CN112729573A - Semiconductor refrigeration type SPAD single photon detector - Google Patents
Semiconductor refrigeration type SPAD single photon detector Download PDFInfo
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- CN112729573A CN112729573A CN202110050014.4A CN202110050014A CN112729573A CN 112729573 A CN112729573 A CN 112729573A CN 202110050014 A CN202110050014 A CN 202110050014A CN 112729573 A CN112729573 A CN 112729573A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 230000003993 interaction Effects 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 16
- 238000010791 quenching Methods 0.000 claims description 14
- 230000000171 quenching effect Effects 0.000 claims description 14
- 238000005070 sampling Methods 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J11/00—Measuring the characteristics of individual optical pulses or of optical pulse trains
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1917—Control of temperature characterised by the use of electric means using digital means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Automation & Control Theory (AREA)
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Abstract
The invention provides a semiconductor refrigeration type SPAD single-photon detector which comprises: the digital temperature sensor uploads the actual temperature of the refrigeration module to the single chip microcomputer module in real time, an algorithm written in the single chip microcomputer is used for calculating according to the difference value between the target working temperature and the actual temperature set by the interaction module, an enable signal is obtained to control the opening and closing of the relay, the working time of the TEC refrigeration module is controlled, and therefore the temperature control function is achieved.
Description
Technical Field
The invention belongs to the technical field of single photon detection, and particularly relates to a semiconductor refrigeration type SPAD single photon detector.
Background
The single photon detection technology has wide application prospect in the fields of national defense, industry, civil life and the like, such as fluorescence lifetime imaging, radar ranging, three-dimensional vision system, quantum cryptography and the like. Single photon avalanche photodiode (SPAD) is a kind of core device for single photon detection, and is receiving attention and attention from researchers. The single photon avalanche diode in Geiger mode is a detector capable of detecting very weak light signal, and has the advantages of large internal gain, high sensitivity, fast response speed, high detection efficiency, low noise, small volume, firm structure, easy integration, etc. With the continuous expansion of the application field of single photon detection, the performance requirement of the SPAD is higher and higher, the SPAD has higher noise such as dark counting in a normal temperature environment, the SPAD needs to be placed in a low temperature environment for working, a semiconductor refrigerator (Thermo Electric Cooler, abbreviated as TEC) is mostly adopted to refrigerate the SPAD so as to improve the working performance of the SPAD, and an active quenching circuit is needed to control the anode potential of the SPAD so as to reduce the dead time and improve the counting upper limit of the single photon detector.
In order to improve the efficiency of the single-photon detector, patent 201510585608.X uses a temperature bridge, a proportional-Integral-derivative (PID) operation module and a class D audio power amplifier module to output a control signal to control the temperature of the single-photon detector, so that the TEC can work in both a cooling state and a heating state. Patent 201921307621.9 realizes stepless adjustment of the TEC refrigeration plate by controlling the digital-to-analog conversion module to provide a control voltage to the TEC drive chip to change the magnitude and direction of the output voltage. The existing quenching circuit of the single photon detector mainly comprises a passive quenching module, a pulse discrimination and shaping module and a quenching recovery module, wherein a trigger converts a detected signal into two paths of pulses to control the bias voltage at two ends of an SPAD.
The single photon detector can obtain higher detection efficiency, but has the following defects:
1. frequent changes of the current direction can cause damage to the semiconductor refrigeration plate, and the long-time normal operation is difficult to ensure, even the damage of the SPAD is caused.
And 2, the TEC driving chip cannot load larger current, so that the refrigeration effect is limited, and the consumption of stepless regulation power is larger.
3. The refrigerating circuit and the quenching circuit of the single photon detector are independent of each other, when the refrigerating module stops accidentally, the SPAD dark counting rate will rise sharply, and the signal-to-noise ratio of the SPAD dark counting rate is influenced
Disclosure of Invention
The invention aims to solve the technical problem of providing a semiconductor refrigeration type SPAD single-photon detector aiming at the defects in the prior art. In order to solve the technical problems, the invention adopts the technical scheme that: the utility model provides a semiconductor refrigeration type SPAD single photon detector, includes single chip module, relay module, TEC refrigeration module, interactive module, digital temperature sensor circuit, detection module, comparator module and switch module, interactive module includes display screen circuit and keying circuit, digital temperature sensor circuit signal pin with single chip module data receiving pin is connected, single chip module signal output pin with relay module input and switch module link to each other.
In the semiconductor refrigeration type SPAD single photon detector, the digital temperature sensor circuit uploads the actual temperature of the refrigeration module to the single chip microcomputer module in real time, and an algorithm written in the single chip microcomputer is used for calculating according to the difference value between the target working temperature and the actual temperature of the single photon avalanche diode, so that an enabling signal is obtained and transmitted to the relay module to operate.
According to the semiconductor refrigeration type SPAD single photon detector, the singlechip module outputs an enable signal to control the on and off of the relay, and two ends of a switch of the relay module are respectively connected with the anode of the power supply and the anode of the TEC refrigeration module.
According to the semiconductor refrigeration type SPAD single photon detector, the detection module detects and amplifies signals and then transmits the signals to the comparator module, the single chip microcomputer receives pulse signals of the comparator module and outputs two paths of pulse signals to control the switch module, and therefore the quenching time and the recovery time of the detection module are controlled.
According to the semiconductor refrigeration type SPAD single photon detector, when the sampling temperature received by the single chip microcomputer module is larger than the threshold value, the pulse stopping signal is output, and quenching is stopped.
In the semiconductor refrigeration type SPAD single photon detector, the relay module receives the enabling signal of the single chip microcomputer module to control the TEC refrigeration module to be started and closed, and the actual temperature is controlled to be consistent with the target working temperature.
According to the semiconductor refrigeration type SPAD single photon detector, the real-time temperature uploaded by the digital temperature sensor circuit and the set target working temperature are checked through the display screen circuit, and the target working temperature of the current single photon avalanche diode is set through the key circuit.
Compared with the prior art, the invention has the following advantages:
1. the invention uses the digital temperature sensor to obtain the target temperature information and uploads the target temperature information to the singlechip module for data processing, thereby simplifying the circuit structure and improving the reliability compared with the common temperature sensor.
2. The invention compares the collected temperature signal with the set temperature value, if the sampling temperature is higher than the set value, the temperature of the device is high and needs to be reduced, and the TEC refrigeration module is used for refrigerating the device. The SPAD working temperature is far lower than the normal temperature, and when the TEC stops working, the temperature can rise rapidly, so that only one relay is needed to control the refrigeration time of the TEC, the heating function is not needed, the damage to the semiconductor refrigeration piece due to frequent change of the current direction is avoided, and the service life is prolonged.
3. The invention uses the relay to control the TEC refrigerating plate, and can bear larger current load compared with the TEC driving chip control.
4. The temperature control process of the invention is controlled by adopting a software algorithm, the scheme can adjust the parameters by software, is more convenient and faster, does not need a TEC refrigeration driving chip, realizes the temperature control function by a singlechip and other electronic elements, and has better and flexible hardware circuit design and low cost.
5. The invention uses the display screen to display the real-time sampling temperature and the set temperature, and the set temperature value is adjusted by the keys, thereby being convenient for recording and observing during use.
6. The single chip microcomputer module receives the pulse of the comparator module and outputs two paths of pulse signals to control the switch module, so that the quenching and recovery of the detection module are realized. The trigger circuit is replaced, and the integration level is improved.
7. The single chip microcomputer of the refrigeration module replaces a trigger in the quenching circuit, and the output of the pulse signal can be stopped when the sampling temperature rises to exceed a threshold value, so that the SPAD avalanche is stopped in time, and the SPAD is prevented from overload.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
FIG. 1 is a schematic diagram of a semiconductor refrigeration type SPAD single photon detector;
FIG. 2 is a flow chart of a semiconductor refrigeration type SPAD single photon detector;
FIG. 3 is a schematic structural diagram of a semiconductor refrigeration type SPAD single photon detector;
Detailed Description
For better understanding of the contents of the present patent, the technical solutions of the present invention will be further described below with reference to the accompanying drawings. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1, the temperature monitoring device comprises a digital temperature sensor circuit 5 for collecting the temperature of a single photon avalanche diode, a single chip microcomputer module 1 connected with the digital temperature sensor circuit 5 for receiving collected temperature information, processing the collected temperature information and a set temperature input by an interaction module 3 connected with the single chip microcomputer module 1, and a relay module 2 connected with the single chip microcomputer module 1 receiving an enable signal of the single chip microcomputer to make corresponding action and control the operation of a refrigeration module 4. The detection module 6, the comparator module 7, the switch module 8 and the singlechip module 1 form a quenching circuit.
The working process of the invention is as follows: after the device is powered on, when the single chip microcomputer module is powered on to operate, the display screen of the interaction module can display the temperature value transmitted by the digital temperature sensor and the set target temperature in real time, and the target temperature on the display screen is adjusted through the keys of the interaction module. When the actual temperature is higher than the set target temperature, the singlechip obtains an enable signal through an internal algorithm to control the relay to be closed, and the refrigeration module operates; and when the avalanche occurs, the detection module receives an avalanche voltage signal and amplifies the avalanche voltage signal to the comparator module, and the singlechip module receives a pulse signal of the comparator module and outputs two paths of pulses to control the quenching and recovery of the detection module. When the refrigeration module stops working, the sampling temperature rises, the single chip microcomputer stops outputting the pulse signal, and the quenching stops.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and all simple modifications, changes and equivalent structural changes made to the above embodiment according to the technical spirit of the present invention still fall within the protection scope of the technical solution of the present invention.
Claims (7)
1. The semiconductor refrigeration type SPAD single photon detector is characterized by comprising a single chip microcomputer module, a relay module, a TEC refrigeration module, an interaction module, a digital temperature sensor circuit, a detection module, a comparator module and a switch module, wherein the interaction module comprises a display screen circuit and a key circuit, a signal pin of the digital temperature sensor circuit is connected with a data receiving pin of the single chip microcomputer module, and a signal output pin of the single chip microcomputer module is connected with an input end of the relay module and the switch module.
2. The semiconductor refrigeration type SPAD single photon detector as claimed in claim 1, wherein the digital temperature sensor circuit uploads the actual temperature of the refrigeration module to the single chip microcomputer module in real time, and an algorithm written in the single chip microcomputer is used for calculating according to the difference value between the target working temperature and the actual temperature of the single photon detector, so that an enabling signal is obtained and transmitted to the relay module to operate.
3. The semiconductor refrigeration type SPAD single photon detector as claimed in claim 1, wherein said single chip module outputs an enable signal to control the on and off of the relay, and the two ends of the switch of said relay module are respectively connected to the positive electrode of the power supply and the positive electrode of said TEC refrigeration module.
4. The semiconductor refrigeration type SPAD single photon detector as claimed in claim 1, wherein said detection module detects and amplifies the signal and transmits the signal to said comparator module, the single chip receives the pulse signal of said comparator module, and outputs two pulse signals to control said switch module, thereby controlling the quenching time and recovery time of said detection module.
5. The semiconductor refrigeration type SPAD single photon detector as claimed in claim 1, wherein when the sampling temperature received by said single chip module is greater than a threshold value, a stop pulse signal is outputted to stop the quenching.
6. The semiconductor refrigeration type SPAD single photon detector as claimed in claim 1, wherein said relay module receives enable signal of said single chip microcomputer module to control on and off of said TEC refrigeration module, and control actual temperature to be consistent with target working temperature.
7. The semiconductor refrigeration type SPAD single photon detector according to claim 1, wherein real-time temperature uploaded by the digital temperature sensor circuit and set target working temperature are checked through the display screen circuit, and the current target working temperature of the single photon avalanche diode is set through the key circuit.
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CN114894306A (en) * | 2022-07-13 | 2022-08-12 | 济南量子技术研究院 | Up-conversion array camera and imaging method thereof |
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CN114894306A (en) * | 2022-07-13 | 2022-08-12 | 济南量子技术研究院 | Up-conversion array camera and imaging method thereof |
CN114894306B (en) * | 2022-07-13 | 2022-09-13 | 济南量子技术研究院 | Up-conversion array camera and imaging method thereof |
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