CN112728717B - Temperature sensor control method, electronic device and storage medium - Google Patents

Temperature sensor control method, electronic device and storage medium Download PDF

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Publication number
CN112728717B
CN112728717B CN202110004961.XA CN202110004961A CN112728717B CN 112728717 B CN112728717 B CN 112728717B CN 202110004961 A CN202110004961 A CN 202110004961A CN 112728717 B CN112728717 B CN 112728717B
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temperature
target module
value
module
mean value
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CN112728717A (en
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梁景梅
赖海龙
唐于淞
杨柳
王宁
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Gree Electric Appliances Inc of Zhuhai
Gree Wuhan Electric Appliances Co Ltd
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Gree Electric Appliances Inc of Zhuhai
Gree Wuhan Electric Appliances Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/30Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • F24F11/32Responding to malfunctions or emergencies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/30Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • F24F11/49Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring ensuring correct operation, e.g. by trial operation or configuration checks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/50Control or safety arrangements characterised by user interfaces or communication
    • F24F11/61Control or safety arrangements characterised by user interfaces or communication using timers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/62Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
    • F24F11/63Electronic processing
    • F24F11/64Electronic processing using pre-stored data
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/70Control systems characterised by their outputs; Constructional details thereof
    • F24F11/80Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
    • F24F11/86Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling compressors within refrigeration or heat pump circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Fuzzy Systems (AREA)
  • Mathematical Physics (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Control Of Temperature (AREA)

Abstract

The application relates to a temperature sensor control method. The method comprises the following steps: sampling the temperature of a target module in a preset sampling period to obtain N target module temperature values, wherein N is the sampling frequency in the sampling period and is an integer greater than 1; determining a first module temperature mean value in a sampling period according to the N target module temperature values; judging the state of a target module, if the state of the target module is an operating state, determining a first temperature difference value according to the average value of the first module temperatures in two sampling periods, and comparing the first temperature difference value with a maximum rising temperature value, wherein the maximum rising temperature value is a preset maximum rising temperature in the sampling period under the condition that the target module normally operates; and determining the average value of the target module temperature participating in the execution of the target module temperature protection regulation according to the comparison result of the first temperature difference value and the maximum rising temperature value. According to the scheme, the abnormal detection value of the temperature sensor can be effectively processed, and the probability of error protection caused by the abnormal detection value is reduced.

Description

Temperature sensor control method, electronic device and storage medium
Technical Field
The present application relates to the field of temperature sensor technology, and in particular, to a temperature sensor control method, an electronic device, and a storage medium.
Background
At present, the temperature sensor is widely applied and is used in household appliances such as household air conditioners, dehumidifiers and the like. Due to the fact that individual quality differences exist in the temperature sensors and the application scenes of the temperature sensors are diversified, the reliability and the detection accuracy of the temperature sensors are certain, and the situation that jump occurs to the detection result of the temperature of the target module due to the fact that the temperature sensors are damaged or the detection circuit of the temperature sensors is interfered by the outside easily occurs, so that equipment enters the protective adjustment of the temperature of the target module by mistake, for example, frequency limiting, frequency reducing, protective stopping and the like, and normal use of a user is affected.
In the prior art, patent publication No. CN105546760A (a method and an apparatus for controlling a compressor of an air conditioner, and an air conditioner) proposes a method for controlling a compressor of an air conditioner, which can prevent damage to a control target module due to rapid temperature rise by detecting the temperature of the control target module, acquiring a rate of rise of the temperature of the control target module, and controlling the compressor of the air conditioner to reduce the frequency or stop the air conditioner according to a comparison result between the rate of rise and a first threshold and a second threshold.
The technical scheme has the following defects:
when the temperature sensor detects the temperature of the target module abnormally, the equipment can be mistakenly in a protection and adjustment mode, the abnormal detection value of the temperature sensor needs to be processed, and smooth operation is ensured.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides a temperature sensor control method, which can effectively process the abnormal detection value of the temperature sensor and reduce the probability of error protection caused by the abnormal detection value.
The first aspect of the present application provides a temperature sensor control method, including:
sampling the temperature of a target module in a preset sampling period to obtain N target module temperature values, wherein N is the sampling frequency in the sampling period and is an integer greater than 1;
determining a first module temperature mean value in a sampling period according to the N target module temperature values;
judging the state of a target module, if the state of the target module is an operating state, determining a first temperature difference value according to the average value of the first module temperatures in two sampling periods, and comparing the first temperature difference value with a maximum rising temperature value, wherein the maximum rising temperature value is a preset maximum rising temperature in the sampling period under the condition that the target module normally operates;
and determining the average value of the temperature of the target module participating in the execution of the temperature protection and adjustment of the target module according to the comparison result of the first temperature difference value and the maximum rising temperature value.
In one embodiment, determining the first temperature difference value according to the first module temperature mean value in two sampling periods includes:
and subtracting the first module temperature average value of the (k + n) th sampling period from the first module temperature average value of the (k-1) th sampling period to obtain a first temperature difference value, wherein k is an integer larger than 1, and n is a natural number.
In an embodiment, the target module state further includes: a shutdown process state;
if the target module state is a shutdown process state, comparing a second temperature difference value with a maximum descending temperature value, wherein the second temperature difference value is the difference between the first module temperature average value of the kth-1 sampling period and the first module temperature average value of the kth + n sampling period, the maximum descending temperature value is a preset maximum descending temperature in the sampling period under the condition that the target module is normally shut down, and the maximum descending temperature value is larger than zero;
and determining the average value of the target module temperature participating in the execution of the target module temperature protection regulation according to the comparison result of the second temperature difference value and the maximum drop temperature value.
In one embodiment, the temperature sampling of the target module in a preset sampling period includes:
sampling voltage of the target module in a preset sampling period to obtain N sampling voltages, wherein the sampling voltages are voltages obtained by detecting the target module through a temperature sensor;
and converting the N sampling voltages into N target module temperatures through analog-to-digital conversion to obtain N target module temperature values.
In one embodiment, determining a first module temperature mean value over a sampling period according to the N target module temperature values includes:
and after the maximum target module temperature and the minimum target module temperature are removed from the N target module temperature values, calculating a first module temperature mean value.
In one embodiment, the target module state further includes: an abnormal state;
if the calculation result of the first module temperature mean value is equal to the target module temperature short-circuit value or the target module temperature open-circuit value, rejecting the current first module temperature mean value and judging that the target module is in an abnormal state;
the target module temperature short-circuit value is a preset target module temperature when the target module is in a short-circuit state;
the target module temperature open circuit value is a preset target module temperature when the target module is in an open circuit state.
In an embodiment, determining a mean value of the target module temperatures participating in performing the target module temperature protection adjustment according to a comparison result of the first temperature difference value and the maximum temperature rise value includes:
if the first temperature difference value is larger than the maximum rising temperature value, determining that the first module temperature mean value of the (k + n) th sampling period does not participate in executing target module temperature protection adjustment, and determining that the first module temperature mean value of the (k-1) th sampling period is used as the target module temperature mean value to participate in executing the target module temperature protection adjustment;
and if the first temperature difference value is smaller than the maximum rising temperature value, determining that the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period are used as the target module temperature mean value to participate in executing target module temperature protection and adjustment.
In an embodiment, determining a mean value of the target module temperature involved in performing the target module temperature protection adjustment according to the comparison result between the second temperature difference value and the maximum drop temperature value includes:
if the second temperature difference value is larger than the maximum descending temperature value, determining that the target module temperature mean value of the (k + n) th sampling period does not participate in executing target module temperature protection adjustment, and determining that the first module temperature mean value of the (k-1) th sampling period is used as the target module temperature mean value to participate in executing target module temperature protection adjustment;
and if the second temperature difference value is smaller than the maximum descending temperature value, determining that the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period are used as the target module temperature mean value to participate in executing target module temperature protection and adjustment.
In one embodiment, participating in performing target module temperature protection adjustment includes:
comparing the target module temperature mean value with the first temperature, the second temperature and the third temperature;
if the average value of the temperature of the target module is greater than the first temperature and less than the second temperature, sending a target module frequency limit mark bit and controlling the target module frequency limit;
if the average value of the temperature of the target module is higher than the second temperature and lower than the third temperature, sending a target module frequency reduction zone bit and controlling the target module to reduce the frequency;
if the average value of the temperature of the target module is higher than the third temperature, sending a target module protection zone bit and controlling the target module to stop for protection;
the first temperature is a preset frequency limiting temperature threshold, the second temperature is a preset frequency reducing temperature threshold, and the third temperature is a preset shutdown protection temperature threshold.
A second aspect of the present application provides an electronic device, comprising:
a processor; and
a memory having executable code stored thereon, which when executed by the processor, causes the processor to perform the method as described above.
A third aspect of the application provides a non-transitory machine-readable storage medium having stored thereon executable code which, when executed by a processor of an electronic device, causes the processor to perform a method as described above.
The technical scheme provided by the application can comprise the following beneficial effects:
the temperature of the target module is sampled in a preset sampling period, the module temperature mean value in the sampling period is calculated, and in the running state, the difference of the module temperature mean values of the two sampling periods before and after the target module is compared with the maximum rising temperature value, so that whether the two module temperature mean values are the target module temperature mean value participating in executing the temperature protection and adjustment of the target module is determined. Compared with the prior art, the method and the device have the advantages that the module temperature mean value in the sampling period is calculated, the difference between the module temperature mean values in the front sampling period and the module temperature mean value in the rear sampling period is compared with the maximum rising temperature value, the temperature value participating in the module temperature protection adjustment is determined according to the comparison result, the probability that the temperature abnormal value participates in the module temperature protection adjustment is reduced, the problem that the target module enters a wrong protection mode due to the fact that the target module jumps to the abnormal value when the temperature of the target module is detected is effectively avoided, the situation that normal use of a user is influenced due to detection errors of the temperature sensor is reduced, and the user experience is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
FIG. 1 is a schematic flow chart of an embodiment of a method for controlling a temperature sensor according to an embodiment of the present disclosure;
FIG. 2 is a schematic flow chart of an embodiment of a method for controlling a temperature sensor according to an embodiment of the present application;
FIG. 3 is a schematic flow chart of an embodiment of a temperature sensor control method according to an embodiment of the present application;
FIG. 4 is a schematic flow chart of a fourth embodiment of a method for controlling a temperature sensor according to an embodiment of the present application;
FIG. 5 is a schematic flow chart of a fifth embodiment of a method for controlling a temperature sensor according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device shown in an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Example one
At present, the temperature sensor is widely applied and is used in household appliances such as household air conditioners, dehumidifiers and the like. Due to the fact that individual quality differences exist in the temperature sensors and the application scenes of the temperature sensors are diversified, the reliability and the detection accuracy of the temperature sensors are certain, and the situation that jump occurs to the detection result of the temperature of the target module due to the fact that the temperature sensors are damaged or the detection circuit of the temperature sensors is interfered by the outside easily occurs, so that equipment enters the protective adjustment of the temperature of the target module by mistake, for example, frequency limiting, frequency reducing, protective stopping and the like, and normal use of a user is affected. In the prior art, a method is provided for preventing damage to a control target module due to rapid temperature rise by detecting the temperature of the control target module, acquiring the temperature rise rate of the control target module, and controlling a compressor of an air conditioner to reduce the frequency or stop the frequency according to the comparison result of the temperature rise rate and a first threshold and a second threshold. However, the above technical solutions have certain defects, and when the temperature sensor detects the temperature of the target module abnormally, the device may enter the protection and adjustment mode by mistake, and the abnormal detection value of the temperature sensor needs to be processed to ensure smooth operation.
In view of the above problems, embodiments of the present application provide a temperature sensor control method, which can effectively process a detected abnormal value of a temperature sensor, and reduce a probability of false protection caused by detecting the abnormal value.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, an embodiment of a method for controlling a temperature sensor according to the embodiment of the present application includes:
101. sampling the temperature of the target module in a preset sampling period;
the time range of the preset sampling period may be 100-500 ms, and specifically, 100ms may be set as one sampling period, it is understood that, in practical applications, there may be various ways for setting the sampling period, and the above description of the time range of the sampling period and the specific set value are only exemplary and are not only limited to the setting way of the sampling period.
The sampling may be performed N times in one sampling period, the range of N may be set to 10 to 50, and specifically, the sampling time may be set to 10 times, it is understood that, in practical applications, there may be various ways for setting the sampling time, and the above description of the numerical range of the sampling time and the specific value set are only exemplary and are not only limited to the setting way of the sampling time.
The target module refers to a series of operating modules generating temperature in the equipment, and specifically may be a compressor, and it should be understood that the example of the compressor is only exemplary and not intended as the only limitation of the target module.
The temperature sampling refers to sampling according to the set sampling times in a continuous temperature monitoring curve in a sampling period, the sampling mode is not limited, and finally N target module temperature values are obtained.
102. Determining a first module temperature mean value in a sampling period according to the N target module temperature values;
the first module temperature mean value is a calculation result obtained by calculating a mean value of N target module temperature values obtained in one sampling period. For example, the first module temperature mean may be calculated according to the following equation a:
formula A: w ═ P1+ … + Pm-Pmax-Pmin)/(N-2)
Wherein W is a first module temperature mean value, P1 is a first target module temperature value of N target module temperatures, Pm is an mth target module temperature value of the N target module temperatures, m is a positive integer having a maximum value of N, Pmax is a maximum target module temperature, Pmin is a minimum target module temperature, and N is a sampling frequency.
It is to be understood that, in practical applications, the module temperature mean value may be calculated by different methods, and the above description of the module temperature mean value calculation method is only exemplary and not intended to be the only limitation of the module temperature mean value calculation method.
103. If the state of the target module is judged to be the running state, comparing the first temperature difference value with the maximum rising temperature value;
the operating state refers to a state of the target module when the process is operated.
The first temperature difference value is the difference of the first module temperature mean values of the two sampling periods before and after in the sampling period sequence.
The maximum rising temperature value is the maximum rising temperature obtained by an experiment in which the target module is kept running for one sampling period in the environment with worst heat dissipation and maximum heat generation, and is usually larger than zero when the target module is just started or occurs in the normal running process.
104. Determining a target module temperature mean value participating in executing target module temperature protection adjustment according to a comparison result of the first temperature difference value and the maximum rising temperature value;
in the embodiment of the application, the maximum temperature rise value is set as a preset standard value for judging whether the first module temperature mean value obtained by the target module in the running process state can participate in the execution of the target module temperature protection adjustment, that is, when the first temperature difference value is greater than the maximum temperature rise value by default, it is judged that the module temperature mean values of two sampling cycles are excessively increased, an abnormal value may be detected by a temperature sensor, and the abnormal value needs to be prevented from participating in the target module temperature protection adjustment; and when the first temperature difference value is smaller than the maximum rising temperature value by default, namely, the module temperature mean value of the two sampling periods is judged to be increased in a reasonable range, and an abnormal value may not exist.
The temperature protection adjustment includes, but is not limited to, frequency limiting, frequency reducing, shutdown protection and other control strategies of the target module, and which control strategy is specifically executed is judged according to the retained module temperature mean value.
The first embodiment described above can be seen to have the following beneficial effects:
the temperature of the target module is sampled in a preset sampling period, the module temperature mean value in the sampling period is calculated, and in the running state, the difference of the module temperature mean values of the two previous and next sampling periods is compared with the maximum rising temperature value, so that whether the two module temperature mean values are the target module temperature mean value participating in executing target module temperature protection and regulation is determined. Compared with the prior art, the method and the device have the advantages that the module temperature mean value in the sampling period is calculated, the difference between the module temperature mean values in the front sampling period and the module temperature mean value in the rear sampling period is compared with the maximum rising temperature value, the temperature value participating in the module temperature protection adjustment is determined according to the comparison result, the probability of the temperature abnormal value participating in the module temperature protection adjustment is reduced, the problem that the target module enters a wrong protection mode due to the fact that a jumping abnormal value occurs when the target module is subjected to temperature detection is effectively avoided, the situation that normal use of a user is influenced due to detection errors of a temperature sensor is reduced, and user experience is improved.
Example two
In practical applications, when the target module is in an operating state, a specific retention method of the module temperature mean value may be determined according to a comparison result of the first temperature difference value and the maximum rising temperature value, so as to remove an invalid module temperature mean value and reduce a probability that a temperature abnormal value participates in module temperature protection adjustment.
Referring to fig. 2, an embodiment of a temperature sensor control method according to an embodiment of the present application includes:
201. comparing the first temperature difference value to a maximum elevated temperature value;
the first temperature difference value is a difference between first module temperature mean values of two sampling periods before and after in the sampling period sequence, the two sampling periods before and after can be specifically a k-1 th sampling period and a k + n th sampling period, k is an integer greater than 1, and n is a natural number.
Specifically, the first temperature difference value may be obtained by subtracting the first module temperature average value in the (k + n) th sampling period from the first module temperature average value in the (k-1) th sampling period.
And (3) taking different values for k and n to reach the first module temperature mean value between different sampling periods, and performing circular comparison and subtraction to obtain different first temperature difference values and a maximum rising temperature value for comparison so as to determine whether each first module temperature mean value is an effective module temperature mean value.
202. Determining a target module temperature mean value participating in executing target module temperature protection adjustment;
and eliminating an invalid first module temperature mean value according to the comparison result of the first temperature difference value and the maximum rising temperature value, and reserving the valid first module temperature mean value as a target module temperature mean value to participate in executing target module temperature protection and regulation.
If the first temperature difference value is larger than the maximum rising temperature value, it is indicated that the first module temperature mean value of the (k + n) th sampling period is excessively increased relative to the first module temperature mean value of the (k-1) th sampling period, a temperature sensor may exist in the (k + n) th sampling period to detect an abnormal value, and temperature data of the (k + n) th sampling period needs to be removed, so that it can be judged that the first module temperature mean value of the (k + n) th sampling period does not participate in executing target module temperature protection adjustment, the first module temperature mean value of the (k-1) th sampling period is continuously reserved for comparison difference of the next cycle, and the first module temperature mean value of the (k-1) th sampling period is taken as a target module temperature mean value to participate in executing the target module temperature protection adjustment;
if the first temperature difference value is smaller than the maximum rising temperature value, it is indicated that the first module temperature mean value of the (k + n) th sampling period is increased in a reasonable range relative to the first module temperature mean value of the (k-1) th sampling period, it is judged that there is no abnormal value detected by the temperature sensor in the (k + n) th sampling period, and the temperature data of the (k + n) th sampling period is retained, so that it can be determined that both the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period can be retained for comparison and difference of the next cycle, and the first module temperature mean value is used as a target module temperature mean value to participate in executing target module temperature protection and adjustment.
The following beneficial effects can be seen from the second embodiment:
under the running state of the target module, the first module temperature mean value between each sampling period is subjected to cyclic comparison, and the obtained first temperature difference value is continuously compared with the maximum rising temperature value, so that whether the first module temperature mean value is reserved as the target module temperature mean value to participate in executing target module temperature protection adjustment is continuously judged, the probability that a temperature abnormal value participates in module temperature protection adjustment is reduced, the accuracy rate of implementing module temperature protection adjustment is improved, the problem that the target module enters a wrong protection mode due to the fact that a jump abnormal value occurs when the target module is subjected to temperature detection is effectively avoided, the situation that normal use of a user is influenced due to detection errors of a temperature sensor is reduced, and user experience is improved.
EXAMPLE III
For convenience of understanding, an embodiment of the temperature sensor control method is provided below for explanation, in practical application, the state of the target module may also be a shutdown process state, a specific retention method of the module temperature mean value may be determined according to a comparison result of the second temperature difference value and the maximum drop temperature value, an invalid module temperature mean value is removed, and a probability that a temperature abnormal value participates in module temperature protection and adjustment is reduced.
Referring to fig. 3, a third embodiment of the temperature sensor control method in the embodiment of the present application includes:
301. comparing the second temperature difference value with the maximum drop temperature value;
and subtracting the first module temperature mean value of the (k-1) th sampling period from the first module temperature mean value of the (k + n) th sampling period to obtain a second temperature difference value.
The maximum dropping temperature refers to the maximum dropping temperature obtained by an experiment in which the target module is kept running for one sampling period in the environment with the best heat dissipation and the minimum heat generation, and generally occurs in the normal shutdown process of the target module, and the maximum dropping temperature value is larger than zero.
And obtaining different values of k and n, and performing cyclic comparison and difference on the first module temperature mean values in different sampling periods to obtain different second temperature difference values and the maximum drop temperature value for comparison, so as to determine whether each first module temperature mean value is an effective module temperature mean value.
302. Determining a target module temperature mean value participating in executing target module temperature protection adjustment;
if the second temperature difference value is larger than the maximum drop temperature value, it is indicated that the first module temperature mean value of the (k + n) th sampling period drops too fast relative to the first module temperature mean value of the (k-1) th sampling period, an abnormal value may exist in the (k + n) th sampling period detected by the temperature sensor, and the temperature data of the (k + n) th sampling period needs to be removed, so that it can be judged that the first module temperature mean value of the (k + n) th sampling period does not participate in executing target module temperature protection adjustment, the first module temperature mean value of the (k-1) th sampling period is continuously reserved for the comparison difference of the next cycle, and the first module temperature mean value of the (k-1) th sampling period is taken as the target module temperature mean value to participate in executing the target module temperature protection adjustment;
if the second temperature difference value is smaller than the maximum drop temperature value, it is indicated that the first module temperature mean value of the (k + n) th sampling period drops in a reasonable range relative to the first module temperature mean value of the (k-1) th sampling period, it is judged that there is no abnormal value detected by the temperature sensor in the (k + n) th sampling period, and the temperature data of the (k + n) th sampling period is retained, so that it can be determined that both the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period can be retained for comparison and difference of the next cycle, and the first module temperature mean value is used as a target module temperature mean value to participate in executing target module temperature protection and adjustment.
The third embodiment can show the following beneficial effects:
in the target module shutdown process state, the first module temperature mean value between each sampling period in the shutdown process is subjected to circular comparison to obtain a difference, and the obtained second temperature difference value is continuously compared with the maximum drop temperature value, so that whether the first module temperature mean value is reserved as the target module temperature mean value to participate in executing target module temperature protection adjustment is continuously judged, the probability that a temperature abnormal value participates in module temperature protection adjustment is reduced, the accuracy of implementing module temperature protection adjustment is improved, the problem that the target module enters a wrong protection mode due to the fact that a jump abnormal value occurs when the target module is subjected to temperature detection is effectively avoided, the situation that normal use of a user is affected due to detection errors of a temperature sensor is reduced, and the user experience is improved.
Example four
For the convenience of understanding, an embodiment of the temperature sensor control method is provided below for explanation, and in practical applications, the state of the target module may also be an abnormal state, and the determination may be performed according to the calculation result of the first module temperature mean value.
Referring to fig. 4, a fourth embodiment of the temperature sensor control method in the embodiment of the present application includes:
401. determining a first module temperature mean value in a sampling period according to the N target module temperature values;
in the embodiment of the present application, the specific content of step 401 is similar to that of step 102 in the first embodiment, and is not described herein again.
402. Judging whether the state of the target module is an abnormal state or not;
if the calculation result of the first module temperature mean value is equal to the target module temperature short-circuit value or the target module temperature open-circuit value, judging that the target module is in an abnormal state, rejecting the current first module temperature mean value, and executing shutdown protection by the target module;
the target module temperature short-circuit value is a preset target module temperature when the target module is in a short-circuit state;
the target module temperature open circuit value refers to a preset target module temperature when the target module is in an open circuit state.
The following beneficial effects can be seen from the fourth embodiment:
by using the module temperature mean value to replace the comparison between the individual module temperature and the target module temperature short-circuit value or the target module temperature open-circuit value, whether the target module is actually in the open-circuit or short-circuit state or not is judged more accurately, the target module is prevented from frequently and mistakenly entering the shutdown protection state due to the influence of individual detection of abnormal values, and the user experience is improved.
EXAMPLE five
For convenience of understanding, an embodiment of the temperature sensor control method is provided below for explanation, in practical application, the target module temperature mean value retained in the processes of the above second embodiment and the third embodiment may participate in module temperature protection adjustment, and a control strategy of specific protection adjustment will be described in detail below.
Referring to fig. 5, a fifth embodiment of the temperature sensor control method in the embodiment of the present application includes:
501. comparing the target module temperature mean value with the first temperature, the second temperature and the third temperature;
the first temperature is a preset frequency limiting temperature threshold, the second temperature is a preset frequency reducing temperature threshold, and the third temperature is a preset shutdown protection temperature threshold.
502. Executing a corresponding module temperature regulation control strategy according to the comparison result;
if the average value of the temperature of the target module is greater than the first temperature and less than the second temperature, sending a target module frequency limit mark bit and controlling the target module frequency limit; if the target module temperature mean value is greater than the second temperature and less than the third temperature, sending a target module frequency reduction zone bit and controlling the target module to reduce the frequency; and if the average value of the temperature of the target module is greater than the third temperature, sending a target module protection zone bit and controlling the target module to stop for protection.
The flag bit refers to a signal or instruction that triggers a control strategy.
The following beneficial effects can be seen from the fifth embodiment:
the temperature of the target module is compared with the frequency limiting temperature threshold, the frequency reducing temperature threshold and the shutdown protection temperature threshold instead of the temperature of the individual module by the target module temperature mean value, whether the target module has a temperature abnormal state or not is judged more accurately, the corresponding module temperature regulation control strategy is executed according to the comparison result by comparing the target module temperature mean value with different temperature thresholds, the problem that shutdown protection is started once the temperature is judged to be abnormal is solved, the corresponding strategy is intelligently implemented on different abnormal conditions to solve the abnormal conditions, and the use satisfaction of users is improved.
Corresponding to the embodiment of the application function implementation method, the application also provides electronic equipment of the temperature sensor control method and a corresponding embodiment.
Fig. 6 is a schematic structural diagram of an electronic device shown in an embodiment of the present application.
Referring to fig. 6, the electronic device 1000 includes a memory 1010 and a processor 1020.
The Processor 1020 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 1010 may include various types of storage units, such as system memory, Read Only Memory (ROM), and permanent storage. Wherein the ROM may store static data or instructions that are needed by the processor 1020 or other modules of the computer. The persistent storage device may be a read-write storage device. The persistent storage may be a non-volatile storage device that does not lose stored instructions and data even after the computer is powered off. In some embodiments, the persistent storage device employs a mass storage device (e.g., magnetic or optical disk, flash memory) as the persistent storage device. In other embodiments, the permanent storage may be a removable storage device (e.g., floppy disk, optical drive). The system memory may be a read-write memory device or a volatile read-write memory device, such as a dynamic random access memory. The system memory may store instructions and data that some or all of the processors require at runtime. Further, the memory 1010 may include any combination of computer-readable storage media, including various types of semiconductor memory chips (DRAM, SRAM, SDRAM, flash memory, programmable read-only memory), magnetic and/or optical disks, among others. In some embodiments, memory 1010 may include a removable storage device that is readable and/or writable, such as a Compact Disc (CD), digital versatile disc read only (e.g., DVD-ROM, dual layer DVD-ROM), Blu-ray disc read only, ultra-dense disc, flash memory card (e.g., SD card, min SD card, Micro-SD card, etc.), magnetic floppy disk, and the like. Computer-readable storage media do not contain carrier waves or transitory electronic signals transmitted by wireless or wired means.
The memory 1010 has stored thereon executable code that, when processed by the processor 1020, causes the processor 1020 to perform some or all of the methods described above.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Those skilled in the art should also appreciate that the acts and modules referred to in the specification are not necessarily required in the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined, and deleted according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided, and deleted according to actual needs.
Furthermore, the method according to the present application may also be implemented as a computer program or computer program product comprising computer program code instructions for performing some or all of the steps of the above-described method of the present application.
Alternatively, the present application may also be embodied as a non-transitory machine-readable storage medium (or computer-readable storage medium, or machine-readable storage medium) having stored thereon executable code (or a computer program, or computer instruction code) which, when executed by a processor of an electronic device (or electronic device, server, etc.), causes the processor to perform part or all of the various steps of the above-described method according to the present application.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the applications disclosed herein may be implemented as electronic hardware, computer software, or combinations of both.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims (11)

1. A temperature sensor control method, comprising:
sampling the temperature of a target module in a preset sampling period to obtain N target module temperature values, wherein N is the sampling frequency in the sampling period and is an integer greater than 1;
determining a first module temperature mean value in the sampling period according to the N target module temperature values;
judging the state of a target module, if the state of the target module is an operating state, determining a first temperature difference value according to the average value of the first module temperatures in two sampling periods, and comparing the first temperature difference value with a maximum rising temperature value, wherein the maximum rising temperature value is a preset maximum rising temperature in the sampling period under the condition that the target module normally operates;
and determining the average value of the target module temperature participating in the execution of the target module temperature protection and adjustment according to the comparison result of the first temperature difference value and the maximum rising temperature value.
2. The temperature sensor control method according to claim 1,
the determining a first temperature difference value according to a first module temperature mean value in two sampling periods includes:
and subtracting the first module temperature mean value of the (k + n) th sampling period from the first module temperature mean value of the (k-1) th sampling period to obtain the first temperature difference value, wherein k is an integer greater than 1, and n is a natural number.
3. The temperature sensor control method according to claim 2,
the target module state further comprises: a shutdown process state;
if the target module state is a shutdown process state, comparing a second temperature difference value with a maximum dropping temperature value, wherein the second temperature difference value is a difference between the first module temperature mean value of the kth-1 th sampling period and the first module temperature mean value of the kth + nth sampling period, the maximum dropping temperature value is a preset maximum dropping temperature in the sampling period under the condition that the target module is normally shutdown, and the maximum dropping temperature value is greater than zero;
and determining the target module temperature mean value participating in executing target module temperature protection adjustment according to the comparison result of the second temperature difference value and the maximum drop temperature value.
4. The temperature sensor control method according to claim 1,
the temperature sampling is carried out on the target module in a preset sampling period, and the method comprises the following steps:
sampling the voltage of the target module in a preset sampling period to obtain N sampling voltages, wherein the sampling voltages are voltages obtained by detecting the target module through a temperature sensor;
and converting the N sampling voltages into N target module temperatures through analog-to-digital conversion, and obtaining N target module temperature values.
5. The temperature sensor control method according to claim 1,
determining a first module temperature mean value within the sampling period according to the N target module temperature values comprises:
and after the maximum target module temperature and the minimum target module temperature are removed from the N target module temperature values, calculating the first module temperature mean value.
6. The temperature sensor control method according to claim 1,
the target module state further comprises: an abnormal state;
if the calculation result of the first module temperature mean value is equal to a target module temperature short-circuit value or a target module temperature open-circuit value, eliminating the current first module temperature mean value, and judging that the target module is in an abnormal state;
the target module temperature short-circuit value is a preset target module temperature when the target module is in a short-circuit state;
the target module temperature open circuit value is a preset target module temperature when the target module is in an open circuit state.
7. The temperature sensor control method according to claim 2,
determining the target module temperature mean value participating in executing target module temperature protection adjustment according to the comparison result of the first temperature difference value and the maximum rising temperature value, wherein the determining comprises:
if the first temperature difference value is greater than the maximum rising temperature value, determining that the first module temperature mean value of the (k + n) th sampling period does not participate in executing the target module temperature protection adjustment, and determining that the first module temperature mean value of the (k-1) th sampling period participates in executing the target module temperature protection adjustment as the target module temperature mean value;
if the first temperature difference value is smaller than the maximum rising temperature value, determining that the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period are both used as the target module temperature mean value to participate in executing the target module temperature protection regulation.
8. The temperature sensor control method according to claim 3,
determining the target module temperature mean value participating in executing target module temperature protection adjustment according to the comparison result of the second temperature difference value and the maximum drop temperature value, including:
if the second temperature difference value is greater than the maximum drop temperature value, determining that the target module temperature mean value of the (k + n) th sampling period does not participate in executing the target module temperature protection adjustment, and determining that the first module temperature mean value of the (k-1) th sampling period participates in executing the target module temperature protection adjustment as the target module temperature mean value;
if the second temperature difference value is smaller than the maximum drop temperature value, determining that the first module temperature mean value of the (k + n) th sampling period and the first module temperature mean value of the (k-1) th sampling period are both used as the target module temperature mean value to participate in executing the target module temperature protection adjustment.
9. The temperature sensor control method according to any one of claims 6 or 7,
the participating execution of the target module temperature protection adjustment includes:
comparing the target module temperature mean with a first temperature, a second temperature, and a third temperature;
if the target module temperature mean value is greater than the first temperature and less than the second temperature, sending a target module frequency limit flag bit and controlling the target module frequency limit;
if the target module temperature mean value is greater than the second temperature and less than the third temperature, sending a target module frequency reduction zone bit and controlling the target module to reduce the frequency;
if the average value of the temperature of the target module is higher than the third temperature, sending a target module protection flag bit to control the target module to stop for protection;
the first temperature is a preset frequency limiting temperature threshold, the second temperature is a preset frequency reducing temperature threshold, and the third temperature is a preset shutdown protection temperature threshold.
10. An electronic device, comprising:
a processor; and
a memory having executable code stored thereon, which when executed by the processor, causes the processor to perform the method of any one of claims 1-9.
11. A non-transitory machine-readable storage medium having stored thereon executable code, which when executed by a processor of an electronic device, causes the processor to perform the method of any one of claims 1-9.
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