CN112729590A - Temperature sensor reading device, temperature reading method, and electronic apparatus - Google Patents
Temperature sensor reading device, temperature reading method, and electronic apparatus Download PDFInfo
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- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
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Abstract
The present disclosure provides a readout device of a temperature sensor, a temperature readout method, and an electronic apparatus, the readout device of the temperature sensor including: the temperature-sensitive frequency generation module is respectively connected with the temperature sensor and the reference resistor and is used for generating a temperature frequency signal related to a thermistor in the temperature sensor and a reference frequency signal related to the reference resistor; the measurement counting module is used for counting the pulses of the reference frequency signal within a preset time to obtain a first counting value, counting the pulses of the temperature frequency signal within the preset time to obtain a second counting value, and determining the resistance value of the thermistor within the preset time based on the first counting value and the second counting value; and the linear correction module is used for obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature sensitive resistor. The embodiment of the disclosure has the characteristics of low power consumption and high precision.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to a readout device of a temperature sensor, a temperature readout method, and an electronic device.
Background
The temperature is an environmental variable frequently used in daily production and life, and the rapid, accurate and safe acquisition of temperature parameters has very important significance in industrial and agricultural production, health care, consumer electronics, scientific research, national defense aviation and a plurality of aspects of society. Corresponding temperature sensors may be employed, including gas temperature sensors, liquid temperature sensors, thermocouple sensors, pressure temperature sensors, semiconductor temperature sensors, resistance temperature sensors, etc., corresponding to different application conditions and requirements.
The temperature sensor reading circuit with low cost and high integration level is generally realized by adopting a CMOS (complementary metal oxide semiconductor) process, and the temperature sensor reading circuit integrating a temperature sensing element triode is mainly used at present. In the reading circuit structure of the temperature sensor based on the triode, the directly obtained temperature related variable is voltage, in order to accurately obtain a temperature value, a high-precision analog-to-digital converter is adopted to discretize the voltage, then digital processing is carried out or a singlechip is used for controlling, and the power consumption is larger; meanwhile, the triode is directly integrated with the reading circuit, so that the temperature measurement result is easily influenced by the heat dissipation of the whole circuit.
Disclosure of Invention
Technical problem to be solved
Based on the above problems, the present disclosure provides a reading device of a temperature sensor, a temperature reading method and an electronic device, so as to alleviate technical problems in the prior art, such as large power consumption of a temperature reading circuit of the temperature sensor, and easy influence of heat dissipation of a whole temperature measurement result on the temperature measurement result.
(II) technical scheme
The present disclosure provides a readout circuit of a temperature sensor, a temperature readout method, and an electronic apparatus. The embodiment of the disclosure has the characteristics of low power consumption and high precision.
According to an aspect of the present disclosure, there is provided a readout apparatus of a temperature sensor, including:
the temperature-sensitive frequency generation module is respectively connected with the temperature sensor and the reference resistor and is used for generating a temperature frequency signal related to the temperature-sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor;
the measurement counting module is used for counting pulses of the reference frequency signal within preset time to obtain a first counting value, counting pulses of the temperature frequency signal within preset time to obtain a second counting value, and determining the resistance value of the temperature-sensitive resistor within the preset time based on the first counting value and the second counting value; and
and the linear correction module is used for obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature sensitive resistor.
In some possible embodiments, the temperature-sensitive frequency generation module includes: an on-chip oscillator and a selection switch; the selection switch is used for selectively switching on the on-chip oscillator and the temperature-sensitive resistor or switching on the on-chip oscillator and the reference resistor.
In some possible embodiments, the selection switch is further configured to turn on the on-chip oscillator and the reference resistor for a first time period, and turn on the on-chip oscillator and the temperature-sensitive resistor for a second time period after the first time period, where the first time period and the second time period are the same and are the preset time.
In some possible embodiments, the linear correction module is further configured to obtain a temperature resistance characteristic curve of the temperature-sensitive resistor by using piecewise non-uniform interpolation.
In some possible embodiments, the linear correction module is further configured to perform a segmentation process on the temperature characteristic curve of the temperature-sensitive resistor, where the temperature range corresponding to each segment is the same, and the number of interpolated temperatures in each segment is inversely proportional to the temperature value in the corresponding segment.
In some possible embodiments, the apparatus further includes a storage module, configured to store a plurality of temperature values and a correction coefficient between adjacent temperature values, where the temperature values are the respective interpolated temperatures in the temperature characteristic curve of the temperature-sensitive resistor.
In some possible embodiments, the apparatus further comprises a display module for displaying the temperature value.
In some possible embodiments, the measurement count module comprises a digital counter.
According to a second aspect of the present disclosure, there is provided a temperature readout method applied to the readout device of the temperature sensor described in the above first aspect, the temperature readout method comprising:
obtaining a temperature frequency signal related to a temperature sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor;
counting the pulses of the temperature frequency signal within a preset time to obtain a first count value, counting the pulses of the reference frequency signal within the preset time to obtain a second count value, and determining the resistance value of the temperature-sensitive resistor within the preset time based on the first count value and the second count value;
and obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature-sensitive resistor.
According to a second aspect of the present disclosure, there is provided an electronic device comprising:
a temperature sensor;
a temperature sensor drainage device according to any one of the first aspect above;
one or more processors;
a memory for storing processor-executable instructions;
wherein the one or more instructions, when executed by the one or more processors, cause the one or more processors to implement obtaining a temperature value for a temperature sensor.
In the embodiment of the disclosure, a readout device of a resistance type temperature sensor capable of being applied in multiple scenarios is provided, a temperature-sensitive frequency generation module may be used to obtain a temperature frequency signal corresponding to a temperature-sensitive resistor of the temperature sensor and a reference frequency signal corresponding to a reference resistor, a ratio between the reference frequency signal and the temperature frequency signal is used to eliminate an influence of temperature on an oscillation coefficient, so as to obtain a resistance value of the temperature-sensitive resistor, and a temperature value is obtained by using the resistance value and a temperature resistance characteristic curve of the temperature-sensitive resistor obtained in advance. In addition, the power consumption can be saved, the temperature-sensitive frequency generation module in the sensor reading circuit is designed as an analog circuit, other modules are digital circuits, the overall power consumption is low, the power consumption is synchronously reduced along with the progress of the use process, and correspondingly, the influence of the heat dissipation of other devices on the temperature detection result is reduced.
(III) advantageous effects
As can be seen from the foregoing technical solutions, the readout device, the temperature readout method, and the electronic device of the temperature sensor according to the present disclosure have at least one or some of the following advantages:
(1) the problems that a traditional resistance type temperature sensor reading circuit is narrow in temperature measurement range, large in occupied area and large in power consumption are solved;
(2) limited resources can be fully utilized, and meanwhile, an accurate large-range temperature measurement result is obtained;
(3) the method has the characteristic of high integration level, and is beneficial to low-cost application;
(4) the circuit area can be saved, a smaller ROM unit can be used, a certain precision is kept, a large temperature measurement range is obtained, and the application scene of the sensor reading circuit is favorably expanded;
(5) power consumption can be saved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent from the following description of embodiments of the present disclosure with reference to the accompanying drawings, in which:
fig. 1 schematically shows a block diagram of a composition structure of a readout device of a temperature sensor according to an embodiment of the present disclosure.
Fig. 2 schematically shows a specific structural diagram of a readout apparatus of a temperature sensor according to an embodiment of the present disclosure.
Fig. 3 schematically shows a temperature-sensitive resistance-temperature resistance characteristic segmented graph.
Fig. 4 schematically shows a block diagram of a component structure of an electronic device according to an embodiment of the present disclosure.
[ reference numerals ]
10-a temperature-sensitive frequency generation module; 20-measuring and counting module; 30-a linearity correction module; 40-a system frequency generation module; 50-a storage module; 60-a display module; 800- -an electronic device; 802-a processing component; 804-a memory; 806-power supply components; 808-multimedia components; 810-an audio component; 812 — an input/output (I/O) interface; 814-a sensor assembly; 816-a communication component; 820-a processor.
Detailed Description
Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the term "at least one" herein means any one of a plurality or any combination of at least two of a plurality, for example, including at least one of A, B, C, and may mean including any one or more elements selected from the group consisting of A, B and C.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present disclosure may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present disclosure.
The reading device of the temperature sensor can obtain a temperature frequency signal corresponding to a temperature-sensitive resistor of the temperature sensor and a reference frequency signal corresponding to a reference resistor by using a temperature-sensitive frequency generation module, eliminate the influence of temperature on an oscillation coefficient by using a ratio between the reference frequency signal and the temperature frequency signal to obtain a resistance value of the temperature-sensitive resistor, and obtain a temperature value by using the resistance value and a temperature resistance characteristic curve of the temperature-sensitive resistor obtained in advance. In addition, the readout apparatus of the temperature sensor according to the embodiment of the present disclosure may be applied to any electronic device, and the electronic device may be a User Equipment (UE), a mobile device, a User terminal, a cellular phone, a cordless phone, a Personal Digital Assistant (PDA), a handheld device, a computing device, an in-vehicle device, a wearable device, and the like, but is not limited to the specific limitation of the present disclosure.
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
Fig. 1 is a schematic block diagram illustrating a component structure of a readout apparatus of a temperature sensor according to an embodiment of the present disclosure, and it should be noted that fig. 1 is only an example of a system architecture to which the embodiment of the present disclosure may be applied to help those skilled in the art understand the technical content of the present disclosure, but does not mean that the embodiment of the present disclosure may not be used in other devices, systems, environments or scenarios.
As shown in fig. 1, the readout device of the temperature sensor may include a temperature sensitive frequency generation module 10, a measurement count module 20, and a linearity correction module 30.
The temperature-sensitive frequency generating module 10 is respectively connected to a temperature sensor and a reference resistor, and is configured to generate a temperature frequency signal related to the temperature-sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor. In some possible embodiments, the temperature-sensitive frequency generation module 10 may include an on-chip oscillator and a selection switch, where the selection switch may be used to selectively turn on the on-chip oscillator and the temperature-sensitive resistor, or turn on the on-chip oscillator and the reference resistor. For example, the selection switch may include two switching units, such as a first switching unit and a second switching unit. The first switch unit is connected with the temperature-sensitive resistor and used for connecting the temperature-sensitive resistor to the on-chip oscillator in parallel, and the second switch unit is connected with the reference resistor and used for connecting the reference resistor to the on-chip oscillator in parallel. The connection between the temperature-sensitive resistor or the reference resistor and the on-chip oscillator is realized by controlling the on-off of the first switch unit and the second switch unit, and the oscillation frequency (reference frequency signal and temperature frequency signal) of the two resistors respectively connected to the on-chip oscillator is obtained. The first switch unit and the second switch unit may be transistors, but are not limited in this disclosure.
In the embodiment of the disclosure, reference resistance and on-chip oscillator that can be in proper order to and switch on temperature sensitive resistance and on-chip oscillator, for example, the select switch is still used for switching on in first time quantum on-chip oscillator with reference resistance, and switch on in the second time quantum after the first time quantum on-chip oscillator with temperature sensitive resistance, first time quantum is the same with the second time quantum and do preset time to can obtain the reference frequency signal of reference resistance in two the same time (preset time) to and the temperature frequency signal that temperature sensitive resistance corresponds.
In addition, fig. 2 schematically shows a specific structural diagram of a readout apparatus of a temperature sensor according to an embodiment of the present disclosure. The embodiment of the present disclosure may further include a system frequency generation module 40, where the system frequency generation module may include an on-chip oscillation circuit and an off-chip crystal, so as to generate a system clock. The selection switch may perform control of the on-times of the temperature sensitive resistor and the reference resistor based on the clock. In addition, in the embodiment of the present disclosure, the preset time is less than a system clock period.
And the measurement counting module 20 is configured to count pulses of the reference frequency signal within a preset time to obtain a first count value, count pulses of the temperature frequency signal within the preset time to obtain a second count value, and determine a resistance value of the temperature sensitive resistor within the preset time based on the first count value and the second count value. In the embodiment of the present disclosure, the measurement counting module 20 may include a digital counter, for example, two digital counters, which may be respectively connected to the temperature-sensitive frequency generating module 10, and are used to count the number of pulses of the temperature-sensitive frequency signal and the reference frequency signal, respectively. Or, a digital counter (e.g., a double-time digital counter) may be included, which is used to count the number of pulses in the reference frequency signal and the temperature-sensitive frequency signal in sequence, and correspondingly obtain the first count value and the second count value. In the embodiment of the disclosure, the measurement counting module may first count the number of pulses of the reference frequency signal to obtain a first count value, and then count the number of pulses of the temperature frequency signal to obtain a second count value.
In addition, the measurement counting module 20 may also obtain the resistance value of the temperature sensitive resistor according to the first count value and the second count value. In the embodiment of the present disclosure, the oscillation frequency f of the on-chip oscillator is:
f＝1/(K*R*C)
wherein, K is the oscillation coefficient, R is the resistance value of the oscillator external resistor, and C is the capacitance value of the oscillator external capacitor.
When the circuit working environment changes, such as the power supply voltage decreases or the temperature and humidity change, the oscillation coefficient K changes, which results in inaccurate measurement results. Therefore, the embodiment of the present disclosure adopts a method of counting respectively, calculates a ratio of the temperature-sensitive resistor to the reference resistor, and eliminates an influence of a change in the K value, which is specifically implemented as follows:
during a fixed preset time t based on the system frequency, firstly, the reference resistor R is addedrefInduced oscillation frequency frefCounting to obtain a first count value Nref(ii) a Then in the same time t, for the temperature sensitive resistor RTInduced oscillation frequency fTCounting to obtain a second count value NT. Then:
NT/Nref＝fT/fref＝Rref/RT；
then, the temperature sensitive resistor oscillates the second count value NTComprises the following steps:
NT＝Rref/RT*Nref；
it can be known that there is no influence of the oscillation coefficient K in the above equation, and meanwhile, the resistance value of the reference resistor is pre-stored, and the resistance value of the temperature sensitive resistor in the time t can be obtained based on the above configuration.
The linear correction module 30 may be configured to obtain a temperature value corresponding to the resistance value based on the resistance value and a temperature resistance characteristic curve of the temperature sensitive resistor. Wherein, each temperature value in the temperature resistance characteristic curve is an uneven temperature value, and the linear correction module 30 can obtain the temperature resistance characteristic curve of the temperature sensitive resistor by using a piecewise uneven interpolation mode.
In some temperature measurement scenes, such as thermometers, temperature resistance curves of temperature-sensitive resistance sensors are generally nonlinear, so that linear calibration is needed in a reading circuit, if a uniform linear interpolation method is adopted for calibration, when the temperature measurement range is small, a ROM with proper storage capacity can be used for coefficient storage, and when the temperature measurement range is increased, the size of the ROM needs to be synchronously increased, so that the circuit area, the power consumption and the cost are directly increased, and the temperature-sensitive resistance sensors cannot be applied to actual products. Therefore, a suitable temperature-sensitive resistance sensor reading circuit needs to be designed, so that the requirement of the temperature measurement range can be met, and the requirement of the temperature measurement precision can be met.
Fig. 3 shows a segmented graph of a typical temperature-sensitive resistance-temperature resistance characteristic, and it can be seen that the temperature resistance characteristic curve is non-linear. To increase the versatility of the temperature sensor reader, it is necessary to support two unit systems of temperature value display, namely, degrees Fahrenheit and degrees Celsius. When the size of the storage module ROM is fixed, for example, the storage capacity is 8X8, half of the storage capacity can be occupied for the degree centigrade, that is, 2^7 ^ 128 numbers.
If a traditional uniform interpolation mode is adopted, 10 numbers are counted between every two interpolation points, and the temperature measuring range is only 12.8 ℃ under the condition of ensuring two-digit precision after decimal point. In fig. 3, as the temperature increases, the absolute value of the slope of the curve (for convenience of description, the absolute value of the slope of the curve is referred to when the slope is negative in the following description) decreases, and if the temperature measurement range of 12.8 degrees celsius is placed at a position where the slope is low, i.e. a high temperature, the obtained temperature measurement result will be more accurate, but since the curve changes more slowly, it is not necessary to use 128 numbers for interpolation, which is a waste of circuit resources; when the temperature measurement range is placed at a position with a higher slope of the curve, namely a low temperature, the resistance change caused by the temperature is steeper, so that the temperature measurement result is inaccurate.
Therefore, the linearity correction module 30 in the embodiment of the present disclosure may calibrate the nonlinearity of the temperature-resistance curve by using a piecewise interpolation or a non-uniform interpolation, so as to obtain the resistance-temperature characteristic curve of the temperature-sensitive resistor. For example, the temperature ranges in the temperature axis may be segmented, with each segment corresponding to the same temperature range, and the number of interpolated temperatures within each segment being inversely proportional to the magnitude of the temperature values within the corresponding segment. In the embodiment of the present disclosure, the sum of the numbers of temperature values in each segment is the storage capacity of the storage module. In addition, the lower the temperature value is, the larger the number of temperatures to be interpolated is, and the higher the temperature value is, the smaller the number of temperatures to be interpolated is. For example, in one example, the curve may be divided into A, B, C, D, E five portions according to the change in slope, each portion having a temperature range of 9.6 degrees Celsius; then, 48 numbers (temperature values) are inserted into the section a with a large slope, and 32, 24, 16 and 8 numbers are sequentially inserted into the B, C, D, E part, and the corresponding interpolation of the above five parts is stored into the partition ROM of fig. 2. Each temperature value may have a resistance value obtained in advance, wherein the corresponding resistance value may be mapped by obtaining the second count value, and in order to ensure the accuracy of two bits after the decimal point, 20 numbers (pulse numbers) are counted between each interpolation point when the a-segment correction is performed; in B segment correction, 30 numbers are counted between each interpolation point; in the C section correction, 40 numbers are counted between each interpolation point; in the D section correction, 60 numbers are counted between each interpolation point; in the E-segment correction, 120 numbers are counted between each interpolation point. Thus, under the condition of comprehensively considering the temperature measurement precision and range, the temperature measurement range of 9.6 x 5, namely 48 ℃ can be obtained in total.
As shown in fig. 2, in the embodiment of the present disclosure, a storage module 50 may further be included, which is configured to store a plurality of temperature values and a correction coefficient between adjacent temperature values, where the temperature value is each interpolated temperature in a temperature characteristic curve of the temperature-sensitive resistor. Correspondingly, the linear calibration module can obtain a temperature resistance characteristic curve by using each interpolation temperature and the corresponding correction coefficient. Wherein the stored correction coefficient is the slope corresponding to the curve between any two adjacent interpolation temperatures.
Based on the configuration, the embodiment of the disclosure can save circuit area, can use a ROM unit with smaller capacity, keeps certain precision and obtains a large temperature measurement range, and is beneficial to expanding the application scene of the sensor reading circuit.
In addition, the embodiment of the present disclosure may further include a display module 60 for displaying the output obtained temperature value, wherein the display module may be a decoding output circuit for outputting timing information capable of driving the LCD to display the temperature value.
In summary, in the embodiment of the present disclosure, the readout apparatus of the temperature sensor solves the problems of a conventional readout circuit of a resistance type temperature sensor, such as narrow temperature measurement range, large occupied area, and large power consumption. The temperature resistance curve is processed in a segmented mode, the ROM is partitioned, correction coefficients of corresponding different partitions are stored in corresponding ROM partitions, limited resources can be fully utilized, and meanwhile accurate large-range temperature measurement results are obtained.
In addition, the reading device of the temperature sensor disclosed by the embodiment of the disclosure has the characteristic of high integration level, integrates other circuit modules except the sensor, the clock reference and the display unit, and is beneficial to low-cost application. In addition, the circuit area can be saved, a smaller ROM unit can be used, a certain precision is kept, a large temperature measurement range is obtained, and the application scene of the sensor reading circuit is favorably expanded. And power consumption can be saved, only two frequency generation circuits in the sensor reading circuit are designed by analog circuits, other circuit modules are all digital circuits, and the overall power consumption is lower. As the use process progresses, power consumption is reduced synchronously.
In addition, an embodiment of the present disclosure may further provide a temperature reading method, where the temperature reading method may be applied to the reading device of the temperature sensor in the foregoing embodiment, where the method includes:
obtaining a temperature frequency signal related to a temperature sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor;
counting the pulses of the temperature frequency signal within a preset time to obtain a first count value, counting the pulses of the reference frequency signal within the preset time to obtain a second count value, and determining the resistance value of the temperature-sensitive resistor within the preset time based on the first count value and the second count value;
and obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature-sensitive resistor.
The implementation of the method steps in the embodiments of the present disclosure is not repeated, and specific reference may be made to the description of the apparatus portion.
An embodiment of the present disclosure further provides an electronic device, including:
one or more processors;
a memory for storing processor-executable instructions;
wherein the one or more instructions, when executed by the one or more processors, cause the one or more processors to implement the method of any of the above.
In the disclosed embodiment, the electronic device may include a temperature sensor and a readout circuit of the temperature sensor connected to the temperature sensor, and configured to obtain a temperature value obtained by the temperature sensor. Wherein the electronic device may be provided as a terminal or other modality of device.
Fig. 4 schematically shows a block diagram of a component structure of an electronic device according to an embodiment of the present disclosure. For example, the electronic device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, or the like terminal.
Referring to fig. 4, electronic device 800 may include one or more of the following components: processing component 802, memory 804, power component 806, multimedia component 808, audio component 810, input/output (I/O) interface 812, sensor component 814, and communication component 816.
The processing component 802 generally controls overall operation of the electronic device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The power supply component 806 provides power to the various components of the electronic device 800. The power components 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.
The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the electronic device 800 is in an operation mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the electronic device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the electronic device 800. For example, the sensor assembly 814 may detect an open/closed state of the electronic device 800, the relative positioning of components, such as a display and keypad of the electronic device 800, the sensor assembly 814 may also detect a change in the position of the electronic device 800 or a component of the electronic device 800, the presence or absence of user contact with the electronic device 800, orientation or acceleration/deceleration of the electronic device 800, and a change in the temperature of the electronic device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 may access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the electronic device 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium, such as the memory 804, is also provided that includes computer program instructions executable by the processor 820 of the electronic device 800 to perform the above-described methods.
Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terms used herein were chosen in order to best explain the principles of the embodiments, the practical application, or technical improvements to the techniques in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A readout device for a temperature sensor, comprising:
the temperature-sensitive frequency generation module is respectively connected with the temperature sensor and the reference resistor and is used for generating a temperature frequency signal related to the temperature-sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor;
the measurement counting module is used for counting pulses of the reference frequency signal within preset time to obtain a first counting value, counting pulses of the temperature frequency signal within preset time to obtain a second counting value, and determining the resistance value of the temperature-sensitive resistor within the preset time based on the first counting value and the second counting value; and
and the linear correction module is used for obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature sensitive resistor.
2. The apparatus of claim 1, the temperature-sensitive frequency generation module comprising: an on-chip oscillator and a selection switch;
the selection switch is used for selectively switching on the on-chip oscillator and the temperature-sensitive resistor or switching on the on-chip oscillator and the reference resistor.
3. The apparatus of claim 2, the selection switch further to turn on the on-chip oscillator and the reference resistor for a first time period, and to turn on the on-chip oscillator and the temperature-sensitive resistor for a second time period after the first time period, the first and second time periods being the same and the preset time.
4. The apparatus of claim 1, wherein the linearity correction module is further configured to obtain a temperature resistance characteristic curve of the temperature-sensitive resistor by using piecewise non-uniform interpolation.
5. The apparatus of claim 4, wherein the linearity correction module is further configured to segment a temperature characteristic curve of the temperature-sensitive resistor, wherein a temperature range corresponding to each segment is the same, and a number of interpolated temperatures within each segment is inversely proportional to a magnitude of a temperature value within the corresponding segment.
6. The apparatus according to claim 4 or 5, further comprising a storage module for storing a plurality of temperature values, which are each interpolated temperature in a temperature characteristic curve of the temperature-sensitive resistor, and a correction coefficient between adjacent temperature values.
7. The device of claim 1, further comprising a display module for displaying the temperature value.
8. The apparatus of claim 1, the measurement counting module comprising a digital counter.
9. A temperature reading method applied to a reading apparatus of the temperature sensor according to any one of claims 1 to 8, the temperature reading method comprising:
obtaining a temperature frequency signal related to a temperature sensitive resistor in the temperature sensor and a reference frequency signal related to the reference resistor;
counting the pulses of the temperature frequency signal within a preset time to obtain a first count value, counting the pulses of the reference frequency signal within the preset time to obtain a second count value, and determining the resistance value of the temperature-sensitive resistor within the preset time based on the first count value and the second count value;
and obtaining a temperature value corresponding to the resistance value based on the resistance value and the temperature resistance characteristic curve of the temperature-sensitive resistor.
10. An electronic device, comprising:
a temperature sensor;
a reading device for a temperature sensor according to any one of claims 1-8;
one or more processors;
a memory for storing processor-executable instructions;
wherein the one or more instructions, when executed by the one or more processors, cause the one or more processors to implement obtaining a temperature value for a temperature sensor.
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