CN112730146A - Etching rate testing device and method for etching solution - Google Patents
Etching rate testing device and method for etching solution Download PDFInfo
- Publication number
- CN112730146A CN112730146A CN202110337035.4A CN202110337035A CN112730146A CN 112730146 A CN112730146 A CN 112730146A CN 202110337035 A CN202110337035 A CN 202110337035A CN 112730146 A CN112730146 A CN 112730146A
- Authority
- CN
- China
- Prior art keywords
- etching
- sample
- nozzle
- injection tube
- etching rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N5/00—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
- G01N5/04—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by removing a component, e.g. by evaporation, and weighing the remainder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses an etching rate testing device and a testing method of etching liquid, wherein the testing device comprises a pressure gauge, a nozzle, a tee joint, a valve, an injection pipe and a propelling mechanism, the pressure gauge, the nozzle and the injection pipe are connected through the tee joint, a sample table for placing a sample to be etched is arranged below the nozzle, a piston rod of the injection pipe is connected with the propelling mechanism, the piston rod is pushed by the propelling mechanism to inject liquid in the injection pipe into the tee joint, the liquid is sprayed on the sample to be etched through the nozzle, and the pressure gauge is used for measuring the spraying pressure at the nozzle. According to the invention, the etching rate of copper is calculated by utilizing a weight loss method according to the comparative analysis of the quality of copper before and after the test. Wherein the injection tube is actively connected with the push rod, can be disassembled to realize the quick replacement of different etching solutions, and has the characteristics of convenience and time saving.
Description
Technical Field
The invention belongs to the field of circuit board manufacturing, relates to a flexible PCB etching technology, and particularly relates to an etching rate testing device and a testing method of an etching solution.
Background
The etching technology is a process of forming a PCB by etching a copper foil covered on a substrate using a chemical etching solution, and plays a key role in the production process of flexible PCB products. With the progress of industry, printed circuit boards are developed in the direction of densification and multilayering, the wiring density is increased, the requirement on the etching process is higher and higher, and the research on the key technology of the etching process is urgently needed.
In the etching production process of the flexible PCB, factors such as the type of etching solution, the etching temperature, the concentration of the etching solution, the spraying pressure and the like influence the etching rate, wherein the type and the concentration of the etching solution determine the etching quality to a certain extent. The type of the etching solution in the manufacturing process of the printed circuit board can directly influence the precision and the quality of the high-density circuit, and the etching solution commonly used in the market is FeCl3Solution, H2O2~H2SO4Solution, acidic CuCl2Solution and ammonia basic CuCl2Solutions, their side reactions, waste liquid treatment, etching stability, and the like are different. The etching rate of the solution generally increases with the increase of the concentration, and the smooth proceeding of the etching process can be ensured only by controlling the concentration within a certain range. Meanwhile, the concentration of the etching solution is reduced due to overlong use time of the etching solution, the etching rate is reduced, and the etching solution needs to be replaced in time. Therefore, the etching rate test of the etching solution with different types and different concentrations has important significance for the research of the etching process.
Present etching rate testing arrangement is mostly the integrated design, connects closely and can not change between the local original paper, and this just leads to changing whole testing arrangement at the in-process of changing etching solution, and the wasting of resources is serious, can't accomplish the maximize utilization of resource. Meanwhile, the replacement process is complicated, the etching time is prolonged, the etching effect is influenced, certain technical difficulty exists in the process of cleaning the container, and the related research of the etching process is limited to a certain extent.
Disclosure of Invention
The invention aims to provide an etching rate testing device and an etching rate testing method for etching solution, which can realize simple replacement of different etching solutions and accurate calculation of etching rates under different pressures in the etching process of a flexible PCB. And providing a guide direction for optimizing the process parameters.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
an etching rate testing device of etching solution is characterized in that: including manometer, nozzle, tee bend, valve, syringe and advancing mechanism, the reducer pipe that the syringe front end reduces for the diameter, and the export of reducer pipe front end links to each other with valve one side, and the valve opposite side can be dismantled with the first interface of tee bend and link to each other, and the tee bend second interface links to each other with the manometer, and the tee bend third interface links to each other with the nozzle, the nozzle below is equipped with and is used for placing the sample platform of treating the sculpture sample, the piston rod of syringe links to each other with advancing mechanism, promotes the liquid injection tee bend in the piston rod will be injected into through advancing mechanism, sprays on treating the sculpture sample through the nozzle, the manometer is used for measuring the blowout pressure of nozzle department.
Furthermore, a waste liquid tank for receiving etching liquid is arranged below the sample table.
Further, the injection tube is made of a transparent acrylic material.
Further, the pressure gauge is vertically installed on a second connector of the tee joint through an elbow.
Furthermore, the pressure gauge is a PP diaphragm pressure gauge and consists of a diaphragm isolator and a universal pressure gauge.
Further, the propelling mechanism is a screw nut sliding table mechanism.
A test method for etching rate of etching solution in PCB preparation technology is characterized in that: the etching rate testing device of the etching solution comprises the following steps:
step 1, selecting a material of a sample to be etched, cutting and drying the sample to be etched, weighing, recording the mass before etching, and placing the weighed etching sample on a sample table;
step 4, after etching, cleaning and drying the etching sample, weighing again, and recording the weight after etching;
and 5, calculating the etching rate by adopting a weight loss method, wherein the calculation formula is as follows:
in the above formula, the first and second carbon atoms are,vis the etching rate; Δ m is the etching quality, i.e., the difference between the quality before and after etching of the etched sample;Ais the etching area;ρis the density of the etched sample;tis the etching time.
Further, in the step 2, after the injection tube is connected, the distance between the etching sample and the nozzle is adjusted to be 0-70 mm.
Further, in step 2, the movement speed of the propelling mechanism is calculated as follows:
firstly, determining the corresponding relation between the spray pressure and the nozzle flow according to the inherent characteristics of the nozzle, searching the corresponding nozzle flow according to the selected spray pressure, and calculating the moving speed of a piston in the injection tube, namely the moving speed of a propelling mechanism according to the nozzle flow, wherein the calculation formula is as follows:
wherein the content of the first and second substances,Qis the flow rate of the nozzle, and is,V 0as the speed of movement of the push rod,Sis the piston area, i.e. the cross-sectional area within the syringe.
Further, in step 4, after weighing, the injection tube is detached, different types or concentrations of etching solutions are replaced, the methods in steps 1 to 4 are installed again for etching, etching data are recorded, after all etching solutions are etched and the etching data are recorded, the method in step 5 is adopted to calculate the etching rate, the influence of the etching solutions on the etching rate is judged, and the optimal process is selected.
The invention has the advantages that:
the invention realizes the quick replacement of the etching solution in the etching rate test process. The conventional etching rate testing device has high sealing performance and tends to be of an integrated structure. If only change container interior etching liquid consuming time hard, the container clearance degree of difficulty is higher, still has the danger of corroding skin. The replacement of the container requires the entire container to be replaced, resulting in waste of resources. The invention saves time and has high efficiency by locally replacing the liquid storage tube, avoids the cleaning process of the container and ensures the stable operation of the etching rate test process.
Drawings
FIG. 1 is a schematic structural diagram of an etching rate testing apparatus for an etching solution.
FIG. 2 is a flow chart of a method for testing the etching rate of different concentration types of etching solutions.
In the figure: 1-screw nut sliding table mechanism, 2-L-shaped connecting plate, 3-push rod, 4-piston rod, 5-injection tube, 6-reducer tube, 7-straight-through PVC ball valve, 8-tee joint, 9-elbow, 10-diaphragm pressure gauge, 11-nozzle, 12-sample table and 13-waste liquid tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in FIG. 1, the invention provides a device for testing etching rate of etching solution, comprising a diaphragm pressure gauge 10, a nozzle 11, a tee joint 8, a straight-through PVC ball valve 7, an injection tube 5 and a propelling mechanism, the front end of the injection pipe 5 is a reducer pipe 6 with a reduced diameter, the outlet of the front end of the reducer pipe 6 is connected with the right side of the valve, the left side of the valve is detachably connected with the first interface (connected by screw threads or bayonet) on the right side of the tee joint 8, the second interface on the left side of the tee joint 8 is connected with the pressure gauge through an elbow 9, the third interface at the lower end of the tee joint 8 is connected with the nozzle 11, a sample table 2 for placing a sample to be etched is arranged below the nozzle 11, a piston rod 4 of the injection tube 5 is connected with a propelling mechanism, the propelling mechanism is used for pushing the piston rod 4 to inject the liquid in the injection tube 5 into the tee joint 8, the sample to be etched is sprayed through the nozzle 11, and the pressure gauge is used for measuring the spraying pressure at the nozzle 11.
In this embodiment, the valve adopts straight-through PVC ball valve 7, is convenient for after the imbibition of injection tube 5 before being connected with tee bend 8, prevents that the etching solution in injection tube 5 from leaking. The pressure gauge adopts the diaphragm pressure gauge 10, so that etching liquid can be effectively prevented from corroding parts of the pressure gauge, the elbow 9 is an upward bent pipe, the diaphragm pressure gauge 10 is vertically placed, accurate pressure reading is guaranteed, and the purpose is to prevent the etching liquid coming out of the injection pipe 5 from directly impacting the pressure gauge to cause inaccurate reading. Besides, the anti-vibration device has an anti-vibration function, and can prevent the problems of slight vibration of the pipeline and the like caused by rapid flowing of the liquid medicine.
In the embodiment of the invention, the injection tube 5 is a conventional injection tube (for example, a medical injector added with an anticorrosive lining can be adopted), a movable piston and a piston rod connected with the piston are arranged in the injection tube 5, the front end of the injection tube is provided with a reducer 6 (the reducer 6 and the injection tube can be integrally manufactured or separately manufactured and then connected through threads), the small diameter section at the front end of the reducer is an outlet of the injection tube, the outlet is connected with the right end of a straight-through PVC ball valve 7, the propulsion mechanism is a screw nut sliding table mechanism 1 and specifically comprises a slide block, a screw rod motor and a guide rail rod (the prior art and the detailed structure is not shown in the figure), the slide block is arranged on the guide rail rod, the sliding direction of the slide block is limited through the guide rail rod, the slide block is connected with the screw rod through thread matching or fixedly connected with the screw nut on the screw rod, thereby driving the slider to move back and forth along the guide rail rod. In this embodiment, an L-shaped connecting plate 2 is arranged on the slider, a push rod 3 is arranged on the L-shaped connecting plate 2, and the push rod 3 and the piston rod 4 are in quick connection through threads or bayonets. Efficient etching rate testing of different etching solutions is achieved by replacing the injection tube 5.
In the embodiment of the invention, the linear velocity (mm/s), the maximum load (Kg) and the maximum stroke (mm) of the screw nut sliding table mechanism 1 are determined to meet the requirements of the invention on the propelling speed and the spraying pressure of the piston rod 4.
The injection tube 5 is made of acrylic materials, has high transparency, chemical stability and weather resistance, does not react with most of etching solution, and can well store the etching solution. The inner diameter is marked as D and is 50 mm; the length is 500mm and the wall thickness is predetermined to be 2mm to ensure that the wall bears the maximum pressure required in the pipe.
To ensure accurate reading of the diaphragm pressure gauge 10, it is further calibrated before use. Before the diaphragm pressure gauge 10 is installed, the model, the diaphragm material, the measurement range and the like must be carefully measured; when no pressure exists, the pressure instrument indicates whether the pressure instrument is at a zero position, and simultaneously, the reason is found out, the pressure instrument is re-calibrated, and the pressure instrument can be used only after being verified to be qualified.
Regarding the spraying device, the nozzle 11 is connected with the third interface at the lower end of the tee joint 8, the speed and the spraying amount of the nozzle 11 are influenced by pressure, and the opening of the nozzle 11 is directly sprayed on the copper plate to test the etching rate. The spraying direction, speed and volume of the liquid medicine are controlled to meet the requirement of the required sample. The spraying device adopts injection type spraying, so that the etching solution is effectively and uniformly sprayed onto the etching plate, and various etching solution etching rate tests are carried out. Because the nozzle 11 adopts the circular arc profile structure, the pressure loss is small, the required straight pipe section is short, and the precision is high. The inner diameter is 8 mm.
In order to control the flow direction of the liquid medicine in the spraying process, further, the position of the waste liquid tank 13 is arranged, and after the etching liquid etches the sample through the nozzle 11, the etching liquid smoothly flows through the sample stage 2 and flows into the waste liquid tank 13. Stored in a waste liquid tank 13 to prevent the waste liquid from polluting the environment. Further, it is necessary to adjust an appropriate height to prevent the waste liquid medicine from splashing. In order to secure a sufficient ejection amount, the capacity of the waste liquid tank 13 is secured at least once for the spraying experiment.
The etching rate test method of the present invention will be described below by taking a copper plate as an example of an etching sample.
As shown in fig. 2, which is a flow chart of an etching rate testing process, the method saves the time for replacing the etching solution, effectively avoids the cleaning process of the etching solution, and improves the testing efficiency, and the specific implementation method comprises the following steps:
s1, selecting a copper sample to slice in the first step, baking the sliced copper sample in the second step, then using an electronic balance, after the electronic balance is set to zero, weighing the sliced copper sample, and recording the mass asm 1The sample copper is then placed on a bench stand to wait for etching.
S2, firstly, selecting etching solution to be tested, installing the through type PVC ball valve 7 on an outlet of the injection tube 5, enabling the front end of the through type PVC ball valve 7 to be immersed into the etching solution, pulling a piston rod of the injection tube 5 to enable the etching solution to enter the injection tube, closing the through type PVC ball valve 7, connecting the front end of the through type PVC ball valve 7 with a first connector on the right side of the tee joint 8, and connecting the piston rod of the injection tube 5 with a push rod of a pushing mechanism. The distance between the nozzle 11 and the sample copper is determined after the device is connected. Firstly setting etching time, then starting a motor of a propelling mechanism to push a piston rod through a push rod, and enabling the piston rod to rotate at a speedV 0And (5) starting etching at a constant speed. In the etching process, according to the required spraying pressure, the flow of the nozzle is calculated by contrasting a relation table (shown in table 1) of the flow and the pressure of the nozzle, and then the required propelling speed of the propelling mechanism under the experimental pressure is preliminarily determined according to a formula (1).
In the formula (1), the first and second groups,Qin order to output the flow rate of the system,V 0in order to speed the advancing mechanism in advance,Sis the cross-sectional area in the liquid storage tube. Simultaneously observing the reading of the pressure gauge and finely adjusting the propelling speed of the propelling mechanismV 0So as to achieve the spraying pressure required by the experiment.
S3, after etching, the etched sample copper is first cleaned.The electronic balance is set to zero, the completely cleaned sample copper is weighed, and the mass is recordedm 2. After the etching data is recorded, the original injection pipe (the injection pipe 5 and the straight-through PVC ball valve 7 are disassembled and assembled together) is disassembled to be replaced by etching liquid with different concentration or different etching liquid, and the etching liquid is injected into a new injection pipe to be connected with the original propelling mechanism for etching again.
S4, after all etching solutions are etched and etching data are recorded, calculating the etching rate by a weight loss method, wherein the calculation formula is as follows:
in the formula (2), the first and second groups,vetching rate (. mu.m/min); deltamEtching mass (mg);Ais an etching area (mm)2）；ρIs the copper density;tthe etching time (min). And obtaining the mass difference, namely the etching mass, according to the recorded mass before and after the etching of the sample copper, and obtaining the mass difference in unit area and unit time, namely the etching rate of the etching solution according to the density, specification and etching time of the sample copper.
As a specific example, in the step S1, the copper sample has a specification of 20mm × 40mm after being sliced and a density of 8.93g/cm3The baking temperature is 120-140 ℃, the baking time is one hour, the precision of the electronic balance is 0.0001g, and the weight is recorded as m1。
As a specific example, in the step S2, the distance between the nozzle 11 and the copper sample is 0-70 mm, and the advancing speed of the advancing mechanismV 00 to 16.7mm/s, spray flow rateQThe range is 0-2L/min, and the range of the pressure gauge is 0-0.3 MPa.
As a specific example, in step S4, the mass difference is Δm=m 1-m 2The copper density is 8.93g/cm3The specification is 20mm × 40mm, and the etching time is 3 min.
The above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (10)
1. An etching rate testing device of etching solution is characterized in that: including manometer, nozzle, tee bend, valve, syringe and advancing mechanism, the reducer pipe that the syringe front end reduces for the diameter, and the export of reducer pipe front end links to each other with valve one side, and the valve opposite side can be dismantled with the first interface of tee bend and link to each other, and the tee bend second interface links to each other with the manometer, and the tee bend third interface links to each other with the nozzle, the nozzle below is equipped with and is used for placing the sample platform of treating the sculpture sample, the piston rod of syringe links to each other with advancing mechanism, promotes the liquid injection tee bend in the piston rod will be injected into through advancing mechanism, sprays on treating the sculpture sample through the nozzle, the manometer is used for measuring the blowout pressure of nozzle department.
2. The etching solution etching rate testing device according to claim 1, wherein: and a waste liquid tank for receiving etching liquid is arranged below the sample table.
3. The etching solution etching rate testing device according to claim 1, wherein: the injection tube is made of transparent acrylic materials.
4. The etching solution etching rate testing device according to claim 1, wherein: the pressure gauge is vertically arranged on a second connector of the tee joint through an elbow.
5. The etching rate testing apparatus of etching solution according to claim 4, wherein: the pressure gauge is a PP diaphragm pressure gauge and consists of a diaphragm isolator and a universal pressure gauge.
6. The etching solution etching rate testing device according to claim 1, wherein: the propelling mechanism is a screw nut sliding table mechanism.
7. A test method for etching rate of etching solution in PCB preparation technology is characterized in that: the etching rate testing apparatus using the etching solution according to any one of claims 1 to 6, the testing method comprising the steps of:
step 1, selecting a material of a sample to be etched, cutting and drying the sample to be etched, weighing, recording the mass before etching, and placing the weighed etching sample on a sample table;
step 2, selecting etching liquid according to the type of a sample material to be etched, sucking the etching liquid into the injection tube, closing a valve at the outlet of the injection tube, connecting the valve with the tee joint, connecting a piston rod at the rear end of the injection tube with the propelling mechanism, and setting the etching time and the motion speed of the propelling mechanism;
step 3, starting a propelling mechanism to push a piston rod of the injection tube, so that etching liquid in the injection tube is sprayed on a sample to be etched through a nozzle, and stopping the propelling mechanism after the etching time is up;
step 4, after etching, cleaning and drying the etching sample, weighing again, and recording the weight after etching;
and 5, calculating the etching rate by adopting a weight loss method, wherein the calculation formula is as follows:
in the above formula, the first and second carbon atoms are,vis the etching rate; Δ m is the etching quality, i.e., the difference between the quality before and after etching of the etched sample;Ais the etching area;ρis the density of the etched sample;tis the etching time.
8. The test method of claim 7, wherein: in step 2, after the injection tube is connected, the distance between the etching sample and the nozzle is adjusted.
9. The test method of claim 7, wherein: in step 2, the motion speed of the propulsion mechanism is calculated as follows:
firstly, determining the corresponding relation between the spray pressure and the nozzle flow according to the inherent characteristics of the nozzle, searching the corresponding nozzle flow according to the selected spray pressure, and calculating the moving speed of a piston in the injection tube, namely the moving speed of a propelling mechanism according to the nozzle flow, wherein the calculation formula is as follows:
wherein the content of the first and second substances,Qis the flow rate of the nozzle, and is,V 0as the speed of movement of the push rod,Sis the piston area, i.e. the cross-sectional area within the syringe.
10. The test method of claim 7, wherein: in the step 4, after weighing, the injection tube is detached, different types or concentrations of etching solutions are replaced, the methods in the steps 1 to 4 are installed again for etching, etching data are recorded, after all the etching solutions are etched and the etching data are recorded, the method in the step 5 is adopted to calculate the etching rate, the influence of the etching solutions on the etching rate is judged, and the optimal process is selected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110337035.4A CN112730146B (en) | 2021-03-30 | 2021-03-30 | Etching rate testing device and method for etching solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110337035.4A CN112730146B (en) | 2021-03-30 | 2021-03-30 | Etching rate testing device and method for etching solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112730146A true CN112730146A (en) | 2021-04-30 |
| CN112730146B CN112730146B (en) | 2021-08-17 |
Family
ID=75595990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110337035.4A Active CN112730146B (en) | 2021-03-30 | 2021-03-30 | Etching rate testing device and method for etching solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112730146B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092301A (en) * | 2023-10-20 | 2023-11-21 | 江苏联卓光电材料有限公司 | Etching capability detection device and detection method for etching solution |
| CN117881095A (en) * | 2024-03-13 | 2024-04-12 | 深圳市凌航达电子有限公司 | Circuit etching parameter compensation optimization method and system for fine circuit board |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204521048U (en) * | 2015-02-09 | 2015-08-05 | 象山康丽针织厂 | Continuous syringes for animals |
| CN106186712A (en) * | 2016-07-14 | 2016-12-07 | 成都工投电子设备有限公司 | Top-jet-type spray etching machine |
| CN207176078U (en) * | 2017-09-15 | 2018-04-03 | 浙江德西瑞新能源科技股份有限公司 | Improved etching machine |
| CN108034946A (en) * | 2017-11-20 | 2018-05-15 | 西安交通大学 | Spray etching system |
| CN108333382A (en) * | 2018-04-17 | 2018-07-27 | 东南大学 | A kind of accurate sampling device of Mechanical Driven |
| CN208127155U (en) * | 2018-03-22 | 2018-11-20 | 昆山国显光电有限公司 | A kind of ejecting device and wet-method etching equipment |
| CN211148679U (en) * | 2019-09-11 | 2020-07-31 | 中国环境科学研究院 | Miniature liquid sampling device in laboratory |
| CN111901979A (en) * | 2020-08-13 | 2020-11-06 | 西安交通大学 | Multi-parameter automatic regulation and control efficient rotary spraying etching system |
| CN112087879A (en) * | 2020-10-22 | 2020-12-15 | 东阳杏泊电子科技有限公司 | Automatic etching equipment of circuit board fountain |
-
2021
- 2021-03-30 CN CN202110337035.4A patent/CN112730146B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204521048U (en) * | 2015-02-09 | 2015-08-05 | 象山康丽针织厂 | Continuous syringes for animals |
| CN106186712A (en) * | 2016-07-14 | 2016-12-07 | 成都工投电子设备有限公司 | Top-jet-type spray etching machine |
| CN207176078U (en) * | 2017-09-15 | 2018-04-03 | 浙江德西瑞新能源科技股份有限公司 | Improved etching machine |
| CN108034946A (en) * | 2017-11-20 | 2018-05-15 | 西安交通大学 | Spray etching system |
| CN208127155U (en) * | 2018-03-22 | 2018-11-20 | 昆山国显光电有限公司 | A kind of ejecting device and wet-method etching equipment |
| CN108333382A (en) * | 2018-04-17 | 2018-07-27 | 东南大学 | A kind of accurate sampling device of Mechanical Driven |
| CN211148679U (en) * | 2019-09-11 | 2020-07-31 | 中国环境科学研究院 | Miniature liquid sampling device in laboratory |
| CN111901979A (en) * | 2020-08-13 | 2020-11-06 | 西安交通大学 | Multi-parameter automatic regulation and control efficient rotary spraying etching system |
| CN112087879A (en) * | 2020-10-22 | 2020-12-15 | 东阳杏泊电子科技有限公司 | Automatic etching equipment of circuit board fountain |
Non-Patent Citations (1)
| Title |
|---|
| 魏静等: "印刷线路板动态蚀刻研究", 《电镀与涂饰》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117092301A (en) * | 2023-10-20 | 2023-11-21 | 江苏联卓光电材料有限公司 | Etching capability detection device and detection method for etching solution |
| CN117092301B (en) * | 2023-10-20 | 2023-12-26 | 江苏联卓光电材料有限公司 | Etching capability detection device and detection method for etching solution |
| CN117881095A (en) * | 2024-03-13 | 2024-04-12 | 深圳市凌航达电子有限公司 | Circuit etching parameter compensation optimization method and system for fine circuit board |
| CN117881095B (en) * | 2024-03-13 | 2024-05-24 | 深圳市凌航达电子有限公司 | Circuit etching parameter compensation optimization method and system for fine circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112730146B (en) | 2021-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112730146B (en) | Etching rate testing device and method for etching solution | |
| CN106645570B (en) | Method and device for detecting surface defects of wind driven generator blade | |
| CN210719297U (en) | Micro-flow and ultramicro-flow measuring device | |
| CN203688332U (en) | Automatic liquid adding device of digestion tube | |
| CN107195850B (en) | Automatic vacuum filling device of electrolyte | |
| CN207457009U (en) | A kind of apparatus for measuring contact angle | |
| CN205850882U (en) | A kind of liquid-transfering device with modular pipetting head | |
| CN1011773B (en) | Apparatus for supplying liquid | |
| CN208187686U (en) | A kind of experimental rig for probing into surface drag reduction mechanism | |
| CN107036764A (en) | A kind of High Precision Automatic hand-held pipettor metering device and its metering method | |
| CN208043200U (en) | A kind of flowmeter detection device | |
| CN215177997U (en) | Irregular container measuring device | |
| CN214277146U (en) | High-precision liquid level detection standard device | |
| CN214347573U (en) | Automatic glue injection device for tubular glue | |
| CN214748325U (en) | Oil liquid flow measuring test bed based on high-precision piston oil cylinder | |
| CN2909190Y (en) | Automatic controller of measuring tank | |
| CN109759160B (en) | A kind of biochip reagent quantitative Adding Way and system | |
| CN209729212U (en) | The on-way resistance experiment instrument of multistable | |
| CN113385120A (en) | Intelligent PH adjusting device and method | |
| CN109115298B (en) | Method and device for measuring volume of irregular-shaped catalytic unit | |
| CN205861478U (en) | A kind of automation equipment of hollow-fibre membrane test flux | |
| CN2887573Y (en) | High precision volume-controlled type affusion device for moulding hollow plastic parts | |
| Roy et al. | A method to estimate the accuracy of 1-D flow based permeability measuring devices | |
| CN112629975B (en) | Geotechnical CBR test sample soaking device | |
| CN206849941U (en) | A kind of electrolyte automatic vacuum filling apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |