CN112699988A

CN112699988A - Electronic tag and cable

Info

Publication number: CN112699988A
Application number: CN202110128404.9A
Authority: CN
Inventors: 戴志波; 王丽媛; 赵景超
Original assignee: Beijing Suresource Technology Co ltd
Current assignee: Beijing Suresource Technology Co ltd
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2021-04-23

Abstract

The invention discloses an electronic tag and a cable, wherein the electronic tag comprises: a dielectric layer having opposing first and second surfaces; a metal reflective layer on the second surface; an antenna assembly located at the first surface, the antenna assembly comprising: the antenna comprises a radiation oscillator and a chip connected with the radiation oscillator. By applying the technical scheme provided by the invention, the electronic tag is used as an implanted tag and implanted into the cable, so that the whole life cycle management of the cable can be realized without a peripheral circuit and a power supply, the temperature change of the cable can be monitored in real time, an alarm is given in advance, the management efficiency and the management level are greatly improved, and the maintenance cost is reduced.

Description

Electronic tag and cable

Technical Field

The invention relates to the technical field of electronic tags, in particular to an electronic tag and a cable.

Background

Radio Frequency identification (rfid) technology, also called radio Frequency identification (rfid), is a communication technology that can read or write information stored in a transponder by radio electromagnetic wave signals and can perform non-visual reading without physical or optical contact. The target object is automatically identified in a radio frequency mode, manual intervention is not needed in identification, a plurality of targets can be identified simultaneously, remote reading can be achieved, the wireless RFID tag can work in various severe environments, the reader-writer is communicated with the electronic tag through an electromagnetic field or radio waves, so that objects are automatically identified and tracked, after the reader-writer reads information of the objects, the information is transmitted to the Internet, and people can obtain instant information of the objects through the Internet.

The electronic tag is a main information carrier in the RFID, and can identify information of an article, and then the article is incorporated into the management and control of the network by using the radio frequency identification technology. Therefore, how to design an electronic tag with a simple structure and convenient use is a problem to be solved urgently in the field of electronic tags.

Disclosure of Invention

In view of the above, the invention provides an electronic tag and a cable, and by implanting the electronic tag into the cable, asset management and real-time temperature monitoring and over-temperature alarm of the cable can be realized, so that management efficiency and management level are greatly improved, and maintenance cost is reduced.

In order to achieve the above purpose, the invention provides the following technical scheme:

an electronic tag, the electronic tag comprising:

a dielectric layer having opposing first and second surfaces;

a metal reflective layer on the second surface;

an antenna assembly located at the first surface, the antenna assembly comprising: the antenna comprises a radiation oscillator and a chip connected with the radiation oscillator.

Preferably, in the electronic tag, the dielectric layer has an accommodating space, and the chip is located in the accommodating space.

Preferably, in the electronic tag, the accommodating space is a through hole penetrating through the dielectric layer.

Preferably, in the electronic tag, the accommodating space is a blind hole having a depth not exceeding the thickness of the dielectric layer.

Preferably, in the electronic tag, the dielectric layer is a long strip, the radiation oscillator has at least one strip-shaped slot, and an extending direction of the strip-shaped slot is the same as an extending direction of the long strip-shaped dielectric layer.

Preferably, in the electronic tag described above, the antenna assembly includes: the substrate layer, the radiation oscillator and the chip all sets up the substrate layer is towards the surface of dielectric layer.

Preferably, in the electronic tag, the dielectric layer is a substrate layer of the antenna assembly;

the first surface has a patterned first metal layer that includes the radiating element.

Preferably, in the electronic tag, the accommodating space is a blind hole with a depth smaller than the thickness of the dielectric layer;

part of the radiation oscillator is located in the blind hole, the other part of the radiation oscillator is located on the first surface, and the chip is located in the blind hole.

Preferably, in the electronic tag, the chip is an RFID chip integrated with a temperature measurement function.

The present invention also provides a cable comprising: an electronic label as claimed in any preceding claim.

As can be seen from the above description, in the electronic tag and the cable provided in the technical solution of the present invention, the electronic tag may be an implanted tag implanted inside a target object, for example, the target object may be a cable. After the product is implanted into the cable, the surface of the cable is not raised, the normal dragging and use of the cable are not influenced, and the performance is stable. And the product adopts an ultra-bandwidth design, can meet the application of cables with different specifications, and can stably read cables with different thicknesses and materials.

In addition, the electronic tag provided by the invention adopts the RFID chip with the integrated temperature measurement function and the dielectric layer to form the ultrahigh frequency passive RFID electronic tag, the electronic tag can be used for counting the meters of cable assets, monitoring the temperature, alarming at the excess temperature and various management, the full life cycle management of the cable can be realized without peripheral circuits and power supplies, the temperature change of the cable can be monitored in real time, the alarm is carried out in advance, the management efficiency and the management level are greatly improved, and the maintenance cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

The structure, proportion, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that the person skilled in the art can understand and read the description, and the description is not used for limiting the limit condition of the implementation of the invention, so the method has no technical essence, and any structural modification, proportion relation change or size adjustment still falls within the scope of the technical content disclosed by the invention without affecting the effect and the achievable purpose of the invention.

Fig. 1 is a side cut-away view of an electronic tag according to an embodiment of the present invention;

FIG. 2 is a side cut-away view of another electronic tag provided in accordance with an embodiment of the present invention;

fig. 3 is a top view of an electronic tag according to an embodiment of the present invention;

fig. 4 is a front cross-sectional view of an electronic tag according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an antenna assembly according to an embodiment of the present invention;

fig. 6 is a side cut-away view of another electronic tag provided in an embodiment of the present invention;

fig. 7 is a side cut-away view of another electronic tag provided in an embodiment of the present invention;

fig. 8 is a cut-away view of a cable according to an embodiment of the present invention.

Detailed Description

Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the application are shown, and in which it is to be understood that the embodiments described are merely illustrative of some, but not all, of the embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Radio Frequency Identification (RFID) technology is a non-contact automatic identification technology. The target object is automatically identified in a radio frequency mode, manual intervention is not needed in identification, a plurality of targets can be identified simultaneously, remote reading can be achieved, the wireless RFID tag can work in various severe environments, the reader-writer is communicated with the electronic tag through an electromagnetic field or radio waves, so that objects are automatically identified and tracked, after the reader-writer reads information of the objects, the information is transmitted to the Internet, and people can obtain instant information of the objects through the Internet.

The electronic tag is a main information carrier in the RFID, and can identify information of an article, and then the article is incorporated into the management and control of the network by using the radio frequency identification technology.

At present, the high-voltage cable temperature measurement technology on the market mainly adopts the modes of embedding a high-voltage cable and pasting a temperature sensing optical fiber on the surface of the high-voltage cable to carry out 24-hour uninterrupted full-path monitoring, the mode has high cost and low measurement progress, and the adopted cable temperature measurement means all need the participation of peripheral equipment, so that the management efficiency and the management level are lower, and the maintenance cost is high.

Meanwhile, cables with different voltage grades have a plurality of specifications, and the diameter, the material of armor, the material and the thickness of a sheath, the presence or absence of non-woven fabrics and the like of the cables made by different specifications or different cable factories are greatly different, and the reading performance of the electronic tag is seriously influenced by the factors. Common electronic tags on the market cannot be compatible with used application scenes and cannot be universal.

In addition, the conventional flexible metal-resistant label medium on the market adopts PP or PE foam (polypropylene foam material), most of the foam is not high-temperature resistant, the temperature exceeds 85 ℃, and the foam deforms. And the foam is elastic and can deform under the extrusion of external force, thus seriously affecting the reading performance of the electronic tag. Because the cable sheath has very big pressure when moulding plastics, therefore ordinary flexible anti metal electronic tags can not implant in the cable inside.

Therefore, in order to solve the above problems, the present invention provides an electronic tag and a cable, the electronic tag including:

a dielectric layer having opposing first and second surfaces;

a metal reflective layer on the second surface;

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.

Referring to fig. 1, fig. 1 is a side cut-away view of an electronic tag according to an embodiment of the present invention, and specifically, fig. 1 is a cut-away view along an extending direction of the electronic tag.

As shown in fig. 1, the electronic tag includes:

a dielectric layer 11, the dielectric layer 11 having opposing first and second surfaces;

a metal reflective layer 12 on the second surface;

an antenna assembly located at the first surface, the antenna assembly comprising: a radiation oscillator 13 and a chip 14 connected to the radiation oscillator 13.

This dielectric layer 11 can adopt thickness to be not more than 1.5mm to the little, flexible material that can buckle, can bear the indeformable extrusion pressure of 10 tons of dielectric loss can select flexible materials such as thermoplastic elastomer (TPE), thermoplastic polyurethane elastomer rubber (TPU), Polytetrafluoroethylene (PTFE), that is to say, dielectric layer 11 can be flexible dielectric layers such as TPE dielectric layer, TPU dielectric layer, PTFE dielectric layer, and flexible material size is stable, and the short time can bear the high temperature of about 200 ℃, and when bearing the injection pressure of about 10 tons, the material is indeformable, can guarantee that electronic tags implants the cable after, product property can be stable.

The metal reflecting layer 12 may be a copper reflecting layer, an aluminum reflecting layer, or a silver reflecting layer, and the metal reflecting layer 12 may be implemented by using a copper clad laminate process, may be implemented by using a copper foil or aluminum foil adhesive method, may be implemented by using a copper etching or aluminum etching method on a substrate such as Polyimide (PI), polyethylene naphthalate (PEN), or the like, and then is adhered to the dielectric layer 11. The metal reflective layer 12 can reflect and superimpose the back lobe radiation level of the antenna on the front surface to increase the radiation gain of the antenna and improve the application condition of the product.

The antenna assembly can be made by compounding, pressing and etching a high-temperature-resistant base material which can be polyimide or PEN (polyethylene glycol) as a base material and copper as a radiation oscillator 13, and is adhered to the first surface of the dielectric layer 11 by using an adhesive, the chip 14 preferably uses double-sided Flat No-lead package (DFN), and the chip can be subjected to surface mount welding by using high-temperature-resistant solder paste. The location of the die 14 within the substrate aperture may protect the die 14 from compression and may also reduce the overall thickness of the product.

In the technical scheme of the invention, the electronic tag can be used as an implanted tag and implanted into a target object, for example, the target object can be a cable. After the product is implanted into the cable, the surface of the cable is not raised, the normal dragging and use of the cable are not influenced, and the performance is stable. And the product adopts an ultra-bandwidth design, can meet the application of cables with different specifications, and can stably read cables with different thicknesses and materials.

In the embodiment of the present invention, the dielectric layer 11 has an accommodating space 15, and the chip 14 is located in the accommodating space 15. The chip 14 is provided with a storage device which can store the codes and related information of the assets, and realizes non-visual reading and storage by using electromagnetic waves through special reading and writing equipment, thereby greatly reducing the cost of operators in the processes of counting meters and managing the assets.

In the manner shown in fig. 1, the accommodating space 15 may be a through hole penetrating through the dielectric layer 11. In addition, a through hole penetrating the metal reflective layer 12 may be provided at a position of the metal reflective layer 12 corresponding to the chip 14, or a whole layer of the metal reflective layer 12 without holes may be directly formed.

As shown in fig. 2, fig. 2 is a side cut view of another electronic tag according to an embodiment of the present invention, specifically, fig. 2 is a cut view along an extending direction of the electronic tag, in the manner shown in fig. 2, the accommodating space 15 may also be a blind hole having a depth not exceeding the thickness of the dielectric layer 11, a portion of the radiation oscillator 13 is located in the blind hole, another portion of the radiation oscillator 13 is located on the first surface, and the chip 14 is located in the blind hole.

In the mode shown in fig. 1 and fig. 2, the antenna assembly is prepared separately, and then is attached and fixed to the surface of the dielectric layer 11, the chip faces the accommodating space 15 and is placed in the accommodating space 15, and the antenna assembly may be attached and fixed to the dielectric layer 11 through an adhesive layer.

Referring to fig. 3 and 4, fig. 3 is a top view of an electronic tag according to an embodiment of the present invention, and fig. 4 is a front cross-sectional view of the electronic tag according to the embodiment of the present invention. Fig. 3 is a cross-sectional view of fig. 2 along a direction a-a', which is perpendicular to the extending direction of the electronic tag.

As shown in fig. 3 and 4, the dielectric layer 11 is a long strip, the radiation oscillator 13 has at least one strip-shaped slot 21, and an extending direction of the strip-shaped slot 21 is the same as an extending direction of the long strip-shaped dielectric layer 11. In fig. 3, two strip-shaped slots 21 extending in parallel to the extending direction of the electronic tag are illustrated as an example. The number and length of the strip-shaped slots 21 are matched with the impedance of the chip 14, and the slot depth is not specifically limited, and the slot depth penetrates through the metal layer of the antenna component.

In the embodiment of the invention, the electronic tag is integrally designed with a narrow edge, adopts an ultrathin and narrow strip-shaped antenna assembly, has a slender structure, and is suitable for being stuck on cable armoring devices with different curvature diameters and implanted into the cable. After the electronic tag is implanted into the cable, the surface of the cable is not raised, the normal dragging and use of the cable are not influenced, and the performance is stable. And the product adopts the ultra-bandwidth design, can meet the cable application of different specifications and different manufacturers, and can realize the stable reading of the electronic tags on cables with different thicknesses and materials.

In an embodiment of the present invention, the antenna assembly is shown in fig. 5, and fig. 5 is a schematic structural diagram of an antenna assembly provided in an embodiment of the present invention, where the antenna assembly includes: the substrate layer 16, the radiation oscillator 13 and the chip 14 are all arranged on the surface of the substrate layer 16 facing the dielectric layer 11. The antenna assembly can be prepared separately and then fixed on the surface of the dielectric layer 11 by gluing, the radiating oscillator 13 and the chip 14 are both arranged on the surface of the substrate layer 16 facing the dielectric layer 11, and the chip 14 is arranged in the accommodating space 15 of the dielectric layer 11.

The antenna assembly can be formed by compounding, pressing and etching a substrate layer made of polyimide and PEN and a radiating oscillator 13 made of copper, is adhered to the first surface of the dielectric layer 11 by an adhesive, and is bonded to the chip 14 by high-temperature-resistant solder paste, wherein the chip 14 is preferably double-sided flat non-leaded package (DFN). The location of the die 14 within the substrate aperture may protect the die 14 from compression and may also reduce the overall thickness of the product.

High-temperature-resistant paper can be compounded above the antenna assembly, and surface information printing of the electronic tag can be performed. The finished product of the electronic tag can be made into a roll-to-roll form or a sheet form, so that the printing and the mounting of the product are facilitated. The electronic tag has a temperature monitoring function, can also have other sensing functions, and can monitor the temperature and alarm the exceeding threshold value in real time. The temperature monitoring function of the electronic tag reduces the cost of temperature monitoring after the high-voltage cable is electrified.

In the embodiment of the present invention, the chip 14 may be an RFID chip integrated with a temperature measurement function. The temperature measurement function of the electronic tag is mainly that the chip 14 has a temperature measurement function. The reader-writer sends a temperature reading command, the electronic tag sends a temperature value to the reader-writer after receiving the command, the temperature value is displayed through upper computer software, and if the measured temperature exceeds a set temperature threshold, the upper computer software can give alarm prompt information.

As shown in fig. 6, fig. 6 is a side cut view of another electronic tag according to an embodiment of the present invention, in which the dielectric layer 11 may serve as a substrate layer of the antenna assembly; the first surface has a patterned first metal layer comprising the radiating element 13, i.e. the radiating element 13 is formed directly on the first surface. The first metal layer may be a copper layer or other metal reflective layer. That is, the radiation element 13 is directly formed on the first surface of the dielectric layer 11, and in this case, a separate substrate layer is not required for the antenna assembly. This method requires the formation of the radiating element 13 and then the bonding of the chip 14 to the surface of the radiating element 13.

Referring to fig. 7, fig. 7 is a side cut-away view of another electronic tag according to an embodiment of the present invention. As shown in fig. 7, the dielectric layer may be a glass fiber 51, or any one of the above dielectric layers, a metal reflective layer 12 is formed on one surface thereof, a patterned first metal layer 53 is formed on the other surface thereof, and then the chip 14 is bonded in the blind via. The first metal layer 53 may be a copper layer or other metal reflective layer.

In the embodiment of the invention, the electronic tag directly adopts a glass fiber 51 copper-clad plate, and the antenna component and the metal reflecting layer 12 are finished by etching. The glass fiber 51 is made into a chip, the flexibility is poor, the blind hole is suitable for being opened, a copper layer is firstly brushed to manufacture an antenna assembly, and then the chip 14 is manufactured on the copper layer of the blind hole.

The electronic tag provided by the invention adopts the RFID chip with the integrated temperature measurement function and the dielectric layer to form the ultrahigh frequency passive RFID electronic tag, the electronic tag can be used for counting the meters of cable assets, monitoring the temperature, alarming at an over-temperature and managing various types, the full life cycle management of the cable can be realized without peripheral circuits and power supplies, the temperature change of the cable can be monitored in real time, the alarm is given in advance, the management efficiency and the management level are greatly improved, and the maintenance cost is reduced.

Based on the above embodiment, another embodiment of the present invention further provides a cable, where the cable is shown in fig. 8, and fig. 8 is a cut-away view of a cable provided in an embodiment of the present invention, where the cable includes the electronic tag 71 described in the above embodiment.

As shown in fig. 8, the cable comprises from inside to outside: conductor 61, conductor shield 62, insulation 63, insulation shield 64, metal shield 65, filler medium 66, tape 67, liner 68, armor 69, and jacket 70. The electronic tag 71 is positioned between the sheath 70 and the armor 69 and is adhered to the armor 69.

In the embodiment of the invention, in the cable production link, the electronic tag 71 can be used as an implanted tag and implanted into the cable, and the electronic tag 71 is installed on the surface of the armor 69 of the cable. An adhesive can be attached below a metal reflecting layer of the electronic tag 71, the electronic tag 71 is fixed on an armor 69 of the cable through the adhesive, a cable sheath 70 is injected outside the armor 69 and the electronic tag 71 through a heating rod, and the electronic tag 71 and the armor 69 are sealed in the sheath 70 together.

In the embodiment of the invention, the thickness of the dielectric layer of the electronic tag 71 is not more than 1.5mm, and the overall thickness of the product is not more than 3 mm. The electronic tag is arranged on the armor 69, the electronic tag 71 and the armor 69 are sealed in the sheath 70, and the sheath 70 is extruded and injection-molded on the outer layers of the electronic tag 71 and the armor 69 through a heating rod. After the electronic tag 71 is subjected to extrusion injection molding, the electronic tag is not deformed and has stable size. The farthest reading distance of the electronic tag 71 can reach 2 m. The farthest reading temperature distance of the electronic tag can reach 1.5 m.

The electronic tag 71 can be attached along the cable along the length direction of the tag. After the electronic tag 71 is implanted into the cable, the surface of the cable is not raised, and the normal dragging and use of the cable are not influenced. And the product adopts an ultra-bandwidth design, can meet the application of cables with different specifications, and can stably read cables with different thicknesses and materials.

As can be seen from the above description, in the cable provided in the technical solution of the present invention, the electronic tag may be implanted as an implanted tag inside the cable. After the product is implanted into the cable, the surface of the cable is not raised, the normal dragging and use of the cable are not influenced, and the performance is stable. And the product adopts an ultra-bandwidth design, can meet the application of cables with different specifications, and can stably read cables with different thicknesses and materials.

The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. For the cable disclosed in the embodiment, since it corresponds to the electronic tag disclosed in the embodiment, the description is relatively simple, and the relevant points can be referred to the description of the electronic tag part.

It should be noted that in the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only used for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic tag, characterized in that the electronic tag comprises:

a dielectric layer having opposing first and second surfaces;

a metal reflective layer on the second surface;

2. The electronic tag according to claim 1, wherein the dielectric layer has a receiving space in which the chip is located.

3. The electronic tag according to claim 2, wherein said receiving space is a through hole penetrating said dielectric layer.

4. The electronic tag according to claim 2, wherein the accommodating space is a blind hole having a depth not exceeding the thickness of the dielectric layer.

5. The electronic tag according to claim 1, wherein the dielectric layer is elongated, the radiation oscillator has at least one elongated slot, and the elongated slot extends in the same direction as the elongated dielectric layer.

6. The electronic tag of claim 1, wherein the antenna assembly comprises: the substrate layer, the radiation oscillator and the chip all sets up the substrate layer is towards the surface of dielectric layer.

7. The electronic tag of claim 1, wherein the dielectric layer is a substrate layer of the antenna assembly;

8. The electronic tag according to claim 7, wherein the accommodating space is a blind hole having a depth smaller than the thickness of the dielectric layer;

9. The electronic tag according to any of claims 1-8, wherein the chip is an RFID chip integrated with thermometry.

10. A cable, comprising:

an electronic label according to any one of claims 1-9.