block light from the optoelectronic proximity switch when the rotating member is away from the initial position.
8. The carrier of semiconductor equipment according to claim 2, wherein the rotational connecting member and a carrying surface formed by the plurality of carrying protrusions for carrying the workpiece to be processed are located on the same plane, and a radius of rotation of the upper abutment end is the same as a distance between the carrying protrusions and the rotational connecting member.
9. The carrier of semiconductor equipment according to any one of claims 1 to 8, wherein the temperature measuring assembly further comprises a second temperature measuring member provided on the lower abutment end for attaching to a lower surface of the workpiece to be processed to detect a temperature of the lower surface of the workpiece to be processed when the workpiece to be processed is in contact with the carrier projection.
10. A semiconductor device comprising a process chamber and a carrier device, wherein the carrier device is a carrier device according to any one of claims 1-9, and the carrier device is disposed in the process chamber and is configured to carry a workpiece to be processed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011559740.0A CN112735965B (en) | 2020-12-25 | 2020-12-25 | Semiconductor device and bearing device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011559740.0A CN112735965B (en) | 2020-12-25 | 2020-12-25 | Semiconductor device and bearing device thereof |
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| CN112735965A CN112735965A (en) | 2021-04-30 |
| CN112735965B true CN112735965B (en) | 2024-02-27 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1175964A2 (en) * | 2000-07-27 | 2002-01-30 | Agere Systems Guardian Corporation | Polishing surface temperature conditioning system for a chemical mechanical planarization process |
| TW200404334A (en) * | 2002-06-17 | 2004-03-16 | Mitsubishi Heavy Ind Ltd | Method and apparatus for measuring wafer voltage or temperature |
| JP2009260046A (en) * | 2008-04-17 | 2009-11-05 | Dainippon Screen Mfg Co Ltd | Thermal processing apparatus and substrate temperature measurement method |
| CN102192799A (en) * | 2010-03-12 | 2011-09-21 | 东京毅力科创株式会社 | Probe for temperature measurement, temperature measuring system and temperature measuring method using the same |
| CN102859645A (en) * | 2010-02-24 | 2013-01-02 | 威科仪器有限公司 | Processing methods and apparatus with temperature distribution control |
-
2020
- 2020-12-25 CN CN202011559740.0A patent/CN112735965B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1175964A2 (en) * | 2000-07-27 | 2002-01-30 | Agere Systems Guardian Corporation | Polishing surface temperature conditioning system for a chemical mechanical planarization process |
| TW200404334A (en) * | 2002-06-17 | 2004-03-16 | Mitsubishi Heavy Ind Ltd | Method and apparatus for measuring wafer voltage or temperature |
| JP2009260046A (en) * | 2008-04-17 | 2009-11-05 | Dainippon Screen Mfg Co Ltd | Thermal processing apparatus and substrate temperature measurement method |
| CN102859645A (en) * | 2010-02-24 | 2013-01-02 | 威科仪器有限公司 | Processing methods and apparatus with temperature distribution control |
| CN102192799A (en) * | 2010-03-12 | 2011-09-21 | 东京毅力科创株式会社 | Probe for temperature measurement, temperature measuring system and temperature measuring method using the same |
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| CN112735965A (en) | 2021-04-30 |
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