CN112701227B - 一种钙钛矿太阳能电池器件及其封装方法 - Google Patents
一种钙钛矿太阳能电池器件及其封装方法 Download PDFInfo
- Publication number
- CN112701227B CN112701227B CN202110109093.1A CN202110109093A CN112701227B CN 112701227 B CN112701227 B CN 112701227B CN 202110109093 A CN202110109093 A CN 202110109093A CN 112701227 B CN112701227 B CN 112701227B
- Authority
- CN
- China
- Prior art keywords
- layer
- film layer
- thin film
- solar cell
- perovskite solar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 50
- 230000004888 barrier function Effects 0.000 claims abstract description 96
- 239000003292 glue Substances 0.000 claims abstract description 49
- 239000011521 glass Substances 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims description 136
- 239000010408 film Substances 0.000 claims description 109
- 239000000463 material Substances 0.000 claims description 26
- 239000002131 composite material Substances 0.000 claims description 16
- 239000004831 Hot glue Substances 0.000 claims description 14
- 238000000231 atomic layer deposition Methods 0.000 claims description 12
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 11
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical group [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000008393 encapsulating agent Substances 0.000 claims description 8
- 150000004767 nitrides Chemical class 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 8
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910004140 HfO Inorganic materials 0.000 claims description 4
- 229910021193 La 2 O 3 Inorganic materials 0.000 claims description 4
- 229910002367 SrTiO Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000007738 vacuum evaporation Methods 0.000 claims description 4
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 16
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 331
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 23
- 230000007774 longterm Effects 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 238000000151 deposition Methods 0.000 description 16
- 238000000354 decomposition reaction Methods 0.000 description 13
- 230000005525 hole transport Effects 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 239000002356 single layer Substances 0.000 description 10
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical group C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 230000032683 aging Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000012188 paraffin wax Substances 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920002160 Celluloid Polymers 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000005019 vapor deposition process Methods 0.000 description 3
- XDXWNHPWWKGTKO-UHFFFAOYSA-N 207739-72-8 Chemical group C1=CC(OC)=CC=C1N(C=1C=C2C3(C4=CC(=CC=C4C2=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC(=CC=C1C1=CC=C(C=C13)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 XDXWNHPWWKGTKO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 229920001167 Poly(triaryl amine) Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- -1 amine cations Chemical class 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000002431 foraging effect Effects 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 208000037408 Device failure Diseases 0.000 description 1
- PNKUSGQVOMIXLU-UHFFFAOYSA-N Formamidine Chemical compound NC=N PNKUSGQVOMIXLU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001767 cationic compounds Chemical class 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910001411 inorganic cation Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110109093.1A CN112701227B (zh) | 2021-01-27 | 2021-01-27 | 一种钙钛矿太阳能电池器件及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110109093.1A CN112701227B (zh) | 2021-01-27 | 2021-01-27 | 一种钙钛矿太阳能电池器件及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112701227A CN112701227A (zh) | 2021-04-23 |
CN112701227B true CN112701227B (zh) | 2023-04-07 |
Family
ID=75516244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110109093.1A Active CN112701227B (zh) | 2021-01-27 | 2021-01-27 | 一种钙钛矿太阳能电池器件及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112701227B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114649483A (zh) * | 2022-03-21 | 2022-06-21 | 夏禹纳米科技(深圳)有限公司 | 一种提升钙钛矿太阳能电池稳定性的方法 |
CN117355157A (zh) * | 2023-10-27 | 2024-01-05 | 天合光能股份有限公司 | 钙钛矿太阳电池组件 |
CN117659938A (zh) * | 2023-12-20 | 2024-03-08 | 华中科技大学 | 快速固化硅氧烷封装剂及其制备方法和应用 |
CN118119197A (zh) * | 2024-03-18 | 2024-05-31 | 深圳现象光伏科技有限公司 | 钙钛矿太阳能电池及其制备方法、用电设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106992253B (zh) * | 2016-01-18 | 2020-01-21 | 张家港康得新光电材料有限公司 | 封装结构、薄膜太阳能电池及有机发光显示装置 |
CN109427977B (zh) * | 2017-09-01 | 2024-10-18 | 杭州纤纳光电科技有限公司 | 防漏电钙钛矿太阳能电池组件的封装结构及其封装方法 |
CN109216556A (zh) * | 2018-08-31 | 2019-01-15 | 武汉理工大学 | 一种特定结构的钙钛矿太阳能电池及其制备方法 |
CN109411611B (zh) * | 2018-11-28 | 2024-07-02 | 中国华能集团有限公司 | 一种钙钛矿太阳能电池封装结构及封装方法 |
CN110010767A (zh) * | 2019-03-26 | 2019-07-12 | 华中科技大学鄂州工业技术研究院 | 钙钛矿太阳能电池的薄膜封装方法和相应的电池器件 |
CN111463351A (zh) * | 2020-05-06 | 2020-07-28 | 武汉理工大学 | 钙钛矿太阳能电池的防铅泄露封装结构及其封装方法 |
-
2021
- 2021-01-27 CN CN202110109093.1A patent/CN112701227B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN112701227A (zh) | 2021-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112701227B (zh) | 一种钙钛矿太阳能电池器件及其封装方法 | |
Corsini et al. | Recent progress in encapsulation strategies to enhance the stability of organometal halide perovskite solar cells | |
Ma et al. | Development of encapsulation strategies towards the commercialization of perovskite solar cells | |
Lu et al. | A review on encapsulation technology from organic light emitting diodes to organic and perovskite solar cells | |
Emery et al. | Encapsulation and outdoor testing of perovskite solar cells: comparing industrially relevant process with a simplified lab procedure | |
US9799854B2 (en) | Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices | |
Xiang et al. | Progress on the stability and encapsulation techniques of perovskite solar cells | |
CN108258138B (zh) | 用于敏感元件的封装的多层部件 | |
CN101306589B (zh) | 阻隔膜及元件 | |
JP5612658B2 (ja) | 光電子デバイス | |
Chu et al. | Encapsulation: The path to commercialization of stable perovskite solar cells | |
TW201006668A (en) | Inorganic graded barrier film and methods for their manufacture | |
CN103258955A (zh) | 有机电子器件的封装方法 | |
Steinmann et al. | Encapsulation requirements to enable stable organic ultra-thin and stretchable devices | |
CN216597635U (zh) | 钙钛矿电池组件的封装结构 | |
CN118574436A (zh) | 钙钛矿太阳能电池的封装结构和封装方法及应用 | |
JP4651346B2 (ja) | 光電変換装置およびそれを用いた光発電装置 | |
CN117650186A (zh) | 光伏器件及其封装方法 | |
WO2021251048A1 (ja) | 太陽電池モジュール | |
CN115734627A (zh) | 一种钙钛矿器件的封装方法 | |
CN1567554A (zh) | 电子元件的封装方法 | |
Zhang et al. | Recent Achievements for Flexible Encapsulation Films Based on Atomic/Molecular Layer Deposition | |
Madogni et al. | Effects of residual oxygen in the degradation of the performance of organic bulk heterojunction solar cells: stability, role of the encapsulation | |
JP7631573B1 (ja) | 太陽電池モジュールおよび太陽電池モジュールの製造方法 | |
CN103137884B (zh) | 一种有机电致发光器件的复合封装结构及其封装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240725 Address after: 701-2, 7th Floor, Building 4, Modern Service Industry Demonstration Base Phase II, Huazhong University of Science and Technology Science Park, No. 15-1 Daxueyuan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province 430070 Patentee after: Wuhan Jiuxiang Dazhong Technology Co.,Ltd. Country or region after: China Address before: 436044 Phoenix Road, Wutong Lake New District, Ezhou, Hubei Patentee before: EZHOU INSTITUTE OF INDUSTRIAL TECHNOLOGY HUAZHONG University OF SCIENCE AND TECHNOLOGY Country or region before: China Patentee before: HUAZHONG University OF SCIENCE AND TECHNOLOGY |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240906 Address after: Room A2198 and A2218, Wuhan International Student Entrepreneurship Park, No. 11 Dongxin Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province 430074 Patentee after: Wuhan Jiuyao Optoelectronic Technology Co.,Ltd. Country or region after: China Address before: 701-2, 7th Floor, Building 4, Modern Service Industry Demonstration Base Phase II, Huazhong University of Science and Technology Science Park, No. 15-1 Daxueyuan Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province 430070 Patentee before: Wuhan Jiuxiang Dazhong Technology Co.,Ltd. Country or region before: China |
|
TR01 | Transfer of patent right |